CN103225931A

CN103225931A - Compressor, refrigerator and equipment

Info

Publication number: CN103225931A
Application number: CN2012105745562A
Authority: CN
Inventors: 前田刚; 中岛浩史
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2012-01-27
Filing date: 2012-12-26
Publication date: 2013-07-31
Anticipated expiration: 2032-12-26
Also published as: CN103225931B; CN203595339U; JP5738207B2; CN203274356U; JP2013155621A

Abstract

The invention provides a compressor, a refrigerator and an equipment. The invention is provided with a control baseplate carriying a wide bandgap semiconductor in a machine room, and near the compressor or the terminal. In addition, in the invention, the length of a supply lead for connecting the compressor and the control base plate is reduced. According to the invention, the equipment comprises a casing body containing a compressor mechnism part with compressing refrigerating fluid and a motor for rotating and driving the compressing mechenism part; a terminal for power connection, which is arranged on the casing for supplying power for the motor; a terminal box for covering at least one part of the surrouding of the power connection terminal; a control part with a semiconductor element for driving and controlling the compressor; a control base plate case for containing and controlling the base plate. The semiconductor element employs a wide bandgap semiconductor and the control base plate case is detachably installed on terminal case.

Description

Compressor, refrigerator, equipment

Technical field

The semiconductor device that the present invention relates to equipment control usefulness has adopted equipment such as the refrigerator of wide bandgap semiconductor, air conditioner.

Background technology

Along with the raising day by day of awareness of saving energy, in refrigeration, the airconditions such as air conditioner in recent years, refrigerator, low power consumption quantizes to develop.Be to realize low power consumption, make the equipment of the frequency conversion type that the driving frequency of compressor can change become main flow.Because mainly the frequency changer circuit that is made of semiconductor device becomes high hot, so need relatively large radiator structure, under the state that is installed on the control substrate, highly high structure is more.Here, component height under the state on the control substrate of being installed in of the component parts beyond the frequency changer circuit, the height of large-scale radiator structure associated components that for example cools off semiconductor device is big, compare with this large-scale radiator structure associated components, parts highly low in the miscellaneous part are many, on the control substrate, highly high parts and highly low parts mix and exist.

The VFC of being undertaken by the frequency conversion drive circuit can realize that low power consumption quantizes, but on the other hand, because the semiconductor device that carries on the control substrate generates heat, so the heat that sends is invaded in the case of refrigerator, need carry out heat insulation reliably.On the other hand, in refrigerator in recent years, be provided with in space and the size (width, highly), seek the increase (taking in the increase of volume) of the amount of taking in the case, therefore, developing the slimming of heat-barrier material limited.If can not be heat insulation reliably to the control substrate, then the heat of the heating of self generation is invaded in the case via heat-barrier material, thereby become one of reason that makes the power consumption deterioration on the contrary, therefore, proposed a kind of periphery that the control substrate of frequency changer circuit is installed and carried out heat insulation refrigerator reliably by heat-barrier material.(for example with reference to patent documentation 1)

Under the situation of refrigerator, viewpoint from the increase of case internal capacity, consideration will be controlled substrate and be configured in the slimming that heat-barrier material is implemented in the Machine Room, but in the equipment of in the past refrigerator etc., the semiconductor element of the frequency changer circuit of lift-launch on the control substrate has adopted the low Si(silicon of heat resisting temperature), therefore, the high place of temperature around (environment temperature) is difficult to be arranged at for example Machine Room etc.

Here, be arranged at countermeasure under the situation that disposes the Machine Room that makes the compressor that environment temperature uprises, proposed a kind of refrigerator, with around the insulation encloses control substrate and directly be not subjected to Temperature Influence in the Machine Room as controlling substrate.(for example with reference to patent documentation 2)

Be arranged under the situation that disposes Machine Room heaters such as compressor, that become higher temperature etc. will controlling substrate, need with insulation encloses control substrate around or other temperature rise and suppress countermeasure, therefore, because the reasons such as cost rising of the guaranteeing of heat-barrier material space, heat-barrier material part, the control substrate is not configured in the Machine Room that becomes hot environment and is arranged on (for example place beyond the Machine Room) the Machine Room outside, this just need the Machine Room in addition other the space is set.

Here, as the countermeasure under the situation about semiconductor element being configured in the Machine Room, the semiconductor element that has proposed frequency changer circuit uses high heat-resisting wide bandgap semiconductor, and this wide bandgap semiconductor element is arranged in the housing that is disposed at the compressor in the Machine Room.In this embodiment, utilize the refrigerant cools wide bandgap semiconductor element in the compressor, realize the simplification of radiator structure thus, in addition, be accommodated in the housing of compressor by the electromagnetic wave noise that will be produced, implement the noise countermeasure from the high frequency magnetic flux that converter plant produces.(it is the wide bandgap semiconductor element that the element of converter plant adopts high heat-resistant component, with this wide bandgap semiconductor arrangements of components in the housing of compressor, with the low heat resistant arrangements of components such as Si used outside in the past at compressor housing.) (for example with reference to patent documentation 3)

In addition, following structure has been proposed, promptly, the power component of heating adopts wide bandgap semiconductor, and with the part of power component be arranged on compressor housing, discharge on the pipe arrangement, utilize the high-pressure refrigerant cooling of compressor, control the temperature of high-pressure refrigerant based on the temperature of power component.(for example with reference to patent documentation 4)

[prior art document]

[patent documentation 1] Japanese kokai publication hei 7-270041 communique

[patent documentation 2] TOHKEMY 2001-41635 communique

[patent documentation 3] TOHKEMY 2008-57425 communique

[patent documentation 4] TOHKEMY 2008-57870 communique

Shown in patent documentation 1, in refrigerator in the past, a kind of refrigerator has been proposed, the control substrate is set on the heat insulation wall at the refrigerator back side, and it is heat insulation that the periphery of the control substrate of installation frequency changer circuit utilizes heat-barrier material to carry out reliably.But, because the employed semiconductor element of semiconductor device is a Si element in the past, thus big at the thickness of control substrate and control substrate box, can not directly be accommodated in the heat-barrier material of refrigerator back face wall.Therefore, side-prominent in case at the back portion of the refrigerator main body that disposes the control substrate box by case in making, the control substrate box is accommodated in the heat-barrier material of back face wall.Therefore, in the part that disposes the control substrate box, only make the part that disposes the control substrate box to case inboard (storeroom side) the outstanding heat-barrier material (polyurethane heat-barrier material) that the refrigerator back side is set (bending), so the volume of storeroom diminish.

In addition, be configured at miscellaneous part under the situation between the case inboard (interior case) of control substrate box and refrigerator vacuum heat insulation material and radiating tube etc., because the height of control substrate box, make the control substrate box become obstacle, therefore vacuum heat insulation material need be bent into more than the height of control substrate near the control substrate box back side, it is complicated that the structure of miscellaneous part such as vacuum heat insulation material, radiating tube becomes, and cost raises.

In addition, vacuum heat insulation material by the bending writing board shape, the packaging bag (outsourcing material) that constitutes vacuum heat insulation material may be damaged, heat-proof quality may reduce, therefore, in advance vacuum heat insulation material was arranged between control substrate and the refrigerator inside, it is heat insulation to utilize heat-proof quality to carry out than the polyurethane heat-barrier material of vacuum heat insulation material difference, can not expect high performance in the past.

In addition, under the situation of refrigerator in the past, there is the radiating tube (suitable) that to constitute the part of freeze cycle to be arranged on the situation at the refrigerator back side with condenser, but at the back side of control substrate box (between in control substrate box and the case), from guaranteeing the viewpoint of case internal capacity, make heat-barrier material as thin as a wafer, can not guarantee in the heat-barrier material at the back side of controlling substrate box, to be provided with the thickness (space) of radiating tube, so, avoid controlling substrate box configuration section make radiating tube be coiled in the side of control substrate box, can not make radiating tube be coiled in the back side of control substrate box, the length that increases radiating tube is difficult.Therefore, there is the limit in the power consumption that the length by the lengthening radiating tube increases radiating efficiency and reduces refrigerator, and is difficult.In addition, under the situation of refrigerator in the past, owing to can not guarantee space at the inboard of control substrate configuration radiating tube, so avoid making radiating tube to be coiled in the side of control substrate with controlling substrate, it is many that the crooked place of the radiating tube at the refrigerator back side becomes, the distortion that becomes of the coiling shape of radiating tube, the processability of radiating tube and reliability worsen.In addition, because the back side that makes radiating tube be coiled in the control substrate is difficult, so the length of lengthening radiating tube also is difficult, therefore, the length of radiating tube shortens, and radiating efficiency reduces.

In addition, in the past, the control substrate box be set at the Machine Room away from the situation of position more, so, the allocation position of the allocation position of compressor and control substrate also away from, therefore, compare with the situation that the control substrate is configured in the Machine Room, need the compressor length that goes between that the elongated line footpath is thick, cost is high, so cost raises.In addition, owing to need lengthening and use the line footpath to become the compressor in generation source of noise slightly, easily with lead-in wire, so the electromagnetic noise of being easy to generate becomes problem.(for example, compressor configuration is at the back side, bottom of refrigerator, the control substrate is configured in the top rear face of refrigerator, perhaps, compressor configuration is in the top rear face of refrigerator, it is more that the control substrate is configured in the situation at the substantial middle back side of refrigerator, the allocation position of the allocation position of compressor and control substrate away from situation more.）

In addition, in the refrigerator of patent documentation 2 records, in becoming the Machine Room of hot environment, be provided with the electric component incorporating section of taking in the control substrate, but in this electric component incorporating section, because semiconductor element is a Si element in the past, used the semiconductor element of non-refractory, so for the Temperature Influence in the Machine Room that is subjected to becoming high temperature and do not break down, foam filled resinous enclosing (heat-barrier material) need be set, the volume reducing of Machine Room measure accordingly with the thickness of heat-barrier material, in addition, cost raises and heat-barrier material is measured accordingly.In addition, from resinous enclosing take out connect control substrate and compressor connecting line (lead-in wire) afterwards, need take out the hole with landfills such as heat-barrier materials, time-consuming and increase cost.In addition, be the not influence of the rising heat of machine by compression, the electric component incorporating section can not be arranged on the positive top of compressor, and the free degree of the configuration of electric component incorporating section diminishes.

In addition, because the compressor of patent documentation 3 records is arranged on the wide bandgap semiconductor element of converter plant in the housing of compressor, so under the situation that the wide bandgap semiconductor element breaks down, can not change, can only when safeguarding, change compressor, the replacing operation is arduous, in addition, replacement cost becomes big.In addition, owing to be arranged in the compressor, the structure of the anti-cold-producing medium that need can not break down because of cold-producing medium causes cost to raise.

In addition, in the refrigerating plant of patent documentation 4 records, owing to the housing that power component is disposed at compressor, think is provided with power component in being the compressor housing of curve form, need study especially the shape of heat transfer component and installation method etc., cost increases.In addition, because the control substrate etc. that will carry power component is arranged at the discharge pipe arrangement of the compressor about diameter 10mm～15mm, so excessive load and stress are applied to the discharge pipe arrangement, become the reason of pipe arrangement fracture and pipe arrangement vibration, reliability may reduce.

Summary of the invention

In the present invention, its objective is equipment such as obtaining to take in capacious refrigerator.In addition, its objective is reduce compressor with power supply lead wire or control with the lead-in wire length.In addition, its objective is the electromagnetic noise that reduction is caused by lead-in wire.In addition, its objective is the equipment such as refrigerator that upkeep operation is easy to have wide bandgap semiconductor that obtain.In addition, its objective is the high compressor with wide bandgap semiconductor, the equipment of reliability that obtains not applying excessive power to pipe arrangements such as discharging pipe arrangement.

In addition, even its objective is equipment such as the compressor that obtains in the Machine Room, not being provided with heat-barrier material the control substrate also can be set, refrigerator, air conditioner, washing machine, refrigeration machine, showcase.In addition, its objective is the space that effectively utilizes in the Machine Room.In addition, its objective is the high equipment of the configuration free degree that the control substrate is provided.In addition, its objective is by controlling substrate to be configured in the Machine Room, effectively utilize the shared space of control substrate in the past.In addition, its objective is the equipment such as refrigerator that obtain effectively to utilize the heat that semiconductor device sends.

In addition, its objective is that the height and the size that make the control substrate box reduce and effective increase space that utilizes the amount that reduces.In addition, its objective is the case internal capacity is increased.In addition, its objective is equipment such as the refrigerator that obtains low power consumption, air conditioner.In addition, its objective is and in the increase space at the control substrate box back side, optional features such as radiating tube, cooling air duct, lighting device to be set, change the outer shape of equipment not significantly and big or small obtain to append function.In addition, its objective is the evaporation of water that promotes in the drain pan.In addition, its objective is that the heat that wide bandgap semiconductor is sent is used to make the Defrost water evaporating that is trapped in the drain pan via drain pan.

In the present invention, have: housing, inside are taken in the compressor means portion of compressed refrigerant and the motor of portion of drive compression mechanism rotation; The used for electric power connection terminal is arranged at housing, is used for switching on to motor; Terminal box, at least a portion around covering power connector end; The control substrate has carried the semiconductor device that drives the control compressor; Take in the control substrate box of control substrate.Semiconductor device adopts wide bandgap semiconductor, and will control substrate box and can be installed on terminal box removably.

The effect of invention

According to the present invention, the semiconductor device of control appliance uses wide bandgap semiconductor, thereby the control substrate can be disposed near the compressor in the Machine Room or the terminal box of compressor, therefore, can shorten the length of compressor control lead-in wire, and can reduce noise.In addition, the semiconductor device of control appliance uses wide bandgap semiconductor, thereby the control substrate can be configured near the compressor in the Machine Room, therefore can shorten the length of compressor control lead-in wire, obtain equipment such as compressor, refrigerator, air conditioner cheaply.

Description of drawings

Fig. 1 is the sectional view of the refrigerator of expression embodiments of the present invention.

Fig. 2 is near the sectional elevation of terminal box of the compressor of expression embodiments of the present invention.

Fig. 3 is the vertical view (front view) of control substrate box of the refrigerator of expression embodiments of the present invention 1.

Fig. 4 is the sectional view of other refrigerators of expression embodiments of the present invention 1.

Fig. 5 is the rear isometric view of other refrigerators of expression embodiments of the present invention.

Fig. 6 is the rear isometric view of other refrigerators of expression embodiments of the present invention.

Fig. 7 is the front view of control substrate of the refrigerator of expression embodiments of the present invention.

Fig. 8 is the sectional elevation of control substrate box of the refrigerator of expression embodiments of the present invention.

Fig. 9 is the sectional elevation of control substrate box of the refrigerator of expression embodiments of the present invention.

Figure 10 is the wiring connection layout of control substrate of the equipment of expression present embodiment.

Figure 11 is the stereogram of drain pan of the equipment of expression embodiments of the present invention.

Figure 12 is the figure of the structure of the compressor of equipment of expression embodiments of the present invention and drain pan.

Figure 13 is the sectional view of other refrigerators of expression embodiments of the present invention.

Figure 14 is near the main position cutaway view of control substrate box of the refrigerator of expression embodiments of the present invention.

Figure 15 is the rear isometric view of the refrigerator of expression embodiments of the present invention.

Figure 16 is near the main position cutaway view of control substrate box of the refrigerator of expression embodiments of the present invention.

Figure 17 is near the main position cutaway view of control substrate box of the refrigerator of expression embodiments of the present invention.

The explanation of Reference numeral

1 refrigerator, 2 refrigerating chambers, 3 switch the chamber, 4 refrigerating chambers, 5 vegetable compartment, 6 compressors, 6X closed container (overcoat), 7,7A controls substrate, 8 heat-barrier materials (partition wall), 9 radiating tubes, 10 vacuum heat insulation materials, 11 semiconductor elements (frequency conversion drive circuit block), 12 radiators, 13 transformers, 14 relays, 15 converters, 16 capacitors, 17 current detection sensors, 35 ice-making compartments, 40 heat radiation auxiliary parts, 60 Machine Rooms, 61 memories, 62 expansion gears, 68 compressor cooling fans, 70,70A controls substrate box, the back side of 71 control substrate boxes, 75 accessories, 79 control substrate box peristomes, 80 back side heat-barrier materials, 81 end face heat-barrier materials, the reduction (the case internal capacity increases part) to the overhang of case inboard of casees in 83, the thickness increasing portion of 85 heat-barrier materials (control substrate box thickness reduces the heat-barrier material thickness increasing portion that causes), 91 up pipe arrangements, 92 descending pipe arrangements, 93 control substrate box back side pipe arrangements, 101 interior casees, 102 outer containers, 110 heat radiation auxiliary parts, 151 end faces, 152 back sides, 200 coolers (evaporimeter), 350 padded coamings, 400 source power supplies, 410 terminal boards, 601 terminal boxs, 610 terminals, 660 drain pans, 730AC/DC converter, 740 semiconductor elements, 750 control assemblies, 770 functional parts.

The specific embodiment

Embodiment 1

(Machine Room is configured in the lower backside of refrigerator main body)

Fig. 1 is a side sectional view of observing the refrigerator of embodiments of the present invention 1 from sidewall.In the drawings, epimere at refrigerator main body 1 is provided with refrigerating chamber 2, be provided with side by side below refrigerating chamber 2 and switch chamber 3 and ice-making compartment 35, be provided with refrigerating chamber 4 below switching chamber 3 and ice-making compartment 35, (hypomere) is provided with vegetable compartment 5 below refrigerating chamber 4.Here, between each storeroom (for example refrigerating chamber 2, switching chamber 3, ice-making compartment 35, refrigerating chamber 4, vegetable compartment 5), separated by heat-barrier material (being partition member, polyurethane heat-barrier material or vacuum heat insulation material etc.) 8 between the different chamber of design temperature (storage temperature).In addition, be provided with Machine Room 60, in Machine Room 60, taken in compressor 6, compressor cooling fan etc. in the lower rear of refrigerator main body 1.

Here, refrigerator 1 also can be provided with refrigerating chamber 2 at epimere, below refrigerating chamber 2, be provided with side by side and switch chamber 3 and ice-making compartment 35, switch chamber 3 and ice-making compartment 35 below vegetable compartment 5 is set, (hypomere) is provided with refrigerating chamber 4 below vegetable compartment 5.In addition, refrigerator 1 also can be provided with refrigerating chamber 2 at epimere, and vegetable compartment 5 is set below refrigerating chamber 2, below vegetable compartment 5, be provided with side by side and switch chamber 3 and ice-making compartment 35, switch chamber 3 and ice-making compartment 35 below (hypomere) refrigerating chamber 4 is set.In addition, also can have the refrigerating chamber 2 of the refrigerating-chamber door of rotary type, below refrigerating chamber 2, vegetable compartment 5 and refrigerating chamber 4(or ice-making compartment 35 are set side by side, switch chamber 3) across heat insulation dividing plate ground in epimere setting.Under this situation, in vegetable compartment 5, vegetable compartment door with rotary type, be provided with one or more drawers in the inboard of vegetable compartment door, in addition, the refrigerating chamber door that refrigerating chamber 4, ice-making compartment 35 and switching chamber 3 also can have rotary type (also can be provided with the ice-making compartment door, switch the chamber door, if can be substituted by refrigerating chamber door, also they can be set.), also side is provided with the refrigerating chamber 4(or the ice-making compartment 35 of one or more drawer types or switches chamber 3 within it).

In addition, between the interior case 101 at the back side of the main body of refrigerator 1 and outer container 102, be provided with the back side heat-barrier material 80 that for example forms by polyurathamc etc., in addition, in the Machine Room 60 at the main body back side of refrigerator 1, dispose compressor 6 and control substrate box 70 etc., this control substrate box 70 has been taken in compressor 6, the compressor cooling fan, the control substrate 7 that cold air Air Blast fan etc. is controlled, in the back side heat-barrier material 80 at the main body back side of refrigerator 1, dispose with compressor 6 and connect and constitute the radiating tube (condenser pipe) 9 of freeze cycle with cooler etc., with vacuum heat insulation material 10 etc.In addition, as described below, be provided with the cooler chamber in the heat-barrier material 80 overleaf, in the cooler chamber, dispose Air Blast fan etc. in cooler 200 and the case, in Machine Room 60, back side heat-barrier material 80, dispose memory 61, expansion gear (for example capillary, electric expansion valve etc.) 62, compressor cooling fan 68 etc.

(the control substrate box is to the configuration of compressor)

Here, control substrate 7 for example is incorporated in the control substrate box 70 that the material by flame resistances such as sheet metal or resins forms.The Machine Room 60 of taking in the compressor 6 that constitutes freeze cycle is set at the lower backside of refrigerator 1 in Fig. 1, be provided with control substrate box 70 in Machine Room 60.Control substrate box 70 in Machine Room 60, be configured in the periphery of the top of the compressor 6 that becomes high temperature or side, compressor 6 or compressor 6 near.The semiconductor of lift-launch on control substrate 7 uses wide bandgap semiconductor, can make small-sized, the slimming of semiconductor device thus, and control substrate 7 also can small-sized and slimming.Therefore, control substrate box 70 also can small-sized, slimming, so can be configured in the top of compressor 6 near the compressor 6 in the Machine Room 60 that can not dispose because of the relation in space in the past.And wide bandgap semiconductor (for example 100 ℃) under the hot environment of Machine Room 60 grades also can be worked, even so also can be provided with near the compressor in the Machine Room 60.Usually, the top of compressor 6 becomes high temperature, so not arrangement components etc. and the space that is provided for dispelling the heat, but if use the control substrate box 70 of the present embodiment of wide bandgap semiconductor and small-sized, attenuation, then the upper space at the compressor 6 that may become high temperature also can dispose.

Fig. 2 is near the sectional elevation the terminal box of the compressor of lift-launch in refrigerator of expression embodiments of the present invention, Fig. 3 observes state control substrate box 70(and the terminal box 601 down pulled down cover 701 from the top) the control substrate box and the vertical view of terminal box, at least a portion of the upper surface of the control substrate box 70 of setting on the terminal box 601 of the compressor 6 of these cover 701 coverage diagrams 2.The top (for example upper casing 6A) of the housing of the compressor 6 of configuration in the set Machine Room 60 of the lower backside of refrigerator 1, be provided with terminal box 601, in terminal box 601, be provided with the terminal 610 of the motor energising that is used in the housing that is arranged at compressor 6, in addition, on the top of terminal box 601, can form or form control substrate box 70 with respect to terminal box 601 disassembled and assembled freely ground.Be provided with the cover 701 that forms by the resin with anti-flammability and electrical insulating property etc. in the substrate box 70 in control.Control substrate box 70 preferably has anti-flammability and electrical insulating property.

Be provided with control substrate 7 in control substrate box 70, and be provided with semiconductor devices 11 such as switch element, diode element, the semiconductor device 11 of at least a portion of frequency conversion drive circuit etc. adopts wide bandgap semiconductor.In addition, on control substrate 7, also can only carry semiconductor device 11(only wide bandgap semiconductor get final product), for example, also can carry control associated components (for example at least one in transformer 13, relay 14, converter 15, reactor, capacitor 16, the current detecting part 17 etc.) etc. with semiconductor element as Fig. 2, shown in Figure 3.

Here, on the terminal 610 that is arranged at compressor 6, be connected with power supply lead wire (not shown) and the motor in the housing that is arranged on compressor 6 and apply voltage, on the bottom surface of control substrate box 70, be provided with control substrate box peristome (being arranged on the control substrate box peristome on the bottom surface of control substrate box 70) 79 in the part relative, pull out power supply lead wire and be connected in the frequency conversion drive circuit block 11 of lift-launch on control substrate 7 etc. from this terminal box peristome 79 with the upper surface open portion 602 of terminal box 601.Frequency conversion drive circuit block 11 is connected with AC power supplies (for example source power supply) by the AC/DC converter that is made of capacitor etc.Frequency conversion drive circuit block 11 is made of switch element and diode element etc., and employing wide bandgap semiconductor, compare with adopting the semi-conductive situation of Si in the past, can realize high speed, miniaturization, low level (slimming), high heat-resistingization of processing speed.

In the equipment (household electrical appliance or electrical equipment) such as compressor 6, refrigerator and air conditioner of present embodiment, the terminal box 601 of compressor 6 can form with control substrate box 70 on disassembled and assembled freely ground by fixed parts such as bolt etc., therefore can make being connected apart from becoming extremely short of terminal 610 and control substrate 7.Therefore, in lead-in wire, can make the length of the power supply lead wire that the compressor in the bigger generation source that may become electromagnetic noise, line footpath uses become extremely short, therefore can significantly reduce electromagnetic noise, and, can make the length of the power supply lead wire that the line footpath is thick, cost is high become extremely short, therefore can access the compressor and the equipment of low cost and low noise.In addition, the misoperation of the equipment that causes because of noise etc. can also be suppressed, therefore high compressor of reliability and equipment can be accessed.

In addition, in the present embodiment, because the semiconductor device 11 of frequency conversion drive circuit block etc. adopts wide bandgap semiconductor, so compare with Si semiconductor in the past, under hot environment, also can be difficult to work with breaking down, therefore, even under the situation in being configured in the Machine Room 60 that becomes hot environment as in the past, heat-barrier material need be set around control substrate box 70 yet to be waited and carries out heat insulation to control substrate box 70, therefore the specification of control substrate box can be simplified, compressor and equipment cheaply can be accessed.In addition, owing to do not need to carry out heat insulation to control substrate box 70, so can make the size amount of the thickness of attenuation heat-barrier material (width or depth are reduced) in height of control substrate box 70, can realize miniaturization, therefore can be arranged on the surrounding space (for example upper space of the terminal box 601 of compressor 6 or lateral space (perhaps surrounding space) etc.) of the compressor 6 that in the past can not be provided with, therefore, the free degree (free degree of design) of the setting of control substrate box 70 improves, and obtains for example can effectively utilizing equipment such as the refrigerator in the space in the Machine Room 60 and air conditioner.

In addition, control substrate box 70 also can be installed on terminal box 601 by screw etc. across padded coaming 350 disassembled and assembled freely.Here, if elastomer that padded coaming is vibration-proof rubber etc. can absorb or alleviate vibration etc. has the antivibrating parts of anti-vibration functions, then the vibration that is produced by compressor 6 is difficult to be directly delivered to control substrate box 70 and control substrate 7, therefore, obtain the few compressor and the equipment of fault of low vibration and control substrate 7.In addition, if padded coaming 350 is the electrical apparatus insulation parts with electrical insulating property, then can suppress from control substrate box 70 to the electric leakage of compressor 6 or from the electric leakage of compressor 6, so can access high compressor of reliability and equipment to control substrate box 70.

As mentioned above, in embodiments of the present invention, be provided with flange part 605 around the peristome 602 of the upper surface of terminal box 601, this flange part 605 and the bottom surface sections of controlling substrate box 70 can be connected on disassembled and assembled freely ground by attaching parts such as bolts across padded coaming 350.Therefore, if padded coaming 350 has anti-vibration functions and is antivibrating parts, then the vibration of compressor 6 can not be directly delivered to control substrate 7, therefore can partly not wait the coupling part that be full of cracks etc. takes place, can access high compressor of reliability and equipment because of the solder that vibration causes controlling on the substrate 7.In addition, if padded coaming 350 is the electrical apparatus insulation parts with electrical insulating property, then can suppress from control substrate box 70 to the electric leakage of compressor 6 or from the electric leakage of compressor 6, so can access high compressor of reliability and equipment to control substrate box 70.Here, if padded coaming 350 has anti-vibration functions and these both sides of electric insulation functions, then the be full of cracks that causes because of vibration etc. can not take place in connecting portion etc., and, also can suppress electric leakage, so can access higher compressor of reliability and equipment.

Here, because frequency conversion drive parts 11 adopt wide bandgap semiconductor, so can realize semiconductor device 11 is miniaturization, lightweight, high heat-resistingization of frequency conversion drive parts, and can be used in radiator 12 miniaturization significantly of cooling frequency conversion drive circuit block, even can not need radiator 12, therefore the weight of control substrate 7 be can alleviate, assembleability well and cheaply compressor and equipment obtained.In addition, frequency conversion drive frequency when the starting of compressor 6 etc. and control substrate box 70, control substrate 7 resonate, under the situation that control substrate box 70, control substrate 7 etc. might damage, can be in the scope of weight that is no more than radiator in the past and size, adjustment is used to cool off weight and the size (can adjust size, shape and weight) that the frequency conversion drive parts are the radiator 12 of semiconductor device 11.

Promptly, in embodiments of the present invention, because for example the frequency conversion drive parts are that semiconductor device 11 adopts wide bandgap semiconductor, so can make cooling frequency conversion drive parts is that the radiator 12 of semiconductor device 11 diminishes or alleviates, therefore can be in the scope of the size of the radiator 12 when in the past Si semiconductor uses and weight required weight and size when wide bandgap semiconductor uses, select the weight and the size of radiator 12 with control substrate box 70 or control substrate 7 in low-frequency region (for example the scope) mode that does not resonate from the starting frequency (about 5Hz～15Hz) of compressor to the low frequency band of the following degree of 40Hz.Under this situation, when weight, size and the shape of radiator 12 can not be selected, also can with the weight and the big or small adjustment and the usefulness of miscellaneous part (for example, carry, carry miscellaneous part in control substrate box 70 etc.) at the miscellaneous part on the control substrate 7.

Here, if control substrate box 70 can be configured in the upper space of compressor 6 in Machine Room 60, then control substrate box 70 can be configured in the past the upper space of the compressor 6 that uses as heat-dissipating space, therefore need in Machine Room 60, not guarantee to control the space that is provided with of substrate box 70 in addition, can effectively utilize the space in the Machine Room 60.To control under substrate box 70 is configured in compressor 6 in Machine Room 60 the situation on top, also can be can remain on partition wall (the upper surface wall of Machine Room that forms Machine Room 60, back face wall, side walls and underside wall etc.) in the upper surface wall, mode on back face wall and the side walls is provided with control substrate box 70, be provided with terminal box 601(or power connector end 610 on the top of compressor 6) situation under, also can with control substrate box 70 can disassembled and assembled freely ground installation or be integrally formed in the upper surface open portion of the terminal box 601 of taking in used for electric power connection terminal 610 or lateral opening portion etc.

As mentioned above, in the present embodiment, the frequency conversion drive parts are that semiconductor device 11 adopts wide bandgap semiconductor, adjust the weight of control substrate 7, size and shape, perhaps carry the weight of the parts on control substrate 7, size and shape, perhaps control the weight of substrate box 70, size and shape, thereby the resonance in the low-frequency region when avoiding the starting of compressor 6, therefore, the vibration that can suppress to cause because of resonance increases, and, control substrate box 70, the connecting portion of control substrate 7 grades (is for example controlled the connecting portion of flange part 605 of the terminal box 601 of substrate box 70 and compressor 6, the connecting portion of control substrate 7 and control substrate box 70, lift-launch is at semiconductor device 11 or the solder connecting portion of control associated components and control substrate 7 etc. of control on the substrate 7) can not come off because of the abnormal vibrations that resonance causes or damage, obtain the high compressor of reliability 6, refrigerator with compressor 6, washing machine and refrigeration, equipment such as aircondition.

Here, at Fig. 2, among Fig. 3, show the example (bottom surface at control substrate box 70 is provided with the example that peristome is promptly controlled substrate box peristome 79) of the part opening relative of the bottom surface of control substrate box 70 with terminal box 601, but consider from the correspondence of electric insulations such as electric leakage correspondence and correspondence on fire etc., existing problems during the top opening of terminal box 601 (terminal box peristome 602), in this case, in the mode of the terminal box peristome 602 of the top that covers terminal box 601 the terminal case lid 701 that is formed by electrical insulating property material and flame-retardant materials can be set removably in addition gets final product.In addition, also can block the control substrate box peristome 79 on the bottom surface that is arranged on control substrate box 70, also peristome 79 can be set.

Under this situation, upper surface open portion at terminal box 601 is provided with the terminal case lid 701 that covers upper surface open portion, in addition, bottom at control substrate box 70 is not provided with peristome, therefore, the power supply lead wire that is connected with the terminal 610 of compressor 6 can not take out from the terminal box peristome 602 or the control substrate box peristome 79 of the top of terminal box 601, therefore, in the side of terminal box 601 or at least a portion of bottom surface terminal boxs lead-in wire peristomes such as opening or otch be set get final product.In addition, on control substrate box 70, at least a portion in bottom surface, side or the upper surface at not relative with terminal box peristome 602 position is provided with control substrate boxes lead-in wire peristomes such as opening or otch, the power supply lead wire that will be connected with terminal 610 from the side that is arranged on terminal box 601 or the terminal box lead-in wire peristome of below (also can be the top) take out, be connected to semiconductor device 11 that the control substrates 7 in the control substrate box 70 carry etc. from the control substrate box peristome of the side, below or the top that are arranged on control substrate box 70 and get final product.

Even connect the terminal 610 and the control substrate 7 of compressor 6 like this, also can make terminal 610 and being connected of control substrate 7 become extremely short apart from compared with the past.Therefore, in lead-in wire, can make that line footpath is big, the length of the power supply lead wire in the generation source that may become electromagnetic noise becomes extremely short, therefore can significantly reduce electromagnetic noise, and, can make the length of the power supply lead wire that the line footpath is thick, cost is high become extremely short, therefore can access the compressor and the equipment of low cost and low noise.In addition, obtain suppressing the equipment that causes because of noise misoperation, can also suppress the high compressor and the equipment of reliability of the fault that causes because of electric leakage etc.

In addition, control substrate box 70 can be not yet form or can fix disassembled and assembled freely with the terminal box 601 of compressor 6, also can be near the terminal box 601 of compressor 6 across the space can be fixed in Machine Room 60 inwalls etc. in disassembled and assembled freely ground.Here, also can be around compressor 6 (preferred top), the wall of 60 Machine Rooms such as upper surface wall, back face wall or side walls in the Machine Room, the front and back of the equipment bodies such as heat source machine main body of the off-premises station main body of refrigerator main body, aircondition or water heater or about, control substrate box 70 can be set slidably.If can be provided with slidably like this, then under the situation of the maintaining of control substrate 7 in controlling substrate box 70 or semiconductor device 11 etc., even 60 wall is pulled down control substrate box 70 from the Machine Room at every turn, if make control substrate box 70 carry out the replacing of maintaining, parts and repairing etc., then can access the good equipment of maintainability to the slide outside of Machine Room 60.

The compressor 6 of present embodiment has: housing (closed container) 6X is accommodated in inside with the compression mechanical part of compressed refrigerant and the motor of portion of drive compression mechanism rotation; Used for electric power connection terminal 610 is set on the housing 6X, is used for switching on to motor; Terminal box 601 is set on the housing 6X, and covers at least a portion on every side of used for electric power connection terminal 610; Control substrate 7, be equipped with the semiconductor device 11 of drive control motor; Control substrate box 70 is used to take in control substrate 7.Because semiconductor device 11 adopts wide bandgap semiconductors, can disassembled and assembled freely ground will control substrate box 70 and be installed on the terminal box 601, being connected of substrate become extremely short so can make terminal and control apart from compared with the past.Therefore, in lead-in wire, can make that line footpath is big, the length of the power supply lead wire in the generation source that may become electromagnetic noise becomes extremely short, so can significantly reduce electromagnetic noise.And, owing to can make the length of the power supply lead wire that the line footpath is thick, cost is high become extremely short, so can access the compressor and the equipment of low cost and low noise.In addition, obtain suppressing the equipment that causes because of noise misoperation, can also suppress the high compressor and the equipment of reliability of the fault that causes because of electric leakage etc.

Because the compressor 6 of present embodiment is being controlled between substrate box 70 and the terminal box 601 every establishing padded coaming 350, so, if elastomer that padded coaming is vibration-proof rubber etc. can absorb or alleviate vibration etc. has the antivibrating parts of anti-vibration functions, then the vibration that is produced by compressor 6 is difficult to be directly delivered to control substrate box 70 and control substrate 7, can access the few compressor and the equipment of fault of low vibration and control substrate 7.In addition, if padded coaming 350 is the electrical apparatus insulation parts with electrical insulating property, then can prevent from therefore can access high compressor of reliability and equipment from controlling substrate box 70 to the electric leakage of compressor 6 or from the electric leakage of compressor 6 to control substrate box 70.

(the second control substrate)

Here, be set at as illustrated in fig. 1 in the Machine Room 60 of taking in the compressor 6 that constitutes freeze cycle under the situation of lower backside of refrigerator 1, also can heat-barrier material (for example polyurethane heat-barrier material) as the top of Fig. 4, shown in Figure 5 and Machine Rooms 60 such as near being arranged on the short transverse central authorities that control substrate box 70 in the Machine Room 60 is arranged on the second control substrate box 70A refrigerator 1 upper rear portion or the back side together in.In near the heat-barrier material (for example polyurethane heat-barrier material) of the top of the Machine Room 60 that the second control substrate box 70A is set at the short transverse substantial middle position at refrigerator 1 upper rear portion or the back side etc.In addition, be set at as illustrated in fig. 6 in Machine Room 60 under the situation of upper rear portion of refrigerator 1, control substrate box 70A is set near the short transverse central authorities at the back side of refrigerator 1 lower backside or refrigerator 1 etc. in the heat-barrier material of below of Machine Room 60.

Fig. 4 is the summary sectional view of other refrigerators that the Machine Room of expression embodiments of the present invention 1 is set at the lower backside of refrigerator main body, and Fig. 5 is the rear isometric view of the configuration of the compressor of formation freeze cycle at the refrigerator back side of expression embodiments of the present invention 1 and radiating tube etc.In the drawings, the Reference numeral that identical with Fig. 1～Fig. 3 part mark is identical also omits explanation.

In the drawings, refrigerator 1 for example is provided with refrigerating chamber 2 at epimere, below refrigerating chamber 2, be provided with side by side to switch chamber 3 and ice-making compartment 35, switch chamber 3 and ice-making compartment 35 below refrigerating chamber 4 is set, (hypomere) is provided with vegetable compartment 5 below refrigerating chamber.Here, (for example refrigerating chamber 2 at each storeroom, switch chamber 3, ice-making compartment 35, refrigerating chamber 4, vegetable compartment 5) between, the different chamber of design temperature (storage temperature) (for example, the storerooms of the storeroom of temperature volume above freezing and zubzero temperature body etc.) being had heat-barrier material (is partition member, inclosure has polyurethane heat-barrier material or vacuum heat insulation material) partition member 8 separate (under the situation of the design temperature between each storeroom roughly the same (storeroom of temperature band above freezing each other or the storeroom of zubzero temperature band wait each other), not necessarily need heat-barrier material, therefore do not need to be provided with heat-barrier material).In addition, be provided with the Machine Room 60 of configuration compressor 6 grades in the lower rear of refrigerator 1.

In addition, between the interior case 101 at the back side of refrigerator main body 1 and outer container 102, be provided with back side heat-barrier material 80, in addition, dispose cooler 200 that is arranged in the cooler chamber and the compressor 6 that is arranged in the Machine Room 60 at the back side of refrigerator main body 1, in addition, between the interior case 101 and outer container 102 at the back side of refrigerator main body 1, dispose control substrate box 70, control substrate box 70A, in addition, also dispose radiating tube (condenser pipe) 9 etc., this control substrate box 70 is taken in the control substrate 7 of control compressor 6 or compressor cooling fan 68 or cold air Air Blast fan (not shown) etc., this control substrate box 70A takes in control substrate 7A, this radiating tube (condenser pipe) 9 and memory 61, expansion gear (for example capillary or electric expansion valve etc.) 62, compressor 6 connects and constitutes freeze cycle with cooler etc.Here, in the Machine Room 60 that is arranged at refrigerator 1 back side, dispose compressor 6, control substrate box 70, in addition, also be provided with compressor cooling fan 68, memory 61, expansion gear (for example capillary or electric expansion valve etc.) 62 and be connected with compressor 6 and constitute the radiating tube (condenser pipe) 9 of freeze cycle and accept drain pan 660 of drain water etc. with cooler etc.

Radiating tube 9 for example is connected to expansion gear 62 from compressor 6 by refrigerator side, the refrigerator back side, refrigerator upper surface (perhaps below the refrigerator), refrigerator side etc., and is connected to compressor 6 via evaporimeter 200, memory 61 etc.Compressor 6 is driven in the frequency conversion mode that can adjust motor rotary speed arbitrarily, is that the control substrate 7 of frequency conversion drive circuit block 11 grades is driven by being equipped with semiconductor device for example.Control substrate 7 for example is incorporated in Fig. 4 in the control substrate box 70, and control substrate box 70 is disposed in the set Machine Room of lower backside 60.Control substrate box 70 in Machine Room 60, be set at compressor 6 near, and be configured in the top of compressor 6 or side etc. with compressor 6 with separating the space.Here, as utilize Fig. 1～Fig. 3 explanation, also can directly or across padded coaming 350 ground will control the top that substrate box 70 is arranged on the terminal box 601 of compressor 6.

Control substrate box 70 is configured in the Machine Room 60 of Fig. 1, Fig. 4 and the lower backside that is arranged at refrigerator 1 shown in Figure 5, under the state in being set at Machine Room 60, when observing from the back side of refrigerator 1, front surface side (face side) or upper surface side or side surface side opening are controlled maintaining, the replacing of maintaining, semiconductor device 11 and the control associated components etc. of substrate 7.Peristome at control substrate box 70 suitably is provided with cover and promptly controls substrate case lid 701.Here, in Fig. 1, Fig. 4 and Fig. 5, radiating tube 9 is connected to expansion gear 62 from compressor 6 at least one position by refrigerator side, the refrigerator back side, refrigerator upper surface and refrigerator side etc., and expansion gear 62 is disposed in the Machine Room 60 or in the heat-barrier material 80 of the main body of refrigerator 1.

Here, the second control substrate 7A that for example is provided with control substrate 7 splits ground at the second control substrate 7A(for the actuator of controlling and control substrate 7 splits (for example be arranged on demonstration control on the door, be arranged on the energising control etc. of the heater of the rotation spacer body on the door); The part branch that perhaps will control substrate 7 in order to control and control the actuators that substrate 7 part repeats cede territory to be arranged on refrigerator 1 the back side second control substrate 7A; The second control substrate 7A that control substrate 7 perhaps is not set and is provided with separately etc.) be set under the situation in the second control substrate box 70A of substantial middle position of the top that is disposed at Machine Room 60 or short transverse, radiating tube 9 60 disposes to the refrigerator side from the Machine Room, so, the second control substrate box 70A that is arranged at the refrigerator back side can not become obstacle, dispose from the refrigerator back side to the refrigerator upper surface at radiating tube 9, perhaps from the refrigerator upper surface under the situation of refrigerator side configuration, radiating tube 9 disposes in the mode of the side of the second control substrate box 70A by taking in the second control substrate 7A.In addition, in at least on any one of end face, the back side, side and the bottom surface of refrigerator main body 1, for in the case that improves refrigerator 1 and outside heat-proof quality, be provided with vacuum heat insulation material 10 in a position or a plurality of position, between the back side 71 of the second control substrate box 70A and interior case 101, also dispose vacuum heat insulation material 10.

(Machine Room is configured in the upper rear portion of refrigerator main body)

Below, the situation that Machine Room 60 is set at the upper rear portion of refrigerator 1 describes.Fig. 6 is the rear isometric view that the Machine Room of expression embodiments of the present invention 1 is set at the configuration of the compressor of formation freeze cycle upper rear portion, the refrigerator back side of refrigerator main body and radiating tube etc.In the drawings, the situation that refrigerator 1 is provided with a plurality of storerooms such as refrigerating chamber 2, switching chamber 3, ice-making compartment 35, refrigerating chamber 4, vegetable compartment 5 is identical with Fig. 1, omits explanation.Here, between each storeroom (for example refrigerating chamber 2, switch chamber 3, ice-making compartment 35, refrigerating chamber 4, vegetable compartment 5), design temperature (storage temperature) is separated by heat-barrier material (partition member) 8 between the different chamber.In addition, above the back side of refrigerator 1, be provided with Machine Room 60, in Machine Room 60, take in compressor 6, control substrate box 70, compressor cooling fan 68, expansion gear and be the part, memory (perhaps absorbing silencer) 61 of a part, the radiating tube 9 of capillary 62 etc.

In addition, be provided with back side heat-barrier material 80 at the back side of refrigerator 1, in addition, be provided with the cooler chamber below the Machine Room 60 above being arranged at and in the short transverse substantial middle position at the back side of refrigerator 1 or the lower position at the back side, at the indoor cooler 200 that is provided with of cooler.Here, connecting compressor 6, memory 61, suction line 63, cooler 200, expansion gear in order is capillary 62, radiating tube 9, compressor 6 and constitute freeze cycle.Suction line 63 is for example from compressor 6(or memory 61) be connected in cooler 200 by the refrigerator back side, the expansion gear 62(that is connected with cooler 200 is capillary and expansion valve etc. for example) be set at the back side of refrigerator 1, and be connected in the radiating tube 9 of the upper surface of refrigerator 1 by the back side.Compressor 6 is driven in the frequency conversion mode that can at random adjust motor rotary speed, and is driven by control substrate 7.Control substrate 7 is incorporated in the control substrate box 70, in the set Machine Room 60 of the upper rear portion that this control substrate box 70 is disposed at refrigerator 1.Control substrate box 70 in Machine Room 60, be arranged on compressor 6 near, with compressor 6 across the space be configured in the top of compressor 6 or side etc., be provided with the maintaining that can control substrate 7 and the mode of replacing.Here, as utilize Fig. 2, Fig. 3 explanation like that, also can so that the mode that terminal box 601 and control substrate box 70 form as one will control substrate box 70 can be direct removably or the terminal box 601(that is installed on compressor 6 across padded coaming 350 ground will control the terminal box 601 that substrate box 70 is installed on compressor 6 in the mode of the maintaining that can control substrate 7 and replacing etc. and get final product).

Control substrate box 70 is when observing from the back side of refrigerator 1 under the state that is arranged at refrigerator 1, front surface side (face side) or upper surface side or side surface side opening are used to control the replacing and the maintaining of maintaining, semiconductor device 11 and the control associated components etc. of substrate 7.Peristome at control substrate box 70 suitably is provided with cover 701.Here, in Fig. 6, compressor 6(or the memory 61 of suction line 63 in the Machine Room 60 on the top that is disposed at refrigerator 1), be connected in the indoor cooler 200 of cooler that is configured in the refrigerator lower rear, in addition, expansion gear is that capillary 62 is from being configured in the cooler 200 of refrigerator 1 below, being connected to the radiating tube 9 that is disposed at the refrigerator end face.

Here, in the second control substrate 7A(and the situation that control substrate 7A is set with controlling substrate 7 splits; The part of the control associated components of control substrate 7 is ceded territory to be arranged on the situation at the back side of refrigerator 1 by branch as control substrate 7A; The situation of control substrate 7A etc. only is set individually) be set under the situation in the second control substrate box 70A on the back side of refrigerator 1 of the below that is disposed at Machine Room 60, capillary 62(or suction line 63) be configured in the heat-barrier material 80 at the side of control substrate box 70A or the back side, perhaps by disposing between heat-barrier material 80 and the control substrate box 70A.In addition, in end face, the back side, side and the bottom surface of refrigerator 1 at least on any one, for in the case that improves refrigerator 1 and outside heat-proof quality, in a position or a plurality of position vacuum heat insulation material 10 is set, between the back side 71 of controlling substrate box 70A and interior case 101, also disposes vacuum heat insulation material 10.

(wide bandgap semiconductor)

In Fig. 1 to Fig. 6, as carrying at the control substrate 7(or the second control substrate 7A) on semiconductor device 11(for example the frequency conversion drive circuit of the driving control usefulness of compressor 6, compressor cooling fan 68 and cold air Air Blast fan etc. with semiconductor etc.) use wide bandgap semiconductor.Carried at the control substrate 7(or the second control substrate 7A in the past) on the semiconductor device 11 of for example frequency conversion drive circuit block etc. generally to adopt with silicon (Si) be the semiconductor of matrix, but in the present invention, adopt wide bandgap semiconductor, for example use carborundum (SiC), gallium nitride (GaN), diamond, aluminium gallium nitride alloy (AlGaN) etc. as wide bandgap semiconductor.

With respect to the semi-conductive advantage of silicon (Si), enumerate following 2 points as wide bandgap semiconductor (for example carborundum SiC, gallium nitride (GaN) etc.).First advantage be the loss of element little, can hot operation.The caloric value of Si is many, in addition, and under about 100 ℃～200 ℃, semiconducting behavior reduces, and becoming is difficult to work, and therefore the fin (radiator 12) of heat transmission is set, also need dispel the heat, need be used to carry the space of taking in volume and being used to dispel the heat of fin by air.Relative with it, the switching loss of wide bandgap semiconductor (for example SiC) in element is little, energy-conservation, simultaneously, reaches the reduction that also is difficult for causing performance about 300 ℃, therefore can use in 60 environment such as high temperature such as grade of Machine Room.In addition, owing to reach the reduction that yet is difficult for causing performance about 300 ℃,, that is, do not need the fin 12 of heat transmission, perhaps can make the fin of heat transmission 12 quite little (make height and size diminishes, slimming, miniaturization) so have the following advantages.

Second advantage is that can to make the semiconductor component parts be the less thick of device.Because the insulation breakdown field intensity height of wide bandgap semiconductor (for example SiC, GaN), thus semi-conductive withstand voltage big (having the about 10 times withstand voltage of silicon (Si)), so, the thickness of semiconductor device 11 is reduced (attenuation) to about 1/10.In the present invention, the wide bandgap semiconductor that has such characteristic by use, can realize significantly miniaturization, the slimming of frequency conversion drive circuit block 11 and need not note the good structure etc. of heat dissipation environment, can access therefore that design freedom is big, small-sized, the good refrigerator of quality under the hot environment.

In Fig. 1 to Fig. 6, owing to carry at the control substrate 7(or the second control substrate 7A) on the semiconductor device 11 of frequency conversion drive circuit block etc. adopt wide bandgap semiconductors, so as mentioned above, insulation breakdown field intensity height, withstand voltage big, thus thickness and size can reduce (be silicon about 1/10).In addition, owing under 300 ℃ high temperature, also can work, so the radiating fin (radiator) 12 of the cooling usefulness of semiconductor device 11 also can be minimum.Therefore, in the past, carrying at the control substrate 7(or the second control substrate 7A) on state under, to compare the frequency conversion drive circuit block of highly high radiator 12 be semiconductor device 11 as being provided with control associated components with other etc., adopt wide bandgap semiconductor in the present invention, thereby height and size that radiator 12 and frequency conversion drive circuit block 11 are complementary are (vertical, horizontal width) minimum (slimming, miniaturization), therefore, carrying at the control substrate 7(or the second control substrate 7A) on state under, can be reduced to control associated components (reactor for example with other, capacitor, transformer, current detecting part etc.) height that height same degree or same degree are following.

(control substrate, control substrate box)

Fig. 7 is from the figure of top view as the control substrate 7 of for example refrigerator 1 of equipment.Fig. 8 is the figure that observes control substrate 7 from the side, and Fig. 8 (a) is the figure that observes the control substrate 7 of embodiments of the present invention from the side, and Fig. 8 (b) is the figure that observes control substrate 7 in the past from the side.In the drawings, for example be equipped with on the substrate 7 in control: semiconductor device 11, this semiconductor device 11 is frequency conversion drive circuit blocks, is made of wide bandgap semiconductor etc.; Radiating fin 12, this radiating fin 12 constitutes with heat conduction with semiconductor device 11 one, is the radiator that the heat that is sent by semiconductor device 11 is dispelled the heat; Power source voltage is for example converted to the transformer 13 of 12V etc. from 100V; Relay 14; Converter 15; Capacitor 16; Current detecting part is a current detection sensor 17 etc.

And, the control substrate 7(or the second control substrate 7A) under the state that has carried semiconductor device 11 and other control associated components (for example transformer 13, converter 15, capacitor 16 etc.), be incorporated in the control substrate box 70(or the second control substrate box 70A) in, and be fixed and held at control substrate box 70(or control substrate box 70A by the control substrate fixed mechanism 79 of bolt etc.) the back side (bottom surface) etc.At control substrate box 70(or control substrate box 70A) in, with the control substrate 7(or the second control substrate 7A) also taken in reactor etc., but reactor etc. also can not be accommodated in control substrate box 70(or control substrate box 70A) and configuration in addition.Radiator 12 is pressed by quilts such as bonding agent or bolts via heat radiation auxiliary part 110 grades of the good for example sheet of heat conductivity and is paid that to be fixed in semiconductor device 11 be frequency conversion drive circuit block 11.The heat radiation auxiliary part 110 that for example has the sheet of specific thickness has heat conductivity and gets final product, and the rubber-like parts are closely contact easily, and so therefore heat radiation easily is more preferably.Here, the heat radiation auxiliary part 110 of sheet must be set not necessarily, also can not be provided with, also can be directly pay and fixed heat sink 12 and semiconductor device 11 are the frequency conversion drive circuit block by bonding agent or bolt are isobaric.

Here, shown in Fig. 8 (a), the lift-launch of embodiments of the present invention is at the control substrate 7(or the second control substrate 7A) on the semiconductor device 11 of frequency conversion drive circuit block etc. and the height that radiator 12 is complementary be A, the height of the control associated components of other of embodiments of the present invention (for example transformer 13, converter 15, capacitor 16 etc.) is A4, the control substrate box 70(of embodiments of the present invention or control substrate box 70A) height be H, control substrate box 70(or control substrate box 70A) the short transverse upper opening.In addition, shown in Fig. 8 (b), lift-launch in the past is at the control substrate 7(or the second control substrate 7A) on the semiconductor device 11 of frequency conversion drive circuit block etc. and the height that radiator 12 is complementary be A2, the height of the control associated components of in the past other (for example transformer 13, converter 15, capacitor 16 etc.) is A3, control substrate box 70(in the past or control substrate box 70A) height be H2, the short transverse upper opening.

Here, in the past, shown in Fig. 8 (b), the control substrate 7(or the second control substrate 7A) the size restriction etc. that is controlled the size of substrate box decide the space be set, so, preferably reduce to control the substrate 7(or the second control substrate 7A as far as possible) size, need obtain area of dissipation by increasing radiator 12 along short transverse and reducing to be provided with area, the height A 2 that is complementary about radiator 12 and frequency conversion drive circuit block 11, increase the height of radiator 12 because of needs, and carrying at the control substrate 7(or the second control substrate 7A) on state under, compare with other the height A 3 of control associated components (for example capacitor 16 etc.), it is high highly to become, therefore, the control substrate box 70(or the second control substrate box 70A) height H 2 also need to increase.Therefore, for example, be arranged under the situation in the Machine Room 60, because the temperature in the Machine Room 60 becomes high temperature, so need further to increase the height and the size of radiator 12, therefore, need to increase the control substrate 7(or the second control substrate 7A) and the control substrate box 70(or the second control substrate box 70A) height and size, be difficult to take in and dispose in the limited space in Machine Room 60.In addition, in refrigerator, for example, studied pack into the situation at the back side of refrigerator 1 with the second control substrate 7A, in this case, the part that only disposes control substrate box 70A need thicken the thickness (thickness that control substrate box 70A and back side heat-barrier material 80 are complementary) of thermal wall at the back side (perhaps end face) of refrigerator 1, therefore, the thermal wall that the position is set of control substrate box 70A becomes side-prominent in case, makes case internal capacity (compartment interior volume) reduce corresponding amount.

But, the semiconductor device 11 that is provided with the frequency conversion drive circuit block etc. of radiator 12 adopts wide bandgap semiconductor in the present invention, thus, shown in Fig. 8 (a), the height A that radiator 12 and the semiconductor device 11 are complementary (A＜A2) that to become minimum (slimming), therefore, carrying under the state on the control substrate 7, can be reduced to and in the past other control associated components (reactor for example, capacitor 16, transformer 13, the height of height A 3 same degree current detecting part 17 etc.), so, the control substrate box 70(or the second control substrate box 70A) height H control substrate box 70A with in the past control substrate box 70(or second) height H 2 compare and can significantly reduce, can reduce to take in the space of required equipment.Therefore, control substrate 7,7A and control substrate box 70,70A can be accommodated in the Machine Room 60 of equipment such as aircondition, refrigerator, in addition, to control under the state at the back side that substrate 7A, control substrate box 70A be configured in refrigerator 1, also can make thickness (thickness that control substrate box 70 and the back side heat-barrier material 80 are complementary) attenuation of thermal wall at the back side of the refrigerator 1 of the part that disposes control substrate box 70, therefore, interior case 101 can be not side-prominent in case, can increase case internal capacity (for example volume in the storeroom 2).

Here, carrying at the control substrate 7(or the second control substrate 7A) on state under, the height A that is complementary at the semiconductor device 11 of radiator 12 and frequency conversion drive circuit block etc. can be than other control associated components (reactor for example in the past, capacitor 16, transformer 13, under the low situation of height A 3 current detecting part 17 etc.) (A＜A3), shown in Fig. 8 (a), make other control associated components (reactor for example of embodiments of the present invention on the contrary like that, capacitor 16, transformer 13, current detecting part 17 etc.) height A 4 is reduced to and makes the semiconductor device 11 of frequency conversion drive circuit block of embodiments of the present invention etc. and the height A same degree that radiator 12 is complementary (A4＜A3), thus, can further reduce the control substrate 7(or the second control substrate 7A) height, therefore, can the control substrate box 70(or the second control substrate box 70A) height H suppress lowlyer.

Here, in the present embodiment, the semiconductor of frequency conversion drive circuit block 11 (for example switch element, diode element etc.) is formed than the big wide bandgap semiconductor of silicon (Si) by band gap, as wide bandgap semiconductor, carborundum, carborundum class material, gallium nitride, gallium nitrate kind material or diamond etc. are for example arranged.

The switch element that forms by such wide bandgap semiconductor and the proof voltage height of diode element, allow current density also high, therefore can realize the miniaturization of switch element and diode element, by using these switch element and diode elements of being miniaturized, can realize having installed the miniaturization of the semiconductor module of these elements.

In addition, because hear resistance is also high,, therefore can realize the further miniaturization of semiconductor module so can realize the miniaturization of radiating fin 12 of radiator and the air coolingization of water-cooled portion.

In addition, because power consumption is low, thus can realize the high efficiency of switch element and diode element, and then can realize the high efficiency of semiconductor module.

Here, the device construction of having used the MOSFET of SiC is a longitudinal type, is favourable to high capacity, realizes big electric currentization, high withstand voltageization easily, therefore, is preferred for main equipments such as relatively large room air conditioner or cabinet air-conditioner.In addition, the device configuration that has used the GaN-FET of GaN is horizontal type, realizes low resistanceization, cost degradation easily, therefore is preferred at the refrigerator of low current zone use or more small-sized mini-plants such as room air conditioner.

In addition, preferred switch element and diode element both sides are formed by wide bandgap semiconductor, but also can be formed by wide bandgap semiconductor for the element of any one party, also can access the effect of present embodiment record.

In the present invention, by using wide bandgap semiconductor, can make semiconductor device 11 of frequency conversion drive circuit block etc. and height A that radiator 12 is complementary or only the height of radiator 12 become minimum, therefore shown in Fig. 8 (a), can also control substrate 7(or control substrate 7A) semiconductor element be that the height A that frequency conversion drive circuit block 11 and radiator 12 are complementary suppresses for a short time, therefore, can also control substrate box 70(or control substrate box 70A) height H suppress lowly.Therefore, under the situation in the heat-barrier material that the second control substrate box 70A is configured in the refrigerator 1 main body back side, because control substrate box 70A is suppressed to the outstanding situation in case inboard (storeroom inboard), so can increase case internal capacity (compartment interior volume), and can access equipment such as energy-conservation refrigerator 1.

In addition, owing to can reduce to control substrate box 70A(or 70A) height H, can make the interior case of the part that disposes the second control substrate box 70A not side-prominent in case, so, back side heat-barrier material 80 does not need to case inside bend or outstanding yet, even in the time of will being not suitable for the vacuum heat insulation material 10(of deformation processing such as bending machining and carrying out bending machining, the possibility that exists outsourcing material to break) is configured between the back side 71 and case interior (interior case 101) of the control substrate box 70A at the back side in the case, also can not bend flat vacuum heat insulation material 10 ground directly with the tabular setting.

Here, owing to will partly dispose control substrate box 70A in the thermal wall that constitutes by interior case 101 and outer container 102 of refrigerator 1 with specific thickness, even so adopt wide bandgap semiconductors and reduced under the situation of height (depth) H of control substrate box 70A at frequency conversion drive circuit block 11, under the short situation of the length (distance) of the back side 71 of controlling substrate box 70A and the script between the interior case 101, for guaranteeing necessary insulating thickness, also need to make the interior case 101 at the back side 71 of controlling substrate box 70A side-prominent in case slightly, even under these circumstances, also can be at the flat vacuum heat insulation material 10 of the back side of control substrate box 70A 71 configurations.In this case, existence must be disposed the possibility of vacuum heat insulation material 10 slightly bendingly, but because the overhang to the case inboard of case 101 is littler than in the past in can making, so can make the bending angle of vacuum heat insulation material 10 littler than in the past, therefore can access the heat-proof quality that do not reduce vacuum heat insulation material 10, deterioration, that quality the is not high equipment such as refrigerator of heat-proof quality.

Promptly, owing to can make vacuum heat insulation material 10 be arranged on the refrigerator back side as follows, promptly, when bending vacuum heat insulation material 10, the bending angle of vacuum heat insulation material 10 outsourcing material do not break or the scope of the little predetermined angular (the little bending angle of the following degree of for example about 30 degree) of injured degree in, even so bending vacuum heat insulation material 10, outsourcing material also can not break or be injured, therefore vacuum heat insulation material 10 losses of function or deterioration can be reduced and the possibility of performance reduction, so the reduction of heat-proof quality can be suppressed.

(making wide bandgap semiconductor contact and dispel the heat) with the control substrate box

In addition, as shown in Figure 9, carrying at control substrate 7(or 7A) on the semiconductor device 11 of frequency conversion drive circuit block etc. situation about constituting by wide bandgap semiconductor under, do not need radiating fin because hear resistance is high, perhaps radiating fin is minimum gets final product, so, control substrate box 70(or 70A) also can form by the good material of pyroconductivity (iron, aluminium, copper etc. and steel alloy thereof etc.), the semiconductor device 11 that makes frequency conversion drive circuit block etc. directly with control substrate box 70(or 70A) contact assisting of dispelling the heat.

Fig. 9 is the control substrate box 70(or the second control substrate box 70A that observes expression embodiments of the present invention 1 from the side) in the control substrate 7(or the second control substrate 7A) figure.Also can make the frequency conversion drive circuit block is semiconductor device 11 and the control substrate box 70(or the 70A that are made of thermally-conductive materials such as the metal with heat conductivity, resin, rubber) directly contact, will control substrate box 70(or 70A) use as the heat radiation of carrying out frequency changer circuit parts 11 or the auxiliary thermal component of heat radiation.If at control substrate 7(or 7A) and control substrate box 70(or 70A) between clip the semiconductor device 11 of frequency conversion drive circuit block etc., and utilize control such as bolt substrate fixed mechanism 79 pushings, fixing, then obtain the equipment driving control apparatus and the equipment of the good driving control that can carry out frequency converter and fan motor etc. of simple in structure, low cost and assembleability etc.

In the present invention, because the semiconductor device 11 of frequency conversion drive circuit block etc. adopts wide bandgap semiconductor, so with in the past use the situation of semiconductor device of silicon Si compare, heat resisting temperature height (about 300 ℃), so, even the control substrate box 70 that replaces the heat-barrier material 80 of radiating fin use and polyurethane etc. to be provided with contiguously, also can dispel the heat, in addition, even control substrate box 70(or 70A) be embedded in the structure in the heat-barrier material 80, the structure of heat radiation difficulty, the heat resisting temperature of semiconductor device 11 uprises, control substrate box 70(or 70A) in temperature can not rise to heat resisting temperature above semiconductor device 11 yet, therefore, frequency conversion drive circuit block 11 can not break down, and is no problem on the reliability yet.

As the semiconductor device 11 that makes frequency conversion drive circuit block etc. like this directly with control substrate box 70(or 70A) the inwall contacting structure, by replacing radiating fin to use control substrate box 70(or 70A), do not need radiating fin, in addition, can control substrate box 70(or 70A) height suppress lowly, therefore the thickness (thickness of heat-barrier material 80 etc.) in can reducing between case and the outer container is so can access cheaply equipment such as refrigerator.In addition, because the semiconductor device 11 of frequency conversion drive circuit block etc. is made of wide bandgap semiconductor, so can make semiconductor device 11 attenuation of frequency conversion drive circuit block etc., control substrate box 70(or 70A) thickness also can attenuation, therefore can increase the compartment interior volume (case internal capacity) of refrigerator 1.In addition, because the semiconductor device 11 of frequency conversion drive circuit block etc. is made of wide bandgap semiconductor, so can access energy-conservation equipment such as refrigerator.

In addition, because semiconductor device 11 adopts wide bandgap semiconductors, thus not needing can also realize the structure of radiating fin, therefore can simplified construction, and obtain cheaply equipment such as refrigerator.In addition, since the semiconductor device 11 that can make frequency conversion drive circuit block etc. directly with control substrate box 70(or 70A) the interior contact, so do not need as in the past at control substrate 7(or 7A) and control substrate box 70(or 70A) between predetermined gap is set, can reduce and will control substrate 7(or 7A) be accommodated in and control substrate box 70(or 70A) height under the interior situation.That is, owing to can further reduce control substrate box 70(or 70A) height, so can increase compartment interior volume (case internal capacity).In addition, in equipment such as air conditioner and washing machine, owing to can reduce to control substrate box 70(or 70A) the space is set, so it is more than needed accordingly that the space is had with the amount that reduces, thereby optional feature can be set in excess room, can carry out effective utilization in space.In addition, can make equipment reduce to measure accordingly with excess room.

(heat radiation auxiliary part)

Here, the semiconductor device 11 that makes frequency conversion drive circuit block etc. directly with control substrate box 70(or 70A) under the inwall contacting structure situation of difficult, can also can be other materials also across the good material of pyroconductivity (can be and control substrate box 70(or 70A) identical materials) heat radiation auxiliary part 110 contact with heat conduction.As heat radiation auxiliary part 110, for example preferably make, the heat that produces can be rejected heat in outside (for example controlling substrate box 70(or 70A) or the air but also can have by heating for frequency conversion drive parts 11 by the pyroconductivity good metal) the resin of pyroconductivity make or elastomeric element etc. is made.In addition, as the size of heat radiation auxiliary part 110, if for example adopt the size that size (width, length) with frequency conversion drive circuit block 11 is identical or above and can dispel the heat, then space efficiency is good.Therefore in addition,, then can make the thickness attenuation, can suppress to control substrate 7 and control substrate box 70(or 70A if for example be sheet as heat radiation auxiliary part 110) height.Adopt and make frequency conversion drive circuit block 11 like this across heat radiation auxiliary part 110 and control substrate box 70(or 70A) contacting structure, even will control substrate box 70(or 70A) as the alternative use of radiating fin, also can access and the equal effect of situation that heat radiation auxiliary part 110 is not set.If here, heat radiation auxiliary part 110 is the materials with electrical insulating property, does not then worry electric leakage, and safe equipment can be provided.

Especially, control substrate box 70A with respect to the short transverse of refrigerator 1 be set at back side substantial middle (for example be arranged under the situation of upper rear portion of refrigerator 1 at compressor 6, than the Machine Room 60 of taking in compressor 6 more by the bottom and than the storeroom (for example vegetable compartment 5) of hypomere more by top; Compressor 6 is set under the situation of lower backside of refrigerator 1, more more (storeroom of for example epimere is under the situation of refrigerating chamber 2 by the bottom by top and than the storeroom of the storeroom position of the epimere of refrigerator 1 or epimere than the Machine Room 60 of taking in compressor 6, than the refractory slab position of the epimere in the refrigerating chamber 2 more by the bottom)) situation under, the situation that is set at back side topmost or back side foot with control substrate box 70A is compared, at the high height and position that storeroom the disposed configuration control substrate box 70A of user's frequency of utilization, therefore can dispose the big storeroom of taking in volume of expectation as refrigerator, so, make the thickness attenuation of control substrate box 70A and meaning and effect that the case internal capacity is increased is big.

Here, at the semiconductor device 11 that will make frequency conversion drive circuit block etc. and control substrate box 70(or 70A) between can the situation of electric insulation under, auxiliary part 110 is as the material with heat conductivity and electrical insulating property if will dispel the heat, at control substrate box 70(or 70A) and the semiconductor device 11 of frequency conversion drive circuit block etc. between every establishing heat radiation auxiliary part 110, perhaps preparation has specific thickness, peucinous miscellaneous part with sheet of electrical insulating property is an electric insulation part, this electric insulation part is dispelled the heat auxiliary part 110 and controls substrate box 70(or 70A every being located at) between, then can make semiconductor device 11 and the control substrate box 70(or the 70A of frequency conversion drive circuit block etc.) electric insulation, also no problem on electrical insulating property and safety.

Here, at control substrate box 70(or 70A) and be provided with control substrate box 70(or 70A) equipment body (the off-premises station main body of the main body of refrigerator 1, air conditioner, the heat source machine main body of water heater etc.) between need under the situation of electric insulation, at control substrate box 70(or 70A) and equipment body (for example the framework of heat-barrier material 80, interior case 101, outer container 102, constitution equipment main body etc.) between, at control substrate box 70(or 70A) and control substrate box 70(or 70A) lid between etc. get final product every establishing electric insulation part.

Here, in the present embodiment, the semiconductor device 11 that for example constitutes the frequency conversion drive circuit block adopts wide bandgap semiconductor, make semiconductor portions 11 and the control substrate box 70(or the 70A of frequency conversion drive circuit block etc.) in directly contact, about such structure, example with refrigerator is illustrated, but also can be applicable to the off-premises station of the air conditioner beyond the refrigerator or the heat source machine of water heater etc. are carried out the control substrate 7(or the second control substrate 7A that the semiconductor device 11 of frequency conversion drive circuit block etc. of the equipment of VFC is taken in) or the control substrate box 70(or the second control substrate box 70A).

In addition, about Fig. 8, shown in Figure 9 have control substrate 7(or a 7A), control substrate box 70(or 70A), semiconductor device is the structure of the control device of structure of frequency conversion drive circuit block 11 etc. and control substrate box etc., not only can be applicable to refrigerator, other home appliance etc. of air conditioner, water heater, washing machine etc. can also be applicable to, equal effect can be accessed.Be applicable under the situation of heat source machine of the off-premises station of air conditioner or water heater, because control substrate box 70(or 70A) can attenuation, realize miniaturization so can reduce the height of off-premises station or heat source machine and width, in addition, can also reduce weight and cost.In addition, be applicable under the situation of washing machine, also can reduce the width, depth of body of the washing machine and height and realize miniaturization in addition, can also reducing weight and cost with sink.

As mentioned above, in the compressor 6 of present embodiment, control substrate box 70 is made of thermal conductive member, make semiconductor element and fix with controlling the substrate box thermally coupled, the heating of semiconductor element is dispelled the heat by the control substrate box, therefore do not need radiating fin, obtain compressor, equipment cheaply.In addition, because can control substrate box 70(or 70A) height suppress lowly, so for example equipment is under the situation of refrigerator, can subtract the thickness (thickness of heat-barrier material 80 etc.) between small internal box and the outer container, so can access equipment such as refrigerator cheaply.In addition, because the semiconductor device 11 of frequency conversion drive circuit block etc. is made of wide bandgap semiconductor, so can make semiconductor device 11 attenuation of frequency conversion drive circuit block etc., can also make control substrate box 70(or 70A) the thickness attenuation, so can increase the compartment interior volume (case internal capacity) of refrigerator 1.In addition, because the semiconductor device 11 of frequency conversion drive circuit block etc. is made of wide bandgap semiconductor, so can access energy-conservation equipment such as refrigerator.

In the compressor 6 of present embodiment, because semiconductor device 11 is connected in control substrate box 70 across heat radiation auxiliary part 110 that can electric insulation, thus simple in structure, simultaneously, do not need radiating fin, can access compressor, equipment cheaply.In addition, because can control substrate box 70(or 70A) height suppress lowlyer, so the height of equipment can be suppressed lower.For example equipment is under the situation of refrigerator, owing to can subtract thickness (thickness of heat-barrier material 80 etc.) between small internal box and the outer container, so can access cheaply equipment such as refrigerator.

In the compressor 6 of present embodiment, because semiconductor device 11 is SiC(carborundum), the GaN(gallium nitride), so can realize miniaturization, lightweight, high heat-resistingization of semiconductor device 11.In addition, owing to can be used in radiator 12 miniaturization or radiator 12 is not set significantly of cooling semiconductor device 11,, obtain assembleability well and cheaply compressor and equipment so can also alleviate the weight of control substrate 7.

In addition, the control substrate 7 that drives control compressor 6 adopts wide bandgap semiconductor, thus, frequency conversion drive frequency and control substrate box 70 that can be when suppressing the starting of compressor 6 etc., resonance takes place and makes control substrate box 70 in control substrate 7, the mode of the situation that control substrate 7 grades are damaged, the weight and the size that with cooling frequency conversion drive parts are the radiator 12 of semiconductor device 11 are adjusted in the scope of weight that is no more than radiator in the past and size, therefore, frequency conversion drive frequency and control substrate box 70 in the time of can suppressing the starting of compressor 6 etc., resonance takes place and makes control substrate box 70 in control substrate 7, the situation that control substrate 7 grades are damaged.That is, by adjusting size, shape and the weight of radiator 12, frequency conversion drive frequency and control substrate box 70, control substrate 7 in the time of can suppressing the starting of compressor 6 etc. resonate, so the reliability raising.

(equipment connection structure of control substrate)

Here, about will control

substrate

7,7A describes to the method for attachment of power supply.Figure 10 is the connection layout of distribution etc. of control substrate of the equipment of expression embodiments of the present invention 1.In the drawings, the Reference numeral that identical with Fig. 1～Fig. 9 part mark is identical also omits explanation.

In the drawings, the control substrate 7(or the second control substrate 7A) be connected to source power supply 400 and be supplied to electric power via electric power connection line 760.Source power supply 400 is connected in via electric power connection line 760 and is arranged on the control substrate 7(or the second control substrate 7A) on terminal board 410, be connected in AC/DC converter 730 via first connecting line 761 again.It is semiconductor device 740 that AC/DC converter 730 is connected in the frequency conversion drive circuit block via second connecting line 762.Here, in the present invention, semiconductor device 740 adopts wide bandgap semiconductor (for example SiC semiconductor, GaN semiconductor etc.).

From the frequency conversion drive circuit block is semiconductor device 740, is connected to compressor 6 via the compressor of 3 phases (U phase, V phase, W phase) with connecting line 766, and the semiconductor device 740 by being made of switch element etc. carries out the variable control of rotating speed to compressor 6.Here, carry out the control (for example the temperature control in the storeroom, the open and close controlling of air door device, the energising control of electrostatic atomization apparatus etc.) beyond the control that the control assembly (for example the frequency conversion drive circuit block is a semiconductor device 11 etc.) of the VFC (the variable control of rotating speed) of compressor 6 carried out, by second control assembly is that semiconductor device 740 is implemented, this semiconductor device 740 be connected with connecting line 768 from AC/DC converter 730 branches or from the control of the branch midway of second connecting line 762.And, at least one functional part 770 that control assembly 750 is connected to the exercises of carrying out equipment or carries out various demonstrations with connecting line 769 via second control.

Here, if equipment is refrigerator, then functional part 770 for example is: the expansion gear 62 that constitutes freeze cycle; In storeroom, carry the cold air Air Blast fan of cold air; The throttle setting of adjusting for the air conditioning quantity of in storeroom, carrying; Sprayer unit to the storeroom internal spraying; Be arranged on that the temperature of carrying out a plurality of storerooms on the shutter door (for example be arranged on the front surface of refrigerating chamber 2 refrigerating-chamber door etc.) of the main body front surface of refrigerator 1 shows, temperature setting, electricity bill or the CO of storeroom ₂The various demonstrations of discharge rate etc. and the display unit of setting; And, to lighting device of shining in the storeroom etc.

In addition, if equipment is air conditioner, then functional part 770 is: the expansion gear that constitutes freeze cycle; Sprayer unit to set indoor spraying; The wind direction control panel of change wind direction; Be arranged on front surface decorative panel etc., be used for display setting temperature, Current Temperatures, air quantity, electricity bill, CO visibly ₂The display unit of discharge rate etc. etc.

In addition, if equipment is the washing machine of heat-pump-type, then functional part 770 is: the expansion gear that constitutes freeze cycle; The sprayer unit of external spraying in sink; The wind direction control panel of change wind direction; Be arranged on front surface decorative panel etc., be used for display setting temperature, Current Temperatures, air quantity, electricity bill, CO visibly ₂The display unit of discharge rate etc.; And the control rinse water is the pump of the supply of water in sink or open and close valve etc.About other equipment, with the said equipment similarly movable show or the functional part set too.

Here, first connecting line 761, second connecting line 762 is formed on control substrate 7(or 7A by the pattern of aluminium etc. usually) on, waiting under the situation about connecting with lead-in wire without pattern, electric power connection line 760, first connecting line 761, second connecting line 762, compressor because of current value adopts the thick connecting line of diameter (lead-in wire) greatly, is used to carry out compressor 6 other the control line 768 of control of functional part 770 in addition with connecting line 766,769 adopt diameter than electric power connection line 760 because of current value is little, first connecting line 761, second connecting line 762, compressor little connecting lines such as connecting line 766.

Here, at equipment is under the situation of refrigerator, because of current value adopts the thick connecting line of the about 2.5mm of diameter greatly, the control line 768,769 etc. of control control in addition that is used to carry out compressor 6 is because of comparing the little thin connecting line that adopts the about 1.5mm of diameter of current value with compressor with connecting line 766 etc. with connecting line 766 for electric power connection line 760, first connecting line 761, second connecting line 762, compressor.

(disposing two control substrates)

In Figure 10, the control assembly that shows the control assembly that carries out VFC etc. and be semiconductor device 740 and the control of carrying out functional part is that semiconductor device 750 carries at the identical control substrate 7(or the second control substrate 7A) on example, but as Fig. 4～shown in Figure 6, also the semiconductor device 740 that drives control compressor 6 can be carried on control substrate 7, carry at the second control substrate 7A control assembly 750 of the functional part 770 beyond the control compressor 6 first-class, the control substrate is divided into two is configured in different positions respectively, and carry out the action control of actuator and parts by each control substrate respectively.(also can utilize and respectively control substrate and carry out identical control.) here, if semiconductor device shown in Figure 10 740 is identical at the semiconductor device of controlling on the substrate 7 11 with the lift-launch among Fig. 4～Fig. 6, semiconductor device 750 shown in Figure 10 is identical at the semiconductor device of controlling on the substrate 7A 11 with the lift-launch among Fig. 4～Fig. 6, then can access identical effect.

But control assembly is that semiconductor device 740,750 can be identical with the semiconductor device 11 shown in Fig. 3～Fig. 9 etc., also can be different.In addition, semiconductor device 740,750 also can not necessarily must contain semiconductor, but contains under the semi-conductive situation, semi-conductive at least one adopt wide bandgap semiconductor for well.Especially since switch element etc. need can high speed operation, also needing can hot operation, so adopt wide bandgap semiconductor for well.

Here, at equipment is under the situation of refrigerator, and the control assembly 750 of lift-launch on the second control substrate 7A for example constitutes the aperture control of the expansion gear 62 of freeze cycle, in storeroom, carry the switch control and the rotating speed control of the cold air Air Blast fan of cold air, the open and close controlling of the throttle setting of the air conditioning quantity that adjustment is carried in storeroom, switch control to the storeroom intraoral illumination that shines in the storeroom, with on the shutter door of the main body front surface that is arranged on refrigerator 1 (for example being arranged on refrigerating-chamber door on the front surface of refrigerating chamber 2 etc.), the temperature of carrying out a plurality of storerooms shows, the control of demonstration control of the display unit of various demonstrations such as the temperature setting of storeroom and setting etc.

In addition, if equipment is air conditioner, then carry the control assembly 750 on the second control substrate 7A constitute the expansion gear of freeze cycle aperture control, to the wind direction control of the wind direction control panel of the energising control of the sprayer unit of set indoor spraying, change wind direction and be arranged on the front surface decorative panel etc., be used for display setting temperature, Current Temperatures, air quantity, electricity bill, CO visibly ₂The control of the demonstration control of the display unit of discharge rate etc. etc.

In addition, if equipment is the washing machine of heat-pump-type, then carry the control assembly 750 on the second control substrate 7A constitute the expansion gear of freeze cycle aperture control, to the wind direction control of the wind direction control panel of the energising control of the sprayer unit of sink internal spraying, change wind direction, be arranged on the front surface decorative panel etc., display setting temperature, Current Temperatures, air quantity, electricity bill, CO visibly ₂Control such as the demonstration of the display unit of discharge rate etc. and control rinse water are the control of the flow-control of the pump of the supply of water in sink or open and close valve etc. etc.About other equipment, also carry out work similarly movable with the said equipment, the functional part that can show or set and control.

Like this first control substrate 7 is configured near the compressor 6 in the Machine Room 60, with the second control substrate 7A be configured in Machine Room 60 in different positions (for example, if refrigerator, then 60 be set at the situation of lower backside (for example with reference to Fig. 4 in the Machine Room, Fig. 5), different positions is meant the substantial middle position at the upper rear portion or the back side etc., be set in Machine Room 60 under the situation (for example with reference to Fig. 6) of upper rear portion, different positions is meant the substantial middle position at the lower backside or the back side etc.), thus, at least the control substrate 7 that carries out the driving control of compressor 6 be set at compressor 6 near, so can make compressor become extremely short with the length of connecting line 766.

In addition, even if at equipment is to have under the situation of air conditioner of indoor set and off-premises station, the control substrate 7 of configuration driven control compressor 6 at least in taking in the Machine Room of compressor, the control substrate 7A that will carry out the control of the functional part beyond the compressor 6 are configured in outside the Machine Room of off-premises station or indoor set gets final product.About the equipment beyond refrigerator or the air conditioner, with above-mentioned refrigerator or air conditioner similarly near compressor 6 configuration control substrate 7 get final product.

As mentioned above, in the equipment of present embodiment, if will take in the control substrate box 70 that compressor 6 is carried out the control substrate 7 of Frequency Drive Control be configured in compressor 6 near, compressor thick and that cost raises is shortened with connecting line 766, therefore, obtain compressor, equipment cheaply.In addition, by will take in the control substrate box 70 that compressor 6 is carried out the control substrate 7 of VFC be configured in compressor 6 near, thick and the big compressor of electromagnetic noise in line footpath is shortened with connecting line 766, so obtain to reduce significantly the equipment of the low noise of electromagnetic noise.In addition, if being configured in the control assembly of being taken in the control substrate box 70 in the Machine Room 60 is semiconductor device 7,740 adopt can hot operation wide bandgap semiconductor, even then will control substrate box 70 is configured in the Machine Room 60 that becomes hot environment or neighbouring (for example top of compressor 6 or the sidepiece) of compressor 6, do not need as in the past with around the Coverage Control substrate boxes 70 such as heat-barrier material yet, therefore can make control substrate box 70 reduce to measure accordingly with the thickness of heat-barrier material, therefore, the free degree that is provided with of control substrate box 70 improves, and, do not need heat-barrier material, therefore can access and control substrate box cheaply, equipment.

Here, from source power supply 400 supply capability in the first control substrate box 70, but for the second control substrate box 70A, can be from AC/DC converter 730 branches in the first control substrate box 70 and via connecting line 768 supply capabilities, perhaps, also can directly control supply capability in the substrate box 70A from source power supply 400 to second from connecting line 762 branches and via connecting line 768 supply capabilities.Perhaps, can be not do not connect by the electric wave of radio communication etc. yet and supply with via connecting line 768.Under the situation by the radio communication connection, on control substrate 7, the second control substrate 7A, control device is set respectively, these control device (second control device of the first control device of control substrate 7, the second control substrate 7A) each or one of them have power informations such as an antenna transmitting-receiving mechanism of the transmitting-receiving that can carry out electric power and information.

Send information via the power information transmitting-receiving mechanism of control substrate 7 to second power information transmitting-receiving mechanism of the second control substrate 7A from the control signal of the first control device that is arranged on the microcomputer of control on the substrate 7 etc., thus, be sent to the second control device of the microcomputer etc. of the second control substrate 7A from the control signal of the first control device that is arranged on the microcomputer of control on the substrate 7 etc.At this moment, electric power also can send.

In second control device, based on control signal from first control device, carry out control (for example control of the temperature in the storeroom of functional part, perhaps be arranged on the demonstration control of the display unit on the storeroom front surface, the perhaps energising of sprayer unit control, perhaps the action control of various actuators etc.).Here, in the present embodiment, the signal of transmission is that the electric wave of wireless signal etc. gets final product, but as long as signal can be sent to, also can adopt the electromagnetic wave of infrared signal etc.In addition, in the present embodiment, be illustrated by the example of working for second control device from the control signal of first control device, but also can be with from the information of external equipments such as mobile phone or remote controller or control signal sends to first control device by electric waves such as wireless signal or infrared signal, electromagnetic wave or second control device is controlled.

(the control substrate box is configured in the bottom of drain pan)

Here, drain pan 660 is arranged on the below of cooler 200, also the control substrate box 70 of taking in control substrate 7 can be arranged on the rear side of reception by the bottom surface of the drain pan 660 of the water (defrost water, drain water etc.) of cooler 200 generations.Figure 11 is the figure of structure of the situation in control substrate box 70 that expression will be taken in control substrate 7 outside (rear side) that is arranged on the bottom surface of drain pan, Figure 11 (a) is the top perspective view of observing drain pan from oblique upper, Figure 11 (b) is the below stereogram from oblique beneath drain pan, and Figure 11 (c) is arranged on stereogram under the situation at the drain pan back side with the portion of dewatering.Here, in being container-like drain pan 660, with hydropexic inner surface of container as the inboard, with the outer surface of container as the outside (rear side).

In Figure 11 (a), Figure 11 (b), the control substrate box 70 of taking in control substrate 7 is arranged on the bottom surface or the side in the outside of the drain pan 660 of the water that acceptance produces by the cooler that constitutes freeze cycle (evaporimeter) 200 (for example drain water etc.), and described drain pan 660 is arranged in the set Machine Room 60 of the main body lower backside of refrigerator 1 or main body upper rear portion.Drain pan 660 is the container-like of top opening, is the shape that inside can occluded water (defrost water, drain water).For easily carrying repairing, maintaining, replacing at the control assembly of semiconductor device 11 grades of control on the substrate 7 and control substrate 7 self, with control substrate box 70 or control substrate 7 can slide and disassembled and assembled freely be arranged on the outside bottom surface or the outer lateral side of drain pan 660.

Here, control substrate 7 is provided with the semiconductor device 11 of switch element, diode element etc., and the semiconductor device 11 of at least a portion of frequency conversion drive circuit etc. adopts wide bandgap semiconductor.In addition, control also can only carry on the substrate 7 semiconductor device 11(only wide bandgap semiconductor also can), for example as Fig. 2, shown in Figure 3, also control associated components (for example at least one in transformer 13, relay 14, converter 15, reactor, capacitor 16, the current detecting part 17 etc.) etc. can be carried with semiconductor element.

Side, the bottom surface of control substrate box 70 is provided with control substrate box peristome (being arranged on the control substrate box peristome on the bottom surface of controlling substrate box 70) 79, takes out power supply lead wires and is connected to the frequency conversion drive circuit block of lift-launch on control substrate 7 from this control substrate box peristome 79.The frequency conversion drive circuit block is connected to AC power supplies (for example source power supply) via the AC/DC converter that is made of capacitor etc.Semiconductor element is that frequency conversion drive circuit block 11 is made of switch element or diode element etc., and employing wide bandgap semiconductor, compared with use the semi-conductive situation of Si in the past, and can realize high speed, miniaturization, low level, high heat-resistingization of processing speed.

In the present embodiment, wide bandgap semiconductor is that semiconductor device 11 is set at bottom surface or the side of controlling in the substrate box 70 and being arranged on drain pan 660, therefore the heat that is sent by wide bandgap semiconductor can be used to effectively make the water evaporation that is trapped in the drain pan 660.Under this situation, because the heat resisting temperature height of wide bandgap semiconductor, even so in Machine Room 60, compressor 6 above and can not break down under the hot environment of side yet, in addition, even can not break down under the hot environment in the control substrate box 70 of airtight construction roughly yet.If semiconductor device 11 adopts wide bandgap semiconductors, then also can utilize at least a portion of the heat-barrier material Coverage Control substrate box 70 of vacuum heat insulation material etc.At least a portion of heat-barrier material Coverage Control substrate box 70 by utilizing vacuum heat insulation material etc. can be with the temperature in the high state retentive control substrate box 70, therefore can carry out evaporation of water in the drain pan 660 with the short time.Even in this case, by using wide bandgap semiconductor as semiconductor device 11, the heat resisting temperature height of semiconductor device 11 (about 300 ℃), therefore, even utilize the heat-barrier material Coverage Control substrate box 70 of vacuum heat insulation material etc. and the temperature in the control substrate box 70 to rise, because semiconductor device 11 adopted the high wide bandgap semiconductor of heat resisting temperature, thus semiconductor device 11 also can work, no problem.In addition, make structure that wide bandgap semiconductor parts and the bottom surface or the side of drain pan 660 directly contact or the structure that contacts across miscellaneous parts such as heat radiation auxiliary part 110 shown in Figure 9 if adopt, then can make the heat of wide bandgap semiconductor be directly delivered to drain pan 660, therefore can efficient evaporate the water well.

Here, shown in Figure 11 (c), also can be on drain pan 660, even outside drain pan 660, overflow with the water in the drain pan 660, water yet can not enter or invade the mode of control substrate 7 or control substrate box 70, in the outside of drain pan 660 bottom surfaces or side (rear side) at least a portion setting on every side from drain pan 660 downwards or stretch out side, the outside or the outstanding portion that dewaters 670.

In Figure 11 (c), around the rear side of the bottom surface (perhaps side) of

drain pan

660,4 portions 670 that dewater are set, by first portion of dewatering is that dewater portion 671, second portion of dewatering of the right side is that the left side portion 674 that dewaters promptly of portion 673, the 4th portion of dewatering that dewaters promptly of portion 672, the 3rd portion of dewatering that dewaters constitutes, and from the back side of drain pan 660 downwards (perhaps side, the outside) outstanding.Here, in the portion of dewatering 670, the right side dewater portion 671, a left side dewater portion 672, the preceding portion 673 that dewaters, after the portion 674 that dewaters can link to each other continuously, perhaps also can be shown in Figure 11 (c) (for example dewater portion 671 and dewater between the portion 673 etc.) is provided with the gap in the coupling part separately of 4 portions 671,672,673,674 that dewater.In addition, the portion 670 that dewaters also can not be provided with 4, if be provided with one at least in the part of necessity, also can obtain above-mentioned effect.

Control substrate 7, control substrate box 70 are set at the bottom surface of drain pan 660, the rear side of side, be arranged on the central side direction of drain pan 660 (under the situation that the portion 670 that dewaters is set up relatively with respect to the portion of dewatering 670, be relative dewatering between the portion), therefore, even the water in the drain pan 660 overflows outside drain pan 660, because the water that overflows flows and falls downwards from the portion of dewatering 670 in the portion of dewatering 670, so water can not enter or invade control substrate 7 or control substrate box 70, can access the high equipment of reliability.This portion 670 that dewaters also can form with drain pan 660 or be shaped integratedly, also can constitute also and can install removably in split ground.

Here, be arranged on the portion that dewaters 670 on drain pan 660 back sides, the side and also can be used for location with the equipment body of refrigerator etc.Portion 670 is formed with to the outstanding protuberance in the below or side of drain pan 660 owing to dewater, so can utilize this protuberance to carry out location to equipment body (for example, refrigerator main body, off-premises station main body, indoor set main body, heat source machine main body, body of the washing machine etc.).Like this, the portion that dewaters 670 of present embodiment can suppress the immersion of water in control substrate 7 or control substrate box 70, and, can also carry out and equipment body between the location, the location that therefore can access reliability height and drain pan is easy to equipment such as refrigerator.

In addition, wanting under the situation that drain pan 660 can be installed slidingly back and forth with respect to equipment body, utilization gets final product as track with the portion that dewaters that is arranged on side, drain pan 660 back side in the portion of dewatering 670 671,672.By the portion 671,672 that will dewater as the track utilization, can with can before and after slide and mode that can dismounting is installed drain pan 660, the maintaining of the cleaning of drain pan 660, the control substrate 7 that is arranged on drain pan 660 back sides and semiconductor device 11 also becomes easy.

(drain pan is configured in the top of compressor)

Here, also the drain pan 660 of the frost accepting to be generated by cooler or water (for example defrost water, drain water etc.) can be arranged on the top of upper casing 6A, this upper casing 6A forms closed container (overcoat) 6X of compressor 6 above compressor 6.Figure 12 is the figure of structure of the situation on the expression top that drain pan is configured in compressor 6, Figure 12 (a) is the figure that the control substrate box is arranged on the situation at the drain pan back side, and Figure 12 (b) is detained the figure that portion's (water is concentrated portion) is arranged at the situation of drain pan with drain water.

In Figure 12 (a), compressor 6 constitutes closed container (overcoat) 6X by shell divided into two parts (upper casing 6A and lower casing 6B) or tripartite shell (upper casing 6A, middle case (not shown) and lower casing 6B).In present embodiment (for example Fig. 1～Fig. 3 etc.), top at the closed container 6X of compressor 6 is provided with terminal box 601, under the situation on the top of the closed container 6X that drain pan 660 is arranged on compressor 6, become at terminal box 601 under the situation of obstacle, for example shown in Figure 12 (a), the side (for example, the side of the side of upper casing 6A, lower casing 6B, the side of middle case etc.) that terminal box 601 is arranged on the closed container 6X that forms compressor 6 gets final product.

Here, drain pan 660 directly or be arranged on the closed container 6X(upper casing 6A of compressor 6 across miscellaneous parts such as heat-conduction components) top.The part of the bottom of drain pan 660 (for example is positioned at the position 660Y on the top of compressor 6, spherical shape) forms and the shape on the top of the closed container 6X of compressor 6 (the top 6Y of upper casing 6A for example, spherical shape) roughly the same shape, like this, under the situation on the top that is installed in compressor 6, the bottom 660Y of drain pan 660 is along the top 6Y of compressor 6, and is therefore fixing easily.By drain pan 660 being arranged on the top of compressor 6, the heat of the high temperature that produced by compressor 6 can being used to make the drain waters evaporation that is trapped in the drain pan 660, thereby can efficient making the drain water evaporation well.

Here, in Figure 12, be provided with control substrate box 70 in the bottom of drain pan 660 (for example part of the bottom surface in the outside of drain pan), control substrate 7 is inserted in the control substrate box 70.Control substrate 7 is provided with the semiconductor device 11 of switch element, diode element etc., and the semiconductor device 11 of at least a portion of frequency conversion drive circuit etc. adopts wide bandgap semiconductors such as SiC, GaN.In addition, on control substrate 7, also can only carry semiconductor device 11(and can only use wide bandgap semiconductor, also can and use wide bandgap semiconductor and other semiconductor device), for example as Fig. 2, shown in Figure 3, also control associated components (for example at least one in transformer 13, relay 14, converter 15, reactor, capacitor 16, the current detecting part 17 etc.) etc. can be carried with semiconductor element.

Here, power supply lead wire (not shown) is connected on the terminal 610 that is arranged at compressor 6, applies voltage via the motor of this power supply lead wire in the closed container 6X that is arranged on compressor 6.An end of this power supply lead wire is connected on the terminal 610, side, the control substrate box peristome on the bottom surface (being arranged on the control substrate box peristome on the bottom surface of controlling substrate box 70) 79 that is arranged on control substrate box 70 passed in another end of power supply lead wire, is connected to lift-launch on the frequency conversion drive circuit block on the control substrate 7 of the inside that is accommodated in control substrate box 70.The frequency conversion drive circuit block is connected on the AC power supplies (for example source power supply) via the AC/DC converter that is made of capacitor etc.Semiconductor device 11 is that the frequency conversion drive circuit block is made of switch element, diode element etc., and employing wide bandgap semiconductor, therefore, compare with using the semi-conductive situation of Si in the past, can realize processing speed high speed, miniaturization, highly lowly simplify, heat-resistingization.

Even under the situation on the top that drain pan 660 is configured in compressor 6, because wide bandgap semiconductor is semiconductor device 11 is arranged on drain pan 660 in control substrate box 70 bottom surface or side, therefore also the heat that is sent by wide bandgap semiconductor effectively can be used in and makes the water evaporation that is trapped in the drain pan 660.In addition, because the heat resisting temperature height of wide bandgap semiconductor, even so in Machine Room 60, compressor 6 above or can not break down under the hot environment of side yet, in addition, even can not break down under the hot environment in the control substrate box 70 of airtight construction roughly yet.If semiconductor device 11 adopts wide bandgap semiconductors, then also can utilize at least a portion of the heat-barrier material Coverage Control substrate box 70 of vacuum heat insulation material etc.At least a portion of heat-barrier material Coverage Control substrate box 70 by utilizing vacuum heat insulation material etc. can be with the temperature in the high state retentive control substrate box 70, therefore can carry out evaporation of water in the drain pan 660 with the short time.In this case, semiconductor device 11 also adopts wide bandgap semiconductor, thus, the heat resisting temperature height of semiconductor device 11 (about 300 ℃), even so utilize the heat-barrier material Coverage Control substrate box 70 of vacuum heat insulation material etc. and the temperature in the control substrate box 70 to rise, because semiconductor device 11 has adopted the high wide bandgap semiconductor of heat resisting temperature, semiconductor device 11 also can be worked, and is no problem.In addition, make structure that wide bandgap semiconductor element and the bottom surface or the side of drain pan 660 directly contact or the structure that contacts across miscellaneous parts such as heat radiation auxiliary part 110 shown in Figure 9 if adopt, then can make the heat of wide bandgap semiconductor be directly delivered to drain pan 660, therefore can the water (for example defrost water, drain water) in the drain pan 660 be evaporated efficient.

In addition, if will control substrate box 70 or control bottom surface or the side that substrate 7 can be slidingly arranged in drain pan 660, then the maintaining of semiconductor device 11 or control substrate 7 becomes easy.Under this situation, even the connecting lines such as lead-in wire that are connected with control substrate 7 are configured to control

substrate box

70 or 7 slips of control substrate do not have the length of obstacle yet and have surplus to get final product.

As mentioned above, equipment such as the refrigerator of present embodiment, washing machine or refrigeration, aircondition have: connect compressor 6, condenser (perhaps condenser pipe or radiating tube etc.) 9, expansion gear 62, evaporimeter (cooler) 200 successively and the freeze cycle that constitutes; Drain pan 660, it is configured in the main body (for example the main body of Machine Room 60, indoor set, off-premises station, heat source machine, partition wall, equipment etc.), and accepts the water (for example drain water) that generated by cooler (evaporimeter) 200; Control substrate box 70, it is arranged at least a portion of side of drain pan 660 or at least a portion of bottom surface, and has taken in control substrate 7.Being equipped with driver part on control substrate 7 is semiconductor device 11, this semiconductor device 11 is used for for example utilizing drive compression machines 6 such as frequency converter, compressor cooling fan 68 etc., semiconductor device 11 adopts wide bandgap semiconductor, to be delivered to drain pan 660 by the heat that wide bandgap semiconductor produces, and will be delivered to drain pan 660 by the heat that compressor 6 produces, thereby make the water evaporation that is trapped in the drain pan 660, therefore the heat that can produce by wide bandgap semiconductor and be used to make the water evaporation that is trapped in the drain pan 660 by the heat both sides that compressor 6 produces, can low cost and efficient the water in the drain pan 660 are evaporated.In the present embodiment, the freeze cycle of refrigerator is illustrated, but in washing machine etc., also can obtains same effect.In addition, the equipment about air conditioner with indoor heat exchanger and outdoor heat exchanger etc. has freeze cycle also can obtain same effect.

In addition, equipment such as the refrigeration of present embodiment, aircondition have: connect compressor 6, indoor heat exchanger, expansion gear 62, outdoor heat exchanger successively and the freeze cycle that constitutes; Drain pan 660, its be configured in the compressors 6 that disposed in the Machine Room 60 compressors 6 such as top, side near, and accept the water (for example drain water) that generates by outdoor heat exchanger; The control substrate box, it is set at the part of side of drain pan 660 or the part of bottom surface, and has taken in control substrate 7.On control substrate 7, the frequency conversion drive parts that for example are used for compressor 6 or compressor cooling fan 68 etc. is carried out frequency conversion drive are that semiconductor device 11 adopts wide bandgap semiconductors, to be delivered to drain pan 660 by the heat that wide bandgap semiconductor produces, and will be delivered to drain pan 660 by the heat that compressor 6 produces, thereby make the water evaporation that is trapped in the drain pan 660, therefore, the heat that can produce by wide bandgap semiconductor and be used to make the water evaporation that is trapped in the drain pan 660 by the heat both sides that compressor 6 produces, can low cost and efficient make water evaporation in the drain pan 660 well.

In addition, to control substrate box 70 or control bottom surface or the side that substrate 7 is arranged on drain pan 660 by track etc. if can be slidably, in case of necessity, can will control substrate box 70 or control substrate 7 via track from bottom surface, the side of drain pan 660 and pull out maintaining or the replacing of carrying out parts, therefore become simple structure, and replacing, the maintaining of control substrate 7 or semiconductor device 11 etc. become easy.

In addition, if the bottom surface of drain pan 660, side directly to contact with the upper surface of the closed container 6X of compressor 6 or to fix across the mode of the miscellaneous part contact of heat-conduction component etc., then can be used to the heat that is produced by compressor 6 make the water evaporation in the drain pan 660 effectively.Especially, the closed container 6X inside of compressor 6 becomes high pressure, high temperature, the at least a portion on the surface of closed container 6X becomes the structure of the high pressure shell type of high temperature, the heat of the high temperature that produced by compressor 6 can be delivered to drain pan 660, so, can the water in the drain pan 660 be evaporated efficient.Here, even become the low pressure shell type of low pressure, low temperature in the closed container 6X, so long as the top of the closed container 6X of compressor 6 becomes the compressor 6 of the structure of high pressure, high temperature, just the heat of the high temperature that produced by compressor 6 can be delivered to drain pan 660, so can access identical effect.

In addition, if the semiconductor device 11 of wide bandgap semiconductor etc. is directly contacted with bottom surface, the side of drain pan 660 or, then the heat that is produced by the wide bandgap semiconductor with heat-resisting ability can be used to effectively make drain pan 660 interior water to evaporate as illustrated in fig. 9 across the miscellaneous part ground contact of heat-conduction component etc.

Here, shown in Figure 11 (c), the back side at drain pan 660, at least a portion in the rear side (for example outer periphery) of the side or the bottom surface of drain pan 660, be provided with downwards or stretch out the side or the outstanding portion that dewaters 670 from drain pan 660, thus, even the water in the drain pan 660 overflows outside drain pan 660, water yet can not enter or invade control substrate 7 or control substrate box 70.Because control substrate 7 or control substrate box 70 are set at the inboard of this portion 670 that dewaters, so even the water in the drain pan 660 overflows outside drain pan 660, water yet can not enter or invade control substrate 7 or control substrate box 70, therefore can access the high equipment of reliability.

As mentioned above, equipment such as refrigerator of the present invention has: main body 1; Machine Room 60, it is arranged on the main body back side, disposes the compressor 6 that constitutes freeze cycle with cooler; Drain pan 660, it is arranged in the Machine Room 60, receives the defrost water of cooler 200; Control substrate 7, it is equipped with the semiconductor device 11 that is used to drive control compressor 6; Take in the control substrate box 70 of control substrate 7.Semiconductor device 11 adopts wide bandgap semiconductor, can removably control substrate box 70 be installed in the back side or the side of drain pan 660, therefore can be delivered to drain pan 660 by the heat that wide bandgap semiconductor produces, can efficient make the water evaporation that is trapped in the drain pan 660 well.

In addition and since with drain pan 660 in Machine Room 60, be arranged on compressor 6 above, so the heat of the high temperature that produced by compressor 6 can be delivered to drain pan 660, therefore can efficient make the water evaporation in the drain pan 660 well.In addition, if can with take in the control substrate 7 that has carried wide bandgap semiconductor control substrate box 70 disassembled and assembled freelies be installed in the back side or the side of drain pan 660, the heat that can produce by wide bandgap semiconductor and be used to make the water evaporation that is trapped in the drain pan 660 then by the heat both sides that compressor 6 produces, can low cost and efficient make water evaporation in the drain pan 660 well.

In addition, if can drain pan 660 be installed on the compressor 6 disassembled and assembled freely ground, then become simple structure, replacing, the maintaining of control substrate 7 or semiconductor device 11 etc. become easy.

Here, shown in Figure 12 (b), also drain water delay portion (water is concentrated portion) 665 can be set on drain pan 660.To generate and fall or be discharged to the ad-hoc locations that drain water in the drain pan 660 or water concentrates in the drain pan 660 by cooler 200 be drain pan hydropexis portion (water is concentrated portion) 665 in order to make, and at least a portion of the bottom of drain pan 660 becomes recess.And, it is that drain water delay portion (water is concentrated portion) 665 ground are so that the rake 666,667 that the mode that water is assembled tilts that the bottom of drain pan 660 has towards recess shapes, in addition, drain water delay portion (water is concentrated portion) 665 be than the low one-level of other parts, formed can occluded water recess.

If control substrate 7 or control substrate box 70 are set at the back side of this drain water delay portion (water is concentrated portion) 665, then can utilize the heat efficient of sending of semiconductor device 11 not have directly to heat lavishly the drain water delay portion (water is concentrated portion) 665 that the water in the drain pan 660 is concentrated well, therefore can make the water efficient evaporation as soon as possible well in the drain pan 660.

More than, mainly the example that drain pan 660 is configured in the Machine Room 60 is illustrated, but drain pan 660 also can be configured in the Machine Room.For example, be under the situation of refrigerator, during on the top that Machine Room 60 is arranged on refrigerator main body 1 etc., cooler 200 is arranged on the bottom of Machine Room 60, therefore, drain pan 660 is not arranged in the Machine Room 60, and the below that is arranged on cooler 200 gets final product, and perhaps is arranged on the substantial middle back side of refrigerator main body 1 or back side, bottom etc. and gets final product.

In addition, for example be under the situation of air conditioner, drain pan 660 is not configured in the off-premises station, and is configured in the indoor set, and therefore control substrate 7 or control substrate box 70 can also be set in the rear side of the bottom surface that is configured in indoor drain pan, side.The indoor set of air conditioner has: air suction inlet; Be arranged on the filter in the downstream of air suction inlet; Be arranged on the indoor heat exchanger in the downstream of filter; Air Blast fan, it is arranged on the downstream of indoor heat exchanger, will be transported to the air blow-off outlet in the downstream that is arranged on indoor heat exchanger from the air suction inlet inhaled air; The indoor set drain pan, it receives the water (drain water) that is generated by indoor heat exchanger.Therefore, foregoing (for example, the back side of drain pan or side structure, the drain pan that can be provided with control substrate box 70 or control substrate 7 slidably is provided with the structure etc. of portion of dewatering 670 or drain water delay portion 665) also goes for the indoor set drain pan.

Therefore, equipment such as air conditioner of the present invention has: be arranged on indoor indoor set main body; Air suction inlet, it is arranged on front surface top, end face or the side of indoor set main body; Filter, it is arranged on the downstream of air suction inlet; Indoor heat exchanger, it is arranged on the downstream of filter; The air blow-off outlet, it will blow out to indoor from the air suction inlet inhaled air; Air Blast fan, it is arranged on the downstream of indoor heat exchanger, and is arranged between indoor heat exchanger and the air blow-off outlet, is used for being transported to the air blow-off outlet in the downstream that is arranged on indoor heat exchanger via indoor heat exchanger from the air suction inlet inhaled air; The indoor set drain pan, it receives the water (drain water) that is generated by indoor heat exchanger; Control substrate 7, it is equipped with the semiconductor device 11 that driver parts such as Air Blast fan or wind direction board is driven control; Take in the control substrate box 70 of control substrate 7.Semiconductor device 11 adopts wide bandgap semiconductor, can the back side or the side that substrate box 70 or control substrate 7 are installed in drain pan 660 will be controlled removably, so can be delivered to drain pan 660 by the heat that wide bandgap semiconductor produces, the water efficient that is trapped in the drain pan 660 is evaporated well.

(the case internal capacity that the control substrate is configured under the situation at the refrigerator back side increases)

More than, example to equipment that 1 or 2 control substrate is set is illustrated, here, be not arranged in the Machine Room 60 for the control substrate that has carried wide bandgap semiconductor 11 and the increase that is arranged on the case internal capacity under the situation in the heat-barrier material of the back side describes.

Figure 13 is the key diagram that the volume of the back portion of the control substrate box 70A in the refrigerator 1 of expression embodiments of the present invention increases.In the drawings, the Reference numeral that identical with Fig. 1～Figure 12 part mark is identical also omits explanation.In the drawings, the epimere of refrigerator main body 1 is provided with refrigerating chamber 2, be provided with side by side below refrigerating chamber 2 and switch chamber 3 and ice-making compartment 35, be provided with refrigerating chamber 4 below switching chamber 3 and ice-making compartment 35, (hypomere) is provided with vegetable compartment 5 below refrigerating chamber.Here, between each storeroom (for example refrigerating chamber 2, switching chamber 3, ice-making compartment 35, refrigerating chamber 4, vegetable compartment 5), separated by heat-barrier material (being partition member, polyurethane heat-barrier material, vacuum heat insulation material) 8 between the different chamber of design temperature (storage temperature).In addition, be provided with the Machine Room 60 of configuration compressor 6 grades in the lower rear of refrigerator 1.

In addition, be provided with back side heat-barrier material 80 at the back side of refrigerator main body 1, in addition, dispose the cooler 200 that is arranged at the cooler chamber at the back side of refrigerator main body 1, compressor 6, and control substrate box 70, this control substrate box 70 has been taken in control compressor 6, compressor cooling fan 68, the control substrate 7 of cold air Air Blast fan (not shown) etc., in addition, (perhaps in the Machine Room 60) disposes expansion gear (for example capillary or electric expansion valve etc.) 62 in the heat-barrier material 80 overleaf, connect and constitute the radiating tube (condenser pipe) 9 etc. of freeze cycle with compressor 6 with cooler etc.Here, in the Machine Room 60 that is arranged at refrigerator 1 back side, dispose compressor 6, memory 61, control substrate box 70 etc., also be provided with the drain pan 660 of the water (defrost water, drain water etc.) that reception produces by cooler 200 etc.

Radiating tube 9 for example is connected to expansion gear 62 from compressor 6 by the side of refrigerator main body 1, the back side of refrigerator main body 1, the upper surface (the perhaps lower surface of refrigerator main body 1) of refrigerator main body 1, the side of refrigerator main body 1 etc., and is connected to compressor 6 via evaporimeter 200, memory 61 etc.Compressor 6 is driven in the frequency conversion mode that can at random adjust motor rotary speed, for example is equipped with control substrate 7 drivings that semiconductor device is frequency conversion drive circuit block 11 grades.Control substrate 7 for example in Fig. 1, Fig. 4 and Fig. 5 etc., is incorporated in the control substrate box 70, and this control substrate box 70 is disposed in the set Machine Room of lower backside 60.Control substrate box 70 is, in Fig. 1, in Machine Room 60, across terminal box 601 and with compressor 6 across the space be configured in the top of compressor 6, in addition, in Fig. 4 and Fig. 5, in Machine Room 60, be set at compressor 6 near, and with compressor 6 across the space be configured in the top of compressor 6 or side etc.Here, as Fig. 1～illustrated in fig. 3, also can be directly or be arranged on the top of the terminal box 601 of compressor 6 across padded coaming 350 ground with control substrate box 70.

Control substrate box 70 is configured in the Machine Room 60 of lower backside that is arranged at refrigerator 1 shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 6 etc. or upper rear portion, under the state in being set at Machine Room 60, observe from the back side of refrigerator 1, front surface side (face side) or upper surface side or side surface side or lower face side opening are used to control maintaining, the replacing of maintaining, semiconductor device 11 or the control associated components etc. of substrate 7.Suitably be provided with cover at the peristome of controlling substrate box 70 and promptly control substrate case lid 701.Here, in Fig. 1, Fig. 4, Fig. 5, radiating tube 9 is connected to by at least one position refrigerator side, the refrigerator back side, refrigerator upper surface, the refrigerator side etc. from compressor 6 and is configured in the Machine Room 60 or the expansion gear 62 in the heat-barrier material 80 of the main body of refrigerator 1, and is connected to the indoor cooler of cooler 200.Here, radiating tube 9 also can be connected to expansion gear 62 via the condenser with the setting of radiating tube 9 splits ground.

Here, for example control substrate 7A at the second control substrate 7A(with second of control substrate 7 splits ground setting, the part branch that perhaps will control substrate 7 cedes territory to be arranged on the second control substrate 7A on the back side of refrigerator 1, the second control substrate 7A that control substrate 7 perhaps is not set and is provided with individually etc.) be set under the situation in the second control substrate box 70A of substantial middle position of the top that is disposed at Machine Room 60 or short transverse, when radiating tube 9 from the Machine Room 60 when being configured to the refrigerator side, radiating tube does not coil in the refrigerator back side, therefore, the situation that the second control substrate box 70A at the refrigerator back side becomes obstacle is few, but be configured to the refrigerator upper surface from the refrigerator back side at radiating tube 9, perhaps be configured under the situation of refrigerator side the configuration laterally that radiating tube 9 is avoided taking in the second control substrate box 70A of the second control substrate 7A and passed through the second control substrate box 70A from the refrigerator upper surface.In addition, on any one face at least in end face, the back side, side and the bottom surface of refrigerator 1, for improving the heat-proof quality of refrigerator 1, between interior case 101 and outer container 102, in a position or a plurality of position vacuum heat insulation material 10 is set, also can be configured between the back side 71 and interior case 101 of the second control substrate box 70A.

In the present embodiment, the second control substrate 7A, the second control substrate box 70A are configured in the upper rear portion of refrigerator 1 or the short transverse substantial middle position at the back side, if semiconductor device 11 adopts wide bandgap semiconductor, then can make thickness (the fore-and-aft direction length of refrigerator 1, depth) the H attenuation of the thickness and the second control substrate box 70A of the second control substrate 7A, therefore can reduce to dispose outstanding (stretching out) the partly size and volume of (overhang reduction 83) of (in the storeroom) in case of interior case of the part of control substrate box 70A to the case inboard.In addition, owing to can reduce the thickness H of the second control substrate box 70A, can make the thickness of the heat-barrier material 80 between the interior case 101 and the second control substrate box 70A back side 71 increase the amount (control substrate box thickness reduction) that thickness reduces.(the thickness increase of heat-barrier material 80 is measured accordingly with the volume of heat-barrier material thickness increasing portion 85, so heat-proof quality improve.) here, even the thickness attenuation of the second control substrate box 70A, if the thickness of heat-barrier material 80 is increased, then can make the case internal capacity increase the amount of the volume of this heat-barrier material thickness increasing portion 85, therefore can change refrigerator main body size (width, highly, depth) obtain jumbo refrigerator.That is, can make case internal capacity (internal capacity of storeroom) increase the amount (perhaps amount of thickness) of volume of heat-barrier material thickness increasing portion 85 at the back side of the second control substrate box 70A of thickness H attenuation.What therefore, need not increase refrigerator main body obtains the good jumbo refrigerator of usability for the user big or smallly.

Here, in refrigerator 1 in the past, (the perhaps thickness of the semiconductor device 11 of frequency conversion drive circuit block etc.) becomes big because the thickness of the second control substrate box 70A, so need the depth direction (thickness direction) of the accommodation space of the increase second control substrate box 70A, case 101 outstanding (stretching out) arrives the size of the ledge (the overhang reduction 83 to the case inboard) in the storeroom (for example refrigerating chamber 2) in making, so the case internal capacity diminishes.In addition, in refrigerator in the past, owing to the second control substrate box 70A is set to the thickness increasing portion 85 of heat-barrier material 80, so the difficulties that become such as optional feature of vacuum heat insulation material 10 or radiating tube 9 etc. are set, but the control of second among the present invention substrate 7A, the second control substrate box 70A can make the thickness attenuation by using wide bandgap semiconductor, therefore can reduce the size or the overhang of ledge (overhang reduction 83) to the case inboard to the case inboard, in addition, owing to can be only guarantee the space with the amount of the volume of heat-barrier material thickness increasing portion 85,, the second control substrate 7A or the second control substrate box 70A reduced the overhang of ledge (overhang reduction 83) so being disposed obliquely with respect to the back side 152 of refrigerator 1 to the case inboard, even the back side 152 with respect to refrigerator 1 roughly is provided with side by side (face or refrigerator back side approximate vertical being set with respect to refrigerator), ledge (the overhang reduction 83 to the case inboard) is disappeared or reduce, therefore can access the refrigerator that the accommodation space of the simple structure and the second control substrate box 70A can reduce significantly.And, because interior case 101 does not stretch out (giving prominence to) in storeroom is refrigerating chamber 2,, obtain big capacity and good refrigerator or the equipment of usability for the user so can also enlarge the food amount of taking in that storeroom is a refrigerating chamber 2.

Here, by reducing by the height H of the second control substrate box 70A, interior case increase part 83 to the overhang reduction 83(of case inboard case internal capacity), the height H step-down of the second control substrate box 70A, thus, the thickness increasing portion 85(control substrate box thickness of the heat-barrier material 80 of (for example constituting the back side of the heat insulating box of refrigerator 1) reduces and the heat-barrier material thickness increasing portion 85 that produces between second control substrate box 70A and the interior case 101) volume that waits increases part (83 or 85), is provided with or disposes optional feature (functional part (sprayer unit for example, sterilizing unit, bactericidal device etc.), wind path parts (cooling air duct for example, mist is carried wind path, air quantity is adjusted, wind path switches the throttle setting of usefulness etc.), freeze cycle parts (radiating tube (condenser pipe) for example, decompressor (expansion valve, capillary etc.), suction line etc.), miscellaneous part (vacuum heat insulation material, wiring, illuminace component (the case intraoral illumination of LED illumination etc. for example, warning etc., display lamp) etc.)) also can.

Like this, increase part 85 configurations or above-mentioned optional feature is set by the heat-barrier material thickness (volume) of controlling the back side 71 of substrate box 70A in the increase part 83 and second of case internal capacity, therefore the additional function that obtains compared with the past obtains the good and also big high refrigerator of cost performance of space service efficiency of usability for the user with can not reducing the case internal capacity.

Promptly, with control substrate box back side heat-barrier material thickness increasing portion 85 optional feature is set if increase part 83 at the case internal capacity, realize the function of appending of optional feature with then can not reducing case internal capacity (storeroom take in volume), perhaps the part configuration miscellaneous part of optional feature can disposed, therefore can not reduce the use of case internal capacity ground and append function, space efficiency improves, and obtains the good refrigerator of usability for the user.In addition, increasing part 83 at the case internal capacity is not provided with under the situation of optional feature with control substrate box back side heat-barrier material thickness increasing portion 85, for with the refrigerator of identical in the past appearance and size, can increase the case internal capacity, therefore can access the space efficiency raising and take in the good refrigerator of capacious usability.

Here, optional feature be generate mist and in storeroom or the sprayer unit of indoor spraying, with mist to the mist of guiding such as air blow-off outlet or mist blow-off outlet carry wind path, under the situation of associated components of spraying such as mist blow-off outlet that mist is blown out in indoor or storeroom, because can be in storeroom or indoor the spraying, carry out the health of interior degerming of storeroom and humidification and fresh-keeping refrigerator and carry out indoor humidification and the equipment such as air conditioner of degerming so can access the volume ground of taking in that can not reduce in the storeroom.

In addition, at optional feature is under the situation of radiating tube (condenser pipe) 9, because the radiating tube that makes that can not reduce in the storeroom coils (configuration) heat-barrier material thickness increasing portion 85 at the back side 71 of control substrate box 70A with taking in volume, so can increase the length of radiating tube 9, and the increase of realization area of dissipation, therefore can provide radiating efficiency to improve and energy-conservation refrigerator.

In addition, at optional feature is under the situation of vacuum heat insulation material 10, owing to can not reduce to take in volume ground in the storeroom, heat-barrier material at the back side of the control substrate box 70A that is difficult to dispose in the past increases part 85 configuration vacuum heat insulation materials 10, so can realize the expansion that area is set of vacuum heat insulation material 10, and heat-proof quality improves, so can access energy-conservation refrigerator.In addition, owing to can make control substrate box 70A attenuation, so do not need to dispose bendingly vacuum heat insulation material 10, outsourcing material can not break or be injured, therefore can access the high equipment such as refrigerator of quality.In addition, even do not bending under the situation that just can not dispose vacuum heat insulation material 10, since in the scope of can be not injured or not breaking at outsourcing material with little bending angle configuration, so can suppress because of bending makes the situation that outsourcing material is injured or break, can access vacuum heat insulation material does not damage and heat-proof quality does not reduce high reliability and energy-conservation equipment such as refrigerator.

(the bending configuration of vacuum heat insulation material)

Among the present invention second controls substrate 7, the second control substrate box 70A can make the thickness attenuation by using wide bandgap semiconductor, therefore, compared with the past, can guarantee that the ledge in case is that the case internal capacity increases part 83, the space of the cubical content of heat-barrier material thickness increasing portion 85, so, can not make the second control substrate 7A, the second control substrate box 70A disposes obliquely with respect to the back side 152 of refrigerator 1, the second control substrate box 70A can roughly be set side by side with respect to the back side 152 of refrigerator 1, when the research second control substrate 7A or the second control substrate box 70A the position is set the time, the free degree of allocation position increases, and the free degree of design improves.In addition, even under the situation that disposes the second control substrate 7A or the second control substrate box 70A obliquely, with little bending angle configuration vacuum heat insulation material 10, therefore can access the equipment of the high refrigerator of reliability height and heat-proof quality etc. in the scope of also can be not injured or not breaking at outsourcing material.

Figure 14 is near the main position cutaway view other the control substrate box of refrigerator of expression present embodiment.In the drawings, the Reference numeral that identical with Fig. 1～Figure 13 part mark is identical also omits explanation.In the drawings, the back side 71 of control substrate box 70 tilts with respect to the outer container 102 of refrigerator 1 or the back side 152 angle with regulation, and control substrate 7A is also to dispose obliquely with the roughly the same angle in the angle of inclination at the back side 71 of control substrate box 70A.In the present embodiment, control substrate 7A, control substrate box 70A can make the thickness attenuation because of having adopted wide bandgap semiconductor, therefore space or the volume that can guarantee the cubical content of case internal capacity increase part 83, heat-barrier material thickness increasing portion 85 compared with the past, if the back side 71 that will control substrate box 70A disposes with predetermined angular obliquely with respect to the back side 152 of the outer container 102 of refrigerator 1 or refrigerator main body 1, then compare, can significantly reduce to control the accommodation space in the heat-barrier material of substrate box 70A with the situation of configuration generally perpendicularly.And, owing to interior case 101 stretching out in storeroom is refrigerating chamber 2 being reduced or disappearing, so can also enlarge the food amount of taking in that storeroom is a refrigerating chamber 2.

In the present embodiment, disposing optional feature in heat-barrier material thickness increasing portion 85 is vacuum heat insulation material 10, vacuum heat insulation material 10 bends with predetermined angular near control substrate box 70A matchingly with the inclination at the back side 71 of control substrate box 70A, but set the bending angle of vacuum heat insulation material 10 in the scope of can be not injured or not breaking at the outsourcing material of vacuum heat insulation material 10 littlely, therefore, the outsourcing material of vacuum heat insulation material 10 is not injured or do not break, so can guarantee the reliability of vacuum heat insulation material 10.Here, the predetermined angular of bending vacuum heat insulation material 10 is set in the not injured or scope of not breaking of outsourcing material, vacuum heat insulation material 10 with respect to the part that does not dispose control substrate box 70A, the regulation bending angle of the part of the bending of vacuum heat insulation material 10 is set roughly 30 degree following (preferred 10 degree are following) (under the situation that the back side or the end face almost parallel ground of the vacuum heat insulation material 10 of the part of configuration control substrate box 70A and refrigerator 1 are provided with, the bending part of vacuum heat insulation material 10 gets final product for 30 degree roughly following (be preferably 15 spend below) with respect to the regulation bending angle of the back side or end face) for.Like this, under the situation that the back side 71 of control substrate box 70A tilts, the optional feature that is arranged on the back side of control substrate box 70A also can not be a vacuum heat insulation material 10, also can be other optional feature such as radiating tube 9, suction line 63, expansion gear 62, sprayer unit or cooling air duct.

(disposing a plurality of optional features)

Here, optional feature also can not be one, but the plural combination (for example pipe arrangement (combination of radiating tube 9 and suction line 63 each other, suction line 63 and decompressor are the combination of capillary 62 etc.), pipe arrangement (radiating tube 9, the combination of suction line 63 and capillary 62 etc.) and the combination of vacuum heat insulation material 10, the combination of sprayer unit and cooling air duct, the combination of sprayer unit and vacuum heat insulation material 10, vacuum heat insulation material 10 and mist are carried wind path, perhaps vacuum heat insulation material 10 and mist blow-off outlet, the perhaps combination of vacuum heat insulation material 10 and cooling air duct, illuminace component (the case intraoral illumination of LED illumination etc. for example, warning etc., display lamp etc.) and the combination of cooling air duct, the combination of illuminace component and vacuum heat insulation material, the combination of two kinds of different optional features such as combination of illuminace component and sprayer unit, perhaps vacuum heat insulation material, the combination of sprayer unit and cooling air duct, lighting device, the combination of three kinds of different optional features such as combination of sprayer unit and cooling air duct also can be selected a plurality of combinations from a plurality of optional features).In addition, also can two or three etc. the combination of identical optional feature.By making up the optional feature more than one or two, the minimizing of taking in volume along with in the storeroom can access more additional function, therefore can access user satisfaction height and the also big high equipment such as refrigerator of cost performance of space service efficiency.

(vacuum heat insulation material)

Here, adopt at optional feature under the situation of vacuum heat insulation material, when core uses glass fibre, therefore heat-proof quality is good, even use also no problemly, but uses inorfil such as glass fibre to compare with core, when using polyester fiber (PP) or polystyrene organic fibers such as (PS), when the operation of core, when disintegrating or when reclaiming, to the harmful effect of human body, operability is not good.In addition, use under the situation of glass fibre, because of burning produces residue, but use under the situation of organic fiber, be difficult for producing residue, the recuperation of heat usability is good, and is favourable to environment.

Vacuum heat insulation material 10 has: the barrier properties for gases container (hereinafter referred to as " outsourcing material ") with air property cut off; Enclosed the core and the adsorbent (for example adsorbent, moisture adsorbent (CaO) etc.) of the inside of outsourcing material.And the inside of outsourcing material is depressurized to about specified vacuum degree (a few Pa(Pascal)～hundreds of Pa).In addition, the situation that vacuum heat insulation material 10 is abbreviated as vacuum heat insulation material is also arranged.

Fiber as the core that forms vacuum heat insulation material 10 uses inorfil or organic fiber in the present embodiment, but the operability of organic fiber, recuperation of heat usability are good.As the employed material of organic fiber, can use polyester fiber, can also use polypropylene, PLA, aramid fiber, LCP(liquid crystal polymer in addition), PPS, polystyrene etc.In addition, improve under the stable on heating situation of core, organic fiber adopts the LCP(liquid crystal polymer) or the PPS(polyphenylene sulfide) etc. have stable on heating resin and get final product.In addition, improve under the situation of compression creep characteristic, adopt the big material of fibre diameter to get final product.In addition, use above-mentioned resin, then obtain the hear resistance height and the high vacuum heat insulation material 10 of thermal insulation of compression creep characteristic good if mix.The solid thermal conductivity of polystyrene is little, can expect the raising of the heat-proof quality of heat-barrier material, and can make at an easy rate.

Because polyacrylic hygroscopicity is low, thus drying time can be shortened, the pumpdown time, and can boost productivity.In addition, because the conduction of polyacrylic solid thermal is little, so can expect the raising of the heat-proof quality of vacuum heat insulation material 10.

In addition, because PLA has biological degradability, so disintegrate after the use of product, separated core can also carry out landfill disposal.

In addition, because the rigidity height of aramid fiber and LCP, so, have the advantage of the raising that can improve voidage and can expect heat-proof quality etc. by vacuum-packed and shape retention when being subjected to atmospheric pressure is good.

For example, at the vacuum heat insulation material 10 that composite plastic film is used for outsourcing material, core performance is born atmospheric pressure and is guaranteed the effect and the segmentation space in the space in the vacuum heat insulation material 10 and reduce the effect of the heat conduction etc. of gas.In addition, conduct the viewpoint that suppresses, preferably make the distance in this space become littler than the free travel distance of the air molecule under its vacuum from the heat of gas.

In the present embodiment, if the core of vacuum heat insulation material 10 adopts for example organic fiber, then with in the past hard and crisp glass fibre is compared as the situation that core uses like that, when the manufacturing of vacuum heat insulation material 10, when disintegrating and when reclaiming, do not have dust to disperse and bring the situation of stimulation, operability, operation, the raising of recovery property attached to operator's skin, mucous membrane etc.During fabrication when disintegrating, do not have dust to disperse and bring the situation of stimulation attached to operator's skin, mucous membrane etc., therefore can access the product favourable to environment.

(vacuum heat insulation material+radiating tube)

Adopting under the situation of vacuum heat insulation material 10 and radiating tube 9 as the combination of optional feature, vacuum heat insulation material 10 is configured in storeroom side (case inboard), radiating tube 9 is configured in the back side 71 sides (according to the arranged in order of interior case 101, vacuum heat insulation material 10, radiating tube 9, control substrate box 70) of control substrate box 70A, thus, the situation that the heat radiation that can utilize vacuum heat insulation material 10 to suppress radiating tube 9 is transmitted in storeroom, therefore, can access energy-conservation equipment such as refrigerator.Here, between interior case 101 and vacuum heat insulation material 10, between vacuum heat insulation material 10 and radiating tube 9, between the back side 71 of radiating tube 9 and control substrate box 70A, other heat-barrier material (for example polyurethane heat-barrier material), fixed part, antivibrating parts (for example elastomeric element, resin component etc.) suitably are set, can access effects such as heat-insulating efficiency, vibrationproof, noise reduction thus.

In addition, setting is towards the length direction or the continuous recess of width of the vacuum heat insulation material 10 of the tabular with specific length, Rack and specific thickness (perhaps sheet), making concave depth is more than about 1/3 of diameter of radiating tube 9, become that radiating tube 9 can insert or chimeric shape (for example circular shape), become the location that to carry out radiating tube 9, the degree of depth and the shape of maintenance gets final product.(for example, the circular-arc of diameter that become more than the diameter same degree with radiating tube 9 of the shape of recess gets final product.）

And, if make radiating tube be coiled in this recess, then radiating tube can be buried the amount of this concave depth underground, so the thickness that can make vacuum heat insulation material 10 adds the thickness attenuation of the total that the size (diameter amount) of radiating tube 9 obtains, can make heat-barrier material thickness (the heat-barrier material thickness between interior case and the outer container) attenuation of total at the back side of refrigerator, therefore, can make the internal capacity of storeroom increase the amount of thickness attenuation, obtain the good refrigerator of usability for the user.

Here, can reduce to make vacuum heat insulation material 10 and radiating tube 9 aggregate thickness situation as mentioned above, but under this situation, except can reducing to make the aggregate thickness of vacuum heat insulation material 10 and radiating tube 9, because semiconductor device 11 adopts wide bandgap semiconductor, therefore can also make the thickness attenuation of control substrate box 70,, the compartment interior volume is further increased so no matter whether append optional feature.Therefore, can access the equipment of good and capacious refrigerator of compartment interior of space efficiency etc.Here, be under the situation capillaceous replacing radiating tube 9 configuration suction lines 63, decompressor 62, also can access same effect.

(radiating tube)

Here, semiconductor device 11 about frequency conversion drive circuit block etc. adopts wide bandgap semiconductors, control the situation of the thickness attenuation of substrate box 70A thus, be illustrated above, here, for describing in the coiling mode of the back side 71 sides of controlling substrate box 70A as the radiating tube 9 of the refrigerator 1 under the situation of optional feature configuration radiating tube 9.In the past, because the thickness of control substrate 7A is big, so the thickness H2 of control substrate box 70A is also big, because the thickness of the heat-barrier material 80 on the back side 71 that can not obtain making radiating tube 9 be coiled in control substrate box 70A, so avoided making radiating tube 9 to coil in the back side 71 of control substrate box 70A, but in the present embodiment, the semiconductor device 11 of frequency conversion drive circuit block etc. adopts SiC(carborundum), the GaN(gallium nitride) etc. wide bandgap semiconductor can make the thickness of the control substrate 7A that contains semiconductor device 11 thus, and the thickness H attenuation of control substrate box 70A.Therefore, by making the thickness attenuation of control substrate box 70A, can guarantee between the interior case 101 and the control substrate box 70A back side 71, to make the gap (thickness of heat-barrier material) of radiating tube 9 coilings.Here, use Figure 15 that the example of the coiling mode of the radiating tube 9 under the situation of controlling substrate box 70A attenuation has been described.

Figure 15 is the rear isometric view Machine Room that is used to illustrate the refrigerator of the expression embodiments of the present invention coiling mode that is arranged at the radiating tube under the situation of lower backside, observe refrigerator from the back side.In the drawings, the Reference numeral that identical with Fig. 1～Figure 14 part mark is identical also omits explanation.In the drawings, be provided with Machine Room 60, and dispose the compressor 6 that constitutes freeze cycle in the lower backside of refrigerator 1.On the discharge pipe of compressor 6, be connected with radiating tube 9, this radiating tube 9 runs through top, Machine Room wall or the sidepiece wall that forms Machine Room 60, then, directly or across sept stick under the state of outer container 102 of refrigerator 1, be configured between outer container 102 and the heat-barrier material 80, and from the Machine Room 60 the back side or sides by refrigerator main body 1, be the suction line 63 that evaporimeter 200 is connected to compressor 6 via expansion gear 62, cooler.The high temperature of discharging from compressor 6, the refrigerant gas of high pressure the HC cold-producing medium of natural cold-producing medium (for example as) carry out heat exchange with refrigerator main body 1 back side, the outer container 102 of side, heat-barrier material 80, thus, liquefaction is condensed in radiating tube 9, become the refrigerant gas of low temperature, low pressure by expansion gear 62, evaporimeter 200, return the suction side of compressor 6 again, constitute freeze cycle thus.

Here, radiating tube 9 is connected in the discharge pipe arrangement of compressor 6, and by constituting with the lower part: between the outer container 102 at the refrigerator main body back side and heat-barrier material 80 or the up pipe arrangement 91 that disposes upward from the refrigerator main body lower backside in heat-barrier material 80; Control substrate box back side pipe arrangement 92 along ground, the back side configuration of the left and right directions of refrigerator main body 1 or the transversal control substrate box of above-below direction 70A; From the descending pipe arrangement 93 of refrigerator main body upper rear portion towards 60 configurations of the Machine Room of below.This radiating tube 9 is connected in compressor 6 via expansion mechanism 62, evaporimeter 200 and constitutes freeze cycle.Here, suitably between evaporimeter 200 and compressor 6, containers 61 such as air-breathing memory, absorbing silencer are set, between the discharge side line (for example discharging pipe arrangement) of compressor 6 and up pipe arrangement 91, second containers such as exhaust silencer are set, thus, reliability improves, and noise reduces.

Here, radiating tube 9 is illustrated by the example that constitutes with the lower part, that is, up pipe arrangement 91, it is between the outer container 102 at the refrigerator back side and heat-barrier material 80 or dispose towards the top from refrigerator main body lower backside (for example the Machine Room 60) in heat-barrier material; Control substrate box back side pipe arrangement 92, it is along ground, the back side configuration of the left and right directions or the transversal control substrate box 70 of above-below direction of refrigerator 1; Descending pipe arrangement 93, it is towards the configuration of 60 ground, Machine Room of below.But also can be by constituting as the lower part: the first up pipe arrangement, its refrigerator main body back side near the side by the control substrate box 70A Machine Room 60 of refrigerator main body lower backside towards above configuration; The first descending pipe arrangement, the first up pipe arrangement (for example control the substrate box 70A and refrigerator main body 1 back side upper end between) near the top of refrigerator main body 1 turn back and thus the ground that descends below refrigerator main body 1 at the back side of control substrate box 70A disposes and forms this first descending pipe arrangement; The second up pipe arrangement, near the first descending pipe arrangement (for example controlling between the upper end of substrate box 70A and Machine Room 60) above the Machine Room 60 turns back and towards the top configuration, and the ground that rises above refrigerator main body 1 at the back side of control substrate box 70A disposes and form this second up pipe arrangement; The second descending pipe arrangement, the second up pipe arrangement turns back and the ground that descends below refrigerator main body 1 at the back side of control substrate box 70A disposes and form this second descending pipe arrangement (for example control the substrate box 70A and refrigerator main body 1 back side upper end between) near the top of refrigerator main body 1; The 3rd up pipe arrangement, near the second descending pipe arrangement (for example controlling between the upper end of substrate box 70A and Machine Room 60) above the Machine Room 60 turns back and towards the top configuration, and the ground that rises above refrigerator main body 1 at the back side of control substrate box 70A disposes and form the 3rd up pipe arrangement; The 3rd descending pipe arrangement, the 3rd up pipe arrangement turns back and the ground that descends below refrigerator main body 1 in the side of control substrate box 70A disposes and form the 3rd descending pipe arrangement (for example control the substrate box 70A and refrigerator main body 1 back side upper end between) near the top of refrigerator main body 1.

Promptly, radiating tube 9 also can be between the outer container 102 and interior case 101 at the back side of refrigerator 1, on the back side of control substrate box 70A, on left and right directions or above-below direction, once or repeatedly be configured in the back side of control substrate box with respect to refrigerator 1 with turning back, by in this wise radiating tube 9 being coiled in the back side of the control substrate box 70A on the back side that is arranged at refrigerator main body 1, even only in the side of refrigerator 1, upper surface or bottom surface coiling and causing under the situation of heat radiation curtailment of radiating tube 9, also can only just guarantee the length of dispelling the heat fully, therefore can access the good energy-conservation equipment such as refrigerator of radiating efficiency at the back side of refrigerator 1.In addition and since can also be only at the back side of refrigerator 1 or only overleaf with the side or only overleaf and upper surface (perhaps bottom surface) guarantee the required length of heat radiation of radiating tube 9, so the free degree of the coiling mode of radiating tube 9 and configuration improves.In addition, by radiating tube being coiled in the back side of control substrate box 70A, on part that can be beyond the control substrate box 70A at refrigerator main body 1 back side, the side of refrigerator main body 1, the end face, the part that obtains not coil radiating tube 9 and become good, therefore the heat-barrier material thickness or the wall thickness attenuation of not coiling the good part of becoming of this radiating tube 9 be can make, compactness and refrigerator cheaply obtained.

In the present embodiment, as mentioned above, the semiconductor device 11 of the frequency conversion drive circuit block of equipment such as control refrigerator etc. adopts wide bandgap semiconductor, thereby can make control substrate 7A(or 7) thickness, and control substrate box 70A(or 70) thickness H attenuation, therefore radiating tube 9 can be configured in the back side of control substrate box 70, can access radiating efficiency and improve and energy-conservation equipment such as refrigerator.

In the past, because the thickness (depth) of control substrate box 70A is thick, think the volume of guaranteeing in the storeroom, back side configuration radiating tube 9 optional features such as grade at control substrate box 70A become difficult, for example radiating tube 9 is coiled under the situation at the back side of refrigerator main body 1, so that radiating tube 9 not the mode at the back side by control substrate box 70A turn back in top or the bottom of control substrate box 70A, perhaps the side by control substrate box 70A etc. and be not coiled in control substrate box 70A the back side be coiled in the end face of refrigerator main body 1, the heat radiation length of radiating tube 9 is guaranteed in side or bottom surface.Under the situation of turning back in top or the bottom of control substrate box 70A making radiating tube 9 not be coiled in the back side of control substrate box 70A, owing to need the heat radiation length or the area of dissipation of regulation, so radiating tube 9 on the top of control substrate box 70A or the bottom along the vertical direction (short transverse of refrigerator 1) or left and right directions (refrigerator 1 laterally) or incline direction repeatedly dispose with turning back, obtain required heat radiation length thus.

But, in the present embodiment, owing to radiating tube 9 can be coiled in the back side of the control substrate box 70A of the top rear face (near the perhaps central authorities of the back side or the back side, bottom) that is arranged at refrigerator 1, so need not be as in the past (short transverse of refrigerator 1) or left and right directions (refrigerator 1 laterally) or incline direction repeatedly turn back and dispose (bending) along the vertical direction with radiating tube 9, just can guarantee the length of dispelling the heat, therefore the free degree of the configuration of radiating tube 9 improves, and, can reduce the number of times that turns back of the direction up and down (short transverse of refrigerator 1) of radiating tube 9 or left and right directions (refrigerator 1 laterally), therefore can shorten the process time of radiating tube 9, obtain energy-conservation and equipment such as refrigerator cheaply.In addition, owing to can reduce the number of times that turns back (bending number of times) of radiating tube 9, reduce so can also suppress the quality that the problem of the be full of cracks etc. of the radiating tube 9 that produces because of bending causes.Therefore, can access high-quality, reliability is high, process time is short, low-cost and energy-conservation equipment such as refrigerator.

When increasing radiating tube 9, owing to radiating efficiency becomes well, and the minimizing that brings power consumption, so obtain energy-conservation equipment.In general, semiconductor in the past uses silicon (Si), being difficult to tackle excessive temperature rises, but the wide bandgap semiconductor of SiC used in the present invention, GaN etc. has the characteristic that heating is little and heat-resisting ability is strong of self, therefore can be arranged in the heat-barrier material that unworkable in the past temperature becomes higher, in the

control substrate box

70,70A or in the Machine Room 60 (for example near near the discharge pipe of, the compressor 6 of compressor 6 or radiating tube near) etc.Under the semi-conductive situation of Si in the past, do not have enough to note from around the giving of heat the time, the possibility height that breaks down owing to high temperature, but under the situation of wide bandgap semiconductor, since the hear resistance height, so the fault that Yin Gaowen causes is few, rare problem.As the heating temp of radiating tube 9, for example maximum rises to about 40～120 ℃, because the high temperature endurance height (about 300 ℃) of wide bandgap semiconductor, so can use no problemly.

(between the optional feature and the control substrate box back side, accessory being set)

Here, thereby by fixing radiating tube 9 and the control substrate box 70A(or 70 of making such as binding agent or screw) the back side direct or when the accessory with heat conductivity contacts (resin component etc.), the heat that can make radiating tube 9 is via control substrate box 70A(or 70) dispel the heat, can access the equipment such as high performance refrigerator of simple in structure and excellent radiation performance.

Figure 16 is near the main position cutaway view of control substrate box of the refrigerator of expression present embodiment.In the drawings, the Reference numeral that identical with Fig. 1～Figure 15 part mark is identical also omits explanation.In the drawings, between the back side 71 of controlling substrate box 70A and optional feature (for example radiating tube 9, vacuum heat insulation material 10, sprayer unit, mist are carried wind path, cooling air duct, backflow wind path etc.), be provided with accessory 75.Optional feature is that radiating tube 9 disposes as follows, promptly, for example from above or below Machine Room 60 directly or across accessory 75, fixed part, sept and other places be fixed under the state of outer container 102, after making the inner face side rising of outer container 102 or dropping near the control substrate box 70A, be coiled in the back side 71 of control substrate box 70A.

Here, accessory 75 is the heat conductivity parts with heat conductivity, if the rubber-like elastomeric element (for example, have the rubber of heat conductivity or resin etc.), fixing etc. by bonding or screw, rubber-like accessory 75 is fixed on the back side 71 of control substrate box 70A, with optional feature is that radiating tube 9 presses against on the rubber-like accessory 75, perhaps will control substrate box 70A presses against on the radiating tube 9 across accessory 75 ground and fixes, if as described above, then assembling becomes simple, obtains the good equipment such as high performance refrigerator of low cost and heat dispersion.

As mentioned above, the semiconductor device 11 of control substrate 7A adopts the wide bandgap semiconductor element, therefore can reduce to control the thickness H of substrate box 70A.By reducing to control the thickness H of substrate box 70A, in the space that can be produced at the back side 71 of the control substrate box 70A at the back side that is disposed at refrigerator main body 1, therefore coiling radiating tube 9 can make the length of radiating tube 9 increase corresponding amount, obtains the good equipment such as refrigerator of radiating efficiency.In addition, owing to also can so can reduce the bending number of times of radiating tube 9, obtain the little equipment such as refrigerator cheaply of manufacturing cost not at the radiating tube of bending nearby 9 of control substrate box 70A.In addition, if with radiating tube 9 across the accessory 75(with heat conductivity for example resin component or elastomeric element etc.) pushing is fixed on the back side 71 of control substrate box 70A, the distribute heat of radiating tube 9 is dispelled the heat outside refrigerator effectively via control substrate box 70A, therefore can access equipment such as high performance refrigerator.

Here, replacing radiating tube 9 to use suction lines 63, expansion gear 62 is other pipe such as capillary, also can be coiled in the back side of control substrate box 70A, therefore can access same effect.In addition, can not refrigerator also, have radiating tube 9 for comprising, the equipment of the freeze cycle of the pipe of suction line 63 etc., the equipment such as air conditioner (indoor set, off-premises station), water heater (heat source machine, hot water storage tank), washing machine of wide bandgap semiconductor can be adopted for the semiconductor device 11 of control appliance, same effect can both be obtained.Under this situation, even do not dispose heat-barrier material, to coil optional feature be that radiating tube 9, suction line 63, expansion gear are the pipe of capillary 62 etc. as long as can increase part in the space that the back side produced of control substrate box 70A, and just can access same effect.

(sprayer unit)

Below, the situation of refrigerator describes to being used for sprayer unit for example as optional feature.Sprayer unit has: sparking electrode, and it produces mist by applying voltage; Holding member, it keeps described sparking electrode; The water feed mechanism, it supplies with water to sparking electrode.Here, sparking electrode is formed by roughly main part cylindric or roughly prism-shaped and protuberance roughly coniform or roughly pyramid-shaped, generates mist by applying voltage at protuberance.As long as the water feed mechanism can be supplied with water to sparking electrode, therefore can adopt following structure, promptly, water is fallen and to the main part supply water of the sparking electrode that forms by porous material etc. with the main part of sparking electrode across ground, space, and supply with water to the protuberance (being arranged on the protuberance of the opposition side of water feed mechanism) of sparking electrode by capillarity etc., also can adopt following structure, promptly, constitute the water feed mechanism by heat conductivity good metal etc., one distolateral wall with low temperature storerooms such as refrigerating chamber or cooling chamber is contacted, another distolateral main part with the sparking electrode that is formed by porous material etc. is connected, the direct main part of cooling discharge electrode and make the main part of sparking electrode produce dew is supplied with water by capillarity etc. to the protuberance (being arranged on the protuberance of the opposition side of water feed mechanism) of sparking electrode.

And, the mist that will generate by protuberance in storeroom is vegetable compartment or the refrigerating chamber internal spraying get final product.In addition, dispose refrigerating chamber 2, vegetable compartment 5 on the top of refrigerator, bottom in refrigerating chamber 2, vegetable compartment 5 has refrigerating chamber 4, refrigerating chamber is configured near the back side of refrigerating chamber 2 with cooler, refrigerating chamber is configured near the back side of refrigerating chamber 4 with cooler, in such refrigerator, also can will supply with near the sparking electrode of water (for example defrost water) back side that is arranged on refrigerating chamber 2 or vegetable compartment 5 of cooler and produce mist from refrigerating chamber, and mist will be supplied with in refrigerating chamber 2 or in the vegetable compartment 5 via porous materials such as felt etc.Under this situation, just defrost water can be utilized,, therefore refrigerator cheaply can be accessed so do not need cooling body just can access dew owing to need not require great effort especially.

In addition, at first storeroom is that the storeroom of the temperature band above freezing of higher temperatures is a vegetable compartment 5, second storeroom is that the storeroom of temperature band above freezing is under the situation of refrigerating chamber 2, be temperature than the low storeroom of described first storeroom at the 3rd storeroom be that the storeroom of zubzero temperature band is under the situation of refrigerating chamber 4, second storeroom is that refrigerating chamber 2 is configured in top, thereunder disposing the 3rd storeroom is refrigerating chamber 4, disposing below the 3rd storeroom under the situation that first storeroom is a vegetable compartment 5, dispose sprayer unit in the partition wall between first storeroom and the 3rd storeroom, make the water feed mechanism one distolateral be that refrigerating chamber 4 sides of low temperature penetratingly dispose to the 3rd storeroom, perhaps distolateral being configured in the partition wall and at the 3rd storeroom with the water feed mechanism is on the partition wall wall of refrigerating chamber 4 sides of low temperature, and the storeroom that will be configured in higher temperatures with another distolateral sparking electrode that is connected (for example protuberance) of water feed mechanism is vegetable compartment 5 sides, thus, the cold air that can utilize refrigerating chamber 4 is directly or via the wall of partition wall cooling water feed mechanism one distolateral indirectly, therefore can utilize the temperature difference of refrigerating chamber 4 and vegetable compartment 5, so, even without special effort, also can not need cooling body ground to make sparking electrode (for example main part) produce dew, therefore can access refrigerator cheaply by the water feed mechanism.

In addition, distolateral being configured in the water feed mechanism to having the cooler chamber that is arranged near the evaporimeter (cooler) 200 the storeroom back side, wall or the inside that storeroom is carried the cooling air duct of cold air, the storeroom that will be configured in higher temperatures with another distolateral sparking electrode that is connected of water feed mechanism is vegetable compartment 5, refrigerating chamber 2 sides, thus, the cold air that can utilize cooler chamber, cooling air duct is cooling water feed mechanism one distolateral directly or indirectly, therefore can utilize the temperature difference of refrigerating chamber 4 and vegetable compartment 5.Therefore,, also can not need cooling body ground to obtain dew, therefore can access refrigerator cheaply at sparking electrode (for example main part of sparking electrode) even without requiring great effort especially.

In the present embodiment, also can promptly for example between the back side 71 of the back side of refrigerating chamber 2 and control substrate box 70A the sprayer unit main body be set at first storeroom, the sprayer unit main body also can be arranged on other place different second storeroom (for example vegetable compartment 4) of first storeroom (for example refrigerating chamber 2) of the back side that is arranged on control substrate box 70A (for example with), and nozzle to the first storeroom internal spraying is set at the back side of control substrate box 70A, mist is carried or the mist of guiding is carried wind path to nozzle.Perhaps, also sprayer unit can be arranged in the Machine Room 60 or in the Machine Room 60 on the back side or side of set control substrate box 70.

The 71 different places at the back side that the sprayer unit main body is arranged on and controls substrate box 70A are (for example with the different position, the back side of control substrate box 70A, perhaps with different second storeroom (for example vegetable compartment 5) of first storeroom (for example refrigerating chamber 2) that is arranged on the back side of controlling substrate box 70), and nozzle to the first storeroom internal spraying is set at the back side of control substrate box 70A, mist is carried under the situation of wind path to the mist of nozzle guiding or conveying, connect sprayer unit main body and nozzle and get final product to the first storeroom internal spraying from nozzle, described sprayer unit main body is for example passed through the conduit of encirclement on every side or flexible pipe etc. are constituted mist conveying wind path, and being set at the first storeroom back side or the second storeroom back side, described nozzle is set between the back side of the first storeroom back side and control substrate box 70.Here, the back side 71 at control substrate box 70A, be provided with nozzle as optional feature to the storeroom internal spraying, mist is carried wind path to the mist of nozzle guiding or supply, the cold air that will be generated by evaporimeter (cooler) 200 is under the situation of cooling air duct that storeroom is carried etc., if heat-barrier material (vacuum heat insulation material for example is set between the back side of control substrate box 70A and optional feature, materials such as polyurethane heat-barrier material), then can reduce control substrate box 70A is cooled and the possibility of dewfall, therefore, electronic unit in the control substrate box 70A (for example wide bandgap semiconductor parts 11 etc.) does not have fault, obtains the equipment of the high refrigerator of reliability etc.Therefore, can make simple in structure and do not reduce volume in the storeroom, effectively utilize the space at the control substrate box 70A back side, can access the high equipment such as high performance refrigerator of design freedom.

Here, for example, also can be via backflow wind path, to a plurality of storerooms sprayings from first storeroom or second storeroom to the backflow wind path of cooler chamber or backflow wind path from first storeroom to second storeroom or the 3rd storeroom from first storeroom to other.Under this situation, if carry at least a portion of wind path or at least a portion of backflow wind path to be arranged on the back side 71 of controlling substrate box 70A across heat-barrier material the mist of spraying (for example vacuum heat insulation material), then can make simple in structure and do not reduce volume in the storeroom, can effectively utilize the dead angle at the control substrate box 70A back side 71.And, can be prevented control substrate box dewfall, mist carries the configuration free degree high performance refrigerator that increase, that design freedom is high of wind path and backflow wind path.

Here, describe about the situation that sprayer unit is used for air conditioner.Sprayer unit is used under the situation of air conditioner, it is arranged in the indoor set indoor set main body gets final product.Under this situation, air conditioner has: be arranged on indoor indoor set main body; Air suction inlet, it is arranged on front surface top, end face or the side of indoor set main body; Filter, it is arranged on the downstream of air suction inlet; Indoor heat exchanger, it is arranged on the downstream of filter; The air blow-off outlet, it will blow out to indoor from the air suction inlet inhaled air; Air Blast fan, it is arranged on the downstream of indoor heat exchanger and between indoor heat exchanger and air blow-off outlet, will carries to the air blow-off outlet in the downstream that is arranged on indoor heat exchanger via indoor heat exchanger from the air suction inlet inhaled air; The indoor set drain pan, it receives the water (drain water) that is generated by indoor heat exchanger; Control substrate 7, it is equipped with the semiconductor device 11 of driver parts such as driving control Air Blast fan or wind direction board; Take in the control substrate box 70 of control substrate 7; The mist device, it is arranged on the top of indoor set drain pan between filter and indoor heat exchanger, and generates mist.Sprayer unit has: sparking electrode, and it is supplied to water attached to the surface by capillarity; Comparative electrode, itself and sparking electrode are set up with having predetermined distance; The electrode maintaining part that keeps sparking electrode; The water feed mechanism, it supplies with water to the sparking electrode that is kept by the electrode maintaining part, the mist device generates mist by applying voltage to sparking electrode, be configured in the downstream of filter and be formulated in the top of indoor set drain pan, will being fed into unnecessary water in the water of sparking electrode by the water feed mechanism, to be discharged to the indoor set drain pan also passable.

And, if the semiconductor device 11 that carries on control substrate 7 adopts wide bandgap semiconductor, and can the back side or the side that substrate box 70 be installed in the indoor set drain pan will be controlled removably, then can be delivered to the indoor set drain pan, and the water efficient that is trapped in the indoor set drain pan is evaporated well by the heat that wide bandgap semiconductor produces.In addition, owing to will be discharged to the indoor set drain pan by the unnecessary water that the water feed mechanism supplies in the water of sparking electrode, so need not be fed into the unnecessary water in the water of sparking electrode by the water feed mechanism and the water receiving portion is set in addition in order to receive, cost reduces, can also cut down components number, assembleability also improves.

In addition, also sprayer unit can be configured in air conditioner indoor set air suction inlet the downstream and near air suction inlet, at the upstream side of the air blow-off outlet of the indoor set of air conditioner nozzle is set via the air supply path of conduit or flexible pipe etc.Here, also nozzle can be also used as the air blow-off outlet, nozzle be provided with, to the inside opening ground of air supply path or air blow-off outlet from of the indoor spraying of air blow-off outlet to air blow-off outlet institute opening.Like this, at least the sprayer unit that has water feed mechanism and sparking electrode is configured near the downstream or air suction inlet of air suction inlet of indoor set of air conditioner, via will around guiding is generated by sprayer unit in the air wind path of the conduit that surrounds etc. mist and (for example to the place different with the position that disposes sprayer unit, in the air supply path of the upstream side of the indoor or air blow-off outlet of the air blow-off outlet institute opening of indoor machine of air conditioner etc.) spraying, therefore, at least the sprayer unit that has sparking electrode and comparative electrode, increase with the free degree of the mist that is used for to generate by sprayer unit to the allocation position of the spraying portion (nozzle) of indoor spraying, owing to can spray, so the free degree of design improves in the place that will spray.

(the control substrate box is to the setting of end face)

More than, introduced about controlling the example of refrigerator that substrate 7A, control substrate box 70A are arranged on the type of the top, the back side of refrigerator 1 or back side substantial middle, here, describe about controlling the situation that substrate 7A, control substrate box 70A be arranged on the end face of refrigerator 1.

Figure 17 is configured near the control substrate under the situation of end face of refrigerator 1 main position cutaway view with control substrate 7A, Figure 17 (a) is that the control substrate with refrigerator of the present invention is configured in the main position cutaway view under the situation of end face, and Figure 17 (b) is that the control substrate with in the past refrigerator is configured in the main position cutaway view under the situation of end face.In Figure 17, the Reference numeral that the part mark identical with Fig. 1～Figure 16 is identical also omits explanation.

In Figure 17 (b), control substrate 7A, control substrate box 70A are set at the rear of the end face 151 of refrigerator 1.Shown in Figure 17 (b), in refrigerator 1 in the past, because the semiconductor element of the frequency conversion drive circuit block of control appliance etc. adopts silicon (Si), so the thickness of frequency conversion drive circuit block 11 is thick, in addition, heat resisting temperature is low, therefore big radiator 12 need be set, need make semiconductor device 11 is that the thickness that frequency conversion drive circuit block and radiator 12 add up to becomes big, and therefore, the thickness of control substrate box 70A also becomes big.Therefore, with the size of control substrate box 70A and shape matchingly, interior case 101 is given prominence to (stretching out) to case inboard (storeroom 2 in).Therefore, the back side 71 of control substrate box 70A and the thickness of the heat-barrier material 80 between the interior case 101 become as thin as a wafer from the necessity that increases case internal capacity (storeroom volume) as far as possible, it is difficult being arranged on optional features such as radiating tube 9 or vacuum heat insulation material 10 between the back side 71 of control substrate box 70A and the interior case 101, and optional feature has been set at the part beyond the back side of control substrate box 70A.(optional feature is the side nearby that radiating tube 9 or vacuum heat insulation material 10 only are configured to control substrate box 70A, and nearby the turning back of control substrate box 70A, bending and avoid controlling 71 ground, the back side configuration of substrate box 70A.）

But, shown in Figure 17 (a), in the refrigerator of present embodiment, because semiconductor device 11 adopts wide bandgap semiconductor, so can make the thickness attenuation of control substrate box 70A, therefore optional feature can be configured between the back side 71 and interior case 101 of control substrate box 70A.In Figure 17 (a), control substrate 7A, control substrate box 70A are set at the rear side of the end face 151 of refrigerator 1 with respect to the front of refrigerator main body 1.In the present embodiment, because being semiconductor device 11, the control assembly of control appliance adopts wide bandgap semiconductor, so can reduce the semiconductor device 11 of frequency conversion drive circuit block etc., the thickness of radiator 12, so can also reduce to control the thickness of substrate box 70A, suppress the height of refrigerator lower.And the caloric value of wide bandgap semiconductor also tails off, and therefore can also significantly reduce radiator 12.Therefore, the height of frequency conversion drive circuit block 11 peripheries can be suppressed to the height degree of miscellaneous part, can realize the increase of case internal capacity or the miniaturization of equipment.

In addition, in the refrigerator of the embodiments of the present invention shown in Figure 17 (a), because without image pattern 17(b) shown in the control substrate box 70A of refrigerator in the past control substrate 7A is tilted with respect to the end face 151 of refrigerator 1, and can roughly be provided with side by side, so can significantly reduce to control the accommodation space of substrate box 70A with the end face 151 of refrigerator (approximate horizontal).Therefore, in also not needing outstanding (the stretching out) of case 101, can also significantly increase the volume (taking in volume) of storeroom.

Here, in refrigerator 1 in the past, because the height (depth) of the accommodation space in the control substrate box 70A of semiconductor device 11 peripheries of needs increase frequency conversion drive circuit block etc., the interior case 101 outstanding (stretching out) at the control substrate box 70A back side is that the case internal capacity increases part 83 to ledge, so the compartment interior volume diminishes, in addition, owing to be provided with control substrate box 70A, be difficult so optional feature etc. is set in heat-barrier material thickness increasing portion 85.But, because the control substrate 7A of embodiments of the present invention, control substrate box 70A adopts wide bandgap semiconductor and can make the thickness attenuation, so can guarantee that it is that the case internal capacity increases part 83 that the space has more ledge, the space of the amount of the volume of heat-barrier material thickness increasing portion 85, so, can not dispose control substrate 7A obliquely with respect to the end face 151 of refrigerator main body 1 yet, control substrate box 70A, and roughly be provided with side by side with respect to the end face 151 of refrigerator 1 (approximate horizontal), therefore the accommodation space of simple structure, and control substrate box 70A also can significantly reduce.And interior case 101 need not stretch out in storeroom is refrigerating chamber 2, so can enlarge the food amount of taking in that storeroom is a refrigerating chamber 2.

In addition, owing to can reduce the height H of control substrate box 70A, so, because inwardly the overhang reduction 83(case internal capacity of the case inboard of case 101 increases part 83), the height H step-down of control substrate box 70A can also reduce and the heat-barrier material thickness increasing portion 85 that produces at the control of the heat-barrier material thickness increasing portion 85(between control substrate box 70A and the interior case 101 substrate box thickness) the volume increase part 83 that waits, 85 are provided with or configuration optional feature (functional part (sprayer unit for example, sterilizing unit, bactericidal device etc.), wind path parts (cooling air duct, mist is carried wind path, air quantity is adjusted, wind path switches the throttle setting of usefulness etc.), freeze cycle parts (radiating tube (condenser pipe), decompressor (expansion valve, capillary etc.), suction line etc.), miscellaneous part (vacuum heat insulation material, wiring, illuminace component (the case intraoral illumination of LED illumination etc. for example, warning etc., display lamp etc.))).

Like this, increase the above-mentioned optional feature of part 85 configurations by the heat-barrier material thickness (volume) that increases part 83 at the case internal capacity or be configured in the heat-barrier material on the end face at the back side 71 of control substrate box 70A, compared with the past, can not reduce case internal capacity ground and obtain additional function, can access therefore that usability is good for the user, the space service efficiency is also big and the high equipment such as refrigerator of cost performance.

In addition, if increase the heat-barrier material thickness increasing portion 85 at part 83, the control substrate box back side at the case internal capacity optional feature is set, realize the function of appending of optional feature with then can not reducing case internal capacity (storeroom take in volume), perhaps the part configuration miscellaneous part of optional feature can disposed, thereby can not reduce the use of compartment interior volume ground and append function, space efficiency improves, and obtains the good refrigerator of usability for the user.In addition, the heat-barrier material thickness increasing portion 85 that increases part 83, the control substrate box back side at the compartment interior volume is not provided with under the situation of optional feature, for with the refrigerator of identical in the past appearance and size, can increase the compartment interior volume, therefore can access space efficiency and improve, take in the equipment such as refrigerator that volume is big, usability is good.

In the present embodiment, shown in Figure 17 (a), slimming, miniaturization by control substrate 7A, control substrate box 70A also can realize slimming, miniaturization, so, the optional feature that in the past can only be set to the vacuum heat insulation material nearby 10, radiating tube 9 etc. of control substrate box 70A can be arranged on the back side (inboard) 71 of control substrate box 70A, therefore flat vacuum heat insulation material 10 ground can be do not bent directly with the tabular setting, the situation that the outsourcing material (packing timber) of vacuum heat insulation material 10 breaks because of bending can be suppressed to constitute.In addition, promptly control substrate 7 and refrigerating chamber 2 owing to can utilize high performance vacuum heat insulation material 10 to block heating portion, so also bring the reduction of power consumption.

In addition, can also be at the back side 71 of control substrate box 70A interruptedly the vacuum heat insulation material 10 on the end face 151 that is configured in refrigerator main body 1 be connected with vacuum heat insulation material 10 on the back side 152 that is configured in refrigerator main body 1, the vacuum heat insulation material that is configured on the end face 151 and the back side 152 can be set continuously, obtain the good equipment such as refrigerator of heat-proof quality.Here, also can dispose even be configured in the vacuum heat insulation material 10 on the end face 151 and be configured in the vacuum heat insulation material that the vacuum heat insulation material 10 on the back side 152 forms continuously, the free degree of the configuration of vacuum heat insulation material 10 improves, and obtains the equipment of refrigerator cheaply etc.In addition, also can dispose, therefore can access the equipment such as refrigerator that the free degree of low cost and design increases with vacuum heat insulation materials 10 of roughly 90 degree bendings.

As mentioned above, can access equipment such as following refrigerator, air conditioner, equipment such as this refrigerator, air conditioner have: the compressor 6 that is linked in sequence, radiating tube 9, expansion gear 62, cooler 200, suction line 63 and the freeze cycle that constitutes; Heat insulating box (perhaps refrigerator main body), it disposes heat-barrier material 80 between interior case 101 and outer container 102, and the front surface side has a plurality of storerooms (for example refrigerating chamber 2, switching chamber 3, ice-making compartment 35, refrigerating chamber 4, vegetable compartment 5 etc.); Machine Room 60, it is arranged on the top or the bottom at the back side 152 of heat insulating box (perhaps refrigerator main body), and has taken in compressor 6; Control substrate box 70A, it is arranged on the back side 152, end face 151 or the lower surface (bottom surface) of heat insulating box (perhaps refrigerator main body), and takes in the control substrate 7A that drives driver parts such as control compressor 6; Carried the semiconductor device 11 of transistor on control substrate 7A, diode etc.Semiconductor device 11 adopts SiC, the wide bandgap semiconductor of GaN etc., therefore, can make semiconductor device 11 or control substrate 7A miniaturization (also can make semiconductor device 11 and control substrate 7,7A both sides' miniaturization), and at the back side 71(of control substrate box 70A or also can be in the side, upper surface, at least one wall in the surrounding wall beyond the peristome of the control substrate box 70A of bottom surface etc.) the configuration optional feature (for example, vacuum heat insulation material 10, radiating tube 9, suction line 63, expansion gear 62, sprayer unit, mist is carried wind path, cooling air duct (comprising the backflow wind path), throttle setting etc.), therefore, unnecessary ground, space can be set have the function of appending, obtain having the function of appending with need not changing size and volume.In addition, in having used the semi-conductive control substrate in the past of Si, 70A is big and highly high for the control substrate box, therefore can not dispose optional feature at the back side 71 of control substrate box 70A, and the present invention can dispose such optional feature, can effectively utilize the space and obtain and append function, can also realize the miniaturization of equipment.

Here, semiconductor device 11 adopts SiC, the wide bandgap semiconductor of GaN etc., therefore, can make semiconductor device 11 or control substrate 7A miniaturization (also can make semiconductor device 11 and the 7 both sides' miniaturizations of control substrate), at height by reduction control substrate box 70A, size is (vertical, horizontal width, length) back side 71(of the control substrate box 70A that produces or also can be in the side, upper surface, the increase part 83 in space at least one wall in the surrounding wall beyond the peristome of the control substrate box 70A of bottom surface etc.), 85(for example reduce the height of control substrate box 70A and expansion in the storeroom that produces the space, remaining space is that the case internal capacity increases part 83, perhaps the expansion that produces in the heat-barrier material 80 the space, remaining space is a heat-barrier material thickness increasing portion 85 etc.) configuration optional feature get final product.Under this situation, in having used the semi-conductive control substrate in the past of Si, 70A is big and highly high for the control substrate box, and can not dispose optional feature at the back side 71 of control substrate box 70A, but the present invention can dispose such optional feature, therefore can effectively utilize space and acquisition to append function, can realize effective utilization in limited space.In addition, can also realize the miniaturization of equipment.

Here, because control substrate box 70A can miniaturization or attenuation, so control substrate box 70A can be configured in the wall of side of the refrigerator main body 1 that can not dispose, in the heat-barrier material or in the dividing plate 8 in the past, therefore, in the heat-barrier material 80 at the back side that is arranged on refrigerator main body 1, produce remaining space, so can realize the increase of case internal capacity or the configuration of optional feature etc., effective utilization that can also the implementation space.

Therefore, according to the embodiment of the present invention, the semiconductor device 11 of control appliance adopts wide bandgap semiconductor, can reduce the thickness or the size of semiconductor device 11 thus, and can reduce

control substrate

7,7A or the control substrate 7 that is equipped with semiconductor device 11, the control substrate box 70 that 7A takes in, the height (depth) of 70A, therefore can reduce to control the space that is provided with of substrate box 70,70A.In addition, owing to can reduce to control the height of

substrate box

70,70A, so can be at optional features such as the back side of

control substrate box

70,70A 71 configuration radiating tubes 9 or vacuum heat insulation materials 10, have the function of appending so ground, unnecessary space can be set, obtain having the equipment such as refrigerator, air conditioner of the function of appending with can not changing the size of equipment body or volume.

In addition, equipment is under the situation of refrigerator 1, owing to can make

control substrate

7,7A,

control substrate box

70,70A slimming, miniaturization, so, case 101(Machine Room 60 is too under the big influence of the height of

control substrate box

70,70A) for example (storeroom) side-prominent ledge (the overhang reduction to the case inboard of case for example) is that case internal capacity increase part 83 becomes unwanted part in case, therefore, even change the increase that outer shape etc. also can realize the case internal capacity not significantly.In addition, owing to the control back side of substrate box and the insulated space between the storeroom (for example control substrate box thickness and reduce the heat-barrier material thickness increasing portion that produces) are that at least a portion of heat-barrier material thickness increasing portion 85 becomes excess room, so can optional features such as radiating tube, vacuum heat insulation material be set in this excess room, can not reduce case internal capacity ground and obtain to append function.

(vacuum heat insulation material is to the stickup of control substrate box)

Here, at Fig. 4, Figure 13, among Figure 14 etc., show at vacuum heat insulation material 10 and control substrate box 70, exist predetermined gap (at vacuum heat insulation material 10 and control substrate box 70 between the back side 71 of 70A, there is the space between the 70A), and the polyurethane foam heat-barrier material is filled into structure in this predetermined gap, but also can at least one face of the outsourcing material of vacuum heat insulation material 10, use the composite membrane that has been equipped with aluminium foil, with the outfit of the outsourcing material of vacuum heat insulation material 10 the multilayer film side of aluminium foil directly paste control substrate box 70, the back side 71 of 70A.In addition, even the two sides all is the film that is made of the aluminium-vapour deposition layer, also one side directly can be sticked on the back side 71 of control substrate box 70,70A.Here, multilayer film is made of sealer, intermediate layer, hot sealing layer etc.By like this vacuum heat insulation material 10 directly being sticked on the back side of control substrate box 70,70A, do not need the polyurethane heat-barrier material, so the predetermined gap between the back side 71 of vacuum heat insulation material 10 and control substrate box 70,70A diminishes, be difficult to filled polyurethane (polyurethane is difficult to flow into predetermined gap), the possibility that thermal insulation reduces disappears.

In addition, the stepped construction of the multilayer film that disposes on the multilayer film of the outsourcing material that disposes on the face of the duplexer (core) of the vacuum heat insulation material 10 of formation sheet (tabular) and another face of duplexer can be different, the multilayer film of a face has aluminium foil in the intermediate layer, and the intermediate layer of the multilayer film of another face enforcement aluminium-vapour deposition also can.Under this situation, by with the outfit of outsourcing material the multilayer film side of aluminium foil be configured in the back side of control substrate box 70,70A or side etc., cause the temperature of vacuum heat insulation material 10 to rise even become the heat of control substrate box 70, the 70A of high temperature side, also can suppress gas and enter the heat-proof quality that causes and reduce.In addition, adopt the situation of aluminium foil to compare with the multilayer film on the two sides that is configured in duplexer, the intermediate layer that is configured in the multilayer film on the face of duplexer has aluminium foil, and implement under the situation of aluminium-vapour deposition in the intermediate layer that is configured in the multilayer film on another face, can reduce heat from being configured in multilayer film on the face, so heat-proof quality improves to the multilayer film transmission of aluminium-vapour deposition that has been configured in enforcement on another face with aluminium foil.So, with the outfit of outsourcing material the multilayer film side of aluminium foil be configured in the back side of control substrate box 70,70A or side etc., heat-proof quality improves.That is, compare with the storeroom side, the rear side of control substrate box 70,70A becomes high temperature, therefore, is disposed under the situation of high temperature side in the multilayer film side that is equipped with aluminium foil with outsourcing material, and heat-proof quality improves.In addition, all use under the situation of the multilayer film of having implemented aluminium-vapour deposition on the two sides, can reduce heat transmission, thereby heat-proof quality improves.

Therefore, obtain heat-proof quality height, equipment such as refrigerator that reliability is high.In addition, can also before being the assembling of refrigerator 1, equipment in advance vacuum heat insulation material 10 be pasted on

control substrate box

70,70A, so assembleability improves, and do not need vacuum heat insulation material 10 and the location of controlling

substrate box

70,70A, so can also reduce built-up time.

More than, be illustrated about the example that vacuum heat insulation material 10 is directly sticked on the back side of controlling substrate box 70,70A, but the stickup place of vacuum heat insulation material 10 or position also can be or not the back sides of controlling substrate box 70,70A, also can be at least one wall in the surrounding wall beyond the peristome of control substrate box 70,70A (outside of preferred wall, but also can be the inboard of wall).To control substrate box 70,70A is arranged under the state in the equipment of refrigerator 1 grade, directly stick on surrounding wall beyond the peristome (Fig. 4 for example, shown in Figure 13, be arranged under the situation of top of compressor set in the Machine Room 60 6 towards the mode of the upper surface side of refrigerator 1 or front surface side with the peristome of control substrate box 70 with will controlling substrate box 70 approximate horizontal, refer to control substrate box 70 peristome around 4 side walls and underside wall, in addition, to control substrate box 70A with peristome towards the mode of the rear side of refrigerator 1 generally perpendicularly is arranged under the situation at the back side that equipment is refrigerator 1, refer to 4 side walls (upper surface walls on every side of the peristome of control substrate box 70A, side walls, underside wall) and back face wall, shown in Figure 11 (a), be arranged under the situation of upper surface that equipment is refrigerator 1 towards the mode of the upper surface side of refrigerator 1 with peristome with will controlling substrate box 70A approximate horizontal, refer to control substrate box 70A peristome around 4 side walls and underside wall.), also can access same effect.

(other equipment)

Here, in equipment such as air conditioner, refrigeration machine, water heater, washing machine, has the freeze cycle that be linked in sequence by pipe arrangement expansion gear 62, evaporimeters 200 such as condenser, capillary such as compressor 6, radiating tube 9 constitute, be under the situation of air conditioner, refrigeration machine, compressor is carried on off-premises station, is under the situation of water heater, and compressor is carried on heat source machine, be under the situation of washing machine, compressor is equipped on main body.Under this situation, equipment has: the main body of equipment, the main body of described equipment are main bodys that disposes by the off-premises station main body of compressor 6, heat source machine main body, washing machine etc.; Control substrate box 70,70A, it is arranged on the top (perhaps the place ahead, side, rear) of compressor 6, and takes in control substrate 7, the 7A that drives control compressor 6; The semiconductor device 11 of frequency conversion drive circuit block etc., it carries on control substrate 7,7A, is made of the transistor that the action of equipment is controlled, diode etc.; The cooling fan that is used for cooling compressor etc.Because semiconductor device 11 adopts wide bandgap semiconductor, therefore can make semiconductor device 11, control substrate 7, the 7A miniaturization (also can make semiconductor device 11 and control substrate 7,7A both sides' miniaturization), so can be at control substrate box 70, the back side of 70A (perhaps also can be at control substrate box 70, the side of 70A, upper surface, around bottom surface etc. the control substrate box) and compressor 6 between remaining space, the space that has enlarged, (for example radiating tube 9 for the configuration optional feature, suction line 63 pipe arrangements such as grade, vacuum heat insulation material 10, cooling fan 68, acoustic material, memory, muffler etc.), therefore, in having used the semi-conductive control substrate of Si in the past like that, at control substrate box 70, can not dispose optional feature on the back side of 70A, and the present invention can dispose such optional feature, can effectively utilize the space in the limited framework, and obtain to append function, can also realize the miniaturization of equipment.

Here, can also be before equipment be the assembling of air conditioner, water heater, washing machine etc., in advance vacuum heat insulation material 10 is pasted on

control substrate box

70,70A, therefore assembleability improves, and, do not need the location of vacuum heat insulation material 10 and

control substrate box

70,70A, can also reduce built-up time.

According to the present invention, the semiconductor element that equipment is driven control adopts wide bandgap semiconductor, thus, can be at the back side of control substrate box, dispose the optional feature of radiating tube or vacuum heat insulation material etc. on every side, therefore unnecessary ground, space can be set obtain to append function.In addition, can reduce the thickness of semiconductor element, and can reduce the height (depth) of control substrate that is equipped with semiconductor element and the control substrate box of taking in the control substrate, therefore can reduce to control the space that is provided with of substrate box.In addition, owing to can reduce to control the height of substrate box, so can be at optional features such as the back side of control substrate box configuration radiating tube or vacuum heat insulation materials, obtain to append function so ground, unnecessary space can be set, obtain having the equipment such as refrigerator, air conditioner of the function of appending with can not changing size or volume.

In addition, at equipment is under the situation of refrigerator, owing to can make control substrate, the slimming of control substrate box, miniaturization, so, case side-prominent ledge in case disappears under the big influence of the height of control substrate box, therefore can realize the increase of case internal capacity.In addition, because that the control back side of substrate box and the insulated space between the storeroom have is more than needed,, therefore, obtain appending function so can optional features such as radiating tube, vacuum heat insulation material be set in this excess room with can not reducing the case internal capacity.

Here, in equipment such as the refrigerator of present embodiment, air conditioner, have: Machine Room 60, it is arranged at the equipment body that the heat source machine main body of off-premises station main body, water heater of indoor set main body, the air conditioner of refrigerator main body 1, air conditioner or body of the washing machine etc. have freeze cycle, disposes the compressor 6 that constitutes freeze cycle; Control substrate 7, it is arranged in the Machine Room 60, carries out the control of compressor 6; The second control substrate 7A, it is arranged on outside the Machine Room 60, carries out the control control in addition of compressor 6.The semiconductor element of lift-launch on described control substrate 7 adopts wide bandgap semiconductor, and the semiconductor element of lift-launch on the second control substrate 7A can use Si semiconductor in the past.Like this,, consider the cost advantage, use wide bandgap semiconductor and Si semiconductor in the past respectively, can access high function and compressor, equipment cheaply according to the size of environment for use, control electric current.(for example require under the situation of heat-resisting ability, processing speed etc., there are heaters such as compressors such as Machine Room and become the place of hot environment, perhaps as the control of compressor, require the situation of processing speed etc.), though cost height, but use wide bandgap semiconductor, in the place that does not require heat-resisting ability, processing speed etc. (for example, the place etc. that does not have other heat generating components) uses cheaply in the past Si semiconductor, can be met the high compressor of necessary function, low cost and reliability, equipment.

(effect etc.)

As mentioned above, equipment such as the refrigerator of present embodiment, air conditioner have: Machine Room 60, it is arranged on the heat source machine main body of off-premises station main body, water heater of indoor set main body, the air conditioner of refrigerator main body 1, air conditioner or body of the washing machine etc. has on the equipment body of freeze cycle, disposes the compressor 6 that constitutes freeze cycle; Control substrate 7, it is arranged in the Machine Room 60, is equipped with the wide bandgap semiconductor of the control of carrying out compressor 6; The second control substrate 7A, it is arranged on outside the Machine Room 60, and carries out the control control in addition of compressor 6.Therefore, can be according to the allocation position of the selected control of control object substrate, so the free degree of design improves.In addition, the semiconductor device 11 that the compressor that is configured in the Machine Room 60 that becomes high temperature is controlled adopts wide bandgap semiconductor, the control substrate 7 that is equipped with this wide bandgap semiconductor is configured in the Machine Room 60, thereby the thicker expensive power supply lead wire that connects control substrate 7 and compressor 6 is shortened, thereby cost reduces, in addition, can also suppress the generation of the electromagnetic noise that causes by power supply lead wire.

In addition, at least one side among the control substrate 7 and the second control substrate 7A has the information transmit-receive member of the antenna that can receive and send messages etc., if the giving and accepting of control signal of the control substrate 7 and the second control substrate 7A carried out in non-contacting mode by electromagnetic waves such as wireless or infrared rays, then do not need to connect the connecting line of giving and accepting that carries out control signal between the control substrate 7 and the second control substrate 7A, therefore can access low-cost device.In addition, owing to there is not connecting line, so do not need the coiling of the connecting line in the consideration equipment in the mode (processing) of equipment or fixed form etc., in addition, owing to do not need on framework, dividing plate or the heat-barrier material etc. of equipment body, to offer the hole, so the simple structure of obtaining and low-cost device for the coiling connecting line.In addition, if also have the power information transmitting-receiving mechanism of the antenna that can receive and dispatch electric power etc., then can also carry out the transmitting-receiving of electric power.

In addition, have: operating portion, it is arranged on outside the Machine Room of main body, and design temperature and the duration of runs etc. is indicated; Second control substrate, it is arranged on outside the Machine Room of main body, and be arranged on operating portion near.Under the operated situation of operating portion, control substrate from the control signal of operating portion from second and send to the control substrate, the connecting line of the attended operation portion and the second control substrate 7A is shortened in non-contacting mode.In addition, if with the second control substrate setting operation portion integratedly, then can cancel connecting line.In addition, if between the control substrate 7 and the second control substrate, implement in non-contacting mode by wireless or infrared ray etc., connecting line then is not set can controls giving and accepting of control signal between the substrate 7 and the second control substrate 7A or electric power yet, do not need the processing of wiring and the fixing of wiring of equipment body, obtain the good equipment of low cost and aesthetic appearance.

In addition, if the control substrate 7 or the second control substrate 7A have the power information transmitting-receiving mechanism that can receive and dispatch electric power and information, between the control substrate 7 and the second control substrate 7A, can realize the transmitting-receiving of electric power, then main power source (for example source power supply 400) only connects or any one party that supplies among the control substrate 7 or the second control substrate 7A get final product, so can access simple structure and low-cost device.

In addition, have and compare the little device of control electric current with the operating current of compressor, described device have for the heat source machine main body of the off-premises station main body of the indoor set main body that is arranged on refrigerator main body 1, air conditioner, air conditioner, water heater or body of the washing machine etc. freeze cycle equipment body, to the sprayer unit of indoor spraying or to the indoor bactericidal device that carries out degerming etc. by applying actuator, display unit or the lighting device etc. that voltage is worked.Carry out the driving control of compressor 6 by near the control substrate 7 that is arranged on compressor 6, the second control substrate that is configured in than the position of controlling substrate 7 more close devices carries out the control of device, then can with the control of control object in perhaps control the selected matchingly control of electric current substrate 7, the size of the second control substrate and the kind of semiconductor chip etc., in addition, the allocation position of control substrate 7, the second control substrate also can be set matchingly with the shape or the space of equipment body.Therefore, obtain the big equipment of the free degree that designs.

In addition, have: the front surface opening also has the heat insulating box (perhaps refrigerator main body 1) of a plurality of storerooms; Be arranged on the Machine Room 60 at the back side of heat insulating box; Control substrate 7 has carried wide bandgap semiconductor as the semiconductor device 11 that drives control compressor 6.Compressor 6 is configured in the Machine Room 60, control substrate 7 is arranged near the terminal box 601 of or the compressor 6 of compressor 6, then disposing compressor 6 and becoming in the Machine Room 60 of hot environment, also can carry with the wide bandgap semiconductor of processing speed work at a high speed on control substrate 7, therefore, even in the Machine Room 60 that becomes high temperature, semiconductor can not break down yet, processing speed can not reduce yet, and can control compressor 6.

In addition, in the present embodiment, have: main body (for example off-premises station of refrigerator main body 1 or refrigeration, aircondition (heat source machine that comprises hot water apparatus) etc.); Machine Room 60, it is arranged in the main body 1 or described main body 1 back side, and disposes the compressor 6 that constitutes freeze cycle with cooler 200; Drain pan 660, it is arranged in the Machine Room 60, and accepts the defrost water of cooler 206; Control substrate 7, it is equipped with the semiconductor device 11 that drives control compressor 6; Take in the control substrate box 70 of control substrate 7.Semiconductor device 11 adopts wide bandgap semiconductors such as SiC, GaN, semiconductor device 11 or control substrate 7 or control substrate box 70 are installed in the back side or the side of drain pan 660, therefore can access simple in structure, can be configured in semiconductor device 11, control substrate 7, control substrate box 70 in the Machine Room 60 and the heat that semiconductor device 11 sends can be used to make the equipment such as refrigerator, refrigerating air conditioning device, water heater of water (drain water) evaporation in the drain pan 660.In addition, for carrying out the evaporation of water in the drain pan 660, can and use with heater blocks such as heater, radiating tubes, do not need heater block newly to be set for the drain water evaporation, in addition, for carrying out the evaporation of water in the drain pan 660, the heat that can utilize semiconductor device 11 to send is so can access the equipment such as refrigerator that can improve the evaporation efficiency in the drain pan 660.In addition, make at the heat that can utilize semiconductor device 11 to send under the situation of drain water evaporation, can also heater block be set, obtain low-cost device.

In addition, have: refrigerator main body 1, its front surface side have a plurality of storerooms 2,3,4,5,35 that marked off by partition wall; Cooler 200, it is configured in the cooler chamber at the back side of refrigerator main body 1, generates the cold air of supplying with to a plurality of storerooms; Box fan, it is arranged on the cooler chamber, and will be supplied with to a plurality of storerooms via air supply path by the cold air that cooler 200 generates; Machine Room 60, it is arranged on the lower backside of refrigerator main body 1 upper rear portion or refrigerator main body, and disposes the compressor 6 that constitutes freeze cycle with cooler 200; Drain pan 660, it is arranged on the below of cooler 200, accepts the defrost water of cooler 200; Control substrate 7, it is equipped with the semiconductor device 11 that drives control compressor 6; Take in the control substrate box 70 of control substrate 7.Semiconductor device 11 adopts wide bandgap semiconductor, semiconductor device 11 or control substrate 7 are installed in the back side or the side of drain pan 660, so can access refrigerator simple in structure and that the heat that semiconductor device 11 sends can be used to make the water (drain water) in the drain pan 660 to evaporate.In addition, for carrying out the evaporation of water in the drain pan 660, can and use with heater blocks such as heater, radiating tubes, do not need heater block newly to be set for the drain water evaporation, in addition, for carrying out the evaporation of water in the drain pan 660, therefore the heat that can utilize semiconductor device 11 to send can access the equipment such as refrigerator that can improve the evaporation efficiency in the drain pan 660.In addition, make at the heat that can utilize semiconductor device 11 to send under the situation of drain water evaporation, can also heater block be set, obtain low-cost device.

In addition, the semiconductor device 11 of control appliance adopts wide bandgap semiconductor, therefore semiconductor device 11, control substrate 7 can be configured near the compressor 6 in the Machine Room 6 or the terminal box 601 of compressor 6, therefore can shorten the length of compressor control lead-in wire, and reduce noise.In addition, the semiconductor device 11 of control appliance adopts wide bandgap semiconductor, thereby the control substrate can be configured in drain pan 660 in the Machine Room 60 near, thereby can shorten the length of compressor control lead-in wire, obtain equipment such as compressor, refrigerator, air conditioner cheaply.

In addition, if drain pan 660 is arranged in the Machine Room 60 and above compressor 6, then can utilize the air of the heat heating that the compressor 6 by the waste that does not usually utilize sends to heat drain pan 660, thereby can make the water efficient such as drain water that are trapped in the drain pan 660 evaporate the heat that can effectively utilize compressor 6 to send well.In addition, by with wide bandgap semiconductor and usefulness, can make the water evaporation in the drain pan more efficiently.

In addition, if directly or can be installed in the top 6Y of compressor 6 removably with drain pan 660, then can utilize heat that the compressor 6 of the waste that does not usually utilize sends directly efficiently heating be trapped in water in the drain pan 660, the heat that can effectively utilize compressor 6 to send.Therefore, the heat that can utilize compressor 6 to send evaporates the water efficient in the drain pan 660 well.In addition, by with wide bandgap semiconductor and usefulness, can make the water evaporation in the drain pan more efficiently.

In addition, if control substrate box 70 is made of thermal conductive member, with semiconductor device 11 to fix with control substrate box 70 hot linked modes, and utilize the evolution of heat of 70 pairs of semiconductor devices 11 of control substrate box to dispel the heat, then adopt under the situation of wide bandgap semiconductor for example at semiconductor device 11, control substrate box 70 becomes the substitute of radiating fin, does not therefore need radiating fin, obtains compressor, equipment cheaply.

In addition, if semiconductor device 11 is connected with control substrate box 70 across the heat radiation auxiliary part 110 of electric insulation, then as compressor 6, outer shape is spherical, even protuberance is arranged, also can set the shape of heat radiation auxiliary part 110 according to the outer shape of drain pan 660 or compressor 6, the heat that semiconductor device 11 is sent is delivered to the water of controlling in substrate box 70, drain pan 660 or the drain pan 660 well via heat radiation auxiliary part 110 efficient, and the water efficient in the drain pan 660 are evaporated well.

In addition, if at least a portion in the bottom surface of drain pan 660 is provided with the drain water delay portion (for example recess) 665 of assembling for drain water, and drain water delay portion be provided with semiconductor device 11 or control substrate 7, then the water in the drain pan 660 concentrates on the ad-hoc location (for example position) as drain water delay portion, and the heat that can utilize semiconductor device 11 to send evaporates drain water efficient well.

In addition, if from drain pan 660 downwards or stretch out side, the outside or the outstanding portion that dewaters 670 at least a portion setting of the outer periphery at drain pan 660 back sides (control substrate 7 or control substrate box 70 around), even then the water in the drain pan 660 overflows outside drain pan 660, water yet can not enter or invade control substrate 7 or control substrate box 70, therefore can access the high equipment of reliability.

In addition, under the situation of the evaporation of water in the heat that wide bandgap semiconductor is sent is used for drain pan 660, if with drain pan 660 be configured in not with from the direct position contacting of the wind pushing air of compressor cooling fan 68 (for example drain pan 660 being configured in the upside of the wind of compressor cooling fan 68), then can the cooling of compressor 6 will nearly all be used for from the wind pushing air of compressor cooling fan 68, the temperature that therefore can suppress compressor 6 rises, and obtains the high compressor of reliability, equipment.Because the heat that wide bandgap semiconductor can be sent is used for the evaporation of water in the drain pan 660,, therefore can efficient carry out the cooling of compressor 6 well so do not need to utilize the wind pushing air of compressor cooling fan 68 that the water in the drain pan 660 is evaporated.In addition, owing to do not need to utilize the wind pushing air of compressor cooling fan 68 that the water in the drain pan 660 is evaporated, thus the not influence of the allocation position of machine cooling fan 68 by compression, so the free degree of the configuration of drain pan 660 improves.

Claims

1. compressor is characterized in that having:

Housing, described housing are taken in the compression mechanical part of compressed refrigerant and are driven the motor of described compression mechanical part rotation in inside;

The used for electric power connection terminal, described used for electric power connection terminal is arranged at described housing, is used for to described motor energising;

Terminal box, described terminal box is arranged at described housing, and covers at least a portion on every side of described used for electric power connection terminal;

The control substrate, described control substrate is equipped with the semiconductor device that drives the described motor of control;

The control substrate box, described control substrate box is taken in described control substrate,

Described semiconductor device uses wide bandgap semiconductor, and described control substrate box can be installed on described terminal box disassembled and assembled freely.

2. compressor as claimed in claim 1 is characterized in that, between described control substrate box and described terminal box every being provided with padded coaming.

3. compressor as claimed in claim 1, it is characterized in that, described control substrate box is made of thermal conductive member, to fix described semiconductor device with the hot linked mode of described control substrate box, utilizes described control substrate box that the heat that described semiconductor device sends is dispelled the heat.

4. compressor as claimed in claim 1 is characterized in that, described semiconductor device is connected in described control substrate box via heat radiation auxiliary part that can electric insulation.

5. compressor as claimed in claim 1 is characterized in that, described semiconductor device is a SiC(carborundum) or the GaN(gallium nitride).

6. equipment as claimed in claim 1 is characterized in that having: the Machine Room, and described Machine Room is arranged at main body, disposes described compressor; The second control substrate, the described second control substrate is arranged on outside the described Machine Room,

Utilize electromagnetic wave to carry out the giving and accepting of control signal of described control substrate and the described second control substrate.

7. equipment as claimed in claim 6, it is characterized in that, on main body, have the operating portion that the work of equipment is indicated, under the operated situation of described operating portion, will send to described control substrate from the described second control substrate from the control signal of described operating portion.

8. equipment as claimed in claim 6, it is characterized in that, on described control substrate or the described second control substrate, have the power information transmitting-receiving mechanism that to receive and dispatch electric power and information, can between described control substrate and the described second control substrate, carry out the transmitting-receiving of electric power.

9. equipment as claimed in claim 6, it is characterized in that, have by applying the actuator that voltage works or the little device of operating current of the described compressors of control current ratio such as display unit or lighting device, described actuator is to the sprayer unit of indoor spraying or to indoor bactericidal device that carries out degerming etc.

Described control substrate carries out the driving control of described compressor,

The described second control substrate carries out the control of described device.

10. refrigerator is characterized in that having: heat insulating box, and the front surface opening of described heat insulating box has a plurality of storerooms; The Machine Room, described Machine Room is arranged on the back side of described heat insulating box,

With the described compressor configuration of claim 1 in described Machine Room.

11. an equipment is characterized in that, is equipped with the described compressor of claim 1 in main body.