JP5756657B2 - Method for producing metal plating material - Google Patents

Description

  The present invention relates to a method for producing a metal plating material. More specifically, the present invention relates to a method for manufacturing a metal plating material useful for, for example, a patterned electrode. According to the method for producing a metal plating material of the present invention, when a flexible material is used as a base material, a flexible conductive film that can be bent without taking a complicated method such as metal vapor deposition is provided. Since the metal plating material which has it can be manufactured easily, it is anticipated that the metal plating material which has a flexible conductive film will be mass-produced industrially. The metal plating materials such as patterned electrodes obtained by the method for producing a metal plating material of the present invention are expected to be applied to electronic devices and the like. Further, the metal plating material is expected to be used for applications such as diaphragm pumps and artificial muscles.

  In the specification of the present application, the metal plating material means a material in which metal plating is performed on the surface. In the present specification, ion implantation includes the concept of ion irradiation.

  Conventionally, as a method for producing an electrode material having a predetermined electrode pattern, for example, a masking tape is applied to a current collector made of a metal foil, an electrode mixture is applied onto the metal foil to which the masking tape is applied, and dried. There is known a method for producing an electrode in which an electrode mixture is formed by peeling the masking tape from the current collector after the formation of the electrode mixture (see, for example, [Claim 1] of Patent Document 1). However, since the masking method is adopted in this electrode manufacturing method, when the masking tape is peeled off, the electrode mixture layer follows the masking tape and the electrode mixture layer is formed at the boundary between the masking tape and the electrode mixture layer. Since it peels, there exists a fault that the quality of an electrode falls.

  In addition, as a method of manufacturing an electrode material having another electrode pattern, for example, a photosensitive resin layer forming step for forming a photosensitive resin layer on a substrate, and exposing the photosensitive resin layer to expose a latent image of the pattern There has been proposed an electrode manufacturing method using a photolithography method comprising an exposure step for forming a pattern, a development step for forming a pattern by developing the photosensitive resin layer, and a baking step for baking the formed pattern. (For example, see paragraph [0133] of Patent Document 2). However, this electrode manufacturing method requires four complicated steps of forming a photosensitive resin layer, an exposure step, a developing step, and a baking step, and it takes a long time to manufacture the electrode. There is a disadvantage that it is inefficient.

JP 2010-027798 A JP 2010-243816 A

  The present invention has been made in view of the above prior art, and does not require a masking tape, and is a metal plating material that can manufacture a metal plating material more efficiently than a method of manufacturing an electrode using a photolithography method. It is an object to provide a manufacturing method.

The present invention
(1) A method for producing a metal plating material using a polymer material as a substrate , wherein a polymer electrolyte material is used as the polymer material, and the polymer electrolyte material is passed through a mask having a predetermined pattern. A method for producing a metal plating material, characterized by performing electroless plating on the polymer electrolyte material after ion implantation on the surface;
(2) The metal plating according to (1), wherein the polymer electrolyte material is a polymer having at least one functional group selected from the group consisting of a sulfonic acid group, a carboxyl group, a phosphoric acid group, and a boric acid group. (3) Metal plating according to (1) or (2) above, wherein the amount of ion implantation into the surface of the polymer electrolyte material is 1 × 10 ¹¹ to 1 × 10 ²⁰ ions / cm ² The present invention relates to a material manufacturing method.

  According to the present invention, there is an excellent effect that a metal plating material can be manufactured more efficiently than a method of manufacturing an electrode using a photolithography method without requiring a masking tape.

It is a figure which shows the X-ray photoelectron spectroscopy spectrum about the binding energy of C1s derived from the carbon atom of the fluororesin film | membrane before ion implantation and the fluororesin film | membrane ion-implanted by manufacture examples 1-4. It is a figure which shows the X-ray photoelectron spectroscopy spectrum about the binding energy of F1s derived from the fluorine atom of the fluororesin film | membrane before ion implantation and the fluororesin film | membrane ion-implanted by manufacture examples 1-4. It is a figure which shows the X-ray photoelectron spectroscopy spectrum about the binding energy of O1s derived from the oxygen atom of the fluororesin film | membrane before ion implantation and the fluororesin film | membrane ion-implanted by manufacture examples 1-4. It is a figure which shows the X-ray photoelectron spectroscopy spectrum about the binding energy of S2p3 / 2 derived from the sulfur atom of the fluororesin film | membrane before ion implantation and the fluororesin film | membrane ion-implanted by manufacture examples 1-4. It is a figure which shows the Fourier-transform infrared spectroscopy spectrum of the fluororesin film | membrane before ion implantation, and the fluororesin film | membrane ion-implanted by manufacture examples 1-4. It is a figure which shows the result of having investigated the tensile strength of the fluororesin film | membrane before ion implantation, and the fluororesin film | membrane ion-implanted by the manufacture examples 1-4.

  The method for producing a metal plating material of the present invention is a method for producing a metal plating material using a polymer material. The polymer electrolyte material is used as the polymer material, and the high-density metal plating material is passed through a mask having a predetermined pattern. After performing ion implantation on the surface of the molecular electrolyte material, the polymer electrolyte material is subjected to electroless plating.

  When manufacturing electrodes using a masking tape, the present inventors follow the masking tape when the masking tape is peeled off, and the electrode layer peels off together with the masking tape. As a result of extensive research to develop a method that can efficiently produce an electrode material patterned into an electrode pattern, a polymer material is used instead of a metal substrate. In particular, when a polyelectrolyte material was used and ion implantation was performed on the surface of the polyelectrolyte material through a mask and then electroless plating was performed on the polyelectrolyte material, the ion implantation was performed. It was found that the plating film was not formed at the location and the plating film was formed at the location where the ion implantation was not performed. The present invention has been completed based on such findings.

  In the present invention, a polymer electrolyte material is used as the polymer material constituting the plating substrate.

  The polymer constituting the polymer electrolyte material is preferably a polymer having at least one functional group selected from the group consisting of a sulfonic acid group, a carboxyl group, a phosphoric acid group, and a boric acid group. Since the amount of the functional group contained in the polymer constituting the polymer electrolyte material varies depending on the electroless plating conditions and the use of the metal plating material, it cannot be determined unconditionally, so ions are present in the polymer electrolyte material. It is preferable to adjust appropriately within a range in which the metal plating film is not formed in the injected portion and the metal plating film can be formed in the portion where ions are not injected into the polymer electrolyte material.

  Specific examples of the polymer having a suitable functional group include a sulfonic acid group-containing polymer, a carboxyl group-containing polymer, a phosphoric acid group-containing polymer, a boric acid group-containing polymer, and these polymers are used alone. Two or more types may be used in combination. The polymer having a functional group can be prepared, for example, by polymerizing a monomer component including a monomer having the functional group, and a functional group can be introduced into the polymer by modifying the polymer. . For example, a sulfonic acid group-containing polymer can be prepared by polymerizing a monomer component containing a sulfonic acid group-containing monomer such as styrene sulfonic acid or sulfonic acid group-containing (meth) acrylate, and can also be sulfonated. Can be prepared.

  Examples of the base polymer used in the polymer having the functional group include a fluorine resin such as polytetrafluoroethylene, an acrylic resin, an epoxy resin, a phenol resin, a polyester such as polyethylene terephthalate, a polysulfone, a polyamide, a polyimide, a polycarbonate, and a polyacetal. , Polystyrene, polyphenylene ether, polyarylate, polyphenylene sulfide, and the like, but the present invention is not limited to such examples. These base polymers are preferably selected and used as appropriate according to the application of the metal plating material.

  The shape of the polymer electrolyte material is preferably determined according to the use of the metal plating material. Examples of the shape of the polymer electrolyte material include a film shape, a plate (plate) shape, a spherical shape, a linear shape, a rod (rod) shape, a fiber shape, a mesh shape, and the like. It is not limited.

  In the present invention, first, a mask having a predetermined pattern is placed on a polymer electrolyte material to be subjected to electroless plating.

  As the mask, a mask made of a material that does not transmit ions when ion implantation is performed is preferable. Examples of the material constituting the mask include a plate made of a metal material such as aluminum, stainless steel, copper, iron, and brass, and a resin film such as a fluororesin film and a polyester film. It is not limited to only. The pattern formed on the mask is not particularly limited, and is preferably determined as appropriate according to the use of the metal plating material. Further, the thickness of the mask differs depending on the material used for the mask and cannot be determined unconditionally. However, from the viewpoint of performing electroless plating on a pattern having a predetermined shape with accuracy, it is usually in the range of about 10 μm to 3 mm. It is preferable to select from the above.

  When ion implantation is performed on the surface of the polymer electrolyte material through the mask, ions are not implanted into the polymer electrolyte material covered with the mask. Since ions are implanted into the molecular electrolyte material, electroless plating is not performed.

  Ion implantation into the polymer electrolyte material can be performed using an ion implantation apparatus. Examples of ion species implanted into the polymer electrolyte material include ions of rare gases such as helium, neon, argon, krypton, and xenon; ions such as hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, and fluorine; methane, ethane Ions of alkane gases such as propane, butane, pentane and hexane; ions of alkene gases such as ethylene, propylene, butene and pentene; ions of alkadiene gases such as pentadiene and butadiene; alkynes such as acetylene and methylacetylene Gas ion; ion of aromatic hydrocarbon gas such as benzene, toluene, xylene, indene, naphthalene and phenanthrene; ion of cycloalkane gas such as cyclopropane and cyclohexane; cycloalkene such as cyclopentene and cyclohexene Ions of gold, silver, copper, platinum, nickel, palladium, chromium, titanium, molybdenum, niobium, tantalum, tungsten, aluminum, and the like. It is not limited.

  Examples of the method of implanting ions include a method of irradiating a polymer electrolyte material with an ion beam accelerated by an electric field, and a method of implanting plasma ions into the polymer electrolyte material. It is not limited to only.

The amount of ions implanted into the surface of the polymer electrolyte material is preferably 1 × 10 ¹¹ ions / cm ² or more, more preferably from the viewpoint of clarifying the boundary between the portion to be electrolessly plated and the portion that is not. Is 1 × 10 ¹² ions / cm ² or more, more preferably 1 × 10 ¹³ ions / cm ² or more, even more preferably 1 × 10 ¹⁴ ions / cm ² or more, and particularly preferably 1 × 10 ¹⁵ ions / cm ² or more. From the viewpoint of increasing production efficiency, it is preferably 1 × 10 ²⁰ ions / cm ² or less.

  In the polymer electrolyte material, the depth of the portion into which ions are implanted can be easily controlled by adjusting ion implantation conditions such as the type of ions, applied voltage, and application time. Further, the depth of the portion into which ions are implanted is preferably about 10 nm to 5 μm, preferably about 10 nm to 3 μm, from the viewpoint of efficiently producing an electrode material patterned into a predetermined electrode pattern. It is more preferable. The depth of the portion into which ions are implanted can be confirmed, for example, by analyzing the chemical structure change in the thickness direction of the polymer electrolyte material by X-ray photoelectron spectroscopy (XPS).

  Next, electroless plating is performed on the ion-implanted polymer electrolyte material. The method for applying electroless plating is not particularly limited as long as it is a generally adopted method.

  Examples of the metal used in the plating solution used when performing electroless plating on the polymer electrolyte material include platinum, gold, silver, copper, nickel, palladium, etc., but the present invention is only such examples. It is not limited to. These metals may be used alone or in combination of two or more. Usually, the metal is preferably used as a metal ion complex in order to be dissolved in water. Examples of the metal complex include dichlorotetraammineplatinum (II), diaminedinitroplatinum (II), dichlorodiamineplatinum (II), ammonium tetrachloroplatinate (II), and the present invention is only such examples. It is not limited to. Although the metal concentration in a plating solution is not specifically limited, Usually, it is preferable that it is about 0.3-10 g / L.

  In general, the temperature of the plating solution when electroless plating is performed on the polymer electrolyte material is preferably about 10 to 60 ° C. The time for applying electroless plating to the polymer electrolyte material is usually about 5 minutes to several hours, but the present invention is not limited by the time for applying such electroless plating.

  The electroless plating of the polymer electrolyte material can be performed by a general electroless plating method, for example, by immersing the polymer electrolyte material in a plating solution and then reducing the surface thereof.

  When immersing the polymer electrolyte material in the plating solution, it is preferable to stir the plating solution as appropriate in order to remove bubbles adhering to the surface of the polymer electrolyte material and form a uniform plating film. . In addition, after immersing the polymer electrolyte material in the plating solution, if necessary, it may be washed with water to remove the plating solution present on the surface of the polymer electrolyte material.

  Next, the metal is deposited by reducing the surface of the polymer electrolyte material in which the polymer electrolyte material is immersed in the plating solution. When reducing the surface of the polymer electrolyte material, a reducing agent can be used. Examples of the reducing agent include borohydride compounds such as sodium borohydride and potassium borohydride, borane compounds such as dimethylamine borane, diethylamine borane, trimethylamine borane and triethylamine borane, hydrazine, and ascorbic acid. The present invention is not limited to such examples.

  The reduction of the surface of the polymer electrolyte material can be performed, for example, by immersing the polymer electrolyte material immersed in a plating solution in a reducing agent aqueous solution. The concentration of the reducing agent in the reducing agent aqueous solution is not particularly limited, but is usually preferably about 0.03 to 0.1 mol / L. Although the liquid temperature of reducing agent aqueous solution is not specifically limited, Usually, it is preferable that it is about 10-50 degreeC. Moreover, it is usually preferable that the time required for the reduction of the plating film is about 30 minutes to 2 hours. At that time, in order to remove bubbles adhering to the surface of the polymer electrolyte material and form a uniform plating film, it is preferable to appropriately stir the aqueous solution of the reducing agent.

  After reducing the surface of the polymer electrolyte material, if necessary, the surface of the polymer electrolyte material may be washed with water in order to remove the reducing solution aqueous solution existing on the surface of the polymer electrolyte material. Thereafter, if necessary, the surface of the polymer electrolyte material may be neutralized. The neutralization of the surface of the polymer electrolyte material can be performed, for example, by immersing the polymer electrolyte material in an acidic aqueous solution. Examples of the acidic aqueous solution include inorganic acid aqueous solutions such as nitric acid aqueous solution and hydrochloric acid aqueous solution, and organic acid aqueous solutions such as acetic acid aqueous solution. However, the present invention is not limited to such examples.

  In addition, after a plating film is formed on the surface of the polymer electrolyte material by electroless plating, the plating film may be further electroplated to increase the thickness of the plating film or increase the conductivity. Good. For example, after a platinum plating film is formed on the surface of the polymer electrolyte material by electroless plating, a platinum plating film of the same kind is further formed on the formed platinum plating film by electrolytic plating. The thickness of the plating film may be increased, or in order to further increase the conductivity of the plating film, a gold plating film may be further formed on the platinum plating film by electrolytic plating. The type of metal used in the electroplating may be the same as or different from the metal used in the electroless plating, and is not particularly limited.

  By performing electroless plating on the polymer electrolyte material as described above, a plating film is formed at the ion non-implanted portion of the polymer electrolyte material, but no plating film is formed at the ion implanted portion of the polymer electrolyte material. Therefore, a plating film having a pattern corresponding to the predetermined pattern of the mask can be formed on the surface of the polymer electrolyte material.

  In order to increase the thickness of the plating film formed on the surface of the polymer electrolyte material, the electroless plating operation of the polymer electrolyte material may be repeated. Although the film thickness of the plating film formed on the surface of the polymer electrolyte material is not particularly limited, it is usually preferably about 1 to 10 μm.

  A metal plating material is obtained as described above. The method for producing a metal plating material of the present invention does not require a masking tape that has been conventionally used. Therefore, when the masking tape is peeled off, an electrode is formed at the boundary between the masking tape and the electrode mixture layer following the masking tape. The disadvantage that the mixture layer is peeled off and the quality of the electrode is lowered can be solved. In addition, since the complicated steps such as the formation process of the photosensitive resin layer, the exposure process, the development process, and the baking process, which are required in the electrode manufacturing method using the conventional photolithography method, are unnecessary, the metal plating material is used. It can be manufactured efficiently in a short time.

  The metal plating material obtained by the method for producing a metal plating material of the present invention is expected to be used for various applications such as patterned electrodes, diaphragm pumps, and artificial muscles.

  Next, the present invention will be described in more detail based on examples, but the present invention is not limited to such examples.

Production Examples 1-4
As the polymer solid electrolyte material, a square-shaped fluororesin membrane having a sulfonic acid group (length: 30 mm, width: 30 mm, thickness: 180 μm, manufactured by DuPont, Nafion (registered trademark) 117) was used. As a mask, a template (vertical: 30 mm, horizontal: 30 mm, thickness: 300 μm) made of a stainless steel plate (SUS304) and formed with slits was used.

Next, a template is placed on the fluororesin film, and the obtained laminate is put into an ion implantation apparatus (manufactured by Hitachi, Ltd.) so that the ambient atmosphere becomes a pressure of about 1 × 10 ⁻⁴ Pa. After deaeration, helium ions are implanted at an acceleration energy of 100 keV at room temperature (about 25 ° C.) with an ion implantation amount of 1 × 10 ¹³ ions / cm ² (Production Example 1), 1 × 10 ¹⁴ ions / cm ² (Production). Example 2) Ions were implanted by irradiating the template surface with an ion beam so as to be 1 × 10 ¹⁵ ions / cm ² (Production Example 3) or 1 × 10 ¹⁶ ions / cm ² (Production Example 4). .

  As a result, it was confirmed that the concentration of yellow colored in the order of Production Examples 1 to 4 increased in the ion-implanted portion of the fluororesin film as the ion implantation amount increased. In addition, when the chemical structure change in the thickness direction of the polymer electrolyte material was analyzed by X-ray photoelectron spectroscopy (XPS), it was found that ions were implanted within a thickness of about 1 μm near the surface of the fluororesin film. Was confirmed.

  Next, the chemical structures of the fluororesin film before ion implantation and the fluororesin film ion-implanted in each production example were examined by measuring X-ray photoelectron spectroscopy. The results are shown in FIGS. FIG. 1 is an X-ray photoelectron spectrum for the binding energy of C1s derived from carbon atoms, FIG. 2 is an X-ray photoelectron spectrum for the binding energy of F1s derived from fluorine atoms, and FIG. 3 is a graph of O1s derived from oxygen atoms. FIG. 4 shows an X-ray photoelectron spectrum for the binding energy of S2p3 / 2 derived from a sulfur atom.

  In each figure, a is the X-ray photoelectron spectrum of the fluororesin film before ion implantation, and b to e are the X-ray photoelectron spectrum of the fluororesin film ion-implanted in Production Examples 1 to 4, respectively. Indicates.

From the results shown in FIG. 1, the peak at the binding energy of 294 eV starts to greatly decrease when the ion implantation amount is about 1 × 10 ¹⁴ ions / cm ² (c in FIG. 1, Production Example 2), and the peak at 287 eV It can be seen that it has greatly increased. When the ion implantation amount is about 1 × 10 ¹⁶ ions / cm ² (e in FIG. 1, Production Example 4), the peak at the binding energy of 294 eV almost disappears, and the peak at the binding energy of 287 eV is mainly used. I understand that. Since the peak at the binding energy of 294 eV is considered to be derived from the C—F bond, it is inferred that the fluorine atom is desorbed due to the decrease in the peak intensity. In addition, since the peak at the binding energy of 287 eV is considered to be derived from the C—C bond, the increase in the peak intensity results in a relative increase in the C—C bond due to crosslinking or the like. It is thought that there is.

  From the results shown in FIG. 2, it can be seen that the peak intensity of the binding energy of fluorine atoms derived from the C—F bond in the vicinity of the binding energy of 692 eV greatly decreases as the ion implantation amount increases. This suggests that the amount of fluorine atoms is decreasing, suggesting that fluorine atoms are desorbed in the X-ray photoelectron spectroscopy spectrum of the binding energy of carbon atom C1s shown in FIG. Is consistent with

  From the results shown in FIG. 3, it can be seen that the peak intensity at the binding energy 538 eV decreases as the ion implantation amount increases, and the peak intensity at the binding energy 536 eV on the lower energy side further increases. . Further, the results shown in FIG. 4 indicate that the spectrum of the binding energy of sulfur atoms in the vicinity of the binding energy of 173 eV is significantly reduced as the amount of ion implantation increases. From these facts, it is considered that the oxygen atom is derived from the C—O bond and the S—O bond or S═O bond of the sulfonic acid group, so that the sulfonic acid group is eliminated.

  Next, FIG. 5 shows a Fourier transform infrared spectrum by the attenuated total reflection (ATR) method for the fluororesin film before ion implantation and the fluororesin film ion-implanted in each production example. In FIG. 5, a is the Fourier transform infrared spectrum of the fluororesin film before ion implantation, and b to e are the Fourier transform infrared of the fluororesin film ion-implanted in Production Examples 1 to 4, respectively. A spectrum is shown.

In the infrared spectroscopic spectrum shown in FIG. 5, the peaks at wave numbers of 1199 cm ⁻¹ , 1146 cm ⁻¹ , 1056 cm ⁻¹ , 985 cm ⁻¹ and 970 cm ⁻¹ are peaks characteristic of a fluororesin film having a sulfonic acid group. . Among these peaks, it can be seen that the intensity of the peaks at wave numbers of 1056 cm ⁻¹ , 985 cm ⁻¹ and 970 cm ⁻¹ are decreased. Peak at a wave number 1146～1199Cm ^-1 is the stretching vibration derived from a sulfonic acid group and CF ₂ -CF ₂ binding, by increasing the injection amount of ions, in particular reducing the peak intensity of the peak at wavenumber 1199cm ^-1 It is considered that the sulfonic acid group and the C—F bond are strongly influenced by the broadening.

  From these results, the chemical structure of the fluororesin film having the sulfonic acid group is changed by ion implantation into the fluororesin film having the sulfonic acid group, and the change in the chemical structure is caused by the fluorine atom and the sulfonic acid group. It is thought that it is desorption.

Next, the fluororesin film before ion implantation and the fluororesin film ion-implanted in each production example are cut, and a dumbbell-shaped test piece (width: 10 mm, length: 32 mm, constriction width: 4 mm, The length of the constricted part: 12 mm) was prepared, and the tensile strength of each test piece was examined. The result is shown in FIG. In FIG. 6, (a) is the tensile strength of the fluororesin film before ion implantation, and (b) to (e) are the fluororesin film ion-implanted in Production Examples 1 to 4, respectively. Indicates the tensile strength. Further, the elongation ratio described in FIG.
[Elongation ratio (times)]
= [Length after extension (mm)-Length before extension (mm)] ÷ [Length before extension (mm)]
It is a value when calculated based on.

From the results shown in FIG. 6, in the fluororesin film before ion implantation, a yield point occurs when the load is about 9 N [(a) in FIG. 6], while the ion implantation amount is 1 ×. In the fluororesin film having 10 ¹⁶ ions / cm ² , a yield point is generated when the load is about 12 N ((e) in FIG. 6), and mechanical strength such as tensile strength before the ion implantation is performed. It can be seen that the film is improved by about 30% over the fluororesin film.

  From the above, it is understood that the mechanical strength of the fluororesin film having a sulfonic acid group can be improved by ion implantation into the fluororesin film having a sulfonic acid group. The elongation after the yield point to the fracture occurred when the elongation ratio was about 1.5 times regardless of the presence or absence of ion implantation and the amount of ion implantation.

Example 1
The ion-implanted fluororesin film obtained in Production Example 1 was immersed in a plating solution [2 g / L dichlorotetraammineplatinum (II) aqueous solution, liquid temperature: about 25 ° C.] and stirred lightly for about 20 minutes. Next, the fluororesin film is taken out from the plating solution, washed with deionized water, immersed in a 0.079 mol / L sodium borohydride aqueous solution (liquid temperature: about 25 ° C.), and gently stirred for 1 hour. Thus, dichlorotetraammineplatinum (II) was reduced to deposit platinum, and the electroless plating was completed.

  The electroless-plated fluororesin film is washed with deionized water, immersed in a 1 mol / L nitric acid aqueous solution (liquid temperature: about 25 ° C.), and the nitric acid aqueous solution is lightly stirred for 10 minutes, and then deionized. Washed with water. In order to increase the thickness of the platinum plating film, the above operation was repeated 5 times to obtain a metal plating material.

Example 2
Example 1 is the same as Example 1 except that the ion-implanted fluororesin film obtained in Production Example 2 was used instead of the ion-implanted fluororesin film obtained in Production Example 1. A metal plating material was obtained.

Example 3
Example 1 is the same as Example 1 except that the ion-implanted fluororesin film obtained in Production Example 3 was used instead of the ion-implanted fluororesin film obtained in Production Example 1. A metal plating material was obtained.

Example 4
Example 1 is the same as Example 1 except that the ion-implanted fluororesin film obtained in Production Example 4 was used in place of the ion-implanted fluororesin film obtained in Production Example 1. A metal plating material was obtained.

Next, the plating film formed on the metal plating material obtained in each example was visually observed. As a result, in Example 1 and Example 2, the platinum plating film is not formed in some places where ions are implanted into the fluororesin film, and the platinum plating film is formed in places where ions are not implanted into the fluororesin film. It was confirmed that it was uniformly formed. In particular, in the metal plating materials obtained in Example 3 and Example 4, the ion implantation amount is 1 × 10 ¹⁵ ions / cm ² or more, but the platinum plating film is used at the place where ions are implanted into the fluororesin film. Was not formed at all, and it was confirmed that a platinum plating film was uniformly formed at a location where ions were not implanted into the fluororesin film. Therefore, the platinum plating film is not formed at the place where the ions are implanted into the fluororesin film, and the platinum plating film is formed uniformly at the position where the ions are not implanted into the fluororesin film. Therefore, it can be seen that the ion implantation amount into the fluororesin film is preferably 1 × 10 ¹⁵ ions / cm ² or more.

  From the above results, when a polymer electrolyte material is used, and after ion implantation is performed on the surface of the polymer electrolyte material through a mask having a predetermined pattern, the polymer electrolyte material is subjected to electroless plating. Since electroless plating can be applied only to the parts that are not ion-implanted, it is possible to efficiently produce a metal plating material in which a metal plating film is formed in a predetermined pattern without the need for a masking tape. You can see that

  In each example, a polymer electrolyte material having a sulfonic acid group was used as the polymer electrolyte material, but functional groups such as a carboxyl group, a phosphoric acid group, and a boric acid group are similar to the sulfonic acid group, Since ions are desorbed from the polymer electrolyte material by ion implantation, even when a polymer electrolyte material having these functional groups is used, as in the polymer electrolyte material having a sulfonic acid group, ions are present in the polymer electrolyte material. A metal plating film can be formed at a location where ions are not injected into the polymer electrolyte material without forming a metal plating film at the injected location.

  The metal plating material obtained by the method for producing a metal plating material of the present invention is expected to be used for, for example, a patterned electrode. Further, in the method for producing a metal plating material of the present invention, when a thin film is used as the polymer electrolyte material used for the metal plating material, a conventional complicated method such as metal deposition such as gold is employed. The metal plating material having a flexible conductive film that can be bent even without it can be easily manufactured, so that it is expected that the metal plating material having a flexible conductive film will be mass-produced industrially. . This metal plating material having a flexible conductive film is expected to be used in various applications such as flexible electrode materials, flexible printed boards, diaphragm pumps, artificial muscles, etc. It is.

Claims (3)

A method of manufacturing a metal plating material using a polymer material as a substrate , wherein a polymer electrolyte material is used as the polymer material, and ions are formed on the surface of the polymer electrolyte material through a mask having a predetermined pattern. A method for producing a metal plating material, wherein electroless plating is performed on the polymer electrolyte material after injection.   The method for producing a metal plating material according to claim 1, wherein the polymer electrolyte material is a polymer having at least one functional group selected from the group consisting of a sulfonic acid group, a carboxyl group, a phosphoric acid group, and a boric acid group. . 3. The method for producing a metal plating material according to claim 1, wherein the amount of ion implantation into the surface of the polymer electrolyte material is 1 × 10 ¹¹ to 1 × 10 ²⁰ ions / cm ² .