JP5777220B2 - Printed wiring board manufacturing method and printed wiring board using the same - Google Patents
Printed wiring board manufacturing method and printed wiring board using the same Download PDFInfo
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- JP5777220B2 JP5777220B2 JP2012112864A JP2012112864A JP5777220B2 JP 5777220 B2 JP5777220 B2 JP 5777220B2 JP 2012112864 A JP2012112864 A JP 2012112864A JP 2012112864 A JP2012112864 A JP 2012112864A JP 5777220 B2 JP5777220 B2 JP 5777220B2
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Description
本発明は、プリント配線板の製造方法及びそれを用いたプリント配線板に関する。 The present invention relates to a method for manufacturing a printed wiring board and a printed wiring board using the same.
モジュール基板のような部品実装基板は、搭載される部品やその実装方法によって電極への最終表面処理が適宜選択される。また、それ自体もマザーボードへの実装や単体で製品になる場合があり、それぞれの接続先や使用方法によって電極への最適な最終表面処理が選択される。 For a component mounting substrate such as a module substrate, the final surface treatment on the electrodes is appropriately selected depending on the component to be mounted and the mounting method. Moreover, the product itself may be mounted on the motherboard or may be a single product, and the most suitable final surface treatment for the electrode is selected depending on the connection destination and usage method.
例えば、部品が実装される場合、はんだ実装やワイヤーボンディング実装などが挙げられ、はんだ実装の場合はフラッシュ金めっきのような無電解銅めっき法を用いた薄い金めっきやプリフラックスと呼ばれる有機膜を形成することが多い。
ワイヤーボンディング実装やフリップチップ実装などは、接続信頼性を確保するために電解金めっき法や、無電解めっき法でも厚い金めっきを形成する方法が選択される。
For example, when components are mounted, solder mounting and wire bonding mounting are listed. In the case of solder mounting, thin gold plating using an electroless copper plating method such as flash gold plating or an organic film called preflux is used. Often formed.
For wire bonding mounting and flip-chip mounting, a method of forming a thick gold plating by an electrolytic gold plating method or an electroless plating method is selected in order to ensure connection reliability.
近年では、ＬＥＤモジュール基板などは、発生したＬＥＤチップからの光を有効に活用するために実装面を銀めっきで処理する場合もある。
単体で使用される場合、例えばＳＤカード向けでは、メモリーチップの実装部は通常の金めっきだが、外部電極には耐摩耗性、摺動性に優れる硬質金めっきが使われる。ＬＥＤモジュール基板では、ＬＥＤチップ搭載部は銀めっきだが、マザーボード側ははんだ実装用の金めっきの場合もある。
In recent years, an LED module substrate or the like sometimes has a mounting surface treated with silver plating in order to effectively utilize the generated light from the LED chip.
When used alone, for example, for SD cards, the memory chip mounting portion is normal gold plating, but the external electrodes are hard gold plating with excellent wear resistance and slidability. In the LED module substrate, the LED chip mounting portion is silver-plated, but the motherboard side may be gold-plated for solder mounting.
このように、実装方法や使用方法によって外部電極が配置された一方の面と他方の面では、双方に施される最終表面処理の方法が異なる場合がある。
以上のように、基板の外部電極が配置された一方の面と他方の面でその双方に施される最終表面処理が異なる場合の工法は、例えば特許文献１や特許文献２に開示されるように、めっき不要部分にマスキングを施す手法が適用される。
As described above, depending on the mounting method and the usage method, the method of final surface treatment applied to both of the one surface where the external electrode is disposed and the other surface may differ.
As described above, for example,
この手法を使えば、マスキングされてない電極部分への最終表面処理の種類と、マスキングを除去して露呈した電極部分への最終表面処理の種類を異なるものにすることが可能となる。この際、初めに最終表面処理をした部分を改めてマスキングを施し、ついで２回目の最終表面処理を行うことも可能である。
つまり、外部電極配置された一方の面の全体にマスキングを施して他方の面に最終表面処理を行い、一方の面のマスキングを除去した後に他方の面にマスキングを施し、ついで異なる種類の最終表面処理をマスキングされていない面に行うことで一方の面と他方の面のそれぞれに異なる種類の最終表面処理を施すことが可能となる。
If this method is used, it is possible to make the type of the final surface treatment to the electrode portion that is not masked different from the type of the final surface treatment to the electrode portion that is exposed by removing the masking. At this time, it is also possible to mask the portion that has been subjected to the final surface treatment first, and then perform the second final surface treatment.
In other words, masking is performed on the entire surface of the external electrode and the other surface is subjected to final surface treatment. After removing the masking on one surface, the other surface is masked, and then a different type of final surface is applied. By performing the treatment on the unmasked surface, it is possible to perform different types of final surface treatment on each of the one surface and the other surface.
特許文献に示される従来のめっき不要部分にマスキングを施す方法において、基板内に一方の面と他方の面に通じるキリ穴があると、湿式法による最終表面処理をした場合、そのキリ穴を通じてマスキングをした面に表面処理液が浸透し、キリ穴周辺もしくは製品部分の外部電極に不要な最終表面処理が成されてしまう場合があり、このような状態では、本来の目的とは異なる種類の最終表面処理が外部電極に成されるため、製品として機能しなくなり、不良製品を作製してしまうこととなる。 In the conventional method of masking an unnecessary plating area shown in the patent document, if there is a drill hole in one side and the other side in the substrate, the final surface treatment by the wet method will mask through the drill hole. The surface treatment liquid may permeate into the treated surface, and an unnecessary final surface treatment may be performed around the drill hole or on the external electrode of the product part. Since the surface treatment is performed on the external electrodes, the product does not function as a product and a defective product is produced.
このような状況の中、本発明では、上記問題を解決すべく、キリ穴周辺の外部電極の形状を最適に定めることによりマスキングした面への最終表面処理液の浸透を抑制し、外部電極への最終表面処理を所望の状態にせしめる回路基板の製造方法を提供するものである。 Under such circumstances, in the present invention, in order to solve the above-described problem, the penetration of the final surface treatment liquid into the masked surface is suppressed by optimally determining the shape of the external electrode around the drill hole, to the external electrode. A method of manufacturing a circuit board that allows the final surface treatment to be in a desired state is provided.
本発明の第１の発明は、キリ穴を有するプリント配線板の一方の平面に備えられる外層回路に、その外層回路における最後の表面処理である最終表面処理を施した後、この外層回路と相対した他方の平面に備えられる外層回路に、その外層回路における最後の表面処理である最終表面処理を施すプリント配線板の製造方法において、最終表面処理の成分が最終表面処理される外層回路と相対した平面に設けられる外層回路の回路面に、キリ穴を通じて漏れ出すのを防ぐための表面処理成分の漏れ防止用外層回路を、キリ穴の両平面における開口部若しくは一方の平面における開口部を全包囲する形状で具備した後、最終表面処理を施すことを特徴とするプリント配線板の製造方法である。 According to a first aspect of the present invention, after an outer layer circuit provided on one plane of a printed wiring board having a drill hole is subjected to a final surface treatment which is a final surface treatment in the outer layer circuit, In the method of manufacturing a printed wiring board in which the outer surface circuit provided on the other plane is subjected to the final surface treatment which is the final surface treatment in the outer layer circuit, the component of the final surface treatment is opposed to the outer layer circuit to be subjected to the final surface treatment. The outer layer circuit for preventing leakage of the surface treatment component to prevent leakage through the drill hole on the circuit surface of the outer layer circuit provided on the plane completely surrounds the opening in both planes of the drill hole or the opening in one plane In the printed wiring board manufacturing method, the final surface treatment is performed after the substrate has the shape to be formed.
本発明の第２の発明は、キリ穴を有するプリント配線板の一方の平面に備えられる外層回路に、その外層回路における最後の表面処理である最終表面処理を施した後、この外層回路と相対した他方の平面に備えられる外層回路に、先の最終表面処理とは異なる最終表面処理を施すプリント配線板の製造方法において、最終表面処理の成分が最終表面処理される外層回路と相対した平面に設けられる外層回路の回路面に、キリ穴を通じて漏れ出すのを防ぐための表面処理成分の漏れ防止用外層回路を、キリ穴の両平面における開口部若しくは一方の平面における開口部を全包囲する形状で具備した後、最終表面処理を施すことを特徴とするプリント配線板の製造方法である。 According to a second aspect of the present invention, after an outer layer circuit provided on one plane of a printed wiring board having a drill hole is subjected to a final surface treatment which is the last surface treatment in the outer layer circuit, In the method for manufacturing a printed wiring board, in which the outer surface circuit provided on the other plane is subjected to a final surface treatment different from the previous final surface treatment, the final surface treatment component is placed on a plane opposite to the outer layer circuit to be subjected to the final surface treatment. The outer layer circuit for preventing leakage of the surface treatment component to prevent leakage through the drill hole on the circuit surface of the outer layer circuit to be provided is a shape that completely surrounds the opening in both planes of the drill hole or the opening in one plane And after that, a final surface treatment is performed.
本発明の第３の発明は、キリ穴を有するプリント配線板の一方の平面に備えられる外層回路に、その外層回路における最後の表面処理である最終表面処理を施した後、この外層回路と相対して他方の平面に備えられる外層回路に、先の最終表面処理とは異なる最終表面処理を施すプリント配線板の製造方法において、他方の平面に備えられる外層回路への最終表面処理の成分がキリ穴を通じて、一方の平面に備えられる外層回路の回路面に漏れ出すのを防ぐための表面処理成分の漏れ防止用外層回路を、キリ穴の一方の平面における開口部を全包囲する形状で具備した後、他方の平面に備えられる外層回路への最終表面処理を施すことを特徴とするプリント配線板の製造方法である。 According to a third aspect of the present invention, an outer layer circuit provided on one plane of a printed wiring board having a drill hole is subjected to a final surface treatment, which is the last surface treatment in the outer layer circuit, and then relative to the outer layer circuit. In the printed wiring board manufacturing method in which the outer layer circuit provided on the other plane is subjected to a final surface treatment different from the previous final surface treatment, the component of the final surface treatment on the outer layer circuit provided on the other plane is determined. The outer layer circuit for preventing leakage of the surface treatment component for preventing leakage through the hole to the circuit surface of the outer layer circuit provided on one plane has a shape that completely surrounds the opening in one plane of the drill hole. Thereafter, a final surface treatment is performed on the outer layer circuit provided on the other plane.
本発明の第４の発明は、第１から第３の発明における最終表面処理が、めっき処理であることを特徴とするプリント配線板の製造方法である。 According to a fourth aspect of the present invention, there is provided a printed wiring board manufacturing method, wherein the final surface treatment in the first to third aspects is a plating treatment.
本発明の第５の発明は、第１から第４の発明におけるキリ穴周囲に具備する漏れ防止用外層回路が、キリ穴の平面における開口部を全包囲する形状で、キリ穴の径方向の断面形状において凹凸構造を有する回路であって、その凹凸構造の凸部が、幅０．０３〜１．０ｍｍの回路配線により構成され、その凹凸構造の凹部が、凸部と凸部間の空隙により構成されていることを特徴とするプリント配線板の製造方法である。 According to a fifth aspect of the present invention, in the first to fourth aspects of the invention, the outer layer circuit for preventing leakage provided around the drill hole has a shape that completely surrounds the opening in the plane of the drill hole. A circuit having a concavo-convex structure in cross-sectional shape, wherein the convex part of the concavo-convex structure is constituted by circuit wiring having a width of 0.03 to 1.0 mm, and the concave part of the concavo-convex structure is a gap between the convex part and the convex part. It is comprised by these, The manufacturing method of the printed wiring board characterized by the above-mentioned.
本発明の第６の発明は、第５の発明における凹凸構造の凹部である空隙が、凸部を構成する回路配線の幅を超えない大きさであることを特徴とするプリント配線板の製造方法である。 According to a sixth aspect of the present invention, there is provided a printed wiring board manufacturing method, characterized in that the gap that is the concave portion of the concave-convex structure according to the fifth aspect is a size that does not exceed the width of the circuit wiring constituting the convex portion. It is.
本発明の第７の発明は、第１から第６の発明におけるめっき成分漏れ防止用外層回路が、キリ穴の開口部を囲む多重額縁形状、多重リング状、メッシュ形状の中から少なくとも１種類が選ばれる閉じた幾何形状であることを特徴とするプリント配線板の製造方法である。 According to a seventh aspect of the present invention, the outer layer circuit for preventing leakage of plating components according to the first to sixth aspects includes at least one of a multiple frame shape, a multiple ring shape, and a mesh shape surrounding the opening of the drill hole. A printed wiring board manufacturing method characterized by a closed geometric shape selected.
本発明の第８の発明は、キリ穴を有する両面に最終めっき処理が施されるプリント配線板であって、プリント配線板の少なくとも一面に、そのキリ穴の開口部周囲にキリ穴の開口部を全包囲する形状で、最終めっき処理のめっき成分の漏れを防止する漏れ防止用外層回路を備えることを特徴とするプリント配線板である。 According to an eighth aspect of the present invention, there is provided a printed wiring board in which a final plating process is performed on both sides having a drill hole, wherein at least one surface of the printed wiring board has an opening portion of the drill hole around the opening portion of the drill hole. The printed wiring board is characterized by comprising a leakage preventing outer layer circuit that prevents the leakage of the plating component of the final plating process.
本発明のプリント配線板の製造方法によれば、キリ穴周辺の外部電極を含む回路配線（外層回路）の形状を所望の定義に従って形成することにより、マスキングされた面に対して他方の面で行う最終表面処理の成分がキリ穴を通じて浸透することを回避できる。
よって、マスキングされた面に不要な最終表面処理がなされることがなく、品質の高いプリント配線板を提供することができる。
According to the method for manufacturing a printed wiring board of the present invention, the shape of the circuit wiring (outer layer circuit) including the external electrode around the drill hole is formed in accordance with a desired definition, so that the other surface is masked. It is possible to prevent the component of the final surface treatment to be performed from penetrating through the drill hole.
Therefore, an unnecessary final surface treatment is not performed on the masked surface, and a high-quality printed wiring board can be provided.
本発明は、プリント配線板の最外層における外部電極を含む回路配線を形成し、一方の面の全体をフィルム状のマスキング材で被覆し、他方の面の外部電極を含む回路配線に対して所望の種類の最終表面処理を行い、ついで、そのマスキング材を除去し、最終表面処理済みの面の全体をフィルム状のマスキング材で被覆し、その他方となる面に対して異なる種類の最終表面処理を行う。その後、フィルム状のマスキング材を除去する。
これら一連の作業により、プリント配線板の一方の面と他方の面とで、それぞれの面の外部電極を含む回路配線に対して異なる種類の最終表面処理を行い、両面共に健全な処理表面を得ようとするものである。なお、外部電極を含む回路配線は、本発明における外層回路を示すものである。
The present invention forms a circuit wiring including an external electrode in the outermost layer of a printed wiring board, covers the entire one surface with a film-like masking material, and is desired for the circuit wiring including the external electrode on the other surface. This type of final surface treatment is performed, then the masking material is removed, the final surface-treated surface is entirely covered with a film-like masking material, and a different type of final surface treatment is applied to the other surface. I do. Thereafter, the film-like masking material is removed.
Through these series of operations, different types of final surface treatments are performed on the circuit wiring including the external electrodes on each side on one side and the other side of the printed wiring board, and a sound treated surface is obtained on both sides. It is about to try. The circuit wiring including the external electrode indicates the outer layer circuit in the present invention.
そのため、このプリント配線板に部品実装時の位置合わせを目的としたキリ穴が設けられている場合、図１に示すように、そのキリ穴周辺の外部電極を含む回路配線とマスキング材の密着が十分な状態ではなく（図１（ａ）の状態）、最終表面処理の成分がマスキング材で被覆された面に浸透（図１（ｂ）の状態）して図１（ｃ）に見られるようなマスキングされた面の外部電極を含む回路配線に所望とは異なる種類の最終表面処理が施される部分が生じ、製品の機能が損なわれることになり不良製品となることがある。
図１は最終表面処理成分の漏れ状態を説明する模式図で、（ａ）はマスキング材貼り付け状態を示し、（ｂ）は最終表面処理を施した状態、（ｃ）はマスキング材を外した状態を示す図である。２はキリ穴、４はマスキング材、１０は絶縁基材、１１は外層回路Ａ、１２は外層回路Ｂ、１３は最終表面処理層である。
Therefore, when this printed wiring board is provided with a drill hole for the purpose of positioning at the time of component mounting, as shown in FIG. 1, the circuit wiring including the external electrode around the drill hole and the masking material are not in close contact with each other. As shown in FIG. 1 (c), the components of the final surface treatment penetrated into the surface covered with the masking material (state of FIG. 1 (b)) instead of being in a sufficient state (the state of FIG. 1 (a)). A portion of the circuit wiring including the external electrodes on the masked surface is subjected to a final surface treatment of a different type from that desired, which may impair the function of the product and result in a defective product.
FIG. 1 is a schematic diagram for explaining a leakage state of a final surface treatment component, where (a) shows a masking material application state, (b) shows a state where final surface treatment has been applied, and (c) shows a masking material removed. It is a figure which shows a state. 2 is a drill hole, 4 is a masking material, 10 is an insulating substrate, 11 is an outer layer circuit A, 12 is an outer layer circuit B, and 13 is a final surface treatment layer.
そこで、その不具合を回避するためには、マスキングされる面のキリ穴周辺の外部電極を含む回路配線とマスキング材との密着性を十分に確保することが必要であり、本発明では、キリ穴の開口部周囲にその開口部を全包囲する形で、漏れ防止用外層回路として、キリ穴の径方向の断面が凹凸構造を有する回路を設け、その形状、回路幅、及び回路間幅などを規定することによって、設けた漏れ防止用外層回路とマスキング材との密着性を十分に確保して配線基板の回路配線に所望の健全な最終表面処理を施すことを可能とし、不良製品の発生を大幅に減ずるものである。 Therefore, in order to avoid the problem, it is necessary to ensure sufficient adhesion between the circuit wiring including the external electrode around the hole on the masked surface and the masking material. As a leakage prevention outer layer circuit, a circuit having a concavo-convex structure in the radial direction of the drill hole is provided as a leakage prevention outer layer circuit, and its shape, circuit width, inter-circuit width, etc. By prescribing, it is possible to ensure the sufficient adhesion between the leakage prevention outer layer circuit and the masking material, and to apply the desired sound final surface treatment to the circuit wiring on the wiring board, and to generate defective products. It is greatly reduced.
図２は本発明の漏れ防止用外層回路の特徴を示す図で、漏れ防止用外層回路の断面図である。
図２において、２はキリ穴、３は漏れ防止用外層回路、３１は漏れ防止用外層回路の回路配線、３２は回路配線間の空隙部、Ｌ１は回路配線幅、Ｌ２は空隙部３２の幅、４はマスキング材である。
FIG. 2 is a view showing the characteristics of the outer layer circuit for preventing leakage according to the present invention, and is a cross-sectional view of the outer layer circuit for preventing leakage.
In FIG. 2, 2 is a drill hole, 3 is an outer layer circuit for preventing leakage, 31 is a circuit wiring of the outer layer circuit for preventing leakage, 32 is a gap between circuit wirings, L 1 is a circuit wiring width, and L 2 is a
図２に示すように、本発明における漏れ防止用外層回路３は、キリ穴２の周囲にキリ穴２を囲むように、キリ穴の径方向に凹凸構造を備えるもので、マスキング材４との楔効果により、その密着性を上げるものである。
ここで、外層回路の回路配線３１の回路配線幅Ｌ１は、０．０３〜１．０ｍｍが望ましく、回路配線間の空隙部３２の幅Ｌ２との関係は、空隙部３２の幅Ｌ２が回路配線幅Ｌ１を超えない大きさであることが望ましい。
回路配線幅Ｌ１が０．０３ｍｍより狭い場合、若しくは１．０ｍｍより広い場合の両者共に、マスキング材４との密着性の向上が見られない。また、空隙部３２の幅Ｌ２は、回路配線幅Ｌ１より広い値を採る場合では、マスキング材４との楔効果が十分に得られずに、漏れを完全には防止できないためである。
As shown in FIG. 2, the
Here, the circuit line width L 1 of the
If the circuit line width L 1 smaller than 0.03 mm, or broad Both cases than 1.0 mm, not seen improvement in adhesion between the masking
図３は、その代表的な平面形態を示すもので、（ａ）はリング形状（二重リング）、（ｂ）はリング形状（三重リング）、（ｃ）は額縁メッシュ形状である。
図３において、２はキリ穴、３は漏れ防止用外層回路、３１は漏れ防止用外層回路の回路配線、３２は回路配線間の空隙部、Ｓは漏れ防止用外層回路の内側部である。
FIG. 3 shows a typical planar form, where (a) is a ring shape (double ring), (b) is a ring shape (triple ring), and (c) is a frame mesh shape.
In FIG. 3, 2 is a drill hole, 3 is an outer layer circuit for preventing leakage, 31 is a circuit wiring of the outer layer circuit for preventing leakage, 32 is a gap between the circuit wires, and S is an inner portion of the outer layer circuit for preventing leakage.
以下に、本発明の漏れ防止用外層回路の形成法を説明する。なお、最終表面処理としてめっき処理の場合を例示して説明するが、他の表面処理の場合においても下記手順に則って行われる。 The method for forming the leakage preventing outer layer circuit of the present invention will be described below. In addition, although the case of a plating process is illustrated and demonstrated as a final surface treatment, in the case of another surface treatment, it is performed according to the following procedure.
［回路配線の加工］
先ず、両面に所望厚みの銅箔を貼り付け、キリ穴加工した銅張積層板の銅箔部分を、エッチング法を用いて、所望、例えば図３（ａ）〜（ｃ）に示す漏れ防止用外層回路形態に、その回路配線を加工する。
この加工の詳細を以下の（１）から（５）に示す。（１）から（５）の工程を経ることによって、漏れ防止用外層回路の回路配線を形成する。
[Processing of circuit wiring]
First, a copper foil portion of a copper clad laminate having a desired thickness attached to both sides and drilled with holes is used to prevent leakage as shown in FIGS. 3 (a) to 3 (c), for example. The circuit wiring is processed into an outer layer circuit form.
Details of this processing are shown in the following (1) to (5). By performing the steps (1) to (5), the circuit wiring of the outer layer circuit for preventing leakage is formed.
（１）銅張積層板の銅箔上に感光性ドライフィルムを貼り付ける工程。
（２）所望の漏れ防止用外層回路を含む回路配線を描画した露光マスクを用いて（１）の感光性ドライフィルム上に、回路配線の形状を焼きつける露光工程。
（３）露光されたドライフィルムの被露光部分を溶解除去する現像工程。
（４）感光性ドライフィルムが除去されて露呈した銅箔部分を溶解除去するエッチング工程。
（５）銅箔状に残存する感光性ドライフィルムを除去する剥離工程。
(1) A step of attaching a photosensitive dry film on the copper foil of the copper clad laminate.
(2) An exposure process in which the shape of the circuit wiring is printed on the photosensitive dry film of (1) using an exposure mask on which circuit wiring including the desired outer layer circuit for preventing leakage is drawn.
(3) A development step of dissolving and removing the exposed portion of the exposed dry film.
(4) An etching step of dissolving and removing the exposed copper foil portion after the photosensitive dry film is removed.
(5) A peeling step of removing the photosensitive dry film remaining in the copper foil shape.
［最終表面処理］
１．一方の平面に備えられる外層回路に対する最終表面処理（先の最終表面処理）
次に、一方の平面に配置される外部電極を含む回路配線にのみ電解銀めっき法による最終表面処理を施す。この処理工程の詳細は、以下の（６）から（８）に示す通りに行う。ここで、一方の平面に設けられる外部電極を含む回路配線を外層回路Ａとし、他方の平面に設けられる外部電極を含む回路配線を外層回路Ｂとして、以下の説明に供する。
[Final surface treatment]
1. Final surface treatment for the outer layer circuit on one plane (previous final surface treatment)
Next, only the circuit wiring including the external electrode arranged on one plane is subjected to a final surface treatment by electrolytic silver plating. The details of this processing step are performed as shown in the following (6) to (8). Here, a circuit wiring including an external electrode provided on one plane is referred to as an outer layer circuit A, and a circuit wiring including an external electrode provided on the other plane is referred to as an outer layer circuit B.
（６）電解銀めっきを施す一方の平面（外層回路Ａ側）とは他方の平面（外層回路Ｂ側）の全体にマスキングフィルムを貼る工程。
（７）電解銀めっきを施す面（外層回路Ａ側）の外層回路Ａの回路配線に電解銀めっきを施す工程。
（８）他方の平面（外層回路Ｂ側）に貼られたマスキングフィルムを剥がす工程。
(6) A step of applying a masking film to the whole of one plane (outer layer circuit A side) and the other plane (outer layer circuit B side) on which electrolytic silver plating is performed.
(7) A step of performing electrolytic silver plating on the circuit wiring of the outer layer circuit A on the surface (outer layer circuit A side) to be subjected to electrolytic silver plating.
(8) The process of peeling the masking film affixed on the other plane (outer layer circuit B side).
２．他方の平面に備えられる外層回路に対する最終表面処理：外層回路Ｂ
次に、他方の平面に配置される外層回路Ｂの回路配線にのみ電解硬質金めっき法による最終表面処理を施す。この処理工程の詳細は、以下の（９）から（１１）に示す通りに行う。
2. Final surface treatment for the outer layer circuit provided in the other plane: outer layer circuit B
Next, only the circuit wiring of the outer layer circuit B arranged on the other plane is subjected to a final surface treatment by electrolytic hard gold plating. The details of this processing step are performed as shown in the following (9) to (11).
（９）電解硬質金めっきを施す平面（外層回路Ｂ側）に対して、他方の平面（外層回路Ａ側）の全体にマスキングフィルムを貼る工程。
（１０）電解硬質金めっきを施す平面の外層回路Ｂの回路配線に電解硬質金めっきを施す工程。
（１１）マスキングフィルムを剥がす工程。
(9) A step of applying a masking film to the whole of the other plane (outer layer circuit A side) with respect to the plane on which electrolytic hard gold plating is applied (outer layer circuit B side).
(10) A step of applying electrolytic hard gold plating to the circuit wiring of the planar outer layer circuit B on which electrolytic hard gold plating is applied.
(11) A step of removing the masking film.
以上の工程により、プリント配線板の両面に備わる外層回路の回路配線に、それぞれに所望の最終表面処理を施すことができる。
上記では、それぞれの面に、その都度マスキングフィルムを貼る場合を示したが、本発明の適用は、上記限りではなく、以下（i）から（iv）に示すような電解めっき層を積層した回路配線を形成するような最終表面処理に対する加工工程においても有用である。
Through the above steps, a desired final surface treatment can be applied to the circuit wiring of the outer layer circuit provided on both surfaces of the printed wiring board.
In the above, the case where a masking film is stuck on each surface is shown. However, the application of the present invention is not limited to the above, and a circuit in which electrolytic plating layers as shown in (i) to (iv) below are laminated. It is also useful in processing steps for final surface treatment such as forming wiring.
３．電解めっき層を積層する最終表面処理
（i）当該プリント配線板の両面に電解銀めっきを施す工程。
（ii）電解銀めっきを最終表面処理とする一方の平面にマスキングフィルムを貼る工程。
（iii）他方の平面の外部電極を含む回路配線に電解硬質金めっきを施す工程。
（iv）マスキングフィルムを剥がす工程。
3. Final surface treatment of laminating an electrolytic plating layer (i) A step of performing electrolytic silver plating on both surfaces of the printed wiring board.
(Ii) A step of pasting a masking film on one plane with electrolytic silver plating as the final surface treatment.
(Iii) A step of applying electrolytic hard gold plating to the circuit wiring including the external electrode on the other plane.
(Iv) A step of removing the masking film.
以下、実施例を用いて本発明をより詳細に説明する。
先ず、両面に所望厚みの銅箔を貼り付け、キリ穴加工した銅張積層板のキリ穴周辺の銅箔部分を、上記「回路配線の加工」に記載の（１）から（５）の工程を経て、図３（ａ）〜（ｃ）に示す漏れ防止用外層回路、並びに比較例及び従来例として図４（ａ）、（ｂ）に示す一重リング形状、及び額縁デザインの外層回路の回路配線に加工した。なお、キリ穴の径は１．５５ｍｍとした。
表１に、それぞれの漏れ防止用外層回路の詳細を示す。
Hereinafter, the present invention will be described in more detail with reference to examples.
First, a copper foil portion around a drilled hole of a copper-clad laminate obtained by pasting a copper foil of a desired thickness on both sides and drilled into a hole is processed in the steps (1) to (5) described in “Processing of circuit wiring”. 3A to 3C, and the outer layer circuit for leakage prevention as shown in FIGS. 4A and 4B as a comparative example and a conventional example. Processed into wiring. The diameter of the drill hole was 1.55 mm.
Table 1 shows details of each outer layer circuit for preventing leakage.
次に、漏れ防止用外層回路を形成した銅張積層板の両面に、上記「最終表面処理」に記載の（６）から（８）、次いで（９）から（１１）の工程を施して、銅張積層板の両面にめっき処理を施したプリント配線板の供試材を作製して、キリ穴周辺のめっき漏れの有無を目視観察した。
漏れ防止用外層回路の外側に明らかにめっき漏れによるめっきムラが見られる場合を「×」、漏れ防止用外層回路の内側（図３（ａ）符号Ｓに示すキリ穴２と漏れ防止用外層回路３の最初の回路配線３１の間の範囲）にのみめっきムラが見られる場合を「△」、めっきムラが見られない場合を「○」と評価して、その結果を表１に併せて示した。
Next, on both surfaces of the copper clad laminate on which the outer layer circuit for preventing leakage is formed, the steps (6) to (8) and then (9) to (11) described in “Final surface treatment” are performed, A test material for a printed wiring board in which both sides of the copper clad laminate were plated was prepared, and the presence or absence of plating leakage around the drill hole was visually observed.
The case where the plating unevenness due to the plating leakage is clearly seen on the outside of the outer layer circuit for leakage prevention is indicated by “X”, inside the outer layer circuit for leakage prevention (FIG. No. 3 (range between the first circuit wirings 31) is evaluated as “Δ” when the plating unevenness is observed, and “○” when the plating unevenness is not observed, and the result is also shown in Table 1. It was.
１ プリント配線板
２ キリ穴
３ 漏れ防止用外層回路
４ マスキング材
１０ 絶縁基材
１１ 一方の平面に備えられる外層回路（外層回路Ａ）
１２ 他方の平面に備えられる外層回路（外層回路Ｂ）
１３ 最終表面処理層
３１ 漏れ防止用外層回路の回路配線
３２ 回路配線間の空隙部
Ｌ１ 回路配線幅（回路幅）
Ｌ２ 空隙部３２の幅（回路間幅）
Ｓ 漏れ防止用外層回路の内側部
DESCRIPTION OF
12 Outer layer circuit (outer layer circuit B) provided on the other plane
13 Final
L 2 gap 32 width (inter-circuit width)
S Inside part of the outer layer circuit for leakage prevention
Claims (7)
前記最終表面処理の成分が最終表面処理される外層回路と相対した平面に設けられる外層回路の回路面に前記キリ穴を通じて漏れ出すのを防ぐための表面処理成分の漏れ防止用外層回路を、前記キリ穴の両平面における開口部若しくは一方の平面における開口部を全包囲した多重額縁形状、多重リング状、メッシュ形状の中から少なくとも１種類が選ばれる閉じた幾何形状で具備した後、前記最終表面処理を施すことを特徴とするプリント配線板の製造方法。 An outer layer circuit provided on one plane of a printed wiring board having a drill hole is subjected to a final surface treatment, which is the last surface treatment in the outer layer circuit, and then provided on the other plane facing the outer layer circuit. In the method of manufacturing a printed wiring board for performing a final surface treatment that is a final surface treatment in the outer layer circuit,
An outer layer circuit for preventing leakage of the surface treatment component for preventing the component of the final surface treatment from leaking through the drill hole to the circuit surface of the outer layer circuit provided on a plane opposite to the outer layer circuit to be subjected to the final surface treatment, After having a closed geometric shape selected from at least one of a multi-frame shape, a multi-ring shape, and a mesh shape that completely surrounds the openings in both planes of the drill hole or in one plane, the final surface A method for producing a printed wiring board, comprising performing a treatment.
前記最終表面処理の成分が最終表面処理される外層回路と相対した平面に設けられる外層回路の回路面に前記キリ穴を通じて漏れ出すのを防ぐための表面処理成分の漏れ防止用外層回路を、前記キリ穴の両平面における開口部若しくは一方の平面における開口部を全包囲した多重額縁形状、多重リング状、メッシュ形状の中から少なくとも１種類が選ばれる閉じた幾何形状で具備した後、前記最終表面処理を施すことを特徴とするプリント配線板の製造方法。 An outer layer circuit provided on one plane of a printed wiring board having a drill hole is subjected to a final surface treatment, which is the last surface treatment in the outer layer circuit, and then provided on the other plane facing the outer layer circuit. In addition, in the method of manufacturing a printed wiring board that performs a final surface treatment different from the final surface treatment,
An outer layer circuit for preventing leakage of the surface treatment component for preventing the component of the final surface treatment from leaking through the drill hole to the circuit surface of the outer layer circuit provided on a plane opposite to the outer layer circuit to be subjected to the final surface treatment, After having a closed geometric shape selected from at least one of a multi-frame shape, a multi-ring shape, and a mesh shape that completely surrounds the openings in both planes of the drill hole or in one plane, the final surface A method for producing a printed wiring board, comprising performing a treatment.
前記他方の平面に備えられる外層回路への最終表面処理の成分が前記キリ穴を通じて前記一方の平面に備えられる外層回路の回路面に漏れ出すのを防ぐための表面処理成分の漏れ防止用外層回路を、前記キリ穴の一方の平面における開口部を全包囲した多重額縁形状、多重リング状、メッシュ形状の中から少なくとも１種類が選ばれる閉じた幾何形状で具備した後、前記他方の平面に備えられる外層回路への最終表面処理を施すことを特徴とするプリント配線板の製造方法。 After an outer layer circuit provided on one plane of a printed wiring board having a drill hole is subjected to a final surface treatment which is the final surface treatment in the outer layer circuit, the outer layer provided on the other plane opposite to the outer layer circuit In the method for manufacturing a printed wiring board, the circuit is subjected to a final surface treatment different from the final surface treatment.
The outer layer circuit for preventing leakage of the surface treatment component for preventing the component of the final surface treatment to the outer layer circuit provided on the other plane from leaking to the circuit surface of the outer layer circuit provided on the one plane through the drill hole. Are provided in a closed geometric shape selected from at least one of a frame shape, a multiple ring shape, and a mesh shape that completely surrounds the opening in one plane of the drill hole, and then provided in the other plane. A method for producing a printed wiring board, comprising subjecting the outer layer circuit to a final surface treatment.
前記凹凸構造の凸部が、幅０．０３〜１．０ｍｍの回路配線により構成され、
前記凹凸構造の凹部が、前記凸部と凸部間の空隙により構成されていることを特徴とする請求項１から４のいずれか１項に記載のプリント配線板の製造方法。 The outer layer circuit for preventing leakage provided around the drill hole is a circuit having a concavo-convex structure in a cross-sectional shape in the radial direction of the drill hole in a shape that completely surrounds the opening in the plane of the drill hole,
The convex part of the concavo-convex structure is constituted by circuit wiring having a width of 0.03 to 1.0 mm,
The method for manufacturing a printed wiring board according to any one of claims 1 to 4, wherein the concave portion of the concavo-convex structure is constituted by a gap between the convex portion and the convex portion.
前記プリント配線板の少なくとも一面に、前記キリ穴の開口部周囲に前記開口部を全包囲した多重額縁形状、多重リング状、メッシュ形状の中から少なくとも１種類が選ばれる閉じた幾何形状で、最終めっき処理のめっき成分の漏れを防止する漏れ防止用外層回路を備えることを特徴とするプリント配線板。 A printed wiring board in which a final plating process is performed on both sides having a drill hole,
At least one surface of the printed wiring board is a closed geometric shape selected from at least one of a multi-frame shape, a multi-ring shape, and a mesh shape surrounding the opening portion around the opening portion of the drill hole. A printed wiring board comprising a leakage preventing outer layer circuit for preventing leakage of a plating component of a plating process.
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