JP2012202612A - Refrigerator and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispose additional components such as a vacuum heat insulating material, and a heat radiating pipe on the back, the side face, the upper face, the bottom face and the like of a control board box while reducing the height or the size of a wide band gap semiconductor component or a control board by using a wide band gap semiconductor.SOLUTION: A refrigerator includes a machine chamber which is provided in an upper part or a lower part of the back of a heat insulating box body and in which a compressor is accommodated, a control board box which is provided on the back or the ceiling of the heat insulating box body and in which a control board controlling the compressor is accommodated, and a semiconductor component which is packaged on the control board. A wide band gap semiconductor is used for the semiconductor component and additional components such as a vacuum heat insulating material, a heat radiating pipe and the like are disposed on the back, the side face, the upper face, the bottom face and the like of the control board box. Furthermore, the vacuum heat insulating material is deposited directly on the back of the control board box.

Description

  The present invention relates to a device such as a refrigerator that uses a wide bandgap semiconductor as a semiconductor component for device control.

  Due to the growing trend toward energy saving, refrigerators in recent years have been declining in power consumption. In order to achieve low power consumption, inverter-type refrigerators that vary the drive frequency of compressors have become mainstream. Since an inverter circuit mainly composed of semiconductor components becomes hot, a relatively large heat dissipation structure is required, and many of them are high when mounted on a control board. Here, the height of the components other than the inverter circuit attached to the control board is, for example, larger than that of a large heat dissipation structure related component that cools the semiconductor component, compared to this large heat dissipation structure related component. Many of the other parts are relatively low in height, and the control board has a configuration in which high-height parts and low-height parts are mixed.

  On the other hand, recent refrigerators are required to increase the amount of storage (increase in storage capacity) in the storage space within a limited installation space and size (width and height), and thus the thickness of the heat insulating material has been reduced. It is out. However, while inverter control by the inverter drive circuit can achieve low power consumption, heat generation is large, so it is necessary to insulate firmly so that the amount of heat generated does not enter the refrigerator. If the control board is not well insulated, the heat generated by its own heat will enter the cabinet via the heat insulating material, which will cause the power consumption to deteriorate. It is necessary to insulate with a heat insulating material. (For example, see Patent Document 1)

JP-A-7-270041

  In order to reduce the thickness of heat insulating materials used in refrigerators, there are increasing examples of using high-performance vacuum heat insulating materials, but heat insulating materials are also installed between the control board and the refrigerator to achieve heat insulation. In this case, since the inner box of the control board part protrudes to the inside of the cabinet by the height (thickness) of the control board in a certain part of the control board, it is necessary to bend the heat insulating material according to the shape of the inner box, for example, When placing the vacuum heat insulating material between the control board and the refrigerator, it is necessary to bend the vacuum heat insulating material in the middle, but in the flat vacuum heat insulating material, the packaging bag that constitutes the vacuum heat insulating material by bending (Outer packaging material) may be torn and there is a concern about deterioration of heat insulation performance, so we gave up installing vacuum heat insulation material between the control board and the inside of the refrigerator and performed heat insulation with urethane heat insulation material with poor heat insulation performance .

  Furthermore, in the case of a refrigerator, a heat radiating pipe that constitutes a part of the refrigeration cycle is provided on the rear surface of the refrigerator, but the rear surface of the control board (between the control board and the interior) secures the interior volume as described above. In view of the above, the heat insulating material is made thin and there is no thickness (space) to install the heat radiating pipe in the heat insulating material on the back of the control board, so the heat radiating pipe is made to avoid the control board part. It has been difficult to extend the heat radiation pipe to the back of the control board to increase the heat radiation efficiency and reduce the power consumption of the refrigerator. In the case of the conventional refrigerator configuration, there is no space for the heat radiation pipe to pass through the back side of the control board. Therefore, the heat radiation pipe is moved away from the control board. Therefore, the workability deteriorates and the heat radiating pipe cannot be provided on the back surface of the control board, so the length of the heat radiating pipe is shortened and the heat radiating efficiency is lowered.

  In the present invention, by using a wide band gap semiconductor, the height and size of the semiconductor components and the control board are reduced, and a vacuum heat insulating material and a heat radiating pipe are provided on the back surface and surrounding walls (side surface, top surface, bottom surface, etc.) of the control board box. The purpose is to arrange additional parts such as. It is another object of the present invention to reduce the height and size of the control board box and effectively utilize the increased space. Another object is to increase the internal volume. Another object is to obtain a device such as a refrigerator with low power consumption. Another object of the present invention is to reduce the height and size of the control board to reduce the control board storage space and increase the storage volume such as the internal volume. In addition, additional parts such as heat radiation pipes, cooling air passages, and lighting devices can be installed in the increased space between the back of the control board box and the inside of the cabinet without making significant changes to the external shape or size of the equipment. The purpose is to obtain additional functions. Another object is to obtain a device such as a refrigerator with low power consumption.

  In the present invention, a heat insulating material is disposed between a refrigeration cycle configured by connecting a compressor, a heat radiating pipe, an expansion device, a cooler, and a suction pipe in this order, and an inner box and an outer box, A heat insulating box having a storage chamber; a machine room provided at an upper part or a lower part of the rear surface of the heat insulating box; the compressor is stored; and a back surface or a ceiling surface of the heat insulating box, the compressor. A control board box for storing a control board for controlling the semiconductor board and a semiconductor component such as a transistor or a diode mounted on the control board, and a wide bandgap semiconductor is used for the semiconductor part. Additional parts are arranged in the heat insulating material.

  According to the present invention, by using a wide band gap semiconductor as a semiconductor component for controlling the device, additional parts such as a heat radiating pipe and a vacuum heat insulating material can be disposed on the back surface and the periphery of the control board box, thereby providing an extra space. It becomes possible to have an additional function without.

Embodiment 1 FIG.
(The machine room is located at the lower back of the refrigerator)
1 is a schematic cross-sectional view of a refrigerator that represents Embodiment 1 of the present invention, and FIG. 2 is a back view showing the arrangement of compressors and heat radiating pipes that constitute the refrigeration cycle on the back of the refrigerator that represents Embodiment 1 of the present invention. It is a perspective view. In the figure, the refrigerator 1 is provided with a refrigerating chamber 2 at the top, a switching chamber 3 and an ice making chamber 35 provided in parallel below the refrigerating chamber 2, and a freezing chamber 4 provided below the switching chamber 3 and the ice making chamber 35. The vegetable compartment 4 is provided at the bottom (lowermost level) of the freezer compartment. Here, between each storage room (for example, refrigerator compartment 2, switching room 3, ice making room 35, freezer room 4, vegetable room 5), between the rooms where setting temperature (storage temperature) differs, it is with heat insulating material (partition member) 8. It is partitioned. A machine room 60 is provided below the back of the refrigerator 1, and the compressor 6 is accommodated in the machine room 60.

  In addition, a rear heat insulating material 80 is provided on the back surface of the refrigerator 1, and a cooler (not shown), a compressor 6, an accumulator 61, and an expansion device provided in the cooler chamber are provided on the back surface of the refrigerator 1. (For example, a capillary tube or an electronic expansion valve) 62, a heat radiating pipe (condensing pipe) 9 etc. which are connected to the compressor 6 and constitute a refrigeration cycle together with a cooler and the like are arranged. A compressor cooling fan 68 is also provided. The heat radiating pipe 9 is connected to the expansion device 62 from the compressor through the side of the refrigerator, the back of the refrigerator, the top of the refrigerator (or the bottom of the refrigerator), the side of the refrigerator, and connected to the compressor 6 via the evaporator 200, the accumulator 61, and the like. Is done. The compressor 6 is driven by an inverter system capable of arbitrarily adjusting the rotation speed of the motor, and is driven by a control board 7 on which, for example, an inverter drive circuit component 11 which is a semiconductor component is mounted. For example, in FIG. 1, the control board 7 is accommodated in a control board box 70 that is disposed in the heat insulating material 80 at the upper rear part of the refrigerator 1 so that the back side of the refrigerator 1 is opened.

  The control board box 70 is opened on the back side of the refrigerator 1 in FIG. 1 (or the upper face side in FIG. 11A described later) so that the control board 7 can be maintained and replaced. Here, in FIGS. 1 and 2, the heat radiating pipe 9 is connected to the expansion device 62 from the compressor 6 through the side of the refrigerator, the back of the refrigerator, the top of the refrigerator, and the side of the refrigerator. Alternatively, it is arranged so as to pass through the side surface of the control board box 70 from the top surface of the refrigerator to the side surface of the refrigerator. In addition, at least one of the ceiling surface, the back surface, the side surface, and the bottom surface of the refrigerator 1 is provided with one or more vacuum heat insulating materials 10 in order to improve the heat insulating performance between the inside and the outside of the refrigerator 1, It is also arranged between the back surface 71 of the substrate box 70 and the inner box 101.

(The machine room is located at the upper rear of the refrigerator)
Next, the case where the machine room 60 is provided in the upper part of the back surface of the refrigerator 1 will be described. FIG. 3 shows the arrangement of the compressor and the heat radiating pipe constituting the refrigeration cycle on the back surface of the refrigerator representing the first embodiment of the present invention. FIG. In the figure, the refrigerator 1 is provided with a plurality of storage rooms such as a refrigerating room 2, a switching room 3, an ice making room 35, a freezing room 4, a vegetable room 5, etc., and is not described here. . Here, between each storage room (for example, refrigerator compartment 2, switching room 3, ice making room 35, freezer room 4, vegetable room 5), between the rooms where setting temperature (storage temperature) differs, it is with heat insulating material (partition member) 8. It is partitioned. In addition, a machine room 60 is provided above the rear surface of the refrigerator 1, and the compressor 6 is accommodated in the machine room 60.

  In addition, a rear heat insulating material 80 is provided on the rear surface of the refrigerator 1, and a cooler 200 provided in the cooler chamber is provided on the rear surface of the refrigerator 1, and includes a compressor 6, an accumulator 61, an intake air. The pipe 63, the cooler 200, the capillary tube 62 which is an expansion device, the heat radiating pipe 9, and the compressor 6 are connected in this order to constitute a refrigeration cycle. For example, the suction pipe 63 is connected from the compressor 6 (or accumulator 61) to the cooler 200 provided below the back of the refrigerator 1 through the back of the refrigerator 1, and the expansion device 62 connected to the cooler 200 is connected to the refrigerator 1. It passes through the back surface and is connected to the heat radiating pipe 9 on the top surface of the refrigerator 1. The compressor 6 is driven by an inverter system capable of arbitrarily adjusting the rotation speed of the motor, and is driven by the control board 7. The control board 7 is accommodated in a control board box 70 provided in a heat insulating material 80 in the center of the back surface of the refrigerator 1 (for example, below the machine room 60 and above the cooler 200).

  The control board box 70 is open on the back side of the refrigerator 1 so that the control board 7 can be maintained and replaced. Here, in FIG. 3, the suction pipe 9 is connected from the compressor 6 (or accumulator 61) disposed in the machine room 60 in the upper part of the refrigerator 1 to the cooler 200 disposed below the back of the refrigerator, and expanded. The capillary tube 62 as an apparatus is connected from the cooler 200 disposed below the refrigerator 1 to the heat radiating pipe 9 disposed on the top of the refrigerator. The capillary tube 62 (or suction pipe 63) is connected to the rear surface of the refrigerator. Are arranged so as to pass through the side surface or the back surface of the control board box 70. In addition, at least one of the ceiling surface, the back surface, the side surface, and the bottom surface of the refrigerator 1 is provided with one or more vacuum heat insulating materials 10 in order to improve the heat insulating performance between the inside and the outside of the refrigerator 1, It is also arranged between the back surface 71 of the substrate box 70 and the inner box 101.

(Wide band gap semiconductor)
In FIG. 1, FIG. 2, and FIG. 3, in the present invention, a wide band gap semiconductor is used as a semiconductor of an inverter driving circuit which is a compressor driving circuit mounted on a control board. Conventionally, for example, a semiconductor based on silicon (Si) has been used for the semiconductor component 11 such as an inverter drive circuit component mounted on the control board 7, but in the present invention, a wide band gap semiconductor is used. As the wide band gap semiconductor, for example, silicon carbide (SiC), gallium nitride (GaN), or the like is used.

  The following two points can be given as the advantages of wide band gap semiconductors (eg, silicon carbide SiC) over silicon (Si) semiconductors. The first advantage is that the element loss is small and high-temperature operation is possible. Since Si generates a large amount of heat, and the semiconductor performance deteriorates at about 100 ° C. to 200 ° C., which makes it difficult to operate, a heat dissipating fin (heat radiator 12) is provided, and heat is dissipated through air. A storage capacity for mounting and a space for heat dissipation are required. On the other hand, wide band gap semiconductors (for example, SiC) have low switching loss in the element and are energy saving. Also, since the performance does not easily decrease up to about 300 ° C., the heat dissipating fins 12 are unnecessary. There is an advantage that the fins 12 for heat dissipation can be made considerably small (height is reduced and profile is reduced).

  The second merit is that the thickness of the device, which is a semiconductor component, can be reduced. Wide band gap semiconductors (for example, SiC and GaN) have a high breakdown field strength, so the breakdown voltage of the semiconductor is large (having a breakdown voltage about 10 times that of silicon (Si)). It can be as small as 1/10 (thin). In the present invention, by using a wide band gap semiconductor having such characteristics, it is possible to obtain a refrigerator in which the inverter drive circuit component 11 can be significantly reduced in size and a structure that does not have to worry about the heat radiation environment can be realized.

  1, 2, and 3, the semiconductor component 11 such as the inverter drive circuit component mounted on the control board 7 uses a wide band gap semiconductor, so that the dielectric breakdown electrolytic strength is large and the breakdown voltage is large. Therefore, the thickness and size can be reduced (about 1/10 of silicon). Moreover, since it can operate | move at high temperature of 300 degreeC, the radiation fin (radiator) 12 for cooling of the semiconductor component 11 can also be made extremely small. Therefore, conventionally, in the present invention, a wide band gap is used in the semiconductor component 11 such as an inverter driving circuit component provided with the radiator 12 that is mounted on the control board 7 and is extremely higher than other components. Since the height and size (vertical and horizontal width) of the radiator 12 and the inverter drive circuit component 11 can be made extremely small (low profile and small size) by using a semiconductor, it is mounted on the control board 7. In the state, it is possible to reduce the height to the same level as that of other control-related parts (for example, a power reactor, a capacitor, a transformer, a current detection part, or the like), or to a height below the same level.

(Control board, control board box)
FIG. 4 is a view of the control board 7 of the refrigerator 1, which is a device, as viewed from the front. 5 is a side view of the control board 7, FIG. 5A is a side view of the control board 7 of the present invention, and FIG. 5B is a side view of the conventional control board 7. FIG. FIG. In the figure, the control board 7 is composed of, for example, an inverter drive circuit component and a semiconductor component 11 composed of a wide band gap semiconductor, etc. A heat dissipating fin 12 that is a heat dissipator for dissipating heat, a transformer 13 that converts a power source voltage from, for example, 100 V to 12 V, a relay 14, a converter 15, a capacitor 16, a current detecting sensor 17 that is a current detecting component, and the like are mounted. .

  The control board 7 is housed in the control board box 70 in a state where the semiconductor component 11 and other control-related parts (for example, the transformer 13, the converter 15 and the capacitor 16) are mounted, and control board fixing means such as bolts. In 79, it is fixed and held on the back surface (bottom surface) of the control board box 70 or the like. A power supply reactor and the like are stored in the control board box 70 together with the control board 7. The radiator 12 is fixed to the inverter drive circuit component 11 with an adhesive, a bolt, or the like via a sheet-like heat radiation auxiliary member 110 having good thermal conductivity. The sheet-like heat radiation assisting member 110 only needs to have thermal conductivity, but it is preferable that the sheet-like heat radiation assisting member 110 is more likely to be dissipated because it has better elasticity. Here, the sheet-shaped heat radiation auxiliary member 110 is not necessarily provided, and may not be provided. The heat radiator 12 and the inverter drive circuit component 11 which is a semiconductor component are directly bonded with an adhesive or a bolt. Or it may be fixed.

  Here, as shown in FIG. 5 (a), the combined height of the semiconductor component 11 such as the inverter drive circuit component and the radiator 12 mounted on the control board 7 according to the embodiment of the present invention is A. The height of other control-related parts (for example, the transformer 13, the converter 15 and the capacitor 16) of the embodiment is A4, and the height of the control board box 70 of the embodiment of the present invention is H. Is open. As shown in FIG. 5B, the combined height of the semiconductor component 11 such as the inverter drive circuit component mounted on the conventional control board 7 and the radiator 12 is A2, and other conventional control-related components (for example, The height of the transformer 13, the converter 15 and the capacitor 16) is A3, the height of the conventional control board box 70 is H2, and the upper part in the height direction is open.

  Here, conventionally, as shown in FIG. 5B, the installation space is determined due to the restriction of the size of the control board 7, so it is necessary to increase the heat dissipation area by increasing the heat radiator 12 in the height direction. The combined height A2 of the radiator 12 and the inverter drive circuit component 11 is extremely higher than the height A3 of other control-related components (for example, the capacitor 16) when mounted on the control board 7. Therefore, it is necessary to increase the height H2 of the control board box 70 as well. Therefore, in the state where it is incorporated in the refrigerator 1, only the portion where the control board box 70 is disposed is the thickness of the heat insulating wall on the back surface (or the ceiling surface) of the refrigerator 1 (the thickness of the control board box 70 and the back heat insulating material 80 combined). ) Became thicker and protruded to the inside of the warehouse, and the interior volume (storage chamber volume) was reduced accordingly.

  However, in the present invention, a wide band gap semiconductor is used for the semiconductor component 11 such as an inverter drive circuit component provided with the radiator 12, so that the radiator 12 and the semiconductor component 11 are combined as shown in FIG. The height A can be made extremely small (low profile) (A <A2)), so that other conventional control-related components (for example, the power reactor, the capacitor 16, the transformer 13, and the current detection) are mounted on the control board 7. The height H of the control board box 70 is significantly lower than the height H2 of the conventional control board box 70. it can. Therefore, in the state incorporated in the refrigerator 1, the thickness of the heat insulating wall on the back surface of the refrigerator 1 (the thickness of the control board box 70 and the back heat insulating material 80 combined) even in the portion where the control board box 70 is disposed. Since the inner box 101 does not protrude to the inner side, the inner volume (for example, the inner volume of the storage chamber 2) can be increased.

  Here, the height A of the heat sink 12 and the semiconductor component 11 such as an inverter drive circuit component mounted on the control board 7 is higher than other conventional control-related components (for example, a power reactor, a capacitor 16 and a transformer). 13 and the current detection component 17) can be made lower than the height A3 (A <A3), conversely, as shown in FIG. 5A, other control-related components (for example, The height A4 of the power reactor, the capacitor 16, the transformer 13, the current detection component 17, etc.) is approximately equal to the height A of the semiconductor component 11 such as the inverter drive circuit component and the radiator 12 in the embodiment of the present invention. By lowering (A4 <A3), the height of the control board 7 can be further reduced, and therefore the height H of the control board box 70 can be further reduced.

  Here, in the present embodiment, the semiconductor of the inverter drive circuit component 11 (for example, a switching element or a diode element) is formed of a wide band gap semiconductor having a larger band gap than silicon (Si). Examples of the semiconductor include silicon carbide, a gallium nitride material, and diamond.

  Switching elements and diode elements formed by such wide band gap semiconductors have high voltage resistance and high allowable current density, so that switching elements and diode elements can be miniaturized. By using elements and diode elements, it is possible to reduce the size of a semiconductor module incorporating these elements.

  Further, since the heat resistance is high, the heat radiation fins 12 of the heat sink can be downsized and the water cooling section can be air cooled, so that the semiconductor module can be further downsized.

  Furthermore, since the power loss is low, it is possible to increase the efficiency of the switching element and the diode element, and further increase the efficiency of the semiconductor module.

  Here, a MOSFET using SiC has a vertical device structure, which is advantageous for increasing the capacity, and can easily increase the current and withstand voltage, so that it can be applied to relatively large equipment such as room air conditioners and packaged air conditioners. Application is desirable. In addition, GaN-FETs have a horizontal device structure, can easily reduce resistance, and can be reduced in cost. Therefore, they can be applied to relatively small devices such as refrigerators and room air conditioners that are used in low current ranges. Is desirable.

  Although both the switching element and the diode element are desirably formed of a wide band gap semiconductor, either one of the elements may be formed of a wide band gap semiconductor, and the effect described in this embodiment Can get

  Here, the control board 7 is accommodated in a control board box 70 made of sheet metal or resin, for example. When the machine room 60 in which the compressor 6 constituting the refrigeration cycle is housed is provided at the lower back of the refrigerator 1 as shown in FIGS. 1 and 2, the control board box 70 is provided on the back of the refrigerator 1. It is provided in a heat insulating material (for example, urethane heat insulating material) above the machine room 60 such as near the center in the height direction of the upper part or the back surface. In addition, when the machine room 60 is provided at the upper rear part of the refrigerator 1 as shown in FIG. 3, the control board box 70 is located at the lower rear part of the refrigerator 1 or near the center in the height direction of the rear face of the refrigerator 1. It is provided in the heat insulating material below the machine room 60.

  In the present invention, the combined height A of the semiconductor component 11 such as the inverter drive circuit component and the radiator 12 or the height of the radiator 12 can be made extremely small by using a wide band gap semiconductor. As shown in (a), the height A of the inverter drive circuit component 11 that is a semiconductor component of the control board 7 and the radiator 12 can be kept small, and therefore the height H of the control board box 70 is also low. It can be kept low. Therefore, since it can suppress that the control board box 70 protrudes inside a store | warehouse | chamber, the volume in a store | warehouse | chamber can be enlarged and energy-saving refrigerator 1 is obtained.

  Further, since the height H of the control board box 70 can be reduced, the inner box of the control board box 70 portion can be prevented from protruding to the inside of the cabinet, so that the back heat insulating material 80 is also bent or projected to the inside of the cabinet. There is no need, and the vacuum heat insulating material 10 that is vulnerable to deformation processing such as bending processing (the outer packaging material may be broken if bending processing) is connected to the rear surface 71 of the control board box 70 on the rear surface inside the chamber and the inner space (inner box 101). If the flat vacuum heat insulating material 10 is not bent, the flat vacuum heat insulating material 10 can be installed in a flat shape.

  Here, since the control board box 70 is disposed on the heat insulating wall portion having a predetermined thickness between the inner box 101 and the outer box 102 of the refrigerator 1, the inverter drive circuit component 11 is controlled using a wide band gap semiconductor. Even when the height (depth) H of the substrate box 70 is reduced, if the original length (distance) between the back surface 71 of the control board box 70 and the inner box 101 is short, a heat insulation thickness is secured. In addition, the inner box 101 on the back surface 71 of the control board box 70 needs to protrude slightly toward the inside of the cabinet. Even in such a case, the flat vacuum heat insulating material 10 is disposed on the back surface 71 of the control board box 70. It is possible. In this case, there is a possibility that the vacuum heat insulating material 10 needs to be slightly bent and disposed, but since the protruding amount of the inner box 101 to the inner side is smaller than the conventional case, the bending angle of the vacuum heat insulating material 10 Can be made smaller than before.

  In other words, the bending angle of the vacuum heat insulating material 10 is within a range of a small predetermined angle (for example, a small bending angle of about 30 degrees or less) such that the outer packaging material is not torn or damaged when the vacuum heat insulating material 10 is bent. For example, even if the vacuum heat insulating material 10 is bent, the outer packaging material is not torn or damaged, so that the possibility of the vacuum heat insulating material 10 not functioning or deteriorating and degrading performance can be reduced. .

  Further, as shown in FIG. 6, when the semiconductor component 11 such as the inverter drive circuit component mounted on the control board 7 is composed of a wide band gap semiconductor, the heat resistance is high, and the radiating fin is unnecessary or extreme. Therefore, the control board box 70 is formed of a material having good thermal conductivity (iron, aluminum, copper, or its alloy steel), and the semiconductor parts such as the inverter drive circuit parts 11 are directly attached to the control board box 70. It is good also as a structure which makes it contact and assists heat dissipation.

  FIG. 6 is a side view of the control board 7 in the control board box 70 representing the first embodiment of the present invention. The inverter drive circuit component 11, which is a semiconductor component, is brought into direct contact with a control board box 70 made of a heat conductive material such as a metal, resin, or rubber having thermal conductivity, and the control board box 70 is dissipated from the inverter circuit part 11. It may be used as a component for assisting heat dissipation. If the semiconductor component 11 such as the inverter drive circuit component is sandwiched between the control board 7 and the control board box 70 and pressed and fixed by the control board fixing means 79 such as a bolt, the assembly is simple and low cost. It is possible to obtain a device drive control device that can perform drive control of an inverter, a fan motor, and the like with good performance.

  In the present invention, since a wide band gap semiconductor is used for the semiconductor component 11 such as the inverter drive circuit component, the heat resistance temperature is higher than that of the conventional semiconductor component using Si (about 300 ° C.). It is possible to dissipate heat even if the control board box 70 provided so as to be in contact with the heat insulating material 80 is used instead of the heat radiating fins, and the control board box 70 is embedded in the heat insulating material 80. However, since the heat resistance temperature of the semiconductor component 11 is high, the temperature in the control board box 70 does not increase until the heat resistance temperature of the semiconductor component 11 is exceeded, so that the inverter drive circuit component 11 is not damaged and is reliable. There is no problem in nature.

  In this way, by using the control board box 70 instead of the heat radiating fin as a configuration in which the semiconductor component 11 such as the inverter drive circuit part is brought into direct contact with the control board box 70, no heat radiating fin is required. Since the height can be kept low, the thickness between the inner box and the outer box (thickness of the heat insulating material 80, etc.) can be reduced, so that a low-cost refrigerator can be obtained. Further, since the semiconductor component 11 such as the inverter drive circuit component is composed of a wide band gap semiconductor, the semiconductor component such as the inverter drive circuit component 11 can be thinned, and the thickness of the control board box 70 can be thinned. The storage chamber volume (internal volume) can be increased. Further, since the semiconductor component 11 such as the inverter drive circuit component is composed of a wide band gap semiconductor, an energy-saving refrigerator can be obtained. In addition, since a wide band gap semiconductor is used for the semiconductor component 11, a structure that does not require heat radiating fins is possible, so that the structure can be simplified and a low-cost refrigerator can be obtained. Further, since the semiconductor component 11 such as the inverter drive circuit component can be directly brought into contact with the control board box 70, there is no need to provide a predetermined gap between the control board 7 and the control board box 70 as in the prior art. The height when the control board 7 is stored in the control board box 70 can be reduced. That is, since the height of the control board box 70 can be further reduced, the storage chamber volume (internal volume) can be increased.

  Here, when it is difficult to directly contact the semiconductor component 11 such as the inverter drive circuit component with the control board box 70, a material with good thermal conductivity (the same material as the control board box 70 or another material may be used). You may make it contact thermally through the heat dissipation auxiliary member 110. The heat radiation auxiliary member 110 is preferably made of metal having a good thermal conductivity, for example, but the heat conductivity that can radiate the heat generated by the heat generated by the inverter drive component 11 to the outside (for example, the control board box 70 or in the air) A resin or an elastic member having a heat transfer coefficient may be used. Further, the size of the heat radiation assisting member 110 may be a size that can radiate heat with a size equal to or larger than the size (width or length) of the inverter drive circuit component 11, for example. Moreover, since the thickness can be made thin if the heat radiation auxiliary component 110 is, for example, a sheet shape, the height of the control board 7 and the control board box 70 can be suppressed. Thus, even if the control board box 70 is used instead of the heat radiating fins as a configuration in which the inverter drive circuit component 11 is brought into contact with the control board box 70 via the heat radiating auxiliary member 110, it is equivalent to the case where the heat radiating auxiliary member 110 is not provided. An effect is obtained.

  In particular, the control board box 70 is substantially at the rear center with respect to the height direction of the refrigerator 1 (for example, when the compressor is provided at the upper rear part of the refrigerator, the lowermost stage is lower than the machine room in which the compressor is accommodated. When the compressor is provided at the upper part of the storage room and at the lower part of the back of the refrigerator, the upper part is higher than the machine room in which the compressor is accommodated and lower than the uppermost storage room of the refrigerator 1 (the uppermost storage room). If the control board box 70 is provided in the upper part of the back surface or the lower part of the back surface, the height of the control board box 70 is lower than that of the uppermost shelf in the refrigerator room. Since the position becomes a substantially central height position that is easy for the user to use, a storage room that is frequently used by the user is arranged, and a large storage volume is desired. Therefore, the significance and effect of increasing the internal volume are great.

  Here, when it is desired to electrically insulate between the semiconductor component 11 such as the inverter drive circuit component and the control board box 70, the heat dissipation auxiliary member 110 is made of a material having thermal conductivity and electrical insulation as a control board. An electrical insulation member that is a sheet-like separate member that has a predetermined thickness and a resinous electrical insulation is interposed between the box 70 and the semiconductor component 11 such as an inverter drive circuit component. If the electric insulation member is interposed between the heat radiation assisting member 110 and the control board box 70, the semiconductor component 11 such as an inverter drive circuit part and the control board box 70 can be electrically insulated. There is no problem in electrical insulation and safety.

  Here, when electrical insulation between the control board box 70 and the equipment main body (the main body of the refrigerator 1, the outdoor unit main body of the air conditioner, the heat source machine main body of the water heater, etc.) on which the control board box 70 is provided is necessary. An electrical insulating member may be interposed between the substrate box 70 and the apparatus main body, between the control board box 70 and the lid of the control board box 70, or the like.

  Here, in the present embodiment, for example, a wide band gap semiconductor is used for the semiconductor component 11 constituting the inverter drive circuit component, and the semiconductor portion 11 such as the inverter drive circuit component is brought into direct contact with the control board box 70. As described in the example of the refrigerator, the control board 7 and the control board box 70 that house the semiconductor parts 11 such as the inverter drive circuit parts of the equipment that performs inverter control such as the outdoor unit of the air conditioner other than the refrigerator and the heat source machine of the water heater. It can also be applied to.

  Further, not only the refrigerator but also the configuration of the control device and the control board box including the control board 7 and the control board box 70 shown in FIG. 5 and FIG. It can be applied to other home appliances such as an air conditioner, a water heater, and a washing machine, and the same effect can be obtained. When applied to an outdoor unit of an air conditioner or a heat source unit of a water heater, the control board box 70 can be made thin, so that the height and width of the outdoor unit and the heat source unit can be reduced, and the size can be reduced. And cost can be reduced. Further, when applied to a washing machine having a washing layer, the width, depth and height of the washing machine body can be reduced and the size can be reduced, and the weight and cost can also be reduced.

  FIG. 7 is an explanatory diagram regarding an increase in the volume of the back surface portion of the control board box 70 in the refrigerator 1 representing the embodiment of the present invention. In the figure, the same parts as those in FIGS. In the figure, a control board box 70 is disposed at the upper back of the refrigerator 1 and accommodates an inverter drive circuit component 11 made of a wide band gap semiconductor.

  In the present invention, since the inverter drive circuit component 11 uses a wide band gap semiconductor, the thickness of the control board 7 and the thickness of the board control box 70 (length and depth in the front-rear direction of the refrigerator 1) H can be reduced. The size and volume of the protruding portion 83 of the portion in which the control board box 70 is disposed into the interior (storage chamber) of the inner box can be reduced. Further, since the thickness H of the control board box 70 can be reduced, the thickness of the heat insulating material 80 is reduced by the reduction in the thickness of the control board box between the inner box 101 and the back surface 71 of the control board box 70 by the reduced thickness. It is possible to increase the thickness. (The thickness of the heat insulating material 80 can be increased by the volume of the heat insulating material thickness increasing portion 85.) If the thickness of the heat insulating material 80 is not increased, the internal volume of the heat insulating material thickness increasing portion 85 is increased. Can be increased. That is, by reducing the thickness of the heat insulating material 80 by the volume (or thickness) of the heat insulating material thickness increasing portion 85 in which the thickness H of the control board box 70 has been reduced, (Internal volume) can be increased. Therefore, a large-capacity refrigerator that is convenient for the user can be obtained.

  Here, in the conventional refrigerator 1, since the thickness of the semiconductor component 11 such as the inverter drive circuit component and the control board box 70 is large, it is necessary to increase the depth of the control board box storage space around the control board box 70. Since the inner box 101 protrudes (projects) to the protruding portion 83 in the storage chamber, the internal volume is small. Further, in the conventional refrigerator, since the control board box 70 is provided in the thickness increasing portion 85 of the heat insulating material 80, it is difficult to provide additional parts such as a vacuum heat insulating material and a heat radiating pipe. Since the control board 7 and the control board box 70 can be reduced in thickness by using a wide band gap semiconductor, the protruding portion 83 to the inside of the cabinet can be reduced, and the volume of the heat insulating material thickness increasing portion 85 can be reduced. Since space can be secured, the control board 7 and the control board box 70 do not have to be inclined with respect to the back surface 152 of the refrigerator 1 and are substantially parallel to the back surface 152 of the refrigerator 1 (the refrigerator installation surface). In other words, the structure is simple and the storage space for the control board box 70 can be greatly reduced. Furthermore, since the inner box 101 does not stick out (protrusions) into the refrigerating room 2 as the storage room, the amount of food stored in the refrigerating room 2 as the storage room can be increased. A good refrigerator and equipment can be obtained.

  Here, when the height H of the control board box 70 is lowered, the amount 83 of decrease in the amount of protrusion of the inner box to the inside of the box (the volume increase part 83 in the box) and the height H of the control board box 70 are lowered. Thickness increasing portion 85 of the heat insulating material 80 between the control board box 70 and the inner box 101 (for example, the back surface of the heat insulating box constituting the refrigerator 1) (heat insulating material thickness increasing portion 85 due to control board box thickness reduction) Additional parts (functional parts (for example, mist spraying device, sterilization device, sterilization device, etc.)) and air passage parts (for example, cooling air passage, mist air passage, air volume adjustment and air passage switching) Damper devices, etc.), refrigeration cycle components (such as heat dissipation pipes (condensation pipes), decompression devices (expansion valves, capillary tubes, etc.) and suction pipes) and other components (vacuum insulation, wiring, lighting components (such as LED lighting) Or provided in the internal lighting and warning like or indicator), etc.)), it may be arranged.

  In this way, the contents of the storage can be compared to the conventional case by arranging or providing the additional parts in the increased volume 83 of the internal space 83 or the increased thickness (volume) 85 of the heat insulating material on the back surface 71 of the control board box 70. Since an additional function can be obtained without reducing the product, a refrigerator that is convenient for the user, has high space use efficiency, and has high cost performance can be obtained.

  In other words, if additional parts are provided in the internal volume increasing portion 83 or the control board box rear surface insulating material thickness increasing portion 85, the additional volume can be added without reducing the internal volume (storage chamber storage capacity). Functions can be realized, or another part can be placed in the part where the additional part has been placed, so additional functions can be used without reducing the internal volume, improving space efficiency and making it easy for users to use. A good refrigerator is obtained. In addition, when no additional parts are provided in the internal volume increasing portion 83 or the control board box rear heat insulating material thickness increasing portion 85, the internal volume can be increased with a refrigerator having the same external dimensions as the conventional one, so that space efficiency is improved. The storage capacity is large and an easy-to-use refrigerator can be obtained.

  Here, when the additional part is a mist spray-related part such as a mist spraying device, a mist blower channel, or a mist outlet, mist spraying can be performed in the storage chamber, so that the storage capacity in the storage chamber is not reduced. In addition, a hygienic and freshness-maintaining device that can be sterilized and humidified in the storage chamber can be obtained.

  When the additional part is the heat radiating pipe (condensation pipe) 9, the heat radiating pipe is passed to the heat insulating material thickness increasing portion 85 on the back surface 71 of the control board box 70 without disposing the storage volume in the storage chamber (arrangement). Since the length of the heat radiating pipe 9 can be increased and the heat radiating area can be increased, the heat radiating efficiency is improved and an energy-saving refrigerator can be provided.

  Further, when the additional part is the vacuum heat insulating material 10, the vacuum heat insulating material 10 can be disposed in the rear heat insulating material increasing portion 85 of the control board box 70, which has been difficult to arrange conventionally without reducing the storage volume in the storage chamber. Therefore, the installation area of the vacuum heat insulating material 10 can be expanded and the heat insulating performance is improved, so that an energy-saving refrigerator can be obtained. Further, since the control board box 70 can be made thin, the folding angle of the vacuum heat insulating material 10 can be reduced within a range in which the outer packaging material is not damaged or torn, so that the outer packaging material is damaged or torn by folding. Therefore, a highly reliable and energy-saving refrigerator without breakage of the vacuum heat insulating material and deterioration of the heat insulating performance can be obtained.

(Folding arrangement of vacuum insulation)
Since the thickness of the control board 7 and the control board box 70 in the present invention can be reduced by using a wide band gap semiconductor, the volume of the protruding portion 83 and the heat insulating material thickness increasing portion 85 in the cabinet is compared with the conventional one. Space can be secured, and the control board 7 and the control board box 70 do not have to be inclined with respect to the back surface 152 of the refrigerator 1. It becomes possible to install them substantially in parallel, and the degree of freedom in design is improved when examining the installation positions of the control board 7 and the control board box 70. Further, even when the control board 7 and the control board 70 are inclined and arranged, the vacuum heat insulating material 10 can be arranged with a small bending angle within a range in which the outer packaging material is not damaged or torn. Equipment such as a refrigerator with high and high thermal insulation performance can be obtained.

  FIG. 8 is a cross-sectional view of a main part near the control board box of the refrigerator representing the present embodiment. In the figure, the same parts as those in FIGS. In the figure, the back surface 71 of the control board box 70 is inclined at a predetermined angle with respect to the outer box 102 or the back surface 152 of the refrigerator 1, and the control board 7 is also substantially the same angle as the inclination angle of the back surface 71 of the control board box 70. It is arranged at an angle. Since the thickness of the control board 7 and the control board box 70 can be reduced by using a wide band gap semiconductor, space and volume can be secured by the volume of the protruding portion 83 and the heat insulating material thickness increasing portion 85 as compared with the conventional case. Even if the rear surface 71 of the control board box 70 is inclined with respect to the outer box 102 or the rear face 152 of the refrigerator 1, the storage space in the heat insulating material of the control board box 70 can be greatly reduced. It is. Furthermore, since the protrusion of the inner box 101 into the refrigerating room 2 that is the storage room can be reduced, the amount of food stored in the refrigerating room 2 that is the storage room can be increased.

  In the present embodiment, the vacuum heat insulating material 10 as an additional part is disposed in the heat insulating material thickness increasing portion 85, but the vacuum heat insulating material 10 is aligned with the inclination of the back surface 71 of the control board box 70. However, since the folding angle can be set small, the outer packaging material of the vacuum heat insulating material 10 is not damaged or broken, so that the reliability of the vacuum heat insulating material 10 can be ensured. Here, the predetermined angle at which the vacuum heat insulating material 10 is bent is set in a range in which the outer packaging material is not damaged or torn, and the vacuum heat insulating material 10 with respect to the vacuum heat insulating material 10 in the portion where the control board box 70 is not arranged. The predetermined bending angle of the bent portion is approximately 30 degrees or less (preferably 10 degrees or less) (the vacuum heat insulating material 10 in the portion where the control board box 70 is not disposed is substantially parallel to the back surface or the top surface of the refrigerator 1). The predetermined bending angle of the bent portion of the vacuum heat insulating material 10 with respect to the back surface or the top surface is about 30 degrees or less (preferably 10 degrees or less). In this way, when the back surface 71 of the control board box 70 is inclined, the additional component provided on the back surface of the control board box 70 may not be the vacuum heat insulating material 10, and the heat radiating pipe 9, the suction pipe 63, the expansion device 62, Other additional parts such as a mist spraying device and a cooling air passage may be used.

(Multiple placement of additional parts)
Here, the number of additional parts may not be one, but two or more combinations (for example, pipes (a combination of the heat radiating pipe 9 and the suction pipe 63, a combination of the suction pipe 63 and the capillary tube 62 which is a decompression device, etc.) , A combination of piping (heat radiating pipe 9, suction pipe 63, capillary tube 62, etc.) and vacuum heat insulation 10, a combination of a mist spraying device and a cooling air passage, a vacuum heat insulating material 10 and a mist air passage, or a vacuum heat insulating material 10 And a mist outlet, or a combination of a vacuum heat insulating material 10 and a cooling air passage, a combination of lighting components (for example, interior lighting such as LED lighting, warnings, indicator lights, etc.) and a cooling air passage, a lighting component and a vacuum heat insulating material , Combination of two additional parts such as a combination of lighting parts and mist spraying device, or vacuum insulation It may be a different additional parts 3 kinds of combinations, such as combinations of the cooling air path and strike the spray device and the cooling air path combinations and lighting apparatus and a mist spray apparatus, a plurality of combinations from a plurality of additional components) may be used. Also, a plurality of combinations such as two, three, etc., of the same additional parts may be used. By combining one or two or more additional parts, many additional functions can be obtained without reducing the storage volume in the storage chamber, so user satisfaction is high and space use efficiency is high. A refrigerator with high cost performance can be obtained.

(Vacuum insulation)
Here, when using vacuum insulation for additional parts, it is better to use organic fibers such as polyester (PP) and polystyrene (PS) than to use inorganic fibers such as glass fibers for the core. There is no adverse effect on the human body when handling, dismantling or recycling.

  The vacuum heat insulating material 10 includes an air barrier gas barrier container (hereinafter referred to as “external packaging material”), a core material and an adsorbent (for example, a gas adsorbent and a moisture adsorbent (CaO) enclosed in the external packaging material. ) Etc.). The inside of the outer packaging material is depressurized to a predetermined degree of vacuum (several Pa (pascal) to several hundred Pa). In addition, the vacuum heat insulating material 10 may be simply called a vacuum heat insulating material.

  In this embodiment, an organic fiber is used as the fiber forming the core of the vacuum heat insulating material 10, but as a material used for the organic fiber, other than polyester, polypropylene, polylactic acid, aramid, LCP ( Liquid crystal polymer), PPS, polystyrene, and the like can be used. In order to improve the heat resistance of the core material, a heat resistant resin such as LCP (liquid crystal polymer) or PPS (polyphenylene sulfide) may be used for the organic fiber. Moreover, what is necessary is just to use a thing with a big fiber diameter, when improving compression creep characteristics. Moreover, if it mixes and uses said resin, the vacuum heat insulating material 7 with the high heat resistance excellent in the compression creep characteristic and high heat insulation will be obtained. Polystyrene has a low solid thermal conductivity and can be expected to improve the heat insulating performance of the heat insulating material, and can be manufactured at low cost.

  Polypropylene has low hygroscopicity, so that drying time and evacuation time can be shortened and productivity can be improved. Moreover, since the solid heat conduction is small, the heat insulation performance of the vacuum heat insulating material 10 can be expected.

  Moreover, since polylactic acid is biodegradable, the core material disassembled and separated after use of the product can be subjected to landfill treatment.

  In addition, since aramid and LCP have high rigidity, they have good merits such as good shape retention when vacuum-packed and subjected to atmospheric pressure, can increase the porosity, and can be expected to improve heat insulation performance.

  For example, in the vacuum heat insulating material 10 using a plastic laminate film as an outer packaging material, the core material supports the atmospheric pressure and secures a space in the vacuum heat insulating material 10, and heat conduction of gas by finely dividing the space. It plays a role to reduce. From the viewpoint of suppressing heat conduction of gas, it is desirable that the distance of this space be smaller than the free stroke distance of air molecules at the degree of vacuum.

  In the present embodiment, for example, an organic fiber is used for the core material of the vacuum heat insulating material 10, so that the vacuum heat insulating material is used in comparison with the case where a hard and brittle glass fiber is used as the core material as in the prior art. When the material 10 is manufactured, disassembled, or recycled, dust does not scatter and adhere to the skin / mucous membrane of the worker, thereby irritating it, and handling, workability, and recycling are improved. Dust scatters during manufacturing and dismantling, and does not adhere to the skin and mucous membranes of workers, giving them an environment-friendly product.

(Vacuum insulation + heat dissipation pipe)
In the case of the vacuum heat insulating material 10 and the heat radiating pipe 9 as a combination of additional parts, the vacuum heat insulating material 10 is disposed on the storage chamber side (inside the warehouse), and the heat radiating pipe 9 is disposed on the back surface 71 side of the control board box 70 (inside By arranging the box 101, the vacuum heat insulating material 10, the heat radiating pipe 9, and the control board box 70 in this order, the heat radiated from the heat radiating pipe 9 can be prevented from being transmitted into the storage chamber by the vacuum heat insulating material 10, so that the energy-saving refrigerator Etc. can be obtained. Here, between the inner box 101 and the vacuum heat insulating material 10, between the vacuum heat insulating material 10 and the heat radiating pipe 9, and between the heat radiating pipe 9 and the back surface 71 of the control board box 70, another heat insulating material (for example, By providing a (urethane heat insulating material), a fixing member, and a vibration isolating member (for example, an elastic member, a resin member, etc.), effects such as heat insulating efficiency, vibration isolating, and noise reduction can be obtained.

  Further, a concave portion continuous in the length direction or the width direction of the flat plate (or sheet shape) vacuum heat insulating material 10 having a predetermined length, a predetermined width, and a predetermined thickness is provided, and the depth of the concave portion is radiated. A shape (for example, a circular arc shape) into which the heat radiating pipe 9 can be inserted or fitted is set to about 1/3 or more of the diameter of the pipe 9, and a depth and a shape in which the heat radiating pipe 9 can be positioned and held may be used. (For example, the shape of the recess may be an arc having a diameter equal to or greater than the diameter of the heat radiating pipe 9).

  If the heat radiating pipe is arranged in the concave portion, the heat radiating pipe can be embedded by the depth of the concave portion, so the total thickness obtained by adding the size (diameter) of the heat radiating pipe 9 to the thickness of the vacuum heat insulating material 10. The total thickness of the heat insulating material on the back of the refrigerator (the thickness of the heat insulating material between the inner box and the outer box) can be reduced. Therefore, the internal volume of the storage room can be reduced by the reduced thickness. A user-friendly refrigerator can be obtained.

  Here, as described above, the combined thickness of the vacuum heat insulating material 10 and the heat radiating pipe 9 can be reduced. In this case, however, the combined thickness of the vacuum heat insulating material 10 and the heat radiating pipe 9 can be decreased. Since the thickness of the control board box 70 can be reduced by using a wide band gap semiconductor for the semiconductor component 11, the volume in the storage chamber can be further increased despite the addition of additional components. Therefore, it is possible to obtain a device such as a refrigerator that has a high space efficiency and a large volume in the storage room. Here, the same effect can be obtained even when a suction pipe 63 or a capillary tube 62 as a pressure reducing device is arranged instead of the heat radiating pipe 9.

(Heat radiation pipe)
Here, by using a wide band gap semiconductor for the semiconductor component 11 such as the inverter drive circuit component, the thickness of the control board box 70 is reduced, and the heat radiating pipe 9 is disposed as an additional part on the back surface 71 side of the control board box 70. A description will be given of how to dispose the heat radiating pipe 9 of the refrigerator 1. Conventionally, since the thickness of the control board 7 is large, the thickness H2 of the control board box 70 is also large, and the thickness of the heat insulating material 80 enough to cause the heat radiating pipe 9 to be wound on the back surface 71 of the control board box 70 is obtained. In the present embodiment, the semiconductor component 11 such as the inverter drive circuit component is applied to the wide band such as SiC (silicon carbide) or GaN (gallium nitride). Since the thickness of the control board 7 including the semiconductor component 11 and the thickness H of the board control box 70 can be reduced by using the gap semiconductor, the inner box 101 is reduced as the thickness of the control board box 70 is reduced. It is possible to secure a gap (thickness in the heat insulating material) between which the heat radiating pipe 9 is placed between the control board box 70 and the back surface 71 of the control board box 70. An example of how to dispose the heat radiating pipe 9 when the control board box 70 becomes thin will be described with reference to FIG.

  FIG. 9 is a rear perspective view of the refrigerator as viewed from the rear for explaining how to arrange the heat radiating pipes when the machine room of the refrigerator representing the embodiment of the present invention is provided at the lower back. In the figure, the same parts as those in FIGS. In the figure, a machine room 60 is provided at the lower back of the refrigerator 1 and a compressor 6 constituting a refrigeration cycle is arranged. A heat radiating pipe 9 is connected to the discharge pipe of the compressor 6, and the heat radiating pipe 9 penetrates the upper wall surface or the side wall surface forming the machine room 60, and then directly to the outer box 102 of the refrigerator 1 or via a spacer. The compressor 6 is disposed between the outer box 102 and the heat insulating material 80 in a state of being attached to the compressor 6 through the evaporator 200 serving as the expansion device 62 and the cooler from the machine room 60 through the back and side surfaces of the refrigerator 1. The suction pipe 63 is connected. The high-temperature and high-pressure refrigerant gas discharged from the compressor 6 (for example, HC refrigerant, which is a natural refrigerant) is condensed and liquefied in the heat radiating pipe 9 by exchanging heat with the outer box 102 and the heat insulating material 80 on the back and side of the refrigerator 1. Then, the refrigerant passes through the expansion device 62 and the evaporator 200 to become low-temperature and low-pressure refrigerant gas, and returns to the suction side of the compressor 6 to constitute a refrigeration cycle.

  Here, the heat radiating pipe 9 is connected to the discharge pipe of the compressor 6 and is disposed between the outer box 102 on the back of the refrigerator and the heat insulating material 80 or in the heat insulating material 80 from the lower back of the refrigerator to the upper side. An upstream pipe 91, a control board box rear pipe 92 disposed across the back surface of the control board box 70 in the left-right direction or the vertical direction of the refrigerator 1, and an upper rear surface of the refrigerator toward the lower machine room 60. And a downstream pipe 93 that is connected to the compressor 6 via an expansion mechanism 62 and an evaporator 200 to form a refrigeration cycle. Here, a container 61 such as a suction accumulator or a suction muffler is provided between the evaporator 200 and the compressor 6 as appropriate, or a discharge is made between a discharge side pipe (for example, a discharge pipe) of the compressor 6 and the upstream pipe 91. By providing a muffler, reliability is improved and noise is reduced.

  Here, the heat radiating pipe 9 is connected between the outer box 102 on the rear surface of the refrigerator and the heat insulating material 80, or in the heat insulating material, and an upward pipe 91 disposed upward from the lower rear surface of the refrigerator (for example, the machine room 60). An example constituted by a control board box back surface pipe 92 disposed across the back surface of the substrate box 70 in the left-right direction or the up-down direction of the refrigerator 1 and a down line pipe 93 disposed toward the lower machine room 60. However, the refrigerator 1 is provided with a first upstream pipe and a first upstream pipe that is disposed on the rear surface of the refrigerator from the vicinity of the machine room 60 in the lower part of the rear surface of the refrigerator toward the upper side through the side of the control board box 70. The first down pipe disposed in the vicinity of the upper portion of the control board box 70 so that the back surface of the control board box 70 is disposed in the downward direction of the refrigerator 1 and the first down pipe are folded up in the vicinity of the upper portion of the machine room 60 and directed upward. Control group A second upstream pipe arranged on the back of the box 70 upward in the refrigerator 1 and the second upstream pipe are folded in the vicinity of the top of the refrigerator 1 so that the back of the control board box 70 is below the refrigerator 1. The second down pipe disposed downward and the second down pipe are folded in the vicinity of the upper part of the machine room 60 and disposed upward, and the back surface of the control board box 70 is directed upward of the refrigerator 1. A third up pipe arranged upward and a third up pipe arranged in the vicinity of the upper part of the refrigerator 1, and the third up pipe arranged below the side of the control board box 70 downward. You may comprise by down piping.

  That is, the heat radiating pipe 9 folds the back of the control board box 70 once or a plurality of times in the left-right direction or the up-down direction with respect to the refrigerator 1 between the outer box 102 and the inner box 101 on the back of the refrigerator 1. The control board box rear pipe may be arranged on the rear side of the control board box 70. In this way, the length of the heat radiating pipe 9 radiated by the heat radiating pipe 9 on the back face of the control board box 70 is set to the side or upper surface of the refrigerator 1. Even if the heat radiation length is insufficient only by rubbing on the bottom surface, a sufficient heat radiation length can be ensured only on the back surface of the refrigerator 1, so that a device such as an energy-saving refrigerator with good heat radiation efficiency can be obtained. Moreover, since it becomes possible to ensure the length required for heat dissipation of the heat radiating pipe 9 only on the back surface of the refrigerator 1, only on the back surface and side surfaces, or only on the back surface and top surface (or bottom surface), The degree of freedom of arrangement and arrangement is improved. In addition, a portion that does not require the heat radiating pipe 9 to be twisted can be obtained by twisting the heat radiating pipe on the back surface of the control board box 70. A thin, compact and low-cost refrigerator can be obtained.

  In the present embodiment, as described above, the thickness of the control board 7 and the board control box 70 can be obtained by using a wide bandgap semiconductor for the semiconductor component 11 such as an inverter drive circuit component for controlling a device such as a refrigerator. Since the thickness H can be reduced, the heat radiating pipe 9 can be disposed on the back surface of the control board box 70, and the heat radiation efficiency is improved and equipment such as an energy saving refrigerator is obtained.

  Here, conventionally, since the thickness (depth) of the control board box 70 is thick, additional parts such as the heat radiating pipe 9 cannot be arranged on the back surface of the control board box 70 to secure the storage chamber volume. When the pipe 9 is turned on the back of the refrigerator 1, the pipe 9 is folded at the upper or lower part of the control board box 70 or passed through the side surface of the control board box 70 without turning the back side of the control board box 70. The heat radiating length of the heat radiating pipe 9 was secured over the top surface, side surface, and bottom surface of the refrigerator 1. When the heat radiating pipe 9 is folded back at the upper or lower portion of the control board box 70 without turning the back surface of the control board box 70, the heat radiating pipe 9 needs a predetermined heat radiating length or heat radiating area. In addition, a necessary heat radiation length is obtained by folding and arranging a plurality of times in the vertical direction (the height direction of the refrigerator 1), the horizontal direction (the horizontal direction of the refrigerator 1), or an oblique direction at the lower part.

  However, in the present embodiment, the heat radiating pipe 9 can be passed to the back surface of the control board box 70 provided on the upper back surface (or the vicinity of the center of the back surface or the lower back surface) of the refrigerator 1. Since the heat radiating pipe 9 does not have to be arranged in the up and down direction (the height direction of the refrigerator 1), the left and right direction (the horizontal direction of the refrigerator 1), or the diagonal direction (folded), the heat radiating pipe 9 Since the number of times of folding the heat radiating pipe 9 in the vertical direction (the height direction of the refrigerator 1) or in the left and right direction (the horizontal direction of the refrigerator 1) can be reduced, the processing of the heat radiating pipe 9 is improved. Time can be shortened, and energy-saving and low-cost equipment such as refrigerators can be obtained. Further, since the number of times of folding (number of times of folding) of the heat radiating pipe 9 can be reduced, it is possible to suppress deterioration in quality due to defects such as cracks in the heat radiating pipe 9 caused by bending. Therefore, it is possible to obtain a device such as a refrigerator having high quality, high reliability, short processing time, low cost and energy saving.

  If the heat radiating pipe 9 is lengthened, the heat radiating efficiency is improved and the power consumption is reduced, so that an energy saving device can be obtained. Generally, conventional semiconductors use silicon (Si) and are vulnerable to excessive temperature rise. However, the wide band gap semiconductor used in the present invention has the characteristics that it generates little heat and is resistant to high temperatures. Therefore, it can be installed in a heat insulating material, which has been difficult to use in the past, in a relatively high temperature, in the control board box 70, in the machine room 60, or the like. In the case of conventional Si semiconductors, there is a high possibility of failure due to high temperatures unless care is taken as much as possible. However, in the case of wide band gap semiconductors, failure due to high temperatures may occur due to high heat resistance. Small and less problematic. The heat generation temperature of the heat radiating pipe 9 rises up to, for example, about 40 to 120 ° C., but since the wide band gap semiconductor has high temperature proof stress (about 300 ° C.), it can be used without any problem.

  Here, if the heat radiating pipe 9 is fixed to the back surface of the control board box 70 directly or via an auxiliary member (resin member or the like) having thermal conductivity with an adhesive or a screw, the heat of the heat radiating pipe 9 is increased. It is possible to dissipate heat through the control board box 70, and it is possible to obtain a device such as a high-performance refrigerator having a simple structure and excellent heat dissipation performance.

  FIG. 10 is a cross-sectional view of the main part in the vicinity of the control board box of the refrigerator representing the present embodiment. In the figure, the same parts as those in FIGS. In the figure, an auxiliary member 75 is provided between the back surface 71 of the control board box 70 and additional components (for example, the heat radiating pipe 9, the mist air passage, the cooling air passage, the return air passage, etc.). For example, the heat radiating pipe 9 as an additional part rises up to the vicinity of the control board box 70 from the inner side of the outer box 102 while being fixed to the outer box 102 directly from the upper or lower machine chamber 60 or via a fixing member. Alternatively, the control board box 70 is disposed so as to face the back surface 71 after being lowered.

  Here, the auxiliary member 75 is a thermally conductive member having thermal conductivity, and if the elastic member is elastic (for example, rubber or resin having thermal conductivity), the auxiliary member 75 having elasticity is used. It fixes to the back surface 71 of the control board box 70 by adhesion | attachment, screwing, etc., and the heat radiating pipe 9 which is an additional part is pressed to the auxiliary member 75 which has elasticity, or the control board box 70 is radiated pipe via the auxiliary member 75. If it is fixed so as to press against 9, assembly can be simplified, and a high-performance refrigerator or the like having good heat dissipation performance can be obtained at low cost.

  As described above, since the thickness H of the control board box 70 can be reduced by using the wide band gap semiconductor component for the semiconductor part 11 of the control board 7, the thickness H of the control board box 70 can be reduced. Since the heat radiating pipe 9 can be moved in the space generated on the back surface of the control board box 70 disposed on the back surface of the refrigerator 1, the length of the heat radiating pipe 9 can be increased by that much, and a refrigerator with good heat radiation efficiency, etc. Can be obtained. Moreover, since it is not necessary to bend the heat radiating pipe 9 in front of the control board box 70, the number of times of bending of the heat radiating pipe 9 can be reduced, and a device such as a low-cost refrigerator with a low manufacturing cost can be obtained. Further, if the heat radiating pipe 9 is pressed and fixed to the back surface of the control board box 70 via a member having thermal conductivity (for example, a resin member or an elastic member), the heat radiating of the heat radiating pipe 9 is effective via the control board box 70. Since heat can be radiated outside the refrigerator, a high-performance refrigerator or other device can be obtained.

  Here, if the pipe is a suction pipe 63 or a capillary tube 62 which is an expansion device instead of the heat radiating pipe 9, the same effect can be obtained by moving the pipe to the back of the control board box 70. In addition, the air conditioner may not be the refrigerator 1 and includes a refrigeration cycle having pipes such as the heat radiating pipe 9 and the suction pipe 63, and can use a wide band gap semiconductor as a semiconductor component for controlling the equipment. The same effect can be obtained with devices such as (indoor units and outdoor units), water heaters (heat source units and hot water storage tanks), and washing machines. In this case, pipes such as the heat-dissipating pipe 9 as an additional part, the suction pipe 63, and the capillary tube 62 as an expansion device are inserted in an increased space generated on the back surface of the control board box 70 even if no heat insulating material is provided. The same effect can be obtained if it can be forgotten.

(Mist spraying device)
Next, the case where a mist spraying device is used as an additional part will be described. The mist spraying device includes a discharge electrode that generates mist by applying a voltage, a holding member that holds the discharge electrode, and a water supply unit that supplies water to the discharge electrode. Here, since the water supply means only needs to be able to supply water to the discharge electrode, it may have a structure in which water is directly dropped to the discharge electrode via the space and supplied to the discharge electrode, or the water supply means is a metal having good heat conductivity. And one end side is brought into contact with the wall of a low temperature storage room or cooling room such as a freezing room, and the other end side is connected to the discharge electrode to directly cool the discharge electrode and supply condensed water to the discharge electrode, or You may make it produce | generate mist in the vegetable room which is a storage room so that it may produce | generate. Moreover, the refrigerator compartment 2 and the vegetable compartment 5 are arrange | positioned in the upper part, the refrigerator compartment 4 is provided in the lower part of the refrigerator compartment 2 and the vegetable compartment 5, and the cooler for refrigerator compartments is arrange | positioned in the back surface vicinity of the refrigerator compartment 2, In the refrigerator in which the cooler is arranged near the back of the freezer compartment 4, defrosted water from the refrigerator for the freezer compartment is supplied to the discharge electrodes provided near the back of the refrigerator compartment 2 and the vegetable compartment 5 to generate mist. The mist may be supplied into the refrigerator compartment 2 or the vegetable compartment 5. In this case, since defrosted water can be used without special measures, the cooling means is unnecessary and condensed water can be obtained, so that a low-cost refrigerator can be obtained.

  In the case where the first storage room is the vegetable room 5 which is a storage room in a relatively high temperature plus temperature zone, and the second storage room is the refrigeration room 2 which is a storage room in the plus temperature zone, the third storage The room is a freezing room 4 which is a storage room in a minus temperature zone which is a lower temperature storage room than the first storage room, and the refrigerating room 2 which is a second storage room is arranged at the top, When the freezer room 4 which is the third storage room is arranged below and the vegetable room 5 which is the first storage room is arranged below the third storage room, the first storage room and the first storage room A mist spraying device is arranged in the partition wall between the three storage chambers, one end side of the water supply means is arranged on the low temperature freezing chamber 4 side which is the third storage chamber, and the other end side of the water supply means By disposing the discharge electrode connected to the side of the vegetable room 5 which is a relatively high temperature storage room, one end side of the water supply means is cooled by the cold air in the freezing room 4 It is possible, since it is possible to use the temperature difference between the freezing chamber 4 and the vegetable compartment 5, it is possible to even cooling means without special contrivance obtain unnecessary and condensed water, low-cost refrigerator is obtained.

  Here, one end side of the water supply means is arranged on the wall surface or inside of the cooling air passage for supplying cool air to the cooler room or the storage room having the evaporator (cooler) 200 provided in the vicinity of the back of the storage room, By disposing the discharge electrode connected to the other end side of the supply means on the vegetable room 5 or refrigeration room 2 side which is a relatively high temperature storage room, one end of the water supply means is cooled by the cool air in the cooler room or the cooling air passage. Since the side can be cooled, the temperature difference between the freezer compartment 4 and the vegetable compartment 5 can be used, so that no condensing water can be obtained without special measures, so that condensed water can be obtained at low cost. A refrigerator is obtained.

  In the present embodiment, for example, a mist spraying device main body may be provided between the back surface of the refrigerator compartment 2, which is the first storage chamber, and the back surface 71 of the control board box 70. (For example, a second storage room (for example, vegetable room 4) different from the first storage room (for example, refrigeration room 2) in which the control board box 70 is provided on the back surface). A mist spraying port for spraying mist into the storage chamber and a mist blowing path for transporting mist may be provided.

  The main body of the mist spraying device is located at a location different from the rear surface 71 of the control board box 70 (for example, a part different from the rear surface of the control board box 70, or a first storage chamber (for example, the refrigerator compartment 2) provided with the control board box 70 on the rear surface ) Provided in a second storage room (for example, vegetable room 5) different from), and provided on the back surface of the control board box 70 is a mist spraying port for spraying mist into the first storage room and a mist air passage for conveying the mist. In order to do so, a mist spraying device main body, a first storage chamber back surface, and a control board provided with a mist air passage such as a duct or a hose surrounded by the periphery on the back surface of the first storage chamber or the back surface of the second storage chamber. A mist spraying port provided between the back of the box 70 and a mist spraying port may be connected to spray the mist from the mist spraying port into the first storage chamber. Here, the mist spray port for spraying mist into the storage chamber as an additional part on the back surface 71 of the control board box 70, the mist air supply path for supplying mist to the mist spray port, and the cold air generated by the evaporator (cooler) 200 are used. When a cooling air passage for blowing air to the storage room is provided, if a heat insulating material (such as a vacuum heat insulating material or a urethane heat insulating material) is provided between the back surface of the control board box 70 and the additional parts, the control board Since the possibility that the box 70 is cooled and dew can be reduced, a highly reliable device such as a refrigerator can be obtained without causing an electronic component (for example, the wide band gap semiconductor component 11) in the control board box 70 to fail. Therefore, the space behind the control board box 70 can be effectively utilized without reducing the volume in the storage chamber with a simple configuration, and a high-performance refrigerator or the like having a high degree of design freedom can be obtained.

  Here, for example, the return air passage from the first storage chamber or the second storage chamber to the cooler chamber, the return air passage from the first storage chamber to the second storage chamber, or the first Mist may be sprayed to a plurality of storage chambers via a return air passage from one storage chamber to another third storage chamber. In this case, if at least a part of the mist blowing path for spraying mist or at least a part of the return air path is provided on the back surface 71 of the control board box 70 via a heat insulating material (for example, a vacuum heat insulating material), a simple configuration is provided. However, the dead space on the back surface 71 of the control board box 70 can be effectively used without reducing the volume in the storage chamber. In addition, it is possible to prevent the control board box from being exposed to dew, increase the degree of freedom in the arrangement of the mist air passage and the return air passage, and obtain a high-performance refrigerator with a high degree of design freedom.

(Installation of the control board box on the ceiling)
Although the example about the refrigerator of the type which installs the control board 7 and the control board box 70 above the back of the refrigerator 1 was introduced above, the control board 7 and the control board box 70 are installed on the ceiling surface of the refrigerator 1 here. The case where it does is demonstrated.

  FIG. 11 is a cross-sectional view of the main part in the vicinity of the control board when the control board 7 representing the present embodiment is arranged on the ceiling surface of the refrigerator 1, and FIG. 11 (a) shows the ceiling of the control board of the refrigerator of the present invention. FIG. 11B is a cross-sectional view of a main part when a control board of a conventional refrigerator is arranged on the ceiling surface. 11, the same parts as those in FIGS. 1 to 10 are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 11B, the control board 7 and the control board box 70 are provided behind the ceiling surface 151 of the refrigerator 1. As shown in FIG. 11 (b), in the conventional refrigerator 1, silicon (Si) is used for semiconductor components such as inverter drive circuit components for controlling the equipment, so that the thickness of the inverter drive circuit components 11 is large. Since the heat-resistant temperature is low, it is necessary to provide a large radiator 12, and the combined thickness of the inverter drive circuit component 11 and the radiator 12 is increased, and accordingly, the thickness of the control board box 70 is also increased. For this reason, the inner box 101 protrudes (starts out) inside the cabinet (in the storage chamber 2) in accordance with the size and shape of the control board box 70. Therefore, the thickness of the heat insulating material 80 between the back surface 71 of the control board box 70 and the inner box 101 is made as thin as possible because it is necessary to increase the internal volume (storage chamber volume) as much as possible. It is difficult to provide additional parts such as the vacuum heat insulating material 10 between the back surface 71 of the control board box 70 and the inner box 101, and the additional parts are provided in portions other than the back side of the control board box 70. (The heat-dissipating pipe 9 and the vacuum heat insulating material 10 which are additional parts are disposed only up to the front of the control board box 70, and are folded or folded before the control board box 70 to be attached to the rear surface of the control board box 70. 71 was avoided.)

  However, as shown in FIG. 11A, in the refrigerator according to the present embodiment, since the wide band gap semiconductor is used for the semiconductor component 11, the thickness of the control board box 70 can be reduced. It can be provided between the back surface 71 of the box 70 and the inner box 101. In FIG. 11A, the control board 7 and the control board box 70 are provided behind the ceiling surface 151 of the refrigerator 1. In the present embodiment, since a wide band gap semiconductor is used for the semiconductor component 11 that is a control component for controlling the device, the thickness of the semiconductor component 11 such as the inverter drive circuit component and the radiator 12 can be reduced. Since the thickness of the substrate box 70 can be reduced, the height can be suppressed and the amount of heat generated can be reduced, so that the radiator 12 can be significantly reduced. Thus, the height around the inverter drive circuit component 11 can be suppressed to the height of other components.

  11A, the control board 7 is not inclined with respect to the ceiling surface of the refrigerator 1 as in the control board box 70 of the conventional refrigerator shown in FIG. Since it can be installed substantially parallel to the ceiling surface of the refrigerator, the storage space for the control board box 70 can be greatly reduced. Accordingly, the protrusion of the inner box 101 is not required, and the volume (storage volume) of the storage chamber can be greatly increased.

  Here, in the conventional refrigerator 1, it is necessary to increase the depth of the storage space in the control board box 70 around the semiconductor component 11 such as the inverter drive circuit parts, and the inner box 101 on the back surface of the control board box 70 has the protruding portion 83. Therefore, it was difficult to provide additional parts because the control board box 70 was provided in the heat insulating material thickness increasing portion 85. However, since the thickness of the control board 7 and the control board box 70 in the present invention can be reduced by using a wide band gap semiconductor, it is possible to secure the volume of the protruding portion 83 and the heat insulating material thickness increasing portion 85. The control board 7 and the control board box 70 do not have to be inclined with respect to the top surface 151 of the refrigerator 1 and can be installed substantially parallel to the top surface 151 of the refrigerator 1, so that the structure is simple and the control is performed. The storage space for the substrate box 70 can also be significantly reduced. Furthermore, since the inner box 101 does not protrude into the refrigerating room 2 as the storage room, the amount of food stored in the refrigerating room 2 as the storage room can be increased.

  Further, since the height H of the control board box 70 can be reduced, the amount 83 of the protrusion of the inner box 101 to the inside of the box is reduced (the volume increase portion 83 in the box) and the height H of the control board box 70 is reduced. Increased portion 85 of the top heat insulating material 81 between the substrate box 70 and the inner box 101 (the top surface thickness of the heat insulating box constituting the refrigerator 1) (heat insulating material thickness increasing portion 85 due to the control substrate box thickness decreasing) ) And other volume increasing parts 83 and 85 (for example, functional parts (mist spraying device, sterilizing device, sterilizing device, etc.) and air passage components (cooling air passage, mist air passage, air volume adjustment and air path switching) Damper devices), refrigeration cycle components (heat dissipating pipes (condensation pipes), decompression devices (expansion valves, capillary tubes, etc.), suction pipes, etc.) and other components (vacuum insulation, wiring and lighting components (eg LED lighting) Inside lighting and Or provided tell the like and a display lamp))), may be arranged.

  In this way, by arranging the additional parts in the increased portion 83 of the internal volume and the increased thickness (volume) portion 85 of the heat insulating material 81 of the top surface heat insulating material 81 on the back surface 71 of the control board box 70, compared to the conventional case. Since an additional function can be obtained without reducing the internal volume, a user-friendly refrigerator with high space efficiency and high cost performance can be obtained.

  Further, if an additional part is provided in the internal volume increasing portion 83 or the control board box rear surface insulating material thickness increasing portion 85, the additional volume can be added without reducing the internal volume (storage chamber storage volume). Functions can be realized, or another part can be placed in the part where the additional parts were placed, so additional functions can be used without reducing the storage chamber volume, improving space efficiency and user convenience A good refrigerator is obtained. In addition, when no additional parts are provided in the storage chamber volume increasing portion 83 or the control board box rear heat insulating material thickness increasing portion 85, the storage chamber volume can be increased with a refrigerator having the same external dimensions as the conventional one, thus improving the space efficiency. The storage capacity is large and an easy-to-use refrigerator can be obtained.

  In the present embodiment, as shown in FIG. 11 (a), the control board 7 can be reduced in height and size by reducing the height and size of the control board 7. Thus, conventionally, the control board box 70 is in front of the control board box 70. Additional components such as the vacuum heat insulating material 10 and the heat radiating pipe 9 that could only be installed can be installed on the back surface (back side) 71 of the control board box 70, and the flat plate heat insulating material 10 is not bent and is flat. Therefore, it is possible to prevent the outer packaging material (packaging material) constituting the vacuum heat insulating material 10 from being broken by being bent. Moreover, since the control board 7 which is a heat generating part, and the refrigerator compartment 2 can be shielded with the high performance vacuum heat insulating material 10, it leads also to reduction of power consumption.

  Further, the vacuum heat insulating material 10 disposed on the ceiling surface 151 and the vacuum heat insulating material 10 disposed on the back surface 152 can be connected to each other without interruption at the back surface 71 of the control board box 70, and the ceiling surface 151. And the vacuum heat insulating material arrange | positioned by the back surface 152 can be provided continuously, and apparatuses, such as a refrigerator with favorable heat insulation performance, can be obtained. Here, even if the vacuum heat insulating material 10 disposed on the ceiling surface 151 and the vacuum heat insulating material 10 disposed on the back surface 152 are integrally formed continuously, the vacuum heat insulating material 10 can be disposed. The degree of freedom of arrangement of the heat insulating material 10 is improved, and a low-cost refrigerator or the like can be obtained.

  As described above, the compressor 6, the heat radiating pipe 9, the expansion device 62, the cooler 200, and the suction pipe 63 are connected in order by piping, and heat insulation is provided between the inner box 101 and the outer box 102. The heat insulation box which the material 80 is arrange | positioned and has several storage rooms (For example, the refrigerator compartment 2, the switching room 3, the ice making room 35, the freezer compartment 4, the vegetable compartment 5, etc.) in the front side, and the back surface 152 of a heat insulation box. Is provided on the upper or lower portion of the machine chamber 60 in which the compressor 6 is housed, and on the back surface 152 or the ceiling surface 151 or the bottom surface (bottom surface) of the heat insulating box, and drives and controls driving components such as the compressor 6. A control board box 70 for accommodating the control board 7 and a semiconductor component 11 such as a transistor or a diode mounted on the control board 7, and a wide band gap semiconductor such as SiC or GaN is used for the semiconductor part 11. Yo Thus, the semiconductor component 11 or the control board 7 can be downsized (both the semiconductor component 11 and the control board 7 may be miniaturized), and the back surface 71 of the control board box 70 (or the control board box 70 such as the side, top, bottom). Or an additional part (for example, the vacuum heat insulating material 10, the heat radiating pipe 9, the suction pipe 63, the expansion device 62, the mist spraying device, the mist air passage, or the cooling air). Roads (including return air passages) and damper devices, etc. are arranged, so that it is possible to have an additional function without providing extra space, and a refrigerator having an additional function without changing the size or volume. Equipment such as air conditioners can be obtained. Further, in the conventional control board using a Si semiconductor, the control board box 70 is large and high in height, so that additional components that could not be arranged on the back surface 71 of the control board box 70 can be arranged, and space is effectively used. It can be used to obtain additional functions, and the equipment can be miniaturized.

  Here, by using a wide band gap semiconductor such as SiC or GaN for the semiconductor component 11, the semiconductor component 11 or the control substrate 7 can be downsized (both the semiconductor component 11 and the control substrate 7 may be downsized) and controlled. Control board box 70 back surface 71 (or side walls other than the opening of the control board box 70 such as side, top, bottom, etc.) generated by reducing the height and size (vertical and horizontal width and length) of the board box 70 Space 83, 85 (which may be at least one wall) (for example, an enlarged space or surplus space 83 in the storage chamber generated by lowering the height of the control board box 70, or an expansion generated in the heat insulating material 80. The additional parts may be arranged in the space or the surplus space 85). In this case, in the conventional control board using a Si semiconductor, the control board box 70 is large and high in height, so that additional parts that could not be arranged on the back surface 71 of the control board box 70 can be arranged. Effective use is possible, additional functions can be obtained, and limited space can be used effectively. In addition, the equipment can be made smaller.

  Here, since the control board box 70 can be reduced in size or thinned, the control board box 70 can also be arranged in the side wall surface of the refrigerator 1, the heat insulating material, or the partition 8, which could not be arranged conventionally. As a result, surplus space is generated in the heat insulating material 80 on the back surface of the refrigerator 1, so that the internal volume can be increased or additional components can be arranged, and the space can be effectively used.

  Therefore, according to the present invention, it is possible to reduce the thickness of the semiconductor component 11 by using a wide band gap semiconductor for the semiconductor component 11 for controlling the device, and the control substrate 7 and the control substrate 7 on which the semiconductor component 11 is mounted. Since the height (depth) of the control board box 70 for storing the control board box 70 can be reduced, the installation space for the control board box 70 can be reduced. Further, since the height of the control board box 70 can be reduced, additional parts such as the heat radiating pipe 9 and the vacuum heat insulating material 10 can be disposed on the back surface 71 of the control board box 70, so that an additional function can be provided without providing an extra space. Thus, it is possible to obtain a device such as a refrigerator or an air conditioner having an additional function without changing the size or volume.

  Further, when the device is the refrigerator 1, the control board 7 and the control board box 70 can be reduced in height and size, so that the inner box 101 is stored in the storage (storage) due to the large height of the control board box 70. The protruding part (the amount of decrease in the protruding amount of the inner box to the inner side of the box or the increased volume of the inner volume) 83 is no longer required, so the contents of the box can be obtained without any significant changes in the external shape. The product can be increased. In addition, since there is room in the heat insulation space (a portion where the thickness of the heat insulating material is increased or a portion where the thickness of the heat insulating material is increased due to a decrease in the thickness of the control board box) 85 between the back surface of the control board box and the storage chamber, this extra space Additional components such as a heat radiating pipe and a vacuum heat insulating material can be provided in the hood, and an additional function can be obtained without reducing the internal volume.

(Attach vacuum insulation material to control board box)
Here, in FIGS. 1, 8, and 11, a predetermined gap exists between the vacuum heat insulating material 10 and the back surface 71 of the control board box 70, and urethane foam heat insulating material is filled in the predetermined gap. The composite film which arranged aluminum foil on at least one side of the outer packaging material of the vacuum heat insulating material 10 is used, and the multilayer film side where the aluminum foil of the outer packaging material of the vacuum heat insulating material 10 is arranged is controlled. You may affix directly on the back surface 71 of the board | substrate box 70. FIG. Here, the multilayer film is composed of a surface protective layer, an intermediate layer, a heat seal layer, and the like. In this way, by directly attaching the vacuum heat insulating material 10 to the back surface of the control board box 70, the predetermined gap between the vacuum heat insulating material 10 and the back surface 71 of the control board box 70 is small, and urethane is not easily filled (in the predetermined gap). There is no risk that the heat insulation performance will be reduced.

  Moreover, the multilayer film of the outer packaging material arranged on one surface of the laminate (core material) constituting the sheet-like (flat plate) vacuum heat insulating material and the multilayer film arranged on the other surface of the laminate are: The laminated structure may be different, and the multilayer film on one side may have an aluminum foil in the intermediate layer, and the intermediate layer of the multilayer film on the other side may be subjected to aluminum vapor deposition. In this case, by disposing the multilayer film side on which the aluminum foil of the outer packaging material is disposed on the back surface 71 of the control board box 70, the temperature of the vacuum heat insulating material 10 due to the heat of the control board box 70 on the high temperature side increases. In addition, it is possible to suppress a decrease in heat insulation performance due to gas ingress. Also, compared to the case where aluminum foil is used for the multilayer film disposed on both sides of the laminate, the intermediate layer of the multilayer film disposed on one surface of the laminate has aluminum foil on the other surface. When aluminum vapor deposition is applied to the intermediate layer of the multilayer film to be disposed, heat is transferred from the multilayer film having the aluminum foil disposed on one surface to the multilayer film subjected to aluminum vapor deposition disposed on the other surface. Since the transmission of can be reduced, the heat insulation performance is improved. Therefore, the heat insulation performance is improved by arranging the multilayer film side on which the aluminum foil of the outer packaging material is disposed on the back surface 71 of the control board box 70. That is, since the back side of the control board box 70 is hotter than the storage chamber side, the heat insulating performance is improved by arranging the multilayer film side in which the aluminum foil of the outer packaging material is arranged on the high temperature side.

  Therefore, a highly reliable device such as a refrigerator with high heat insulation performance can be obtained. In addition, since the vacuum heat insulating material 10 can be attached in advance to the control board box 70 before assembling the refrigerator 1 that is a device, the assembling property is improved and the positioning of the vacuum heat insulating material 10 and the control board box 70 is improved. Can be reduced, and the assembly time can be reduced.

  Here, although the example which affixes the vacuum heat insulating material 10 directly on the back surface 71 of the control board box 70 was demonstrated, the location and site | part which affix the vacuum heat insulating material 10 do not need to be the back surface 71, There may be at least one wall (preferably outside the wall surface) of the surrounding wall other than the opening. A peripheral wall other than the opening in a state where the control board box 70 is installed in a device such as the refrigerator 1 (for example, as shown in FIG. 11 is a top wall, a side wall, and a bottom wall of the control board box 70, and the control board box 70 is placed on the top face of the refrigerator 1 as a device as shown in FIG. If the opening is installed substantially horizontally so that it faces the upper surface side of the refrigerator 1, the four side walls around the opening of the control board box 70 are indicated. It is done.

(Other equipment)
Here, in an apparatus such as an air conditioner, a water heater, or a washing machine, the compressor 6, a condenser such as a heat radiating pipe 9, an expansion device 62 such as a capillary tube, and an evaporator 200 are sequentially connected by piping. A refrigeration cycle is provided. An air conditioner has an outdoor unit, a water heater has a heat source unit, and a washing machine has a compressor mounted on the main body. In this case, the equipment is provided on the main body of the equipment such as an outdoor unit in which the compressor 6 is disposed, the heat source machine, and the main body of the washing machine, and above the compressor 6 (or on the front, side, and rear). A control board box 70 that houses a control board 7 that controls driving of the semiconductor 6, a semiconductor part 11 such as an inverter drive circuit part that is mounted on the control board 7 and includes transistors and diodes that control the operation of the device, and compression A cooling fan for cooling the machine and the like, and by using a wide band gap semiconductor for the semiconductor component 11, the semiconductor component 11 or the control board 7 can be downsized (even if both the semiconductor component 11 and the control board 7 are downsized). And an additional component (for example, heat radiation) in the space between the back surface 71 of the control board box 70 (or the periphery of the control board box such as a side surface, top surface, and bottom surface) and the compressor 6. In the conventional control board using Si semiconductor, it is possible to arrange piping such as type 9 and suction pipe 63, vacuum heat insulating material 10, cooling fan 68, soundproofing material, accumulator, muffler, etc. Additional components that could not be disposed on the back surface 71 of the control board box 70 can be disposed, space can be used effectively, additional functions can be obtained, and the size of the device can be reduced.

  Further, by using a wide band gap semiconductor for the semiconductor component 11, the semiconductor component 11 or the control board 7 can be downsized (both the semiconductor part 11 and the control board 7 may be miniaturized), and the height of the control board box 70. Excess space or expanded space between the rear surface 71 of the control board box 70 (or the periphery of the control board box such as the side surface, upper surface, and bottom surface) generated by lowering the height of the compressor 6 and components such as the compressor 6 Additional components (for example, piping such as the heat radiating pipe 9 and the suction pipe 63, the vacuum heat insulating material 10, the cooling fan 68, the soundproofing material, the accumulator, and the muffler) can be disposed. In a conventional control board using a conventional semiconductor which is not a gap semiconductor), the control board box 70 is large and high, and therefore the back of the control board box 70 is used. 71 could not be arranged in the additional parts enables disposed a limited effective use of housing space can be a gain additional functionality, also attained is small equipment.

  Here, since it becomes possible to affix the vacuum heat insulating material 10 to the control board box 70 in advance before assembling the air conditioner, the water heater, the washing machine, etc., which is a device, the assemblability is improved and the vacuum heat insulating material is also provided. Since the positioning of the control board 10 and the control board box 70 becomes unnecessary, the assembly time can be reduced.

  According to the present invention, since a wide band gap semiconductor is used as a semiconductor component for driving and controlling the equipment, additional parts such as a heat radiating pipe and a vacuum heat insulating material can be disposed on the back and the periphery of the control board box, so that extra space It is possible to have an additional function without providing a. In addition, the thickness of the semiconductor component can be reduced, and the height (depth) of the control board on which the semiconductor component is mounted and the control board box that houses the control board can be reduced, so that the installation space for the control board box can be reduced. . In addition, since the height of the control board box can be reduced, additional parts such as heat radiation pipes and vacuum heat insulating materials can be placed on the back of the control board box, making it possible to have additional functions without providing extra space. Equipment such as a refrigerator and an air conditioner having additional functions can be obtained without changing the size and volume.

  In addition, when the equipment is a refrigerator, the control board and control board box can be reduced in height and size, so that the protruding part where the inner box protrudes inside the cabinet due to the large height of the control board box. Since it becomes unnecessary, the internal volume can be increased. In addition, since there is room in the heat insulation space between the back of the control board box and the storage room, additional parts such as heat radiation pipes and vacuum heat insulating materials can be provided in this room without reducing the internal volume. Additional functions can be obtained.

The schematic sectional drawing of the refrigerator showing Embodiment 1 of this invention. The rear perspective view which shows arrangement | positioning of the compressor, the heat radiating pipe, etc. which comprise the refrigerating cycle of the refrigerator back showing Embodiment 1 of this invention. The rear perspective view which shows arrangement | positioning of the compressor, the heat radiating pipe, etc. which comprise the refrigerating cycle of the refrigerator back showing Embodiment 1 of this invention. The figure which looked at the control board 7 of the refrigerator from the front. The figure which looked at the control board 7 from the side. The figure which looked at the control board 7 in the control board box 70 showing Embodiment 1 of this invention from the side surface. Explanatory drawing about the volume increase of the back part of the control board box 70 in the refrigerator 1 of embodiment of this invention. The principal part sectional drawing of the control board box vicinity of the refrigerator showing this Embodiment. The rear perspective view which looked at the refrigerator for demonstrating how to arrange | position the heat radiating pipe in case a machine room is provided in the back lower part. The principal part sectional drawing of the control board box vicinity of the refrigerator showing this Embodiment. The principal part sectional drawing of the control board vicinity at the time of arrange | positioning the control board 7 showing this Embodiment on the ceiling surface of the refrigerator 1. FIG.

  1 refrigerator, 2 refrigerator compartment, 3 switching room, 4 freezer room, 5 vegetable room, 6 compressor, 7 control board, 8 heat insulating material (partition wall), 9 heat radiating pipe, 10 vacuum heat insulating material, 11 inverter drive circuit parts ( Semiconductor parts), 12 radiators, 13 transformers, 14 relays, 15 converters, 16 capacitors, 17 current detection sensors, 35 ice making rooms, 40 heat dissipation auxiliary parts, 60 machine rooms, 70 control board boxes, 71 back of control board boxes, 75 Auxiliary member, 80 Back surface heat insulating material, 81 Top surface heat insulating material, 83 Projection amount decrease amount to inner side of inner box (increase in internal volume), 85 Insulation thickness increase portion (control board box thickness decrease) Insulating material thickness increase part), 91 ascending piping, 92 descending piping, 93 control board box rear piping, 101 inner box, 102 outer box, 110 heat radiation auxiliary member, 151 top surface, 152 back , 200 evaporator.

Claims (10)

  A refrigeration cycle configured by connecting a compressor, a heat radiating pipe, an expansion device, a cooler, and a suction pipe in order, and a heat insulating material between the inner box and the outer box, and a plurality of storage chambers on the front side A heat insulation box, a machine room provided in the upper or lower part of the back surface of the heat insulation box and containing the compressor, and a control provided in the back surface or ceiling surface of the heat insulation box to control the compressor A control board box for housing the board, and semiconductor components such as transistors and diodes mounted on the control board, and a wide band gap semiconductor is used for the semiconductor parts, and additional parts are provided on the back or the periphery of the control board box Refrigerator characterized by arranging.   The refrigerator according to claim 1, wherein the additional component is a vacuum heat insulating material.   The refrigerator according to claim 2, wherein the vacuum heat insulating material is directly attached to at least one of a back wall and a peripheral wall of the control board box.   The refrigerator according to any one of claims 1 to 3, wherein the additional component is the heat radiating pipe, the expansion device, or the suction pipe.   The refrigerator according to any one of claims 1 to 4, further comprising a cooling air passage that supplies cold air generated by the cooler to the storage chamber, and the additional component is the cooling air passage. .   A mist spraying device for spraying mist in the storage chamber is provided, and the additional component stores the mist spraying device, a mist blowing path for supplying mist generated by the mist spraying device to the storage chamber, or the mist. The refrigerator according to any one of claims 1 to 5, wherein the refrigerator is a mist spraying port for spraying the chamber.   The control board box is composed of a heat conductive member, the semiconductor component is fixed so as to be thermally connected to the control board box, and the heat generated by the semiconductor component is radiated by the control board box. The refrigerator according to any one of claims 1 to 6.   The refrigerator according to any one of claims 1 to 7, wherein the semiconductor component is connected to the control board box through a heat radiation auxiliary component capable of being electrically insulated.   The refrigerator according to any one of claims 1 to 8, wherein the semiconductor component is SiC (silicon carbide) or GaN (gallium nitride).   A compressor, a condenser, an expansion device, and an evaporator are connected in order by piping, a refrigeration cycle, a main body on which the compressor is disposed, a drive unit that is provided above the compressor and controls the compressor. A control board box for storing the control board to be used and a semiconductor component such as a transistor or a diode mounted on the control board, and a wide band gap semiconductor is used for the semiconductor part and the back surface of the control board box and the compression A device characterized in that additional parts are arranged in the space between the machine.

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