JP5784634B2 - 金属表面のスケール調整 - Google Patents
金属表面のスケール調整 Download PDFInfo
- Publication number
- JP5784634B2 JP5784634B2 JP2012548143A JP2012548143A JP5784634B2 JP 5784634 B2 JP5784634 B2 JP 5784634B2 JP 2012548143 A JP2012548143 A JP 2012548143A JP 2012548143 A JP2012548143 A JP 2012548143A JP 5784634 B2 JP5784634 B2 JP 5784634B2
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- temperature
- adjustment
- metal object
- metal
- solution
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 title claims description 100
- 239000002184 metal Substances 0.000 title claims description 100
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- 230000003750 conditioning effect Effects 0.000 claims description 58
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- 238000000034 method Methods 0.000 claims description 56
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- 238000012545 processing Methods 0.000 claims description 42
- 230000008569 process Effects 0.000 claims description 38
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 32
- 239000007864 aqueous solution Substances 0.000 claims description 29
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- 238000001816 cooling Methods 0.000 claims description 23
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- 239000000463 material Substances 0.000 claims description 18
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- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 21
- 239000011651 chromium Substances 0.000 description 20
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- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 6
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- 239000000376 reactant Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
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- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
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- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
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- -1 halide carbonates Chemical class 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
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- 239000011733 molybdenum Substances 0.000 description 2
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- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 2
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- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 150000007522 mineralic acids Chemical class 0.000 description 1
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- PXHVJJICTQNCMI-BJUDXGSMSA-N nickel-58 Chemical compound [58Ni] PXHVJJICTQNCMI-BJUDXGSMSA-N 0.000 description 1
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- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 1
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- 235000019795 sodium metasilicate Nutrition 0.000 description 1
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- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/19—Iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B45/00—Hand-held or like portable drilling machines, e.g. drill guns; Equipment therefor
- B23B45/06—Hand-held or like portable drilling machines, e.g. drill guns; Equipment therefor driven by man-power
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G3/00—Apparatus for cleaning or pickling metallic material
- C23G3/02—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G3/00—Apparatus for cleaning or pickling metallic material
- C23G3/02—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously
- C23G3/021—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously by dipping
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G3/00—Apparatus for cleaning or pickling metallic material
- C23G3/02—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously
- C23G3/023—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously by spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G3/00—Apparatus for cleaning or pickling metallic material
- C23G3/02—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously
- C23G3/027—Associated apparatus, e.g. for pretreating or after-treating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B45/00—Devices for surface or other treatment of work, specially combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills
- B21B45/04—Devices for surface or other treatment of work, specially combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills for de-scaling, e.g. by brushing
- B21B45/06—Devices for surface or other treatment of work, specially combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills for de-scaling, e.g. by brushing of strip material
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Chemical Treatment Of Metals (AREA)
Description
この出願の発明に関連する先行技術文献情報としては、以下のものがある(国際出願日以降国際段階で引用された文献及び他国に国内移行した際に引用された文献を含む)。
(先行技術文献)
(特許文献)
そのため、一部の実施形態では、前記冷却要素105が前記調整溶液のライデンフロスト温度未満に前記ストリップ表面112を冷却し、さらに前記ストリップ表面112でライデンフロスト温度を超える領域が確実になくなるよう、余分な冷却値(例えば、100゜F(38℃)〜200゜F(93℃))が追加される。さらに、一部の加熱要素113は、前記最終処理温度に余裕をもたせた追加加熱値(例えば、100゜F(38℃)〜200゜F(93℃))まで前記ストリップ表面112を加熱して、前記ストリップ表面112の全領域を確実に前記最終処理温度にする。そのような局所差に対応するため提供される付加的な冷却幅または加熱幅は、一部の非常に軽量の鋼ストリップの場合、小さく、または場合により省略されるが、これはそれらの局所差が小さく、または無視できる程度であるためで、一態様ではストリップが軽量であるほどヒートシンクおよび保温性も低いためである。
Claims (11)
- 金属物体の表面上の酸化物スケールを処理することにより前記金属物体の表面を調整するシステム(100)であって、前記酸化物スケールは処理前の前記金属物体表面からの深さである初期深さを有するものであり、このシステムは、
温度制御装置(105)であって、前記金属物体(106)の表面(112)の温度を適用温度に制御するものであり、当該適用温度は調整用水溶液中に含まれる実質的に無水のアルカリ性金属水酸化物混合物の融点未満の温度である、前記温度制御装置と、
適用装置(108)であって、前記制御された温度において前記金属物体の表面を前記調整用水溶液を有する薄層(111)で湿潤させるものであり、当該調整用水溶液の薄層は前記酸化物スケールに付着するものである、前記適用装置と、
加熱装置(113)であって、前記湿潤された金属物体を最終調整温度に加熱するものであり、当該最終調整温度は前記実質的に無水のアルカリ性金属水酸化物混合物の前記融点に所定の温度値を加えてなる前記融点を超える温度であり、前記加える所定の温度値は前記金属物体表面上の酸化物スケールの処理をもたらすようにゼロ〜200゜F(94℃)の範囲から選択されるものであり、この加熱装置は前記湿潤された金属物体表面を前記最終調整温度に加熱して前記調整用水溶液に含まれる水を蒸発させ且つ前記実質的に無水のアルカリ性金属水酸化物混合物を前記金属物体表面上で溶融させるものであり、当該溶融したアルカリ性金属水酸化物は前記付着した酸化物スケールと反応して前記金属物体表面から前記酸化物スケールを減少させるものである、前記加熱装置(113)と、
冷却装置(114)であって、調整時間の終了時に前記金属物体の表面を前記最終調整温度未満の温度に冷却するものであり、前記調整時間は前記金属物体表面上の酸化物スケールの処理を調整深さで終了させて当該調整深さを超える酸化物スケールの処理を阻止するように前記金属物体の材料パラメータおよび寸法パラメータに基づいて選択されるものであり、前記調整深さは前記初期深さより少ないものである、前記冷却装置と
を有し、
前記調整用水溶液は、有効量の、
水酸化ナトリウムおよび水酸化カリウムの共晶混合物と、
硝酸ナトリウムと、
水と、
を有し、それに少なくとも1つの非イオン性界面活性剤を添加したものである、
システム(100)。 - 請求項1記載のシステムにおいて、前記最終調整温度は、前記金属物体の表面のスケールを処理して当該金属物体表面に特定の度合いの調整をもたらすように選択されるものであるシステム。
- 前記請求項1または2に記載のシステムにおいて、前記調整用水溶液は前記共晶混合物として18重量%の水酸化カリウムと12重量%の水酸化ナトリウムとを有するものであるシステム。
- 前記請求項1から3いずれか1つに記載のシステムにおいて、前記最終調整温度は、前記実質的に無水のアルカリ性金属水酸化物混合物の前記塩溶融温度を超え、前記適用温度を150゜F(65℃)〜200゜F(94℃)の範囲で上回るものであるシステム。
- 前記請求項1に記載のシステムにおいて、前記調整用水溶液は、
水酸化ナトリウムおよび水酸化カリウムの30重量%の共晶混合物と、
3重量%の硝酸ナトリウムと、
67重量%の水と、
を有し、それに少なくとも1つの非イオン性界面活性剤を数滴添加したものである、システム。 - 前記請求項5に記載のシステムにおいて、前記数滴は6滴であるシステム。
- 金属物体の表面上の酸化物スケールを処理することにより前記金属物体の表面を調整する方法であって、前記酸化物スケールは処理前の前記金属物体表面からの深さである初期深さを有するものであり、この方法は、
金属物体の表面の温度を適用温度に制御する工程であって、当該適用温度は調整用水溶液中に含まれる実質的に無水のアルカリ性金属水酸化物混合物の融点未満の温度である、前記制御する工程と、
前記制御された温度において前記金属物体の表面を前記調整用水溶液を有する薄層で湿潤させる工程であって、当該調製用水溶液の薄層は前記酸化物スケールに付着するものである、前記湿潤させる工程と、
前記湿潤された金属物体を酸素含有雰囲気下で最終調整温度に加熱する工程であって、当該最終調整温度は前記実質的に無水のアルカリ性金属水酸化物混合物の前記融点に所定の温度値を加えてなる前記融点を超える温度であり、前記加える所定の温度値は前記金属物体表面上の酸化物スケールの処理をもたらすようにゼロ〜200゜F(94℃)の範囲から選択されるものであり、この加熱により、前記調整用水溶液に含まれる水を蒸発させ且つ前記実質的に無水のアルカリ性金属水酸化物混合物を前記金属物体の表面上において前記最終調整温度で溶融させるものであり、且つ、当該溶融したアルカリ性金属水酸化物混合物が前記付着した酸化物スケールと反応して前記金属物体の表面から前記酸化物スケールを減少させるものである、前記加熱する工程と、
調整時間の終了時に前記金属物体の表面を前記最終調整温度未満の温度に冷却することにより前記金属物体表面上の酸化物スケールの処理を調整深さで終了させる工程であって、前記調整時間は前記最終調整温度で前記金属物体の表面のスケールに特定の度合いの調整をもたらし且つ前記調整深さを超える酸化物スケールの処理を阻止するように前記金属物体の材料パラメータおよび寸法パラメータに基づいて選択されるものであり、前記調整深さは前記初期深さより少ないものである、前記終了させる工程と
を有する方法。 - 請求項7記載の方法において、前記調整用水溶液は、有効量の、
水酸化ナトリウムおよび水酸化カリウムの共晶混合物と、
硝酸ナトリウムと、
水と、
を有し、それに少なくとも1つの非イオン性界面活性剤を添加したものである、方法。 - 請求項8記載の方法において、前記調整用水溶液は、
水酸化ナトリウムおよび水酸化カリウムの30重量%の共晶混合物と、
3重量%の硝酸ナトリウムと、
67重量%の水と、
を有し、それに少なくとも1つの非イオン性界面活性剤を数滴添加したものである、方法。 - 前記請求項9に記載の方法において、前記数滴は6滴である方法。
- 請求項7記載の方法において、さらに、
前記適用温度を150゜F(65℃)〜200゜F(94℃)の範囲で上回る前記最終調整温度を選択する工程を有するものである方法。
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US29382110P | 2010-01-11 | 2010-01-11 | |
US61/293,821 | 2010-01-11 | ||
PCT/US2011/020479 WO2011085172A2 (en) | 2010-01-11 | 2011-01-07 | Metal surface scale conditioning |
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CN103305745B (zh) * | 2012-03-09 | 2016-04-27 | 宝山钢铁股份有限公司 | 一种高质量硅钢常化基板的生产方法 |
EP2893670A4 (en) * | 2012-09-10 | 2016-04-06 | Hewlett Packard Development Co | USE OF PRIMARY AND SECONDARY CONNECTION TABLES |
EP2937747A1 (de) * | 2014-04-24 | 2015-10-28 | Siemens Aktiengesellschaft | Auf Modellierung einer Beizlinie beruhende Optimierung einer Sequenz von zu beizenden Bändern |
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EP3325690B1 (en) * | 2015-07-22 | 2020-09-02 | Kolene Corporation | Scale conditioning process for advanced high strength carbon steel alloys |
CN105586603B (zh) * | 2015-11-23 | 2018-10-09 | 佛山市高明俊品金属制品有限公司 | 一种不锈钢氧化皮去除方法 |
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KR102521021B1 (ko) * | 2018-03-08 | 2023-04-12 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 태양 전지 패널용 플럭스 도포 부재 및 방법, 그리고 태양 전지 패널의 인터커넥터 부착 장치 |
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BR112012016999A2 (pt) | 2016-04-19 |
TW201139743A (en) | 2011-11-16 |
CA2786513A1 (en) | 2011-07-14 |
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MX2012008097A (es) | 2012-07-30 |
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US10006129B2 (en) | 2018-06-26 |
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