JP5828697B2 - Circuit board inspection apparatus and circuit board inspection method - Google Patents

Description

  The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for performing an insulation inspection between conductor patterns on a circuit board.

  As this type of circuit board inspection apparatus, an insulation inspection apparatus disclosed in Japanese Patent No. 3546046 is known. This insulation inspection apparatus includes a variable voltage source, a voltmeter, a control unit, a spark detection circuit, and the like. In this circuit board inspection device, the insulation resistance value between the wiring patterns to which the DC voltage output from the variable voltage source is applied is calculated and compared with a threshold value, thereby determining the quality of the insulation state between the wiring patterns, When there is a wiring pattern with a poor insulation state, the circuit board is determined to be defective. Further, in this insulation inspection apparatus, when a discharge (spark) is generated between the wiring patterns by applying a DC voltage during the insulation inspection, the discharge is detected and it is determined that the circuit board is defective.

Japanese Patent No. 3546046 (page 5-6, FIG. 1)

  However, the conventional insulation inspection apparatus described above has the following problems. That is, in this insulation inspection apparatus, a discharge generated during the insulation inspection is detected to determine that the circuit board is defective. In this case, since discharge is generated in the process of gradually increasing the voltage value of the applied DC voltage, in this type of insulation inspection apparatus, the voltage value of the DC voltage is generally measured every time one insulation inspection is completed. The method of gradually increasing the voltage value of the DC voltage again after changing the wiring pattern to be subject to insulation inspection is adopted. However, in the conventional insulation inspection apparatus that employs this method, it takes time to increase and decrease the voltage value. Therefore, when inspecting a substrate having a large number of conductor patterns, the inspection time increases and the inspection efficiency increases. There is a problem that it decreases. In this case, for example, while a group of wiring patterns is set to the same potential (low potential) and another group of wiring patterns is set to the same potential (high potential), a DC voltage is applied to both groups of wiring patterns to A method is known in which the number of inspections is reduced by performing insulation inspection or discharge detection, thereby improving inspection efficiency. However, with this method, when a discharge occurs during an insulation test, it is possible to grasp that the discharge occurred in one of the wiring patterns belonging to both groups, but it is possible to identify which wiring pattern caused the discharge. There is a problem that it is difficult to do.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a circuit board inspection apparatus and a circuit board inspection method capable of improving the efficiency of insulation inspection between each conductor pattern on a circuit board. .

In order to achieve the above object, the circuit board inspection apparatus according to claim 1, wherein a power supply unit that outputs an inspection voltage, and each conductor based on a current value that flows by supplying the inspection voltage to each conductor pattern on the circuit board. A circuit board comprising: an inspection unit that performs an insulation inspection between patterns; a switch unit that performs connection / disconnection between each conductor pattern and the power supply unit and the inspection unit; and a control unit that controls the switch unit In the inspection apparatus, the control unit causes the switch unit to perform the disconnection in a voltage output state in which the inspection voltage is output from the power supply unit to the switch unit, and M (M is A part of the conductor patterns on the circuit board having the conductor pattern of 2 or an integer) is set as a first group of conductors of the first group The turns are set to the same potential, and all the conductor patterns other than the first group of conductor patterns are set as the second group, and the second group of conductor patterns is set to the same potential. A supply process for performing the connection / disconnection on the switch unit so that the inspection voltage is supplied between the conductor patterns is performed, and at that time, combinations of the conductor patterns to be set as the both groups are performed. and executes the supplied processing for the combination of modified while N type (N is (a is log 2 _M) or (nearest integer log 2 _M)), in the execution process of the respective supply process, said power source The disconnection in the voltage output state with respect to the switch part so that the number of the conductor patterns connected to the part increases by one or more. An additional connection process to be performed is performed, and the inspection unit is based on at least one of the voltage value and the current value of the inspection voltage every time the number of conductor patterns to be connected is increased by the execution of the additional connection process. Then, the presence / absence of occurrence of discharge in the conductor pattern is detected, and the insulation inspection is executed after the supply process is executed by changing the combination .

The circuit board inspection apparatus according to claim 2 is the circuit board inspection apparatus according to claim 1 , wherein the controller is configured to increase the number of the conductor patterns by one in the additional connection process. The connection is made to the part.

According to a third aspect of the present invention, there is provided a circuit board inspection method for controlling each conductor pattern on the circuit board by controlling each conductor pattern, a power supply section that outputs a test voltage, and a switch section that connects and disconnects the inspection section. A circuit board inspection method for supplying the inspection voltage and causing the inspection unit to perform an insulation inspection between the conductor patterns based on a current value flowing by supplying the inspection voltage. In the voltage output state in which the voltage for inspection is output, the switch portion is connected and disconnected, and each of the circuit boards having M conductor patterns (M is an integer of 2 or more). A part of the conductor patterns is set as a first group, the conductor patterns of the first group are set to the same potential, and the conductor pattern of the first group is set. All the conductor patterns except for the conductors are set as the second group, and the test voltage is supplied between the conductor patterns of the two groups while keeping the conductor patterns of the second group at the same potential. The supply process is performed to cause the switch unit to perform the connection / disconnection, and at that time, N types (N is (log ₂ M) or more) while changing the combination of the conductor patterns respectively set as the both groups And the supply process is executed for the combination of ( the closest integer to (log ₂ M)), and the number of the conductor patterns connected to the power supply unit is 1 or To perform the additional connection process for causing the switch unit to perform the connection / disconnection in the voltage output state so as to increase by a plurality of numbers, Each time the number of conductor patterns to be connected is increased, the inspection unit detects the occurrence of discharge in the conductor pattern based on at least one of the voltage value of the inspection voltage and the current value, and After the combination is changed and each supply process is performed, the inspection unit is caused to perform the insulation inspection .

According to a fourth aspect of the present invention, there is provided the circuit board inspection method according to the third aspect , wherein, in the additional connection process, the switch unit is configured to increase the number of the conductor patterns by one. Make a connection.

According to the circuit board inspection apparatus according to claim 1 and the circuit board inspection method according to claim 3 , the switch part is disconnected in the voltage output state in which the inspection voltage is output from the power supply part to the switch part. As a result, it is possible to eliminate the process of increasing and decreasing the voltage value of the inspection voltage for each connection / disconnection by the switch unit. As a result, the inspection time is increased by the time required to increase and decrease the voltage value. It can be shortened. Therefore, according to the circuit board inspection apparatus and the circuit board inspection method, the insulation inspection is performed in comparison with the conventional configuration and method in which the voltage value of the inspection voltage is increased and decreased for each connection / disconnection by the switch unit. Efficiency can be sufficiently improved.

The circuit board inspection apparatus according to claim 1, and In the claims 3 circuit board inspection method according, to supply the processing for the combination of N type while changing the combination of the conductive patterns to be set as the first and second groups And after each supply process is performed, an insulation test is performed. Therefore, according to the circuit board inspection apparatus and the circuit board inspection method, it is possible to inspect the insulation state between the plurality of conductor patterns set as each group at the same time. As a result, the insulation state between the pair of conductor patterns is sequentially The efficiency of the insulation inspection can be further improved as compared to the configuration and method to be performed and the configuration and method to sequentially perform the insulation state between one conductor pattern and a plurality of conductor patterns having the same potential. Further, according to the circuit board inspection apparatus and the circuit board inspection method, in the process of executing the supply process, the switch unit is arranged so that the number of conductor patterns connected to the power supply unit increases by one or more. Since the disconnection is performed in the voltage output state and the presence or absence of discharge in the conductor pattern additionally connected to the power supply unit is detected, the conductor pattern in which the discharge has occurred in the insulation inspection can be easily specified.

According to the circuit board inspection apparatus according to claim 2 and the circuit board inspection method according to claim 4 , in the additional connection process, by increasing the number of conductor patterns to be connected to the power supply unit one by one, 1 Since the presence or absence of occurrence of discharge can be detected for each conductor pattern, the conductor pattern in which discharge has occurred can be accurately and reliably specified.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 1 is a configuration diagram showing a configuration of a circuit board 100. FIG. It is the 1st explanatory view explaining a circuit board inspection method. It is the 2nd explanatory view explaining a circuit board inspection method. It is the 3rd explanatory view explaining a circuit board inspection method.

  Embodiments of a circuit board inspection apparatus and a circuit board inspection method according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 as an example of the circuit board inspection apparatus will be described. The circuit board inspection apparatus 1 shown in FIG. 1 has M conductor patterns P1 to P10 (M is an integer of 2 or more and 10 in this example) (see FIG. 2; hereinafter, “conductor pattern P” unless otherwise distinguished). Insulation inspection for inspecting the insulation state between the conductor patterns P in the circuit board 100 having the circuit board 100 is also possible in accordance with a circuit board inspection method described later. Specifically, as shown in FIG. 1, the circuit board inspection apparatus 1 includes a substrate holding unit 11, a probe unit 12, a moving mechanism 13, a power supply unit 14, a switch unit 15, a measurement unit 16, a storage unit 17, and a control unit. 18 is provided.

  The substrate holding unit 11 includes a holding plate and a clamp mechanism (none of which is shown) that is attached to the holding plate and sandwiches and fixes the end portion of the circuit substrate 100, and is configured to hold the circuit substrate 100. ing. The probe unit 12 includes a plurality of probe pins 21 (see FIG. 1) and is configured in a jig shape. In this case, in the probe unit 12, the number of probe pins 21 and the arrangement pattern are defined in advance according to the shape and arrangement position of each conductor pattern P of the circuit board 100. The moving mechanism 13 performs probing by moving the probe unit 12 in the vertical direction under the control of the control unit 18.

  The power supply unit 14 generates an inspection voltage Ve (for example, a DC voltage having a voltage value Vm of about 15V to 250V) under the control of the control unit 18. The switch unit 15 is a scanner and includes a plurality of switches (not shown). The switch unit 15 contacts the conductor pattern P by shifting each switch to an on state or an off state according to the control of the control unit 18. The probe pin 21 of the probe unit 12 connected to the power supply unit 14 is disconnected (connected and disconnected (disconnected)), and the probe pin 21 is connected to the measuring unit 16.

  The measurement unit 16 measures the voltage value Vm of the inspection voltage Ve output from the power supply unit 14 to the switch unit 15. Further, the measuring unit 16 measures the current value Im of the current flowing between the conductor patterns P by supplying the inspection voltage Ve to the conductor pattern P. The storage unit 17 stores conductor pattern data D used in the insulation inspection performed by the control unit 18. In this case, as an example, the conductor pattern data D is uniquely (without overlapping) numbers 1 to M (10 in this example) for each conductor pattern P of the circuit board 100. Sometimes, it is configured to include information relating the numbers from No. 1 to No. M, the number of the conductor pattern P and the number of the probe pin 21 to be brought into contact with each conductor pattern P during inspection (probing). ing.

  The control unit 18 controls each component constituting the circuit board inspection apparatus 1 according to an operation signal output from an operation unit (not shown).

  In addition, the control unit 18 performs supply processing to supply the inspection voltage Ve between the conductor patterns P on the circuit board 100. Specifically, in this supply process, the control unit 18 sets a part of the conductor patterns P of each conductor pattern P on the circuit board 100 as the first group and excludes the first group of conductor patterns P. All other conductor patterns P are set as the second group. The control unit 18 sets the first group of conductor patterns P to the same potential (one of a high potential and a low potential) and sets the second group of conductor patterns P to the same potential (the other of the high potential and the low potential). ), And the switching unit 15 is disconnected so that the inspection voltage Ve is supplied between the conductor patterns P belonging to both groups.

In this case, the control unit 18 changes the combination of the conductor patterns P set as the first group and the second group as described above to N types (when the number of conductor patterns P is M, N Is executed for a combination of (log ₂ M) or more and an integer closest to (log ₂ M)). In addition, the control unit 18 adds the number of conductor patterns P connected to the power supply unit 14 so as to increase by one or plural (in this example, one by one) in the execution process of each supply process. In this state, an additional connection process for causing the switch unit 15 to be disconnected is executed.

  In this case, when executing the additional connection process, the control unit 18 connects the voltage output state in which the inspection voltage Ve is output from the power supply unit 14 to the switch unit 15, that is, connects the power supply unit 14 and the switch unit 15. In a state where the inspection voltage Ve is output to the wiring (hereinafter also referred to as “live line state”), the switch unit 15 is disconnected. In addition, the process which makes the switch part 15 cut and disconnect in a live line state is also called "hot-line cut-off process" below.

  Further, the control unit 18 functions as an inspection unit, and supplies the voltage value Vm of the inspection voltage Ve supplied to the conductor pattern P and the current value Im of the current that flows when the inspection voltage Ve is supplied to the measurement unit 16. By changing the combination of the conductor patterns P that are set as the first group and the second group, respectively, the inspection of the insulation state between the conductor patterns P based on the voltage value Vm and the current value Im (insulation inspection) is performed. It is executed after the supply process is executed (that is, N times). Such an insulation inspection method is also referred to as a “multiple method” hereinafter.

  Further, the control unit 18 increases the voltage value Vm of the inspection voltage Ve measured by the measurement unit 16 in unit time each time the number of conductor patterns P connected to the power supply unit 14 increases by executing the additional connection process. The conductor based on at least one of the changed value (hereinafter also referred to as “change value”) and the current value Im measured by the measurement unit 16 (in this example, both the change value of the voltage value Vm and the current value Im). The presence or absence of occurrence of discharge in the pattern P is detected.

  Next, a circuit board inspection method for inspecting the insulation state between the conductor patterns P in the circuit board 100 using the circuit board inspection apparatus 1 and the operation of the circuit board inspection apparatus 1 at that time will be described with reference to the drawings. explain. In addition, the circuit board 100 shall have 10 (an example of M) conductor patterns P1-P10, as shown in FIG. In addition, it is assumed that numbers 1 to 10 are uniquely assigned to the conductor patterns P1 to P10. In the initial state, it is assumed that the switch unit 15 disconnects (disconnects) all of the power supply unit 14 and each probe pin 21 that is in contact with each conductor pattern P.

  First, the circuit board 100 to be inspected is placed on a holding plate (not shown) in the board holding part 11, and then the end part of the circuit board 100 is sandwiched by a clamping mechanism (not shown) of the board holding part 11. By fixing, the circuit board 100 is held by the board holding part 11. Subsequently, an inspection start operation is performed using an operation unit (not shown). At this time, the control unit 18 controls the moving mechanism 13 to move the probe unit 12 downward in accordance with the operation signal output from the operation unit. Thereby, the front-end | tip part of each probe pin 21 of the probe unit 12 is made to contact (probing) each conductor pattern P1-P10.

Next, the control unit 18 performs an insulation test using a multiple method. Here, in this example, since the number M of the conductor patterns P on the circuit board 100 is “10”, the number N of combinations of the conductor patterns P set as the first group and the second group in the multiple system is ( log ₂ M) or more and “4” which is an integer closest to (log ₂ M). That is, the control part 18 can test | inspect the quality of the insulation state about all the conductor patterns P by performing a supply process and an insulation test | inspection about four types of combinations.

  In the first supply process, the control unit 18 stores, in the storage unit 17, the conductor patterns P set as the first group and the conductor patterns P set as the second group among the conductor patterns P of the circuit board 100. It is specified based on the conductor pattern data D. In this case, the control unit 18, for example, the conductor pattern P whose first digit is “1” when the decimal number assigned to each conductor pattern P is a binary number (in this example, the first, 3 No. 5, No. 5, No. 7, No. 9 conductor patterns P1, P3, P5, P7, P9) are set as the first group. In addition, the control unit 18 assigns all the conductor patterns P except the conductor patterns P set as the first group (numbers 2, 4, 6, 8, and 10 in this example). The conductor patterns P2, P4, P6, P8, and P10) are set as the second group (refer to the first insulation inspection column in FIG. 3).

  Subsequently, as shown in FIG. 4, the control unit 18 controls the power supply unit 14 to gradually increase the voltage value Vm of the test voltage Ve and cause the switch unit 15 to output the test voltage Ve. Transition to line state.

  Next, in this live line state, the control unit 18 has one conductor pattern P connected to the power source unit 14 from the initial state (all conductor patterns P and the power source unit 14 are disconnected). An additional connection process (hot-line connection / disconnection process) for performing connection / disconnection to the switch unit 15 so as to increase gradually is executed. Specifically, the control unit 18 controls the switch unit 15 to first contact one of the probe pins 21 in contact with each conductor pattern P of the first group (for example, in contact with the conductor pattern P1). The probe pin 21) is connected to the high potential side of the power supply unit 14. In this case, when this connection is made, a charge (charge current) flows through the capacitance between the conductor pattern P1 and the other conductor pattern P, so that a current (pulse current) flows (the number “of the conductor pattern P in FIG. 4” 1 ”), the measurement unit 16 measures the current value Im of this current. The measuring unit 16 measures the voltage value Vm of the inspection voltage Ve supplied from the power supply unit 14 to the switch unit 15.

  Subsequently, the control unit 18 compares the current value Im measured by the measurement unit 16 with a predetermined current reference value Ir, and determines the change value of the voltage value Vm measured by the measurement unit 16 and the predetermined value. The obtained reference value Vr is compared, and based on the comparison result, the presence or absence of occurrence of discharge in the conductor pattern P1 is determined (detected). In this case, as shown in FIG. 4, when the current value Im is equal to or less than the reference value Ir and the change value of the voltage value Vm is equal to or less than the reference value Vr, the control unit 18 performs the conductor pattern P ( In this example, it is determined that no discharge has occurred in the conductor pattern P1). On the other hand, when the current value Im exceeds the reference value Ir or when the change value of the voltage value Vm exceeds the reference value Vr, the control unit 18 performs the conductor pattern connected to the power supply unit 14. It is determined that a discharge has occurred at P.

  Next, the control unit 18 connects the probe pin 21 that is in contact with the conductor pattern P <b> 2 and the low potential side of the power supply unit 14. At this time, a current flows due to the above-described charge charging (refer to the position of the number “2” of the conductor pattern P in FIG. 4), and the control unit 18 measures the current value Im of this current measured by the measuring unit 16. Is compared with the reference value Ir, and the change value of the voltage value Vm is compared with the reference value Vr to determine whether or not a discharge has occurred in the conductor pattern P2.

  Hereinafter, the control unit 18 performs connection / disconnection with respect to the switch unit 15 so that the number of conductor patterns P (probe pins 21 in contact with the conductor pattern P) connected to the power supply unit 14 increases by one. Make it. Further, the control unit 18 compares the current value Im of the current flowing at the time of connection measured by the measurement unit 16 with the reference value Ir, and also compares the change value of the voltage value Vm with the reference value Vr. The presence or absence of occurrence of discharge in the conductor pattern P is determined.

  When the connection between all the conductor patterns P and the power supply unit 14 is completed and the additional connection process is completed, the conductor patterns P1, P3, P5, P7, and P9 set as the first group are connected to a high potential and have the same potential. Thus, the conductor patterns P2, P4, P6, P8, and P10 set as the second group are connected to a low potential and have the same potential (see the first insulation inspection column in FIG. 3).

  Subsequently, the control unit 18 calculates a resistance value based on the current value Im and the voltage value Vm measured by the measurement unit 16, compares the resistance value with a predetermined reference value, and compares the resistance value with that of the first group. The quality of the insulation state between each conductor pattern P and each conductor pattern P of the second group is inspected. Next, as shown in FIG. 4, the control unit 18 controls the power supply unit 14 to gradually decrease the voltage value Vm of the inspection voltage Ve. Thereby, the live line state in the switch part 15 is cancelled | released. Thus, the first supply process and the insulation inspection are completed.

  Subsequently, the control unit 18 executes a second supply process and an insulation test. In the second supply process, the control unit 18, for example, has a conductor pattern P whose second digit is “1” when the number of each conductor pattern P is a binary number (in this example, the second and third numbers). , No. 6, No. 7, No. 10 conductor patterns P2, P3, P6, P7, P10) are set as the first group. The control unit 18 also includes all other conductor patterns P except for the conductor patterns P set as the first group (in this example, the first, fourth, fifth, eighth and ninth conductor patterns P1, P4, P5, P8, P9) are set as the second group (see the column of the second insulation inspection in FIG. 3).

  Next, as shown in FIG. 5, the control unit 18 controls the power supply unit 14 to gradually increase the voltage value Vm of the test voltage Ve and output the test voltage Ve to the switch unit 15 so as to live. Transition to the state.

  Subsequently, the control unit 18 executes an additional connection process (hot-line disconnection process) in the same process as the process executed in the execution process of the first supply process. Here, as shown in FIG. 5, when the conductor pattern P7 and the power supply unit 14 are connected, when the current value Im measured by the measurement unit 16 exceeds the reference value Ir (in this example, the voltage value The control unit 18 determines that discharge has occurred in the conductor pattern P7.

  Next, when the connection between all the conductor patterns P and the power supply unit 14 is completed and the additional connection process is completed, the conductor patterns P2, P3, P6, P7, and P10 set as the first group are connected to a high potential. The conductor patterns P1, P4, P5, P8, and P9 set as the second group are connected to a low potential and become the same potential (see the column of the second insulation inspection in FIG. 3).

  Subsequently, the control unit 18 calculates a resistance value based on the current value Im and the voltage value Vm measured by the measurement unit 16, compares the resistance value with a predetermined reference value, and compares the resistance value with that of the first group. The quality of the insulation state between each conductor pattern P and each conductor pattern P of the second group is inspected. Next, as shown in FIG. 5, the control unit 18 controls the power supply unit 14 to gradually decrease the voltage value Vm of the inspection voltage Ve. Thereby, the live line state in the switch part 15 is cancelled | released. Thus, the second supply process and the insulation inspection are completed.

  In the circuit board inspection apparatus 1 and the circuit board inspection method, as described above, the switch unit 15 is disconnected and connected in a live line state. For this reason, in this circuit board inspection apparatus 1 and the circuit board inspection method, it is not necessary to increase and decrease the voltage value Vm of the inspection voltage Ve for each connection / disconnection performed by the switch unit 15. Has been shortened. Further, in the circuit board inspection apparatus 1 and the circuit board inspection method, since the additional connection process for increasing the number of conductor patterns P to be connected to the power supply unit 14 by one is performed, a group of conductor patterns P are set to the same potential (low And the other group of conductor patterns P are set to the same potential (high potential), and in this state, the inspection voltage Ve is applied to both groups of conductor patterns P to detect the presence or absence of discharge. Unlike the above, it is possible to reliably identify in which conductor pattern P the discharge has occurred.

  Subsequently, the control unit 18 performs the third supply process and the insulation test and the fourth supply process and the insulation test in the same manner as the second supply process and the insulation test. In this case, in the third supply process, the control unit 18, for example, the conductor pattern P whose third digit is “1” when the number of each conductor pattern P is a binary number (in this example, the number 4 to No. 7 conductor patterns P4 to P7) are set as the first group, and all the other conductor patterns P except for the conductor patterns P set as the first group (in this example, No. 1 to No. 3, No. 8 to No. 7) The tenth conductor pattern P1 to P3, P8 to P10) is set as the second group (see the column of the third insulation inspection in FIG. 3).

  In addition, in the fourth supply process, the control unit 18, for example, has a conductor pattern P whose number is “1” when the number of each conductor pattern P is a binary number (in this example, from 8 to 10). No. conductor patterns P8 to P10) are set as the first group, and all other conductor patterns P except for the conductor patterns P set as the first group (in this example, No. 1 to No. 7 conductor patterns P1 to P10) P7) is set as the second group (see the column of the fourth insulation test in FIG. 3).

  Next, when the fourth supply process and the insulation inspection are finished, the control unit 18 can specify whether or not the conductor pattern P has a discharge, and information that can specify the conductor pattern P in which the discharge has occurred when the discharge has occurred ( The number of the conductor pattern P and the like, and the result of the insulation inspection are displayed on a display unit outside the figure.

  Thus, according to the circuit board inspection apparatus 1 and the circuit board inspection method, the switch unit 15 is disconnected in the voltage output state in which the inspection voltage Ve is output from the power supply unit 14 to the switch unit 15. As a result, the process of increasing and decreasing the voltage value Vm of the inspection voltage Ve for each connection / disconnection by the switch unit 15 can be made unnecessary. As a result, the time required for the increase and decrease of the voltage value Vm, Inspection time can be shortened. For this reason, according to the circuit board inspection apparatus 1 and the circuit board inspection method, compared with the conventional configuration and method in which the voltage value Vm of the inspection voltage Ve is increased and decreased for each connection / disconnection by the switch unit 15. Thus, the efficiency of the insulation inspection can be sufficiently improved.

  In the circuit board inspection apparatus 1 and the circuit board inspection method, the supply process is executed for N types of combinations while changing the combination of the conductor patterns P set as the first group and the second group, and each supply process is executed. After that, perform an insulation test. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, it is possible to inspect the insulation state between the plurality of conductor patterns P set as each group at a time, and as a result, the insulation between the pair of conductor patterns P. Compared with a configuration and method for sequentially performing states and a configuration and method for sequentially performing insulation between a plurality of conductor patterns P having the same potential as one conductor pattern P, the efficiency of insulation inspection is further improved. Can do. Further, according to the circuit board inspection apparatus 1 and the circuit board inspection method, the switch unit 15 is increased so that the number of the conductor patterns P connected to the power supply unit 14 increases one by one in the process of executing the supply process. In order to detect the occurrence of discharge in the conductor pattern P additionally connected to the power supply unit 14 by disconnecting in the voltage output state (live line state), the conductor pattern in which the discharge was generated in the insulation test P can be easily identified.

  Further, according to the circuit board inspection apparatus 1 and the circuit board inspection method, in the additional connection process, the number of conductor patterns P to be connected to the power supply unit 14 is increased by one to discharge each conductor pattern P. Therefore, it is possible to accurately and reliably identify the conductor pattern P in which the discharge has occurred.

  The circuit board inspection apparatus and the circuit board inspection method are not limited to the configuration and method described above. For example, the example in which the voltage value Vm of the test voltage Ve is increased and decreased each time the combination of the conductor patterns P set as the first group and the second group is changed, that is, for each insulation test is described above. However, a configuration and a method are adopted in which the switch unit 15 is disconnected while maintaining the live line state without decreasing the voltage value Vm of the inspection voltage Ve until the insulation inspection for all the combinations is completed. You can also. Further, it is possible to adopt a configuration and method for terminating the inspection of the circuit board 100 when the occurrence of discharge is detected or when the insulation state is determined to be defective.

  In the additional connection process, the configuration and method for increasing the number of conductor patterns P to be connected to the power supply unit 14 one by one have been described. However, in the additional connection process, a plurality of conductor patterns P to be connected to the power supply unit 14 are used. It is also possible to employ a configuration and a method of increasing the number by one (for example, by two). Moreover, the structure and method of changing the number of the conductor patterns P connected to the power supply part 14 every time or every several times are also employable.

  Moreover, although the example which performs a hot-wire connection process in the structure and method which performs an insulation test | inspection by a multiple system was mentioned above, the structure and method which perform an insulation test | inspection by a bulk short system (1 to N system) or a 1 to 1 system It is also possible to execute a hot-wire cut-off process.

  Further, the configuration and method for detecting the presence or absence of occurrence of discharge in the conductor pattern P based on both the voltage value Vm (change value of the voltage value Vm) and the current value Im measured by the measurement unit 16 are described above. It is also possible to employ a configuration and method for detecting whether or not a discharge occurs in the conductor pattern P based on either the value Vm (change value of the voltage value Vm) or the current value Im.

DESCRIPTION OF SYMBOLS 1,1A Circuit board inspection apparatus 14 Inspection signal output part 15 Scanner part 16 Measurement part 18, 18A Control part 100 Circuit board P1-P10 Conductor pattern S1 Low voltage signal S2 High voltage signal

Claims (4)

A power supply unit that outputs a test voltage; an inspection unit that performs an insulation test between the conductor patterns based on a current value that flows by supplying the test voltage to each conductor pattern on the circuit board; and each conductor pattern A circuit board inspection apparatus comprising a switch unit for connecting / disconnecting between the power supply unit and the inspection unit, and a control unit for controlling the switch unit,
The control unit causes the switch unit to perform the disconnection in a voltage output state in which the inspection voltage is output from the power supply unit to the switch unit, and M (M is an integer of 2 or more) A part of the conductor patterns in the circuit board having the conductor pattern is set as a first group so that the first group of conductor patterns have the same potential, and the conductors of the first group All the conductor patterns other than the pattern are set as the second group, and the inspection voltage is supplied between the conductor patterns of the two groups while keeping the second group of conductor patterns at the same potential. A supply process that causes the switch unit to perform the connection / disconnection, and at that time, a combination of the conductor patterns to be set as the two groups, respectively. With (is N (an in log 2 _M) or (nearest integer log 2 _M)) N type while changing the allowed to execute the supply process for the combination of the execution process of the respective supply process, Performing an additional connection process for causing the switch unit to perform the disconnection in the voltage output state so that the number of the conductor patterns connected to the power supply unit is increased by one or a plurality,
The inspection unit generates a discharge in the conductor pattern based on at least one of the voltage value of the inspection voltage and the current value each time the number of conductor patterns to be connected increases by executing the additional connection process. A circuit board inspection apparatus that detects presence / absence, and performs the insulation inspection after each of the supply processes is executed by changing the combination . Wherein the control unit is configured in addition connection process, the conductor pattern number circuit board inspection apparatus according to claim 1, wherein to perform the disconnection with respect to said switch unit so as to increase by one. A control unit for connecting and disconnecting each conductor pattern on the circuit board and the power supply unit that outputs the inspection voltage and the inspection unit is controlled so that the inspection voltage is supplied to each conductor pattern. A circuit board inspection method for causing the inspection unit to perform an insulation inspection between the conductor patterns based on a current value flowing by supply,
In the voltage output state in which the voltage for inspection is output from the power supply unit to the switch unit, the switch unit is connected and disconnected .
A part of the conductor patterns in the circuit board having the M (M is an integer of 2 or more) conductor patterns is set as a first group, and the conductor patterns of the first group are the same. While setting the electric potential and setting all the other conductor patterns other than the first group of conductor patterns as a second group and setting the second group of conductor patterns to the same potential, the respective conductor patterns of both groups A supply process for performing the connection / disconnection to the switch unit so that the inspection voltage is supplied in between is performed, and at that time, while changing the combination of the conductor patterns respectively set as the two groups N kinds (N is (a is _log 2 M) or (nearest integer _log 2 M)) by running the feed process for the combination of In the process of performing each supply process, the switch unit is disconnected in the voltage output state so that the number of the conductor patterns connected to the power supply unit increases by one or more. Execute additional connection processing
Each time the number of conductor patterns to be connected is increased by executing the additional connection process, the inspection unit determines whether or not discharge has occurred in the conductor pattern based on at least one of the voltage value of the inspection voltage and the current value. A circuit board inspection method that causes the inspection unit to perform the insulation inspection after performing the respective supply processes while changing the combination . The circuit board inspection method according to claim 3 , wherein, in the additional connection process, the connection / disconnection is performed on the switch unit so that the number of the conductor patterns increases by one.

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