JP5798480B2 - Insert moldings and sockets for electrical components - Google Patents

Description

  The present invention relates to an insert molded product in which a frame-shaped metal plate is coated with a resin by injection molding, and a socket for an electrical component using the insert molded product as a component.

  Conventionally, as this type of “electrical component socket”, there is an IC socket that detachably accommodates an “electrical component” IC package.

  In this IC socket, an IC package is accommodated on the socket body, and a large number of contact pins are arranged in the vertical direction on the socket body. In addition, a slide plate (moving plate) as an “insert molding” for elastically deforming the elastic pieces of these contact pins to contact the terminals of the IC package is provided in the socket body in the horizontal direction (lateral direction). It is arranged to be freely movable.

  It has been proposed that the slide plate is manufactured by embedding a reinforcing metal plate in a resin by insert molding in order to resist the force for elastically deforming the elastic pieces of a large number of contact pins. In this slide plate, a large number of contact pin insertion holes must be formed in a lattice shape in the center of the resin, so the metal plate is inevitably formed in a frame shape so as to avoid these contact pin insertion holes. It must be done (see, for example, Patent Document 1).

JP 2003-223966 A (paragraph [0030] [0059] [0060] column)

  However, in such a conventional product, although the metal plate and the resin are integrated by insert molding, the expansion coefficients of the two are different from each other. ) Occurs.

  Further, in the IC socket, the contact pin pitch has been narrowed in recent years, and along this flow, the lattice-shaped contact pin insertion hole of the slide plate tends to be narrowed to form a thin portion. .

  However, when a thin-walled portion is formed at the center of the resin of the insert molded product in order to cope with the narrow pitch of the slide plate, the insert molded product is kept at a predetermined temperature (for example, about 85 ° C.). When chemicals are washed, cracks (cracks, cracks, etc.) may occur in the resin due to interaction with the chemicals and other causes. As a result, when this insert molded product is used as a slide plate for an IC socket, a force acts on the insert molded product due to the elastic deformation of the contact pin, so that the insert molded product is damaged due to cracks. There was a case.

  Such inconvenience may occur in processes other than chemical cleaning.

  Accordingly, the present invention provides an insert molded product and an electrical component socket capable of preventing damage caused by the crack by suppressing the occurrence of a crack in the resin during chemical cleaning or the like. Is an issue.

To achieve the foregoing object, the invention according to claim 1 is a insert molding of the electrical component socket of frame-shaped metal plate is covered with a substantially rectangular flat plate-like resin by insert molding, the resin A plurality of contact pin insertion holes are formed in a portion located inside the metal plate, and elongated slits are formed along the four sides of the resin around the contact pin insertion holes. The insert molded product of the socket for an electrical component, in which the metal plate is exposed, is provided.

The invention according to claim 2 is characterized in that, in addition to the configuration according to claim 1, a thin portion is formed between contact pin insertion holes adjacent to each other among the plurality of contact pin insertion holes. .

The invention described in claim 3 is characterized in that, in addition to the configuration described in claim 1 or 2, the slits are provided on both the front and back surfaces of the resin .

According to a fourth aspect of the present invention, there is provided an electric component socket in which the insert molded product of the electric component socket according to any one of the first to third aspects is used.

  According to this invention, since the slit is formed in the resin so that the metal plate is exposed, the internal stress of the resin can be released by opening the slit. As a result, it is possible to prevent occurrence of cracks in the resin of the insert molded product during chemical cleaning of the insert molded product and prevent the insert molded product from being damaged due to the crack. .

It is a top view of the slide plate which concerns on embodiment of this invention. It is sectional drawing which follows the AA line of the slide plate shown in FIG. It is sectional drawing which follows the BB line of the slide plate shown in FIG. It is a bottom view of the slide plate shown in FIG. It is a figure which shows the metal plate of the slide plate shown in FIG. 1, Comprising: (a) is the top view, (b) is sectional drawing which follows the CC line of (a). It is an enlarged detail drawing which shows the center part of resin of the slide plate shown in FIG. 1, (a) is the top view, (b) is sectional drawing which follows the DD line | wire of (a), (c) is ( It is sectional drawing which follows the EE line of a).

  Embodiments of the present invention will be described below.

  1 to 6 show an embodiment of the present invention.

  First, the configuration will be described. An IC socket (not shown) which is an “electrical component socket” is arranged on a wiring board (not shown), and an IC package (not shown) which is an “electrical component”. In order to perform a burn-in test or the like, the IC package and the wiring board are electrically connected.

  The IC socket has an unillustrated socket body that accommodates an IC package and is disposed on a wiring board, and a number of unillustrated contact pins are disposed in the vertical direction on the socket body. Has been. Also, in this socket body, a substantially rectangular flat plate-like slide plate (moving plate) 11 as an “insert molded product” shown in FIGS. 1 to 4 is disposed so as to be movable in the horizontal direction (lateral direction). Yes. Then, when the slide plate 11 is moved in the horizontal direction via a link mechanism (not shown) by moving the operation member (not shown) up and down, the elastic piece of the contact pin is elastically deformed and the terminal (not shown) of the IC package is shown. It is comprised so that it may be separated from.

  As shown in FIGS. 1 to 4, the slide plate 11 is formed by injecting a resin 21 around a metal plate 12 accommodated in a cavity of a mold (not shown) so that the substantially rectangular frame-shaped metal plate 12 is formed. It is coated with resin 21.

  The metal plate 12 is made of, for example, stainless steel, and has a plate body 13 having a substantially rectangular flat plate shape, as shown in FIG. The hole 14 is formed so as to penetrate in the thickness direction (arrow A, B direction) of the plate body 13. The plate body 13 is formed with six semi-oval cutouts 15 communicating with the through holes 14, and eight round holes 16 are formed in the vicinity of the cutouts 15.

  On the other hand, the resin 21 is made of PEI (polyetherimide), for example, and has a substantially rectangular flat plate-shaped resin main body 22 as shown in FIGS. In other words, a large number of contact pin insertion holes 25 penetrating in the thickness direction (directions of arrows C and D) of the resin main body 22 are formed in a lattice shape so as not to interfere with the metal plate 12 at a portion located inside the metal plate 12. Is formed. As shown in FIG. 6, each of these contact pin insertion holes 25 has a rectangular cross section, and a contact pin (not shown) is inserted into each contact pin insertion hole 25. In the central portion of the resin main body 22, a large number of thin portions 26 having a small thickness in the surface direction of the resin main body 22 (a direction perpendicular to the thickness direction of the resin main body 22) between adjacent contact pin insertion holes 25. Is formed. Further, as shown in FIGS. 1 to 4, the metal plate 12 is embedded in the resin main body 22, and the end portion (peripheral portion) 17 of the metal plate 12 is not exposed and the resin body is entirely covered. The body 22 is covered. Further, eight elastic pieces 27 protrude downward from the peripheral edge of the resin body 22, and claw portions 28 are formed outward from the lower ends of the elastic pieces 27.

  Further, as shown in FIGS. 1 to 4, four elongated slits 23 are formed symmetrically along the four sides of the resin main body 22 on the front and back surfaces (total of eight). Since these slits 23 are formed, a part of the plate body 13 of the metal plate 12 is exposed to the outside.

  Thus, in the slide plate 11, the eight slits 23 are formed in the resin 21 so that the metal plate 12 is exposed. Therefore, when an internal stress is generated in the resin 21 due to the difference in expansion coefficient between the metal plate 12 and the resin 21 after insert molding, as shown in FIG. 1 and FIG. The internal stress of the resin 21 can be released by appropriately opening the slits 23 in the width direction (arrow E, F direction). As a result, when the slide plate 11 is subjected to chemical cleaning or the like at a predetermined temperature, unlike the conventional product in which the slits 23 are not formed in the resin 21, a large number of thin portions 26, i.e. strength Even if a weak portion is formed, the occurrence of a crack in the resin 21 can be suppressed.

  In addition, since the slits 23 are provided symmetrically on the front and back surfaces of the resin body 22 as described above, the internal stress of the resin 21 can be evenly released on both the front and back surfaces of the resin body 22. Therefore, compared with the case where the slit 23 is provided only on one of the front and back surfaces of the resin main body 22, the above-described crack generation suppressing effect can be further enhanced.

  When the IC socket in which the slide plate 11 is incorporated is used, a force acts on the slide plate 11 as the contact pins are elastically deformed. At this time, as described above, since the occurrence of a crack in the resin 21 is suppressed, it is possible to prevent the slide plate 11 from being damaged due to the crack in the resin 21.

  In the above-described embodiment, the case where eight elongated oval slits 23 are formed in the resin 21 has been described. However, as long as the metal plate 12 is provided so as to be exposed, the shape and the number of the slits 23 are not limited to this.

  Moreover, in the said embodiment, the case where four slits 23 were formed in the front and back both surfaces along 4 sides of the resin main body 22 was demonstrated. In this case, there is an advantage that the moldability of the resin 21 is improved by dividing the slit 23. However, when the moldability of the resin 21 does not matter, the slits 23 may be formed so as to be connected to one along the four sides of the resin main body 22.

  Moreover, in the said embodiment, the case where the thin part 26 was formed between the contact pin insertion holes 25 of the resin 21 adjacent to each other was described. However, the formation state of the thin portion 26 is not limited to this. For example, the present invention can be applied to a case where a fine structure such as a plurality of concave portions is formed in the resin 21 and the thin portion 26 is formed by this fine structure. Can be applied as well.

  Moreover, in the said embodiment, although the insert molding of this invention was applied to the substantially rectangular flat plate-shaped slide plate 11, slides of shapes other than a substantially rectangular flat plate shape (for example, circular flat plate shape, octagonal flat plate shape, etc.). Even if the present invention is applied to the plate 11, the same effects as those of the above-described substantially rectangular flat plate-like slide plate 11 can be obtained.

  Furthermore, in the said embodiment, although the insert molding of this invention was applied to the slide plate 11 of IC socket as an "electrical component socket", it is not restricted to this, The components (For example, other electrical component sockets, for example) It is also possible to apply to a socket main body, an operation member, and the like.

11 Slide plate (insert molding)
12 Metal plate
21 Resin
23 Slit
26 Thin section

Claims (4)

An insert molding of a socket for an electrical component in which a frame-shaped metal plate is covered with a substantially rectangular plate-shaped resin by insert molding,
In the resin, a plurality of contact pin insertion holes are formed in a portion located inside the metal plate, and elongated slits are formed along the four sides of the resin around the contact pin insertion holes. Thereby, the metal plate is exposed, and the insert molding of the socket for electrical parts is characterized by the above-mentioned. The insert molding of the socket for electrical parts according to claim 1, wherein a thin portion is formed between contact pin insertion holes adjacent to each other among the plurality of contact pin insertion holes . The insert molding of the socket for an electrical component according to claim 1 or 2, wherein the slit is provided on both front and back surfaces of the resin . Socket for electrical parts, wherein the insert molding of the socket for electrical parts are used according to any one of claims 1 to 3.

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