JP5738207B2 - Compressor, refrigerator, equipment - Google Patents

Description

  The present invention relates to a device such as a refrigerator or an air conditioner that uses a wide band gap semiconductor as a semiconductor component for device control.

  Due to the increasing trend toward energy saving, refrigeration and air-conditioning devices such as air conditioners and refrigerators have recently been reduced in power consumption. In order to achieve low power consumption, inverter type inverters that vary the drive frequency of compressors have become mainstream. Since an inverter circuit mainly composed of semiconductor components becomes hot, a relatively large heat dissipation structure is required, and many of them are high when mounted on a control board. Here, the height of the components other than the inverter circuit attached to the control board is, for example, larger than that of a large heat dissipation structure related component that cools the semiconductor component, compared to this large heat dissipation structure related component. Many of the other parts are relatively low in height, and the control board has a configuration in which high-height parts and low-height parts are mixed.

  Inverter control by the inverter drive circuit can achieve low power consumption, but the semiconductor parts mounted on the control board generate heat, so it is necessary to insulate it firmly so that the generated heat does not enter the refrigerator cabinet. Arise. On the other hand, recent refrigerators are required to increase the amount of storage (increase in storage capacity) in the storage space within a limited installation space and size (width and height), and thus the thickness of the heat insulating material has been reduced. It is out. If the control board is not well insulated, the heat generated by its own heat will enter the cabinet via the heat insulating material, which will cause the power consumption to deteriorate. A refrigerator that is well insulated with a heat insulating material has been proposed. (For example, see Patent Document 1)

  In the case of a refrigerator, from the viewpoint of increasing the internal volume, it is conceivable to arrange the control board in the machine room and reduce the thickness of the heat insulating material. However, in conventional equipment such as a refrigerator, it is mounted on the control board. Since Si (silicon) having a low heat-resistant temperature is used for the semiconductor element of the inverter circuit, it is difficult to install it in a place where the ambient temperature (atmosphere temperature) is high, such as a machine room.

  Here, as a countermeasure when the control board is provided in the machine room where the compressor having a high ambient temperature is arranged, the control board is surrounded by a heat insulating material so that it is not directly affected by the temperature in the machine room. A refrigerator has been proposed. (For example, see Patent Document 2)

  When a control board is placed in a machine room where a heating element such as a compressor is placed and the temperature is relatively high, it is necessary to take measures to suppress the temperature rise, such as by surrounding the control board with heat insulation. The control board is not placed in the machine room that is in a high-temperature atmosphere for reasons such as securing and increasing the cost of the heat insulating material, but is provided outside the machine room (for example, a different place from the machine room) A separate installation space other than the room was necessary.

  Here, as a countermeasure when semiconductor components are arranged in the machine room, a wide band gap semiconductor having high heat resistance is used for the semiconductor element of the inverter circuit, and the casing of the compressor in which the wide band gap semiconductor element is arranged in the machine room. The one arranged inside is proposed. In this example, the heat dissipation structure is simplified by cooling the wide band gap semiconductor element with the refrigerant in the compressor, and electromagnetic noise due to the high-frequency magnetic flux generated from the inverter device is stored in the compressor casing. Measures are being taken. (A wide-gap semiconductor element, which is a high heat-resistant element, is used as an element of the inverter device, and this wide band-gap semiconductor element is placed in the casing of the compressor. Some are arranged outside the casing.) (For example, see Patent Document 3)

  In addition, a wide band gap semiconductor is used for the power element that generates heat, and a part of the power element is provided in the casing or discharge pipe of the compressor and cooled with the high-pressure refrigerant of the compressor. A configuration for controlling the temperature has also been proposed. (For example, see Patent Document 4)

JP-A-7-270041 JP 2001-41635 A JP 2008-57425A JP 2008-57870 A

  As shown in Patent Document 1, in a conventional refrigerator, a control board is provided on a heat insulating wall surface on the back of the refrigerator, and a refrigerator in which the periphery of the control board on which the inverter circuit is mounted is well insulated with a heat insulating material is proposed. Has been. However, since the semiconductor element used for the semiconductor component is a conventional Si element, the thickness of the control board and the control board box cannot be accommodated in the heat insulating material on the rear wall of the refrigerator as it is. Therefore, in the back part of the refrigerator main body in which the control board box is disposed, the control board box is accommodated in the heat insulating material on the back wall by projecting the inner box to the inner side. Therefore, in the part where the control board box is arranged, the heat insulating material (urethane heat insulating material) on the back of the refrigerator is installed by protruding (bending) only the part where the control board box is arranged inside the storage room (store side) As a result, the volume of the storage room was small.

  Moreover, when arranging other parts, such as a vacuum heat insulating material and a heat radiating pipe, between the control board box and the refrigerator inside (inner box), the control board box becomes an obstacle by the height of the control board box. Therefore, it is necessary to bend the vacuum heat insulating material by the height of the control board in the vicinity of the back surface of the control board box, and the structure of other parts such as the vacuum heat insulating material and the heat radiating pipe becomes complicated and the cost is increased.

  Further, since the flat vacuum heat insulating material may be bent to break the packaging bag (outer packaging material) that constitutes the vacuum heat insulating material, there is a concern that the heat insulating performance may be deteriorated. Conventionally, it is between the control board and the refrigerator. I gave up the installation of the vacuum heat insulating material, and heat insulation was performed with a urethane heat insulating material having a heat insulating performance worse than that of the vacuum heat insulating material, and high performance could not be expected.

  In the case of a conventional refrigerator, a heat radiating pipe (corresponding to a condenser) constituting a part of the refrigeration cycle may be provided on the back of the refrigerator, but the back of the control board box (between the control board box and the inside of the cabinet). In order to secure the interior volume, the insulation is made as thin as possible, and the thickness (space) for installing the heat radiation pipe cannot be secured in the insulation on the back of the control board box. Therefore, the heat radiating pipe is provided on the side surface of the control board box, and the heat radiating pipe cannot be moved on the back surface of the control board box, so that it is difficult to increase the length of the heat radiating pipe. Therefore, it is difficult to increase the heat radiation efficiency by increasing the length of the heat radiating pipe to reduce the power consumption of the refrigerator. In addition, in the case of a conventional refrigerator, since the space for disposing the heat radiating pipe cannot be secured on the back side of the control board, the heat radiating pipe is arranged on the side of the control board to avoid the control board. The heat-dissipating pipes in the area have a large number of bent parts, and the shape of the heat-dissipating pipes is distorted, which deteriorates the workability and reliability of the heat-dissipating pipes. Further, since it is difficult to place the heat radiating pipe behind the control board, it is difficult to increase the length of the heat radiating pipe. Therefore, the length of the heat radiating pipe is shortened and the heat radiating efficiency is lowered.

  Conventionally, since the control board box is often provided at a position away from the machine room, the arrangement position of the compressor and the arrangement position of the control board are also separated, so that the control board is arranged in the machine room. Therefore, the length of the lead wire for the compressor having a thick wire diameter and high cost is longer than that of the case where the cost is high. Further, since it is necessary to use a compressor lead wire having a large wire diameter, which is likely to be a noise generation source, for a long time, electromagnetic noise is easily generated, which is a problem. (For example, the compressor is placed on the lower back of the refrigerator and the control board is placed on the upper back of the refrigerator, or the compressor is placed on the upper back of the refrigerator and the control board is placed on the substantially central back of the refrigerator. In many cases, the arrangement position of the compressor and the arrangement position of the control board are often separated.)

  Moreover, in the refrigerator described in Patent Document 2, an electrical component storage unit that stores a control board in a machine room that is in a high-temperature atmosphere is provided. In this electrical component storage unit, a semiconductor element is a conventional Si element, Since semiconductor elements without high-temperature proof stress are used, it is necessary to provide a foam-filled resin enclosure (heat insulation) so as not to be affected by the temperature inside the machine room, which is at a high temperature. The volume of the machine room was reduced by that much, and the cost was increased by the amount of heat insulation. In addition, it is necessary to fill the extraction hole with a heat insulating material after the connection line (lead wire) for connecting the control board and the compressor is taken out of the resin enclosure, which takes time and cost. In addition, the electrical component storage section is not provided directly above the compressor so as not to be affected by the rising heat of the compressor, and the degree of freedom of arrangement of the electrical component storage section is reduced.

  Moreover, since the compressor of patent document 3 has provided the wide band gap semiconductor element of the inverter apparatus in the casing of a compressor, it cannot replace | exchange when a wide band gap semiconductor element fails, but compressor replacement at the time of service Therefore, the replacement work is difficult, and the replacement cost is large. Moreover, since it is installed in the compressor, a refrigerant-resistant structure that does not break down with respect to the refrigerant is necessary, which increases costs.

  Further, in the refrigeration apparatus described in Patent Document 4, since the power element is disposed in the casing of the compressor, the shape and mounting method of the heat transfer member, etc. in order to provide the power element in the compressor casing having a curved shape. Special measures were required, and the cost increased. In addition, since a control board with a power element mounted on the discharge pipe of a compressor having a diameter of about 10 mm to 15 mm, an excessive load or stress is applied to the discharge pipe, causing breakage of the pipe or vibration of the pipe. There was a risk of decline.

  An object of the present invention is to obtain a device such as a refrigerator having a large storage capacity. It is another object of the present invention to reduce the length of a power supply lead wire for a compressor or a control lead wire. Moreover, it aims at reducing the electromagnetic noise resulting from a lead wire. It is another object of the present invention to obtain a device such as a refrigerator provided with a wide band gap semiconductor that can be easily serviced. It is another object of the present invention to obtain a compressor and equipment including a reliable wide band gap semiconductor that does not apply excessive force to piping such as discharge piping.

  It is another object of the present invention to obtain a compressor, a refrigerator, an air conditioner, a washing machine, a refrigerator, a showcase, or the like that can install a control board without providing a heat insulating material in the machine room. Moreover, it aims at making effective use of the space in the machine room. It is another object of the present invention to provide a device having a high degree of freedom in arrangement of control boards. It is another object of the present invention to make effective use of the space provided by the conventional control board by arranging the control board in the machine room. Moreover, it aims at obtaining apparatuses, such as a refrigerator which can use effectively the heat | fever which a semiconductor component emits.

  It is another object of the present invention to reduce the height and size of the control board box and effectively utilize the increased space. The purpose of the refrigerator is to increase the internal volume. Moreover, it aims at obtaining apparatuses, such as a low power consumption refrigerator and an air conditioner. In addition, additional parts such as heat radiation pipes, cooling air passages, and lighting devices can be installed in the increased space on the back of the control board box, so that additional functions can be obtained without significantly changing the external shape and size of the equipment. Objective. Another object is to promote the evaporation of water in the drain pan. Moreover, it aims at utilizing the heat | fever which a wide band gap semiconductor emits for evaporation of the defrost water stored in the drain pan through the drain pan.

  In the present invention, a casing that houses therein a compressor mechanism section that compresses a refrigerant and an electric motor that rotationally drives the compression mechanism section, a power connection terminal that is provided in the casing and energizes the electric motor, and a power connection terminal A terminal box that covers at least a part of the periphery of the motor, a control board on which a semiconductor component that drives and controls the compressor is mounted, and a control board box that houses the control board. The control board box is detachably attached to the terminal box.

  According to the present invention, since the control board can be arranged in the vicinity of the compressor in the machine room or in the terminal box of the compressor by using a wide band gap semiconductor as a semiconductor component for controlling the equipment, the length of the compressor control lead wire can be reduced. It can be shortened and noise can be reduced. In addition, by using a wide band gap semiconductor for the semiconductor parts that control the equipment, the control board can be placed near the compressor in the machine room, so the length of the compressor control lead wire can be shortened, resulting in a low-cost compressor. Equipment such as refrigerators and air conditioners can be obtained.

Embodiment 1 FIG.
(The machine room is located in the lower back of the refrigerator body)
FIG. 1 is a side cross-sectional view of the refrigerator representing the first embodiment of the present invention as viewed from the side. In the figure, the refrigerator main body 1 has a refrigerator compartment 2 at the top, a switching chamber 3 and an ice making chamber 35 provided in parallel below the refrigerator compartment 2, and a freezing compartment 4 provided below the switching chamber 3 and the ice making chamber 35. A vegetable room 5 is provided under the freezing room 4 (lowermost level). Here, between each storage room (for example, refrigeration room 2, switching room 3, ice making room 35, freezer room 4, vegetable room 5), between the room where set temperature (storage temperature) differs, it is a heat insulating material (partition member, It is partitioned by 8 (urethane insulation, vacuum insulation, etc.). A machine room 60 is provided below the back of the refrigerator body 1, and the compressor 6, a compressor cooling fan, and the like are housed in the machine room 60.

  Here, the refrigerator 1 is provided with a refrigerator compartment 2 at the top, a switching chamber 3 and an ice making chamber 35 provided in parallel below the refrigerator compartment 2, and a vegetable compartment 5 provided below the switching chamber 3 and the ice making chamber 35, The freezer compartment 4 may be provided under the compartment 5 (lowermost stage). The refrigerator 1 has a refrigerator compartment 2 at the top, a vegetable compartment 5 below the refrigerator compartment 2, a switching chamber 3 and an ice making chamber 35 provided in parallel below the vegetable compartment 5, and the switching chamber 3 and the ice making compartment 35. The freezer compartment 4 may be provided under (lowermost). In addition, a refrigerator compartment 2 having a rotary refrigerator compartment door at the top, and a vegetable compartment 4 and a freezer compartment 5 (or an ice making room 35 and a switching compartment 3) are provided in parallel below the refrigerator compartment 2 through a heat insulating partition. It may be configured. In this case, the vegetable compartment 4 is provided with a rotary vegetable compartment door, and one or a plurality of drawer cases are provided inside the vegetable compartment door, and the freezer compartment 5, the ice making compartment 35 and the switching compartment 3 are also provided. It is equipped with a rotary freezer compartment door (the ice compartment door and the switching compartment door may be provided, or may be provided if the freezer compartment door can be substituted), and one or a plurality of drawer case type refrigerators are provided on the inside thereof. The chamber 5 (or the ice making chamber 35 or the switching chamber 3) may be provided.

  Further, between the inner box 101 and the outer box 102 on the back side of the main body of the refrigerator 1, for example, a rear heat insulating material 80 formed of foamed urethane or the like is provided, and in the machine room 60 on the rear side of the main body of the refrigerator 1. The control board box 70 in which the control board 7 for controlling the compressor 6, the compressor 6, the compressor cooling fan, the cool air blower fan, etc. is housed is disposed. A heat radiating pipe (condensation pipe) 9, a vacuum heat insulating material 10, and the like that are connected to the compressor 6 and constitute a refrigeration cycle together with a cooler and the like are disposed. Further, as will be described later, a cooler chamber is provided in the back surface insulating material 80, and a cooler 200, an internal fan and the like are disposed in the cooler chamber, and the machine room 60 and the back surface heat insulating material 80 are disposed in the cooler room. An accumulator 61, an expansion device (for example, a capillary tube or an electronic expansion valve) 62, a compressor cooling fan 68, and the like are arranged.

(Arrangement of control board box to compressor)
Here, the control board 7 is housed in a control board box 70 made of a flame resistant material such as sheet metal or resin. A machine room 60 in which the compressor 6 constituting the refrigeration cycle is accommodated is provided at the lower back of the refrigerator 1 in FIG. 1, and a control board box 70 is provided in the machine room 60. The control board box 70 is arranged in the upper part or the side of the compressor 6 that becomes a high temperature in the machine room 60, around the compressor 6, or in the vicinity of the compressor 6. By using a wide bandgap semiconductor as the semiconductor mounted on the control board 7, the semiconductor component can be reduced in size and height, and the control board 7 can also be reduced in size and thickness. Therefore, since the control board box 70 can also be reduced in size and height, it can be arranged in the vicinity of the compressor 6 in the machine room 60 which cannot be arranged in the conventional space because of the space. In addition, since the wide band gap semiconductor can operate even in a high temperature environment (for example, 100 ° C.) such as the machine room 60, it can be installed even in the vicinity of the compressor in the machine room 60. Normally, the upper part of the compressor 6 is at a high temperature, so that a space is provided from the point of heat dissipation without arranging parts or the like. However, the control of the present embodiment, which is small and thin using a wide band gap semiconductor, is used. If it is the board | substrate box 70, it will become possible to arrange | position even if it is the upper space of the compressor 6 which may become high temperature.

  2 is a cross-sectional view of the vicinity of the terminal box of the compressor mounted on the refrigerator representing the embodiment of the present invention, and FIG. 3 is an upper surface of the control board box 70 provided in the terminal box 601 of the compressor 6 of FIG. FIG. 6 is a top view of the control board box and the terminal box when the control board box 70 (and the terminal box 601) in a state where the cover member 701 covering at least a part of the board is removed is viewed from above. A terminal box 601 is provided in the upper part (for example, the upper shell 6A) of the compressor 6 disposed in the machine room 60 provided in the lower back of the refrigerator 1, and the compressor 6 is provided in the terminal box 601. A terminal 610 for energizing a motor provided in the casing is provided, and a control board box 70 is detachably formed on the terminal box 601 or formed integrally with the terminal box 601. Yes. The control board box 70 is provided with a lid member 701 made of a flame retardant and electrically insulating resin. The control board box 70 is also preferably flame retardant and electrically insulating.

  A control board 7 is provided in the control board box 70, semiconductor parts 11 such as switching elements and diode elements are provided, and a wide band gap semiconductor is provided in at least some of the semiconductor parts 11 such as an inverter drive circuit. Is used. Further, only the semiconductor component 11 (only a wide band gap semiconductor may be used) may be mounted on the control board 7, or as shown in FIGS. 2 and 3, for example, control-related components (for example, the transformer 13 and the relay 14) At least one of the converter 15, the power reactor, the capacitor 16, the current detection component 17, and the like may be mounted together with the semiconductor component.

  Here, a power supply lead wire (not shown) is connected to the terminal 610 provided in the compressor 6 and a voltage is applied to the electric motor provided in the casing of the compressor 6. A control board box opening (control board box opening provided on the bottom surface of the control board box) 79 is provided on the bottom face of the box 70 at a portion facing the upper face opening 602 of the terminal box 601. A power supply lead is taken out from the terminal box opening 79 and connected to the inverter drive circuit component 11 and the like mounted on the control board 7. The inverter drive circuit component 11 is connected to an AC power source (for example, a commercial power source) via an AC / DC converter configured with a capacitor or the like. The inverter drive circuit component 11 is composed of a switching element, a diode element, and the like, and uses a wide bandgap semiconductor. Thus, the processing speed is increased, the size is reduced, and the speed is lower than when a conventional Si semiconductor is used. Realizes high height (low profile) and high heat resistance.

  In devices such as the compressor 6, the refrigerator, and the air conditioner of the present embodiment, the terminal box 601 of the compressor 6 is detachably integrated with the control board box 70 and fixing means such as bolts. The connection distance between the terminal 610 and the control board 7 can be extremely shortened. Therefore, the length of the power lead wire for the compressor, which has a relatively large wire diameter and can be a source of electromagnetic noise among lead wires, can be extremely shortened, greatly reducing electromagnetic noise. In addition, since the length of the power lead having a large wire diameter and high cost can be extremely shortened, a low-cost and low-noise compressor or device can be obtained. In addition, since malfunction of the device due to noise can be suppressed, a highly reliable compressor and device can be obtained.

  In this embodiment, since a wide bandgap semiconductor is used for the semiconductor component 11 such as the inverter drive circuit component, it can operate less easily even in a high temperature environment than the conventional Si semiconductor. Even if it is arranged in the machine room 60 under a high temperature environment as in the prior art, it is not necessary to insulate the control board box 70 by providing a heat insulating material around the control board box 70. Specifications can be simplified, and low-cost compressors and equipment can be obtained. In addition, since it is not necessary to insulate the control board box 70, the size of the control board box 70 can be reduced in size (or reduced in width and depth) by the thickness of the heat insulating material. Since it can be installed in the surrounding space of the compressor 6 (for example, the upper space or the side space (or the surrounding space) of the terminal box 601 of the compressor 6), the degree of freedom of design of the control board box 70 (design) The degree of freedom) is improved, and for example, a device such as a refrigerator or an air conditioner that can effectively use the space in the machine room 60 is obtained.

  Further, the control board box 70 may be detachably attached to the terminal box 601 with a screw or the like via the buffer material 350. Here, if the cushioning material is a vibration isolating member having a vibration isolating function such as an elastic body capable of absorbing or reducing vibrations such as vibration isolating rubber, the vibration generated in the compressor 6 is directly controlled by the control board box 70 or the control board. Therefore, a compressor and a device with low vibration and few failures of the control board 7 can be obtained. Further, if the buffer material 350 is an electrical insulating member having electrical insulation, it is possible to suppress leakage from the control board box 70 to the compressor 6 or leakage from the compressor 6 to the control board box 70. A highly efficient compressor and equipment can be obtained.

  As described above, in the embodiment of the present invention, the flange portion 605 is provided around the opening portion 602 on the upper surface of the terminal box 601, and the flange portion 605 and the bottom surface portion of the control board box 70 are connected to each other. It is detachably connected by a connecting means such as a bolt through the buffer material 350. Therefore, if the cushioning material 350 has a vibration isolation function and is a vibration isolation member, the vibration of the compressor 6 is not directly transmitted to the control board 7. Reliable compressors and equipment can be obtained without cracks. Further, if the buffer material 350 is an electrical insulating member having electrical insulation, it is possible to suppress leakage from the control board box 70 to the compressor 6 or leakage from the compressor 6 to the control board box 70. A highly efficient compressor and equipment can be obtained. Here, if the cushioning material 350 has both a vibration isolating function and an electrical insulation function, cracks due to vibration do not occur in the connection part and the like, and leakage can be suppressed, so that further reliability is high. Compressors and equipment can be obtained.

  Here, since a wide band gap semiconductor is used for the inverter drive component 11, the inverter drive component which is the semiconductor component 11 can be reduced in size, weight and heat resistance, and the inverter drive circuit component can be cooled. Since the radiator 12 can be greatly reduced in size or eliminated, the weight of the control board 7 can be reduced, and a low cost compressor and equipment with good assemblability can be obtained. In addition, when there is a possibility that the control board box 70 or the control board 7 resonates and the control board box break 70 or the control board 7 or the like is damaged due to the inverter drive frequency when the compressor 6 is started up, etc. It is possible to adjust the weight and size of the radiator 12 that cools the semiconductor component 11 as long as the weight and size of the conventional radiator are not exceeded. (Size, shape and weight can be adjusted).

  That is, in the embodiment of the present invention, for example, since a wide band gap semiconductor is used for the semiconductor component 11 that is an inverter driving component, the radiator 12 that cools the semiconductor component 11 that is the inverter driving component is small or light. Since the weight and size of the radiator 12 are within the range of the weight and size required when using a wide gap band semiconductor from the size and weight of the radiator 12 when using a conventional Si semiconductor, The box 70 or the control board 7 can be selected so as not to resonate in a low frequency range (for example, a range of a compressor starting frequency (about 5 Hz to about 15 Hz) to a low frequency band of about 40 Hz or less). In this case, if the weight, size, and shape of the radiator 12 cannot be selected, the weight of other components (for example, other components mounted on the control board 7 or other parts mounted in the control board box 70) You may use together with adjustment of a size.

  Here, if the control board box 70 can be arranged in the upper space of the compressor 6 in the machine room 60, the control board box 70 can be arranged in the upper space of the compressor 6 that has been conventionally used as a heat radiation space. Therefore, it is not necessary to secure a separate installation space for the control board box 70 in the machine room 60, and the space in the machine room 60 can be used effectively. When the control board box 70 is disposed in the machine room 60 at the upper part of the compressor 6, the control board box 70 is formed with a partition wall (a top wall, a back wall, a side wall, a bottom wall, etc. of the machine room 60). ) May be provided so as to be held on the top wall, the back wall, or the side wall, and when the terminal box 601 (or the power connection terminal 610) is provided on the top of the compressor 6, the control board The box 70 may be detachably attached to the upper surface opening or the side surface opening of the terminal box 601 that houses the power connection terminal 610 or may be integrally formed.

  As described above, in the present embodiment, the weight of the control board 7 is used so as to avoid resonance in the low frequency range when the compressor 6 is started by using a wide band gap semiconductor for the semiconductor component 11 that is an inverter driving component. Since the weight and size of components mounted on the control board 7 and the weight and size of the control board box 70 are adjusted, an increase in vibration due to resonance can be suppressed and control can be performed. Connection parts such as the board box 70 and the control board 7 (for example, the connection part between the control board box 70 and the flange part 605 of the terminal box 601 of the compressor 6, the connection part between the control board 7 and the control board box 70, and the control The semiconductor component 11 mounted on the substrate 7 or a solder connection portion between the control-related component and the control substrate 7 is not detached or damaged due to abnormal vibration due to resonance. Appliances such as refrigerators and washing machines and refrigeration and air-conditioning apparatus provided with a machine 6 is obtained.

  2 and 3, an example in which a portion of the bottom surface of the control board box 70 facing the terminal box 601 is opened (a control board box opening 79 which is an opening on the bottom surface of the control board box 70). In the case where there is a problem if the upper part of the terminal box 601 is open (terminal box opening 602) due to measures such as electrical insulation such as electric leakage or fire, etc. Separately, a terminal box cover 701 made of an electrically insulating material or a flame retardant material may be detachably provided so as to cover the terminal box opening 602 above the terminal box 601. Further, the control board box opening 79 provided on the bottom surface of the control board box 70 may be blocked, or the opening 79 may not be provided.

  In this case, the terminal box cover 701 that covers the upper surface opening is provided at the upper surface opening of the terminal box 601, and the opening is not provided at the bottom of the control board box 70. Since the power supply lead wire connected to the terminal 610 of the machine 6 cannot be taken out from the terminal box opening 602 above the terminal box 601 or the control board box opening 79, at least one of the side and bottom surfaces of the terminal box 601 What is necessary is just to provide terminal box lead wire opening parts, such as an opening and a notch, in a part. Further, the control board box 70 is provided with a control board box lead wire opening such as an opening or a notch on at least a part of a bottom surface, a side surface, or an upper surface of a portion not facing the terminal box opening 602, and a power source connected to the terminal 610. A lead wire is taken out from a terminal box lead wire opening provided on the side or lower side (or upper side) of the terminal box 601, and a control board box opening provided on the side, lower side or upper side of the control board box 70. What is necessary is just to connect to the semiconductor component 11 etc. which are mounted in the control board 7 in the control board box 70 more.

  Thus, even if the terminal 610 of the compressor 6 and the control board 7 are connected, the connection distance between the terminal 610 and the control board 7 can be extremely shortened compared to the conventional case. Therefore, among lead wires, the length of the power supply lead wire, which has a relatively large wire diameter and can be a source of electromagnetic noise, can be extremely shortened, and electromagnetic noise can be greatly reduced. Since the length of the power lead having a large wire diameter and high cost can be extremely shortened, a low-cost and low-noise compressor and equipment can be obtained. In addition, it is possible to obtain a highly reliable compressor and device that can suppress malfunction of the device due to noise and can also suppress a failure due to electric leakage.

  Further, the control board box 70 does not have to be formed integrally with the terminal box 601 of the compressor 6 or detachably fixed, and the inner wall of the machine room 60 is provided in the vicinity of the terminal box 601 of the compressor 6 through a space. It may be detachably fixed to. Here, the control board box 70 is placed on the wall surface of the machine room such as the top wall, the back wall, and the side wall of the machine room 60 around the compressor 6 (desirably above), and the outdoor unit body and hot water supply of the refrigerator body and the air conditioner. It may be installed so as to be slidable before and after the apparatus main body such as the heat source main body of the machine. If slidable installation is performed in this manner, the control board box 70 is not removed from the wall surface of the machine room 60 each time maintenance is performed on the control board 7 and the semiconductor component 11 in the control board box 70. If the machine is slid outside the machine room 60 so that maintenance, replacement or repair of parts can be performed, a device with good serviceability can be obtained.

  The compressor 6 of the present embodiment is provided in a casing (sealed container) 6X that houses therein a compression mechanism section that compresses a refrigerant and an electric motor that rotationally drives the compression mechanism section, and is provided in the casing 6X and energizes the electric motor. A power connection terminal 610, a terminal box 601 that is provided in the casing 6X and covers at least a part of the periphery of the power connection terminal 610, a control board 7 on which a semiconductor component 11 that drives and controls an electric motor is mounted, A control board box 70 for housing the control board 7, a wide band gap semiconductor is used for the semiconductor component 11, and the control board box 70 is detachably attached to the terminal box 601. The distance can be extremely shortened compared to the conventional case. Therefore, the length of the power supply lead wire, which has a relatively large wire diameter among the lead wires and can be a source of electromagnetic noise, can be extremely shortened, so that electromagnetic noise can be greatly reduced. Moreover, since the length of the power lead having a large wire diameter and high cost can be extremely shortened, a low-cost and low-noise compressor and equipment can be obtained. In addition, it is possible to obtain a highly reliable compressor and device that can suppress malfunction of the device due to noise and can also suppress a failure due to electric leakage.

  In the compressor 6 according to the present embodiment, since the shock absorbing material 350 is interposed between the control board box 70 and the terminal box 601, the shock absorbing material can absorb or reduce vibrations such as vibration-proof rubber, etc. If the vibration isolating member has an anti-vibration function, it is difficult for vibration generated in the compressor 6 to be directly transmitted to the control board box 70 and the control board 7, and a compressor and a device with low vibration and few failures of the control board 7 are obtained. It is done. Further, if the buffer material 350 is an electrical insulating member having electrical insulation, it is possible to suppress leakage from the control board box 70 to the compressor 6 or leakage from the compressor 6 to the control board box 70. A highly efficient compressor and equipment can be obtained.

(Second control board)
Here, when the machine room 60 in which the compressor 6 constituting the refrigeration cycle is housed is provided at the lower back of the refrigerator 1 as shown in FIG. 1, as shown in FIGS. Also in the heat insulating material (for example, urethane heat insulating material) above the machine room 60 such as the upper part of the rear surface of the refrigerator 1 or the vicinity of the center in the height direction of the back side in combination with the control board box 70 provided in the machine room 60. A control board box 70A may be provided. The second control board box 70 </ b> A is provided in a heat insulating material (for example, a urethane heat insulating material) above the machine room 60, such as in the upper part of the back surface of the refrigerator 1 or in the vicinity of a substantially central position in the height direction of the back surface. In addition, when the machine room 60 is provided at the upper rear portion of the refrigerator 1 as shown in FIG. 6, the control board box 70 </ b> A is located at the lower rear portion of the refrigerator 1 or near the center in the height direction of the rear surface of the refrigerator 1. It is provided in the heat insulating material below the machine room 60.

FIG. 4 is a schematic sectional side view of another refrigerator in which the machine room representing the first embodiment of the present invention is provided at the lower back of the refrigerator main body, and FIG. It is a rear perspective view which shows arrangement | positioning of the compressor which comprises a cycle, a thermal radiation pipe, etc. In the figure, the same parts as those in FIGS.

  In the figure, a refrigerator 1 is provided with, for example, a refrigerating chamber 2 at the top, a switching chamber 3 and an ice making chamber 35 provided in parallel below the refrigerating chamber 2, and a freezing chamber 4 provided below the switching chamber 3 and the ice making chamber 35. The vegetable compartment 4 is provided under the freezer compartment (lowermost level). Here, between each storage room (for example, refrigerator room 2, switching room 3, ice making room 35, freezer room 4, vegetable room 5) between rooms with different set temperatures (storage temperatures) (for example, storage rooms for plus temperature bodies) Between the storage chambers of the negative temperature body and the like) is partitioned by a partition member 8 having a heat insulating material (a partition member, in which a urethane heat insulating material or a vacuum heat insulating material is enclosed). (If the set temperature between each storage room is approximately the same (between storage rooms between plus temperature zones or between storage rooms between minus temperature zones, etc.), a heat insulating material is not necessarily required, so it is necessary to provide a heat insulating material. In addition, a machine room 60 in which the compressor 6 and the like are arranged is provided below the back of the refrigerator 1.

  Further, a back heat insulating material 80 is provided between the inner box 101 and the outer box 102 on the back surface of the refrigerator body 1, and a cooler 200 provided in a cooler chamber is provided on the back surface of the refrigerator body 1. The compressor 6 provided in the machine room 60, and between the inner box 101 and the outer box 102 on the rear surface of the refrigerator body 1, the compressor 6, the compressor cooling fan 68, the cool air blower fan (not shown), etc. A control board box 70 containing a control board 7 for controlling the control and a control board box 70A containing a control board 7A are arranged, an accumulator 61, an expansion device (for example, a capillary tube or an electronic expansion valve) 62, a compression A heat radiating pipe (condensation pipe) 9 and the like that are connected to the machine 6 and constitute a refrigeration cycle together with a cooler and the like are arranged. Here, a compressor 6 and a control board box 70 are disposed in a machine room 60 provided on the back of the refrigerator 1, and a compressor cooling fan 68, an accumulator 61, and an expansion device (for example, a capillary tube or an electronic expansion valve). 62), a heat radiating pipe (condensing pipe) 9 connected to the compressor 6 and constituting a refrigeration cycle together with a cooler and the like, a drain pan 660 for receiving drain water, and the like.

  The heat radiating pipe 9 is connected to the expansion device 62 from the compressor 6 through the side of the refrigerator, the rear of the refrigerator, the upper surface of the refrigerator (or the lower surface of the refrigerator), the side of the refrigerator, and the like. 6 is connected. The compressor 6 is driven by an inverter system capable of arbitrarily adjusting the rotation speed of the motor, and is driven by a control board 7 on which, for example, an inverter drive circuit component 11 which is a semiconductor component is mounted. For example, in FIG. 4, the control board 7 is housed in a control board box 70 disposed in a machine room 60 provided at the lower back. The control board box 70 is provided in the vicinity of the compressor 6 in the machine room 60, and is disposed above the side of the compressor 6 and on the side of the compressor 6 with a space. Here, as described with reference to FIGS. 1 to 3, the control board box 70 may be provided directly on the upper part of the terminal box 601 of the compressor 6 or via the buffer material 350.

  The control board box 70 is disposed in a machine room 60 provided at the lower back of the refrigerator 1 shown in FIGS. 1, 4, and 5, and is installed in the machine room 60 and viewed from the back of the refrigerator 1. The side (front side) or the upper surface side or the side surface is open, so that the maintenance of the control board 7, the semiconductor component 11 and the control-related components can be maintained and replaced. A control board box lid 701 that is a lid member is appropriately provided in the opening of the control board box 70. Here, in FIGS. 1, 4, and 5, the heat radiating pipe 9 passes from the compressor 6 through at least one place such as the side of the refrigerator, the back of the refrigerator, the top of the refrigerator, the side of the refrigerator, and the like in the machine room 60 or the main body of the refrigerator 1. It is connected to an expansion device 62 arranged in the heat insulating material 80.

  Here, to control the second control board 7A (for example, a control board 7 for controlling an actuator different from the control board 7 (for example, display control provided on the door, energization control of the heater of the rotating partition provided on the door, etc.) A second control board 7A provided separately, or a second control board 7A provided by dividing a part of the control board 7 on the back surface of the refrigerator 1 in order to control an actuator partially overlapping with the control board 7 or The second control board 7A provided alone without providing the control board 7 is provided in the second control board box 70A disposed above the machine chamber 60 or at a substantially central position in the height direction. In this case, since the heat radiating pipe 9 is arranged from the machine room 60 to the side of the refrigerator, the second control board box 70A provided on the back of the refrigerator does not get in the way, but the heat radiating pipe 9 is cooled from the back of the refrigerator. Cabinet top or when placed from the refrigerator top to the refrigerator side, the radiating pipe 9 is disposed so as to pass through the side surface of the second control board boxes 70A to second control board 7A are accommodated. Further, at least one of the ceiling surface, the back surface, the side surface, and the bottom surface of the refrigerator main body 1 is provided with one or more vacuum heat insulating materials 10 in order to enhance the heat insulating performance between the inside and the outside of the refrigerator 1, It is also arranged between the back surface 71 of the second control board box 70A and the inner box 101.

(The machine room is located at the upper back of the refrigerator body)
Next, the case where the machine room 60 is provided on the upper back of the refrigerator 1 will be described. FIG. 6 shows the rear of the refrigerator in which the machine room representing the first embodiment of the present invention is provided on the upper back of the refrigerator body. It is a back perspective view which shows arrangement | positioning, such as a compressor and a heat radiating pipe which comprise a refrigerating cycle. In the figure, the refrigerator 1 is provided with a plurality of storage rooms such as a refrigerating room 2, a switching room 3, an ice making room 35, a freezing room 4, a vegetable room 5, etc., and is not described here. . Here, between each storage room (for example, refrigerator compartment 2, switching room 3, ice making room 35, freezer room 4, vegetable room 5), between the rooms where setting temperature (storage temperature) differs, it is with heat insulating material (partition member) 8. It is partitioned. A machine room 60 is provided above the back of the refrigerator 1, and the compressor 6, the control board box 70, the compressor cooling fan 68, a part of the capillary tube 62 that is an expansion device, A part of the heat radiating pipe 9, an accumulator (or a suction muffler) 61, and the like are accommodated.

  In addition, a rear heat insulating material 80 is provided on the rear surface of the refrigerator 1, and is below the machine room 60 provided above and at a substantially central position in the height direction of the rear surface of the refrigerator 1 or a lower position on the rear surface. Is provided with a cooler chamber, and a cooler 200 is provided in the cooler chamber. Here, the compressor 6, the accumulator 61, the suction pipe 63, the cooler 200, the capillary tube 62 that is an expansion device, the heat radiation pipe 9, and the compressor 6 are connected in this order to constitute a refrigeration cycle. The suction pipe 63 is connected to the cooler 200 from the compressor 6 (or accumulator 61) through the back of the refrigerator, for example, and an expansion device 62 (for example, a capillary tube or an expansion valve) connected to the cooler 200 It is provided on the back surface and is connected to the heat radiating pipe 9 on the upper surface of the refrigerator 1 through the back surface. The compressor 6 is driven by an inverter system capable of arbitrarily adjusting the rotation speed of the motor, and is driven by the control board 7. The control board 7 is housed in a control board box 70 disposed in a machine room 60 provided at the upper back of the refrigerator 1. The control board box 70 is provided in the machine room 60 in the vicinity of the compressor 6, and is disposed above and to the side of the compressor 6 with a space between the compressor 6 and maintenance of the control board 7. It is provided so that it can be exchanged. Here, as described with reference to FIGS. 2 and 3, the terminal box 601 and the control board box 70 are formed integrally with the control board box 70 directly on the terminal box 601 of the compressor 6 or through the buffer material 350. You may attach so that attachment or detachment is possible. (The control board box 70 may be attached to the terminal box 601 of the compressor 6 so that the control board 7 can be maintained or replaced.)

  When the control board box 70 is installed in the refrigerator 1, the front side (front side) or the upper side or the side faces as viewed from the rear side of the refrigerator 1 are opened. It is possible to exchange and maintain. A lid member 701 is appropriately provided at the opening of the control board box 70. Here, in FIG. 6, the suction pipe 63 is connected from the compressor 6 (or accumulator 61) disposed in the machine room 60 at the top of the refrigerator 1 to the cooler 200 in the cooler room disposed below the back of the refrigerator. The capillary tube 62 as an expansion device is connected from the cooler 200 disposed below the refrigerator 1 to the heat radiating pipe 9 disposed on the top of the refrigerator.

  Here, the second control board 7A (when the control board 7A is provided separately from the control board 7 or when a part of the control-related parts of the control board 7 is divided as the control board 7A on the back of the refrigerator 1). When it is provided, or when only the control board 7A is provided alone, etc.) is provided in the second control board box 70A disposed on the back surface of the refrigerator 1 below the machine room 60 The capillary tube 62 (or the suction pipe 63) is disposed so as to pass through the heat insulating material 80 on the side surface or the back surface of the control board box 70A or between the heat insulating material 80 and the control board box 70A. In addition, at least one of the ceiling surface, the back surface, the side surface, and the bottom surface of the refrigerator 1 is provided with one or more vacuum heat insulating materials 10 in order to improve the heat insulating performance between the inside and the outside of the refrigerator 1, It is also arranged between the back surface 71 of the substrate box 70 </ b> A and the inner box 101.

(Wide band gap semiconductor)
1 to 6, an inverter drive circuit for driving control of a semiconductor component 11 (for example, a compressor 6, a compressor cooling fan 68, a cold air blower fan) mounted on the control board 7 (or the second control board 7 </ b> A). Wide bandgap semiconductors are used as semiconductors. Conventionally, a semiconductor based on silicon (Si) has generally been used for the semiconductor component 11 such as an inverter drive circuit component mounted on the control substrate 7 (or the second control substrate 7A). In the invention, a wide band gap semiconductor is used, and as the wide band gap semiconductor, for example, silicon carbide (SiC), gallium nitride (GaN), diamond, aluminum gallium nitride (AlGaN), or the like is used.

  The advantages of wide band gap semiconductors (eg, silicon carbide SiC, gallium nitride, gallium nitride (GaN), etc.) over silicon (Si) semiconductors include the following two points. The first advantage is that the element loss is small and high-temperature operation is possible. Since Si generates a large amount of heat, and it becomes difficult to operate at a temperature of about 100 ° C. to 200 ° C., it is necessary to provide a heat dissipating fin (heat radiator 12) and to dissipate heat through air. A storage capacity for mounting and a space for heat dissipation are required. On the other hand, wide band gap semiconductors (for example, SiC) have low switching loss in the element and are energy saving. Also, since performance is hardly lowered up to about 300 ° C. Can be used. Further, since the performance is hardly lowered up to about 300 ° C., there is a merit that the heat dissipating fins 12 are unnecessary, or the heat dissipating fins 12 can be made considerably small (height and size are reduced and reduced in height and size). is there.

  The second merit is that the thickness of the device, which is a semiconductor component, can be reduced. Wide band gap semiconductors (for example, SiC and GaN) have a high breakdown field strength, so the breakdown voltage of the semiconductor is large (having a breakdown voltage about 10 times that of silicon (Si)). It can be as small as 1/10 (thin). In the present invention, by using a wide bandgap semiconductor having such characteristics, it is possible to realize a drastic downsizing and low profile of the inverter drive circuit component 11 and a structure that does not have to worry about the heat dissipation environment. A small refrigerator with a high degree of design freedom and a good quality in a high temperature environment can be obtained.

  1 to 6, since a wide band gap semiconductor is used for the semiconductor component 11 such as the inverter drive circuit component mounted on the control board 7 (or the second control board 7A), as described above. Since the dielectric breakdown electrolytic strength is large and the withstand voltage is large, the thickness and size can be reduced (about 1/10 compared with silicon). Moreover, since it can operate | move at high temperature of 300 degreeC, the radiation fin (radiator) 12 for cooling of the semiconductor component 11 can also be made extremely small. Therefore, conventionally, the inverter drive circuit component is provided with the radiator 12 that is mounted on the control board 7 (or the second control board 7A) and is extremely higher than other control-related parts. In the present invention, by using a wide band gap semiconductor for a certain semiconductor component 11, the combined height and size (vertical and horizontal width) of the radiator 12 and the inverter drive circuit component 11 are extremely small (reduced in height and height). The height of other control-related components (for example, a power supply reactor, a capacitor, a transformer, a current detection component, etc.) mounted on the control board 7 (or the second control board 7A) is equivalent to or equivalent to that of the control board 7 (or the second control board 7A). It is possible to reduce it to a height of less than about.

(Control board, control board box)
FIG. 7 is a view of the control board 7 of the refrigerator 1, which is a device, as viewed from the front. 8 is a view of the control board 7 as viewed from the side, FIG. 8 (a) is a view of the control board 7 according to the embodiment of the present invention as seen from the side, and FIG. 8 (b) is a conventional control board 7. It is the figure which looked at from the side. In the figure, the control board 7 is composed of, for example, an inverter drive circuit component and a semiconductor component 11 composed of a wide band gap semiconductor, etc. A heat dissipating fin 12 that is a heat dissipator for dissipating heat, a transformer 13 that converts a power source voltage from, for example, 100 V to 12 V, a relay 14, a converter 15, a capacitor 16, a current detecting sensor 17 that is a current detecting component, and the like are mounted. .

  The control board 7 (or the second control board 7A) is a control board box 70 (or the second control board 7A) in a state in which the semiconductor component 11 and other control-related components (for example, the transformer 13, the converter 15, the capacitor 16, and the like) are mounted. 2 and is fixed and held on the back surface (bottom surface) of the control board box 70 (or control board box 70A) by control board fixing means 79 such as bolts. In the control board box 70 (or control board box 70A), the power supply reactor and the like are stored together with the control board 7 (or second control board 7A). You may arrange separately, without storing. The radiator 12 is fixed by pressure to the inverter drive circuit component 11 which is the semiconductor component 11 with an adhesive, a bolt, or the like via a sheet-like heat radiation auxiliary member 110 having good thermal conductivity. For example, the sheet-like heat radiation assisting member 110 having a predetermined thickness is only required to have thermal conductivity, and is more preferable because it has better elasticity because it is easier to closely dissipate. Here, the sheet-shaped heat radiation auxiliary member 110 is not necessarily provided, and may not be provided, and the heat radiator 12 and the inverter drive circuit component which is the semiconductor component 11 are directly bonded with an adhesive or a bolt. Or it may be fixed.

  Here, as shown in FIG. 8A, the semiconductor component 11 such as the inverter drive circuit component mounted on the control board 7 (or the second control board 7A) of the embodiment of the present invention and the radiator 12 are combined. The height of the other control-related parts (for example, the transformer 13, the converter 15 and the capacitor 16) of the embodiment of the present invention is A4, and the control board box 70 (or the control) of the embodiment of the present invention. The height of the board box 70A) is H, and the control board box 70 (or the control board box 70A) is open at the top in the height direction. Further, as shown in FIG. 8B, the combined height of the semiconductor component 11 such as the inverter drive circuit component mounted on the conventional control board 7 (or the second control board 7A) and the radiator 12 is A2, The height A3 of other conventional control-related components (for example, the transformer 13, the converter 15 and the capacitor 16) is H2, and the height of the conventional control board box 70 (or control board box 70A) is H2. Is open.

  Here, conventionally, as shown in FIG. 8B, the size of the control board 7 (or the second control board 7A) is determined by the size of the control board box and the installation space is determined. 7 (or the second control board 7A) is preferably as small as possible, and there is a need to increase the heat dissipation area by increasing the radiator 12 in the height direction to reduce the installation area. 12 and the inverter drive circuit component 11 are combined with other control-related components when mounted on the control board 7 (or the second control board 7A) because the height of the radiator 12 is required to be high. For example, the height H2 of the control board box 70 (or the second control board box 70A) has to be increased. Therefore, for example, when installing in the machine room 60, since the temperature in the machine room 60 becomes high, it is necessary to further increase the height and size of the radiator 12, and accordingly, the control board 7 (or the first board). The height and size of the second control board 7A) and the control board box 70 (or the second control board box 70A) need to be increased, and it is difficult to store and arrange them in the limited space in the machine room 60. It was. Further, in the refrigerator, for example, even when considering incorporating the second control board 7A into the back surface of the refrigerator 1, only the portion where the control board box 70A is arranged is provided on the heat insulating wall on the back surface (or ceiling surface) of the refrigerator 1. Since the thickness (the total thickness of the control board box 70A and the rear heat insulating material 80) is required to be large, the heat insulation wall of the part where the control board box 70A is installed protrudes to the inside of the cabinet, and the interior volume The (storage chamber volume) was reduced accordingly.

  However, in the present invention, a wide band gap semiconductor is used for the semiconductor component 11 such as an inverter drive circuit component provided with the radiator 12, so that the radiator 12 and the semiconductor component 11 are combined as shown in FIG. The height A can be made extremely small (low profile) (A <A2)), so that other conventional control-related components (for example, the power reactor, the capacitor 16, the transformer 13, and the current detection) are mounted on the control board 7. The height H of the control board box 70 (or the second control board box 70A) can be reduced to the same height as the height A3 of the component 17 or the like. (Or the second control board box 70 </ b> A) can be significantly lower than the height H <b> 2, and the equipment space required for storage can be reduced. Therefore, the control board 7, 7A and the control board box 70, 70A can be accommodated in the machine room 60 of the equipment such as an air conditioner or a refrigerator, and the control board 7A and the control board box 70A are provided on the back of the refrigerator 1. Even in the disposed state, the thickness of the heat insulating wall on the back surface of the refrigerator 1 where the control board box 70 is disposed (the thickness of the control board box 70 and the back heat insulating material 80 combined) can be reduced. The inner volume (for example, the inner volume of the storage chamber 2) can be increased without protruding to the inner side.

  Here, the height A of the heat sink 12 and the semiconductor component 11 such as an inverter drive circuit component combined with the semiconductor component 11 mounted on the control board 7 (or the second control board 7A) is another conventional control-related component. When the height can be made lower than the height A3 (for example, power supply reactor, capacitor 16, transformer 13, current detection component 17, etc.) (A <A3), conversely, as shown in FIG. The height A4 of other control-related components (for example, power supply reactor, capacitor 16, transformer 13, current detection component 17, etc.) is set to the semiconductor component 11 such as the inverter drive circuit component and the radiator 12 according to the embodiment of the present invention. The height of the control board 7 (or the second control board 7A) can be further reduced by lowering it to the same level as the combined height A (A4 <A3), and therefore the control board box 70 (or The height H of the second control board boxes 70A) can be suppressed even lower.

  Here, in the present embodiment, the semiconductor of the inverter drive circuit component 11 (for example, a switching element or a diode element) is formed of a wide band gap semiconductor having a larger band gap than silicon (Si). Examples of the semiconductor include silicon carbide, silicon carbide-based material, gallium nitride, gallium nitride-based material, and diamond.

  Switching elements and diode elements formed by such wide band gap semiconductors have high voltage resistance and high allowable current density, so that switching elements and diode elements can be miniaturized. By using elements and diode elements, it is possible to reduce the size of a semiconductor module incorporating these elements.

  Further, since the heat resistance is high, the heat radiation fins 12 of the heat sink can be downsized and the water cooling section can be air cooled, so that the semiconductor module can be further downsized.

  Furthermore, since the power loss is low, it is possible to increase the efficiency of the switching element and the diode element, and further increase the efficiency of the semiconductor module.

  Here, the MOSFET using SiC has a vertical device structure, which is advantageous for increasing the capacity and is easy to increase the current and withstand voltage. Application to is desirable. In addition, GaN-FETs using GaN have a horizontal device structure that is easy to reduce resistance and can be reduced in cost, such as refrigerators used in low current ranges and relatively small room air conditioners. Application to small equipment is desirable.

  Note that it is desirable that both the switching element and the diode element are formed of a wide band gap semiconductor. However, either one of the elements may be formed of a wide band gap semiconductor, and the effects described in the present embodiment. Can be obtained.

  In the present invention, the combined height A of the semiconductor component 11 such as the inverter drive circuit component and the radiator 12 or the height of the radiator 12 can be extremely reduced by using a wide band gap semiconductor. As shown in FIG. 8 (a), the height A of the inverter drive circuit component 11 and the radiator 12 which are semiconductor components of the control board 7 (or control board 7A) can be kept small. The height H of the box 70 (or control board box 70A) can also be kept low. Therefore, in the case where the second control board box 70A is arranged in the heat insulating material on the back of the refrigerator 1, the control board box 70A can be prevented from projecting to the inner side (the storage room side). The volume of the storage room) can be increased, and energy-saving equipment such as the refrigerator 1 can be obtained.

  Further, since the height H of the control board box 70A (or 70A) can be reduced, the inner box of the portion where the second control board box 70A is arranged can be prevented from projecting to the inside of the cabinet, so that the rear heat insulating material 80 There is no need to bend or protrude the inside of the cabinet, and the vacuum heat insulating material 10 that is vulnerable to deformation processing such as bending processing (the outer packaging material may be broken if bending processing) is the control board box on the back of the chamber Even if it arrange | positions between the back surface 71 of 70A, and the inside of a store | warehouse | chamber (inner box 101), it becomes possible to install in the shape of a flat plate without bending the flat vacuum heat insulating material 10.

  Here, since the control board box 70A is arranged on the heat insulating wall portion having a predetermined thickness constituted by the inner box 101 and the outer box 102 of the refrigerator 1, a wide band gap semiconductor is provided in the inverter drive circuit component 11. If the original length (distance) between the back surface 71 of the control board box 70A and the inner box 101 is short even when the height (depth) H of the control board box 70A is reduced, the necessary heat insulation is required. In order to ensure the thickness, the inner box 101 on the back surface 71 of the control board box 70A needs to be slightly protruded inside the cabinet. Even in such a case, a flat vacuum is formed on the back surface 71 of the control board box 70A. It is possible to arrange the heat insulating material 10. In this case, there is a possibility that the vacuum heat insulating material 10 needs to be slightly bent, and the amount of protrusion of the inner box 101 to the inner side of the box can be made smaller than before, so that the bending angle of the vacuum heat insulating material 10 is conventionally changed. Therefore, the heat insulation performance of the vacuum heat insulating material 10 is not lowered, and a high quality device such as a refrigerator that does not deteriorate the heat insulation performance can be obtained.

  That is, the refrigerator is within a range of a small predetermined angle (for example, a small bending angle of about 30 degrees or less) such that the outer packaging material is not torn or damaged when the vacuum heat insulating material 10 is bent. Since it can be installed on the back side, the outer packaging material is not torn or damaged even when the vacuum heat insulating material 10 is bent. Therefore, the possibility of the vacuum heat insulating material 10 not functioning or degrading and reducing the performance can be reduced. A decrease in performance can be suppressed.

(Heat radiation by bringing the wide band gap semiconductor into contact with the control board box)
In addition, as shown in FIG. 9, when the semiconductor component 11 such as the inverter drive circuit component mounted on the control board 7 (or 7A) is composed of a wide band gap semiconductor, the heat resistance is high, and the heat radiation fins. Is unnecessary or extremely small, so the control board box 70 (or 70A) is made of a material having good thermal conductivity (such as iron, aluminum, copper, or alloy steel thereof), and semiconductor components such as inverter drive circuit components 11 may be configured to directly contact the control board box 70 (or 70A) to assist heat dissipation.

  FIG. 9 is a side view of the control board 7 (or the second control board 7A) in the control board box 70 (or the second control board box 70A) representing the first embodiment of the present invention. The semiconductor component 11 which is an inverter drive circuit component is brought into direct contact with a control board box 70 (or 70A) made of a heat conductive material such as a metal, resin, or rubber having thermal conductivity, and the control board box 70 (or 70A). May be used as a heat dissipating component that performs heat dissipation or heat dissipation assist of the inverter circuit component 11. A simple configuration is obtained by sandwiching a semiconductor component 11 such as an inverter drive circuit component between the control board 7 (or 7A) and the control board box 70 (or 70A) and pressing and fixing the control board fixing means 79 such as a bolt. However, it is possible to obtain a device drive control device and device that can perform drive control of an inverter, a fan motor, and the like that are low in cost and have good assemblability.

  In the present invention, since a wide band gap semiconductor is used for the semiconductor component 11 such as an inverter drive circuit component, the heat-resistant temperature is higher than that of a conventional semiconductor component using silicon Si (about 300 ° C.). Heat can be radiated even if the control board box 70 provided so as to be in contact with the heat insulating material 80 such as urethane is used instead of the heat radiating fins, and the control board box 70 (or 70A) is embedded in the heat insulating material 80. Even if it is difficult to dissipate heat in the configuration, the heat resistance temperature of the semiconductor component 11 is high, so that the temperature in the control board box 70 (or 70A) may rise until the heat resistance temperature of the semiconductor component 11 is exceeded. Therefore, the inverter drive circuit component 11 does not fail and there is no problem in reliability.

  As described above, the control board box 70 (or 70A) is used in place of the heat radiation fin as a configuration in which the semiconductor component 11 such as the inverter drive circuit part is directly brought into contact with the inner wall of the control board box 70 (or 70A). Since the height of the control board box 70 (or 70A) can be kept low, the thickness between the inner box and the outer box (thickness of the heat insulating material 80, etc.) can be reduced, so that the cost is low. Equipment such as a refrigerator can be obtained. Further, since the semiconductor component 11 such as the inverter drive circuit component is composed of a wide bandgap semiconductor, the semiconductor component 11 such as the inverter drive circuit component can be thinned, and the thickness of the control board box 70 (or 70A) can also be thinned. The storage chamber volume (internal volume) of the refrigerator 1 can be increased. Further, since the semiconductor component 11 such as the inverter drive circuit component is composed of a wide band gap semiconductor, an energy-saving device such as a refrigerator can be obtained.

  In addition, since a wide band gap semiconductor is used for the semiconductor component 11, a configuration that does not require a heat radiating fin is possible, so that the structure can be simplified and a low-cost device such as a refrigerator can be obtained. Further, since the semiconductor component 11 such as the inverter drive circuit component can be directly brought into contact with the control board box 70 (or 70A), the control board 7 (or 7A) and the control board box 70 (or 70A) are conventionally used. It is not necessary to provide a predetermined gap between the control board 7 and the height when the control board 7 (or 7A) is stored in the control board box 70 (or 70A). That is, since the height of the control board box 70 (or 70A) can be further reduced, the storage chamber volume (internal volume) can be increased. In addition, in equipment such as an air conditioner and a washing machine, since the installation space of the control board box 70 (or 70A) can be reduced, the space can be afforded by the reduced amount, so that additional parts can be installed in the spare space, Space can be used effectively. In addition, the equipment can be reduced in size by the marginal space.

(Heat dissipation auxiliary member)
Here, when it is difficult to directly contact the semiconductor component 11 such as the inverter drive circuit component with the inner wall of the control board box 70 (or 70A), the same material as the material with good thermal conductivity (control board box 70 (or 70A) is used. The material may be in thermal contact via the heat radiation auxiliary member 110 (which may be a material or another material). The heat radiation auxiliary member 110 is preferably made of a metal having good thermal conductivity, for example, but the heat generated by the heat generated by the inverter drive component 11 can be radiated to the outside (for example, the control board box 70 (or 70A) or in the air). A resin or an elastic member having thermal conductivity may be used. Further, the size of the heat radiation auxiliary member 110 is good, for example, if the size is equal to or larger than the size (width or length) of the inverter drive circuit component 11 so that heat can be radiated. Moreover, since the thickness can be reduced if the heat radiation auxiliary component 110 is, for example, in the form of a sheet, the height of the control board 7 and the control board box 70 (or 70A) can be suppressed. As described above, even if the control board box 70 (or 70A) is used in place of the heat radiating fin as a configuration in which the inverter drive circuit component 11 is brought into contact with the control board box 70 (or 70A) via the heat radiating auxiliary member 110, the heat radiating auxiliary member. The same effect as when 110 is not provided can be obtained. Here, if the heat radiation auxiliary component 110 is a material that also has electrical insulation, there is no fear of leakage and a safe device can be provided.

  In particular, the control board box 70 </ b> A is substantially centered on the back surface with respect to the height direction of the refrigerator 1 (for example, when the compressor 6 is provided at the upper back of the refrigerator 1, lower than the machine room 60 in which the compressor 6 is accommodated. When the compressor 6 is provided at the lower back of the refrigerator 1 above the lowermost storage room (for example, the vegetable room 5), the refrigerator 1 is located above the machine room 60 in which the compressor 6 is accommodated. It is provided at the uppermost storage chamber position or below the uppermost storage chamber (for example, when the uppermost storage chamber is the refrigerator compartment 2, it is below the uppermost shelf position in the refrigerator compartment 2). In this case, the control board box 70A is arranged at a height position where a storage room that is frequently used by the user is arranged as compared with the case where the control board box 70A is provided at the uppermost part of the rear surface or the lowermost part of the rear surface. Therefore, a large storage capacity is desired as a refrigerator. Since the storage compartment that is to be disposed, large significance and effect of increasing the thinner to the internal volume of the thickness of the control board box 70A.

  Here, when it is desired to electrically insulate between the semiconductor component 11 such as the inverter drive circuit component and the control board box 70 (or 70A), the heat radiation auxiliary member 110 has thermal conductivity and electrical insulation. As a material, a heat radiation auxiliary member 110 is interposed between the control board box 70 (or 70A) and the semiconductor component 11 such as an inverter drive circuit component, or a sheet shape having a predetermined thickness and having a resinous electric insulation. If an electric insulating member which is another member of the above is prepared and this electric insulating member is interposed between the heat radiation auxiliary member 110 and the control board box 70 (or 70A), a semiconductor component such as an inverter drive circuit component 11 and the control board box 70 (or 70A) can be electrically insulated, so there is no problem in terms of electrical insulation and safety.

  Here, the electrical insulation between the control board box 70 (or 70A) and the equipment main body (the main body of the refrigerator 1, the outdoor unit main body of the air conditioner, the heat source main body of the water heater, etc.) provided with the control board box 70 (or 70A). Is required between the control board box 70 (or 70A) and the apparatus main body (for example, the heat insulating material 80, the inner box 101, the outer box 102, the casing constituting the apparatus main body, etc.). Alternatively, an electrical insulating member may be interposed between 70A) and the lid of the control board box 70 (or 70A).

  Here, in this embodiment, for example, a wide band gap semiconductor is used for the semiconductor component 11 constituting the inverter drive circuit component, and the semiconductor portion 11 such as the inverter drive circuit component is directly in contact with the control board box 70 (or 70A). The configuration to be performed has been described in the example of the refrigerator. However, the control board 7 (or the semiconductor component 11 such as an inverter drive circuit component of an apparatus that performs inverter control such as an outdoor unit of an air conditioner other than the refrigerator or a heat source device of a water heater) (or The present invention can also be applied to the second control board 7A) and the control board box 70 (or the second control board box 70A).

  Further, the control board 7 (or 7A), the control board box 70 (or 70A) shown in FIG. 8 and FIG. About a structure, it can apply not only to a refrigerator but to other household appliances, such as an air conditioner, a water heater, and a washing machine, and can obtain an equivalent effect. When applied to an air conditioner outdoor unit or a water heater heat source unit, the control board box 70 (or 70A) can be made thin, so the height and width of the outdoor unit and heat source unit can be reduced and the size can be reduced. Also, the weight and cost can be reduced. Further, when applied to a washing machine having a washing layer, the width, depth and height of the washing machine body can be reduced and the size can be reduced, and the weight and cost can also be reduced.

  As described above, in the compressor 6 of the present embodiment, the control board box 70 is formed of a heat conductive member, and the semiconductor component is fixed so as to be thermally connected to the control board box, and the heat generation of the semiconductor part is performed. Since heat is radiated by the control board box, no heat radiating fin is required, and a low-cost compressor and equipment can be obtained. Further, since the height of the control board box 70 (or 70A) can be kept low, for example, when the device is a refrigerator, the thickness between the inner box and the outer box (thickness of the heat insulating material 80, etc.) is reduced. Therefore, a low-cost refrigerator or the like can be obtained. Further, since the semiconductor component 11 such as the inverter drive circuit component is composed of a wide bandgap semiconductor, the semiconductor component 11 such as the inverter drive circuit component can be thinned, and the thickness of the control board box 70 (or 70A) can also be thinned. The storage chamber volume (internal volume) of the refrigerator 1 can be increased. Further, since the semiconductor component 11 such as the inverter drive circuit component is composed of a wide band gap semiconductor, an energy-saving device such as a refrigerator can be obtained.

  In the compressor 6 of the present embodiment, the semiconductor component 11 is connected to the control board box 70 via the heat radiation auxiliary member 110 that can be electrically insulated. A low-cost compressor and equipment can be obtained. Moreover, since the height of the control board box 70 (or 70A) can be kept low, the height of the device can be kept low. For example, when the device is a refrigerator, the thickness between the inner box and the outer box (thickness of the heat insulating material 80, etc.) can be reduced, so that a low-cost device such as a refrigerator can be obtained.

  In the compressor 6 of this embodiment, since the semiconductor component 11 is SiC (silicon carbide) or GaN (gallium nitride), the semiconductor component 11 can be reduced in size, weight, and heat resistance. In addition, since the radiator 12 for cooling the semiconductor component 11 can be greatly reduced in size or eliminated, the weight of the control board 7 can be reduced, and a low-cost compressor and equipment with good assemblability can be obtained. .

  Further, by using a wide band gap semiconductor for the control board 7 for driving and controlling the compressor 6, the inverter driving frequency at the time of starting the compressor 6 and the control board box 70 and the control board 7 resonate and the control board box The weight and size of the radiator 12 that cools the semiconductor component 11 that is the inverter driving component so as to prevent the breakage 70 and the control board 7 from being damaged are within the range not exceeding the weight and size of the conventional radiator. Since it is possible to adjust, it is possible to suppress the inverter drive frequency such as when the compressor 6 is started up and the control board box 70 or the control board 7 from resonating and the control board box break 70 or the control board 7 from being damaged. . That is, by adjusting the size, shape, and weight of the radiator 12, it is possible to suppress resonance of the inverter drive frequency and the control board box 70 and the control board 7 when the compressor 6 is started. , Improve reliability.

(Control board device connection configuration)
Here, a method of connecting the control boards 7 and 7A to the power source will be described. FIG. 10 is a connection diagram such as wiring of the control board of the device representing the first embodiment of the present invention. In the figure, the same parts as those in FIGS.

  In the figure, the control board 7 (or the second control board 7A) is connected to the commercial power source 400 via the power connection line 760 and supplied with power. The commercial power source 400 is connected to the terminal block 410 provided on the control board 7 (or the second control board 7A) via the power connection line 760, and further to the AC / DC converter 730 via the first connection line 761. Connected to. The AC / DC converter 730 is connected to a semiconductor component 740 that is an inverter drive circuit component via a second connection line 762. Here, in the present invention, a wide band gap semiconductor (for example, a SiC semiconductor or a GaN semiconductor) is used for the semiconductor component 740.

  The semiconductor component 740 which is an inverter drive circuit component is connected to the compressor 6 via a three-phase (U-phase, V-phase, W-phase) compressor connection line 766, and is composed of a switching element or the like. The compressor 6 is variably controlled by 740. Here, control other than control by a control component (for example, the semiconductor component 11 that is an inverter drive circuit component) that performs inverter control (rotational speed variable control) of the compressor 6 (for example, temperature control in the storage chamber, damper open / close control, The semiconductor component 750 that is a second control component that performs control of energization of the electrostatic atomizer and the like is branched from the AC / DC converter 730 or from the middle of the second connection line 762 and a control connection line 768. It is connected. The control component 750 is connected to at least one functional component 770 that performs various operations of the device and performs various displays via the second control connection line 769.

  Here, if the device is a refrigerator, the functional component 770 includes, for example, an expansion device 62 constituting a refrigeration cycle, a cool air blower fan that blows cool air into the storage chamber, a damper device that adjusts the amount of cool air blown into the storage chamber, A mist spraying device for spraying mist into the storage room, provided on an opening / closing door (for example, a refrigeration room door installed on the front side of the refrigerating room 2) of the main body of the refrigerator 1, A display device that can perform various displays and settings such as temperature setting, electricity bill, and CO2 emission amount, and an illumination device that irradiates a storage room.

  In addition, if the device is an air conditioner, the functional component 770 includes an expansion device that constitutes a refrigeration cycle, a mist spraying device that sprays mist in an installed room, a wind direction control plate that changes the wind direction, a front design panel, and the like. It is a display device that is provided and displays a set temperature, a current temperature, an air volume, an electricity bill, a CO2 emission amount, and the like.

  In addition, if the device is a heat pump type washing machine, the functional component 770 includes an expansion device that forms a refrigeration cycle, a mist spraying device that sprays mist into and out of the washing tub, a wind direction control plate that changes the wind direction, a front design panel, and the like And a display device for displaying the set temperature, current temperature, air volume, electricity bill, CO2 emission amount, and the like, and a pump and an on-off valve for controlling the supply of water as washing water into the washing tub. Even in the case of other devices, functional components that can be moved, displayed, and set in the same manner as the above devices.

  Here, the first connection line 761 and the second connection line 762 are usually formed on the control board 7 (or 7A) with a pattern such as aluminum, but are connected not with the pattern but with a lead wire or the like. The power connection line 760, the first connection line 761, the second connection line 762, and the compressor connection line 766 have a large current value, and therefore a connection wire (lead wire) with a large diameter is used. The control lines 768 and 769 for controlling the functional components 770 other than 6 have a small current value, and thus the power supply connection line 760, the first connection line 761, the second connection line 762, and the compressor connection line. A connecting wire having a smaller diameter than that of 766 is used.

  Here, when the device is a refrigerator, the power connection line 760, the first connection line 761, the second connection line 762, and the compressor connection line 766 are large and have a diameter of about 2.5 mm because of a large current value. Control lines 768, 769, etc. for connecting to the control line 6 other than the control of the compressor 6 have a current value smaller than that of the compressor connection line 766, etc., so a thin connection line having a diameter of about 1.5 mm. Is used.

(Two control boards are arranged)
In FIG. 10, an example in which a semiconductor component 740 that is a control component that performs inverter control or the like and a semiconductor component 750 that is a control component that controls a functional component are mounted on the same control board 7 (or the second control board 7A). 4 to 6, the semiconductor component 740 for controlling the drive of the compressor 6 is mounted on the control board 7 as shown in FIGS. 4 to 6, and the control component 750 for controlling the functional component 770 other than the compressor 6 is provided Alternatively, the control board may be divided into two parts by mounting on two control boards 7A, and the control boards may be arranged in different parts to control the operation of different actuators and components on each control board. (The same control may be performed on each control board.) Here, the semiconductor component 740 shown in FIG. 10 is equivalent to the semiconductor component 11 mounted on the control board 7 in FIGS. If the semiconductor component 750 shown in FIG. 10 is equivalent to the semiconductor component 11 mounted on the control board 7A in FIGS.

  However, the semiconductor components 740 and 750 which are control components may be the same as or different from the semiconductor component 11 shown in FIGS. Further, the semiconductor components 740 and 750 do not necessarily include a semiconductor, but when a semiconductor is included, it is better to use a wide band gap semiconductor for at least one of the semiconductors. In particular, since a switching element and the like can operate at high speed and can operate at a high temperature, it is preferable to use a wide band gap semiconductor.

  Here, when the device is a refrigerator, the control component 750 mounted on the second control board 7A controls, for example, the opening degree of the expansion device 62 that constitutes the refrigeration cycle, and cool air blowing that blows cool air into the storage chamber. On / off control of the fan, rotation speed control, opening / closing control of a damper device that adjusts the amount of cool air blown into the storage room, on / off control of lighting in the storage room that irradiates the storage room, opening / closing door on the front surface of the main body of the refrigerator 1 (For example, a cold room door installed in front of the cold room 2), and performs control such as display control of a display device capable of various displays and settings such as temperature display of a plurality of storage rooms and temperature settings of the storage rooms. .

  In addition, if the device is an air conditioner, the control component 750 mounted on the second control board 7A controls the opening degree of the expansion device constituting the refrigeration cycle, and a mist spraying device that sprays mist in the installed room. Energization control, wind direction control of the wind direction control plate to change the wind direction, display control of the display device provided on the front design panel etc. to display and visually check the set temperature, current temperature, air volume, electricity bill, CO2 emissions, etc. Take control.

  Further, if the device is a heat pump type washing machine, the control component 750 mounted on the second control board 7A controls the opening degree of the expansion device constituting the refrigeration cycle, and mist spray for spraying mist into the washing tub. Energization control of the device, wind direction control of the wind direction control plate that changes the wind direction, display control of the display device provided on the front design panel etc. to display and visually check the set temperature, current temperature, air volume, electricity bill, CO2 emission amount, Controls such as flow rate control of pumps and on / off valves that control the supply of water as washing water into the washing tub. Even with other devices, operation control of functional components that can be moved, displayed, and set is performed in the same manner as the above devices.

  In this way, the first control board 7 is arranged in the machine room 60 and in the vicinity of the compressor 6, and the second control board 7 </ b> A is different from the machine room 60 (for example, if it is a refrigerator, When the machine room 60 is provided in the lower part of the back surface (see, for example, FIG. 4 and FIG. 5), the different parts are the upper part of the back surface, the approximate center position of the back surface, and the like. (For example, refer to FIG. 6), the control board 7 that controls the drive of the compressor 6 at least is arranged in the compressor 6 by disposing it at a different part from the lower part of the back surface or the substantially central position of the back surface. Since it is provided in the vicinity, the length of the connecting line 766 for the compressor can be extremely shortened.

  Even if the device is an air conditioner including an indoor unit and an outdoor unit, a control board 7 that drives and controls at least the compressor 6 is disposed in the machine room in which the compressor is accommodated. The control board 7A for controlling the functional parts may be arranged outside the outdoor unit or in the indoor unit. Even in a device other than the refrigerator and the air conditioner, the control board box 7 may be disposed in the vicinity of the compressor 6 in the same manner as the refrigerator and the air conditioner described above.

  As described above, in the apparatus according to the present embodiment, if the control board box 70 that houses the control board 7 that controls the inverter 6 to drive the inverter 6 is disposed in the vicinity of the compressor 6, the compressor is thick and the cost is increased. Since the connection line 766 can be shortened, a low-cost compressor and equipment can be obtained. Further, by arranging the control board box 70 containing the control board 7 that controls the compressor 6 in the vicinity of the compressor 6, the compressor connection line 766 having a large wire diameter and large electromagnetic noise can be shortened. Therefore, it is possible to greatly reduce electromagnetic noise and obtain a low noise device. Further, if a wide band gap semiconductor capable of high-temperature operation is used for the semiconductor components 7 and 740 that are control components housed in the control board box 70 disposed in the machine room 60, the inside of the machine room 60 that becomes a high temperature environment or Even if the control board box 70 is disposed in the vicinity of the compressor 6 (for example, the upper part or the side part of the compressor 6), it is not necessary to cover the periphery of the control board box 70 with a heat insulating material or the like as in the prior art. 70 can be reduced by the thickness of the heat insulating material. Therefore, the degree of freedom of installation of the control board box 70 is improved, and since no heat insulating material is required, a low-cost control board box and equipment can be obtained.

  Here, power is supplied from the commercial power supply 400 into the first control board box 70, but the second control board box 70 </ b> A branches off from the AC / DC converter 730 in the first control board box 70. The power may be supplied via the connection line 768, or may be branched from the connection line 762 and supplied via the connection line 768, or power may be supplied directly from the commercial power source 400 into the second control board box 70A. You may supply. Or you may connect and supply by radio waves, such as wireless communication, without connecting line 768. When connecting by wireless communication, a control device is provided on each of the control board 7 and the second control board 7A, and these control devices (the first control device of the control board 7 and the second control board 7A are connected to the second control board 7A). Each of or one of the control devices may be provided with power / information transmission / reception means such as an antenna capable of transmitting and receiving power and information.

  A control signal from a first control device such as a microcomputer provided on the control board 7 is transmitted to the second power / information transmission / reception means of the second control board 7A via the power / information transmission / reception means of the control board 7. Thus, a control signal from a first control device such as a microcomputer provided on the control board 7 is sent to a second control device such as a microcomputer on the second control board 7A. At this time, power can also be transmitted.

  In the second control device, based on a control signal from the first control device, control of functional parts (for example, temperature control in the storage chamber, display control of a display device provided in front of the storage chamber, or mist spraying device) Energization control or operation control of various actuators is performed. In this embodiment, the signal to be transmitted may be a radio wave such as a radio signal, but may be an electromagnetic wave such as an infrared signal if the signal is delivered. In this embodiment, an example in which the second control device operates with a control signal from the first control device has been described. However, information and control signals from an external device such as a mobile phone and a remote controller are transmitted to the first control device. You may make it control by transmitting to a control apparatus or a 2nd control apparatus by radio waves, electromagnetic waves, such as a radio signal and an infrared signal.

(Control board box placed at the bottom of the drain pan)
Here, the drain pan 660 is provided below the cooler 200, and the control board 7 is housed on the back side of the bottom surface of the drain pan 660 that receives water (defrost water, drain water, etc.) generated by the cooler 200. A control board box 70 may also be provided. FIG. 11 is a view showing a configuration in the case where a control board box 70 in which the control board 7 is accommodated is provided on the outside (rear side) of the bottom surface of the drain pan. FIG. FIG. 11B is a lower perspective view of the drain pan as viewed obliquely from below, and FIG. 11C is a perspective view of the drain pan provided with a draining portion. Here, in the drain pan 660 having a container shape, the inner surface of the container in which water accumulates is defined as the inner side, and the outer surface of the container is defined as the outer side (rear side).

  In Fig.11 (a) and FIG.11 (b), it generate | occur | produces in the cooler (evaporator) 200 which is provided in the machine room 60 provided in the main body back lower part of the refrigerator 1, and the main body back upper part, and comprises a refrigerating cycle. A control board box 70 in which the control board 7 is housed is provided on the bottom or side surface of the drain pan 660 that receives water (for example, drain water). The drain pan 660 has a container shape with an opening at the top, and has a shape capable of storing water (defrost water, drain water) inside. The control board box 70 or the control board 7 is provided on the outer bottom surface or the outer side surface of the drain pan 660 so that the control parts such as the semiconductor parts 11 mounted on the control board 7 and the control board 7 itself can be easily repaired, maintained, or replaced. It is slidable and detachable.

  Here, the control substrate 7 is provided with semiconductor components 11 such as switching elements and diode elements, and a wide gap band semiconductor is used for at least some of the semiconductor components 11 such as an inverter drive circuit. Further, only the semiconductor component 11 (only a wide band gap semiconductor may be used) may be mounted on the control board 7, or as shown in FIGS. 2 and 3, for example, control-related components (for example, the transformer 13 and the relay 14) At least one of converter 15, power supply reactor, capacitor 16, current detection component 17, etc.) may be mounted together with the semiconductor component.

  A control board box opening (control board box opening provided on the bottom surface of the control board box 70) 79 is provided on the side surface and bottom surface of the control board box 70. The line is taken out and connected to the inverter drive circuit component mounted on the control board 7. The inverter drive circuit component is connected to an AC power source (for example, a commercial power source) via an AC / DC converter composed of a capacitor or the like. The inverter drive circuit component 11, which is a semiconductor component, is composed of a switching element, a diode element, and the like, and uses a wide gap band semiconductor. The processing speed is increased compared to the case where a conventional Si semiconductor is used. Realizes downsizing, height reduction, and heat resistance.

  In the present embodiment, since the semiconductor component 11 that is a wide band gap semiconductor is provided in the control board box 70 and on the bottom or side surface of the drain pan 660, it is accumulated in the drain pan 660 due to heat generated by the wide band gap semiconductor. It can be used effectively to evaporate water. Even in this case, since the wide band gap semiconductor has a high heat resistance temperature, the wide band gap semiconductor does not break down even in a high temperature environment in the machine room 60 or above the compressor 6 or on the side, and the control of the substantially sealed structure. Even in a high temperature environment in the substrate box 70, there is no failure. If a wide band gap semiconductor is used for the semiconductor component 11, at least a part of the control board box 70 may be covered with a heat insulating material such as a vacuum heat insulating material. By covering at least a part of the control board box 70 with a heat insulating material such as a vacuum heat insulating material, the temperature in the control board box 70 can be maintained at a high state, so that the water in the drain pan 660 can be evaporated in a short time. Is possible. Even in this case, since the heat resistant temperature of the semiconductor component 11 is high (about 300 ° C.) by using a wide band gap semiconductor for the semiconductor component 11, the control substrate box 70 is covered with a heat insulating material such as a vacuum heat insulating material. Even if the temperature of the semiconductor component 11 rises, there is no problem because the semiconductor component 11 is operable because a wide band gap semiconductor having a high heat resistance temperature is used for the semiconductor component 11. If the wide band gap semiconductor component is configured to be in direct contact with the bottom surface or side surface of the drain pan 660 or is configured to be in contact with another component such as the heat radiation assisting member 110 shown in FIG. Since the heat of the semiconductor can be directly transferred to the drain pan 660, it can be efficiently evaporated.

  Here, as shown in FIG. 11 (c), the drain pan 660 prevents the control board 7 and the control board box 70 from getting water or entering even if the water in the drain pan 660 overflows outside the drain pan 660. The drain pan 660 may be provided with a draining portion 670 extending or projecting downward or outward from the drain pan 660 at least at the periphery of the drain pan 660 bottom surface or the outer side (back side) of the side surface.

  In FIG. 11C, the draining portion 670 includes four draining portions 670 around the back side of the bottom surface (or side surface) of the drain pan 660, and the draining portion right 671, which is the first draining portion, It consists of a draining portion left 672 that is a second draining portion, a draining portion front 673 that is a third draining portion, and a draining portion rear 674 that is a fourth draining portion. Protruding sideways). Here, in the draining part 670, the draining part right 671, the draining part left 672, the draining part front 673, and the draining part rear 674 may be connected continuously or as shown in FIG. 11 (c). A clearance may be provided in each connecting portion (for example, between the draining portion 671 and the draining portion 673) of the draining portions 671, 672, 673, 674. Further, the number of draining portions 670 may not be four, and an effect can be obtained if at least one draining portion 670 is provided in a necessary portion.

  The control board 7 and the control board box 70 are provided on the bottom surface of the drain pan 660 and the back side of the side surface, and are provided in the center side direction of the drain pan 660 (the draining portion 670 is opposed to the draining portion 670. In such a case, it is provided between the opposite draining portions), so that even if the water in the drain pan 660 overflows outside the drain pan 660, the overflowed water travels down the draining portion 670 and falls below the draining portion 670. Therefore, the control board 7 and the control board box 70 are not watered or intruded, and a highly reliable device can be obtained. The draining portion 660 may be formed integrally with the drain pan 660, or may be formed integrally, or may be configured separately and attached detachably.

  Here, the drainer 670 provided on the back surface or side surface of the drain pan 660 may be used for positioning with a device main body such as a refrigerator. Since the draining portion 670 forms a protruding portion that protrudes downward or laterally of the drain pan 660, the device main body (for example, a refrigerator main body, an outdoor unit main body, an indoor unit main body, a heat source main body, a washing machine, or the like) is used. It can be used for positioning to the machine body. As described above, the draining unit 670 of the present embodiment can suppress the intrusion of water into the control board 7 and the control board box 70 and can also be positioned with respect to the apparatus main body, so that the reliability is high and the drain pan is positioned. A device such as a refrigerator can be obtained.

  In addition, when the drain pan 660 is slidably attached to the apparatus main body so as to be slidable back and forth, the draining portions 671 and 672 provided on the back side of the drain pan 660 of the draining portion 670 may be used as rails. By using the draining portions 671 and 672 as rails, the drain pan 660 can be slid back and forth and can be detachably attached. The drain pan 660 can be cleaned and the control board 7 and the semiconductor component 11 provided on the back of the drain pan 660. Maintenance becomes easier.

(Drain pan placed on top of compressor)
Here, a drain pan 660 that receives frost or water (for example, defrosted water, drain water, etc.) generated by a cooler is used as an upper shell that forms an airtight container (outer casing) 6X of the compressor 6 above the compressor 6. You may make it provide in the upper part of 6A. FIG. 12 is a view showing a configuration in which a drain pan is disposed on the upper portion of the compressor 6, FIG. 12 (a) is a view in which a control board box is provided on the back of the drain pan, and FIG. 12 (b) is a drain pan. It is a figure at the time of providing a drain water pool part (water concentration part) in the.

  In FIG. 12A, the compressor 6 is divided into a sealed container (outside shell) by a two-divided shell (upper shell 6A and lower shell 6B) or a three-divided shell (upper shell 6A, intermediate shell (not shown) and lower shell 6B). E) 6X is configured. In the present embodiment (for example, FIGS. 1 to 3, etc.), the terminal box 601 is provided on the top of the sealed container 6 </ b> X of the compressor 6, but the drain pan 660 is provided on the top of the sealed container 6 </ b> X of the compressor 6. When the terminal box 601 becomes an obstacle, for example, as shown in FIG. 12 (a), the terminal box 601 is placed on the side surface of the sealed container 6X forming the compressor 6 (for example, the side surface of the upper shell 6A, the lower shell 6B). And the intermediate shell side face).

  Here, the drain pan 660 is provided directly on the upper part of the sealed container 6X (upper shell 6A) of the compressor 6 or via another member such as a heat conducting member. A part of the bottom of the drain pan 660 (for example, a portion 660Y located at the upper portion of the compressor 6 and having a spherical shape) is a shape of the upper portion of the sealed container 6X of the compressor 6 (for example, the upper portion 6Y of the upper shell 6A and having a spherical shape). If the bottom portion 660Y of the drain pan 660 is along the upper portion 6Y of the compressor 6 when attached to the upper portion of the compressor 6, it is easier to fix. By providing the drain pan 660 in the upper part of the compressor 6, the high-temperature heat generated in the compressor 6 can be used to evaporate the drain water accumulated in the drain pan 660, so that the drain water can be efficiently evaporated. it can.

  Here, in FIG. 12, the control board box 70 is provided below the drain pan 660 (for example, a part of the bottom surface outside the drain pan), and the control board 7 is inserted into the control board box 70. The control substrate 7 is provided with semiconductor parts 11 such as switching elements and diode elements, and wide gap band semiconductors such as SiC and GaN are used for at least some of the semiconductor parts 11 such as inverter drive circuits. Further, only the semiconductor component 11 (only the wide band gap semiconductor may be used, or the wide band gap semiconductor and another semiconductor component may be used in combination) may be mounted on the control board 7, for example, FIG. As shown in FIG. 3, even if a control-related component (for example, at least one of the transformer 13, the relay 14, the converter 15, the power reactor, the capacitor 16, and the current detection component 17) is mounted together with the semiconductor component. good.

  Here, a power supply lead wire (not shown) is connected to the terminal 610 provided in the compressor 6, and is provided in the sealed container 6 </ b> X of the compressor 6 through the power supply lead wire. A voltage is applied to the motor. One end of the power supply lead wire is connected to the terminal 610, and the other end of the power supply lead wire is a control board box opening (control board box 70 provided on the side or bottom surface of the control board box 70. Through the control board box opening portion 79 provided on the bottom surface of the control board box 70 and connected to inverter drive circuit components mounted on the control board 7 housed in the control board box 70. The inverter drive circuit component is connected to an AC power source (for example, a commercial power source) via an AC / DC converter composed of a capacitor or the like. The inverter drive circuit component which is the semiconductor component 11 is composed of a switching element, a diode element, and the like, and uses a wide bandgap band semiconductor. Therefore, the processing speed is higher than that when a conventional Si semiconductor is used. Realized downsizing, downsizing, height reduction, and high heat resistance.

  Even when the drain pan 660 is disposed above the compressor 6, the semiconductor component 11, which is a wide band gap semiconductor, is provided in the control board box 70 and on the bottom or side surface of the drain pan 660. It can be effectively used to evaporate the water accumulated in the drain pan 660 by the heat generated. In addition, since the wide band gap semiconductor has a high heat resistance temperature, it does not fail even in a high temperature environment inside the machine room 60 or above the compressor 6 or on the side, and the control board box has a substantially sealed structure. Even in a high temperature environment within 70, there is no failure. If a wide band gap semiconductor is used for the semiconductor component 11, at least a part of the control board box 70 may be covered with a heat insulating material such as a vacuum heat insulating material. By covering at least a part of the control board box 70 with a heat insulating material such as a vacuum heat insulating material, the temperature in the control board box 70 can be maintained at a high state, so that the water in the drain pan 660 can be evaporated in a short time. Is possible. Even in this case, since the heat resistant temperature of the semiconductor component 11 is high (about 300 ° C.) by using a wide band gap semiconductor for the semiconductor component 11, the control substrate box 70 is covered with a heat insulating material such as a vacuum heat insulating material. Even if the temperature of the semiconductor component 11 rises, there is no problem because the semiconductor component 11 is operable because a wide band gap semiconductor having a high heat resistance temperature is used for the semiconductor component 11. If the wide band gap semiconductor component is configured to be in direct contact with the bottom surface or side surface of the drain pan 660 or is configured to be in contact with another component such as the heat radiation assisting member 110 shown in FIG. Since the heat of the semiconductor can be directly transmitted to the drain pan 660, water (for example, defrost water or drain water) in the drain pan 660 can be efficiently evaporated.

  Further, if the control board box 70 or the control board 7 is slidably provided on the bottom surface or side surface of the drain pan 660, maintenance of the semiconductor component 11 and the control board 7 is facilitated. In this case, a connecting wire such as a lead wire connected to the control board 7 may be set to have a margin by setting the length so as not to hinder the sliding of the control board box 70 or the control board 7.

  As described above, the apparatus such as the refrigerator, the washing machine, the refrigeration / air-conditioning apparatus of the present embodiment includes the compressor 6, the condenser (or the condensing pipe or the heat radiating pipe) 9, the expansion device 62, and the evaporator (cooler) 200. Are placed in a main unit (for example, a machine room 60, an indoor unit, an outdoor unit, a heat source unit, a partition wall, or a main unit of an apparatus) and are connected in a cooler (evaporator) 200. A drain pan 660 that receives the generated water (for example, drain water), and a control board box 70 that is provided on at least a part of the side surface of the drain pan 660 or at least a part of the bottom surface of the drain pan 660 and stores the control board 7. A semiconductor component 11, which is a drive component for driving the compressor 6, the compressor cooling fan 68, and the like with an inverter or the like, for example, is mounted on the substrate 7. The heat generated in the wide band gap semiconductor is transmitted to the drain pan 660 and the heat generated from the compressor 6 is also transmitted to the drain pan 660 so that the water accumulated in the drain pan 660 is evaporated. Therefore, both the heat generated in the wide band gap semiconductor and the heat generated in the compressor 6 can be used for the evaporation of the water accumulated in the drain pan 660, and the water in the drain pan 660 can be efficiently evaporated at a low cost. . Although the refrigeration cycle of the refrigerator has been described in the present embodiment, the same effect can be obtained in a washing machine or the like. Moreover, the same effect is acquired even if it is apparatus which has refrigeration cycles, such as an indoor heat exchanger and an air conditioner provided with the outdoor heat exchanger.

  In addition, the refrigeration / air-conditioning apparatus and the like of the present embodiment include a refrigeration cycle in which a compressor 6, an indoor heat exchanger, an expansion device 62, and an outdoor heat exchanger are sequentially connected, and a machine room 60. A drain pan 660 that is disposed in the vicinity of the compressor 6 such as an upper part or a side of the disposed compressor 6 and receives water (for example, drain water) generated in the outdoor heat exchanger, and a part of the side surface of the drain pan 660 or A control board box which is provided on a part of the bottom surface and accommodates the control board 7, and the control board 7 is a semiconductor component which is an inverter driving part for driving the compressor 6, the compressor cooling fan 68, etc. 11, a wide band gap semiconductor is used, and heat generated in the wide band gap semiconductor is transmitted to the drain pan 660 and heat generated from the compressor 6 is also transmitted to the drain pan 660. Thus, since the water accumulated in the drain pan 660 is evaporated, both the heat generated by the wide band gap semiconductor and the heat generated by the compressor 6 can be used for the evaporation of the water accumulated in the drain pan 660. The water in the drain pan 660 can be evaporated efficiently at low cost.

  In addition, if the control board box 70 or the control board 7 is slidably provided on the bottom surface or side surface of the drain pan 660 via a rail or the like, the control board box 70 can be passed from the bottom surface or side surface of the drain pan 660 via the rail when necessary. In addition, since it is possible to pull out the control board 7 and perform maintenance and replacement of parts, it is easy to replace and maintain the control board 7 and the semiconductor parts 11 while having a simple configuration.

  Further, if the bottom surface or side surface of the drain pan 660 is brought into direct contact with the upper surface of the sealed container 6X of the compressor 6 or is fixed so as to be brought into contact with another part such as a heat conducting member, heat generated from the compressor 6 is obtained. Can be effectively used to evaporate the water in the drain pan 660. In particular, the high-pressure shell type in which the inside of the hermetic container 6X of the compressor 6 has high pressure and high temperature and at least a part of the surface of the hermetic container 6X has high temperature can transmit high-temperature heat generated in the compressor 6 to the drain pan 660. The water in 660 can be efficiently evaporated. Here, even if the inside of the hermetic container 6X is a low pressure shell type in which the pressure is low and low, if the compressor 6 has a structure in which the top of the hermetic container 6 of the compressor 6 has high pressure and high temperature, the compressor 6 generates Since the high-temperature heat to be transmitted can be transmitted to the drain pan 660, an equivalent effect can be obtained.

  Further, if the semiconductor component 11 such as a wide band gap semiconductor is brought into direct contact with the bottom surface or side surface of the drain pan 660 or is brought into contact with another component such as a heat conducting member as shown in FIG. Heat generated from the proof wide band gap semiconductor can be effectively used to evaporate the water in the drain pan 660.

  Here, as shown in FIG. 11 (c), even if the water in the drain pan 660 overflows out of the drain pan 660, the control board 7 or the control board box 70 is watered or water enters the back of the drain pan 660. The drain pan 660 is provided with a draining portion 670 extending or projecting downward or laterally from the drain pan 660 on at least a part of the side surface of the drain pan 660 or the back side of the bottom surface (for example, the outer periphery). Since the control board 7 and the control board box 70 are provided inside the draining portion 670, even if the water in the drain pan 660 overflows outside the drain pan 660, the control board 7 or the control board box 70 is watered or invaded. Therefore, a highly reliable device can be obtained.

  As described above, the apparatus such as the refrigerator of the present invention is provided in the machine room 60, the machine room 60 provided on the main body 1, the compressor rear surface that is included in the refrigeration cycle together with the cooler, and the machine room 60. A drain pan 660 that receives defrost water from the cooler 200, a control board 7 on which a semiconductor component 11 that drives and controls the compressor 6 is mounted, and a control board box 70 that houses the control board 7. Since a wide band gap semiconductor is used for the component 11 and the control board box 70 is detachably attached to the back surface or side surface of the drain pan 660, heat generated by the wide band gap semiconductor can be transferred to the drain pan 660 and collected in the drain pan 660. Water can be efficiently evaporated.

  Further, since the drain pan 660 is provided above the compressor 6 in the machine chamber 60, high-temperature heat generated in the compressor 6 can be transmitted to the drain pan 660, so that water in the drain pan 660 can be efficiently evaporated. Further, if the control board box 70 containing the control board 7 on which the wide band gap semiconductor is mounted is detachably attached to the back or side surface of the drain pan 660, the heat generated by the wide band gap semiconductor and the heat generated by the compressor 6 are obtained. Both of them can be used for evaporation of the water accumulated in the drain pan 660, and the water in the drain pan 660 can be efficiently evaporated at a low cost.

  If the drain pan 660 is detachably attached to the compressor 6, the control board 7 and the semiconductor component 11 can be easily replaced and maintained with a simple configuration.

  Here, as shown in FIG. 12B, the drain pan 660 may be provided with a drain water pool portion (water concentration portion) 665. The drain pan 660 is formed at the bottom of the drain pan 660 so that drain water or water generated by the cooler 200 and dropped or discharged into the drain pan 660 is concentrated in a drain pan pool (water concentration portion) 665 that is a specific location in the drain pan 660. At least a part of the recess is a recess. The bottom of the drain pan 660 has inclined portions 666 and 667 that are inclined so that water gathers toward a drain water reservoir portion (water concentration portion) 665 having a concave shape, and the drain water reservoir portion (water concentration portion). ) 665 is one step lower than the other parts, forming a recess where water can accumulate.

  If the control substrate 7 or the control substrate box 70 is provided on the back surface of the drain water reservoir portion (water concentration portion) 665, the drain water reservoir portion (water concentration portion) 665 in which the water in the drain pan 660 is concentrated is directly connected. Since the heat generated by the semiconductor component 11 can be efficiently and efficiently heated, the water in the drain pan 660 can be efficiently and quickly evaporated.

  Although the above has mainly described the example in which the drain pan 660 is disposed in the machine room 60, the drain pan 660 may not be disposed in the machine room. For example, in the case of a refrigerator, when the machine room 60 is provided in the upper part of the refrigerator main body 1 or the like, the cooler 200 is provided in a lower part than the machine room 60, so that the drain pan 660 is not in the machine room 60. As long as it is below the cooler 200, it may be provided on the substantially central back surface or lower back surface of the refrigerator body 1.

  Further, for example, in the case of an air conditioner, the drain pan 660 is disposed not only in the outdoor unit but also in the indoor unit. Therefore, the control board 7 or the control board is provided on the bottom side or the back side of the side surface of the drain pan placed indoors. A box 70 may be provided. The indoor unit of the air conditioner includes an air intake port, a filter provided downstream of the air intake port, an indoor heat exchanger provided downstream of the filter, and an air intake provided downstream of the indoor heat exchanger. A blower fan that blows air sucked from the opening to an air outlet provided on the downstream side of the indoor heat exchanger, and an indoor unit drain pan that receives water (drain water) generated by the indoor heat exchanger. Therefore, the above-described contents (for example, a configuration in which the control board box 70 and the control board 7 are slidable on the back and side surfaces of the drain pan, a configuration in which the drain pan 670 and the drain water pool 665 are provided in the drain pan, etc.) It may be applied to a machine drain pan.

  Therefore, an apparatus such as an air conditioner of the present invention is provided in an indoor unit main body provided indoors, an air inlet provided in the upper front, top, or side of the indoor unit main body, and downstream of the air inlet. Filter, an indoor heat exchanger provided downstream of the filter, an air outlet for blowing air sucked from the air inlet into the room, and an indoor heat exchanger downstream of the indoor heat exchanger A blower fan for blowing air sucked from the air inlet through the indoor heat exchanger to an air outlet provided on the downstream side of the indoor heat exchanger; An indoor unit drain pan that receives water (drain water) generated by the heat exchanger, a control board 7 on which a semiconductor component 11 that controls driving of a driving part such as a blower fan or a wind direction plate is mounted, and the control board 7 are accommodated. A control board box 70; In addition, since a wide band gap semiconductor is used for the semiconductor component 11 and the control board box 70 or the control board 7 is detachably attached to the back surface or the side surface of the drain pan 660, heat generated by the wide band gap semiconductor is transmitted to the drain pan 660. The water accumulated in the drain pan 660 can be efficiently evaporated.

(Increase of internal volume when the control board is placed on the back of the refrigerator)
The example of the device provided with one or two control boards has been described above, but here, the control board on which the wide band gap semiconductor 11 is mounted is provided not in the machine room 60 but in the back heat insulating material. The increase in the internal volume will be described.

  FIG. 13 is an explanatory diagram regarding an increase in the volume of the back surface portion of the control board box 70A in the refrigerator 1 representing the embodiment of the present invention. In the figure, the same parts as those in FIGS. In the figure, the refrigerator main body 1 has a refrigerator compartment 2 at the top, a switching chamber 3 and an ice making chamber 35 provided in parallel below the refrigerator compartment 2, and a freezing compartment 4 provided below the switching chamber 3 and the ice making chamber 35. The vegetable compartment 4 is provided under the freezer compartment (lowermost level). Here, between each storage room (for example, refrigeration room 2, switching room 3, ice making room 35, freezer room 4, vegetable room 5), between the room where set temperature (storage temperature) differs, it is a heat insulating material (partition member, It is partitioned by a urethane heat insulating material or a vacuum heat insulating material) 8. In addition, a machine room 60 in which the compressor 6 and the like are disposed is provided below the back of the refrigerator 1.

  Moreover, the back surface heat insulating material 80 is provided in the back surface of the refrigerator main body 1, and the cooler 200, the compressor 6, and the compressor 6 and the compressor which were provided in the cooler room in the back surface of the refrigerator main body 1 are provided. A control board box 70 in which a control board 7 for controlling a cooling fan 68, a cold air blower fan (not shown) and the like is accommodated is disposed, and in the heat insulating material 80 (or in the machine room 60) on the back surface, expansion is performed. An apparatus (for example, a capillary tube or an electronic expansion valve) 62, a heat radiating pipe (condensation pipe) 9 connected to the compressor 6 and constituting a refrigeration cycle together with a cooler and the like are disposed. Here, the compressor 6, the accumulator 61, the control board box 70, etc. are arrange | positioned in the machine room 60 provided in the refrigerator 1 back surface, and the water (defrost water, drain water, etc.) which generate | occur | produce with the cooler 200 is arrange | positioned. A drain pan 660 or the like for receiving is also provided.

  The heat radiating pipe 9 is connected to the expansion device 62 from the compressor 6 through the side surface of the refrigerator body 1, the back surface of the refrigerator body 1, the upper surface of the refrigerator body 1 (or the lower surface of the refrigerator body 1), the side surface of the refrigerator body 1, and the like. Connected to the compressor 6 via the evaporator 200, the accumulator 61, and the like. The compressor 6 is driven by an inverter system capable of arbitrarily adjusting the rotation speed of the motor, and is driven by a control board 7 on which, for example, an inverter drive circuit component 11 which is a semiconductor component is mounted. For example, in FIG. 1, FIG. 4, FIG. 5, etc., the control board 7 is accommodated in the control board box 70 arrange | positioned in the machine room 60 provided in the back lower part. In FIG. 1, the control board box 70 is disposed above the compressor 6 via the terminal box 601 and the compressor 6 via a space in the machine room 60, and in FIG. 4 and FIG. It is provided in the vicinity of the compressor 6 in 60, and the compressor 6 is arrange | positioned through the space above the compressor 6, a side, etc. Here, as described with reference to FIGS. 1 to 3, the control board box 70 may be provided directly on the upper part of the terminal box 601 of the compressor 6 or via the buffer material 350.

  The control board box 70 is disposed in the machine room 60 provided in the lower rear part or the upper rear part of the refrigerator 1 shown in FIG. 1, FIG. 4, FIG. 5, FIG. The front side (front side), the upper side, the side, or the lower side as viewed from the rear side of 1 is opened so that maintenance of the control board 7, semiconductor parts 11 and control-related parts can be maintained and replaced. . A control board box lid 701 that is a lid member is appropriately provided in the opening of the control board box 70. Here, in FIGS. 1, 4, and 5, the heat radiating pipe 9 passes from the compressor 6 through at least one place such as the side of the refrigerator, the back of the refrigerator, the top of the refrigerator, the side of the refrigerator, and the like in the machine room 60 or the main body of the refrigerator 1. It is connected to the expansion device 62 arranged in the heat insulating material 80 and connected to the cooler 200 in the cooler chamber. Here, the heat radiating pipe 9 may be connected to the expansion device 62 via a condenser provided separately from the heat radiating pipe 9.

  Here, the second control board 7A (for example, the second control board 7A provided separately from the control board 7 or a part of the control board 7 is provided separately on the back surface of the refrigerator 1). Or a second control board 7A provided alone without being provided with the control board 7) is provided in the second control board box 70A disposed above the machine chamber 60 or at a substantially central position in the height direction. In the case where the heat radiating pipe 9 is arranged from the machine room 60 to the side of the refrigerator, the heat radiating pipe does not rub the back of the refrigerator, so the second control board box 70A on the back of the refrigerator is unlikely to be an obstacle. However, when the heat radiating pipe 9 is disposed from the refrigerator back surface to the refrigerator upper surface or from the refrigerator upper surface to the refrigerator side surface, the heat radiating pipe 9 avoids the second control board box 70A in which the second control board 7A is accommodated. Second It is disposed so as to pass through the side surfaces of the control board box 70A. Further, at least one of the ceiling surface, the back surface, the side surface, and the bottom surface of the refrigerator 1 is provided with one or more vacuum heat insulating materials 10 between the inner box 101 and the outer box 102 in order to improve the heat insulating performance of the refrigerator 1. It is installed, and is also arranged between the back surface 71 of the second control board box 70 </ b> A and the inner box 101.

  In the present embodiment, the second control board 7A and the second control board box 70A are arranged at the upper part of the back surface of the refrigerator 1 or substantially at the center in the height direction of the back surface, and a wide band gap semiconductor is used for the semiconductor component 11. By doing so, since the thickness of the second control board 7A and the thickness (length and depth of the refrigerator 1 in the front-rear direction of the refrigerator 1) H of the second board control box 70A can be reduced, the control board box 70A is arranged. It is possible to reduce the size and volume of the protruding portion of the inner box of the inner box into the storage chamber (the storage chamber) (the amount 83 of the protruding amount decreases toward the inner side of the storage). Further, since the thickness H of the second control board box 70A can be reduced, the inner box 101 and the second control board box 70A rear surface 71 are reduced by the thickness (the reduction in the control board box thickness). It is possible to increase the thickness of the insulation 80 in between. (The heat insulating performance can be improved because the thickness of the heat insulating material 80 can be increased by the volume of the heat insulating material thickness increasing portion 85.) Here, even if the thickness of the second control board box 70A is reduced, the heat insulating material. If the thickness of 80 is not increased, the interior volume can be increased by the volume of the heat insulating material thickness increasing portion 85, so that the capacity (width, height, depth) of the refrigerator main body is not changed. You can get a refrigerator. That is, the internal volume (the internal volume of the storage chamber) can be increased by the volume (or the thickness) of the heat insulating material thickness increasing portion 85 on the back surface of the second control board box 70A where the thickness H is reduced. . Therefore, a large-capacity refrigerator that is convenient for the user can be obtained without increasing the size of the refrigerator body.

  Here, in the conventional refrigerator 1, since the thickness of the second control board box 70A (or the thickness of the semiconductor parts 11 such as the inverter drive circuit parts) is large, the depth of the storage space of the second control board box 70A is large. The direction (thickness direction) needs to be increased, and the inner box 101 has protruded (projected) to the size of the protruding portion in the storage chamber (for example, the refrigerated chamber 2) (the amount 83 of the protruding amount decreases toward the inside of the warehouse). The internal volume was small. Further, in the conventional refrigerator, since the second control board box 70A is provided up to the thickness increasing portion 85 of the heat insulating material 80, it is difficult to provide additional parts such as the vacuum heat insulating material 10 and the heat radiating pipe 9. However, since the thickness of the second control board 7A and the second control board box 70A according to the present invention can be reduced by using a wide band gap semiconductor, the protruding portion (to the inside of the box) The amount of protrusion 83 and the amount of protrusion can be reduced, and space can be secured by the volume of the heat-insulating material thickness increasing portion 85. The control board 7A and the second control board box 70A of the second control board 7A may be inclined to reduce the protrusion amount of the protrusion portion (the protrusion amount decrease 83 to the inside of the cabinet). About parallel ( Even if it is installed on the warehouse installation surface or substantially perpendicular to the refrigerator back surface, the protruding portion (protrusion reduction amount 83 to the inside of the warehouse) can be eliminated or reduced, so the structure is simple. Thus, a refrigerator capable of significantly reducing the storage space for the second control board box 70A is obtained. Furthermore, since the inner box 101 does not stick out (protrusions) into the refrigerating room 2 as the storage room, the amount of food stored in the refrigerating room 2 as the storage room can be increased. A good refrigerator and equipment can be obtained.

  Here, as the height H of the second control board box 70A decreases, the amount 83 of the inner box protruding to the inside of the box (the volume increase part 83) and the height of the second control board box 70A are reduced. As H becomes lower, the thickness increasing portion 85 (control board box thickness reduction) of the heat insulating material 80 between the second control board box 70A and the inner box 101 (for example, the back surface of the heat insulating box constituting the refrigerator 1). Addition parts (functional parts (for example, mist spraying apparatus, sterilization apparatus, sterilization apparatus, etc.)) and air path parts (for example, cooling air path, mist, etc.) Air ducts, air volume adjustment and air path dampers, etc.), refrigeration cycle parts (such as heat dissipation pipes (condensation pipes), decompression devices (expansion valves, capillary tubes, etc.) and suction pipes) and other parts (vacuum insulation) Or arrangement And lighting parts (for example the internal lighting and warning like or indicator such as an LED lighting), etc.)) or provided, may be placed.

  As described above, the additional parts are arranged or provided in the increased portion 83 of the internal volume or the heat insulating material thickness (volume) increased portion 85 of the back surface 71 of the second control board box 70A. Thus, since an additional function can be obtained without reducing the internal volume, a refrigerator that is convenient for the user, has a large space use efficiency, and has high cost performance can be obtained.

  In other words, if additional parts are provided in the internal volume increasing portion 83 or the control board box rear surface insulating material thickness increasing portion 85, the additional volume can be added without reducing the internal volume (storage chamber storage capacity). Functions can be realized, or another part can be placed in the part where the additional part has been placed, so additional functions can be used without reducing the internal volume, improving space efficiency and making it easy for users to use. A good refrigerator is obtained. In addition, when no additional parts are provided in the internal volume increasing portion 83 or the control board box rear heat insulating material thickness increasing portion 85, the internal volume can be increased with a refrigerator having the same external dimensions as the conventional one, so that space efficiency is improved. The storage capacity is large and an easy-to-use refrigerator can be obtained.

  Here, a mist spraying device for generating additional mist and spraying the mist into the storage room or the room, or a mist blowing path for guiding the mist to the air outlet or the mist outlet, or a mist outlet for blowing the mist into the room or the storage room For mist spraying related parts such as mist spraying, the mist spraying can be performed in the storage room or the room, so that the storage space can be sterilized and humidified without reducing the storage capacity in the storage room. Equipment such as a refrigerator that can be used and an air conditioner that can humidify and disinfect the room.

  When the additional part is the heat radiating pipe (condensation pipe) 9, the heat radiating pipe is passed to the heat insulating material thickness increasing portion 85 of the back surface 71 of the control board box 70A without disposing the storage volume in the storage chamber (arrangement). Since the length of the heat radiating pipe 9 can be increased and the heat radiating area can be increased, the heat radiating efficiency is improved and an energy-saving refrigerator can be provided.

  Further, when the additional part is the vacuum heat insulating material 10, the vacuum heat insulating material 10 is arranged in the heat insulating material increasing portion 85 on the back surface of the control board box 70A, which has been difficult to arrange without reducing the storage volume in the storage chamber. Therefore, the installation area of the vacuum heat insulating material 10 can be increased, and the heat insulation performance is improved, so that an energy-saving refrigerator can be obtained. Further, since the control board box 70A can be thinned, it is not necessary to bend and arrange the vacuum heat insulating material 10, and the outer packaging material is not torn or damaged, so that a high quality device such as a refrigerator can be obtained. Further, even when the vacuum heat insulating material 10 cannot be arranged without being bent, it is possible to arrange a small folding angle within a range in which the outer packaging material is not damaged or torn, so that the outer packaging material is damaged or torn by folding. Therefore, it is possible to obtain a highly reliable and energy-saving device such as a refrigerator that does not break the vacuum heat insulating material or deteriorate the heat insulating performance.

(Folding arrangement of vacuum insulation)
Since the thickness of the second control board 7 and the second control board box 70A in the present invention can be reduced by using a wide band gap semiconductor, the inside volume increasing portion 83 which is a protruding portion into the inside or the heat insulation. Since it is possible to secure a space by the volume of the material thickness increasing portion 85 as compared to the conventional case, the second control board 7A and the second control board box 70A are inclined with respect to the back surface 152 of the refrigerator 1. The second control board box 70A can be installed substantially in parallel with the back surface 152 of the refrigerator 1, and the installation positions of the second control board 7A and the second control board box 70A are examined. In this case, the degree of freedom of the arrangement position is increased, and the degree of freedom of design is improved. Further, even when the second control board 7A and the second control board box 70A are inclined and arranged, the folding angle of the vacuum heat insulating material 10 is set to be small as long as the outer packaging material is not damaged or torn. Therefore, it is possible to obtain a device such as a refrigerator having high reliability and high heat insulation performance.

  FIG. 14 is a cross-sectional view of the main part near the control board box of another refrigerator representing the present embodiment. In the figure, the same parts as those in FIGS. In the figure, the back surface 71 of the control board box 70 is inclined at a predetermined angle with respect to the outer box 102 or the back surface 152 of the refrigerator 1, and the control board 7A is also substantially the same angle as the inclination angle of the back surface 71 of the control board box 70A. It is arranged at an angle. In the present embodiment, the thickness of the control board 7A and the control board box 70A can be reduced by using a wide band gap semiconductor. Space and volume can be secured by the volume, and if the back surface 71 of the control board box 70A is inclined at a predetermined angle with respect to the outer box 102 of the refrigerator 1 or the back surface 152 of the refrigerator body 1, it is arranged substantially vertically. The storage space in the heat insulating material of the control board box 70A can be significantly reduced as compared with the case where the control board box 70A is used. Furthermore, since the protrusion of the inner box 101 into the refrigerating room 2 as the storage room can be reduced or eliminated, the amount of food stored in the refrigerating room 2 as the storage room can be increased.

  In the present embodiment, the vacuum heat insulating material 10 which is an additional part is disposed in the heat insulating material thickness increasing portion 85, and the vacuum heat insulating material 10 is arranged on the control board box 70A in accordance with the inclination of the back surface 71 of the control board box 70A. Although it is bent at a predetermined angle in the vicinity, the folding angle of the vacuum heat insulating material 10 can be set small as long as the outer packaging material of the vacuum heat insulating material 10 is not damaged or torn. Therefore, the outer packaging material of the vacuum heat insulating material 10 is damaged or torn. Therefore, the reliability of the vacuum heat insulating material 10 can be ensured. Here, the predetermined angle at which the vacuum heat insulating material 10 is bent is set in a range in which the outer packaging material is not damaged or torn, and the vacuum heat insulating material 10 with respect to the vacuum heat insulating material 10 in the portion where the control board box 70A is not disposed. The predetermined bending angle of the bent portion of the sheet is set to be approximately 30 degrees or less (preferably 10 degrees or less) (the vacuum insulating material 10 in the portion where the control board box 70A is not disposed is the rear surface of the refrigerator 1). If the predetermined bending angle of the bent portion of the vacuum heat insulating material 10 with respect to the back surface or the top surface is approximately 30 degrees or less (preferably 15 degrees or less). good). Thus, when the back surface 71 of the control board box 70A is inclined, the additional component provided on the back surface of the control board box 70A may not be the vacuum heat insulating material 10, and the heat radiating pipe 9, the suction pipe 63, the expansion device 62, Other additional parts such as a mist spraying device and a cooling air passage may be used.

(Multiple placement of additional parts)
Here, the number of additional parts may not be one, but two or more combinations (for example, pipes (a combination of the heat radiating pipe 9 and the suction pipe 63, a combination of the suction pipe 63 and the capillary tube 62 which is a decompression device, etc.) , A combination of piping (a combination of the heat radiating pipe 9, the suction pipe 63, and the capillary tube 62) and the vacuum heat insulation 10, a combination of a mist spraying device and a cooling air passage, a combination of a mist spraying device and the vacuum heat insulating material 10, A combination of the vacuum heat insulating material 10 and the mist air passage, or the vacuum heat insulating material 10 and the mist outlet, or a combination of the vacuum heat insulating material 10 and the cooling air passage, lighting components (for example, interior lighting such as LED lighting, warnings, indicator lights, etc.) ) And cooling air passages, lighting parts and vacuum insulation materials, lighting parts and mist spraying equipment It may be a combination of two different additional parts, or a combination of three different additional parts such as a combination of a vacuum heat insulating material, a mist spraying device and a cooling air passage, or a combination of a lighting device, a mist spraying device and a cooling air passage. A plurality of combinations from the additional parts may be selected). Also, a plurality of combinations such as two or three of the same additional parts may be used. By combining one or two or more additional parts, many additional functions can be obtained without reducing the storage volume in the storage chamber, so user satisfaction is high and space use efficiency is high. Equipment such as a refrigerator with high cost performance can be obtained.

(Vacuum insulation)
Here, in the case of using a vacuum heat insulating material for the additional component, if glass fiber is used for the core material, the heat insulating performance is good, so there is no problem even if it is used, but inorganic fibers such as glass fiber are used for the core material. Rather than using organic fibers such as polyester (PP) and polystyrene (PS), the handling of the core material does not adversely affect the human body when handling, dismantling or recycling, and is easier to handle. Further, in the case of glass fiber, a residue is generated by combustion, but in the case of organic fiber, the residue is not easily generated and the thermal recyclability is good and the environment is friendly.

  The vacuum heat insulating material 10 includes an air barrier gas barrier container (hereinafter referred to as “external packaging material”), a core material and an adsorbent (for example, a gas adsorbent and a moisture adsorbent (CaO) enclosed in the external packaging material. ) Etc.). The inside of the outer packaging material is depressurized to a predetermined degree of vacuum (several Pa (pascal) to several hundred Pa). In addition, the vacuum heat insulating material 10 may be simply called a vacuum heat insulating material.

  In the present embodiment, inorganic fibers or organic fibers are used as the fibers forming the core of the vacuum heat insulating material 10, but the organic fibers are better in handling and thermal recyclability. As a material used for the organic fiber, polypropylene, polylactic acid, aramid, LCP (liquid crystal polymer), PPS, polystyrene, or the like can be used. In order to improve the heat resistance of the core material, a heat resistant resin such as LCP (liquid crystal polymer) or PPS (polyphenylene sulfide) may be used for the organic fiber. Moreover, what is necessary is just to use a thing with a big fiber diameter, when improving compression creep characteristics. Moreover, if it mixes and uses said resin, the vacuum heat insulating material 7 with the high heat resistance excellent in the compression creep characteristic and high heat insulation will be obtained. Polystyrene has a low solid thermal conductivity and can be expected to improve the heat insulating performance of the heat insulating material, and can be manufactured at low cost.

  Polypropylene has low hygroscopicity, so that drying time and evacuation time can be shortened and productivity can be improved. Moreover, since the solid heat conduction is small, the heat insulation performance of the vacuum heat insulating material 10 can be expected.

  Moreover, since polylactic acid is biodegradable, the core material disassembled and separated after use of the product can be subjected to landfill treatment.

  In addition, since aramid and LCP have high rigidity, they have good merits such as good shape retention when vacuum-packed and subjected to atmospheric pressure, can increase the porosity, and can be expected to improve heat insulation performance.

  For example, in the vacuum heat insulating material 10 using a plastic laminate film as an outer packaging material, the core material supports the atmospheric pressure and secures a space in the vacuum heat insulating material 10, and heat conduction of gas by finely dividing the space. It plays a role to reduce. From the viewpoint of suppressing heat conduction of gas, it is desirable that the distance of this space be smaller than the free stroke distance of air molecules at the degree of vacuum.

  In the present embodiment, if, for example, organic fiber is used for the core material of the vacuum heat insulating material 10, the vacuum heat insulating material is used as compared with the case where hard and brittle glass fiber is used as the core material as in the prior art. When the material 10 is manufactured, disassembled, or recycled, dust does not scatter and adhere to the skin / mucous membrane of the worker, thereby irritating it, and handling, workability, and recycling are improved. Dust scatters during manufacturing and dismantling, and does not adhere to the skin and mucous membranes of workers, giving them an environment-friendly product.

(Vacuum insulation + heat dissipation pipe)
In the case of the vacuum heat insulating material 10 and the heat radiating pipe 9 as a combination of additional parts, the vacuum heat insulating material 10 is disposed on the storage chamber side (inside the cabinet), and the heat radiating pipe 9 is disposed on the back surface 71 side of the control board box 70A (inside By arranging the box 101, the vacuum heat insulating material 10, the heat radiating pipe 9, and the control board box 70 in this order, the heat radiated from the heat radiating pipe 9 can be prevented from being transmitted into the storage chamber by the vacuum heat insulating material 10, so that the energy-saving refrigerator Etc. can be obtained. Here, between the inner box 101 and the vacuum heat insulating material 10, between the vacuum heat insulating material 10 and the heat radiating pipe 9, and between the heat radiating pipe 9 and the back surface 71 of the control board box 70A, another heat insulating material (for example, By providing a (urethane heat insulating material), a fixing member, and a vibration isolating member (for example, an elastic member, a resin member, etc.), effects such as heat insulating efficiency, vibration isolating, and noise reduction can be obtained.

  Further, a concave portion continuous in the length direction or the width direction of the flat plate (or sheet shape) vacuum heat insulating material 10 having a predetermined length, a predetermined width, and a predetermined thickness is provided, and the depth of the concave portion is radiated. A shape (for example, a circular arc shape) into which the heat radiating pipe 9 can be inserted or fitted is set to about 1/3 or more of the diameter of the pipe 9, and a depth and a shape in which the heat radiating pipe 9 can be positioned and held may be used. (For example, the shape of the recess may be an arc having a diameter equal to or greater than the diameter of the heat radiating pipe 9).

  If the heat radiating pipe is arranged in the concave portion, the heat radiating pipe can be embedded by the depth of the concave portion, so the total thickness obtained by adding the size (diameter) of the heat radiating pipe 9 to the thickness of the vacuum heat insulating material 10. The total thickness of the heat insulating material on the back of the refrigerator (the thickness of the heat insulating material between the inner box and the outer box) can be reduced. Therefore, the internal volume of the storage room can be reduced by the reduced thickness. A user-friendly refrigerator can be obtained.

  Here, as described above, the combined thickness of the vacuum heat insulating material 10 and the heat radiating pipe 9 can be reduced. In this case, however, the combined thickness of the vacuum heat insulating material 10 and the heat radiating pipe 9 can be decreased. Since the thickness of the control board box 70 can be reduced by using a wide band gap semiconductor for the semiconductor component 11, the volume in the storage chamber can be further increased despite the addition of additional components. Therefore, it is possible to obtain a device such as a refrigerator that has a high space efficiency and a large volume in the storage room. Here, the same effect can be obtained even when a capillary tube which is the suction pipe 63 or the decompression device 62 is arranged instead of the heat radiating pipe 9.

(Heat radiation pipe)
Here, since the thickness of the control board box 70A is reduced by using a wide band gap semiconductor for the semiconductor parts 11 such as the inverter drive circuit parts, as described above, the rear surface of the control board box 70A is here. A description will be given of how to arrange the heat radiating pipe 9 of the refrigerator 1 when the heat radiating pipe 9 is disposed as an additional part on the 71 side. Conventionally, since the thickness of the control board 7A is large, the thickness H2 of the control board box 70A is also large, and the thickness of the heat insulating material 80 sufficient to cause the heat radiating pipe 9 to be wound on the back surface 71 of the control board box 70A is obtained. However, in this embodiment, SiC (silicon carbide) or GaN (gallium nitride) is used as the semiconductor component 11 such as an inverter drive circuit component. ) And the like, the thickness of the control board 7A including the semiconductor component 11 and the thickness H of the board control box 70A can be reduced. Therefore, since the thickness of the control board box 70A is reduced, it is possible to secure a gap (thickness in the heat insulating material) between the inner box 101 and the back face 71 of the control board box 70A. Become. Here, an example of how to dispose the heat radiating pipe 9 when the control board box 70A becomes thin will be described with reference to FIG.

  FIG. 15 is a rear perspective view of the refrigerator as viewed from the rear side for explaining how to arrange the heat radiating pipes when the machine room of the refrigerator representing the embodiment of the present invention is provided at the lower back side. In the figure, the same parts as those in FIGS. In the figure, a machine room 60 is provided at the lower back of the refrigerator 1 and a compressor 6 constituting a refrigeration cycle is arranged. A heat radiating pipe 9 is connected to the discharge pipe of the compressor 6, and the heat radiating pipe 9 penetrates the upper wall surface or the side wall surface of the machine room forming the machine room 60, and then directly or directly to the outer box 102 of the refrigerator 1. It is disposed between the outer box 102 and the heat insulating material 80 in a state of being pasted via a spacer, passes from the machine room 60 through the back and side surfaces of the refrigerator body 1 through the expansion device 62 and the evaporator 200 as a cooler. And connected to the suction pipe 63 of the compressor 6. The high-temperature and high-pressure refrigerant gas discharged from the compressor 6 (for example, HC refrigerant, which is a natural refrigerant) is condensed in the heat radiating pipe 9 by exchanging heat with the outer box 102 and the heat insulating material 80 on the rear surface and side surface of the refrigerator body 1. A refrigeration cycle is configured by being liquefied and passing through the expansion device 62 and the evaporator 200 to become low-temperature / low-pressure refrigerant gas and returning to the suction side of the compressor 6 again.

  Here, the heat radiating pipe 9 is connected to the discharge pipe of the compressor 6, and is disposed between the outer box 102 on the back surface of the refrigerator main body and the heat insulating material 80 or in the heat insulating material 80 from the lower rear surface of the refrigerator main body upward. The upward piping 91, the control board box rear pipe 92 disposed across the back surface of the control board box 70A in the left-right direction or the vertical direction of the refrigerator body 1, and the upper part of the rear face of the refrigerator body toward the lower machine room 60. And a downstream pipe 93 disposed in a refrigeration cycle by being connected to the compressor 6 via an expansion mechanism 62 and an evaporator 200. Here, a container 61 such as a suction accumulator or a suction muffler is provided between the evaporator 200 and the compressor 6 as appropriate, or a discharge is made between a discharge side pipe (for example, a discharge pipe) of the compressor 6 and the upstream pipe 91. By providing a second container such as a muffler, reliability is improved and noise is reduced.

  Here, the heat radiating pipe 9 includes an ascending pipe 91 disposed between the outer box 102 on the rear surface of the refrigerator and the heat insulating material 80 or in the heat insulating material from the lower rear surface of the main body of the refrigerator (for example, the machine room 60). The control board box 70 is configured by a control board box back pipe 92 disposed across the back surface of the refrigerator 1 in the horizontal direction or the vertical direction of the refrigerator 1 and a down pipe 93 disposed toward the lower machine room 60. Although the example has been described, the first up pipe and the first up pipe arranged on the rear surface of the refrigerator main body from the vicinity of the machine room 60 at the lower back of the refrigerator main body through the side of the control board box 70A. Is folded in the vicinity of the upper portion of the refrigerator main body 1 (for example, between the control board box 70A and the upper rear end of the refrigerator main body 1), and the first descending is arranged with the rear surface of the control board box 70A being lowered downward of the refrigerator main body 1. Plumbing The first down pipe is folded back in the vicinity of the upper side of the machine room 60 (for example, between the control board box 70A and the upper end of the machine room 60) and arranged upward, and the back surface of the control board box 70A is connected to the refrigerator body 1 The second ascending pipe disposed upward and the second ascending pipe are folded back in the vicinity of the upper part of the refrigerator main body 1 (for example, between the control board box 70A and the rear upper end of the refrigerator main body 1). A second down pipe disposed below the back surface of the substrate box 70A in the lower direction of the refrigerator main body 1 and the second down pipe are near the upper part of the machine room 60 (for example, the upper ends of the control board box 70A and the machine room 60). And a third upward pipe that is disposed upward and is disposed so that the back surface of the control board box 70A rises upward in the refrigerator main body 1. The third upward pipe is a refrigerator. Near the upper part of the main body 1 (for example, control board box 70A and cold Compartment body 1 third and downstream piping the side surfaces of the control board box 70A folded between) the rear upper end is disposed down in the downward direction of the refrigerator body 1, may be constituted by.

  That is, the heat radiating pipe 9 folds the back surface of the control board box 70 </ b> A once or a plurality of times in the left-right direction or the up-down direction with respect to the refrigerator 1 between the outer box 102 and the inner box 101 on the back side of the refrigerator 1. It may be arranged on the back of the control board box, and the heat radiating pipe 9 is wound on the back of the control board box 70A provided on the back of the refrigerator body 1 in this way, so that the side, top and bottom of the refrigerator 1 Even if the heat radiating length of the heat radiating pipe 9 is insufficient only by flicking, a sufficient heat radiating length can be ensured only on the back surface of the refrigerator 1, so that a device such as an energy-saving refrigerator with high heat radiating efficiency can be obtained. Moreover, since it becomes possible to ensure the length required for heat dissipation of the heat radiating pipe 9 only on the back surface of the refrigerator 1, only on the back surface and side surfaces, or only on the back surface and top surface (or bottom surface), The degree of freedom of arrangement and arrangement is improved. Moreover, the part which does not need to put the heat radiating pipe 9 in the part other than the control board box 70A on the rear surface of the refrigerator main body 1, the side surface or the top surface of the refrigerator main body 1 by twisting the heat radiating pipe on the back surface of the control board box 70A. Therefore, it is possible to reduce the thickness of the heat insulating material and the wall thickness at the portion where the heat radiating pipe 9 is not required to be twisted, and a compact and low-cost refrigerator can be obtained.

  In the present embodiment, as described above, the thickness of the control substrate 7A (or 7) and the substrate are obtained by using a wide band gap semiconductor for the semiconductor component 11 such as an inverter drive circuit component for controlling a device such as a refrigerator. Since it is possible to reduce the thickness H of the control box 70A (or 70), the heat radiating pipe 9 can be disposed on the back surface of the control board box 70, so that heat dissipation efficiency is improved and energy-saving equipment such as a refrigerator is obtained. .

  Conventionally, since the thickness (depth) of the control board box 70A is large, it is difficult to arrange additional parts such as the heat radiating pipe 9 on the back surface of the control board box 70A in order to secure the volume in the storage chamber. When the refrigerator main body 1 is placed on the back surface, the back surface of the control board box 70A is folded back at the upper or lower part of the control board box 70A so that the heat radiating pipe 9 does not pass through, or the side surface of the control board box 70A is passed. Thus, the heat radiation length of the heat radiating pipe 9 is secured by placing the control board box 70A on the top surface, the side surface, and the bottom surface of the refrigerator body 1 without turning the back surface of the control board box 70A. When the heat radiating pipe 9 is folded back at the upper or lower portion of the control board box 70A without turning the back surface of the control board box 70A, the heat radiating pipe 9 needs a predetermined heat radiating length or heat radiating area. In addition, a necessary heat radiation length is obtained by folding and arranging a plurality of times in the vertical direction (the height direction of the refrigerator 1), the horizontal direction (the horizontal direction of the refrigerator 1), or an oblique direction at the lower part.

  However, in the present embodiment, the heat radiating pipe 9 can be passed to the back surface of the control board box 70A provided on the upper back surface (or the vicinity of the center of the back surface or the lower back surface) of the refrigerator 1, so that it is conventional. It is possible to ensure the heat dissipation length without arranging the heat radiating pipe 9 in the up and down direction (the height direction of the refrigerator 1), the right and left direction (the horizontal direction of the refrigerator 1) or the diagonal direction (folded). As a result, the degree of freedom in disposing the heat radiating pipe 9 is improved, and the number of times of folding the heat radiating pipe 9 in the vertical direction (the height direction of the refrigerator 1) or the left and right direction (the horizontal direction of the refrigerator 1) can be reduced. The processing time of the heat radiating pipe 9 can be shortened, and energy-saving and low-cost equipment such as a refrigerator can be obtained. Further, since the number of times of folding (number of times of folding) of the heat radiating pipe 9 can be reduced, it is possible to suppress deterioration in quality due to defects such as cracks in the heat radiating pipe 9 caused by bending. Therefore, it is possible to obtain a device such as a refrigerator having high quality, high reliability, short processing time, low cost and energy saving.

  If the heat radiating pipe 9 is lengthened, the heat radiating efficiency is improved and the power consumption is reduced, so that an energy saving device can be obtained. Generally, conventional semiconductors use silicon (Si) and are vulnerable to excessive temperature rise, but wide band gap semiconductors such as SiC and GaN used in the present invention have low self-heating and high temperatures. In the heat insulating material, which is relatively difficult to use in the past, and in the control board boxes 70 and 70A and in the machine room 60 (for example, in the vicinity of the compressor 6 or the discharge of the compressor 6). It can be installed in the vicinity of pipes and heat dissipation pipes). In the case of conventional Si semiconductors, there is a high possibility of failure due to high temperatures unless care is taken as much as possible. However, in the case of wide band gap semiconductors, failure due to high temperatures may occur due to high heat resistance. Small and less problematic. The heat generation temperature of the heat radiating pipe 9 rises up to, for example, about 40 to 120 ° C., but since the wide band gap semiconductor has high temperature proof stress (about 300 ° C.), it can be used without any problem.

(Auxiliary member between additional parts and back of control board box)
Here, if the heat radiating pipe 9 is fixed to the back surface of the control board box 70A (or 70) directly or via an auxiliary member (resin member, etc.) having thermal conductivity, it is fixed by an adhesive or a screw. 9 can be dissipated through the control board box 70A (or 70), and a device such as a high-performance refrigerator having a simple structure and excellent heat dissipation performance can be obtained.

  FIG. 16 is a cross-sectional view of the main part near the control board box of the refrigerator representing the present embodiment. In the figure, the same parts as those in FIGS. In the figure, there is an auxiliary member 75 between the back surface 71 of the control board box 70A and additional components (for example, the heat radiating pipe 9, the vacuum heat insulating material 10, the mist spraying device, the mist air passage, the cooling air passage, the return air passage, etc.). Is provided. The heat radiating pipe 9 as an additional component controls the inner surface side of the outer box 102 directly from the upper or lower machine room 60 to the outer box 102 or in a state of being fixed via an auxiliary member 75, a fixing member, a spacer, or the like. It is arranged so as to crawl the back surface 71 of the control board box 70A after being raised or lowered to the vicinity of the board box 70A.

  Here, the auxiliary member 75 is a thermally conductive member having thermal conductivity, and if the elastic member is elastic (for example, rubber or resin having thermal conductivity), the auxiliary member 75 having elasticity is used. The control board box 70A is fixed to the back surface 71 of the control board box 70A by bonding or screwing, and the heat radiating pipe 9 as an additional part is pressed against the elastic auxiliary member 75, or the control board box 70A is radiated through the auxiliary member 75. If it is fixed so as to press against 9, assembly can be simplified, and a high-performance refrigerator or the like having good heat dissipation performance can be obtained at low cost.

  As described above, the thickness H of the control board box 70A can be reduced by using the wide band gap semiconductor parts for the semiconductor parts 11 of the control board 7A. Since the thickness H of the control board box 70A can be reduced, the heat radiating pipe 9 can be moved to the space generated on the back face 71 of the control board box 70A disposed on the back face of the refrigerator main body 1. The length can be increased by that much, and a device such as a refrigerator with good heat dissipation efficiency can be obtained. Moreover, since it is not necessary to bend the heat radiating pipe 9 in front of the control board box 70A, the number of times of bending of the heat radiating pipe 9 can be reduced, and a device such as a low-cost refrigerator with a low manufacturing cost can be obtained. Further, if the heat radiating pipe 9 is pressed and fixed to the back surface 71 of the control board box 70A via an auxiliary member 75 having thermal conductivity (for example, a resin member or an elastic member), the heat radiating of the heat radiating pipe 9 is controlled by the control board box 70A. Since the heat can be effectively radiated to the outside of the refrigerator, a high performance device such as a refrigerator can be obtained.

  Here, in place of the heat radiating pipe 9, other pipes such as a suction pipe 63 and a capillary tube which is the expansion device 62 can be wound on the back surface of the control board box 70 </ b> A, so that the same effect can be obtained. In addition, the air conditioner may be a device having a refrigeration cycle having pipes such as the heat radiating pipe 9 and the suction pipe 63, and a wide band gap semiconductor can be used for the semiconductor component 11 for controlling the device. The same effect can be obtained with devices such as (indoor units and outdoor units), water heaters (heat source units and hot water storage tanks), and washing machines. In this case, pipes such as the heat radiating pipe 9 as the additional part, the suction pipe 63, and the capillary tube 62 as the expansion device are inserted in the space increasing portion generated on the back surface of the control board box 70A even if the heat insulating material is not provided. The same effect can be obtained if it can be forgotten.

(Mist spraying device)
Next, the case where the mist spraying apparatus is used as an additional part in, for example, a refrigerator will be described. The mist spraying device includes a discharge electrode that generates mist by applying a voltage, a holding member that holds the discharge electrode, and a water supply unit that supplies water to the discharge electrode. Here, in the discharge electrode, a substantially cylindrical or substantially prismatic main body portion and a substantially conical or substantially pyramidal protrusion are integrally formed, and a mist is generated at the protrusion by applying a voltage. . Since the water supply means only needs to be able to supply water to the discharge electrode, the water is supplied directly to the main body of the discharge electrode that is formed of a porous material by dropping water directly through the main body and the space of the discharge electrode, and the capillary tube. Depending on the phenomenon, the structure may be such that water is supplied to the protruding portion of the discharge electrode (the protruding portion provided on the side opposite to the water supply means), or the water supply means is made of a metal having good thermal conductivity, etc. In contact with the wall of a low temperature storage room or cooling room such as a freezing room, and the other end is connected to the main body of the discharge electrode formed of a porous material, etc. May be generated in the main body of the discharge electrode to supply water to the protrusion of the discharge electrode (protrusion provided on the side opposite to the water supply means) by capillary action or the like.

  And what is necessary is just to spray the mist produced | generated by the protrusion part in the vegetable compartment which is a storage room, or a refrigerator compartment. Moreover, the refrigerator compartment 2 and the vegetable compartment 5 are arrange | positioned in the upper part, the refrigerator compartment 4 is provided in the lower part of the refrigerator compartment 2 and the vegetable compartment 5, and the cooler for refrigerator compartments is arrange | positioned in the back surface vicinity of the refrigerator compartment 2, In the refrigerator in which the cooler is disposed in the vicinity of the back surface of the freezer compartment 4, water (for example, defrosted water) from the refrigerator for the refrigerator compartment is felt on the discharge electrode provided in the vicinity of the back surface of the refrigerator compartment 2 or the vegetable compartment 5. The mist may be supplied through the porous material or the like to generate mist and supply the mist into the refrigerator compartment 2 or the vegetable compartment 5. In this case, since defrosted water can be used without special measures, the cooling means is unnecessary and condensed water can be obtained, so that a low-cost refrigerator can be obtained.

  In the case where the first storage room is the vegetable room 5 which is a storage room in a relatively high temperature plus temperature zone, and the second storage room is the refrigeration room 2 which is a storage room in the plus temperature zone, the third storage The room is a freezing room 4 which is a storage room in a minus temperature zone which is a lower temperature storage room than the first storage room, and the refrigerating room 2 which is a second storage room is arranged at the top, When the freezer room 4 which is the third storage room is arranged below and the vegetable room 5 which is the first storage room is arranged below the third storage room, the first storage room and the first storage room A mist spraying device is arranged in the partition wall between the three storage chambers and one end side of the water supply means is arranged to penetrate the low temperature freezing chamber 4 side as the third storage chamber, or water supply One end of the means is disposed in the partition wall on the partition wall wall on the side of the low temperature freezer compartment 4 as the third storage chamber, and is in contact with the other end of the water supply means. By disposing the discharge electrode (for example, the projecting portion) on the side of the vegetable room 5 which is a relatively high temperature storage room, the one end side of the water supply means is directly passed through the cold air in the freezing room 4 or through the wall surface of the partition wall. Since the temperature difference between the freezer compartment 4 and the vegetable compartment 5 can be used, the cooling means is not required even if no special measures are taken, and the discharge electrode (for example, the main body) is provided by the water supply means. Since dew condensation water can be generated, a low-cost refrigerator can be obtained.

  Further, one end side of the water supply means is arranged on the wall surface or inside of the cooling air passage for sending cool air to the cooler room or the storage room having the evaporator (cooler) 200 provided in the vicinity of the back of the storage room, and the water supply By disposing the discharge electrode connected to the other end of the means on the side of the vegetable room 5 or the refrigerating room 2 which is a relatively high temperature storage room, one end side of the water supply means with the cool air in the cooler room or the cooling air passage Can be directly or indirectly cooled, so that the temperature difference between the freezer compartment 4 and the vegetable compartment 5 can be utilized. Therefore, since no cooling means is required and dew condensation water can be obtained on the discharge electrode (for example, the main body of the discharge electrode) without special measures, a low-cost refrigerator can be obtained.

  In the present embodiment, for example, a mist spraying device main body may be provided between the back surface of the refrigerating chamber 2 which is the first storage chamber and the back surface 71 of the control board box 70A, and the mist spraying device main body is located in a different location. (For example, a second storage chamber (for example, vegetable room 4) different from the first storage chamber (for example, refrigeration chamber 2) in which the control board box 70A is provided on the back surface). A mist spraying port for spraying mist into the storage chamber and a mist air passage for conveying and guiding the mist to the mist spraying port may be provided. Alternatively, the mist spraying device may be provided in the machine room 60 or on the back surface or side surface of the control board box 70 provided in the machine room 60.

  The mist spraying device main body is located at a location different from the back surface 71 of the control board box 70A (for example, a part different from the back surface of the control board box 70A, or a first storage room (for example, the refrigerator compartment 2) provided with the control board box 70 on the back surface. ) Is provided in a second storage room (for example, vegetable room 5) different from), and on the back surface of the control board box 70A, a mist spraying port for spraying mist into the first storage chamber and a mist are guided and conveyed to the mist spraying port. In the case of providing a mist air passage, the mist air passage is constituted by, for example, a duct or a hose surrounded by a mist, and a mist spraying device main body provided on the back surface of the first storage chamber or the back surface of the second storage chamber. The mist spraying port provided between the back surface of the first storage chamber and the back surface of the control board box 70 may be connected to spray the mist from the mist spraying port into the first storage chamber. Here, a mist spray port for spraying mist into the storage chamber as an additional part on the back surface 71 of the control board box 70A, a mist air passage for guiding or supplying mist to the mist spray port, and an evaporator (cooler) 200 are generated. In the case of providing a cooling air passage or the like for blowing the cooled air to the storage room, a heat insulating material (for example, a vacuum heat insulating material or a urethane heat insulating material) is provided between the back surface of the control board box 70A and the additional parts. For example, since the possibility that the control board box 70A is cooled and the dew is formed can be reduced, the electronic components (for example, the wide band gap semiconductor parts 11 and the like) in the control board box 70A do not break down and are highly reliable devices such as a refrigerator. Is obtained. Therefore, the space behind the control board box 70A can be effectively utilized without reducing the volume in the storage chamber with a simple configuration, and a high-performance refrigerator or the like having a high degree of design freedom can be obtained.

  Here, for example, the return air passage from the first storage chamber or the second storage chamber to the cooler chamber, the return air passage from the first storage chamber to the second storage chamber, or the first Mist may be sprayed to a plurality of storage chambers via a return air passage from one storage chamber to another third storage chamber. In this case, if at least a part of the mist blowing path for spraying mist or at least a part of the return air path is provided on the back surface 71 of the control board box 70A via a heat insulating material (for example, a vacuum heat insulating material), a simple configuration is provided. However, the dead space on the back surface 71 of the control board box 70A can be effectively used without reducing the volume in the storage chamber. In addition, it is possible to prevent the control board box from being exposed to dew, increase the degree of freedom in the arrangement of the mist air passage and the return air passage, and obtain a high-performance refrigerator with a high degree of design freedom.

  Here, the case where a mist spraying apparatus is used for an air conditioner is demonstrated. When the mist spraying device is applied to an air conditioner, it may be provided in an indoor unit main body installed indoors. In this case, the indoor unit main body provided indoors, the air inlet provided in the upper front, top, and side of the indoor unit main body, the filter provided downstream of the air inlet, and the downstream side of the filter Provided between the indoor heat exchanger and the air outlet that is provided on the downstream side of the indoor heat exchanger and between the indoor heat exchanger and the air outlet. A blower fan for blowing air sucked from the air suction port to an air outlet provided on the downstream side of the indoor heat exchanger via the indoor heat exchanger, and water (drain) generated by the indoor heat exchanger Water), an indoor unit drain pan, a control board 7 on which a semiconductor component 11 that controls driving of a driving part such as a blower fan or a wind direction plate is mounted, a control board box 70 that houses the control board 7, a filter, and room heat Indoor unit with exchange A mist device that is provided on the top of the pan and generates mist, and the mist spraying device is provided with a discharge electrode to which water adhering to the surface is supplied by capillary action and a predetermined distance from the discharge electrode. It has a counter electrode, an electrode holding part for holding the discharge electrode, and a water supply means for supplying water to the discharge electrode held by the electrode holding part, and generates a mist by applying a voltage to the discharge electrode, Of the water that is disposed downstream of the filter and above the indoor unit drain pan and is supplied from the water supply means to the discharge electrode, excess water may be discharged to the indoor unit drain pan.

  If a wide band gap semiconductor is used for the semiconductor component 11 mounted on the control board 7 and the control board box 70 is detachably attached to the back or side surface of the indoor unit drain pan, the heat generated by the wide band gap semiconductor is obtained. Can be transmitted to the indoor unit drain pan, and the water accumulated in the indoor unit drain pan can be efficiently evaporated. In addition, since excess water out of the water supplied to the discharge electrode from the water supply means is discharged to the indoor unit drain pan, in order to receive excess water out of the water supplied to the discharge electrode from the water supply means, a separate water There is no need to provide a receiving portion, the cost is low, the number of parts can be reduced, and the assemblability is improved.

  Moreover, the mist spraying device is arranged in the vicinity of the air suction port downstream of the air suction port of the indoor unit of the air conditioner, and upstream of the air blower outlet of the indoor unit of the air conditioner via a ventilation path such as a duct or a hose. A mist spraying port may be provided. Here, the mist is opened from the air outlet to the air outlet so that the mistake and the spray outlet can also be used as the air outlet, or the mist spray outlet is provided to open inside the air passage or the air outlet. You may make it spray in the room. As described above, the mist spraying device including at least the water supply means and the discharge electrode is arranged downstream of the air suction port of the indoor unit of the air conditioner or in the vicinity of the air suction port, and the mist generated by the mist spraying device is sprayed with the mist. Duct with surroundings surrounded by a place other than the part where the device is located (for example, the room where the air outlet of the air conditioner indoor unit is open or the air duct upstream of the air outlet) The mist spraying device for spraying the mist generated by the mist spraying device into the room and the mist spraying device provided with at least the discharge electrode and the counter electrode The degree of freedom of the arrangement position of the part (mist spraying port) is increased, and mist spraying can be performed from the place where mist spraying is desired, so that the degree of freedom in design is improved.

(Installation of the control board box on the ceiling)
The above has described an example of a refrigerator in which the control board 7A and the control board box 70A are installed at the upper rear side of the refrigerator 1 or substantially at the center of the rear face. Here, the control board 7A and the control board box 70A are installed on the refrigerator 1 as shown in FIG. The case where it installs on a ceiling surface is demonstrated.

  FIG. 17 is a cross-sectional view of the main part in the vicinity of the control board when the control board 7A is arranged on the ceiling surface of the refrigerator 1, and FIG. 17 (a) is a case where the control board of the refrigerator of the present invention is arranged on the ceiling surface. FIG. 17B is a cross-sectional view of the main part when the control board of the conventional refrigerator is arranged on the ceiling surface. In FIG. 17, the same parts as those in FIGS.

  In FIG. 17B, the control board 7 </ b> A and the control board box 70 </ b> A are provided behind the ceiling surface 151 of the refrigerator 1. As shown in FIG. 17 (b), in the conventional refrigerator 1, silicon (Si) is used for semiconductor components such as inverter drive circuit components for controlling the equipment, so that the thickness of the inverter drive circuit component 11 is large. Since the heat-resistant temperature is low, it is necessary to provide a large radiator 12, and the thickness of the inverter drive circuit component, which is the semiconductor component 11, and the radiator 12 must be large. Accordingly, the thickness of the control board box 70A is accordingly increased. It was getting bigger. Therefore, the inner box 101 protrudes (starts out) inside the cabinet (in the storage chamber 2) in accordance with the size and shape of the control board box 70A. Therefore, the thickness of the heat insulating material 80 between the back surface 71 of the control board box 70A and the inner box 101 is made as thin as possible because it is necessary to increase the internal volume (storage chamber volume) as much as possible. It is difficult to provide additional parts such as the vacuum heat insulating material 10 between the back surface 71 of the control board box 70A and the inner box 101, and the additional parts are provided at portions other than the back face of the control board box 70A. (The additional parts, the heat radiation pipe 9 and the vacuum heat insulating material 10, are disposed only up to the front of the control board box 70A, and are folded back or bent before the control board box 70A, and the rear surface of the control board box 70A. It was arranged avoiding 71.)

  However, as shown in FIG. 17A, in the refrigerator according to the present embodiment, since the wide band gap semiconductor is used for the semiconductor component 11, the thickness of the control board box 70A can be reduced. It can be provided between the back surface 71 of the box 70 </ b> A and the inner box 101. In FIG. 17A, the control board 7 </ b> A and the control board box 70 </ b> A are provided on the rear side of the ceiling surface 151 of the refrigerator 1 with respect to the front surface of the refrigerator body 1. In this embodiment, since a wide band gap semiconductor is used for the semiconductor component 11 which is a control component for controlling the device, the thickness of the semiconductor component 11 such as the inverter drive circuit component and the radiator 12 can be reduced. The thickness of the control board box 70A can be reduced, and the height of the refrigerator can be kept low. In addition, since the wide band gap semiconductor generates a small amount of heat, the radiator 12 can be significantly reduced. As a result, the height around the inverter drive circuit component 11 can be suppressed to the height of other components, and the internal volume can be increased or the device can be downsized.

  Further, in the refrigerator according to the embodiment of the present invention shown in FIG. 17A, the control board 7A is placed on the ceiling surface 151 of the refrigerator 1 like the control board box 70A of the conventional refrigerator shown in FIG. On the other hand, since it can be installed substantially parallel (substantially horizontal) with the ceiling surface 151 of the refrigerator, the storage space for the control board box 70A can be greatly reduced. Accordingly, the protrusion of the inner box 101 is not required, and the volume (storage volume) of the storage chamber can be greatly increased.

  Here, in the conventional refrigerator 1, it is necessary to increase the height (depth) of the storage space in the control board box 70A around the semiconductor component 11 such as the inverter drive circuit parts, and the inner box 101 on the back of the control board box 70A. Projecting to the internal volume increasing portion 83, which is a protruding portion, the storage chamber volume is small, and the heat insulating material thickness increasing portion 85 is provided with the control board box 70A. It was difficult to provide additional parts. However, since the thickness of the control board 7A and the control board box 70A in the embodiment of the present invention can be reduced by using a wide band gap semiconductor, the internal volume increasing portion 83, which is a protruding portion, and the heat insulating material thickness increasing portion. Since the space can be secured by the volume of 85, the control board 7A and the control board box 70A do not have to be inclined with respect to the top surface 151 of the refrigerator main body 1, and with respect to the top surface 151 of the refrigerator 1. Since it can be installed substantially parallel (substantially horizontal), the storage space for the control board box 70A can be significantly reduced while the structure is simple. Furthermore, since the inner box 101 does not protrude into the refrigerating room 2 as the storage room, the amount of food stored in the refrigerating room 2 as the storage room can be increased.

  Further, since the height H of the control board box 70A can be lowered, the amount 83 of the protrusion of the inner box 101 to the inside of the box is reduced (the volume increase portion 83 in the box) and the height H of the control board box 70A is reduced. Additional parts (for example, functional parts (such as functional parts)) are added to the volume increasing parts 83, 85 such as the heat insulating material thickness increasing part 85 (heat insulating material thickness increasing part 85 due to the control board box thickness decreasing) between the board box 70A and the inner box 101. Mist spraying device, sterilizing device, sterilizing device, etc.), air passage parts (cooling air passage, mist air passage, damper device for air volume adjustment, air passage switching, etc.) and refrigeration cycle parts (radiating pipe (condensation pipe) and decompression) Equipment (expansion valves, capillary tubes, etc.) and suction pipes) and other parts (vacuum insulation, wiring and lighting components (eg interior lighting such as LED lights, warnings, indicator lights, etc.))) It may be so that.

  As described above, the additional component is disposed in the heat-insulating material thickness (volume) increasing portion 85 of the heat insulating material disposed on the internal volume increasing portion 83 or the top surface of the back surface 71 of the control board box 70A. Compared to the above, since an additional function can be obtained without reducing the internal volume, it is possible to obtain a device such as a refrigerator that is convenient for the user, has high space use efficiency, and has high cost performance.

  Further, if an additional part is provided in the internal volume increasing portion 83 or the heat insulating material thickness increasing portion 85 on the back surface of the control board box, the internal volume (storage chamber storage volume) is not reduced, and the additional part is used. Additional functions can be realized, or another part can be placed in the part where the additional part was placed, so that the additional function can be used without reducing the storage chamber volume, improving space efficiency and A convenient refrigerator can be obtained. In addition, if no additional parts are provided in the storage chamber volume increasing portion 83 or the heat insulating material thickness increasing portion 85 on the back of the control board box, the storage chamber volume can be increased with a refrigerator having the same external dimensions as the conventional one. Improved, large storage capacity and easy-to-use equipment such as refrigerators can be obtained.

  In the present embodiment, as shown in FIG. 17 (a), the control board box 70A can be reduced in height and size by reducing the height and size of the control board 7A. Additional components such as the vacuum heat insulating material 10 and the heat radiating pipe 9 that could only be installed can be installed also on the back surface (back side) 71 of the control board box 70A, and the flat plate heat insulating material 10 is not bent and is flat. Since the outer packaging material (packaging material) constituting the vacuum heat insulating material 10 can be prevented from being broken, it can be suppressed. Moreover, since the control board 7 which is a heat generating part, and the refrigerator compartment 2 can be shielded with the high performance vacuum heat insulating material 10, it leads also to reduction of power consumption.

  Further, the vacuum heat insulating material 10 disposed on the ceiling surface 151 of the refrigerator main body 1 and the vacuum heat insulating material 10 disposed on the back surface 152 of the refrigerator main body 1 are connected without interruption at the back surface 71 of the control board box 70A. In addition, the vacuum heat insulating material disposed on the ceiling surface 151 and the back surface 152 can be continuously provided, and a device such as a refrigerator with good heat insulating performance can be obtained. Here, even if the vacuum heat insulating material 10 disposed on the ceiling surface 151 and the vacuum heat insulating material 10 disposed on the back surface 152 are continuously formed, the vacuum heat insulating material can be disposed. The freedom degree of arrangement | positioning 10 improves and apparatuses, such as a low-cost refrigerator, are obtained. In addition, it is possible to dispose one vacuum heat insulating material 10 bent at approximately 90 degrees, and it is possible to obtain a device such as a refrigerator that increases the degree of design freedom at low cost.

  As described above, the compressor 6, the heat radiating pipe 9, the expansion device 62, the cooler 200, and the suction pipe 63 are connected in order by piping, and heat insulation is provided between the inner box 101 and the outer box 102. A heat insulating box (or a refrigerator main body) having a plurality of storage rooms (for example, a refrigeration room 2, a switching room 3, an ice making room 35, a freezing room 4, a vegetable room 5, etc.) disposed on the front surface side; The machine room 60 provided in the upper part or the lower part of the back surface 152 of the box (or the refrigerator main body), in which the compressor 6 is stored, the back surface 152 or the ceiling surface 151 or the lower surface (bottom surface) of the heat insulating box (or the refrigerator main body). A control board box 70A for housing a control board 7A for driving and controlling drive parts such as the compressor 6, and a semiconductor part 11 such as a transistor and a diode mounted on the control board 7A, and a semiconductor unit By using a wide band gap semiconductor such as SiC or GaN for the semiconductor component 11, the semiconductor component 11 or the control substrate 7A can be miniaturized (both the semiconductor component 11 and the control substrate 7, 7A can be miniaturized), and the control substrate box 70A. Additional parts (for example, the vacuum heat insulating material 10, the heat radiating pipe 9, the suction pipe, etc.) (or may be at least one wall of the peripheral wall other than the opening of the control board box 70A such as the side surface, top surface, and bottom surface). 63, an expansion device 62, a mist spraying device, a mist air passage, a cooling air passage (including a return air passage), a damper device, etc.) can be disposed, so that an additional function can be provided without providing an extra space. Thus, devices such as a refrigerator and an air conditioner having additional functions can be obtained without changing the size and volume. Further, in the conventional control board using the Si semiconductor, the control board box 70A is large and high in height, so that additional parts that could not be arranged on the back surface 71 of the control board box 70A can be arranged, and the space is effectively used. It can be used to obtain additional functions, and the equipment can be miniaturized.

  Here, by using a wide band gap semiconductor such as SiC or GaN for the semiconductor component 11, the semiconductor component 11 or the control substrate 7A can be downsized (both the semiconductor component 11 and the control substrate 7 may be downsized) and controlled. The back surface 71 of the control board box 70A generated by reducing the height and size (vertical and horizontal width and length) of the board box 70A (or the surroundings other than the opening of the control board box 70A such as the side surface, top surface, and bottom surface) Increased space 83, 85 (for example, at least one wall of the wall) (for example, an increase in the internal volume which is an expanded space or excess space in the storage chamber caused by lowering the height of the control board box 70A) The additional parts are arranged in the portion 83 or the enlarged space generated in the heat insulating material 80 or the heat insulating material thickness increasing portion 85 (excess space). Good. In this case, in the conventional control board using the Si semiconductor, the control board box 70A is large and high in height, so that additional parts that could not be arranged on the back surface 71 of the control board box 70A can be arranged. Effective use is possible, additional functions can be obtained, and limited space can be used effectively. In addition, the equipment can be made smaller.

  Here, since the control board box 70A can be reduced in size or thinned, the control board box 70A can also be placed in the side wall of the refrigerator main body 1, in the heat insulating material, or in the partition 8, which could not be placed conventionally. Therefore, an excess space is generated in the heat insulating material 80 provided on the back surface of the refrigerator main body 1, so that the internal volume can be increased or additional components can be arranged, and the space can be effectively used.

  Therefore, according to the embodiment of the present invention, it is possible to reduce the thickness and size of the semiconductor component 11 by using a wide bandgap semiconductor for the semiconductor component 11 for controlling the device, and control for mounting the semiconductor component 11. Since the height (depth) of the control board boxes 70 and 70A for storing the boards 7 and 7A and the control boards 7 and 7A can be reduced, the installation space for the control board boxes 70 and 70A can be reduced. Further, since the height of the control board boxes 70 and 70A can be reduced, additional parts such as the heat radiating pipe 9 and the vacuum heat insulating material 10 can be disposed on the rear surface 71 of the control board boxes 70 and 70A, so that an extra space is provided. Therefore, it is possible to have an additional function, and a device such as a refrigerator or an air conditioner having the additional function can be obtained without changing the size or volume of the device body.

  Further, when the device is the refrigerator 1, the control board 7, 7A and the control board boxes 70, 70A can be reduced in height and size, so that the inner box is affected by the large height of the control board boxes 70, 70A. 101 is the same (even in the machine room 60). For example, the interior volume increasing portion 83 which is a projecting portion (for example, a decrease in the amount of protrusion of the inner box toward the interior of the interior box) projecting to the interior (storage chamber) side is unnecessary. Therefore, the internal volume can be increased without significant changes in the outer shape and the like. Further, at least a part of the heat insulating material thickness increasing portion 85 which is a heat insulating space between the back surface of the control board box and the storage chamber (for example, a heat insulating material thickness increasing portion due to the control board box thickness decreasing) becomes a marginal space. Therefore, additional parts such as a heat radiating pipe and a vacuum heat insulating material can be provided in this extra space, and an additional function can be obtained without reducing the internal volume.

(Attach vacuum insulation material to control board box)
Here, in FIG. 4, FIG. 13, FIG. 14, etc., a predetermined gap (between the vacuum heat insulating material 10 and the control board boxes 70, 70A) is provided between the vacuum heat insulating material 10 and the back surface 71 of the control board boxes 70, 70A. In this example, a urethane foam insulation material is filled in the predetermined gap, but a composite film in which an aluminum foil is arranged on at least one surface of the outer packaging material of the vacuum insulation material 10 is used. And the multilayer film side which arranged the aluminum foil of the outer packaging material of the vacuum heat insulating material 10 may be directly affixed on the back surface 71 of the control board boxes 70 and 70A. Moreover, even if it is a film comprised by an aluminum vapor deposition layer on both surfaces, you may make it affix directly on the back surface 71 of the control board boxes 70 and 70A. Here, the multilayer film is composed of a surface protective layer, an intermediate layer, a heat seal layer, and the like. Since the urethane heat insulating material becomes unnecessary by directly attaching the vacuum heat insulating material 10 to the back surfaces of the control board boxes 70 and 70A in this way, a predetermined distance between the vacuum heat insulating material 10 and the back surface 71 of the control board boxes 70 and 70A. There is no risk that the clearance is small and urethane is not easily filled (urethane does not easily flow into the predetermined clearance) and the heat insulation performance is deteriorated.

  Moreover, the multilayer film of the outer packaging material arranged on one surface of the laminate (core material) constituting the sheet-like (flat plate) vacuum heat insulating material 10 and the multilayer film arranged on the other surface of the laminate The multilayer structure may be different, and the multilayer film on one side may have an aluminum foil in the intermediate layer, and the intermediate layer of the multilayer film on the other side may be subjected to aluminum vapor deposition. In this case, the vacuum insulating material by the heat of the control board boxes 70 and 70A on the high temperature side is arranged by arranging the multilayer film side on which the aluminum foil of the outer packaging material is disposed on the back surface or the side surface of the control board boxes 70 and 70A. Even if the temperature rises, it is possible to suppress a decrease in the heat insulation performance due to the gas entering. Also, compared to the case where aluminum foil is used for the multilayer film disposed on both sides of the laminate, the intermediate layer of the multilayer film disposed on one surface of the laminate has aluminum foil on the other surface. When aluminum vapor deposition is applied to the intermediate layer of the multilayer film to be disposed, heat is transferred from the multilayer film having the aluminum foil disposed on one surface to the multilayer film subjected to aluminum vapor deposition disposed on the other surface. Since the transmission of can be reduced, the heat insulation performance is improved. Therefore, the heat insulation performance is improved by arranging the multilayer film side on which the aluminum foil of the outer packaging material is disposed on the back surface or the side surface of the control board box 70, 70A. That is, since the back side of the control board boxes 70 and 70A is hotter than the storage chamber side, the heat insulation performance is improved by arranging the multilayer film side in which the aluminum foil of the outer packaging material is arranged on the high temperature side. In addition, since the direction which uses the multilayer film which distribute | arranged aluminum vapor deposition on both surfaces can reduce heat | fever transmission, heat insulation performance improves.

  Therefore, a highly reliable device such as a refrigerator with high heat insulation performance can be obtained. Further, since the vacuum heat insulating material 10 can be attached in advance to the control board boxes 70 and 70A before the assembly of the refrigerator 1, which is a device, the assembling property is improved, and the vacuum heat insulating material 10 and the control board box 70 are improved. , 70A positioning is not necessary, and the assembly time can be reduced.

  The example in which the vacuum heat insulating material 10 is directly attached to the back surface of the control board boxes 70 and 70A has been described above. However, the location and part of the vacuum heat insulating material 10 to be attached may not be on the back surface of the control board boxes 70 and 70A. Alternatively, at least one wall other than the openings of the control board boxes 70 and 70A (the outside of the wall surface is preferable but the inside of the wall surface may be used) may be used. With the control board box 70, 70A installed in a device such as the refrigerator 1, the peripheral wall other than the opening (for example, the compressor 6 provided with the control board box 70 in the machine room 60 as shown in FIGS. 4 and 13). When the control board box 70 is installed substantially horizontally so that the opening of the control board box 70 faces the upper surface side or the front side of the refrigerator 1, the four side walls and the bottom wall around the opening of the control board box 70 are provided. In addition, when the control board box 70A is installed substantially vertically on the back surface of the refrigerator 1 that is the equipment so that the opening portion faces the back side of the refrigerator 1, the four around the opening portion of the control board box 70A. Side wall (top wall, side wall, bottom wall) and back wall, as shown in FIG. 11A, the control board box 70A faces the top surface of the refrigerator 1 that is the device, and the opening faces the top surface side of the refrigerator 1. When installed almost horizontally, the periphery of the opening of the control board box 70A The point to four side walls and a bottom wall.) In a similar effect can be obtained directly attached to.

(Other equipment)
Here, in devices such as an air conditioner, a refrigerator, a water heater, and a washing machine, a compressor 6, a condenser such as a heat radiating pipe 9, an expansion device 62 such as a capillary tube, and an evaporator 200 are sequentially connected by piping. In the case of an air conditioner or refrigerator, a compressor is mounted on an outdoor unit, in the case of a hot water heater, on a heat source device, and in the case of a washing machine, a compressor is mounted. In this case, the equipment is provided on the main body of the equipment such as an outdoor unit main body, a heat source main body, and a washing machine main body on which the compressor 6 is disposed, and above the compressor 6 (or on the front, side, and rear). Control board boxes 70 and 70A for storing control boards 7 and 7A for driving and controlling the compressor 6, and inverter drive circuit components which are mounted on the control boards 7 and 7A and which are configured by transistors, diodes, etc. for controlling the operation of the equipment The semiconductor component 11 and the control boards 7 and 7A are miniaturized by using a wide band gap semiconductor for the semiconductor component 11 and a cooling fan for cooling the compressor and the like. Since both of the control boards 7 and 7A can be reduced in size, the back of the control board boxes 70 and 70A (or the control board boxes such as the side, top and bottom surfaces of the control board boxes 70 and 70A) Additional parts (for example, piping such as the heat radiating pipe 9 and the suction pipe 63, the vacuum heat insulating material 10, the cooling fan 68, soundproofing material, etc.) Accumulators, mufflers, etc.) can be placed, so additional components that could not be placed on the back of the control board boxes 70, 70A can be placed on the control board that used Si semiconductors as in the past. Therefore, the space in the limited housing can be effectively used, additional functions can be obtained, and the device can be miniaturized.

  Here, since the vacuum heat insulating material 10 can be affixed to the control board boxes 70 and 70A in advance before assembling the air conditioner, the water heater, the washing machine, and the like, which are the devices, the assemblability is improved and the vacuum is further reduced. Since the positioning of the heat insulating material 10 and the control board boxes 70 and 70A becomes unnecessary, the assembly time can be reduced.

  According to the present invention, since a wide band gap semiconductor is used as a semiconductor component for driving and controlling the equipment, additional parts such as a heat radiating pipe and a vacuum heat insulating material can be disposed on the back and the periphery of the control board box, so that an extra space is required. It is possible to have an additional function without providing a. In addition, the thickness of the semiconductor component can be reduced, and the height (depth) of the control board on which the semiconductor component is mounted and the control board box that houses the control board can be reduced, so that the installation space for the control board box can be reduced. . In addition, since the height of the control board box can be reduced, additional parts such as heat radiation pipes and vacuum heat insulating materials can be placed on the back of the control board box, making it possible to have additional functions without providing extra space. Equipment such as a refrigerator and an air conditioner having additional functions can be obtained without changing the size and volume.

  In addition, when the equipment is a refrigerator, the control board and control board box can be reduced in height and size, so that the protruding part where the inner box protrudes inside the cabinet due to the large height of the control board box. Since it becomes unnecessary, the internal volume can be increased. In addition, since there is room in the heat insulation space between the back of the control board box and the storage room, additional parts such as heat radiation pipes and vacuum heat insulating materials can be provided in this room without reducing the internal volume. Additional functions can be obtained.

  Here, in the devices such as the refrigerator and the air conditioner of the present embodiment, the refrigeration cycle of the refrigerator main body 1 or the indoor unit main body of the air conditioner, the outdoor unit main body of the air conditioner, the heat source main body of the water heater or the washing machine main body is used. A machine room 60 in which the compressor 6 constituting the refrigeration cycle is disposed, a control board 7 that is provided in the machine room 60 and controls the compressor 6, and is provided outside the machine room 60. And a second control board 7A for performing control other than the control of the compressor 6, and a wide band gap semiconductor is used for the semiconductor component mounted on the control board 7 and is mounted on the second control board 7A. A conventional Si semiconductor may be used as the semiconductor component. In this way, if a wide band gap semiconductor and a conventional Si semiconductor are selectively used in consideration of cost merit depending on the usage environment and the magnitude of the current to be controlled, a highly functional and low cost compressor and equipment can be obtained. . When high-temperature proof stress or processing speed is required (for example, when there is a heating element such as a compressor in a machine room and where a high-temperature environment is required, or when processing speed is required for compressor control, etc.) Use high-cost but wide-bandgap semiconductors, and use low-cost conventional Si semiconductors where high-temperature proof stress or processing speed is not required (for example, where there are no other heat-generating parts). As a result, a compressor and a device that satisfy the necessary functions and are highly reliable at low cost can be obtained.

(Effects etc.)
As described above, devices such as the refrigerator and the air conditioner of the present embodiment are refrigerators such as the refrigerator main body 1 or the indoor unit main body of the air conditioner, the outdoor unit main body of the air conditioner, the heat source main body of the water heater, or the main body of the washing machine. A machine room 60 provided in an apparatus main body having a cycle, in which a compressor 6 constituting a refrigeration cycle is arranged, and a control in which a wide band gap semiconductor provided in the machine room 60 and controlling the compressor 6 is mounted. Since the board 7 and the second control board 7A that is provided outside the machine room 60 and performs control other than the control of the compressor 6 are provided, the arrangement position of the control board can be selected according to the control target. The degree of freedom is improved. Further, a wide bandgap semiconductor is used for the semiconductor component 11 that controls the compressor disposed in the machine room 60 that is at a high temperature, and the control board 7 on which the wide bandgap semiconductor is mounted is disposed in the machine room 60. As a result, the relatively thick and high-cost power lead wire connecting the control board 7 and the compressor 6 can be shortened, so that the cost is low, and electromagnetic noise caused by the power lead wire is also generated. Can be suppressed.

  Further, at least one of the control board 7 and the second control board 7A is provided with information transmitting / receiving means such as an antenna capable of transmitting and receiving information, and control signals are exchanged wirelessly between the control board 7 and the second control board 7A. If it is performed in a non-contact manner by electromagnetic waves such as infrared rays, the connection line for exchanging control signals by connecting between the control board 7 and the second control board 7A can be eliminated. Equipment can be obtained. Also, since the connection lines can be eliminated, there is no need to consider how to connect the connection lines in the equipment (handling) and how to fix the connection lines. This eliminates the need for drilling holes in partitions, heat insulating materials, etc., so that a simple structure and low-cost equipment can be obtained. Further, if power / information transmission / reception means such as an antenna capable of transmitting / receiving power is provided, power transmission / reception is also possible.

  An operation unit provided outside the machine room of the main body and instructing a set temperature, an operating time, and the like, and a second control board provided outside the machine room of the main body and provided in the vicinity of the operation unit, If the control signal from the operation unit is transmitted from the second control board to the control board in a non-contact manner when the control unit is operated, the connection line connecting the operation unit and the second control board 7A is shortened. it can. Further, if the operation unit is provided integrally with the second control board, the connection line can be eliminated. Further, if the control board 7 and the second control board are contactlessly communicated by radio or infrared rays, control signals and power are exchanged between the control board 7 and the second control board 7A via a connection line. This is possible without the need for wiring, and it is not necessary to handle the wiring of the device main body or to fix the wiring, so that a low-cost device with good design can be obtained.

  Further, the control board 7 or the second control board 7A is provided with a power / information transmission / reception means capable of transmitting and receiving power and information, so that power can be transmitted and received between the control board 7 and the second control board 7A. For example, it is only necessary to connect and supply the main power source (for example, the commercial power source 400) only to either the control board 7 or the second control board 7A, so that a device having a simple structure and a low cost can be obtained.

  Also, a mist spray that is provided in a device body having a refrigeration cycle, such as a refrigerator body 1 or an indoor unit body of an air conditioner, an outdoor unit body of an air conditioner, a heat source body of a water heater or a washing machine body, and sprays mist indoors. A device having a small control current compared to the operating current of the compressor, such as an actuator, a display device, or a lighting device, which operates by applying a voltage such as a device or a sterilizing device for sterilizing the room, is provided. If the control board 7 provided in the vicinity controls the drive of the compressor 6 and the second control board arranged closer to the apparatus than the control board 7 controls the apparatus, the control object 7 The size of the control board 7 and the second control board, the type of the semiconductor chip, etc. can be selected according to the control content and control current, and the arrangement positions of the control board 7 and the second control board are also the equipment. It can be set to match the body of shape and space. Therefore, a device with a high degree of design freedom can be obtained.

  In addition, a wide band gap semiconductor as a semiconductor part 11 which drives and controls the heat insulation box (or the refrigerator main body 1) having an opening on the front and having a plurality of storage rooms, the machine room 60 on the back of the heat insulation box, and the compressor 60. If the compressor 60 is arranged in the machine chamber 60 and the control board 7 is provided in the vicinity of the compressor 6 or in the terminal box 601 of the compressor 6, the compressor 6 is provided. Since a wide band gap semiconductor that can operate at a high processing speed is mounted on the control board 7 even in the machine room 60 that is in a high temperature environment, even in the machine room 60 that is at a high temperature. The compressor 6 can be controlled without causing a semiconductor failure or a reduction in processing speed.

  In the present embodiment, the main body (for example, the refrigerator main body 1 or the outdoor unit of the refrigeration / air-conditioning apparatus (including the heat source unit of the hot water supply apparatus)), the main body 1 or the back of the main body 1 is provided. A machine room 60 in which the compressor 6 constituting the refrigeration cycle is arranged, a drain pan 660 that is provided in the machine room 60 and receives the defrost water of the cooler 200, and a semiconductor component 11 that drives and controls the compressor 6 are mounted. A control board 7 and a control board box 70 for storing the control board 7. The semiconductor part 11 is made of a wide band gap semiconductor such as SiC or GaN, and the semiconductor part 11 or the control board 7 or the control board 7 is controlled. Since the substrate box 70 is attached to the back surface or the side surface of the drain pan 660, the semiconductor component 11, the control substrate 7, and the control substrate box 70 can be machined with a simple configuration. To be placed within 60, moreover devices such as a semiconductor water components drain pan 660 heat generated by the 11 refrigerator or refrigeration air conditioning system and water heater available for evaporation (drain water) is obtained. Further, in order to evaporate the water in the drain pan 660, it can be used in combination with a heating component such as a heater or a heat radiating pipe, and there is no need to provide a new heating component for drain water evaporation. Since the heat generated by the semiconductor component 11 can be used to evaporate the water, a device such as a refrigerator capable of improving the evaporation efficiency in the drain pan 660 can be obtained. Further, when the drain water can be evaporated by the heat generated by the semiconductor component 11, it is possible to eliminate the heating component, so that a low-cost device can be obtained.

  Moreover, it is arrange | positioned in the refrigerator main body 1 which has the some storage chambers 2, 3, 4, 5, and 35 divided by the partition wall in the front side, and the cooler room of the back of the refrigerator main body 1, and supplies to several storage chambers A cooler 200 for generating cool air, an internal fan that is provided in the cooler chamber and supplies the cool air generated by the cooler 200 to a plurality of storage chambers via an air passage, and a rear upper part of the refrigerator main body 1 or a refrigerator A machine room 60 provided at the lower back of the main body 1 and in which the compressor 6 that constitutes the refrigeration cycle together with the cooler 200 is disposed; a drain pan 660 provided below the cooler 200 and receiving defrost water from the cooler 200; A control board 7 on which a semiconductor component 11 for driving and controlling the compressor 6 is mounted, and a control board box 70 for housing the control board 7, using a wide band gap semiconductor for the semiconductor part 11, 1 or because the control board 7 is attached to the back surface or side surface of the drain pan 660, a refrigerator capable of using the heat generated by the semiconductor component 11 to evaporate water (drain water) in the drain pan 660 is obtained with a simple configuration. . Further, in order to evaporate the water in the drain pan 660, it can be used in combination with a heating component such as a heater or a heat radiating pipe, and there is no need to provide a new heating component for drain water evaporation. Since the heat generated by the semiconductor component 11 can be used to evaporate the water, a refrigerator capable of improving the evaporation efficiency in the drain pan 660 can be obtained. In addition, when the drain water can be evaporated by the heat generated by the semiconductor component 11, it is possible to eliminate the heating component, so that a low-cost refrigerator can be obtained.

  Further, by using a wide bandgap semiconductor for the semiconductor component 11 for controlling the device, the semiconductor component 11 and the control board 7 can be disposed in the vicinity of the compressor 6 in the machine room 6 or in the terminal box 601 of the compressor 6. Machine control lead wire can be shortened and noise can be reduced. Further, by using a wide band gap semiconductor for the semiconductor component 11 for controlling the device, the control board can be disposed in the vicinity of the drain pan 660 in the machine room 60, so that the length of the compressor control lead wire can be shortened. Equipment such as cost compressors, refrigerators and air conditioners can be obtained.

  Further, if the drain pan 660 is provided above the compressor 6 in the machine room 60, the drain pan 660 can be heated with air heated by the heat generated by the compressor 6 that is normally not used and is wasted. Further, water such as drain water accumulated in the drain pan 660 can be efficiently evaporated, and the heat generated by the compressor 6 can be effectively used. Further, when used in combination with a wide band gap semiconductor, water in the drain pan can be evaporated more efficiently.

  Further, if the drain pan 660 is directly and detachably attached to the upper portion 6Y of the compressor 6, the water accumulated in the drain pan 660 directly by the heat generated by the compressor 6 that is normally not used and is wasted. Heating can be performed efficiently and the heat generated by the compressor 6 can be used effectively. Therefore, the water in the drain pan 660 can be efficiently evaporated by the heat generated by the compressor 6. Further, when used in combination with a wide band gap semiconductor, water in the drain pan can be evaporated more efficiently.

  Further, the control board box 70 is made of a heat conductive member, the semiconductor component 11 is fixed so as to be thermally connected to the control board box 70, and the heat generated by the semiconductor component 11 is radiated by the control board box 70. In this case, for example, when a wide band gap semiconductor is used for the semiconductor component 11, the control board box 70 can be used instead of the heat radiating fins, so that the heat radiating fins are unnecessary, and a low-cost compressor and device can be obtained.

  Further, if the semiconductor component 11 is connected to the control board box 70 via the heat radiation auxiliary member 110 that can be electrically insulated, the outer shape may be spherical like the compressor 6 or may have a protrusion. Even so, the shape of the heat radiation assisting member 110 can be set so as to conform to the outer shape of the drain pan 660 and the compressor 6, and the heat generated by the semiconductor component 11 can be efficiently transmitted through the heat radiation assisting member 110. The drain pan 660 or the water in the drain pan 660 can be transmitted to the drain pan 660, and the water in the drain pan 660 can be efficiently evaporated.

  Further, if a drain water pool portion (for example, a recess portion) 665 for collecting drain water is provided on at least a part of the bottom surface of the drain pan 660, and the semiconductor component 11 and the control board 7 are provided in the drain water pool portion, the water in the drain pan 660 can be obtained. Is collected at a specific location (for example, one location) where the drain water is accumulated, the drain water can be efficiently evaporated by the heat generated by the semiconductor component 11.

  In addition, if a draining portion 670 extending or projecting downward or outward from the drain pan 660 is provided on at least a part of the outer periphery (the periphery of the control substrate 7 or the control substrate box 70) of the drain pan 660, the drain pan is provided. Even if the water in 660 overflows outside the drain pan 660, the control board 7 and the control board box 70 do not spill water or enter the water, so that a highly reliable device can be obtained.

  Further, when the heat generated by the wide band gap semiconductor is used for evaporation of water in the drain pan 660, the drain pan 660 is not directly exposed to the air blown from the compressor cooling fan 68 (for example, the drain pan 660 is cooled by the compressor). If it is arranged on the windward side of the fan 68, most of the air blown from the compressor cooling fan 68 can be used for cooling the compressor 6, so that the temperature rise of the compressor 6 can be suppressed and highly reliable compression can be achieved. Machine and equipment. Since the heat generated by the wide band gap semiconductor can be used to evaporate the water in the drain pan 660, it is not necessary to evaporate the water in the drain pan 660 with the air blown from the compressor cooling fan 660. Can be cooled. Further, since it is not necessary to evaporate the water in the drain pan 660 with the air blown by the compressor cooling fan 660, the degree of freedom of the arrangement of the drain pan 660 is improved because it is not affected by the position of the compressor cooling fan 68.

The sectional side view of the refrigerator showing embodiment of this invention. The cross-sectional view near the terminal box of the compressor representing the embodiment of the present invention. The top view (front view) of the control board box of the refrigerator showing Embodiment 1 of this invention. The sectional side view of another refrigerator showing Embodiment 1 of the present invention. The rear perspective view of another refrigerator showing embodiment of this invention. The rear perspective view of another refrigerator showing embodiment of this invention. The front view of the control board of the refrigerator showing embodiment of this invention. The cross-sectional view of the control board box of the refrigerator showing embodiment of this invention. The cross-sectional view of the control board box of the refrigerator showing embodiment of this invention. The wiring connection figure of the control board of the apparatus showing this Embodiment. The perspective view of the drain pan of the apparatus showing embodiment of this invention. The figure which shows the structure of the compressor and drain pan of an apparatus showing embodiment of this invention. The sectional side view of another refrigerator showing embodiment of this invention. The principal part sectional drawing of the control board box vicinity of the refrigerator showing embodiment of this invention. The rear perspective view of the refrigerator showing embodiment of this invention. The principal part sectional drawing of the control board box vicinity of the refrigerator showing embodiment of this invention. The principal part sectional drawing of the control board box vicinity of the refrigerator showing embodiment of this invention.

  DESCRIPTION OF SYMBOLS 1 Refrigerator, 2 Refrigeration room, 3 Switching room, 4 Freezing room, 5 Vegetable room, 6 Compressor, 6X Airtight container (jacket), 7, 7A Control board, 8 Heat insulating material (partition wall), 9 Radiation pipe, 10 Vacuum heat insulating material, 11 Semiconductor parts (inverter drive circuit parts), 12 Heat radiator, 13 Transformer, 14 Relay, 15 Converter, 16 Capacitor, 17 Current detection sensor, 35 Ice making room, 40 Heat radiation auxiliary part, 60 Machine room, 61 Accumulator , 62 expansion device, 68 compressor cooling fan, 70, 70A control board box, 71 back of control board box, 75 auxiliary member, 79 control board box opening, 80 back heat insulating material, 81 top surface heat insulating material, 83 inner box The amount by which the amount of protrusion to the inside of the cabinet decreases (the volume increase portion in the cabinet), 85 the thickness increase portion of the heat insulating material (the heat insulation thickness increase portion due to the control board box thickness decrease), 91 Piping, 92 downstream piping, 93 control board box back piping, 101 inner box, 102 outer box, 110 heat dissipation auxiliary member, 151 top surface, 152 back surface, 200 cooler (evaporator), 350 cushioning material, 400 commercial power supply, 410 terminal block, 601 terminal box, 610 terminal, 660 drain pan, 730 AC / DC converter, 740 semiconductor component, 750 control component, 770 functional component.

Claims (11)

A casing that houses therein a compression mechanism portion that compresses the refrigerant and an electric motor that rotationally drives the compression mechanism portion;
A power connection terminal provided in the casing for energizing the electric motor;
A terminal box provided on the casing and covering at least a part of the periphery of the power connection terminal;
A control board on which semiconductor components for driving and controlling the electric motor are mounted;
A control board box for storing the control board;
With
A compressor characterized in that a wide band gap semiconductor is used for the semiconductor component, and the control board box is detachably attached to the terminal box.   The compressor according to claim 1, wherein a buffer material is interposed between the control board box and the terminal box.   The control board box is composed of a heat conductive member, the semiconductor component is fixed so as to be thermally connected to the control board box, and the heat generated by the semiconductor component is radiated by the control board box. The compressor according to claim 1 or 2, characterized by the above-mentioned.   The compressor according to any one of claims 1 to 3, wherein the semiconductor component is connected to the control board box via a heat dissipation auxiliary member capable of being electrically insulated.   The compressor according to any one of claims 1 to 4, wherein the semiconductor component is SiC (silicon carbide) or GaN (gallium nitride).   A machine room provided in the main body, in which the compressor is disposed, and a second control board provided outside the machine room, and exchange of control signals between the control board and the second control board. The apparatus according to claim 1, wherein the apparatus is performed by electromagnetic waves such as radio waves and infrared rays.   An operation unit for instructing the operation of the device is provided in the main body, and when the operation unit is operated, a control signal from the operation unit is transmitted from the second control board to the control board. The device according to claim 6.   The control board or the second control board includes power / information transmission / reception means capable of transmitting and receiving power and information, and enables transmission and reception of power between the control board and the second control board. The device according to claim 6 or 7, characterized in that Control current compared to the operating current of the compressor, such as an actuator that operates by applying a voltage, such as a mist spraying device that sprays mist in the room or a sterilizing device that sterilizes the room, or a display device or a lighting device. With a small device,
The control board performs drive control of the compressor,
The apparatus according to claim 6, wherein the second control board controls the apparatus.   6. A heat insulating box having a front surface and a plurality of storage chambers, and a machine room on the back of the heat insulating box, wherein the compressor according to claim 1 is disposed in the machine chamber. A refrigerator characterized by doing so.   A device in which the compressor according to any one of claims 1 to 5 is mounted in the body.

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