JP5832569B2 - ギャップ制御中に干渉回避が可能な数値制御装置 - Google Patents

ギャップ制御中に干渉回避が可能な数値制御装置 Download PDF

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Publication number
JP5832569B2
JP5832569B2 JP2014034323A JP2014034323A JP5832569B2 JP 5832569 B2 JP5832569 B2 JP 5832569B2 JP 2014034323 A JP2014034323 A JP 2014034323A JP 2014034323 A JP2014034323 A JP 2014034323A JP 5832569 B2 JP5832569 B2 JP 5832569B2
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JP
Japan
Prior art keywords
workpiece
nozzle tip
gap control
reference position
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014034323A
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English (en)
Japanese (ja)
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JP2015157313A (ja
Inventor
隆良 松本
隆良 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
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Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Priority to JP2014034323A priority Critical patent/JP5832569B2/ja
Priority to DE102015002040.4A priority patent/DE102015002040B4/de
Priority to US14/629,524 priority patent/US10108174B2/en
Priority to CN201510087857.6A priority patent/CN104858545B/zh
Publication of JP2015157313A publication Critical patent/JP2015157313A/ja
Application granted granted Critical
Publication of JP5832569B2 publication Critical patent/JP5832569B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • B23K26/048Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0892Controlling the laser beam travel length
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45041Laser cutting
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/50Machine tool, machine tool null till machine tool work handling
    • G05B2219/50131Setup as function of tool position in manufacturing center

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
JP2014034323A 2014-02-25 2014-02-25 ギャップ制御中に干渉回避が可能な数値制御装置 Expired - Fee Related JP5832569B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014034323A JP5832569B2 (ja) 2014-02-25 2014-02-25 ギャップ制御中に干渉回避が可能な数値制御装置
DE102015002040.4A DE102015002040B4 (de) 2014-02-25 2015-02-18 Numerische Steuerung für eine Laserbearbeitungsmaschine
US14/629,524 US10108174B2 (en) 2014-02-25 2015-02-24 Numerical controller controlling a laser processing machine
CN201510087857.6A CN104858545B (zh) 2014-02-25 2015-02-25 控制激光加工机的数值控制装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014034323A JP5832569B2 (ja) 2014-02-25 2014-02-25 ギャップ制御中に干渉回避が可能な数値制御装置

Publications (2)

Publication Number Publication Date
JP2015157313A JP2015157313A (ja) 2015-09-03
JP5832569B2 true JP5832569B2 (ja) 2015-12-16

Family

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Family Applications (1)

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JP2014034323A Expired - Fee Related JP5832569B2 (ja) 2014-02-25 2014-02-25 ギャップ制御中に干渉回避が可能な数値制御装置

Country Status (4)

Country Link
US (1) US10108174B2 (de)
JP (1) JP5832569B2 (de)
CN (1) CN104858545B (de)
DE (1) DE102015002040B4 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6396273B2 (ja) * 2015-10-14 2018-09-26 ファナック株式会社 ワークとの干渉を避ける位置決めを行う数値制御装置
JP6816071B2 (ja) * 2018-08-24 2021-01-20 ファナック株式会社 レーザ加工システム、噴流観測装置、レーザ加工方法、及び噴流観測方法
DE102018125620A1 (de) * 2018-10-16 2020-04-16 Schuler Pressen Gmbh Verfahren und Vorrichtung zum Schneiden einer Blechplatine aus einem kontinuierlich geförderten Blechband
CN109940289B (zh) * 2019-04-09 2020-11-27 奔腾激光(温州)有限公司 一种具有速度安全监控的3d激光切割系统
CN111026036B (zh) * 2019-12-26 2023-02-28 大族激光科技产业集团股份有限公司 一种激光头空移控制方法及控制系统
CN111906434B (zh) * 2020-06-24 2022-08-19 大族激光科技产业集团股份有限公司 激光加工方法及其装置、计算机存储介质及激光加工设备
CN114578753B (zh) * 2022-01-20 2024-06-07 西门子(中国)有限公司 工件加工控制方法及装置、计算机设备、计算机可读介质

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2809039B2 (ja) 1993-03-25 1998-10-08 三菱電機株式会社 レーザ加工機およびレーザ加工方法
US7035716B2 (en) * 2001-01-29 2006-04-25 The Acrobot Company Limited Active-constraint robots
JP2003236691A (ja) 2002-02-19 2003-08-26 Amada Eng Center Co Ltd 熱切断加工機及び熱切断加工方法
JP2004001067A (ja) * 2002-03-28 2004-01-08 Fanuc Ltd レーザ加工機及びレーザ加工方法
JP3944718B2 (ja) 2002-06-28 2007-07-18 澁谷工業株式会社 物品加工装置
US7012210B2 (en) 2002-08-09 2006-03-14 Lockheed Martin Corporation Singulation detection system for objects used in conjunction with a conveyor system
JP2005135061A (ja) 2003-10-29 2005-05-26 Yaskawa Electric Corp モータ制御装置
JP4182044B2 (ja) 2004-10-14 2008-11-19 ファナック株式会社 レーザ加工装置
JP5642996B2 (ja) 2010-05-10 2014-12-17 三菱電機株式会社 制御装置、レーザ加工機およびレーザ加工方法
JP5930522B2 (ja) 2011-10-17 2016-06-08 株式会社アマダホールディングス 加工モニタリング装置及びその方法
JP5166589B1 (ja) 2011-10-21 2013-03-21 ファナック株式会社 加工ヘッドのアプローチ動作を制御するレーザ加工用制御装置
JP5871657B2 (ja) * 2012-02-29 2016-03-01 キヤノン株式会社 光学機器

Also Published As

Publication number Publication date
CN104858545B (zh) 2017-06-09
DE102015002040B4 (de) 2023-06-01
US10108174B2 (en) 2018-10-23
DE102015002040A1 (de) 2015-08-27
JP2015157313A (ja) 2015-09-03
US20150241868A1 (en) 2015-08-27
CN104858545A (zh) 2015-08-26

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