JP5760726B2 - Component bonding apparatus, droplet discharge head manufacturing apparatus, and component bonding method - Google Patents

Description

  The present invention relates to a component bonding apparatus and a component bonding method for bonding components having a bonding portion on the surface of a substrate, such as a recording head of an ink jet recording apparatus.

  As one of the products obtained by joining thin parts together, there is an ink discharge nozzle, a so-called ink jet type print head. This ink jet print head includes a plurality of nozzles for ejecting ink droplets, an electromechanical conversion element for changing the volume of an ink reservoir located on the back side of each nozzle, and a heating resistor. An actuator is provided as a main component, and an actuator at a position selected according to a recording signal is driven to compress an ink reservoir and eject ink from a nozzle.

  As one configuration of such a print head, a plurality of piezoelectric elements arranged side by side on a substrate, a vibration plate joined to each piezoelectric element, ink is stored, and a volume change occurs due to displacement of the vibration plate. Thus, there may be mentioned a configuration including a flow path plate having a pressure chamber for changing the pressure in the storage chamber, and a nozzle plate having an ink discharge port facing the vibration plate across the pressure chamber. In a print head having such a configuration, in order to perform high-density and high-quality recording, it is necessary to individually increase the precision of the fine components that make up the head, as well as nozzle plates, diaphragms, and piezoelectrics. Assembling accuracy (positional accuracy between components, that is, bonding accuracy) must be increased when each fine component such as an element is joined and assembled. In particular, even during assembly, if the positional accuracy of the displacement portion of the diaphragm and the flow path plate, and the positional accuracy of the liquid chamber part composed of the nozzle plate, the flow path plate, and the vibration plate are not increased, the ink ejection speed will decrease. As a result, the image quality deteriorates. Therefore, when it is intended to construct an assembly apparatus that automatically joins two fine parts constituting the ink jet head as described above, it is required to improve the alignment accuracy of the two fine parts.

  Therefore, the alignment pin is inserted into the pin insertion hole, the pin holding plate and the mediation plate are joined, and the alignment plate is joined with the alignment plate positioned relative to the mediation plate based on the reference mark and the second alignment mark. Using the tool, the alignment pin is inserted into the positioning hole with the positioning plate placed on the flange, and the positioning member and the alignment jig are positioned to align the plane position of the reference nozzle opening and the first alignment mark. For example, “Patent Document 1” discloses a technique for positioning by positioning a unit head and an alignment jig so that a positioning plate is fixed to a flange portion. In addition, the displacement at the time of pressurization is measured on the parts on the upper stage and the parts on the lower stage to be joined, and the surface inclination setting means positively adjusts the inclination according to the measurement of the gap and load between both stages. It is decided to relieve misalignment by using it, and it is configured to re-pressurize after adjusting the inclination of the upper stage surface and lower stage surface by the surface inclination correction means based on the correction result of this inclination, and the surface inclination A technique using four PZT stages and the like as correction means is disclosed in, for example, “Patent Document 2”.

  However, the technique disclosed in “Patent Document 1” has a problem that the pin cannot be inserted if there is no clearance between the alignment pin and the pin insertion hole, and if this clearance is increased, the alignment accuracy cannot be obtained. Even if an attempt is made to reduce the clearance, considering the assembly, the alignment accuracy is limited to 5 μm, and the positional deviation after joining becomes the same. Further, in the technique disclosed in “Patent Document 2”, the upper stage surface and the lower stage surface are not necessarily parallel at the time of the main pressurization, and as a result, a uniform load on the joint surface is not applied. There is a problem that the bonding reliability cannot be increased from the viewpoint of completely stopping. In addition, the correction amount set by the surface inclination setting means must be successively fed back, and in order to perform feedback as needed, it is necessary to apply a gentle load with a slow load profile. In addition, there is a problem that the time required for the measurement by the surface inclination setting means and the time required for correcting the surface inclination are also required, and the tact time is increased.

  The present invention solves the above-mentioned problems, and in a method of adjusting the parallelism by causing the parts to be brought into contact with each other with a first pressure (weak pressure) and making them follow, the parts are copied and held in that state. It is possible to adjust the joining position with high accuracy in order to align without separating, by pressing the parts with a second pressure (strong pressure) via an adhesive after releasing the copying holding state, The purpose is to provide a technique capable of easily performing high-precision pressure-bonding bonding without causing a displacement of the pressing position because the parallelism between components is maintained even when the pressing force is increased. . By performing such bonding, the positional deviation after pressure bonding can be made within 1 μm, and the parallelism between the bonding surfaces during pressing can be easily adjusted, so bonding with a uniform load can be performed. It is possible to obtain high bonding quality with a uniform adhesive film thickness.

According to a first aspect of the present invention, there is provided a first holding means and a second holding means for holding a first component and a second component, which are bonded to each other and adhesive is applied to at least one bonding surface, A pressurizing unit that contacts and pressurizes each component, a copy-holding unit that temporarily holds the posture in a state in which the other component is in contact with and pressurized with respect to one of the components as a reference, and each component is provided Alignment means for performing relative alignment of each of the parts based on the alignment mark provided, and the other part with respect to one of the parts serving as a reference at a first pressure by the pressing means. contact is, the temporarily holding the respective parts by the copying holding means in a state where the bonding surfaces are in close contact with each other, wherein each component by said alignment means in a state in which the each component into contact via the adhesive After the alignment is performed and the copying holding unit is released after the alignment, the second component which is larger than the first pressure by the pressing unit is placed on the other component with respect to the one component serving as a reference. The components are brought into contact with each other by pressure and the components are joined via the adhesive.

  According to a second aspect of the present invention, in the component joining apparatus according to the first aspect, the first holding means and the second holding means further release the vacuum suction means for holding the first part and the second part, and release the holding. It has the release means to perform, respectively, It is characterized by the above-mentioned.

  According to a third aspect of the present invention, in the component joining apparatus according to the first or second aspect, the alignment unit further includes a position detection unit that detects a relative displacement of the alignment marks, and alignment of the components. And a position adjusting means for performing adjustment.

  According to a fourth aspect of the present invention, in the component joining apparatus according to any one of the first to third aspects, the position and load of the pressing means can be controlled.

  According to a fifth aspect of the present invention, in the component joining apparatus according to any one of the first to fourth aspects, the copying holding means further includes a spherical surface having a convex spherical surface provided integrally with the second holding means. A member, a bearing member having a concave spherical surface for receiving the convex spherical surface, a receiving member having a concave spherical surface for receiving the bearing member, and a locking means capable of holding and releasing the posture of the second holding means, When the respective parts are brought into contact with and pressurized by the first pressure by the pressurizing means, the second holding means is displaced by the copying operation of the respective parts, and the parallelism of the respective parts is adjusted. It is characterized by.

  A sixth aspect of the present invention is a droplet discharge head manufacturing apparatus using the component bonding apparatus according to any one of the first to fifth aspects, wherein the first component and the second component are a diaphragm, It is a channel plate.

  A seventh aspect of the present invention is a droplet discharge head manufacturing apparatus using the component bonding apparatus according to any one of the first to fifth aspects, wherein the first component and the second component are a nozzle and a flow. It includes a road plate.

The invention according to claim 8 is the step of applying two kinds of adhesives to at least one of the first part and the second part to be joined together, and the first holding means so that the parts face each other. And a step of holding by the second holding means, a step of pressing each of the parts with each other and then applying a low pressure, and contacting and pressing the other part against one of the reference parts The process of maintaining this posture in a state where the parts are in close contact with each other, and the relative positions of the parts based on the alignment marks provided on the parts while the parts are kept in contact with the adhesive. A step of aligning, a step of once releasing the contact-like body of each component after the alignment, and then pressurizing and bonding each component under high pressure using a first adhesive; and pressurizing and bonding under high pressure Each cured member is UV cured And a step of temporarily fixing the second adhesive, characterized by joining the respective parts in the state through the first and second adhesive.

  According to the present invention, after the parallelism between the first part and the second part is adjusted by the copying operation under the first pressure which is a low pressure, this state is temporarily held and the parts are separated from each other. By performing the alignment without any adjustment, the parallelism of each component is adjusted, and the alignment can be performed in a state where a uniform load is applied to the joint surface of each component. Therefore, the alignment can be performed with high accuracy. Further, after the alignment is completed, each part is pressurized and joined with the second pressure, which is a strong pressure after the holding state is released, so that the pressure is gradually increased, so that the second is caused by the bending of the pressing means. Even if the fixed base is tilted, the second part can follow the first part and the parallelism can be constantly maintained, so that the position shift during pressurization and uneven load is applied to each part. This can be prevented.

It is the schematic of the component joining apparatus which employ | adopted one Embodiment of this invention. It is a flowchart explaining joining operation | movement of the 1st component and 2nd component by the components joining apparatus in one Embodiment of this invention. It is a principal part schematic of the component joining apparatus used for one Embodiment of this invention. It is the schematic of the droplet discharge head produced using one Embodiment of this invention. It is the schematic which shows the 2nd component used for one Embodiment of this invention. It is the schematic which shows the 1st component used for one Embodiment of this invention. It is the schematic which shows the state with which the 1st component and 2nd component which were used for one Embodiment of this invention were piled up. It is the schematic explaining the positional error amount between the center positions of the 1st component and the 2nd component in one embodiment of the present invention. It is the schematic explaining the force F which generate | occur | produces when two planes of the upper and lower two area A which pinched | interposed the viscoelastic body (viscosity k) of thickness h in one Embodiment of this invention move with the relative speed U. is there. It is the schematic which shows the state of the copying holding means when the deformation | transformation resulting from the rigidity of the 2nd fixed base has arisen during the pressurization by the pressurization means in one Embodiment of this invention. 1 is a schematic diagram illustrating an example of a side shooter type recording head to which an embodiment of the present invention can be applied.

  4 to 6 show a schematic configuration of a piezo (PZT) type print head which is a droplet discharge head used in an embodiment of the present invention. As shown in FIG. 4, the piezo-type print head 41 includes a drive unit 43 and a liquid chamber unit 42 joined thereto. The drive unit 43 includes a plurality of piezoelectric element drive units 54a and support column parts 54b arranged alternately on the PZT base 55, and the piezoelectric element drive unit 54a and the support column parts 54b are arranged at predetermined intervals. 55 is joined.

  The liquid chamber unit 42 includes a nozzle plate 51 having a plurality of nozzles 58 for discharging ink droplets, and a flow path plate 52 having a plurality of liquid chambers 57 formed corresponding to the nozzles 58 as shown in FIG. 6 and a vibration plate 53 corresponding to each liquid chamber 57 and transmitting the vibration of the piezoelectric element driving portion 54a to each liquid chamber 57, as shown in FIG. The nozzle plate 51 and the flow channel plate 52, and the flow channel plate 52 and the vibration plate 53 are joined via an adhesive 56 applied to the upper and lower surfaces of the flow channel plate 52. The liquid chamber unit 42 is supplied with ink supplied by an ink supply mechanism (not shown) to each liquid chamber 57. The upper surfaces of the piezoelectric element driving portions 54a and the column portions 54b of the driving unit 43 are adhesively bonded to the lower surface of the liquid chamber unit 42 via an adhesive 56, and by selectively driving the piezoelectric element driving portion 54a. Ink droplets are ejected from the nozzles 58 of the liquid chamber unit 42.

  In order to provide a high-quality print head with the above-described configuration, the nozzle plate 51 and the flow channel plate 52, the flow channel plate 52 and the vibration plate 53, and the liquid chamber unit 42 that drive the liquid chamber unit 42 are driven. It is necessary to join the unit 43 with high accuracy via the adhesive 56. However, in joining parts, if there is a difference in relative inclination between the holding means for holding each part due to variations in the thickness of the adhesive applied between the parts or the surface properties of the parts, Variations in the velocity gradient of the adhesive in the horizontal plane result in deviations in the pressure positions of the parts.

  As shown in FIG. 9 (A), the force F generated when the two upper and lower planes of area A sandwiching a viscoelastic body (viscosity k) having a thickness h move at a relative speed U is F = KAU / h. That is, when a vertical force is applied to the adhesive by bonding pressure, the adhesive is crushed and spreads in the horizontal direction at the same time, proportional to the velocity gradient (U / h) in the viscoelastic body when spreading, A force F is generated to move the upper part or the lower part laterally. When this is considered in the entire horizontal plane, the resultant force in the entire horizontal plane is the force applied to each part.

  Also, as shown in FIG. 9B, when there is a relative inclination between the upper and lower two planes (h12 <h02), the left side speed gradient (U12 / h12) is the right side speed gradient (U02 / h02). Therefore, the leftward force ΔFc acts on the part. The leftward force ΔFc acting on the component at this time is ΔFc = F02−F12 = kA2 (U02 / h02−U12 / h12).

  Similarly, when the relative inclination between the upper and lower parts is adjusted, the left and right speed gradients are equalized by pressurization, so that the forces applied to the left and right parts are equal, and the parts are identified. Misalignment of components can be prevented without generating a force to move in the direction. This means that the horizontal force generated by the inhomogeneity of the flow of the adhesive can be suppressed by preventing the relative inclination of the surface between the upper and lower parts during pressurization, thus preventing the occurrence of misalignment. can do.

  Next, the structure of the component joining apparatus which shows one Embodiment of this invention is demonstrated. Thereafter, the vibration plate 53 described above is used as the first component 2 and the flow path plate 52 is used as the second component 3, and the component bonding apparatus 1 for bonding the two is a position detection provided in each of the components 2 and 3. The reference alignment mark is detected, and the positions of the components 2 and 3 are adjusted based on the detection result.

  1 and 3 show a state in which the first component 2 and the second component 3 are supplied to the component bonding apparatus 1, and the first component 2 is fixed to the first fixed base 6. The first holding means 8 is vacuum-sucked and held, and the suction is released by a release means (not shown). Similarly, the second component 3 is vacuum-sucked and held by the second holding means 9 fixed to the second fixed base 7 and is released from suction by a release means (not shown). The first fixed base 6 is fixed to the apparatus main body 17 of the component bonding apparatus 1.

  As shown in FIG. 5, alignment marks 5a and 5b for position detection are formed on both ends of the second component 3, and alignment for position detection is also formed on both ends of the first component 2 as shown in FIG. Marks 4a and 4b are formed. The alignment marks 4a and 4b are formed by through holes, and are configured to be able to detect the alignment marks 5a and 5b through the alignment marks 4a and 4b as shown in FIG.

  As shown in FIG. 1, the component joining apparatus 1 includes a position detection unit 16 that detects a relative displacement between the alignment marks 4 a and 4 b and the alignment marks 5 a and 5 b, and a relative position of each of the components 2 and 3. An alignment stage 14 that can move in the XYθ direction and a pressurizing unit 15 are provided as position adjusting units that perform alignment. The position detection means 16 is an image pickup means having two or more fields of view, and is disposed on the upper part of the first holding means 8 and has a slight gap between the parts 2 and 3 before the pressure bonding. The alignment marks 5a and 5b can be detected via the alignment marks 4a and 4b both in the state and after the pressure bonding and in a state in which the two are completely in close contact with each other. The first holding means 8 has a see-through window (through hole) at the center thereof, and the parts 2 and 3 sucked and held immediately below the first holding means 8 are arranged with a slight gap. The position detection means 16 detects the alignment marks 5a and 5b through the alignment marks 4a and 4b.

  The alignment stage 14 is driven by a driving means (not shown) so that the second component 3 held by the second holding means 9 is rotated in the horizontal direction, the paper surface direction, and the rotation direction about the vertical axis in FIG. Move each one. The alignment stage 14 is driven in accordance with the detection result by the position detection means 16, and the alignment means that performs relative alignment of the components 2 and 3 by the alignment stage 14 and the position detection means 16 is configured. The pressurizing means 15 is configured by an electrically controlled actuator such as an air cylinder, and is configured to be guided and driven by an air bearing that requires a stroke of several tens of mm to generate a continuous load. . Further, the load can be controlled by the built-in load detecting means, and the position can be controlled by the built-in position detecting means.

  Next, the copying holding means of the present invention will be described with reference to FIG. The copying holding means 24 includes a spherical member 26 having a convex spherical surface 25 provided integrally with the second fixed base 7, a bearing member 29 having a concave spherical surface 27 that receives the convex spherical surface 25, and a concave member that receives the bearing member 29. And a receiving member 28 having a spherical surface. The spherical member 26 is configured such that the convex spherical surface 25 is movable along the concave spherical surface 27 via a bearing member 29 having an air floating mechanism, and when the components 2 and 3 are brought into contact with each other by this movement, The parallelism between the two is automatically configured to substantially match. The air supply to the concave spherical surface 27 is performed by compressed air supplied from the air supply port 34, thereby constituting an air floating mechanism.

  Further, a cylinder 30 and a piston 31 provided so as to be movable up and down by air pressure are disposed through the spherical member 26, the bearing member 29 and the receiving member 28, and air is supplied to the lock port 32. As a result, the piston 31 is moved downward to lock the position and posture of the spherical member 26 with respect to the receiving member 28 via the piston 31, and by supplying air to the free port 33, the piston 31 is moved upward and locked. The spherical member 26 is configured to freely follow the receiving member 28 by releasing the. The lock port 36 and the free port 33 constitute a lock means 36. At this time, the first component 2 is evacuated from the vacuum port 12 by a vacuum pump (not shown) and is sucked and held by the vacuum suction hole 10 of the first holding means 8. The second part 3 is also evacuated from the vacuum port 13 by a vacuum pump (not shown) and is sucked and held by the vacuum suction hole 11 of the second holding means 9. The vacuum port 35 is connected to a vacuum pump (not shown), and is configured to hold the convex spherical surface 25 and the concave spherical surface 27 with a holding force weaker than the holding force by the lock means 36 by vacuum suction by the operation of the vacuum pump. ing. As the locking means in the copying holding means 24, the above-described locking means 36 may be used, or a vacuum suction mechanism using the vacuum port 35 may be used.

  Next, the parallelism adjustment operation of the holding means 8 and 9 that hold the components 2 and 3 will be described. First, air is supplied to the free port 33 to make the spherical member 26 free with respect to the receiving member 28. From this state, the pressurizing means 15 is operated to raise the second holding means 9. The second part 3 is pressed against the first part 2 by this rise, so that the second part 3 follows the first part 2, that is, between the second part 3 and the first part 2. It is imitated so that the parallelism is almost uniform. After this copying operation, air is supplied to the lock port 32, and the spherical member 26 can be temporarily held with respect to the bearing member 29 in a state where the parallelism is adjusted as described above. Since the spherical member 26 is held in a fixed positional relationship with the second component 3 via the second fixed base 7, the first component 2 and the second component 3 are held by holding the spherical member 26. The parallelism is also maintained in an adjusted state.

  The operation of joining the first component 2 and the second component 3 while adjusting the position in the component joining apparatus 1 having the above-described configuration will be described based on the flowchart shown in FIG.

  First, two types of adhesives are applied to the second component 3 (ST01). Here, one is a first adhesive for joining the components 2 and 3, and the other is a second adhesive for temporarily fixing the components 2 and 3. As the first adhesive, an epoxy-based adhesive that takes a long time to cure is suitable, and this is applied to the entire surface of the second component 3 so as to be uniform. As the second adhesive, a UV adhesive that is instantly cured by irradiating ultraviolet rays is suitable, and this is applied to the four corners of the second component 3.

  Next, the first component 2 is fixed at a predetermined position of the first fixed base 6 by vacuum suction by the first holding means 8, and the second part is fixed by vacuum suction by the second holding means 9. The component 3 is fixed at a predetermined position of the second fixed base 7 (ST02). Then, air is supplied to the free port 33 so that the spherical member 26 can move freely with respect to the receiving member 28.

  Next, the pressurizing means 15 is operated so that the parts 2 and 3 are opposed to each other with a slight gap so that the second part 3 is brought close to the first part 2, and the parts 2 and 3 are The alignment marks 4a and 4b are detected by the position detection means 16 in the close state, and the center coordinates (Xs, Ys, θs) of the first component 2 are calculated by a control means (not shown) equipped with an image processing system. The initial position of the second part 3 is changed with respect to the calculated center coordinates, and the second part 3 is roughly placed at a position where the alignment marks 5a and 5b can be reliably detected via the alignment marks 4a and 4b. After the adjustment, the alignment marks 5a and 5b are detected by the position detection means 16 via the alignment marks 4a and 4b, and the center coordinates (Xr, Yr, θr) of the second component 3 are calculated by a control means (not shown). If the amount of positional deviation (ΔXu, ΔYu, Δθu) between the center coordinates is outside the specified value, the alignment adjustment of the second component 3 is performed by the alignment stage 14 (ST03).

  Next, the second component 3 is raised by the operation of the pressurizing means 15, and the second component 3 is brought into contact with the first component 2 with a first pressure (for example, 5 N) which is a weak load. In this state, the second component 3 is caused to be substantially parallel to the first component 2 by the action of the copying holding means 24. After this copying operation, air is supplied to the lock port 32, and the spherical member 26 is temporarily held with respect to the receiving member 28 in a state where the parallelism of the components 2 and 3 is adjusted (ST04). Since the spherical member 26 is held so as to be in a fixed positional relationship with the second component 3 via the second fixed base 7, the parallelism between the components 2 and 3 is also maintained by holding the spherical member 26. The adjusted state is maintained.

  In the case of the two-field system, as shown in FIG. 8, after the respective centers of the alignment marks 4a, 4b, 5a, 5b are detected, the respective calculation calculated from the alignment marks 4a, 4b, 5a, 5b. The center position, that is, the center coordinates (Xs, Ys, θs) of the first part 2 in the horizontal plane and the center coordinates (Xr, Yr, θr) of the second part 3 in the horizontal plane are obtained, and the respective center positions are obtained. The positional error amounts (ΔXu, ΔYu, Δθu) between the center positions of the parts 2 and 3 are set such that (ΔXu, ΔYu, Δθu) = (Xs, Ys, θs) − (Xr, Yr, θr). The second component 3 is corrected using the alignment stage 14 with the first component 2 as a reference (ST05). In the present embodiment, the position of the second component 3 in the horizontal plane is corrected in the X direction, the Y direction, and the θ direction with reference to the position of the first component 2. On the contrary, the second component 3 is corrected. The position on the first component 2 side may be corrected using the position of 3 as a reference.

  Next, the holding by the copying holding unit 24 is released (ST06), and then the second component 3 is brought into contact with the first component 2 with a second pressure (for example, 100 N) that is a load stronger than the first pressure. . At this time, even if the deformation caused by the rigidity of the second fixed base 7 occurs due to the force acting at the time of pressurization, since the holding of the copying holding means 24 is released, the second fixed base 7 is fixed to the first fixed base 7. It is possible to follow the base 6 (ST07), and no relative inclination occurs between the fixed bases 6 and 7 during pressurization. As described above, by adjusting the parallelism of the components 2 and 3 even during pressurization, a large flow of the adhesive does not occur, and the occurrence of displacement due to sliding is prevented. Moreover, since the joining state of each component 2 and 3 is a uniform and favorable state, joining quality can be ensured.

  Thereafter, the bonded parts 2 and 3 are irradiated with ultraviolet rays to cure the second adhesive applied to the four corners of the second part 3 (ST08). As a result, the components 2 and 3 are temporarily joined, and the temporarily joined state can be maintained even if the pressurized state is released. Then, the parts 2 and 3 temporarily joined from the part joining apparatus 1 are taken out (ST09). With this series of operations, the joining operation between the first component 2 and the second component 3 using the component joining apparatus 1 is completed.

  With the configuration described above, this state is temporarily maintained after the parallelism of the parts 2 and 3 is adjusted by the copying operation under the first pressure which is a low pressure, and the parts 2 and 3 can be positioned without being separated. By aligning, the parallelism of the parts 2 and 3 is adjusted, and the alignment can be performed in a state where a uniform load is applied to the joint surfaces of the parts 2 and 3, so that the position adjustment is performed with high accuracy. Can do. Further, after the alignment is completed, the parts 2 and 3 are pressure-bonded with a second pressure which is a strong pressure after the holding state is released, so that the pressure is gradually increased, so that the pressing means 15 is bent. Even if the second fixed base 7 is tilted, the second component 3 can follow the first component 2 so that the parallelism can be constantly maintained. It is possible to prevent the non-uniform load from being applied to 2 and 3. Thereby, it is possible to perform highly reliable bonding with a uniform film thickness in adhesive bonding. Moreover, since the releasing means of the copying holding means 24 is a simple sequence based only on the operation of the electromagnetic valve, it is possible to prevent an increase in tact time.

  FIG. 10 is a diagram illustrating a state of the copying holding unit 24 when the deformation due to the rigidity of the second fixed base 7 occurs during the pressurization by the pressurizing unit 15 in Step ST07 of FIG. As shown in the figure, even when the inclination is caused by an angle θ due to deformation caused by bending, the air floating mechanism rotates between the convex spherical surface 27 of the spherical member 26 and the concave spherical surface 27 of the spherical bearing 29. Since it is flexible, it is possible to adjust the parallelism of the components 2 and 3 by returning the inclination.

  In the above embodiment, the first component 2 is the diaphragm 53 and the second component 3 is the flow path plate 52. However, the first component is the nozzle plate 51 and the second component is the flow path plate 52. In the case where the parts are to be included and pressure-bonded by adjusting their positions, the alignment marks 4a ′ and 4b ′ are provided on the nozzle plate 51 and the alignment marks 5a ′ and 5b are provided on the flow path plate 52 as shown in FIG. 'Is provided and the position is adjusted using these.

  The ink jet recording head as a droplet discharge head bonded using the present invention may be of a side shooter type in which the direction of the ink flow path and the direction of the discharge port are different. An example of a side shooter type recording head is shown in FIG. In the recording head 60 shown in FIG. 11, an orifice 65 is provided on the top plate 63, and the flow direction of ink to the ejection energy acting portion in the flow path 64 and the opening central axis of the orifice 65 are perpendicular to each other as indicated by a one-dot chain line 62. It has the structure which comprises. Reference numeral 61 denotes a substrate.

  With this configuration, energy from PZT (piezo) can be more efficiently converted into kinetic energy for ink droplet formation and flight, and meniscus can be restored by supplying ink. There is a structural advantage of being fast. Further, in the side shooter system, when the bubbles grow and reach the orifice 65, the bubbles are communicated with the atmosphere, and the shrinkage of the bubbles due to a decrease in temperature does not occur. Therefore, it is possible to extend the life of the recording head.

DESCRIPTION OF SYMBOLS 1 Component joining apparatus 2 1st component 3 2nd component 8 1st holding means 9 2nd holding means 14 Position adjustment means (alignment stage)
15 Pressurizing means 16 Position detecting means 24 Copying holding means 25 Convex spherical surface 26 Spherical member 27 Concave spherical surface 28 Receiving member 29 Bearing member 36 Locking means 52 Channel plate 58 Nozzle 41, 60 Droplet ejection head (recording head)

JP 2010-58359 A JP 2008-6609 A

Claims (8)

A first holding means and a second holding means for holding the first part and the second part, respectively, which are joined to each other and adhesive is applied to at least one joining surface;
A pressurizing means for contacting and pressurizing each component;
A copy holding means for temporarily holding the posture in a state in which the other component is in contact with and pressed against the one component serving as a reference;
Alignment means for performing relative alignment of each component based on alignment marks provided on each component;
The other part is brought into contact with the one part serving as a reference by the pressure means by the first pressure, and the parts are temporarily held by the copying holding means in a state where the joint surfaces are in close contact with each other. One of the components serving as a reference after the relative positioning of the components is performed by the alignment unit in a state where the components are in contact with each other through the adhesive, and the copying holding unit is released after the alignment. The other part is brought into contact with the second pressurizing means at a second pressure larger than the first pressure, and the parts are joined together via the adhesive. . The component joining apparatus according to claim 1,
The component holding apparatus, wherein the first holding means and the second holding means each have a vacuum suction means for holding the first component and the second component and a release means for releasing the holding. In the component joining apparatus according to claim 1 or 2,
2. The component joining apparatus according to claim 1, wherein the alignment unit includes a position detection unit that detects a relative displacement between the alignment marks, and a position adjustment unit that performs alignment adjustment of the components. In the component joining apparatus according to any one of claims 1 to 3,
The pressure bonding means is capable of controlling a position and a load, and a component joining apparatus characterized by the above. In the component joining apparatus according to any one of claims 1 to 4,
The copying holding means includes a spherical member having a convex spherical surface provided integrally with the second holding means, a bearing member having a concave spherical surface for receiving the convex spherical surface, and a receiving member having a concave spherical surface for receiving the bearing member. And a lock means capable of holding and releasing the posture of the second holding means, and when the parts are brought into contact with and pressurized by the pressure means with the first pressure, The component joining apparatus, wherein the second holding means is displaced by the copying operation to adjust the parallelism of the components.   A droplet discharge head manufacturing apparatus using the component bonding apparatus according to any one of claims 1 to 5, wherein the first component and the second component are a vibration plate and a flow path plate. A droplet discharge head manufacturing apparatus.   A droplet discharge head manufacturing apparatus using the component bonding apparatus according to any one of claims 1 to 5, wherein the first component and the second component include a nozzle and a flow path plate. Droplet discharge head manufacturing apparatus. A process of applying two types of adhesives to at least one of the first part and the second part to be joined together, and the parts are held by the first holding means and the second holding means so as to face each other. A step of pressing the components with low pressure after bringing the components into contact with each other, and a state in which the components are brought into close contact with each other by contacting and pressing the other component with respect to the reference component The step of holding this posture, the step of performing relative positioning of the respective parts based on the alignment marks provided on the respective parts while keeping the respective parts in contact with each other via the adhesive, and the position After releasing the adhesion of the parts once after the alignment, a step of pressure-bonding the parts under high pressure using a first adhesive, and UV-curing the members pressure-bonded under strong pressure By the second adhesive of the mold And a step of fixing, component bonding method characterized by joining the respective parts in the state through the first and second adhesive.

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