JP5824135B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5824135B2 JP5824135B2 JP2014262313A JP2014262313A JP5824135B2 JP 5824135 B2 JP5824135 B2 JP 5824135B2 JP 2014262313 A JP2014262313 A JP 2014262313A JP 2014262313 A JP2014262313 A JP 2014262313A JP 5824135 B2 JP5824135 B2 JP 5824135B2
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- semiconductor chip
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- mosfet
- lead
- junction fet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014262313A JP5824135B2 (ja) | 2014-12-25 | 2014-12-25 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014262313A JP5824135B2 (ja) | 2014-12-25 | 2014-12-25 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013535780A Division JP5676771B2 (ja) | 2011-09-30 | 2011-09-30 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015092609A JP2015092609A (ja) | 2015-05-14 |
| JP2015092609A5 JP2015092609A5 (enExample) | 2015-08-06 |
| JP5824135B2 true JP5824135B2 (ja) | 2015-11-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014262313A Active JP5824135B2 (ja) | 2014-12-25 | 2014-12-25 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5824135B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6767789B2 (ja) | 2016-06-29 | 2020-10-14 | ローム株式会社 | 半導体装置 |
| WO2018180255A1 (ja) | 2017-03-28 | 2018-10-04 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6822939B2 (ja) | 2017-11-30 | 2021-01-27 | 株式会社東芝 | 半導体装置 |
| US10586755B2 (en) | 2018-01-15 | 2020-03-10 | Rohm Co., Ltd. | Semiconductor device, and method for manufacturing semiconductor device |
| DE102019112935B4 (de) * | 2019-05-16 | 2021-04-29 | Danfoss Silicon Power Gmbh | Halbleitermodul |
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2014
- 2014-12-25 JP JP2014262313A patent/JP5824135B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015092609A (ja) | 2015-05-14 |
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