JP5827414B2 - 混合金属酸化物をベースとするメモリスタ - Google Patents
混合金属酸化物をベースとするメモリスタ Download PDFInfo
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- JP5827414B2 JP5827414B2 JP2014540997A JP2014540997A JP5827414B2 JP 5827414 B2 JP5827414 B2 JP 5827414B2 JP 2014540997 A JP2014540997 A JP 2014540997A JP 2014540997 A JP2014540997 A JP 2014540997A JP 5827414 B2 JP5827414 B2 JP 5827414B2
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- 229910003455 mixed metal oxide Inorganic materials 0.000 title claims description 12
- 229910052735 hafnium Inorganic materials 0.000 claims description 11
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 7
- 229910052706 scandium Inorganic materials 0.000 claims description 5
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical group [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 5
- 229910052765 Lutetium Inorganic materials 0.000 claims description 3
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 description 23
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 21
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical group [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 18
- 229910052726 zirconium Inorganic materials 0.000 description 18
- 229910052719 titanium Inorganic materials 0.000 description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 239000002800 charge carrier Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052763 palladium Inorganic materials 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000002086 nanomaterial Substances 0.000 description 7
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- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
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- 229910052727 yttrium Inorganic materials 0.000 description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 238000000609 electron-beam lithography Methods 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
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- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
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- 150000002500 ions Chemical class 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 238000001127 nanoimprint lithography Methods 0.000 description 2
- 230000001537 neural effect Effects 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 102000004169 proteins and genes Human genes 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229910000314 transition metal oxide Inorganic materials 0.000 description 2
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
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- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
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- 239000013078 crystal Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002069 magnetite nanoparticle Substances 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 210000000225 synapse Anatomy 0.000 description 1
- 230000000946 synaptic effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
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- Semiconductor Memories (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Thyristors (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
TiO2−TinO2n−1、ここでn=3〜9、
ZrO2−Zr2−x、ここで、x=0.01〜0.5、
HfO2−HfO2−x、ここで、x=0.01〜0.5、
TiaZrbHfcO2−(TidZreHff)nO2n−1、ここで、a+b+c=1、d+e+f=1、n=3〜15、
VO2−VnO2n−1、ここで、n=3〜9、
VaNbbTacO2−(VdNbeTaf)nO2n−1、ここで、a+b+c=1、d+e+f=1、n=3〜12、
Nb2O5−NbO2、
Nb2O5−多成分性酸化物Nb(酸化度、+5または+4)(Nb2O5−NbO2+xを含んでいる)、ここでx=−0.5〜0.5、
Ta2O5−TaO2、
Ta2O5−多成分性酸化物Ta(酸化度、+5または+4)(Ta2O5−TaO2+xを含んでいる)、ここでx=−0.5〜0.5、
MoO3−MonO3n−1、ここで、n=4〜12、
WO3−WnO3n−1、ここで、n=4〜12、
CraMobWcO3−(CrdMoeWf)nO3n−1、ここで、a+b+c=1、d+e+f=1、n=4〜15、
Fe2O3−Fe3O4、
Ni2O3−Ni3O4、
Co2O3−Co3O4。
[実施例1]
9種類の混合金属酸化物をベースとするメモリスタにおける、スイッチマトリックスを実施するために、1cm×1cmの大きさの基板が、シリコン・ウエハーから切り出され、用いられた。上記基板と上記スイッチマトリックスとの絶縁性のために、100nmの厚さのSiO2である酸化物が、室内環境にて1000℃で熱的酸化されることによって、上記基板上において形成された。続いて、電子ビームによるリソグラフィの方法を用いて、3つの底部電極が、上記基板の中央にて形成され、幅300nmおよび長さ50ミクロンを有する長方形の一片として、パラジウム製である、一群の平行なナノワイヤーを構成した。上記ナノワイヤー間の距離は、5μmであった。上述のパラジウム層の厚さは、20nmであった。
上記メモリスタを実施する第二の例は、第一の例と技術的に類似している。上記2つの例の違いは、以下のものである:1)スイッチマトリックスが、16種のメモリスタによって形成された;2)上記活性層が、5nmの厚さのY0.1Zr0.9Ox混合酸化物によって形成された;3)ジルコニウムが、頂部電極として堆積された。上記ジルコニウム層は、2nmの厚さを有し、上記活性層と直接接していた。上記ジルコニウム層は、10nmの厚さのパラジウムを用いて被覆された。
[実施例3]
上記メモリスタを実施する第三の例は、第一の例と技術的に類似している。上記2つの例の違いは、以下のものである:1)上記活性層が、6nmの厚さのLu0.45Zr0.65Ox混合酸化物によって形成された;2)ジルコニウムが、頂部電極として堆積された。上記ジルコニウム層は、2nmの厚さを有し、上記活性層と直接接していた。上記ジルコニウム層は、10nmの厚さのパラジウムを用いて被覆された。
Claims (1)
- 混合金属酸化物をベースとするメモリスタであって、
少なくとも3つの交代層を含んでいるメモリスタ、すなわち、
2つの導電体層の間に活性層が位置しており、
上記活性層は、混合酸化物であり、
上記混合金属酸化物の第一の成分がジルコニウムまたはハフニウムであり、
上記混合金属酸化物の第二の成分が、スカンジウムまたはルテチウムであり、
上記混合酸化物の構成要素の比率を%で示すと以下の通りであるメモリスタ:
上記第一の成分は、60%〜99%、
上記第二の成分は、40%〜1%。
Applications Claiming Priority (3)
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RU2011146089 | 2011-11-14 | ||
RU2011146089/07A RU2472254C9 (ru) | 2011-11-14 | 2011-11-14 | Мемристор на основе смешанного оксида металлов |
PCT/RU2012/000899 WO2013073993A2 (ru) | 2011-11-14 | 2012-11-02 | Мемристор на основе смешанного оксида металлов |
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JP2015502031A JP2015502031A (ja) | 2015-01-19 |
JP5827414B2 true JP5827414B2 (ja) | 2015-12-02 |
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US (1) | US20140332747A1 (ja) |
JP (1) | JP5827414B2 (ja) |
CN (1) | CN104054190B (ja) |
RU (1) | RU2472254C9 (ja) |
WO (1) | WO2013073993A2 (ja) |
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RU2540237C2 (ru) * | 2012-11-28 | 2015-02-10 | федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский ядерный университет МИФИ" (НИЯУ МИФИ) | СПОСОБ ФОРМИРОВАНИЯ МЕМРИСТОРА НА ОСНОВЕ ТВЕРДОТЕЛЬНОГО СПЛАВА Si:Me И СТРУКТУРА МЕМРИСТОРА НА ОСНОВЕ ТВЕРДОТЕЛЬНОГО СПЛАВА Si:Me |
RU2524415C1 (ru) * | 2013-04-18 | 2014-07-27 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский ядерный университет "МИФИ" (НИЯУ МИФИ) | Мемристор на основе смешанного оксида металлов |
RU2540486C1 (ru) * | 2013-09-27 | 2015-02-10 | федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" (Университет ИТМО) | Способ получения резистивного элемента памяти |
RU2530534C1 (ru) * | 2013-10-02 | 2014-10-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет радиотехники, электроники и автоматики" | Способ изготовления сегнетоэлектрического конденсатора |
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CN104934534A (zh) * | 2015-05-19 | 2015-09-23 | 中国科学院宁波材料技术与工程研究所 | 一种生物神经突触仿生电子器件及其制备方法 |
WO2019078367A1 (ja) | 2017-10-19 | 2019-04-25 | 学校法人 龍谷大学 | メモリスタ及びそれを用いたニューラルネットワーク |
US11586884B2 (en) * | 2018-02-08 | 2023-02-21 | University Of Massachusetts | Artificial neurons using diffusive memristor |
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CN101593810B (zh) * | 2009-07-02 | 2011-04-06 | 黑龙江大学 | 纳米结构开关忆阻器及其制造方法 |
CN102484127B (zh) * | 2009-09-04 | 2015-07-15 | 惠普开发有限公司 | 基于混合金属价键化合物的记忆电阻 |
US8063395B2 (en) * | 2009-09-30 | 2011-11-22 | Hewlett-Packard Development Company, L.P. | Memristor amorphous metal alloy electrodes |
US8487292B2 (en) * | 2010-03-16 | 2013-07-16 | Sandisk 3D Llc | Resistance-switching memory cell with heavily doped metal oxide layer |
JP2011204785A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 不揮発性記憶装置 |
WO2012118481A1 (en) * | 2011-02-28 | 2012-09-07 | Hewlett-Packard Development Company, L.P. | Memristive elements that exhibit minimal sneak path current |
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2011
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2012
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- 2012-11-02 CN CN201280054398.6A patent/CN104054190B/zh active Active
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WO2013073993A8 (ru) | 2014-06-19 |
US20140332747A1 (en) | 2014-11-13 |
CN104054190A (zh) | 2014-09-17 |
CN104054190B (zh) | 2016-08-24 |
JP2015502031A (ja) | 2015-01-19 |
WO2013073993A3 (ru) | 2013-07-11 |
RU2472254C1 (ru) | 2013-01-10 |
RU2472254C9 (ru) | 2013-06-10 |
WO2013073993A2 (ru) | 2013-05-23 |
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