JP5754784B2 - Electronic component conveying device and electronic component measuring device - Google Patents

Description

  The present invention relates to an electronic component transport apparatus that transports an electronic component with an electrode lead terminal extended along a transport path, and inspects electrical characteristics in a high temperature environment during the transport process, and an electronic component measuring apparatus that inspects electrical characteristics. .

  Electronic parts such as semiconductor elements are separated into individual pieces through various assembly processes such as dicing, mounting, bonding, and sealing, and then post-processes such as various inspections are performed. Examples of the post-process include a marking process, an appearance inspection, an electrical property inspection, a lead molding process, a classification of electronic components, or a combination of these processes.

  This post-process is mainly performed by an electronic component transport apparatus that transports the electronic component to the process processing unit. The electronic component transport apparatus is configured by a transport mechanism that aligns and transports electronic components and various process processing units on the transport path. As the transport mechanism, a turntable transport system, a linear transport system, or the like is generally used, and electronic components are sequentially supplied to various process processing units arranged on the transport path. This transport mechanism is configured by vacuum suction, electrostatic suction, Bernoulli chuck, or mechanical chuck mechanism, and has holding means for holding electronic components.

  In the electrical property test by the electronic component transport device, the electrical property such as voltage, current, resistance, or frequency of the electronic component is measured by passing a current or applying a voltage to the electronic component. . Conventionally, electronic components have been mainly used for equipment used indoors, such as audio, television, and personal computers. However, in recent years, it has come to be used for a wide variety of uses as automobiles with the introduction of IT in automobiles. For this reason, the environment used by automobiles, in extreme cases, is required to have performance that can be used mainly in high temperatures and low temperatures, such as desert areas and the Arctic Circle.

  The electrical properties of electronic components can vary greatly depending on the environmental temperature. Therefore, when testing the electrical characteristics of an electronic component in a high temperature environment, the electronic component is heated to 150 ° C. in advance. Therefore, in the electronic component transport device, an electronic component measuring device for testing electrical characteristics and a heating unit for heating the electronic component are arranged side by side, and the electronic component is heated to a desired temperature in advance by the heating unit. The components are transported to the electronic component measuring device, and the transported electronic components are inspected by the electronic component measuring device (see, for example, Patent Document 1).

  The heating unit has a heating path for electronic components and conveys the electronic components along the heating path. The heating path is heated by the heater, and the electronic component is heated by the heater via the heating path. For example, the heating path is a rotating disk with pockets for storing electronic components formed on the surface. The electronic component is stored at one position of the rotating disk, and the electronic component is heated while returning to the position, and returns to the transport path of the electronic component transport device at the same position.

  If the temperature of the electronic component deviates from the set temperature for the inspection, a large error occurs in the inspection result, which may impair the reliability of the inspection. This is because each member constituting the electronic component has a predetermined coefficient of thermal expansion and thermal resistance, so that the electrical characteristics may change greatly due to temperature changes. Therefore, a certain degree of strictness is required for heating the electronic component.

JP 2010-133716 A

  However, power devices mounted on automobiles, for example, have many relatively large devices such as power transistors, power MOSFETs, rectifier diodes, and the like that handle large power, such as a package size of about 5 mm square.

  In such a large electronic component, the number of electronic components that can be retained in the heating path is overwhelmingly smaller than that of a small electronic component. In other words, if the heating path length of the electronic component is the same as that of a small electronic component, the electronic component cannot be heated to a desired temperature without reducing the conveying speed of the electronic component in the heating path. Moreover, because of the volume of a large electronic component, the time required to heat it to a desired temperature is longer than that of a small electronic component. For this reason, the conveyance speed in the heating path must be made lower and higher.

  In an electronic component transport apparatus that aligns and transports electronic components, a decrease in the transport speed in the heating path leads to a decrease in the transport speed of the entire transport path. This is because the transport speed of the electronic component transport apparatus is determined by the sum of the movement time and the maximum processing time. Therefore, conventionally, when a large-sized electronic component is transported, a decrease in transport speed is unavoidable, and poor production efficiency has been a problem.

  The present invention has been proposed in order to solve the above-described problems, and electronic component conveyance that suppresses the heating time required for the electronic component in the heating unit and suppresses a decrease in the conveyance speed of the electronic component. An object is to provide an apparatus and an electronic component measuring apparatus.

A first aspect of the present invention, by extending the electrode lead terminals, the electronic component having a metal plate on the bottom, and transported along the transport path, an electronic component conveying inspecting the electrical characteristics of the high temperature environment in the transport process An apparatus that is disposed in a conveyance path and that heats the electronic component, and is disposed in a location different from the heating means in the conveyance path and places an electronic component that has been heated by the heating means. The mounting plate and the metal plate that is disposed in the same place as the mounting table and that contacts the mounting table and the mounting table by heating the mounting table by heating the heating device. And a current-carrying contact that is disposed at the same location as the mounting table and contacts the electrode lead terminal of the heated electronic component.

According to another aspect of the present invention, there is provided an electronic component measuring apparatus for measuring an electrical characteristic of an electronic component having an electrode lead terminal extended and having a metal plate on a bottom surface, and a mounting table on which the electronic component is mounted; An electric contact that sandwiches and contacts the electrode lead terminals of the electronic component, and a heater that heats the electronic component via the mounting plate and the metal plate that contacts the mounting table by heating the mounting table. It is characterized by providing.

  According to the present invention, not only the heating means but also the electronic part measuring apparatus can heat the electronic parts. Therefore, even if the heating time by the heating means is shortened, the electronic parts can be obtained at the inspection temperature desired for the electrical characteristics. Can be easily inspected, and the conveying speed of electronic components is improved.

It is a side view which shows the structure of the electronic component measuring apparatus which concerns on this embodiment. It is a top view which shows schematic structure of an electronic component conveyance apparatus provided with the electronic component measuring apparatus which concerns on this embodiment. It is a side view which shows schematic structure of an electronic component conveyance apparatus provided with the electronic component measuring apparatus which concerns on this embodiment. It is a side view which shows schematic structure of the heating unit with which the electronic component conveying apparatus which concerns on this embodiment is provided.

(Electronic component measuring device)
First, an embodiment of an electronic component measuring apparatus according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a side view showing a schematic configuration of an electronic component measuring apparatus according to the present embodiment.

  The electronic component measuring apparatus 1 is an apparatus that measures the electrical characteristics of an electronic component S in which an electrode composed of an electrode lead terminal S1 is extended laterally from the main body. The electronic component measuring apparatus 1 includes a hold pin 6 as a mounting table for the electronic component S, and applies voltage or current injection to the electronic component S placed on the hold pin 6. The electrical characteristics include the voltage, current, resistance, or frequency of the electronic component S with respect to current injection or voltage application to the electronic component S, an output signal with respect to a logic signal, and the like.

  The type of the electronic component S is not particularly limited, but the electronic component measuring apparatus 1 is particularly suitable for a large current test of a power device that handles large power such as a power transistor, a power MOSFET, and a rectifier diode.

  The electronic component measuring apparatus 1 includes an upper contact 21 and a lower contact 22 corresponding to each electrode lead terminal S1. The upper contact 21 and the lower contact 22 are energizing contacts that contact the electrode lead terminal S1 of the electronic component S and cause a current to flow through the electrode lead terminal S1. The upper contact 21 and the lower contact 22 are arranged so as to sandwich the lead extension planned area S2. The lead extension planned area S2 is a plane on which the tip of the electrode lead terminal S1 extends when the electronic component S is placed on the hold pin 6.

  The upper contact 21 is disposed at a position above the electrode lead terminal S1, the distal end portion is bent toward the electrode lead terminal S1 before the electrode lead terminal S1, and the distal end contacts from the upper surface of the electrode lead terminal S1. The lower contact 22 is disposed at a lower position than the electrode lead terminal S1, the tip end portion is bent toward the electrode lead terminal S1 before the electrode lead terminal S1, and the tip contacts from the lower surface of the electrode lead terminal S1.

  The upper contact 21 and the lower contact 22 are held by an upper lever 3a, a lower lever 3b, and a plurality of rollers 4a and 4b. The upper lever 3a, the lower lever 3b, and the hold pin 6 are supported by a shaft 7 and cams 8a and 8b that are pivotally supported by the shaft 7. By driving the cams 8a and 8b by the rotation of the shaft 7 by the motor 10, the upper lever 3a, the lower lever 3b and the hold pin 6 move in the vertical direction.

  The lower end of the hold pin 6, that is, the side opposite to the mounting surface of the electronic component S is in contact with the cam 8 b via a rod or the like. The cam 8b has a cam surface as a peripheral surface, and has an oval or elliptical shape in which the diameter from the center to the cam surface increases smoothly toward the peak, and the center is pivotally supported by the shaft 7. ing. Therefore, the hold pin 6 moves in the vertical direction according to the driving of the motor 10. The hold pin 6 is provided with a spring 6e, which serves as a buffer material and absorbs an impact on the electronic component S when the hold pin 6 contacts the electronic component S.

  The upper lever 3a and the lower lever 3b have a U shape or a Y shape in which both wings are expanded upward from the root. The upper lever 3a and the lower lever 3b are arranged with their wings widened so as to sandwich the hold pin 6 from the side, and the upper lever 3a and the lower lever 3b are provided with a gap so as not to interfere with each other.

  The bottom lower end of the upper lever 3a is in contact with the cam 8a via a rod or the like, and the bottom lower end of the lower lever 3b is in contact with the cam 8b via a rod or the like. As with the cam 8b, the cam 8a also has an oval or elliptical shape in which the circumferential surface is a cam surface and the diameter from the center to the cam surface increases smoothly toward the peak. It is pivotally supported. Therefore, the upper lever 3 a and the lower lever 3 b also move in the vertical direction according to the driving of the motor 10.

  At the upper end of the upper lever 3 a, a pair of rollers 4 a are attached to both sides of the hold pin 6 in divided wings. The pair of rollers 4a have different heights and are provided with a predetermined interval. The upper contact 21 extends between the pair of rollers 4a so as to reach the electrode lead terminal S1 of the electronic component S. A slight gap is provided between each roller 4a and the upper contact 21, and any one of the rollers 4a presses the upper contact 21 when the upper lever 3a moves up and down.

  That is, when the upper lever 3a is lowered and the roller 4a above the upper contact 21 comes into contact with the upper contact 21 from above, the upper contact 21 is pushed down and the electrons placed on the hold pin 6 are placed. The electrode lead terminal S1 of the component S is contacted from above. On the other hand, when the upper lever 3a is raised and the roller 4a below the upper contact 21 comes into contact with the upper contact 21 from below, the upper contact 21 is pushed up and separated from the electrode lead terminal S1.

  As with the upper lever 3a, the lower lever 3b is also attached to both sides of the hold pin 6 at its upper end with a pair of rollers 4b divided into wings. The pair of rollers 4b have different heights and are provided with a predetermined interval. The lower contact 22 extends between the pair of rollers 4b so as to reach the electrode lead terminal S1 of the electronic component S. A slight gap is provided between each roller 4 b and the lower contact 22, and when the lower lever 3 b moves up and down, one of the rollers 4 b presses the lower contact 22.

  That is, when the lower lever 3b is raised and the roller 4b below the lower contact 22 comes into contact with the lower contact 22 from below, the lower contact 22 is pushed upward and placed on the hold pin 6. The electrode lead terminal S1 of the electronic component S is contacted from below. On the other hand, when the lower lever 3b is lowered and the roller 4b above the lower contact 22 comes into contact with the lower contact 22 from above, the lower contact 22 is pushed downward and separated from the electrode lead terminal S1. .

  Since the cams 8a and 8b are mounted with a cam surface phase shifted by 180 degrees, the upper contact 21 and the lower contact 22 sandwich the electrode lead terminal S1 of the electronic component S from above or below, or electronic It moves away from the electrode lead terminal S1 of the component S at the same time.

  The electronic component measuring apparatus 1 measures electrical characteristics while heating the electronic component S. In the lower lever 3b, heaters 9a and 9b are embedded in the vicinity of the hold pin 6. The heaters 9a and 9b are arranged with the hold pin 6 interposed therebetween. The heaters 9a and 9b are electric heating coils that convert electric power into heat.

  The hold pin 6 is a metal pin having a high thermal conductivity such as an aluminum alloy, and conducts heat of the heaters 9 a and 9 b to the electronic component S. Depending on the type of electronic component S, a metal plate that serves as a heat sink or a GND ground is attached to the bottom surface, and the surface of the metal plate is placed in contact with the hold pin 6.

(Electronic component conveyor)
The electronic component measuring apparatus 1 is mounted on the electronic component transport apparatus 100 and used. The electronic component conveying apparatus 100 will be described with reference to FIGS. FIG. 2 is a top view illustrating a schematic configuration of the electronic component transport apparatus 100 including the electronic component measuring apparatus 1 according to the present embodiment. FIG. 3 is a side view showing a schematic configuration of the electronic component conveying apparatus 1.

  The electronic component transport apparatus 100 is provided with a transport path 11 for the electronic component S on the upper surface of the gantry 14, and aligns and transports a plurality of electronic components S along the transport path 11. Process. The gantry 14 is a rectangular parallelepiped pedestal, and accommodates control devices such as a computer and a controller, a power source, cables, a compressor, and an air pipe.

  The conveyance path 11 is formed by a conveyance table 12 on the gantry 14. A suction nozzle 13 is attached to the outer periphery of the transport table 12. The suction nozzle 13 is a holding means for holding and releasing the electronic component. The rotation path of the suction nozzle 13 is the transport path 11. Further, the transport table 12 and the suction nozzle 13 constitute a transport means.

  The conveyance table 12 has a shape such as a disk or a star that expands radially around one point. The transport table 12 rotates intermittently by a predetermined angle in the circumferential direction. The power source of the transport table 12 is a direct drive motor 15. The transfer table 12 is installed on the gantry 14 via a direct drive motor 15.

  A plurality of suction nozzles 13 are attached to the outer periphery of the horizontal plate of the transport table 12 at equal circumferential positions and at the same distance from the center of the horizontal plate. When the transfer table 12 has a star shape, it is attached to the tip of the arm. The suction nozzle 13 is hollow and has one end opened, and the suction nozzle 13 is installed on a horizontal plate with the open end facing downward. The inside of the suction nozzle 13 communicates with a pneumatic circuit of a negative pressure generator such as a vacuum pump or an ejector. By generating a negative pressure in the pneumatic circuit, the suction nozzle 13 sucks the electronic component S at the open end, and separates the electronic component S by breaking the vacuum or releasing the atmosphere.

  The direct drive motor 15 is controlled to rotate intermittently by one pitch. The pitch is adjusted to be equal to the arrangement interval of the suction nozzles 13. That is, the suction nozzle 13 follows a common movement locus with the intermittent rotation of the transport table 12 and stops at a common stop position. By providing a processing unit at this stop position, processing such as inspection for electronic components can be performed.

  At each stop position where the processing unit is provided, an advancing / retreating drive device 16 is fixed immediately above the transport table 12. The advance / retreat driving device 16 is a device that lowers the suction nozzle 13 toward the stage of the processing unit. For example, the suction nozzle 13 is installed on the transfer table 12 via a cylindrical bearing having an axis in the vertical direction and can be moved up and down, and is always urged upward by a compression spring. Further, the advancing / retreating drive device 16 includes a rod extending toward the head of the suction nozzle 13, and a rotation motor and a cam mechanism that apply axial thrust to the rod.

  The advancing / retracting drive device 16 generates a thrust by a rotary motor, converts the thrust into a linear thrust along the axis of the suction nozzle 13 by a cam mechanism and a rod, and uses the rod to resist the biasing force of the compression spring. Push 13 in. The electronic component S held by the suction nozzle 13 is placed on the stage of the processing unit when the suction nozzle 13 is lowered, and receives a process corresponding to the processing unit. When the rod releases the suction nozzle 13, the suction nozzle 13 moves upward toward the original position by the urging force of the compression spring while holding the electronic component S.

  As a processing unit, a supply unit 17 that supplies the electronic component S to the transport path 11 is provided at the start end of the transport path 11 of the electronic component transport apparatus 1. A storage unit 18 that stores the electronic component S is provided at the end of the transport path 11. The electronic component measuring apparatus 1 is arranged in the transport path 11 between the supply unit 17 and the storage unit 18. A heating unit 19 that heats the electronic component S in the first stage is disposed in the transport path 11 closer to the supply unit 17 than the electronic component measuring apparatus 1. In addition, various processing units that perform appearance inspection, position correction, classification, marking, and the like are arranged in parallel on the conveyance path.

  As shown in FIG. 4, the heating unit 19 includes a heating table 191 that rotates about a central axis, and a heater 192 that heats the heating table 191. The central axis of the heating table 191 is provided perpendicular to the plane in which the table extends. This central axis is connected to the drive shaft of the motor 193.

  The heating table 191 is provided with a storage hole 194 on the upper surface. The storage hole 194 is a pocket for storing the electronic component S. A plurality of storage holes 194 are arranged along the circumference of the heating table 191. The arrangement line connecting the arrangement positions of the storage holes 194 and the transport path 11 overlap at one point. The electronic component S is delivered at this overlapping point.

  The heating unit 19 receives the electronic component S from the suction nozzle 13 in the transport path 11 and stores it in the storage hole 194. The heating table 191 rotates the electronic component S stored in the storage hole 194 once in a predetermined time. The electronic component S is heated by the heater 192 through the heating table 191 during this one rotation.

  Heating by the heating unit 19 may be positioned as preliminary heating, or the electronic component S may be heated to an inspection temperature suitable for electrical property inspection. The heating by the electronic component measuring apparatus 1 may be positioned in the main heating up to the inspection temperature, or may be positioned in the heat retaining heating that maintains the inspection temperature.

(Function)
The operation of the electronic component conveying apparatus 100 will be described focusing on the inspection of the electrical characteristics by the electronic component measuring apparatus 1. The electronic component transport apparatus 100 rotates the transport table 12 to stop the suction nozzle 13 immediately above the supply unit 17 and receives the electronic component S from the supply unit 17. When the suction nozzle 13 receives the electronic component S, the transport table 12 is further rotated so that the suction nozzle 13 holding the electronic component S is positioned immediately above the heating unit 19.

  The suction nozzle 13 positioned immediately above the heating unit 19 is lowered by the advancing / retreating drive device 16, and the electronic component S is detached from the empty storage hole 194 positioned immediately below. When the electronic component S is stored in the storage hole 194, the heating table 191 rotates intermittently once over a predetermined time. While the heating table 191 stops intermittently, the electronic components S are sequentially stored in the empty storage holes 194.

  While the heating table 191 makes one rotation, the heater 192 heats the electronic component S through the heating table 191 in the first stage. The electronic component S is picked up again by the suction nozzle 13 when it rotates once and returns to the position immediately below the transport path 11.

  The electronic component S heated by the heating unit 19 is positioned directly below the electronic component measuring apparatus 1 while being held by the suction nozzle 13. The suction nozzle 13 is lowered by the advancing / retreating drive device 16 to place the electronic component S on the hold pin 6 and detach the electronic component S by vacuum break or atmospheric break. At this time, the contact between the hold pin 6 and the electronic component S is mitigated by the spring 6e.

  When the electronic component S is placed on the hold pin 6, the electronic component measuring apparatus 1 drives the motor 10 to rotate the cam 8a, thereby moving the upper lever 3a downward. Then, the upper roller 4a contacts the upper contact 21 from above, and the upper contact 21 is pushed down toward the electrode lead terminal S1. The pushed-up upper contact 21 contacts the electrode lead terminal S1 from the upper surface. The contact pressure of the upper contact 21 with respect to the electrode lead terminal S1 is canceled by the spring 6e.

  Further, the drive of the motor 10 rotates the cam 8b to move the lower lever 3b upward. Then, the lower roller 4b comes into contact with the lower contact 22 from below, and the lower contact 22 is pushed up toward the electrode lead terminal S1. The pushed-down lower contact 22 contacts the electrode lead terminal S1 of the electronic component S from the lower surface simultaneously with the contact of the upper contact 21.

  Thus, the upper contact 21 and the lower contact 22 are in contact with each other so as to sandwich the electrode lead terminal S1. The stress applied to the electrode lead terminal S1 is offset by the electrode lead terminal S1 being sandwiched from above and below. That is, even if an appropriate contact pressure is applied to the electrode lead terminal S1 in order to reduce the contact resistance between the electronic component S, the upper contact 21, and the lower contact 22, deformation, twisting or breakage of the electrode lead terminal S1 is suppressed. ing.

  After the electronic component S is placed on the hold pin 6, the upper contact 21 and the lower contact 22 sandwich the electrode lead terminal S <b> 1, and an electric current is injected into the electronic component S through the upper contact 21 and the lower contact 22 or a voltage is applied. During the application, the heater 9a and the heater 9b perform the second stage heating of the electronic component S.

  That is, the heater 9a and the heater 9b heat the hold pin 6 in the vicinity thereof. The hold pin 6 has thermal conductivity and transfers heat from the heater 9a and the heater 9b to the electronic component S. When a metal plate for grounding the heat sink or GND is attached to the electronic component S, the electronic component S is heated via the metal plate.

  When the electronic component S reaches a temperature suitable for the electrical characteristic inspection by the heating in the second stage, the electronic component measuring apparatus 1 supplies current to the electronic component S through the upper contact 21 and the lower contact 22 and the electrode lead terminal S1. Injection or voltage application is performed, and electrical characteristics are inspected.

  The electronic component S for which the electrical characteristic inspection has been completed is returned to the transport path 11 again. That is, when the motor 10 is driven and the cam 8a is further rotated, the upper lever 3a is moved upward, and the upper contact 21 is moved upward away from the electrode lead terminal S1 via the lower roller 4a. Further, by further rotating the cam 8b, the lower lever 3b is moved downward, and the lower contact 22 is moved downwardly away from the electrode lead terminal S1 via the upper roller 4b.

  When the electrode lead terminal S1 is released from clamping by the upper contact 21 and the lower contact 22, the suction nozzle 13 ascends by the advance / retreat driving device 16 after sucking the electronic component S placed on the hold pin 6. . When the suction nozzle 13 rises while holding the electronic component S, the transport table 12 starts to rotate. The electronic component S moves to the storage unit 17 while being transported through the transport path 11 and to other units, and is stored by the storage unit 17.

(effect)
As described above, the electronic component transport apparatus 100 is configured to heat the electronic component S, and the electronic component measuring apparatus 1 that is arranged at a location different from the heating unit 19 and searches for electrical characteristics of the electronic component S. Are provided on the transport path 11.

  The electronic component measuring apparatus 1 places the electronic component S that has been heated by the heating unit 19 on the hold pin 6 that is a placement table, and heats the hold pin 6 with the heater 9a and the heater 9b, thereby heating the heating unit 19. The electronic component S that has been heated by is heated. Then, the electrical characteristics are inspected using the upper contact 21 and the lower contact 22 that are in contact with each other while sandwiching the electrode lead terminal S1 of the heated electronic component S.

  As a result, not only the heating unit 19 but also the electronic component measuring apparatus 1 can be heated. Therefore, even if the heating time of the heating unit 19 is shortened, the electronic component S can be placed at the inspection temperature desired by the electrical characteristics. It becomes easy to inspect. Therefore, the conveyance speed of the electronic component S is improved. In particular, in the large-sized electronic component S, the degree to which the decrease in the conveyance speed can be suppressed is remarkable, and it is possible to achieve both maintenance of production efficiency for the large-sized electronic component S and improvement in the reliability of the electrical characteristic inspection. .

  Here, the electronic component measuring apparatus 1 may be a final heating unit, and the heating unit 19 may be installed in a single or plural number without limitation. In addition, a heating unit 19 that heats the electronic component S may be used for other purposes, and the electronic component S that has passed through the heating unit 19 is heated by the electronic component measuring apparatus 1 to perform an electrical property inspection. May be.

  Further, when a heating unit is mounted on a processing unit that is transported prior to the electronic component transport apparatus 1 and performs some processing, and a path for transporting the electronic component measurement apparatus 1 while leaving the residual heat is constructed, the processing unit Can be used as one of the heating means.

  The heater 9a and the heater 9b were embedded in the lower lever 3b for bringing the lower contact 22 into and out of contact with the electrode lead terminal S1. The lower lever 3 b is arranged around the hold pin 6. Therefore, the heater 9 a and the heater 9 b can heat the electronic component S through the hold pin 6 by using the hold pin 6 as a heat transfer path.

  The power device electronic component S often has a heat sink or a metal plate for GND grounding attached to the bottom surface in contact with the hold pin 6. Therefore, if the hold pin 6 is heated, heat can be transferred to the metal plate, and the heating efficiency of the electronic component S is excellent. Thereby, the heating time of the electronic component S can be shortened, and further the heating time in the heating unit 19 can be shortened, thereby contributing to the improvement of the conveying speed of the electronic component. Therefore, it is desirable that the hold pin 6 is excellent in thermal conductivity.

(Other embodiments)
The embodiment of the present invention has been described above. However, this embodiment is presented as an example, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. Are included in the technical scope or equivalent scope thereof.

  For example, the case where various process processing mechanisms are arranged on one turntable 11 as the electronic component transport apparatus 100 has been described as an example, but the transport mechanism may be a linear transport system or a plurality of transport tables. A single transport path may be configured.

  Further, instead of the suction nozzle 13, an electrostatic suction system, a Bernoulli chuck system, or a chuck mechanism that mechanically clamps the electronic component S may be provided. When placing the electronic component S on the hold pin 6, the hold pin 6 can be moved up and down without lowering the suction nozzle 13 so that the hold pin 6 side picks up the electronic component S. Good.

  The various processing units included in the electronic component transport apparatus 100 are not limited to the types described above, and can be replaced with various processing units, and the arrangement order can be changed as appropriate.

DESCRIPTION OF SYMBOLS 1 Electronic component measuring device 21 Upper contact 22 Lower contact 3a Upper lever 3b Lower lever 4a Roller 4b Roller 6 Hold pin 6e Spring 7 Shaft 8a Cam 8b Cam 9a Heater 9b Heater 10 Motor 100 Electronic component transport device 11 Transport path 12 Transport Table 13 Suction nozzle 14 Base 15 Direct drive motor 16 Advance / retreat drive 17 Supply unit 18 Storage unit 19 Heating unit 191 Heating table 192 Heater 193 Storage hole S Electronic component S1 Electrode lead terminal S2 Lead extension planned area

Claims (2)

An electronic component transport device that extends an electrode lead terminal , transports an electronic component having a metal plate on the bottom surface along a transport path, and inspects electrical characteristics in a high-temperature environment during the transport process,
A heating means disposed in a transfer path for heating the electronic component;
A placement table on which an electronic component that has been heated by the heating means is placed at a location different from the heating means in the transport path;
A heater that is disposed in the same place as the mounting table and heats the electronic component that has been heated by the heating means via the heating plate and the metal plate that contacts the mounting table. When,
A current-carrying contact that is disposed in the same place as the mounting table and contacts the electrode lead terminal of the heated electronic component;
Providing
An electronic component conveying device characterized by the above. An electronic component measuring device that extends an electrode lead terminal and measures electrical characteristics of an electronic component having a metal plate on the bottom surface ,
A mounting table on which electronic components are mounted;
An energizing contact that sandwiches and contacts the electrode lead terminals of the electronic component;
By heating the mounting table, a heater for heating the electronic component through the metal plate that contacts the mounting table and the mounting table ;
Providing
An electronic component measuring apparatus characterized by the above.

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