JP5771636B2 - Substrate processing apparatus, substrate unloading method - Google Patents

Description

  The present invention relates to a technique for unloading a substrate processed by a substrate processing apparatus to the outside of the apparatus, and particularly suitable for storing a substrate unloaded from a substrate processing apparatus in a storage container.

  2. Description of the Related Art Conventionally, in a board production line for producing a board, a board processing apparatus that performs processing such as application of a material such as solder, mounting or inspection of a component on the board is used. In addition, it is generally performed that a substrate processed by the substrate processing apparatus is stored in a storage container, for example, for transporting the substrate to the next process or the like.

  In particular, Patent Document 1 proposes an unloader (substrate storage device) that stores a substrate that has been processed and carried out of the substrate processing apparatus in a storage container. More specifically, the unloader is for storing (unloading) the substrate in the storage container by pushing the substrate transported to the front of the storage container (storage rack) by the conveyor into the storage container with a pusher. Therefore, if such an unloader is arranged on the unloading side of the substrate processing apparatus, the substrate unloaded from the substrate processing apparatus is pushed by the pusher after being transferred by the conveyor and automatically stored in the storage container. The Thus, the substrate can be efficiently stored in the storage container.

Japanese Patent Laid-Open No. 10-261895

  Incidentally, as described above, the unloader includes a conveyor that conveys the substrate unloaded from the substrate processing apparatus to the storage container. This conveyor is a mechanism necessary for the unloader to receive the substrate unloaded from the substrate processing apparatus and transport it to the front of the storage container, but has also become a factor for increasing the unloader. Therefore, when trying to incorporate an unloader into the board production line, the unloader having a size corresponding to the conveyor affects the size of the board production line, and it is difficult to reduce the size of the board production line. There was a case.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of configuring a substrate production line for storing a substrate unloaded from a substrate processing apparatus in a storage container in a small size. .

The substrate processing apparatus according to the present invention, in order to achieve the above object, in the substrate processing apparatus of carrying out by performing processing on the substrate outside the apparatus conveys the substrate placed in the substrate conveying direction, the substrate processing And a processing head for processing the substrate transferred to the substrate processing position by the conveyor, and a pusher that contacts the processed substrate from the upstream side in the substrate transport direction. By moving the substrate to the downstream side, the substrate processed at the substrate processing position is pushed out from the substrate processing position by the pusher and carried out of the conveyor to the outside of the apparatus . When the moving operation is completed, the substrate is moved upstream in the substrate transport direction. Te and a extrusion unit for performing the operation returns back pusher, performs processing sequentially unloaded outside the apparatus for a plurality of substrates Extrusion unit, characterized in that the conveyor carrying in the starting from the treatment head is back duplicate introducing process period to complete the processing of the substrate in the substrate processing position operation of the substrate toward the substrate processing position It is said.

Substrate unloading method according to the invention, in order to achieve the above object, the substrate unloading method for unloading a substrate where the substrate processing apparatus has performed the processing to the outside of the apparatus, to convey the substrate placed in the substrate conveying direction The substrate processing apparatus includes a step of transferring the substrate, which has been transferred to the substrate processing position and processed at the substrate processing position, from the conveyor to the outside of the apparatus by the transfer operation to the substrate processing position. The pusher is moved to the downstream side in the substrate transport direction while contacting the substrate processed at the substrate processing position from the upstream side in the substrate transport direction, and the processed substrate is pushed out of the substrate processing position by the pusher. place in Rutotomoni, double that when the moving operation is completed, the operation returns back to the pusher toward the upstream side in the substrate transfer direction is performed, the process sequentially performed In order to carry out the substrates in order to the outside of the apparatus, the return operation overlaps with the carry-in processing period from when the conveyor starts to carry the substrate toward the substrate processing position until the processing of the substrate at the substrate processing position is completed. It is characterized in that is carried out.

  In the invention thus configured (substrate processing apparatus, substrate unloading method), the substrate processing apparatus is provided with a pusher, and the pusher is brought into contact with the processed substrate from the upstream side in the substrate transport direction. The substrate is carried out of the apparatus by the moving operation of moving the substrate downstream in the substrate transport direction. That is, the processed substrate is carried out of the apparatus while being pushed out by a pusher provided in the substrate processing apparatus. Therefore, if the storage container is arranged on the carry-out side of the substrate processing apparatus, the substrate carried out from the substrate processing apparatus can be pushed as it is into the storage container with a pusher, without requiring an unloader equipped with a conveyor. The substrate can be stored in the storage container. Therefore, if a substrate production line is configured with such a substrate processing apparatus, the substrate production line for storing the substrate unloaded from the substrate processing apparatus in the storage container can be configured in a small size.

Further, in a substrate processing apparatus that sequentially processes a plurality of substrates and carries them out of the apparatus, the extrusion unit performs a return operation to return the pusher toward the downstream side in the substrate transport direction when the movement operation is completed. Thus, the substrate processing apparatus is configured . That is, in order to process a plurality of substrates in order and carry them out of the apparatus, it is necessary to repeatedly execute the moving operation. Therefore, when the movement operation is completed, if the return operation for returning the pusher toward the downstream side in the substrate conveyance direction is performed, the subsequent movement operation can be started quickly, and the throughput can be improved.

  At this time, the substrate processing apparatus may be configured such that the push-out unit returns the pusher to the upstream side in the substrate transport direction of the substrate position at the start of the moving operation by the returning operation. With such a configuration, it is possible to start the subsequent movement operation more quickly.

Further, the extrusion unit performs a return operation overlappingly during the carry-in processing period from when the conveyor starts to carry the substrate toward the substrate processing position until the processing head completes the processing of the substrate at the substrate processing position. In addition, a substrate processing apparatus is configured . In such a configuration, the return operation is executed repeatedly in a period from the start of the carry-in of the substrate to be processed to the substrate processing position to the completion of the process (carry-in process period). Therefore, throughput can be improved by suppressing or eliminating time spent only for performing the return operation.

  Further, the extrusion unit has a stopper that moves in accordance with the pusher, and is loaded during the loading process period by positioning the stopper with respect to the downstream end of the substrate processing position in the substrate transport direction during the returning operation. The substrate processing apparatus may be configured to stop the substrate at the substrate processing position by a stopper. By configuring the stopper to move with the pusher in this way, it is not necessary to provide a mechanism for moving each of the pusher and the stopper, and the configuration of the substrate processing apparatus can be simplified. Moreover, since the stoppage of the loaded substrate to the substrate processing position by the stopper is also performed using the opportunity of the return operation of the pusher, these movements are compared with the case where the pusher and the stopper are moved at different occasions. Can be executed efficiently.

  Further, the extrusion unit has a vertical drive unit that drives the pusher in the vertical direction, and in the section that overlaps the substrate transport direction with respect to the substrate during the loading process period, the pusher is removed from the substrate in the vertical direction by the vertical drive unit. The substrate processing apparatus may be configured so that the pusher is returned and the return operation is performed. In such a configuration, it is possible to reliably suppress the interference between the substrate that is loaded and processed during the loading process period and the pusher that moves along with the return operation.

  At this time, the push-out unit is extended in the substrate transport direction corresponding to the movement range of the pusher, a holding portion that holds the pusher up and down in a vertical direction, a rodless cylinder that moves the holding portion in the substrate transport direction. The substrate processing apparatus may be configured to further include an extending member that pushes the pusher by moving in the vertical direction, and the extending member is moved up and down by the vertical driving unit. In such a configuration, the pusher held by the holding unit is moved in the substrate transfer direction by moving the holding unit in the substrate transfer direction by the rodless cylinder. In addition, an extending member extending in the substrate transport direction is provided corresponding to the moving range of such a pusher, and the extending member is moved in the vertical direction by the vertical drive unit, so that the moving member can move within the moving range. The pusher can be pushed in the vertical direction regardless of the position. Therefore, it is not necessary to move the driving source (here, the vertical driving unit) for raising and lowering the pusher in the substrate transport direction as the pusher moves in the substrate transport direction, and the electrical wiring connected to the driving source is routed. Etc. can be simplified.

  Further, the conveyor may configure the substrate processing apparatus so that the substrate is not carried into the substrate processing position during the period in which the extrusion unit is moving. With such a configuration, it is possible to reliably suppress interference between the pusher performing the moving operation and the carry-in substrate.

  Further, the extrusion unit may constitute the substrate processing apparatus so that the stop position of the substrate pushed out of the apparatus can be changed. In such a configuration, for example, it is possible to change the degree of pushing the substrate into the storage container according to the state of the substrate (for example, the quality of the substrate) and to make it easy to determine the state of the substrate in a later process. Become.

  Further, the extrusion unit may configure the substrate processing apparatus so as to adjust the position of the pusher in the width direction according to the width of the substrate in the width direction orthogonal to the substrate transport direction. In such a configuration, since a location corresponding to the width of the substrate can be pushed, an appropriate movement operation can be performed on the substrate while suppressing an inclination of the substrate due to an unbalanced force.

  The processing head can perform processing on the substrate while moving in the substrate transport direction, and the extrusion unit further includes a sub pusher attached to the processing head, and moves the processing head to the substrate that has been processed. The substrate processing apparatus may be configured such that the movement is performed by pressing the sub pusher and then pressing the pusher further. With such a configuration, the stroke of the pusher required for the moving operation can be kept short, and the pusher drive mechanism can be downsized.

  Further, the substrate processing apparatus may be configured such that the pushing unit projects the pusher from the downstream end of the conveyor in the substrate transport direction to perform the moving operation. With such a configuration, the substrate can be reliably stored in the storage container by sufficiently pushing out the substrate by the moving operation.

  In addition, there are various types of processing executed by the processing head. Therefore, for example, the substrate processing apparatus may be configured such that the processing head performs the inspection of the substrate state as the processing.

  As described above, according to the present invention, if the storage container is arranged on the carry-out side of the substrate processing apparatus, the substrate unloaded from the substrate processing apparatus can be pushed into the storage container with the pusher as it is, The substrate can be stored in the storage container without the need for the unloader provided. Therefore, if a substrate production line is configured with such a substrate processing apparatus, the substrate production line for storing the substrate unloaded from the substrate processing apparatus in the storage container can be configured in a small size.

It is a front view which shows typically an example of the board | substrate inspection apparatus which can apply this invention. It is a front view which shows typically an example of the board | substrate conveyance unit concerning 1st Embodiment. It is a top view which shows typically an example of the board | substrate conveyance unit concerning 1st Embodiment. It is a block diagram which shows typically an example of a board | substrate production line provided with the board | substrate inspection apparatus of FIG. 4 is a flowchart illustrating a series of operations for inspecting a substrate and storing it in a storage rack in the first embodiment. FIG. 6 is an operation explanatory diagram schematically illustrating a series of operations executed according to the flowchart of FIG. 5, and particularly illustrates an operation when a substrate is carried out from an inspection position to a storage rack. FIG. 6 is an operation explanatory diagram schematically illustrating a series of operations executed according to the flowchart of FIG. 5, and particularly illustrates an operation when a substrate is carried into an inspection position. It is a flowchart which illustrates a series of operation | movement which test | inspects a board | substrate and accommodates in a storage rack in 2nd Embodiment. FIG. 9 is an operation explanatory diagram schematically illustrating a series of operations executed according to the flowchart of FIG. 8, and particularly illustrates an operation when a substrate is carried into an inspection position. It is operation | movement explanatory drawing which illustrates a series of operation | movement which test | inspects a board | substrate and accommodates in a storage rack in 3rd Embodiment, and illustrates the pre operation | movement by a sub pusher especially. It is operation | movement explanatory drawing which illustrates a series of operation | movement which test | inspects a board | substrate and accommodates in a storage rack in 3rd Embodiment, and illustrates especially the extrusion operation | movement by a pusher. It is operation | movement explanatory drawing which illustrates a series of operation | movement which test | inspects a board | substrate in 4th Embodiment, and accommodates it in a storage rack, and illustrates especially the operation | movement at the time of carrying out a board | substrate from a test position to a storage rack. It is operation | movement explanatory drawing which illustrates a series of operation | movement which test | inspects a board | substrate in 4th Embodiment, and accommodates it in a storage rack, Especially the operation | movement at the time of carrying in a board | substrate to a test | inspection position is illustrated. FIG. 10 is a plan view schematically showing an example of an extrusion unit provided in a substrate inspection apparatus according to a fifth embodiment. It is a top view which shows typically an example of the extrusion unit with which the board | substrate inspection apparatus concerning 6th Embodiment is provided.

First Embodiment FIG. 1 is a front view schematically showing an example of a substrate inspection apparatus to which the present invention is applicable. In the figure and the drawings shown below, XYZ orthogonal coordinates are shown as appropriate where the substrate transport direction is the X direction, the width direction is the Y direction, and the vertical direction is the Z direction. The substrate inspection apparatus 1 includes a substrate transport unit 3 that transports the substrate 10 in the X direction, an inspection head 5 that inspects the substrate 10 transported to the inspection position Pt by the substrate transport unit 3, and the inspection head 5 in the XY plane. An XY drive unit 7 to be moved is provided with a schematic configuration accommodated in a housing 9.

  The housing 9 is provided with a carry-in port 91 that opens to the upstream side (right side in FIG. 1) in the substrate transfer direction X and a carry-out port 92 that opens to the downstream side (left side in FIG. 1) in the substrate transfer direction X. Then, the substrate transport unit 3 transports the substrate 10 carried in from the outside of the apparatus 1 (right side in FIG. 1) via the carry-in port 91 to the inspection position Pt. Further, the substrate transport unit 3 unloads the substrate S, which has been inspected at the inspection position Pt, to the outside of the apparatus 1 (left side in FIG. 1) via the carry-out port 92.

  The inspection head 5 has the same configuration as the inspection unit disclosed in, for example, Japanese Patent Application Laid-Open No. 2011-133306, and includes an illumination unit 51, an imaging unit 53, and a laser measurement unit 55, and is fixed to the inspection position Pt. The substrate 10 is inspected. Specifically, the component 11 is mounted on the substrate 10 by soldering, and the inspection head 5 inspects the soldering state of the component 11 to the substrate 10.

  The illumination unit 51 has a configuration in which a plurality of light emitting elements (not shown) are arranged inside a dome-shaped frame in which an opening 51a that opens in the vertical direction Z is formed at the top. And the illumination part 51 irradiates the light from a light emitting element to the test object range which opposes the downward direction of the perpendicular direction Z. FIG. Thereby, light is irradiated from above in the vertical direction Z to the inspection object range. The imaging unit 53 is configured by a CCD (Charge Coupled Device) camera, and faces the inspection target range from above in the vertical direction Z through the opening 51 a of the illumination unit 51. Then, the imaging unit 53 captures an image of the inspection target range illuminated by the illumination unit 51. The laser measuring unit 55 includes a light emitting unit 55a that irradiates the inspection target range with laser light and a light receiving unit 55b that receives the light reflected by the inspection target range, in the vertical direction Z to the inspection target range. The distance is measured.

  Then, the inspection head 5 performs inspection based on the two-dimensional image in the XY plane of the inspection target range imaged by the imaging unit 53 and the distance in the vertical direction Z to the inspection target range acquired by the laser measurement unit 55. Know the 3D shape of the area and inspect the soldering condition. Specifically, the inspection head 5 moves in the XY plane so that the inspection target range is aligned with the solder joint location (the location where the component 11 is soldered to the substrate 10) fixed to the inspection position Pt. Inspect the soldering state at each solder joint. Incidentally, the movement of the inspection head 5 in the XY plane is performed by the XY drive unit 7. The XY drive unit 7 has the same configuration as a so-called XY table, and integrally moves the illumination unit 51, the imaging unit 53, and the laser measurement unit 55 that constitute the inspection head 5.

  FIG. 2 is a front view schematically showing an example of the substrate transport unit according to the first embodiment. FIG. 3 is a plan view schematically showing an example of the substrate transport unit according to the first embodiment. Next, the substrate transfer unit 3 will be described in detail. The substrate transport unit 3 is disposed below the inspection head 5 in the vertical direction Z, and includes a schematic configuration for transporting the substrate 10 in the substrate transport direction X by a conveyor 31 (for example, a belt conveyor). The conveyor 31 extends in the substrate transport direction X, and transports the substrate S placed thereon in the substrate transport direction X. Specifically, the substrate transport unit 3 includes two conveyors 31 arranged at intervals in the width direction Y, and the substrate S placed across the conveyor 31 from the width direction Y is transferred to the substrate transport direction X. Transport to.

  A conveyor frame 32 is provided for each conveyor 31, and each conveyor 31 is supported by a corresponding conveyor frame 32. Each conveyor 31 is driven in the substrate transport direction X by a conveyor motor M31 attached to the conveyor frame 32. That is, by controlling the conveyor motor M31, the substrate 10 can be carried into the inspection position Pt from the outside of the apparatus by the two conveyors 31 and can be carried out of the apparatus from the substrate position Pt. Further, at least one of the two conveyor frames 32 is movable in the width direction Y along with the conveyor 31. Therefore, by moving the movable conveyor frame 32, the distance between the two conveyors 31 in the width direction Y can be adjusted according to the size (that is, the width) of the substrate 10 in the width direction Y.

  A substrate fixing portion 33 is provided below the conveyor 31 in the vertical direction Z. The substrate fixing unit 33 includes a lift pin 331 and a pin cylinder 332, and the lift pin 331 can be lifted and lowered in the vertical direction Z by the pin cylinder 332. The raising / lowering pins 331 are provided at the downstream end of the inspection position Pt in the substrate conveyance direction X, and are located on the conveyance path of the substrate 10 by the conveyor 32 in the raised state, while the substrate by the conveyor 32 in the lowered state. 10 is out of the transport path.

  Further, the substrate fixing unit 33 includes a protruding member 335, a lifting table 336, and a table cylinder 337, and has a configuration in which the protruding member 335 is disposed on the lifting table 336 that is lifted and lowered by the table cylinder 337. Therefore, the protrusion member 335 can be moved up and down in the vertical direction Z by the table cylinder 337. In the raised state, the protrusion member 335 pushes up the substrate 10 at the inspection position Pt and presses against the conveyor frame 32. Thereby, the substrate 10 is fixed at the inspection position Pt. On the other hand, the protrusion member 335 releases the pressure contact between the substrate 10 and the conveyor frame 32 in the lowered state. As a result, the substrate 10 is released from being fixed to the inspection position Pt.

  Further, the substrate transport unit 3 includes an extruding unit 4 that unloads the substrate 10 from the conveyor 31 to the outside of the apparatus via a carry-out port 92. The extruding unit 4 extrudes the substrate 10 from the conveyor 31 to the outside of the apparatus by a pusher 40 movable in the substrate transport direction X, and includes a horizontal cylinder 41 and a vertical cylinder 42 as a mechanism for moving the pusher 40. The horizontal cylinder 41 is a rodless cylinder having a stroke parallel to the substrate transport direction X, and moves the slider 411 in the substrate transport direction X (or the opposite direction). The vertical cylinder 42 is a rod cylinder attached to the slider 411 of the horizontal cylinder 41 and having a stroke parallel to the vertical direction Z. The vertical cylinder 42 moves the rod 421 up and down in the vertical direction Z. In addition, as the horizontal cylinder 41 and the vertical cylinder 42, an air cylinder etc. can be used, for example.

  A pusher 43 is attached to the upper end of the rod 421 of the vertical cylinder 42 that is movable in the substrate transport direction X by the horizontal cylinder 41. Therefore, by operating the horizontal cylinder 41, the pusher 43 can be moved in the substrate transport direction X along with the vertical cylinder 42. Specifically, the front end 43a of the pusher 43 (downstream end in the substrate transport direction X) is located upstream from the inspection position Pt in the substrate transport direction X, and the front end 31a of the conveyor 31 (downstream end in the substrate transport direction X). It can move to a position downstream. Further, the pusher 43 can be moved up and down in the vertical direction Z by operating the vertical cylinder 42. Specifically, the center 43a of the pusher 43 is positioned on the transport path of the substrate 10 by the conveyor 32 in the raised state, and deviates from the transport path of the substrate 10 by the conveyor 32 in the lowered state.

  Such a substrate transport unit 3 performs a series of operations such as loading of the substrate 10 to the inspection position Pt, fixing / release of the substrate 10 to the inspection position Pt, and unloading of the substrate 10 from the inspection position Pt as follows. And execute. When carrying in the board | substrate 10, the raising / lowering pin 331 in the raised state waits for the board | substrate 10 conveyed toward the test | inspection position Pt by the conveyor 31. FIG. The substrate 10 that has reached the inspection position Pt comes into contact with a lift pin 331 that contacts the downstream end of the inspection position Pt in the substrate transport direction X. In this way, the substrate 10 is stopped at the inspection position Pt by the lifting pins 331. The arrival of the substrate 10 at the inspection position Pt can be detected by the sensor 338, and the conveyor 31 stops simultaneously with the arrival of the substrate 10 at the inspection position Pt based on the detection result of the sensor 338.

  When the loading of the substrate 10 is completed in this way, the protrusion member 335 is raised and the substrate 10 is fixed to the inspection position Pt. The inspection head 5 inspects the substrate 10 fixed to the inspection position Pt. When the inspection on the substrate 10 is completed, the protrusion member 335 is lowered and the fixation of the substrate 10 to the inspection position Pt is released. When the substrate 10 is unloaded, the pusher 43 in the raised state faces the substrate 10 at the inspection position Pt from the upstream side in the substrate transport direction X. Subsequently, the pusher 43 moves in the substrate transport direction X, thereby pushing the substrate 10 in the substrate transport direction X and carrying it out of the conveyor 31 to the outside of the apparatus.

  The above is the schematic configuration of the substrate inspection apparatus 1. By the way, in the substrate production line, the substrate inspection apparatus 1 can not only inspect the substrate 10 but also store the inspected substrate 10 in the storage rack of the unloader. Therefore, the operation of the substrate inspection apparatus 1 in the substrate production line will be described in detail.

  FIG. 4 is a block diagram schematically illustrating an example of a substrate production line including the substrate inspection apparatus of FIG. The board production line 100 includes an unloader 200 and a host computer HC in addition to the board inspection apparatus 1 described above. Although not described in detail in the above description with reference to FIGS. 1 to 3, the substrate inspection apparatus 1 includes a substrate inspection control unit 1 </ b> C, and transport control of the substrate 10 such as loading, fixing / release, and unloading of the substrate 10. Alternatively, the inspection of the substrate 10 by the inspection head 5 is executed by the substrate inspection control unit 1C controlling each part of the apparatus. In particular, the conveyance control of the substrate 10 is executed by controlling the table cylinder 337, the conveyor motor M31, the horizontal cylinder 41, and the vertical cylinder 42.

  The unloader 200 is disposed downstream of the substrate inspection apparatus 1 in the substrate transport direction X, and stores the substrate 10 pushed out by the pusher 43 of the substrate inspection apparatus 1 in the storage rack 210. The storage rack 210 has a plurality of slots provided in the vertical direction, and stores the substrate 10 in each slot. For example, the storage rack 210 has a configuration similar to the storage rack stocker disclosed in Japanese Patent Laid-Open No. 10-261895. Further, the unloader 200 includes a lifting mechanism 220 that lifts and lowers the storage rack 210 in the vertical direction Z. The elevating mechanism 220 moves the storage rack 210 up and down so that the empty slot faces the position where the substrate 10 is pushed out from the substrate inspection apparatus 1. Specifically, each time the substrate 10 is stored in the slot, the elevating mechanism 220 lowers the storage rack 210 by one slot and faces the empty slot to a position where the substrate 10 is pushed out from the substrate inspection apparatus 1. Let Such operation of the lifting mechanism 220 is controlled by an unloader control unit 200 </ b> C provided in the unloader 200. The unloader 200 does not include a conveyor for transporting the substrate 10 to the storage rack 210.

  Then, according to the instruction from the host computer HC, the substrate inspection control unit 1C and the unloader control unit 200C perform respective control operations so that the plurality of substrates 10 that have been inspected by the substrate inspection apparatus 1 are stored in the unloader 200. The racks 210 can be sequentially stored. Next, a series of operations for inspecting the substrate 10 and storing it in the storage rack 210 will be described in detail.

  FIG. 5 is a flowchart illustrating a series of operations for inspecting a substrate and storing it in a storage rack in the first embodiment. In FIG. 5, the direction of the substrate transport direction X is particularly referred to as “X-axis forward direction”, and the reverse direction of the substrate transport direction X is particularly referred to as “X-axis reverse direction”. FIG. 6 is an operation explanatory view schematically illustrating a series of operations executed in accordance with the flowchart of FIG. 5, and particularly illustrates an operation when a substrate is carried out from the inspection position to the storage rack. FIG. 7 is an operation explanatory view schematically illustrating a series of operations executed in accordance with the flowchart of FIG. 5, and particularly illustrates an operation when a substrate is carried into an inspection position.

  As shown in the column “inspection of substrate” in FIG. 6, while the inspection head 5 is inspecting the substrate 10 at the inspection position Pt, the tip 43a of the pusher 43 is more in the substrate transport direction X than the inspection position Pt. At the standby position Pw that descends in the vertical direction Z. As shown in the column “Completion of Substrate Inspection” in FIG. 6, when the inspection of the substrate 10 at the inspection position Pt is completed, the fixing of the substrate 10 to the inspection position Pt is released, and step S100 is executed to push the pusher. 43 rises. Thus, the tip 43a of the pusher 43 faces the substrate 10 at the inspection position Pt from the upstream side in the substrate transport direction X. In step S101, the pusher 43 starts moving in the substrate transport direction X.

  6, the pusher 43 moves in the substrate transport direction X to the extrusion start position Ps where the tip 43a contacts the upstream end of the substrate transport direction X of the substrate 10, The substrate 10 is pushed in the substrate transport direction X. Further, as shown in the column “End of extrusion operation” in FIG. 6, the pusher 43 moves in the substrate conveyance direction X to the extrusion end position Pe whose tip 43 a protrudes from the downstream end in the substrate conveyance direction X of the conveyor 31. Thus, the substrate 10 is stored in the slot 211 of the storage rack 210. Thus, by moving the pusher 43 in the substrate transport direction X from the extrusion start position Ps to the extrusion end position Pe, the pusher 43 is brought into contact with the inspected substrate 10 from the upstream side in the substrate transport direction X. An extrusion operation for moving the downstream side in the substrate transport direction X is executed. Thus, the inspected substrate 10 is pushed out and carried out of the conveyor 32 to the storage rack 210 outside the substrate inspection apparatus 1.

  In step S102, it is confirmed whether or not the storage of the substrate 10 in the storage rack 210 is completed by the extrusion operation. When it is confirmed that the substrate 10 has been stored in the storage rack 210 (“YES” in step S102), it is confirmed in step S103 whether all substrate inspections have been completed. If all substrate inspections have been completed (in the case of “YES” in step S103), the flowchart of FIG. 5 ends. On the other hand, if substrate inspections remain (in the case of “NO” in step S103), the subsequent steps are performed. The operation of returning to the reverse direction of the substrate transport direction X (steps S104 to S108) and the operation of carrying the substrate 10 into the inspection position Pt and inspecting (steps S109 to S112) are performed in parallel. And executed.

  In step S104, the pusher 43 starts to move in the direction opposite to the substrate transport direction X. In step S105, it is confirmed whether or not a predetermined time has elapsed from the start of movement of the pusher 43. This predetermined time is required for the pusher 43 to move away from the storage rack 210 in the substrate transport direction X until the pusher 43 and the storage rack 210 do not interfere even if the pusher 43 and the storage rack 210 are relatively moved in the vertical direction Z. Set over time. When the elapse of the predetermined time is confirmed (“YES” in step S105), step S106 is executed and the pusher 43 is lowered. As a result, as shown in the column “Pusher down” in FIG. 7, the pusher 43 is released downward in the vertical direction Z from the transport path of the substrate 10 by the conveyor 31. In step S107, the storage rack 210 is lowered by one slot 211, and the empty slot 211 is opposed to the position where the substrate 10 is pushed out from the substrate inspection apparatus 1. Note that steps S106 and S107 may be executed serially in the reverse order or in parallel. The pusher 43 continues to move in the direction opposite to the substrate transport direction X below the vertical direction Z with respect to the transport path of the substrate 10 by the conveyor 31 (in the column of “arrival of substrate at inspection position” in FIG. 7), and the standby position. Pw is reached (in the column “Pusher movement to standby position” in FIG. 7). In step S108, it is confirmed whether or not the pusher 43 has arrived at the standby position Pw.

  On the other hand, in step S109, loading of the substrate 10 to the inspection position Pt is started, and in the subsequent step S110, arrival of the substrate 10 at the inspection position Pt is confirmed. When the substrate 10 arrives at the inspection position Pt (“YES” in step S110) as shown in the column “Arrival of substrate at inspection position” in FIG. 7, inspection of the substrate 10 by the inspection head 5 is started in step S111. . In step S112, it is confirmed whether or not the inspection of the substrate 10 is completed.

  As described above, the operation of moving the pusher 43 in the direction opposite to the substrate transport direction X from the extrusion end position Pe to the standby position Pw (return operation), and the operation of carrying the substrate 10 into the inspection position Pt and inspecting it (incoming inspection operation). ) Are executed in parallel. At this time, the movement of the pusher 43 is performed at a position deviated from the transport path of the substrate 10, so that interference between the pusher 43 and the substrate 10 is avoided. Then, when the arrival of the pusher 43 at the standby position Pw is confirmed (“YES” in step S108) and the completion of the inspection of the substrate 10 is confirmed (“YES” in step S112), the process returns to step S100, and FIG. The flowchart of 5 is repeatedly executed. Thus, the plurality of substrates 10 can be inspected and stored in the storage rack 210 in order.

  As described above, in the first embodiment, the pusher 43 is provided in the substrate inspection apparatus 1, and the pusher 43 is brought into contact with the substrate 10 subjected to the inspection from the upstream side in the substrate transport direction X. The substrate 10 is carried out of the apparatus by an extruding operation that moves the substrate to the downstream side in the substrate transport direction X. That is, the inspected substrate 10 is carried out of the apparatus while being pushed out by the pusher 43 provided in the substrate inspection apparatus 1. Therefore, if the storage rack 210 is arranged on the carry-out side of the substrate inspection apparatus 1, the substrate 10 carried out from the substrate inspection apparatus 1 can be pushed into the storage rack 210 as it is by the pusher 43, and the conveyor 31 is provided. The substrate 10 can be stored in the storage rack 210 without requiring an unloader. Therefore, if the substrate production line 100 is configured with such a substrate inspection apparatus 1, the substrate production line 100 for storing the substrate 10 unloaded from the substrate inspection apparatus 1 in the storage rack 210 can be configured in a small size. It becomes.

  In the first embodiment, the plurality of substrates 10 are sequentially inspected and carried out to the storage rack 210 outside the apparatus. However, when the processing is sequentially performed on the plurality of substrates 10 and carried out of the apparatus, it is necessary to repeatedly perform the extrusion operation. On the other hand, in the first embodiment, when the extrusion operation is completed, a return operation for returning the pusher 43 toward the downstream side in the substrate transport direction X is performed, so that the subsequent extrusion operation can be started quickly. Throughput can be improved.

  Further, in the return operation of the first embodiment, the pusher 43 is returned to the upstream position (standby position Pw) in the substrate transport direction X of the position of the substrate 10 (inspection position Pt) at the start of the extrusion operation. As a result, the subsequent extrusion operation can be started more quickly.

  Moreover, in 1st Embodiment, it overlaps with the carrying-in process period until the inspection head 5 completes the test | inspection to the board | substrate 10 of test | inspection position Pt after the conveyor 31 starts carrying-in toward the test | inspection position Pt. The return operation is executed. That is, the return operation is executed repeatedly in the period from the start of the carry-in of the substrate 10 to be inspected to the inspection position Pt to the completion of the inspection (the carry-in process period). Therefore, throughput can be improved by suppressing or eliminating time spent only for performing the return operation.

  In the first embodiment, the extrusion unit 5 includes a vertical cylinder 42 that drives the pusher 43 in the vertical direction Z. In the section overlapping the substrate transport direction X with respect to the substrate 10 during the carry-in processing period, the pusher 43 is returned while being removed from the substrate 10 in the vertical direction Z by the vertical cylinder 43, and the return operation is performed. In such a configuration, it is possible to reliably suppress the interference between the substrate 10 that receives and processes with the loading process period and the pusher 43 that moves with the returning operation.

  In the first embodiment, the substrate 10 is not carried into the inspection position Pt during the period in which the extrusion unit 5 performs the extrusion operation. In such a configuration, interference between the pusher 43 performing the pushing operation and the carry-in substrate 10 can be reliably suppressed.

  Moreover, in 1st Embodiment, the extrusion unit 5 makes the pusher 43 protrude from the downstream end of the board | substrate conveyance direction X of the conveyor 31, and performs extrusion operation | movement. With such a configuration, the substrate 10 can be sufficiently extruded by the extrusion operation, and the substrate 10 can be reliably stored in the storage rack 210.

Second Embodiment FIG. 8 is a flowchart illustrating a series of operations for inspecting a substrate and storing it in a storage rack in the second embodiment. In FIG. 8, the direction of the substrate transport direction X is particularly referred to as “X-axis forward direction”, and the reverse direction of the substrate transport direction X is particularly referred to as “X-axis reverse direction”. FIG. 9 is an operation explanatory view schematically illustrating a series of operations executed in accordance with the flowchart of FIG. 8, and particularly illustrates operations when a substrate is carried into an inspection position. Below, it demonstrates centering on the difference with 1st Embodiment using these figures. However, it goes without saying that the same effect can be achieved in the second embodiment by providing the same configuration as in the first embodiment.

  In this embodiment, a stopper 44 is joined to the upstream side of the pusher 43 in the substrate transport direction X, and the pusher 43 and the stopper 44 can be moved integrally in the substrate transport direction X and the vertical direction Z. ing. Then, in the middle of the return operation of the pusher 43, a stop operation for stopping the carry-in substrate 10 at the inspection position Pt by the stopper 44 is executed. That is, the stopper 44 has the same function as the lifting pin 331 in the first embodiment, and the lifting pin 331 and the pin cylinder 332 are eliminated in the second embodiment.

  As shown in steps S200 to S203 in FIG. 8, the same flow as in steps S100 to S103 of the first embodiment is executed in the second embodiment. As a result, the extrusion operation is executed, and the inspected substrate 10 is stored in the storage rack 210, and it is confirmed whether the entire substrate inspection is completed. Then, when all the substrate inspections have been completed (in the case of “YES” in step S203), the flowchart of FIG. 8 ends, whereas when the substrate inspections remain (in the case of “NO” in step S203). Then, proceeding to the subsequent steps, an operation of returning the pusher 43 in the direction opposite to the substrate transport direction X (steps S204 to S210), and an operation of carrying the substrate 10 into the inspection position Pt and inspecting (steps S211 to S214). Are executed in parallel.

  In step S204, movement of the pusher 43 and the stopper 44 in the direction opposite to the substrate transport direction X is started. In step S205, the rear end 44a of the stopper 44 (upstream end in the substrate transport direction X) is positioned at the downstream end in the substrate transport direction X at the inspection position Pt, as shown in the column "Arrival of stopper at the contact position" in FIG. It is confirmed whether the pusher 43 and the stopper 44 have moved in the direction opposite to the substrate transport direction X up to the contact position Pp in contact. When it is confirmed that the pusher 43 and the stopper 44 have arrived at the contact position Pp (“YES” in step S205), the pusher 43 and the stopper 44 are stopped at the contact position Pp (stop S206). In step S207, the storage rack 210 is lowered by the amount of one slot 211, and the empty slot 211 is opposed to the position where the substrate 10 is pushed out from the substrate inspection apparatus 1.

  On the other hand, step S211 is started in parallel with step S204, and the carry-in of the substrate 10 to the inspection position Pt is started. Accordingly, the stopper 44 that stops at the contact position Pp waits for the substrate 10 to reach the inspection position Pt. 9, when the substrate 10 reaches the inspection position Pt, the substrate 10 comes into contact with the stopper 44 stopped at the contact position Pp and moves in the substrate transport direction X as shown in the column “Arrival of the substrate at the inspection position”. Stop. At the same time, in step S212, it is confirmed that the substrate 10 has arrived at the inspection position Pt (YES).

  When both steps S207 and S212 are completed, the continuation operation of the pusher 43 (steps S208 to S210) and the inspection of the substrate 10 (steps S213 to S214) are executed in parallel. In step S208, the pusher 43 is lowered. As a result, as shown in the column “Pusher down” in FIG. 9, the pusher 43 is released downward in the vertical direction Z from the conveyance path of the substrate 10 by the conveyor 31, in other words, from the substrate 10 that stops at the inspection position Pt. In subsequent step S209, movement of the pusher 43 in the direction opposite to the substrate transport direction X is started. As a result, the pusher 43 moves in the reverse direction of the substrate transport direction X below the vertical direction Z with respect to the substrate 10 stopped at the inspection position Pt and reaches the standby position Pw ("Pusher movement to standby position" in FIG. 9). Column). In step S210, it is confirmed whether or not the pusher 43 has arrived at the standby position Pw.

  On the other hand, in step S213, the inspection of the substrate 10 stopped at the inspection position Pt is started, and in step S214, it is confirmed whether the inspection of the substrate 10 is completed. Thus, when the arrival of the pusher 43 at the standby position Pw is confirmed (“YES” in step S210) and the completion of the inspection of the substrate 10 is confirmed (“YES” in step S214), the process returns to step S200, and FIG. The flowchart of 8 is repeatedly executed. Thus, the plurality of substrates 10 can be inspected and stored in the storage rack 210 in order.

  As described above, also in the second embodiment, the inspected substrate 10 is carried out of the apparatus while being pushed out by the pusher 43 provided in the substrate inspection apparatus 1. Therefore, if the storage rack 210 is arranged on the carry-out side of the substrate inspection apparatus 1, the substrate 10 carried out from the substrate inspection apparatus 1 can be pushed into the storage rack 210 as it is by the pusher 43, and the conveyor 31 is provided. The substrate 10 can be stored in the storage rack 210 without requiring an unloader. Therefore, if the substrate production line 100 is configured with such a substrate inspection apparatus 1, the substrate production line 100 for storing the substrate 10 unloaded from the substrate inspection apparatus 1 in the storage rack 210 can be configured in a small size. It becomes.

  In the second embodiment, the extrusion unit 4 has a stopper 44 that moves with the pusher 43. Then, during the returning operation, the push-out unit 4 positions the stopper 44 with respect to the downstream end of the inspection position Pt in the substrate transport direction X, so that the substrate 10 carried in the carry-in processing period is inspected by the stopper 44. Stop at Pt. By configuring the stopper 44 to move along with the pusher 43 in this way, it is not necessary to provide a mechanism for movement in each of the pusher 43 and the stopper 44, and the configuration of the substrate inspection apparatus 1 is simplified. be able to. Moreover, since the stopper 44 is used to stop the loading substrate 10 at the inspection position Pt by using the opportunity of the return operation of the pusher 43, the pusher 43 and the stopper 44 are moved at different occasions. These movements can be executed efficiently.

Third Embodiment FIG. 10 is an operation explanatory diagram illustrating a series of operations for inspecting a substrate and storing it in a storage rack in the third embodiment, and particularly illustrates a pre-operation by a sub pusher. FIG. 11 is an operation explanatory view illustrating a series of operations for inspecting and storing a substrate in a storage rack in the third embodiment, and particularly illustrates an extrusion operation by a pusher. Below, it demonstrates centering on the difference with the said embodiment using these figures. However, it goes without saying that the same effect can be obtained in the third embodiment by providing the configuration common to the above-described embodiment.

  In this embodiment, a sub pusher 57 is attached to the inspection unit 5 via a vertical cylinder 58. Therefore, the sub pusher 57 can move in the XY plane along with the inspection unit 5 and can move in the vertical direction Z as the vertical cylinder 58 operates. Then, the sub pusher 57 and the pusher 43 cooperate to carry out the substrate from the inspection position Pt to the storage rack 210. Specifically, after performing the pre-operation of pushing the substrate 10 from the inspection position Pt to the substrate transport direction X by the sub pusher 57, the pusher 43 pushes the substrate 10 to the storage rack 210. During the pre-operation, the pusher 43 waits at the standby position Pw. However, as shown in FIG. 10, in the third embodiment, the standby position Pw of the pusher 43 is downstream of the inspection position Pt in the substrate transport direction X. Is set to

  As shown in the column “Pre-operation start” in FIG. 10, the sub pusher 57 comes into contact with the substrate 10 at the inspection position Pt from the upstream side in the substrate transport direction X as the inspection of the substrate 10 is completed. Start pre-operation. Further, as shown in the column “End of pre-operation” in FIG. 10, the sub pusher 57 moves in the substrate transport direction X while contacting the substrate 10 to push the substrate 10 in the substrate transport direction to complete the pre-operation. To do. As a result, the upstream end of the substrate 10 in the substrate transport direction X is positioned downstream of the pusher 43 at the standby position Pw in the substrate transport direction X. 10 and 11, a part of the substrate 10 has entered the storage rack 210 when the pre-operation is completed. However, the stop position of the substrate 10 when the pre-operation is completed can be changed as appropriate. It is. Then, as shown in the “sub pusher retreat” column of FIG. 10, when the pre-operation is completed, the sub pusher 57 retreats from the substrate 10 toward the upstream side in the substrate transport direction X.

  As shown in the column “Pusher rise” in FIG. 11, when the retraction of the sub pusher 57 is completed, the pusher 43 rises. Thus, the pusher 43 faces the substrate 10 from the upstream side in the substrate transport direction X. Following this, the pusher 43 moves in the substrate transport direction X and performs an extrusion operation. Then, as shown in the column “End of extrusion operation” in FIG. 11, the pusher 43 moves in the substrate transport direction X to the extrusion end position Pe protruding from the downstream end of the substrate 31 in the substrate transport direction X of the conveyor 31. Is stored in the slot 211 of the storage rack 210 (extrusion operation).

  As described above, also in the third embodiment, the inspected substrate 10 is carried out of the apparatus while being pushed out by the pusher 43 provided in the substrate inspection apparatus 1. Therefore, if the storage rack 210 is arranged on the carry-out side of the substrate inspection apparatus 1, the substrate 10 carried out from the substrate inspection apparatus 1 can be pushed into the storage rack 210 as it is by the pusher 43, and the conveyor 31 is provided. The substrate 10 can be stored in the storage rack 210 without requiring an unloader. Therefore, if the substrate production line 100 is configured with such a substrate inspection apparatus 1, the substrate production line 100 for storing the substrate 10 unloaded from the substrate inspection apparatus 1 in the storage rack 210 can be configured in a small size. It becomes.

  In the third embodiment, a sub pusher 57 attached to the inspection head 5 is provided in addition to the pusher 43. Then, the substrate 10 that has been inspected is moved by the inspection head 5 and pushed by the sub pusher 57, and then further pushed by the pusher 43, whereby the extrusion operation is executed. In such a configuration, the stroke of the pusher 43 required for the push-out operation can be kept short, and the horizontal cylinder 41 that is the drive mechanism of the pusher 43 can be downsized.

Fourth Embodiment FIG. 12 is an operation explanatory view illustrating a series of operations for inspecting a substrate and storing it in a storage rack in the fourth embodiment. In particular, the operation when carrying out a substrate from the inspection position to the storage rack is shown. Illustrate. FIG. 13 is an operation explanatory diagram illustrating a series of operations for inspecting a substrate and storing it in a storage rack in the fourth embodiment, and particularly illustrates an operation when a substrate is carried into an inspection position. Below, it demonstrates centering on the difference with the said embodiment using these figures. However, it goes without saying that the same effect can be obtained in the fourth embodiment by providing the same configuration as that of the above embodiment.

  In this embodiment, the mechanism for raising and lowering the pusher 43 in the vertical direction Z is different. That is, a horizontal bar member 421 extending in the substrate transport direction X is attached to the slider 411 of the horizontal cylinder 41, and the pusher 43 is connected to the other end of the rotating bar member 422 whose one end is pivotally supported by the horizontal bar member 421. Is attached. The rotating rod member 422 is biased in a direction (a counterclockwise direction in FIGS. 12 and 13) that changes from a sleeping state to a standing state. Then, as shown in the column of “PCB INSPECTION” in FIG. 12, in the state where the pusher 43 is positioned at the standby position Pw, the contact member 423 comes into contact with the rotating rod member 422 from above in the vertical direction Z. The pusher 43 is lowered in the vertical direction Z because the rotating rod member 422 lies down. On the other hand, when the pusher 43 is moved in the substrate transport direction X with respect to the contact member 423 as shown in the column of “start of extrusion operation” in FIG. 12, the rotating rod member 422 is detached from the contact member 423. Since the rotating rod member 422 stands by the urging force, the pusher 43 is in a state of being lifted in the vertical direction Z.

  While the inspection head 5 is inspecting the substrate 10 at the inspection position Pt, the pusher 43 is directly below the vertical direction Z of the substrate 10 at the inspection position Pt, as shown in the column “inspection of substrate” in FIG. At the standby position Pw. In the third embodiment, in order to raise the pusher 43 with the completion of the inspection of the substrate 10 at the inspection position Pt, it is necessary to retract the substrate 10 subjected to the inspection from above the pusher 43. Therefore, when the substrate inspection is completed, the conveyor 31 performs a pre-operation for moving the substrate 10 in the substrate transport direction X. As a result, as shown in the column “End of pre-operation” in FIG. 12, the substrate 10 is detached in the substrate transport direction X from above the pusher 43 at the standby position Pw. Subsequently, the pusher 43 rises in the vertical direction Z as it moves in the substrate transport direction X and starts moving in the substrate transport direction X when it faces the substrate 10 from the upstream side of the substrate transport direction X.

  12, the pusher 43 moves in the substrate transport direction X to the extrusion start position Ps that contacts the upstream end of the substrate 10 in the substrate transport direction X, and moves the substrate 10 to the substrate. Start pushing in the transport direction X. Further, as shown in the column “End of extrusion operation” in FIG. 12, the pusher 43 moves in the substrate transport direction X to the extrusion end position Pe protruding from the downstream end in the substrate transport direction X of the conveyor 31, and the substrate 10. Is stored in the slot 211 of the storage rack 210. Thus, by moving the pusher 43 in the substrate transport direction X from the extrusion start position Ps to the extrusion end position Pe, the pusher 43 is brought into contact with the inspected substrate 10 from the upstream side in the substrate transport direction X. An extrusion operation for moving the downstream side in the substrate transport direction X is executed. Thus, the inspected substrate 10 is pushed out and carried out of the conveyor 32 to the storage rack 210 outside the substrate inspection apparatus 1.

  When the substrate inspection is continued, the pusher 43 is moved in the direction opposite to the substrate transport direction X, that is, the return operation is performed, and the pusher 43 moves to the standby position Pw. Further, as shown in the column “Pusher down” in FIG. 13, the pusher 43 descends in the vertical direction Z at the standby position Pw. Thus, when the pusher 43 returns to the standby position Pw, the substrate 10 is loaded as shown in the “substrate loading” column of FIG. Then, as shown in the column “Arrival of substrate at inspection position” in FIG. 13, when the substrate 10 arrives at the inspection position Pt, the inspection of the substrate 10 is executed again.

  As described above, also in the fourth embodiment, the inspected substrate 10 is carried out of the apparatus while being pushed out by the pusher 43 provided in the substrate inspection apparatus 1. Therefore, if the storage rack 210 is arranged on the carry-out side of the substrate inspection apparatus 1, the substrate 10 carried out from the substrate inspection apparatus 1 can be pushed into the storage rack 210 as it is by the pusher 43, and the conveyor 31 is provided. The substrate 10 can be stored in the storage rack 210 without requiring an unloader. Therefore, if the substrate production line 100 is configured with such a substrate inspection apparatus 1, the substrate production line 100 for storing the substrate 10 unloaded from the substrate inspection apparatus 1 in the storage rack 210 can be configured in a small size. It becomes.

Fifth Embodiment FIG. 14 is a plan view schematically showing an example of an extrusion unit provided in a substrate inspection apparatus according to a fifth embodiment. In the following description, differences from the above embodiment will be mainly described. However, it goes without saying that the same effect can be obtained in the fifth embodiment by providing the same configuration as that of the above embodiment.

  As shown in FIG. 14, in the fifth embodiment, there is provided a rod-like link member 45 having one end pivotally supported by the conveyor frame 31 and the other end pivotally supported by the horizontal cylinder 41. Specifically, a pair constituted by a link member 45 connected from one conveyor frame 31 to the horizontal cylinder 41 and a link member 45 connected from the other conveyor frame 31 to the horizontal cylinder 41 is a horizontal cylinder 41. Are provided at both ends in the substrate transport direction X. Therefore, in order to adjust the interval in the width direction Y of the two conveyors 31 according to the width of the substrate W, when the interval in the Y direction of the two conveyor frames 31 changes, the horizontal cylinder 41 is changed accordingly. Also changes in the width direction Y. As a result, the pusher 43 supported by the horizontal cylinder 41 is displaced according to the interval in the width direction Y of the two conveyors 31, and is positioned approximately at the center of the width of the substrate W.

  Thus, in the fifth embodiment, the extrusion unit 4 adjusts the position of the pusher 43 in the width direction Y according to the width of the substrate 10 in the width direction Y orthogonal to the substrate transport direction X. In such a configuration, since the position corresponding to the width of the substrate 10 can be pushed by the pusher 43, an appropriate extrusion operation is performed while suppressing an inclination of the substrate 10 due to an unbalanced force. Can be done.

6th Embodiment FIG. 15: is a top view which shows typically an example of the extrusion unit with which the board | substrate inspection apparatus concerning 6th Embodiment is provided. In the following description, differences from the above embodiment will be mainly described. However, it is needless to say that the same effect can be obtained in the sixth embodiment by providing the configuration common to the above embodiment.

  As shown in FIG. 15, in the extrusion unit 4 of the sixth embodiment, the pusher 43 is supported by the holding portion 46 so as to be movable up and down in the vertical direction Z. Specifically, the holding portion 46 supports the pusher 43 by fitting a vertical support rod 461 extending in the vertical direction Z and having the pusher 43 attached to one end thereof into the through hole of the moving member 462. The moving member 462 of the holding unit 46 is attached to the slider 411 of the horizontal cylinder 41 (rodless cylinder). Therefore, by operating the horizontal cylinder 41, the pusher 43 can be moved in the substrate transport direction X (or the opposite direction) along with the holding portion 46.

  Further, the extrusion unit 4 is provided with an extending member 47 extending in the substrate transport direction X corresponding to the movement range of the pusher 43 in the substrate transport direction X. The extending member 47 faces the lower end of the vertical support bar 461 from below the vertical direction Z, and can push the pusher 43 upward in the vertical direction Z via the vertical support bar 461 by rising. Further, the vertical cylinders 42 are provided at both ends of the extending member 47 in the substrate transport direction X. Therefore, the pusher 43 can be moved up and down in the vertical direction Z by operating the vertical cylinders 42.

  In such a configuration, the pusher 43 held by the holding unit 46 is moved in the substrate transfer direction X by moving the holding unit 46 in the substrate transfer direction X by the horizontal cylinder 41 which is a rodless cylinder. Further, a plate-like extending member 47 extending in the substrate transport direction X is provided corresponding to the moving range of the pusher 43, and the extending member 47 is moved in the vertical direction Z by the vertical cylinder 42. By doing so, it is possible to push the pusher 43 in the vertical direction Z regardless of the position within the movement range. Therefore, it is not necessary to move the drive source (here, the vertical cylinder 42) for moving the pusher 43 up and down in the substrate transport direction X in accordance with the movement of the pusher 43 in the substrate transport direction X, and the electricity connected to the drive source. It is possible to simplify the routing of the target wiring 42a.

Others As described above, in the above-described embodiment, the substrate inspection apparatus 1 corresponds to an example of the “substrate processing apparatus” of the present invention, the conveyor 31 corresponds to an example of the “conveyor” of the present invention, and the inspection head 5 corresponds to this book. The extrusion unit 4 corresponds to an example of the “extrusion unit” of the present invention, the pusher 43 corresponds to an example of the “pusher” of the present invention, and the extrusion operation corresponds to an example of the “processing head” of the present invention. It corresponds to an example of “moving operation”, the substrate 10 corresponds to an example of “substrate” of the present invention, the inspection position corresponds to an example of “substrate processing position” of the present invention, and the substrate transport direction X corresponds to that of the present invention. This corresponds to an example of “substrate transport direction”. The vertical direction Z corresponds to an example of the “vertical direction” of the present invention, the vertical cylinder 42 corresponds to an example of the “vertical drive unit” of the present invention, and the holding unit 46 is an example of the “holding unit” of the present invention. The horizontal cylinder 41 corresponds to an example of the “rodless cylinder” according to the present invention, the extending member 47 corresponds to an example of the “extending member” according to the present invention, and the sub pusher 57 corresponds to the “sub rod” according to the present invention. This corresponds to an example of “pusher”, and inspection corresponds to an example of “processing” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, the push-out end position Pe at which the pusher 43 finishes the push-out operation is not limited to the above content, and can be changed as appropriate. Further, the stop position of the substrate 10 pushed out of the apparatus may be changed. In such a configuration, for example, the degree to which the substrate 10 is pushed into the storage rack is changed according to the state of the substrate 10 (for example, the quality of the substrate), so that the state of the substrate 10 can be easily determined in a later process. Is possible.

  Specifically, the position of the extrusion end position Pe may be varied in the substrate transport direction X according to the inspection result of the substrate 10. Specifically, for the non-defective substrate 10 whose inspection result is non-defective, the extrusion end position Pe is set so that the entire non-defective substrate 10 can be accommodated in the storage rack 210, while the defective product whose inspection result is defective. For the substrate 10, the extrusion end position Pe may be set such that a part of the defective substrate 10 protrudes from the storage rack 210. Thereby, the quality of the substrate 10 stored in the storage rack 210 can be easily determined.

  Further, the standby position Pw and the extrusion start position Ps of the pusher 43 can be changed as appropriate, and the position where the pusher 43 is returned in the return operation can be changed as appropriate. Further, various configurations of each part of the apparatus such as the extrusion unit 4, the pusher 43, the mechanism for moving the pusher 43, or the type of the conveyor 31 can be appropriately changed.

  In the first and second embodiments, the pre-operation as shown in the third and fourth embodiments may be performed before the extrusion operation. Specifically, after the substrate 10 is moved from the inspection position Pt by the conveyor 31 by a predetermined distance in the substrate transport direction X, the pushing operation by the pusher 43 may be executed.

  In the above embodiment, an example in which the present invention is applied to the substrate inspection apparatus 1 has been described. However, the present invention can also be applied to a component mounter that mounts components on the substrate 10 and a coating apparatus that applies a liquid such as solder to the substrate 10. In such a case, component mounting and liquid application correspond to an example of “processing” of the present invention.

1 ... Substrate inspection device (substrate processing device)
DESCRIPTION OF SYMBOLS 10 ... Board | substrate 31 ... Conveyor 4 ... Extrusion unit 4
41 ... Horizontal cylinder (rodless cylinder)
42 ... Vertical cylinder (vertical drive unit)
43 ... Pusher 43
44 ... Stopper 46 ... Holding part 47 ... Extension member 47
5 ... Inspection head 5 (processing head)
57 ... Sub pusher X ... Substrate transport direction Y ... Width direction Z ... Vertical direction Pt ... Inspection position (substrate processing position)

Claims (12)

In a substrate processing apparatus that processes a substrate and carries it out of the apparatus,
A conveyor that transports the placed substrate in the substrate transport direction and transports it to a substrate processing position ;
A processing head for performing the processing on the substrate carried to the substrate processing position by the conveyor;
A pusher that contacts the substrate that has undergone the processing from the upstream side in the substrate transport direction is provided, and the pusher that has been subjected to the processing at the substrate processing position by a moving operation that moves the pusher to the downstream side in the substrate transport direction. Extrusion unit that extrudes a substrate from the substrate processing position by the pusher and carries it out of the conveyor to the outside of the apparatus and performs a return operation to return the pusher toward the upstream side in the substrate transport direction when the moving operation is completed. It equipped with a door,
Performing the processing on a plurality of the substrates in order and carrying them out of the apparatus,
The extruding unit overlaps a carry-in processing period from when the conveyor starts to carry the substrate toward the substrate processing position until the processing head completes the processing to the substrate at the substrate processing position. Then , the substrate processing apparatus performs the returning operation . The substrate processing apparatus according to claim 1 , wherein the push-out unit returns the pusher to the upstream side in the substrate transport direction of the position of the substrate at the start of the moving operation by the return operation. The push-out unit has a stopper that moves with the pusher, and in the middle of the return operation, the carry-in process is performed by positioning the stopper with respect to a downstream end of the substrate processing position in the substrate transport direction. The substrate processing apparatus according to claim 1, wherein the substrate loaded in a period is stopped at the substrate processing position by the stopper. The extrusion unit includes a vertical drive unit that drives the pusher in a vertical direction, and the vertical drive unit causes the vertical drive unit to perform the vertical drive from the substrate in a section that overlaps the substrate during the carry-in processing period. 4. The substrate processing apparatus according to claim 1, wherein the return operation is performed by returning the pusher while removing the pusher in a direction. The push-out unit includes a holding unit that holds the pusher so as to be movable up and down in the vertical direction, a rodless cylinder that moves the holding unit in the substrate transfer direction, and a substrate transfer direction corresponding to a movement range of the pusher. The substrate processing apparatus according to claim 4 , further comprising: an extending member that extends to the vertical direction and pushes the pusher by moving in the vertical direction, and the vertical driving unit raises and lowers the extending member. The conveyor for a period of time in the extrusion unit is performing the moving operation, the substrate processing apparatus according to any one of claims 1 to 5 wherein not perform loading of the substrate into the substrate processing position. The extrusion unit is a substrate processing apparatus according to any one of the apparatus claims 1 can change the stop position of the substrate that has extruded to the outside 6. The extrusion unit is a substrate processing apparatus according to any one of claims 1 to 7 for adjusting the position of said pusher to said width direction according to the width of the substrate in the width direction perpendicular to the substrate conveying direction . The processing head can perform the processing on the substrate while moving in the substrate transport direction,
The push-out unit further includes a sub pusher attached to the processing head, and the substrate subjected to the processing is moved by pushing the sub head with the sub pusher after moving the processing head, and further pushing the pusher to perform the moving operation. the substrate processing apparatus according to any one of claims 1 to 8 carried out. The extrusion unit, said than the downstream end of the substrate conveying direction to project the pusher of the conveyor, the substrate processing apparatus according to any one of claims 1 performs the moving operation 9. Wherein the processing head is a substrate processing apparatus according to the inspection of the state of the substrate in any one of claims 1 to 10 performed as the process. In the substrate carrying-out method for carrying out the substrate processed by the substrate processing apparatus to the outside of the apparatus,
The substrate that has undergone the processing in the substrate processing position are carried to the substrate processing position by conveyor the placed the substrate is transported to the substrate conveying direction and carries to the substrate processing position, from the conveyor by moving the operation A step of carrying out of the apparatus,
In the moving operation, the pusher built in the substrate processing apparatus is moved to the downstream side in the substrate transport direction while abutting the pusher built in the substrate processing position from the upstream side in the substrate transport direction. is allowed, the Rutotomoni done by pushing by the pusher of the substrate receiving the processing from the substrate processing position,
When the moving operation is completed, a return operation for returning the pusher toward the upstream side in the substrate transport direction is performed,
In carrying out the plurality of substrates to be processed in order to the outside of the apparatus in order, the conveyor starts to carry in the substrate toward the substrate processing position, and then the substrate processing position is transferred to the substrate. The substrate carrying-out method, wherein the returning operation is performed in duplicate in a carrying-in processing period until the processing is completed .

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