JP5805497B2 - Electronic component mounting structure - Google Patents

Description

  The present invention relates to a mounting structure on which an electronic component such as a piezoelectric element is mounted.

  A mounting structure that seals a space is known. For example, in the mounting structure of Patent Document 1, a surface acoustic wave (SAW) device is mounted on a wiring board. The SAW device has a piezoelectric substrate, an IDT (InterDigital Transducer) formed on the main surface of the piezoelectric substrate, and a cover that seals the space on the IDT, and is surface-mounted with the upper surface of the cover facing the wiring substrate. Has been. The SAW device is covered with a sealing resin together with other electronic components, and the sealing resin is also filled in the gap between the SAW device and the wiring board and the gap between the SAW device and the other electronic components. Thus, a space sealed with the cover and the sealing resin is formed between the piezoelectric substrate and the wiring substrate.

JP 2002-217673 A

  In the space sealing method of Patent Document 1, various disadvantages occur. For example, a cover and a sealing resin are interposed between the piezoelectric substrate of the SAW device and the wiring substrate on which the SAW device is mounted, which increases the size of the mounting structure.

  An object of the present invention is to provide an electronic component mounting structure capable of suitably sealing a space.

An electronic component mounting structure according to an aspect of the present invention includes a support member, a plurality of electronic components mounted on the support member via bumps, and the plurality of electronic components. A sealing resin that seals a space between the component and the support member, and the plurality of electronic components are distances between predetermined positions where the distance between the lower surfaces of adjacent electronic components is higher than the lower surface. greater than, the sealing resin may possess an intervening portions filled in at least part of the upper side of the gap between the adjacent electronic components, the intermediate section, through the space a lower surface of the support member And are recessed.

  Preferably, at least one of the adjacent electronic components is inclined such that a side surface on the other electronic component side is positioned closer to the other electronic component side as the upper surface side.

An electronic component mounting structure according to an aspect of the present invention includes a support member, a plurality of electronic components mounted on the support member via bumps, and the plurality of electronic components. A sealing resin that seals a space between the component and the support member, and the plurality of electronic components are distances between predetermined positions where the distance between the lower surfaces of adjacent electronic components is higher than the lower surface. The sealing resin has an interposition part filled in at least a part of the upper side of the gap between the adjacent electronic components, and at least one of the adjacent electronic components is on the other electronic component side A protrusion is provided on the side surface of the first electronic component and protrudes toward the other electronic component above the lower surface.

  Preferably, the interposition part is at least filled to a position below the protrusion.

  According to said structure, space can be sealed suitably.

FIG. 1A and FIG. 1B are perspective views of the mounting structure according to the first embodiment of the present invention as seen from the upper surface side and the lower surface side. The disassembled perspective view of the mounting structure of FIG. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4A to 4E are cross-sectional views illustrating a method for manufacturing the mounting structure shown in FIG. FIG. 5A and FIG. 5B are cross-sectional views showing a mounting structure according to a modification of the first embodiment. FIG. 6 is a cross-sectional view showing a mounting structure according to the second embodiment. FIGS. 7A to 7C are cross-sectional views illustrating a method for manufacturing the mounting structure of FIG. FIG. 8A and FIG. 8B are cross-sectional views showing a mounting structure according to a modification of the second embodiment. FIG. 9A and FIG. 9B are cross-sectional views showing a mounting structure according to another modification of the second embodiment.

  Hereinafter, an electronic component mounting structure according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones.

  In the description of each embodiment and the like, components that are the same as or similar to those already described may be denoted by the same reference numerals and description thereof may be omitted.

(First embodiment)
FIG. 1A is a perspective view of the mounting structure 1 according to the first embodiment of the present invention as seen from the upper surface side, and FIG. 1B shows the appearance of the mounting structure 1. It is the perspective view seen from the lower surface side.

  The mounting structure 1 may be either upward or downward. For convenience, the mounting structure 1 defines an orthogonal coordinate system xyz, and the upper side or the lower side with the positive side in the z direction as the upper side. The following words shall be used.

  The mounting structure 1 is formed in a substantially rectangular parallelepiped shape, for example, and a plurality of external terminals 3 are exposed in an appropriate shape and an appropriate number on the lower surface thereof. The size of the mounting structure 1 may be an appropriate size. For example, the length of one side is 1 mm to several tens of mm.

  The mounting structure 1 is disposed with its lower surface facing a mounting board (not shown), and a pad provided on the mounting board and a plurality of external terminals 3 are joined via solder bumps or the like. To be implemented. The mounting structure 1 receives, for example, a signal from any of the plurality of external terminals 3, performs a predetermined process on the input signal, and outputs the signal from any of the plurality of external terminals 3.

  FIG. 2 is an exploded perspective view of the mounting structure 1. FIG. 3 is a cross-sectional view taken along line III-III in FIG. Actually, the mounting structure 1 cannot be disassembled as shown in FIG. 2 without breaking some members.

  The mounting structure 1 includes a support member 5 and a plurality (two in this embodiment) of piezoelectric elements 7A and 7B (hereinafter, A and B may be omitted) mounted on the support member 5. And a bump 8 (FIG. 3) interposed between the support member 5 and the piezoelectric element 7 and a resin portion 9 for sealing the piezoelectric element 7.

  The support member 5 is constituted by, for example, a rigid printed wiring board, and includes an insulating base 11, an upper surface conductive layer 13A (FIG. 3) formed on the upper surface 11a of the insulating base 11, and an inside of the insulating base 11. An inner conductive layer 13B (FIG. 3) formed in parallel with the upper surface 11a, a via conductor 15 (FIG. 3) penetrating all or part of the insulating substrate 11 in the vertical direction, and a lower surface 11b of the insulating substrate 11 are formed. And the above-described external terminal 3. The support member 5 may not be provided with the internal conductive layer 13B.

  The insulating base 11 is formed in, for example, a generally thin rectangular parallelepiped shape. The insulating base 11 is formed including, for example, a resin, a ceramic, and / or an amorphous inorganic material. The insulating substrate 11 may be made of a single material, or may be made of a composite material such as a substrate in which a base material is impregnated with a resin.

  The upper surface conductive layer 13 </ b> A includes a substrate pad 17 (FIG. 3) for mounting the piezoelectric element 7 on the support member 5. The via conductor 15 and the internal conductive layer 13 </ b> B include wiring that connects the substrate pad 17 and the external terminal 3. The top conductive layer 13A, the internal conductive layer 13B, and the via conductor 15 may include an inductor, a capacitor, or a circuit that performs appropriate processing. The top conductive layer 13A, the internal conductive layer 13B, the via conductor 15 and the external terminal 3 are made of a metal such as Cu, for example.

  For example, the piezoelectric element 7A and the piezoelectric element 7B have the same general configuration. The piezoelectric element 7 is, for example, a SAW element, and is an element that is provided on the piezoelectric substrate 19, the excitation electrode 21 (FIG. 2) provided on the lower surface 19 a of the piezoelectric substrate 19, and the support member 5. And a pad 25 (FIG. 2). In addition, the piezoelectric element 7 may include appropriate members such as a protective layer that covers the excitation electrode 21, an electrode that covers the upper surface 19 b of the piezoelectric substrate 19, and / or a protective layer.

  The shape of the piezoelectric substrate 19 is, for example, generally rectangular in plan view and substantially trapezoidal in side view. In the trapezoid, the lower surface 19a and the upper surface 19b are parallel to each other, and the upper surface 19b is longer than the lower surface 19a. The side surface 19c of the piezoelectric substrate 19 is inclined so as to be positioned on the outer side (the other piezoelectric element 7 side) toward the upper surface 19b side. Therefore, in the adjacent piezoelectric elements 7, the distance d1 (FIG. 3) between the lower surfaces 19a is larger than the distance d2 (FIG. 3) between the upper surfaces 19b. The adjacent piezoelectric elements 7 may be in contact with each other on the upper surface 19b side (distance d2 may be 0). The piezoelectric substrate 19 is composed of a single crystal substrate having piezoelectricity, such as a lithium tantalate single crystal or a lithium niobate single crystal.

  The excitation electrode 21 is a so-called IDT (InterDigital transducer) and includes a pair of comb electrodes 23 (FIG. 2). Each comb electrode 23 has a bus bar 23a (FIG. 2) and a plurality of electrode fingers 23b extending from the bus bar 23a, and the pair of comb electrodes 23 mesh with each other (the plurality of electrode fingers 23b Arranged so as to cross each other). Since FIG. 2 is a schematic diagram, only one pair of comb-tooth electrodes 23 having a plurality of electrode fingers 23b is shown. However, in practice, a plurality of pairs having more electrode fingers 23b are shown. The comb-tooth electrode 23 may be provided. The excitation electrode 21 constitutes, for example, a SAW filter, a SAW resonator, and / or a duplexer.

  When a signal is input to the excitation electrode 21, the signal is converted into SAW, propagates in the direction (y direction) perpendicular to the electrode finger 23 b on the lower surface 19 a, converted into a signal again, and output from the excitation electrode 21. . In the process, the signal is filtered. The lower surface 19a and the excitation electrode 21 constitute a functional part 7w that exhibits a predetermined function when a voltage is applied.

  The element pad 25 is connected to the excitation electrode 21 via a wiring (not shown) formed on the lower surface 19a. The excitation electrode 21 receives a signal via the element pad 25 and outputs a signal via the element pad 25.

  The excitation electrode 21, the element pad 25, and the wiring (not shown) connecting them are made of an appropriate metal such as an Al—Cu alloy, for example. These may be formed of the same material, or may be formed of different materials.

  The two piezoelectric elements 7 include, for example, specific dimensions of the piezoelectric substrate 19, specific materials of the piezoelectric substrate 19, specific configurations of the excitation electrodes 21, and / or specific coordination positions of the element pads 25. Are different from each other. However, the two piezoelectric elements 7 may have exactly the same configuration. The two piezoelectric elements 7 may be connected to each other via the support member 5 or may not be connected to each other.

  The bump 8 is interposed between the element pad 25 and the substrate pad 17 to bond these pads. The bump 8 is made of solder. The solder may be a solder using lead such as Pb—Sn alloy solder, or lead-free solder such as Au—Sn alloy solder, Au—Ge alloy solder, Sn—Ag alloy solder, Sn—Cu alloy solder, etc. It may be. Note that the bumps 8 may be formed of a conductive adhesive.

  Since the bumps 8 are interposed between the element pads 25 and the substrate pads 17, a gap (space S) is formed between the upper surface 11 a of the insulating base 11 and the lower surface 19 a of the piezoelectric substrate 19. . Thereby, the vibration (SAW propagation) of the lower surface 19a is facilitated.

  For example, the resin portion 9 is provided on the support member 5 so as to cover the plurality of piezoelectric elements 7 together. Further, the resin portion 9 is also filled in the gap W (FIG. 3) between the adjacent piezoelectric elements 7 (having the interposition portion 9e). It is preferable that at least a part, preferably the whole, of the contact part of the resin part 9 with respect to the piezoelectric element 7 and the support member 5 is bonded.

  The resin part 9 is not filled in the gap between the upper surface 11a of the insulating base 11 and the lower surface 19a of the piezoelectric substrate 19, and constitutes a space S together with the upper surface 11a and the lower surface 19a. In the present embodiment, the space S refers to the entire two spaces under the two piezoelectric elements 7. A gas such as air is sealed in the space S. When the temperature in the space S is equal to the temperature of the atmosphere, the pressure in the space S may be higher than atmospheric pressure, may be equal, or lower than atmospheric pressure. Note that the space S can be substantially vacuumed.

  The resin portion 9 has an inner wall surface 9 a that forms the outer peripheral surface of the space S, and a lower surface 9 b that forms the ceiling of the space S between the piezoelectric elements 7. The inner wall surface 9 a and the lower surface 9 b are concave with respect to the space S. Note that the upper end of the inner wall surface 9a may be located at a corner between the lower surface 19a and the side surface 19c of the piezoelectric substrate 19, inside the corner, or outside the side (side 19c). The lower end of the inner wall surface 9a may be located at a corner portion of the lower surface 19a and the side surface 19c, on the inner side of the corner portion, or on the outer side of the corner portion in plan view. Further, the lower surface 9 b may be located anywhere from the lower surface 19 a to the upper surface 19 b of the piezoelectric substrate 19.

  For example, the outer shape of the resin portion 9 is formed in a substantially rectangular parallelepiped shape. The shape and size in plan view are the same as, for example, the planar shape of the support member 5, and the side surface of the resin portion 9 is flush with the side surface of the support member 5. The thickness of the resin portion 9 may be set to an appropriate size from various viewpoints such as the viewpoint of protecting the piezoelectric element 7.

  The resin part 9 is made of resin. The resin is, for example, an epoxy resin, a polyimide resin, or a cyanoresin resin. The resin is preferably a thermosetting resin, and the thermosetting resin is, for example, an epoxy resin or a phenol resin. In the resin, a filler made of insulating particles formed of a material having a lower thermal expansion coefficient than that of the resin may be mixed. Examples of the material of the insulating particles include silica, alumina, phenol, polyethylene, glass fiber, and graphite filler.

  In addition, since the resin part 9 is formed with resin, generally, compared with the piezoelectric substrate 19 which consists of a piezoelectric material, Young's modulus is small and a thermal expansion coefficient is large. In addition, the resin portion 9 may have a Young's modulus or a coefficient of thermal expansion that is greater than, equal to, or smaller than that of the insulating substrate 11. Preferably, the thermal expansion coefficient of the resin portion 9 is equivalent to that of the insulating base 11.

  FIG. 4A to FIG. 4E are cross-sectional views illustrating a method for manufacturing the mounting structure 1. Note that details of the conductive layer and the like may be omitted in the cross-sectional views of FIGS.

  First, as shown in FIG. 4A, a mother board 31 on which a large number of piezoelectric elements 7A are taken is prepared. The mother substrate 31 is manufactured by forming the excitation electrode 21 and the like by photolithography or the like on a mother substrate on which a large number of piezoelectric substrates 19 are taken. Then, a dicing tape 33 is attached to the surface of the mother board 31 on the upper surface 19b side.

  Next, as shown in FIG. 4B, the mother substrate 31 is cut by a dicing blade 35 to obtain a plurality of separated piezoelectric elements 7A. Here, the dicing blade 35 is formed in a tapered shape whose thickness becomes thinner toward the tip. Accordingly, the piezoelectric element 7A (piezoelectric substrate 19) has a trapezoidal shape in a side view.

  Although not particularly shown, the plurality of piezoelectric elements 7B can be obtained in the same manner as the plurality of piezoelectric elements 7A.

  Next, as shown in FIG. 4C, bumps 8 are formed on a mother substrate 37 on which a large number of support members 5 are taken, and the piezoelectric elements 7 </ b> A and 7 </ b> B are mounted on the mother substrate 37. The mother board 37 may be formed in the same manner as a mother board of a general wiring board. The bump 8 may be formed in the same manner as a general bump, and is formed by, for example, a vapor deposition method, a plating method, or a printing method. Adhesion between the support member 5 and the piezoelectric element 7 via the bumps 8 may be performed by, for example, reflow, as in general mounting.

  Next, as shown in FIG. 4D, a liquid material 39 (for example, an uncured resin material) to be the resin portion 9 is supplied onto the mother substrate 37 and the piezoelectric element 7. The material 39 is supplied by, for example, a printing method or a dispenser method. In supplying the material 39, a material having a relatively high viscosity is used as the material 39 so that the material 39 does not flow into the space S, or the pressure of the material 39 is adjusted (for example, the speed of the squeegee in screen printing is increased). Adjust).

  After the material 39 is supplied, the material 39 is heated while being pressed to cure the material 39. The pressure in the space S increases due to pressurization and heating (thermal expansion). As a result, the surface constituting the space S of the material 39 becomes concave with respect to the space S due to the action of the surface tension of the material 31 that attempts to make the space S closer to a sphere against the expansion of the space S. Alternatively, the surface constituting the space S of the material 31 is inclined with respect to the piezoelectric substrate 19 and / or the support member 5 by adjusting the wettability and the like of the material 31 regardless of the presence or absence of pressurization. It becomes concave with respect to. As a result, the inner wall surface 9 a and the lower surface 9 b of the resin portion 9 are concave with respect to the space S.

  Next, the mother substrate 37 to which the dicing tape 39 is affixed and the cured material 31 are cut by a dicing blade 41 to obtain a plurality of separated mounting structures 1.

  As described above, in the present embodiment, the mounting structure 1 covers both the support member 5, the plurality of piezoelectric elements 7 mounted on the support member 5 via the bumps 8, and the plurality of piezoelectric elements 7. And a sealing resin (resin portion 9) for sealing the space S between the plurality of piezoelectric elements 7 and the support member 5. In the plurality of piezoelectric elements 7, the distance d1 between the lower surfaces 19a of the adjacent piezoelectric elements 7 is larger than the distance d2 between predetermined positions (for example, between the upper surfaces 19b) above the lower surface 19a. The resin part 9 has an interposition part 9e filled in at least a part on the upper side of the gap W between the adjacent piezoelectric elements 7.

  Therefore, the space S is sealed by the resin portion 9, and a cover is unnecessary. Further, since the gap W between the piezoelectric elements 7 is narrower above the lower surface, the opening area to be closed by the resin portion 9 is reduced, and the gap W is filled with a part of the resin portion 9 (intervening portion 9e). Therefore, the sealing property of the space S is improved. In addition, due to the interposition part 9e, the bonding area between the resin part 9 and the piezoelectric element 7 is enlarged, and the peeling of the resin part 9 from the piezoelectric element 7 is also suppressed. Furthermore, the interposition part 9e functions as a spacer between the piezoelectric elements 7, and is also used for suppressing the proximity of the adjacent piezoelectric elements 7. As a result, for example, a short circuit between the piezoelectric elements 7 is suppressed.

  Further, the interposition part 9e has a lower surface 9b which is separated from the support member 5 and has a concave shape.

  Accordingly, the lower surface 9b of the resin portion 9 contacts the side surface 19c at an angle (shape) along the side surface 19c of the piezoelectric substrate 19 as compared with the case where the resin portion 9 is not concave. As a result, even if the atmospheric pressure in the space S acts on the lower surface 9b, the force acting on the lower surface 9b is suppressed from acting as a force for peeling the resin portion 9 from the side surface 19c, and the interposition portion 9e is formed on the side surface 19c. As a result, the resin portion 9 is prevented from being peeled off from the piezoelectric substrate 19. Moreover, the contact area of the resin part 9 and the side surface 19c with respect to the volume of the resin part 9 can be increased, and the adhesive force can be increased.

  At least one of the adjacent piezoelectric elements 7 is inclined such that the side surface 19c on the other piezoelectric element 7 side is located on the other piezoelectric element 7 side as the upper surface 19b side is.

  Therefore, the upper surface 19b side portion of the side surface 19c becomes a hook, and the separation of the interposition part 9e from between the piezoelectric elements 7 is suppressed, and consequently the peeling of the resin part 9 from the piezoelectric element 7 is suppressed. As a result, the lowering of the proximity suppression function of the piezoelectric element 7 and the sealing function of the space S by the resin portion 9 is suppressed. Further, for example, as compared with a second embodiment to be described later, it is possible to suppress the formation of corner portions where stress concentration occurs and to simplify the dicing process.

(Modification of the first embodiment)
FIG. 5A and FIG. 5B are cross-sectional views corresponding to FIG. 3 showing first and second modifications according to the first embodiment.

  In the modification shown in FIG. 5A, the lower surface 9b facing the support member 5 with the gap W is flat. The flat lower surface 9b is, for example, heated only without applying pressure when the material 31 is cured, supplied with the material 31 in a vacuum atmosphere, or covered with a resin sheet on the piezoelectric element 7 and then the material 31. This is realized by forming the resin portion 9 made of the resin sheet and the material 31.

  In the modification shown in FIG. 5B, piezoelectric elements 7A and 7C having different sizes are adjacent to each other. Even in such a case, if the distance d1 between the lower surfaces 19a is larger than the distance d2 between predetermined positions above the lower surface 19a (for example, the position of the upper surface 19b of the piezoelectric element 7A), the lower surfaces 19a Proximity is suppressed.

(Second Embodiment)
FIG. 6 is a cross-sectional view corresponding to FIG. 3 showing the mounting structure 201 according to the second embodiment. The appearance of the mounting structure 201 is the same as that of the first embodiment (FIG. 1).

  The mounting structure 201 is different from the first embodiment in the shape of the piezoelectric substrate 219 of the piezoelectric elements 207A and 207B. In addition, although the shape of the resin part 9 is also different from 1st Embodiment with the difference in the shape of the piezoelectric substrate 219, the same code | symbol as 1st Embodiment is used for convenience.

  Specifically, the piezoelectric substrate 219 has a T-shape when viewed from the side. In other words, the piezoelectric substrate 219 has a shape having a protrusion (flange) 219f protruding from the side surface above the lower surface 219a. The protrusion 219f is formed, for example, over the entire circumference of the piezoelectric substrate 219.

  Accordingly, in the mounting structure 201, as in the first embodiment, the distance d1 between the lower surfaces 219a of the adjacent piezoelectric elements 207 is a distance between predetermined positions (positions of the upper surface 219b) above the lower surface 219a. It is larger than d2. A part of the resin part 9 (intervening part 9e) is filled at least above the gap W between the piezoelectric elements 207. As a result, the same effects as those of the first embodiment are achieved.

  In addition, the lower surface 9b of the interposition part 9e is concave like the first embodiment. The lower surface 9b is located between the protrusions 219f, for example.

  FIG. 7A to FIG. 7C are cross-sectional views illustrating a method for manufacturing the mounting structure 201 (piezoelectric element 207).

  First, as shown in FIG. 7A, a mother board 31 on which a large number of piezoelectric elements 207A are taken is prepared. The mother board 31 is the same as the mother board 31 of the first embodiment.

  Next, as shown in FIG. 7B, a part of the mother substrate 31 on the lower surface 219 a side is cut along the dicing line by the dicing blade 235.

  Next, as shown in FIG. 7C, the mother substrate 31 is cut along the dicing line by a dicing blade 236 thinner than the dicing blade 235, thereby obtaining a plurality of separated piezoelectric elements 7.

  Thus, the protrusion 219f can be formed by using the dicing blades 235 and 236 having different thicknesses. The same applies to the piezoelectric element 207B.

  The subsequent steps are the same as those in the first embodiment.

(Modification of the second embodiment)
FIG. 8A, FIG. 8B, FIG. 9A, and FIG. 9B are cross-sectional views showing modified examples according to the second embodiment.

  In the second embodiment, the lower surface 9b is positioned between the protrusions 219f. However, in FIGS. 8A and 8B, the lower surface 9b is positioned below the protrusion 219f. More specifically, in FIG. 8A, both ends of the lower surface 9b are located on the surface of the protrusion 219f on the support member 5 side, and in FIG. 8B, the lower surface 9b has both ends thereof. The part is located on the side surface below the protrusion 219f.

  The lower surface 9b is positioned further downward as shown in FIGS. 8A and 8B, for example, by reducing the viscosity of the material 31 or increasing the pressure at the time of supplying the material 31. Can be made.

  In this way, since the interposition part 219e is filled to a position below the protrusion 219f, the protrusion 219f is caught and the interposition part 219e is prevented from coming off between the piezoelectric elements 207. Further, peeling of the resin portion 9 from the piezoelectric element 207 is suppressed.

  In FIG. 8A, the material 31 is caused by the action of the surface tension of the material 31 that tries to make the material 31 close to a sphere against the spread of the material 31 and / or due to the wettability of the material 31. The lower surface 9b is convex with respect to the support member 5 by incliningly contacting the lower surface of the protrusion 219f.

  Further, in FIG. 8B, as in the embodiment, the wettability of the material 31 by the action of the surface tension of the material 31 that attempts to make the space S close to a sphere against the expansion of the space S. Due to the above, the material 31 is in contact with the side surface of the piezoelectric substrate 219 while being inclined, so that the lower surface 9 b is concave with respect to the support member 5.

  FIGS. 9A and 9B are modified examples corresponding to FIGS. 5A and 5B. That is, also in 2nd Embodiment, as shown to Fig.9 (a), the lower surface 9b of the resin part 9 may be made flat, and as shown in FIG.9 (b), a magnitude | size differs mutually. A piezoelectric element 207 may be provided.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The support member is not limited to one that mediates between the electronic component and the mounting substrate. In other words, the mounting structure is not limited to that mounted on the mounting substrate. For example, the support member may function as a mother board (main board, main board) of an electronic device such as a portable device.

  The electronic component is not limited to a piezoelectric element. For example, the electronic component may be a semiconductor element (IC or the like), a resistance element, an inductor, or a capacitor. The piezoelectric element is not limited to a SAW element. For example, the piezoelectric element may be a piezoelectric thin film resonator (FBAR: Film Bulk Acoustic Resonator) or a boundary acoustic wave element (however, included in a broad sense SAW element). The SAW element or FBAR may have a cover that forms a space on the excitation electrode. The plurality of electronic components may be different types of electronic components. For example, the piezoelectric element and the semiconductor element may be adjacent to each other. However, from the viewpoint of effective use of the space formed by the resin portion, the electronic component is preferably a SAW element or FBAR that does not have a cover.

  For all the electronic components mounted on the support member, it is not necessary to establish a relationship that the distance between the lower surfaces of adjacent electronic components is larger than the distance between predetermined positions above the lower surface. It is sufficient that the above relationship is established with respect to at least two electronic components. Moreover, it is not necessary for both adjacent electronic components to be trapezoidal or T-shaped. One side may be just a trapezoid.

  The cross-sectional shape of the electronic component is not limited to a trapezoidal shape or a T-shape. In another aspect, the predetermined position where the distance between the electronic components is smaller than the distance between the lower surfaces is not limited to the position on the upper surface. For example, the electronic component may have a shape having a protrusion between the upper surface and the lower surface, or a shape having a rectangular lower surface side portion and a trapezoidal upper surface side portion (but may be regarded as a T-shape). It may be. In addition, the side slopes and protrusions need only be provided on the sides adjacent to each other in adjacent electronic components, and may not be provided on the opposite side (outside).

  The interposition part filled between the electronic components adjacent to each other in the resin part may be filled up to a position reaching the support member. In other words, the space between the electronic component and the support member may not be communicated between adjacent electronic components. Moreover, the resin part may have the thin film formed in the surface which is connected with the inner wall surface or interposition part of space, and opposes the supporting member of an electronic component.

  Dicing is not limited to that performed by a dicing blade. For example, it may be performed by a laser. Even in this case, the inclined side surface can be formed by changing the laser irradiation angle, and the protrusion can be formed by changing the laser diameter.

  DESCRIPTION OF SYMBOLS 1 ... Mounting structure, 5 ... Support member, 7 ... Piezoelectric element (electronic component), 8 ... Bump, 19a ... Lower surface, 19b ... Upper surface, 25 ... Element pad.

Claims (4)

A support member;
A plurality of electronic components mounted via bumps on the support member;
A sealing resin that covers the plurality of electronic components together and seals a space between the plurality of electronic components and the support member;
Have
In the plurality of electronic components, a distance between lower surfaces of adjacent electronic components is larger than a distance between predetermined positions above the lower surface,
The sealing resin may possess an intervening portions filled in at least part of the upper side of the gap between the adjacent electronic components,
The interposition part is an electronic component mounting structure in which a lower surface of the interposition part is spaced apart from the support member via a space and is concave . The electronic component mounting structure according to claim 1, wherein at least one of the adjacent electronic components is inclined such that a side surface on the other electronic component side is positioned closer to the other electronic component side toward the upper surface side. A support member;
A plurality of electronic components mounted via bumps on the support member;
A sealing resin that covers the plurality of electronic components together and seals a space between the plurality of electronic components and the support member;
Have
In the plurality of electronic components, a distance between lower surfaces of adjacent electronic components is larger than a distance between predetermined positions above the lower surface,
The sealing resin has an interposition part filled in at least a part on the upper side of the gap between the adjacent electronic components,
At least one of the adjacent electronic components is provided on the side surface on the other electronic component side with a protrusion that protrudes toward the other electronic component side above the lower surface.
Mounting structure of electronic components. The electronic component mounting structure according to claim 3 , wherein the interposition part is filled at least to a position below the protrusion.

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