JP5824135B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5824135B2
JP5824135B2 JP2014262313A JP2014262313A JP5824135B2 JP 5824135 B2 JP5824135 B2 JP 5824135B2 JP 2014262313 A JP2014262313 A JP 2014262313A JP 2014262313 A JP2014262313 A JP 2014262313A JP 5824135 B2 JP5824135 B2 JP 5824135B2
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semiconductor chip
source
mosfet
lead
junction fet
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Japanese (ja)
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JP2015092609A (ja
JP2015092609A5 (enExample
Inventor
金澤 孝光
孝光 金澤
秋山 悟
悟 秋山
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Renesas Electronics Corp
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Renesas Electronics Corp
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JP2014262313A 2014-12-25 2014-12-25 半導体装置 Active JP5824135B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014262313A JP5824135B2 (ja) 2014-12-25 2014-12-25 半導体装置

Applications Claiming Priority (1)

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JP2014262313A JP5824135B2 (ja) 2014-12-25 2014-12-25 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013535780A Division JP5676771B2 (ja) 2011-09-30 2011-09-30 半導体装置

Publications (3)

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JP2015092609A JP2015092609A (ja) 2015-05-14
JP2015092609A5 JP2015092609A5 (enExample) 2015-08-06
JP5824135B2 true JP5824135B2 (ja) 2015-11-25

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JP2014262313A Active JP5824135B2 (ja) 2014-12-25 2014-12-25 半導体装置

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JP (1) JP5824135B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6767789B2 (ja) 2016-06-29 2020-10-14 ローム株式会社 半導体装置
WO2018180255A1 (ja) 2017-03-28 2018-10-04 ローム株式会社 半導体装置および半導体装置の製造方法
JP6822939B2 (ja) 2017-11-30 2021-01-27 株式会社東芝 半導体装置
US10586755B2 (en) 2018-01-15 2020-03-10 Rohm Co., Ltd. Semiconductor device, and method for manufacturing semiconductor device
DE102019112935B4 (de) * 2019-05-16 2021-04-29 Danfoss Silicon Power Gmbh Halbleitermodul

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JP2015092609A (ja) 2015-05-14

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