JP5732345B2 - Oxide superconducting wire connecting structure and oxide superconducting wire connecting method - Google Patents

Description

  The present invention relates to an oxide superconducting wire connecting structure and an oxide superconducting wire connecting method.

RE-123 oxide superconductor discovered in recent years (REBa ₂ Cu ₃ O _{7-X, where} RE is a rare earth element including Y) exhibits superconductivity above liquid nitrogen temperature and has low current loss. It is considered as a very promising material for practical use, and it is desired to process it into a wire and use it as a power supply conductor or a magnetic coil. As a method for processing this oxide superconductor into a wire, a method of forming an oxide superconducting layer on a metal substrate tape has been studied.

  In the oxide superconducting wire, the stability of the two-layer structure in which a thin silver stabilizing layer is formed on the oxide superconducting layer and a thick stabilizing layer made of a highly conductive metal material such as copper is provided thereon. A structure in which a chemical layer is laminated is employed. The silver stabilizing layer is also provided for the purpose of protecting the oxide superconducting layer from moisture, and the copper stabilizing layer is changed from the superconducting state to the normal conducting state due to the disturbance of the oxide superconducting layer. It is provided for the purpose of functioning as a bypass for commutating the current of the oxide superconducting layer when it is going to transition and electrically protecting the oxide superconducting wire.

In order to apply such an oxide superconducting wire to a practical device, development of a technique for connecting an oxide superconducting conductor is desired.
As a conventional method for connecting the oxide superconducting wire, there are proposed a method in which the outer surface sides of the stabilization layer are bonded to each other with solder, and a method in which the stabilization layers are brought into contact with each other and heat is applied to perform diffusion bonding. (See Patent Documents 1 and 2).

JP 2008-234957 A JP 2007-12582 A

However, in the connection structure connected by the method disclosed in Patent Document 1, a step is generated in the wire at the connection portion. Therefore, when the wire is wound into a coil shape, a load is applied to the wire above the step portion. There is a risk that the superconducting characteristics will deteriorate at that portion.
Even in the connection structure connected by the method disclosed in Patent Document 2, since it has a structure in which another wire is bonded for connection, there is a step in the wire, as in the method disclosed in Patent Document 1. It will occur.

  The present invention has been made in view of the conventional situation as described above, and can be connected without causing a step, and can suppress the intrusion of moisture into the oxide superconducting layer at the connection portion. It is an object of the present invention to provide a superconducting wire connecting structure and an oxide superconducting wire connecting method.

In order to solve the above problems, the superconducting laminate in which the base material, the intermediate layer, the oxide superconducting layer, and the silver layer are laminated in this order is a connection structure of the oxide superconducting wire of the present invention. Soldered from the base material to the silver layer in the vicinity of one of the connection ends of the superconducting laminate that is folded in half with the solder layer sandwiched through the groove processing part reaching from the silver layer to the base material The at least two first oxide superconducting wires removed so as to be exposed are formed by integrally connecting the exposed solder layers.
The connection structure of the oxide superconducting wire according to the present invention is such that the superconducting laminate is folded in two so that the oxide superconducting layer is sandwiched between the base materials, and one of the superconducting laminates stacked in the folded state is connected. The first oxide superconducting wire is formed by connecting the base material near the edge to the silver layer so that the solder layer is exposed.
Therefore, it is possible to realize a configuration in which the oxide superconducting wire having a configuration in which the oxide superconducting layer is shielded from the outside is connected without causing a step without increasing the overall thickness of the wire.
Therefore, since the infiltration of moisture into the oxide superconducting layer is suppressed, the oxide superconducting layer is not damaged by moisture, the superconducting characteristics can be prevented from being deteriorated, and further, there is no step, so that the coil shape is wound. When drawn, local degradation does not occur.

In order to solve the above problems, the superconducting laminate in which the base material, the intermediate layer, the oxide superconducting layer, and the silver layer are laminated in this order is a connection structure of the oxide superconducting wire of the present invention. Soldered from the base material to the silver layer in the vicinity of one of the connection ends of the superconducting laminate that is folded in half with the solder layer sandwiched through the groove processing part reaching from the silver layer to the base material The first oxide superconducting wire is formed by removing the exposed portion, and the base material, the intermediate layer, the oxide superconducting layer, and the silver layer are laminated in this order to form the second oxide superconducting wire. And the connection ends of the at least two first oxide superconducting wires are arranged to face each other.
The exposed solder layer of the first oxide superconducting wire is connected to the second oxide superconducting wire.
The connection structure of the oxide superconducting wire according to the present invention has a solder layer for the two first oxide superconducting wires formed by removing the solder layer from the base material in the vicinity of the connection end to the silver layer. Since one second oxide superconducting wire is connected so as to fill the step in the exposed portion, the oxide superconducting layer is shielded from the outside without increasing the overall thickness of the wire. It is possible to realize a configuration in which oxide superconducting wires are connected without causing a step.
Therefore, since the infiltration of moisture into the oxide superconducting layer is suppressed, the oxide superconducting layer is not damaged by moisture, the superconducting characteristics can be prevented from being deteriorated, and further, there is no step, so that the coil shape is wound. When drawn, local degradation does not occur.

In the oxide superconducting wire connecting structure according to the present invention, the oxide superconducting wire may be formed by further laminating a metal stabilizing layer on the silver layer.
In this case, since the silver superconductor layer and the metal stabilizing layer are provided on the surface of the oxide superconductor layer on the solder layer side, the effect of stabilizing the oxide superconductor layer is further enhanced. In addition, the surface of the oxide superconducting layer on the solder layer side is laminated with a silver layer and a metal stabilizing layer, and more effectively prevents moisture from entering the oxide superconducting layer. It is possible to prevent the deterioration of the superconducting characteristics more reliably without being damaged by moisture.

In order to solve the above problems, the oxide superconducting wire connection structure of the present invention comprises a base material, an intermediate layer, an oxide superconducting layer, a silver layer, and a metal stabilizing layer laminated in this order. And a third oxide superconducting wire is formed by folding the superconducting laminate into two with a solder layer interposed therebetween through a grooved portion extending from the metal stabilizing layer to the base material. The metal stabilization layer at the connection end of the wire extends outward for a predetermined length from the connection end of the substrate, and the substrate, the intermediate layer, the oxide superconducting layer, the silver layer, and the metal stabilization layer The superconducting laminate formed by laminating in this order is folded in half with the solder layer sandwiched between the grooved portion reaching from the metal stabilizing layer to the base material, and the metal stabilizing layer near the connection end is removed. A solder layer is formed on the exposed silver layer to form a fourth oxide superconducting wire;
An extended portion of the metal stabilization layer of the third oxide superconducting wire is sandwiched between two folded portions of the fourth oxide superconducting wire and is connected by a solder layer.
The method for connecting oxide superconducting wires of the present invention includes a third oxide superconducting wire formed by folding a superconducting laminate in half so that the oxide superconducting layer is sandwiched between substrates, and the third oxide superconducting wire. A structure in which the superconducting laminate is folded in half through the metal stabilization layer at the connection end of the wire, and the fourth oxide superconducting wire is formed by removing the metal stabilization layer near the connection end. Therefore, it is possible to realize a configuration in which the oxide superconducting wire having the configuration in which the oxide superconducting layer is shielded from the outside is connected without causing a step without increasing the overall thickness of the wire.
Therefore, since the infiltration of moisture into the oxide superconducting layer is suppressed, the oxide superconducting layer is not damaged by moisture, the superconducting characteristics can be prevented from being deteriorated, and further, there is no step, so that the coil shape is wound. When drawn, local degradation does not occur.

In order to solve the above problems, the superconducting laminate in which the base material, the intermediate layer, the oxide superconducting layer, and the silver layer are laminated in this order is a silver superconducting laminate according to the present invention. In the oxide superconducting wire that is folded in half with the solder layer sandwiched between the grooved portion reaching from the layer to the substrate, the silver is removed from the substrate in the vicinity of one connection end of the superconducting laminate that is folded in half. At least two of the first oxide superconducting wires are prepared, and a first step of obtaining a first oxide superconducting wire by removing up to the layer so that the solder layer is exposed, and each first oxide superconducting wire And a second step of connecting the first oxide superconducting wires together by superimposing and heating the solder layers exposed at the connection ends of the wires to integrate the solder layers.
The method for connecting the oxide superconducting wire of the present invention is obtained by folding the superconducting laminate in two so that the oxide superconducting layer is sandwiched between the base materials to obtain an oxide superconducting wire, and then connecting the oxide superconducting wire. In this configuration, first oxide superconducting wires obtained by removing the solder layer from the nearby base material to the silver layer are connected to each other.
In the first oxide superconducting wire, the connection method is configured to connect the first oxide superconducting wires by heating the solder layers exposed by removing the base layer to the silver layer. The oxide superconducting wire having a structure in which the oxide superconducting layer is shielded from the outside can be joined without causing a step.
Therefore, it is possible to provide a connected body of oxide superconducting wire excellent in superconducting characteristics without causing local deterioration due to a step when wound in a coil shape.

In order to solve the above problems, the superconducting laminate in which the base material, the intermediate layer, the oxide superconducting layer, and the silver layer are laminated in this order is a silver superconducting laminate according to the present invention. In the oxide superconducting wire that is folded in half with the solder layer sandwiched between the grooved portion reaching from the layer to the substrate, the silver is removed from the substrate in the vicinity of one connection end of the superconducting laminate that is folded in half. A first step of obtaining a first oxide superconducting wire, removing at least two layers so as to expose the solder layer, and preparing at least two first oxide superconducting wires, a base material, an intermediate layer, At least one second oxide superconducting wire in which an oxide superconducting layer and a silver layer are laminated in this order is prepared, and the connection ends of the at least two first oxide superconducting wires are arranged to face each other. And the second acid is applied to the exposed solder layer. And a third step of connecting the at least two first oxide superconducting wires and the at least one second oxide superconducting wire by superimposing and heating the silver layer of the physical superconducting wire. And
In the method for connecting oxide superconducting wires of the present invention, the silver layer of the second oxide superconducting wire is overlapped with the exposed solder layer of the first oxide superconducting wire arranged opposite to the solder layer portion. Since the first oxide superconducting wire and the second oxide superconducting wire are connected by heating after filling the step, the oxide superconducting wire having a structure in which the oxide superconducting layer is shielded from the outside is stepped. It can join without generating.
Therefore, it is possible to provide a connected body of oxide superconducting wire excellent in superconducting characteristics without causing local deterioration due to a step when wound in a coil shape.

Moreover, the oxide superconducting wire connection method of the present invention may be such that the oxide superconducting wire further has a metal stabilizing layer laminated on a silver layer.
In this case, since the silver layer and the metal stabilizing layer are formed on the surface of the oxide superconducting layer on the solder layer side, the oxide superconducting wire connecting body further improving the effect of stabilizing the oxide superconducting layer is provided. Can be provided.
In addition, a connection body of oxide superconducting wire with a structure in which the solder layer side surface of the oxide superconducting layer is laminated with a silver layer and a metal stabilizing layer can be manufactured. Therefore, it is possible to provide an oxide superconducting wire connecting body that can more reliably prevent the oxide superconducting layer from being damaged by moisture and degrading the superconducting characteristics.

In order to solve the above-described problems, a method for connecting an oxide superconducting wire according to the present invention includes a base material, an intermediate layer, an oxide superconducting layer, a silver layer, and a metal stabilizing layer laminated in this order. In the oxide superconducting wire in which the superconducting laminate is folded in two with the solder layer sandwiched between the grooved portion reaching from the metal stabilizing layer to the substrate, the metal stabilizing layer on the connection end side is outside the substrate. A fourth step of obtaining a third oxide superconducting wire protruding in the direction;
The metal stabilizing layer side of the superconducting laminate in which the base material, the intermediate layer, the oxide superconducting layer, the silver layer, and the metal stabilizing layer are laminated in this order is arranged in the width direction of the superconducting laminate. A groove is formed by grooving from the metal stabilization layer to the base material along the longitudinal direction from the middle portion, and a solder layer is formed on the upper surface of the metal stabilization layer side where the groove processing portion is provided Then, the superconducting laminate is folded in two through the grooved portion so that the solder layer is on the inside, the metal stabilizing layer near the connection end is removed, and a solder layer is formed on the exposed silver layer And a fifth step of obtaining a fourth oxide superconducting wire,
Preparing at least one third oxide superconducting wire, preparing at least one fourth oxide superconducting wire, and providing a metal stabilization layer protruding outward from the third oxide superconducting wire; The at least one third oxide superconducting wire and the at least one fourth fourth are heated so as to sandwich a solder layer formed on the exposed silver layer of the fourth oxide superconducting wire. A sixth step of connecting the oxide superconducting wire;
It is characterized by providing.
In the method for connecting the oxide superconducting wire of the present invention, the superconducting laminate is folded in two so that the oxide superconducting layer is sandwiched between the bases, and the metal stabilization layer on the connection end side protrudes outward from the base. After obtaining the third oxide superconducting wire, the superconducting laminate is folded in half so as to sandwich the metal stabilization layer protruding outward from the third oxide superconducting wire, and the fourth oxidation Since the superconducting wire is configured to connect the third oxide superconducting wire and the fourth oxide superconducting wire through the metal stabilizing layer protruding outward, the oxide superconducting wire is obtained. An oxide superconducting wire having a structure in which the layer is shielded from the outside can be joined without causing a step.
Therefore, it is possible to provide a connected body of oxide superconducting wire excellent in superconducting characteristics without causing local deterioration due to a step when wound in a coil shape.

  ADVANTAGE OF THE INVENTION According to this invention, the connection structure of an oxide superconducting wire and the connection method of an oxide superconducting wire which can suppress the penetration | invasion of the water | moisture content to an oxide superconducting layer, without producing a level | step difference in a connection part are provided. .

It is a section perspective view showing an oxide superconducting wire used for a 1st embodiment of a connection structure concerning the present invention. It is a section perspective view showing a superconducting layered product used for a 1st embodiment of a connection structure concerning the present invention. It is a figure explaining an example of the manufacturing method of the oxide superconducting wire used for 1st Embodiment. It is a figure explaining an example of 1st Embodiment of the connection method of the oxide superconducting wire which concerns on this invention. It is a figure explaining an example of 1st Embodiment of the connection method of the oxide superconducting wire which concerns on this invention. It is a cross-sectional perspective view which shows the superconducting laminated body used for 2nd Embodiment of the connection structure which concerns on this invention. It is a cross-sectional perspective view which shows the oxide superconducting wire used for 2nd Embodiment of the connection structure which concerns on this invention. It is a figure explaining an example of the manufacturing method of the oxide superconducting wire used for 2nd Embodiment. It is a figure explaining an example of 2nd Embodiment of the connection method of the oxide superconducting wire which concerns on this invention. It is a figure explaining an example of 2nd Embodiment of the connection method of the oxide superconducting wire which concerns on this invention. It is a figure explaining an example of 3rd Embodiment of the connection method of the oxide superconducting wire which concerns on this invention. It is a figure explaining an example of 4th Embodiment of the connection method of the oxide superconducting wire which concerns on this invention. It is a figure explaining an example of 5th Embodiment of the connection method of the oxide superconducting wire which concerns on this invention.

Hereinafter, embodiments of an oxide superconducting wire connecting method and an oxide superconducting wire connecting structure (hereinafter sometimes referred to as a connecting structure) according to the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is a cross-sectional perspective view showing an oxide superconducting wire used in the first embodiment of the connection structure according to the present invention. As shown in FIG. 1, the oxide superconducting wire 10 used in the present embodiment is formed by folding the substrate 1 in two via a grooved portion 11 so that the oxide superconducting layer 3 is sandwiched between the substrates 1. It becomes the structure which becomes.

FIG. 2 is a cross-sectional perspective view of the superconducting laminate 5 used in the first embodiment of the connection structure according to the present invention.
A superconducting laminate 5 shown in FIG. 2 has a structure in which an intermediate layer 2, an oxide superconducting layer 3, and a silver layer 7 are sequentially laminated on a base material 1.

<Oxide superconducting wire>
The substrate 1 may be any material that can be used as a substrate for ordinary superconducting wires, and is preferably in the form of a long plate, sheet, or tape, and is preferably made of a heat-resistant metal. Among heat resistant metals, an alloy is preferable, and a nickel (Ni) alloy or a copper (Cu) alloy is more preferable. Among them, if it is a commercial product, Hastelloy (trade name, manufactured by Haynes) is suitable, and the amount of components such as molybdenum (Mo), chromium (Cr), iron (Fe), cobalt (Co) is different, Hastelloy B, Any kind of C, G, N, W, etc. can be used. Further, an oriented metal base material in which a texture is introduced into a nickel (Ni) alloy or the like may be used as the base material 1, and the intermediate layer 2 and the oxide superconducting layer 3 may be formed thereon.
What is necessary is just to adjust the thickness of the base material 1 suitably according to the objective, and it is preferable normally that it is 10-500 micrometers.

The intermediate layer 2 controls the crystal orientation of the oxide superconducting layer 3 and prevents diffusion of metal elements in the base material 1 into the oxide superconducting layer 3. Furthermore, it functions as a buffer layer that alleviates the difference in physical properties (thermal expansion coefficient, lattice constant, etc.) between the base material 1 and the oxide superconducting layer 3, and the material has physical properties that are based on the base material 1 and the oxide superconductor layer 3. A metal oxide showing an intermediate value with the superconducting layer 3 is preferable. Specifically, preferred materials for the intermediate layer 2 are Gd ₂ Zr ₂ O ₇ , MgO, ZrO ₂ —Y ₂ O ₃ (YSZ), SrTiO ₃ , CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd _2. Examples thereof include metal oxides such as O ₃ , Zr ₂ O ₃ , Ho ₂ O ₃ , and Nd ₂ O ₃ .
The intermediate layer 2 may be a single layer or a plurality of layers.

Further, in the present embodiment, the intermediate layer 2 may have a multi-layer structure in which a diffusion prevention layer and a bed layer are laminated on the base material 1 side. In this case, the diffusion preventing layer is interposed between the base material 1 and the bed layer. The diffusion prevention layer is formed for the purpose of preventing the diffusion of the constituent elements of the substrate 1 and is made of silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), rare earth metal oxide, or the like. The thickness is, for example, 10 to 400 nm. As an example of the case where a diffusion preventing layer is interposed between the base material 1 and the bed layer, a combination using Al ₂ O ₃ as the diffusion preventing layer and Y ₂ O ₃ as the bed layer can be exemplified.

  The intermediate layer 2 may have a multilayer structure in which a cap layer is further laminated on the metal oxide layer. The cap layer has a function of controlling the orientation of the oxide superconducting layer 3, diffuses the elements constituting the oxide superconducting layer 3 into the intermediate layer 2, and intermediates between the gas used for stacking the oxide superconducting layer 3 and the intermediate layer It has a function of suppressing the reaction with the layer 2 and the like.

The material of the cap layer is not particularly limited as long as it can exhibit the above functions, but specifically, preferred examples include CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd ₂ O ₃ , and Zr ₂ O. ₃ , Ho ₂ O ₃ , Nd ₂ O _{3 and the} like.

  The thickness of the intermediate layer 2 may be appropriately adjusted according to the purpose, but is usually 0.1 to 5 μm.

  The intermediate layer 2 is formed by physical vapor deposition such as sputtering or ion beam assisted vapor deposition (hereinafter abbreviated as IBAD); chemical vapor deposition (CVD); coating pyrolysis (MOD); thermal spraying, etc. The oxide thin film can be laminated by a known method. In particular, the metal oxide layer formed by the IBAD method is preferable in that the crystal orientation is high and the effect of controlling the crystal orientation of the oxide superconducting layer 3 and the cap layer is high. The IBAD method is a method of orienting crystal axes by irradiating an ion beam at a predetermined angle with respect to a crystal deposition surface during deposition. Usually, an argon (Ar) ion beam is used as the ion beam.

The oxide superconducting layer 3 can be widely applied with an oxide superconductor having a generally known composition, such as REBa ₂ Cu ₃ O _y (RE is Y, La, Nd, Sm, Er, Gd, etc. A material made of a material that represents a rare earth element, specifically, Y123 (YBa ₂ Cu ₃ O _y ) or Gd123 (GdBa ₂ Cu ₃ O _y ) can be exemplified. Further, other oxide superconductors, for _{example, Bi 2 Sr 2 Ca n-} 1 Cu n for _{O 4 + 2n + δ} becomes may be used in compositions such as those made of other oxide superconductors having high critical temperatures representative Of course.
The oxide superconducting layer 3 is formed by physical vapor deposition such as sputtering, vacuum vapor deposition, laser vapor deposition, or electron beam vapor deposition; chemical vapor deposition (CVD); coating pyrolysis (MOD). Among them, the laser vapor deposition method is preferable.
The oxide superconducting layer 3 has a thickness of about 0.5 to 5 μm and preferably a uniform thickness.

The silver layer 7 formed so as to cover the upper surface of the oxide superconducting layer 3 is formed by a vapor phase method such as a sputtering method, and has a thickness of about 1 to 30 μm.
The reason why the silver layer 7 is provided is that silver is doped in an annealing process in which oxygen is doped into the oxide superconducting layer 3 and the oxide superconducting layer 3 has a good conductivity and low contact resistance. The point which has a property which makes it difficult to escape oxygen from the oxide superconductor layer 3 can be mentioned.

Although details of the oxide superconducting wire 10 used in this embodiment will be described later, as shown in FIG. 1, the oxide superconducting wire 10 is formed on the silver layer 7 side of the superconducting laminate 5. A grooved portion 11 is provided so as to reach the base material 1 from the silver layer 7 along the longitudinal direction from an intermediate portion in the width direction, and is attached to the upper surface on the silver layer 7 side where the grooved portion 11 is provided. The solder layer 12 is laminated, and the superconducting laminate 5 is folded in two via the groove processing portion 11 so that the solder layer 12 is inside.
That is, the oxide superconducting wire 10 has a groove processing in which a superconducting laminate 5 in which a base material 1, an intermediate layer 2, an oxide superconducting layer 3 and a silver layer 7 are laminated in this order reaches the base material 1 from the silver layer 7. It has a structure in which the solder layer 12 is sandwiched between the part 11 and the solder layer 12.

Next, with reference to FIG. 3, the manufacturing method of the oxide superconducting wire 10 used for this embodiment is demonstrated.
The manufacturing method of the oxide superconducting wire 10 used in the present embodiment includes a superconducting laminate 5 in which a base material 1, an intermediate layer 2, an oxide superconducting layer 3, and a silver layer 7 are laminated in this order. The groove A is formed by grooving the step A to be prepared and the silver layer 7 side of the superconducting laminate 5 so as to reach the substrate 1 from the silver layer 7 along the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate 5. Step B for providing the processed portion 11, Step C for forming the solder layer 12 on the upper surface on the silver layer 7 side where the groove processed portion 11 is provided, and the groove processed portion 11 so that the solder layer 12 is on the inner side. A step D for folding the superconducting laminate 5 in half, and a step E for fixing the superconducting laminate 5 by heating the folded superconducting laminate 5 to melt and solidify the solder layer 12.

First, the above-described superconducting laminate 5 is prepared (step A). As an example, after forming a diffusion prevention layer and a bed layer on the substrate 1 by sputtering, an intermediate layer 2 is formed on the bed layer by IBAD, and then a cap layer and an oxide superconducting layer 3 are formed by PLD. Next, a silver layer 7 is formed on the upper surface of the oxide superconducting layer 3 to produce a superconducting laminate 5.
The formation method of the silver layer 7 is not specifically limited, A conventionally well-known method can be applied, However, It is preferable to form by the vapor phase method.

Next, the silver layer 7 side of the superconducting laminate 5 is grooved so as to reach the base material 1 from the silver layer 7 along the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate 5 to form the groove processing portion 11. Provided (step B). The formation method of the groove processing part 11 is not specifically limited, A conventionally well-known method can be applied, However, It is preferable to form with a laser or a rotary blade. As shown in FIG. 3, when using the laser processing machine 13, there is no possibility that the superconducting laminate 5 is deformed by stress or pressure during processing. The width and depth of the grooved portion 11 can be easily adjusted by adjusting the laser output and the thickness of the rotary blade. In addition, more accurate adjustment is possible by changing the transport speed of the superconducting laminate 5.
The width of the groove processing portion 11 is set to about 20 to 100 μm, and the depth of the groove processing portion 11 is set to reach a depth of about 1/3 to 1/2 of the thickness of the substrate 1.
If the base material 1 is folded in half without providing the groove processing portion 11, many irregular cracks are generated in the bent portion of the oxide superconducting layer 3, and the superconducting characteristics of the oxide superconducting wire 10 are deteriorated. . On the other hand, by providing the groove processed portion 11, when the superconducting laminate 5 is folded in half, an unnecessary crack does not occur in the oxide superconducting layer 3, so that the oxide superconducting wire 10 that suppresses deterioration of superconducting characteristics is provided. can do.

  Next, the solder layer 12 is formed on the upper surface on the silver layer 7 side where the groove processing portion 11 is provided (step C). The thickness of the solder layer 12 is about 20 to 30 μm. The solder layer may be formed by applying a solder tape or may be formed by applying a solder layer. Moreover, tin, a tin-silver alloy, a tin-bismuth alloy, or the like can be appropriately used as a material for the solder layer.

  Next, the superconducting laminate 5 is folded in two via the groove processing portion 11 so that the solder layer 12 is on the inner side (process D). The superconducting laminate 5 can be easily bent through the groove processing portion 11. As described above, it is preferable to provide the grooved portion 11 so as to reach a depth of about 1/3 to 1/2 of the thickness of the substrate 1 from the viewpoint of bending.

Next, the superconducting laminate 5 folded in half is heated to melt and solidify the solder layer 12 to fix the superconducting laminate 5 (step E).
The oxide superconducting wire 10 can be manufactured through the above steps.

<Connecting structure of oxide superconducting wire>
Next, the connection method of the oxide superconducting wire 10a and the connection structure 20 of this embodiment will be described.
First, the first oxide superconducting wire 10a is obtained (first step). As described with reference to FIG. 3, the superconducting laminate 5 is folded in half, the superconducting laminate 5 folded in half is heated and the solder layer 12 is melted and solidified to fix the superconducting laminate 5, and the oxide Superconducting wire 10 is manufactured.
Next, in FIG. 4, from the connection end 21 of the oxide superconducting wire 10, a cut is made parallel to the connection end 21 in the longitudinal direction of 10 to 500 mm, and the entire layer of the oxide superconducting wire 10 folded in half is heated. The base material 1 corresponding to half is spread from the silver layer 7. Then, the widened portion is removed so that the solder layer 12 is exposed, and the first oxide superconducting wire 10a having the step portion 19 is produced.

  Next, two first oxide superconducting wires 10a are prepared, and the solder layers 12 of the stepped portions 19 of the first oxide superconducting wire 10a are overlapped with each other so that the stepped portions 19 are staggered to cancel the steps. After overlapping, heating is performed, the solder layers 12 are integrated, the two first oxide superconducting wires 10a are connected, and the connection portion 22 is formed (second step).

  In the present embodiment, the two first oxide superconducting wires 10a are connected so that the creases generated by folding the superconducting laminate in two are on the same side, as shown in FIG. Thus, in the first step, two types of first oxide superconducting wires 10a and 10a ′ are prepared, in which the removed portion of the superconducting laminate stacked in two is different between the upper half and the lower half In the second step, the two first oxide superconducting wires 10a and 10a ′ may be connected such that the folds are opposite to each other.

In the first step, both ends of the oxide superconducting wire 10 may be the connection ends 21 and the solder layers 12 at both ends may be exposed. In the present embodiment, the first oxide superconducting wire 10a with the solder layer 12 at one end exposed may be connected to both ends of the oxide superconducting wire.
Further, in this embodiment, a longer joined body can be obtained by appropriately adjusting the number of oxide superconducting wires used.

Therefore, since the oxide superconducting wire 10 having the structure in which the oxide superconducting layer 3 is shielded from the outside can be joined without causing a step, a circular arc having no step is drawn when wound in a coil shape. be able to. Since the stress applied to the wire is uniformly applied to the entire wire, local deterioration does not occur, the superconducting characteristics are excellent, and the total thickness of the wire is not increased more than necessary. The connection body 20 of the oxide superconducting wire 10a having a configuration in which 3 is shielded from the outside can be provided.
In the unlikely event that a part of the silver layer 7 is peeled off to form a peeled portion and a part of the oxide superconducting layer 3 is exposed, the peeled portion of the silver layer 7 is melted by the molten solder layer 12. And a structure for shielding the oxide superconducting layer 3 from the outside can be realized.
Therefore, since the penetration of moisture into the oxide superconducting layer 3 is suppressed, the oxide superconducting layer 3 is not damaged by moisture, and the connection body 20 of the oxide superconducting wire 10a that prevents deterioration of superconducting characteristics can be provided. .

In addition, the connection structure 20 of the oxide superconducting wire 10a of the present embodiment has a configuration in which the base material 1 is positioned outside the oxide superconducting layer 3.
Therefore, since the oxide superconducting layer 3 can be configured to be shielded from the outside by the base material 1, it can be prevented from being damaged by an impact from the outside and the superconducting characteristics can be prevented from deteriorating.

  In addition, the connection structure 20 of the oxide superconducting wire 10a of the present embodiment includes a superconducting laminate 5 in which the base material 1, the intermediate layer 2, the oxide superconducting layer 3, and the silver layer 7 are laminated in this order. In this configuration, the solder layer 12 is sandwiched between the groove processing portion 11 extending from 7 to the base material 1. Therefore, the oxide superconducting layer 3 is located near the neutral axis of the oxide superconducting wire 10a and is not easily subjected to tensile stress and compressive stress. Therefore, it is not necessary to consider the front and back of the wire when the wire is wound around a winding drum and coiled into a superconducting coil. Therefore, the oxide superconducting wire 10a provided with the connection structure 20 of the present embodiment is used. It can be suitably used as a superconducting coil.

  Furthermore, since the connection structure 20 of the oxide superconducting wire 10a of the present embodiment has a configuration in which the superconducting laminate 5 in which only the solder layer 12 is laminated as described above is folded in two, the wire can be downsized. It is possible to reduce the time required for winding even when the wire material is coiled into a superconducting coil, and the handling property is good.

[Second Embodiment]
<Oxide superconducting wire>
FIG. 6 is a cross-sectional perspective view showing a superconducting laminate 5B used in the second embodiment of the connection structure according to the present invention.
A superconducting laminate 5B shown in FIG. 6 is formed by sequentially laminating an intermediate layer 2, an oxide superconducting layer 3, and a silver layer 7 on a substrate 1, and a metal stabilizing layer on the silver layer 7. 8 is laminated.
FIG. 7 is a cross-sectional perspective view showing an oxide superconducting wire 10B used in the second embodiment of the connection structure according to the present invention.

  The superconducting laminate 5B used for the oxide superconducting wire 10B has a metal stable on the silver layer 7 formed on the upper surface of the oxide superconducting layer 3 in addition to the configuration of the superconducting laminate 5 used for the oxide superconducting wire 10. It is the structure by which the chemical layer 8 was laminated | stacked. In FIG. 7, the same code | symbol is attached | subjected to the component same as the oxide superconducting wire 10 in the said 1st Embodiment, and description is abbreviate | omitted.

The metal stabilizing layer 8 is made of a highly conductive metal material. When the oxide superconducting layer 3 is about to transition from the superconducting state to the normal conducting state, the current of the oxide superconducting layer 3 is commutated together with the silver layer 7. To act as a bypass.
The metal material constituting the metal stabilizing layer 8 is not particularly limited as long as it has good conductivity, but copper alloys such as copper, brass (Cu—Zn alloy), Cu—Ni alloy, stainless steel, etc. It is preferable to use those made of a relatively inexpensive material, and among them, copper is preferable because it has high conductivity and is inexpensive.
When the oxide superconducting wire 10B is used for a superconducting fault current limiter, the metal stabilizing layer 8 is made of a resistance metal material, and a Ni-based alloy such as Ni—Cr can be used.

The formation method of the metal stabilization layer 8 is not specifically limited, For example, it can form by laminating | stacking the metal tape which consists of good electroconductive materials, such as copper, on the silver layer 7 through bonding agents, such as a solder.
The thickness of the metal stabilizing layer 8 is not particularly limited and can be adjusted as appropriate, but is preferably 10 to 300 μm. By setting the lower limit value or more, a higher effect of stabilizing the oxide superconducting layer 3 can be obtained, and by setting the upper limit value or less, the oxide superconducting wire 10B can be thinned.

The oxide superconducting wire 10B reaches the substrate 1 from the metal stabilizing layer 8 to the metal stabilizing layer 8 side of the superconducting laminate 5B from the intermediate portion in the width direction of the superconducting laminate 5B along the longitudinal direction. A groove processing portion 11B is provided, and a solder layer 12 is laminated so as to adhere to the upper surface on the metal stabilization layer 8 side where the groove processing portion 11B is provided, and the groove processing portion 11B so that the solder layer 12 is on the inside. The superconducting laminate 5B is folded in two through the gap.
That is, the oxide superconducting wire 10 </ b> B has a structure in which the metal stabilization layer 8 is interposed between the solder layer 12 and the silver layer 7.
Therefore, the oxide superconducting wire 10B has an entire wire compared with a structure in which a silver stabilizing layer is provided on the entire outer periphery of the superconducting laminate in which the oxide superconducting layers are laminated, and a copper stabilizing layer is further provided. Therefore, there is no possibility that the critical current density is lowered.

Next, with reference to FIG. 8, the manufacturing method of the oxide superconducting wire 10B used for this embodiment is demonstrated.
In the manufacturing method of the oxide superconducting wire 10B used in the present embodiment, first, in Step A of the manufacturing method of the oxide superconducting wire 10 used in the first embodiment, the silver layer 7 is laminated, and then the silver A metal stabilizing layer 8 is laminated on the layer 7 to prepare a superconducting laminate 5B.
Next, in the step B of the manufacturing method of the oxide superconducting wire 10 described above, the metal stabilizing layer 8 side of the superconducting laminate 5B is moved from the intermediate portion in the width direction of the superconducting laminate 5B along the longitudinal direction to the silver layer 7. The groove processing part 11B is provided by processing the groove so as to reach the base material 1 from above.
Next, in Step C of the method for manufacturing the oxide superconducting wire 10 described above, the solder layer 12 is formed on the upper surface of the metal stabilizing layer 8 side where the grooved portion 11B is provided.
Then, the process similar to the process D and the process E of the manufacturing method of the above-mentioned oxide superconducting wire 10 is performed.
The oxide superconducting wire 10B used in the present embodiment can be manufactured through the above steps.

In step A, the metal stabilizing layer 8 can be formed by bonding a metal tape. Since the thickness of the metal stabilization layer 8 can be easily adjusted by adjusting the thickness of the metal tape, it is easy to ensure a sufficient thickness to stabilize the oxide superconducting layer 3, and the oxidation effect is high. It becomes the object superconducting wire 10B.
Next, in step B, the metal stabilizing layer 8 side of the superconducting laminate 5B is grooved to provide a grooved portion 11B. Between the second step and the third step of the manufacturing method of the oxide superconducting wire 10 described above. Alternatively, two metal tapes having the same width as the width of the folded superconducting laminate 5B may be bonded to the silver layer 7 so as not to cover the grooved portion 11B.

Moreover, in the process A, the metal stabilization layer 8 can also be performed by electroplating. The material constituting the metal stabilizing layer 8 is preferably a highly conductive metal, such as Cu or Al. Cu is particularly preferable because it has high conductivity. The thickness of the metal stabilizing layer 8 is not particularly limited and can be changed as appropriate. However, the thickness can be set to about 10 to 100 μm, preferably 20 μm to 100 μm, and more preferably 20 μm to 50 μm. preferable.
A higher effect of stabilizing the oxide superconducting layer 3 can be obtained by setting the thickness of the metal stabilizing layer 8 to 10 μm or more, and the oxide superconducting wire 10B can be made thinner by setting the thickness to 100 μm or less.

<Connecting structure of oxide superconducting wire>
Next, the connection method of the oxide superconducting wire 10b and the connection structure 20B of the present embodiment will be described.
First, the first oxide superconducting wire 10b is obtained (first step). As described with reference to FIG. 8, the superconducting laminate 5B is folded in half, and the superconducting laminate 5 folded in half is heated to melt and solidify the solder layer 12, thereby fixing the superconducting laminate 5 to the oxide. Superconducting wire 10B is manufactured.
Next, in FIG. 9, from the connection end 21 of the oxide superconducting wire 10B, a cut is made parallel to the connection end 21 in the longitudinal direction of 10 to 500 mm, and the whole layer of the oxide superconducting wire 10 folded in half is heated. The base material 1 corresponding to half is spread from the metal stabilizing layer 8. Then, the widened portion is removed so that the solder layer 12 is exposed, and the first superconducting laminate 10b having the step portion 19 is produced.

  Next, two first oxide superconducting wires 10b are prepared, the solder layers 12 of the step portions 19 of the first oxide superconducting wire 10b are overlapped, and the step portions 19 are staggered to cancel the steps. After overlapping, heating is performed, the solder layers 12 are integrated, the two first oxide superconducting wires 10b are connected, and the connection portion 22 is formed (second step).

  In the present embodiment, the two first oxide superconducting wires 10b are connected so that the creases generated by superimposing the superconducting laminate in two are on the same side, as shown in FIG. Thus, in the first step, two types of first oxide superconducting wires 10b and 10b 'are prepared, in which the removed portion of the superconducting laminate stacked in two is different between the upper half and the lower half In the second step, the two first oxide superconducting wires 10b and 10b ′ may be connected so that the folds are opposite to each other.

In the first step, both ends of the oxide superconducting wire 10 may be the connection ends 21 and the solder layers 12 at both ends may be exposed. In the present embodiment, the first oxide superconducting wire 10b with the solder layer 12 at one end exposed may be connected to both ends of the oxide superconducting wire.
Further, in this embodiment, a longer joined body can be obtained by appropriately adjusting the number of oxide superconducting wires used.

The connection method of the oxide superconducting wire 10b of the present embodiment is such that the silver layer 7 and the metal stabilizing layer 8 are formed on the surface of the oxide superconducting layer 3 on the solder layer 12 side. It is possible to provide the connection body 20B of the oxide superconducting wire 10b that further improves the stabilizing effect.
In addition, since the surface of the oxide superconducting layer 3 on the solder layer 12 side can be manufactured with the oxide superconducting wire 10b having a structure in which the silver layer 7 and the metal stabilizing layer 8 are laminated, the oxide superconducting layer 3 can be oxidized more effectively. Provided is a connection body 20B of the oxide superconducting wire 10b that can more reliably prevent the superconducting properties from being deteriorated due to moisture damage to the superconducting layer 3 because it prevents moisture from entering the superconducting layer 3. it can.

The connection method of the oxide superconducting wire 10b of the present embodiment is as follows. In step A of the manufacturing method of the oxide superconducting wire 10b described above, a metal tape is bonded onto the silver layer 7, or the silver layer 7 is plated with a metal. Accordingly, a configuration including a step of laminating the metal stabilizing layer 8 on the silver layer 7 can also be adopted.
When the metal stabilizing layer 8 is formed by bonding a metal tape, the thickness of the metal stabilizing layer 8 can be easily adjusted by adjusting the thickness of the metal tape, so that the oxide superconducting layer 3 is stabilized. Therefore, it is possible to manufacture the oxide superconducting wire 10b having a sufficient stabilizing effect and a sufficient stabilizing effect. Further, when the metal stabilizing layer 8 is formed by plating, the metal stabilizing layer 8 is formed so as to cover the surface of the silver layer 7. Therefore, since superconducting laminate 5B can be more effectively shielded from the outside, it is possible to provide connection body 20 of oxide superconducting wire 10b that more reliably suppresses deterioration of oxide superconducting layer 3 due to moisture.

[Third Embodiment]
<Connecting structure of oxide superconducting wire>
Next, with reference to FIG. 11, the connection method of the oxide superconducting wire 10a of this embodiment and the connection structure 20C will be described.
Similarly to the first embodiment, two first oxide superconducting wires 10a are prepared, and the base material 1, the intermediate layer 2, the oxide superconducting layer 3, and the silver layer 7 are laminated in this order. A second oxide superconducting wire 10c is prepared. The second oxide superconducting wire 10c has a layer structure similar to that of the superconducting laminate 5 described above. The length in the longitudinal direction of the second oxide superconducting wire 10c is a length corresponding to a portion of the two first oxide superconducting wires 10a arranged opposite to each other so that the solder layer 12 is exposed. 20 to 1000 mm.
Next, the connection ends 21 (tips) of the first oxide superconducting wire 10a are arranged so that their stepped portions 19 face each other. Then, the silver layer 7 of the second oxide superconducting wire 10c is superposed on the solder layer 12 exposed in the first oxide superconducting wire 10a so as to fill the step portions 19 and 19, and heated. The first oxide superconducting wire 10a and the second oxide superconducting wire 10c are connected, and the connecting portions 22a, 22b, and 22c are integrated (third step).

In the first step, both ends of the oxide superconducting wire 10 may be the connection ends 21 and the solder layers 12 at both ends may be exposed. In the present embodiment, a combination of a first oxide superconducting wire with one end solder layer 12 exposed, an oxide superconducting wire with both end solder layers 12 exposed, and a second oxide superconducting wire You can also
Further, in this embodiment, a longer joined body can be obtained by appropriately adjusting the number of oxide superconducting wires used.

In the connection method of the oxide superconducting wire 10a of this embodiment, since the step portions 19 and 19 are connected so as to be filled with the oxide superconducting wire 10c as described above, the oxide superconducting layer 3 is shielded from the outside. The superconducting wire 10a can be joined without causing a step.
Therefore, it is possible to provide an oxide superconducting wire connecting member 20C having excellent superconducting characteristics without causing local deterioration due to a step when wound in a coil shape.

  According to this embodiment, since the infiltration of moisture into the oxide superconducting layer 3 is suppressed as in the previous embodiment, the oxide superconducting layer 3 is not damaged by moisture, and the superconducting characteristics are deteriorated. Since there is no step, it is possible to draw a circular arc with no step when wound in a coil shape, and the stress applied to the wire is uniformly applied to the entire wire, so it is local. There is no deterioration.

[Fourth Embodiment]
<Connecting structure of oxide superconducting wire>
Next, with reference to FIG. 12, the connection method of the oxide superconducting wire 10b of this embodiment and the connection structure 20D will be described.
The connection method of the oxide superconducting wire 10b of this embodiment uses the oxide superconducting wire 10B obtained by the manufacturing method of the oxide superconducting wire 10B described with reference to FIG. 8, and the first oxide superconducting wire 10b. And a second oxide superconducting wire comprising a base material 1, an intermediate layer 2, an oxide superconducting layer 3, a silver layer 7, and a metal stabilizing layer 8 laminated in this order. 10d is prepared, and the connection ends 21 of the first oxide superconducting wire 10b are arranged to face each other so that their stepped portions 19 and 19 are arranged, and the second oxide is exposed to the exposed solder layer 12. There is a third step in which the metal stabilizing layer 8 of the superconducting wire 10d is stacked and heated to connect the two first oxide superconducting wires 10b and the one second oxide superconducting wire 10d.

  In the third step, two first oxide superconducting wires 10b and one second oxide superconducting wire 10d are connected to form connection portions 22d, 22e, and 22f (third step).

  The connection method of the oxide superconducting wire 10b of the present embodiment is such that the silver layer 7 and the metal stabilizing layer 8 are formed on the surface of the oxide superconducting layer 3 on the solder layer 12 side. It is possible to provide the connection body 20D of the oxide superconducting wire 10b that further improves the stabilizing effect.

  Since the connection structure 20D of the oxide superconducting wire 10b according to the present embodiment includes the silver layer 7 and the metal stabilizing layer 8 on the surface on the solder layer 12 side of the oxide superconducting layer 3, the oxide superconducting layer 3 is provided. The effect of stabilizing is further increased. Further, the surface on the solder layer 12 side of the oxide superconducting layer 3 is laminated with the silver layer 7 and the metal stabilizing layer 8, and more effectively suppresses the intrusion of moisture into the oxide superconducting layer 3. The oxide superconducting layer 3 is not damaged by moisture, and the superconducting characteristics can be more reliably prevented from deteriorating.

[Fifth Embodiment]
<Connecting structure of oxide superconducting wire>
Next, with reference to FIG. 13, the connection method of the oxide superconducting wire 10e of this embodiment and the connection structure 20E are demonstrated.
First, a third oxide superconducting wire 10e is obtained (fourth step). The third oxide superconducting wire 10e has the metal stabilizing layer 8e for connecting to the fourth oxide superconducting wire 10f in the oxide superconducting wire 10B described with reference to FIG. As shown in FIG. 13, the metal stabilizing layer 8 e protrudes outward from the base 1 from the connection end 21 e side of the oxide superconducting wire 10 e.

  Next, a fourth oxide superconducting wire 10f is obtained (fifth step). The fourth oxide superconducting wire 10f is the same as the oxide superconducting wire 10B described with reference to FIG. 7 except that the superconducting laminate 5B is folded in two via the groove processing portion 11, and then the connecting end 21e A notch is made in parallel with the connection end 21e at 500 mm, heated, and the base 1 corresponding to half of the entire layer of the folded oxide superconducting wire 10B is expanded from the metal stabilizing layer 8 to the expanded portion. Among them, the metal stabilizing layer 8 is removed so that the silver layer 7 is exposed, and a solder layer 12 is formed on the exposed silver layer 7.

  Next, a third oxide superconducting wire 10e is prepared, a fourth oxide superconducting wire 10f is prepared, and a metal stabilization layer 8e protruding outward from the third oxide superconducting wire 10e. Are stacked and heated so that the solder layer 12 of the fourth oxide superconducting wire 10f is sandwiched therebetween, and one third oxide superconducting wire 10e and one fourth oxide superconducting wire 10f are connected. Then, the connecting portions 22g and 22h are formed (sixth step).

  In the fourth step, both ends of the third oxide superconducting wire 10e may have a metal stabilizing layer 8e. In the present embodiment, two fourth oxide superconducting wires 10f may be prepared, arranged opposite to each other, and connected so as to sandwich the metal stabilization layers 8e at both ends.

Further, in the fifth step, the superconducting laminate 5 may be used instead of the superconducting laminate 5B. That is, as the fourth oxide superconducting wire 10f, one that does not have the metal stabilizing layer 8 from the beginning may be used.
In such a case, when the fourth oxide superconducting wire 10f is folded in half with the superconducting laminate 5 via the groove processing portion 11, the solder layer 12 of the fourth oxide superconducting wire 10f is on the inner side, The oxide superconducting wire 10e is folded in half so as to sandwich the metal stabilizing layer 8e protruding outward (see FIG. 13).
Next, in the sixth step, one third oxide superconducting wire 10e was prepared, one fourth oxide superconducting wire 10f was prepared, and protruded outward from the third oxide superconducting wire 10e. The metal stabilization layer 8e is heated so that the solder layer 12 of the fourth oxide superconducting wire 10f is sandwiched between the third oxide superconducting wire 10e and one fourth oxide superconducting wire. It is good also as a form which connects the wire 10f and forms the connection parts 22g and 22h.

As described above, the connection method of the oxide superconducting wire according to the present embodiment includes the third oxide superconducting wire 10e having the base 1 to the metal stabilization layer 8 and the base 1 to the silver layer 7. 4 oxide superconducting wire 10f is connected through a metal stabilizing layer 8e protruding outward, and the metal stabilizing layer 8e and the fourth oxide superconducting wire 10f have the same length. For example, an oxide superconducting wire having a configuration in which the oxide superconducting layer 3 is shielded from the outside can be connected without causing a step.
Therefore, it is possible to provide an oxide superconducting wire connecting body 20E excellent in superconducting characteristics without causing local deterioration due to a step when wound in a coil shape.

The oxide superconducting wire connecting structure 20E of the present embodiment includes a third oxide superconducting wire 10e in which the superconducting laminate 5D is folded in two so that the oxide superconducting layer 3 is sandwiched between the base materials 1. The third oxide superconducting wire 10e is connected to a fourth oxide superconducting wire 10f formed by removing the metal stabilizing layer 8 through the metal stabilizing layer 8e protruding outward from the third oxide superconducting wire 10e. Therefore, it is possible to realize a configuration in which the oxide superconducting layer 3 is configured to be connected without causing a step without increasing the overall thickness of the wire, and the oxide superconducting layer 3 is shielded from the outside. .
Accordingly, since the infiltration of moisture into the oxide superconducting layer 3 is suppressed, the oxide superconducting layer 3 is not damaged by moisture, the superconducting characteristics can be prevented from being deteriorated, and further, there is no step, so that the coil shape When the wire is wound, a circular arc having no step can be drawn, and the stress applied to the wire is uniformly applied to the entire wire, so local deterioration does not occur.

  The oxide superconducting wire connecting method and the oxide superconducting wire connecting structure according to the present invention have been described above. However, the above embodiment is an example, and can be appropriately changed without departing from the scope of the present invention. It is.

  INDUSTRIAL APPLICABILITY The present invention can be used for oxide superconducting wires used in various power devices such as energy storage devices, transformers, motors, and generators.

DESCRIPTION OF SYMBOLS 1 ... Base material, 2 ... Intermediate | middle layer, 3 ... Oxide superconducting layer 5, 5B, 5D ... Superconducting laminated body, 7 ... Silver layer, 8, 8e ... Metal stabilization layer 10, 10B, 10a, 10a ', 10b, 10b ', 10c, 10d, 10e, 10f ... oxide superconducting wire, 11, 11B ... grooved portion, 12 ... solder layer, 19 ... stepped portion, 20, 20B, 20C, 20D, 20E ... oxide superconducting wire Connection structure, 21, 21e ... connection end, 22, 22a, 22b, 22c, 22d, 22e, 22f, 22g, 22h ... connection part

Claims (8)

  A superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order is folded in half with a solder layer sandwiched between groove processing parts reaching from the silver layer to the base material. And at least two first oxide superconducting wires from which the solder layer is exposed from the base material in the vicinity of one of the connection ends to the silver layer of the superconducting laminated body folded in half. The connection structure of the oxide superconducting wire, wherein the exposed solder layers are integrated and connected. A superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order is folded in half with a solder layer sandwiched between groove processing parts reaching from the silver layer to the base material. The first oxide superconducting wire is constituted by removing the solder layer from the base material near one connection end to the silver layer in the superconducting laminate that is folded in half.
A base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order to constitute a second oxide superconducting wire,
The connection ends of the at least two first oxide superconducting wires are arranged to face each other;
An oxide superconducting wire connecting structure, wherein the exposed solder layer of the first oxide superconducting wire is connected to the second oxide superconducting wire.   3. The oxide superconducting wire connecting structure according to claim 1 or 2, wherein the oxide superconducting wire is obtained by further laminating a metal stabilizing layer on a silver layer. A superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, a silver layer, and a metal stabilizing layer are laminated in this order is passed through a groove processing portion that reaches from the metal stabilizing layer to the base material. The third oxide superconducting wire is constructed by being folded in half with the solder layer in between.
The metal stabilization layer at the connection end of the third oxide superconducting wire extends a predetermined length outward from the connection end of the base material,
A superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, a silver layer, and a metal stabilizing layer are laminated in this order is passed through a groove processing portion that reaches from the metal stabilizing layer to the base material. The metal stabilizing layer near the connection end is removed, the solder layer is formed on the exposed silver layer, and the fourth oxide superconducting wire is configured.
An extended portion of the metal stabilization layer of the third oxide superconducting wire is sandwiched between two folded portions of the fourth oxide superconducting wire and connected by a solder layer. Connection structure. A superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order is folded in half with a solder layer sandwiched between groove processing parts reaching from the silver layer to the base material. In the oxide superconducting wire thus formed, the first superconducting conductor is removed so that the solder layer is exposed from the base material in the vicinity of one connection end to the silver layer of the superconducting laminate that is folded in two. A first step of obtaining a wire;
At least two first oxide superconducting wires are prepared, and the solder layers exposed at the connection ends of the respective first oxide superconducting wires are overlapped and heated to integrate the solder layers, A second step of connecting the oxide superconducting wires together;
A method for connecting an oxide superconducting wire characterized by comprising: A superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order is folded in half with a solder layer sandwiched between groove processing parts reaching from the silver layer to the base material. In the oxide superconducting wire thus formed, the first superconducting conductor is removed so that the solder layer is exposed from the base material in the vicinity of one connection end to the silver layer of the superconducting laminate that is folded in two. A first step of obtaining a wire;
At least two first oxide superconducting wires are prepared, and at least one second oxide superconducting wire is formed by laminating a base material, an intermediate layer, an oxide superconducting layer, and a silver layer in this order. This preparation is made, the connection ends of the at least two first oxide superconducting wires are arranged opposite to each other, and the silver layer of the second oxide superconducting wire is overlaid and heated on the exposed solder layer. A third step of connecting the at least two first oxide superconducting wires and the at least one second oxide superconducting wire;
A method for connecting an oxide superconducting wire characterized by comprising:   The method for connecting an oxide superconducting wire according to claim 5 or 6, wherein the oxide superconducting wire is obtained by further laminating a metal stabilizing layer on a silver layer. A superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, a silver layer, and a metal stabilizing layer are laminated in this order is passed through a groove processing portion that reaches from the metal stabilizing layer to the base material. A fourth step of obtaining a third oxide superconducting wire in which the metal stabilizing layer on the connection end side protrudes outward from the base material in the oxide superconducting wire folded in half with the solder layer interposed therebetween;
The metal stabilizing layer side of the superconducting laminate in which the base material, the intermediate layer, the oxide superconducting layer, the silver layer, and the metal stabilizing layer are laminated in this order is arranged in the width direction of the superconducting laminate. A groove is formed by grooving from the metal stabilization layer to the base material along the longitudinal direction from the middle portion, and a solder layer is formed on the upper surface of the metal stabilization layer side where the groove processing portion is provided Then, the superconducting laminate is folded in two through the grooved portion so that the solder layer is on the inside, the metal stabilizing layer near the connection end is removed, and a solder layer is formed on the exposed silver layer And a fifth step of obtaining a fourth oxide superconducting wire,
Preparing at least one third oxide superconducting wire, preparing at least one fourth oxide superconducting wire, and providing a metal stabilization layer protruding outward from the third oxide superconducting wire; The at least one third oxide superconducting wire and the at least one fourth fourth are heated so as to sandwich a solder layer formed on the exposed silver layer of the fourth oxide superconducting wire. A sixth step of connecting the oxide superconducting wire;
A method for connecting an oxide superconducting wire characterized by comprising:

Images