JP2012209189A - Oxide superconducting wire material and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an oxide superconducting wire material which can suppress permeation of moisture into an oxide superconducting layer without increasing the whole thickness of the wire material more than required, and provide a method for manufacturing the same.SOLUTION: An oxide superconducting wire material 10 of the present invention includes a superconducting laminate body 5 which is formed of a substrate 1, an intermediate layer 2, an oxide superconducting layer 3, and a silver layer 7 that are laminated in this order, and is folded into two through a groove processed portion 11 that reaches the substrate 1 from the silver layer 7, so as to sandwich a solder layer 12.

Description

  The present invention relates to a superoxide superconducting wire and a method for manufacturing the same.

RE-123 oxide superconductor discovered in recent years (REBa ₂ Cu ₃ O _{7-X, where} RE is a rare earth element including Y) exhibits superconductivity above liquid nitrogen temperature and has low current loss. It is considered as a very promising material for practical use, and it is desired to process it into a wire and use it as a power supply conductor or a magnetic coil. As a method for processing this oxide superconductor into a wire, a method of forming an oxide superconducting layer on a metal substrate tape has been studied.

  In the oxide superconducting wire, the stability of the two-layer structure in which a thin silver stabilizing layer is formed on the oxide superconducting layer and a thick stabilizing layer made of a highly conductive metal material such as copper is provided thereon. A structure in which a chemical layer is laminated is employed. The silver stabilization layer is also provided for the purpose of protecting the oxide superconducting layer from moisture, and the copper stabilization layer attempts to transition the oxide superconducting layer from the superconducting state to the normal conducting state. In some cases, the oxide superconducting layer is provided for the purpose of functioning as a bypass to commutate the current and electrically protecting the oxide superconducting wire.

  As an example of a technique for forming a stabilization layer having a two-layer structure, a thin silver stabilization layer is formed by sputtering on the entire outer periphery of a superconducting laminate in which an oxide superconducting layer is laminated, and then the entire wire is made of a copper sulfate aqueous solution. A technique is known in which a copper stabilization layer is formed on a silver stabilization layer by electroplating by immersion in a plating bath (see Patent Document 1).

JP 7-335051 A

The RE-123-based oxide superconducting layer having a specific composition is easily deteriorated by moisture, and the oxide superconducting layer is obtained when the wire is stored in an environment with a lot of moisture or when the wire is left in a state where moisture is attached. When moisture enters the crystal, the crystal structure is disturbed and the superconducting properties are deteriorated.
However, in the structure in which the copper stabilization layer is formed by plating as in Patent Document 1, if there is a defect such as a pinhole in the copper plating part, moisture enters the plating defect part and reaches the oxide superconducting layer. The oxide superconducting layer may be deteriorated.
Further, as in Patent Document 1, in a structure in which a silver stabilization layer is provided on the entire outer periphery of a superconducting laminate in which oxide superconducting layers are stacked, and a thick copper stabilization layer is provided on the entire outer periphery, There is a possibility that the entire thickness becomes thick and the critical current density becomes low.

  The present invention has been made in view of the above-described conventional situation, and an oxide capable of suppressing the intrusion of moisture into the oxide superconducting layer without increasing the overall thickness of the wire more than necessary. It aims at providing a superconducting wire and its manufacturing method.

In order to solve the above problems, the oxide superconducting wire of the present invention is a groove processing in which a superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order reaches the base material from the silver layer. It is characterized in that it is folded in half with a solder layer in between via the part.
The oxide superconducting wire of the present invention has a configuration in which the base material is folded in two through a grooved portion so that the oxide superconducting layer is sandwiched between the base materials. Therefore, a configuration in which the oxide superconducting layer is shielded from the outside can be realized without increasing the total thickness of the wire.
Therefore, since the penetration of moisture into the oxide superconducting layer is suppressed, the oxide superconducting layer is not damaged by moisture, and the superconducting characteristics can be prevented from deteriorating.

In the oxide superconducting wire of the present invention, a metal stabilizing layer may be interposed between the solder layer and the silver layer.
In this case, since the silver superconductor layer and the metal stabilizing layer are provided on the surface of the oxide superconductor layer on the solder layer side, the effect of stabilizing the oxide superconductor layer is further enhanced. In addition, the surface of the oxide superconducting layer on the solder layer side is laminated with a silver layer and a metal stabilizing layer, and more effectively prevents moisture from entering the oxide superconducting layer. It is possible to prevent the deterioration of the superconducting characteristics more reliably without being damaged by moisture.

Moreover, in the oxide superconducting wire of the present invention, the metal stabilization layer may be formed by bonding a metal tape or plating. When the metal stabilization layer is formed by bonding a metal tape Since the thickness of the metal stabilization layer can be easily adjusted by adjusting the thickness of the metal tape, it is easy to ensure a sufficient thickness to stabilize the oxide superconducting layer, and the oxide has a high stabilization effect. It becomes a superconducting wire. Moreover, when the metal stabilization layer is formed by plating, the metal stabilization layer is formed so as to cover the surface of the silver layer. Therefore, since the oxide superconducting layer can be more effectively shielded from the outside, deterioration of the oxide superconducting layer due to moisture can be further reliably suppressed.

In order to solve the above problems, the oxide superconducting wire manufacturing method of the present invention includes a first step of preparing a superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order; A second step of providing a grooved portion by grooving the silver layer side of the superconducting laminate so as to reach the substrate from the silver layer along the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate; A third step of forming a solder layer on the upper surface on the silver layer side where the grooved portion is provided, and the superconducting laminate is folded in two through the grooved portion so that the solder layer is on the inner side A fourth step, and a fifth step of fixing the superconducting laminate by heating the superconducting laminate folded in half to melt and solidify the solder layer.
The method for producing an oxide superconducting wire according to the present invention has a configuration in which a superconducting laminate in which only a solder layer is laminated is folded in two so that the oxide superconducting layer is sandwiched between substrates.
Therefore, an oxide superconducting wire having a configuration in which the oxide superconducting layer is shielded from the outside can be manufactured without increasing the overall thickness of the wire. Therefore, since entry of moisture into the oxide superconducting layer is suppressed, the oxide superconducting layer is not damaged by moisture, and an oxide superconducting wire that prevents deterioration of superconducting characteristics can be provided.

Further, in the method for producing an oxide superconducting wire according to the present invention, in the first step, after laminating the silver layer, a metal stabilizing layer is laminated on the silver layer, and in the second step, the superconducting laminate is formed. Forming a grooved portion by grooving the metal stabilizing layer side of the body so as to reach the substrate from the metal stabilizing layer along the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate, In this case, a solder layer can be formed on the upper surface of the metal stabilizing layer side where the grooved portion is provided.
In this case, since the silver layer and the metal stabilizing layer are formed on the surface of the oxide superconducting layer on the solder layer side, it is possible to manufacture an oxide superconducting wire further improving the effect of stabilizing the oxide superconducting layer. In addition, since the oxide superconducting wire can be manufactured so that the surface of the oxide superconducting layer on the solder layer side is laminated with a silver layer and a metal stabilizing layer, it is possible to more effectively prevent moisture from entering the oxide superconducting layer. Therefore, it is possible to provide an oxide superconducting wire that can more reliably prevent the oxide superconducting layer from being damaged by moisture and degrading the superconducting characteristics.

In addition, in the first step, the oxide superconducting wire manufacturing method of the present invention is characterized in that, in the first step, a metal tape is bonded to the silver layer, or the silver layer is plated with metal to stabilize the metal on the silver layer. It is also possible to laminate a chemical layer.
When the metal stabilization layer is formed by laminating a metal tape, the thickness of the metal stabilization layer can be easily adjusted by adjusting the thickness of the metal tape, which is sufficient to stabilize the oxide superconducting layer. It is possible to produce an oxide superconducting wire that is easy to ensure the thickness and has a high stabilization effect. Moreover, when forming a metal stabilization layer by plating, it becomes a structure which forms a metal stabilization layer so that the surface of a silver layer may be covered. Therefore, since the superconducting laminate can be more effectively shielded from the outside, it is possible to provide an oxide superconducting wire that more reliably suppresses deterioration of the oxide superconducting layer due to moisture.

Moreover, the manufacturing method of the oxide superconducting wire of this invention can also provide the said groove process part with a laser or a rotary blade in a said 2nd process.
In this case, since the width and depth of the grooved portion can be easily adjusted by adjusting the laser output and the thickness of the rotary blade, a crack occurs in the oxide superconducting layer when the superconducting laminate is folded in half. Therefore, it is possible to provide an oxide superconducting wire in which deterioration of superconducting characteristics is suppressed.

  ADVANTAGE OF THE INVENTION According to this invention, the oxide superconducting wire which can suppress the penetration | invasion of the water | moisture content to an oxide superconducting layer, and its manufacturing method are provided, without making thickness of the whole wire more than necessary.

It is a section perspective view showing a 1st embodiment of an oxide superconducting wire concerning the present invention. 1 is a cross-sectional perspective view of a superconducting laminate used in a first embodiment of an oxide superconducting wire according to the present invention. It is a figure explaining an example of the manufacturing method of 1st Embodiment of the oxide superconducting wire which concerns on this invention. It is a block diagram which shows an example of the manufacturing apparatus of the oxide superconducting wire which concerns on this invention. It is a cross-sectional perspective view of the superconducting laminated body used for 2nd Embodiment of the oxide superconducting wire which concerns on this invention. It is a cross-sectional perspective view which shows 2nd Embodiment of the oxide superconducting wire which concerns on this invention. It is a figure explaining an example of the manufacturing method of 2nd Embodiment of the oxide superconducting wire which concerns on this invention.

Hereinafter, embodiments of an oxide superconducting wire and a method for manufacturing the same according to the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is a cross-sectional perspective view showing a first embodiment of an oxide superconducting wire according to the present invention. As shown in FIG. 1, the base material 1 is folded in two via a groove processing portion 11 so that the oxide superconducting layer 3 is sandwiched between the base materials 1.

FIG. 2 is a cross-sectional perspective view of the superconducting laminate 5 used in the first embodiment of the oxide superconducting wire according to the present invention.
A superconducting laminate 5 shown in FIG. 2 has a structure in which an intermediate layer 2, an oxide superconducting layer 3, and a silver layer 7 are sequentially laminated on a base material 1.

The substrate 1 may be any material that can be used as a substrate for ordinary superconducting wires, and is preferably in the form of a long plate, sheet, or tape, and is preferably made of a heat-resistant metal. Among heat resistant metals, an alloy is preferable, and a nickel (Ni) alloy or a copper (Cu) alloy is more preferable. Among them, if it is a commercial product, Hastelloy (trade name, manufactured by Haynes) is suitable, and the amount of components such as molybdenum (Mo), chromium (Cr), iron (Fe), cobalt (Co) is different, Hastelloy B, Any kind of C, G, N, W, etc. can be used. Further, an oriented metal base material in which a texture is introduced into a nickel (Ni) alloy or the like may be used as the base material 1, and the intermediate layer 2 and the oxide superconducting layer 3 may be formed thereon.
What is necessary is just to adjust the thickness of the base material 1 suitably according to the objective, Usually, it is preferable that it is 10-500 micrometers, and it is more preferable that it is 20-200 micrometers. By setting the lower limit value or more, the strength can be further improved, and by setting the upper limit value or less, the critical current density of the overall can be further improved.

The intermediate layer 2 controls the crystal orientation of the oxide superconducting layer 3 and prevents diffusion of metal elements in the base material 1 into the oxide superconducting layer 3. Furthermore, it functions as a buffer layer that alleviates the difference in physical properties (thermal expansion coefficient, lattice constant, etc.) between the base material 1 and the oxide superconducting layer 3, and the material has physical properties that are different from those of the base material 1 and oxide. A metal oxide showing an intermediate value with the superconducting layer 3 is preferable. Specifically, preferred materials for the intermediate layer 2 are Gd ₂ Zr ₂ O ₇ , MgO, ZrO ₂ —Y ₂ O ₃ (YSZ), SrTiO ₃ , CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd _2. Examples thereof include metal oxides such as O ₃ , Zr ₂ O ₃ , Ho ₂ O ₃ , and Nd ₂ O ₃ .
The intermediate layer 2 may be a single layer or a plurality of layers. For example, the layer made of the metal oxide (metal oxide layer) preferably has crystal orientation, and in the case of a plurality of layers, the outermost layer (the layer closest to the oxide superconducting layer 3). Preferably have at least crystal orientation.

Further, in the present invention, the intermediate layer 2 may have a multi-layer structure in which a diffusion prevention layer and a bed layer are laminated on the base material 1 side. In this case, the diffusion preventing layer is interposed between the base material 1 and the bed layer. The diffusion prevention layer is formed for the purpose of preventing the diffusion of the constituent elements of the substrate 1 and is made of silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), rare earth metal oxide, or the like. The thickness is, for example, 10 to 400 nm. Note that since the crystallinity of the diffusion preventing layer is not questioned, it may be formed by a film forming method such as a normal sputtering method.
Thus, by interposing the diffusion prevention layer between the base material 1 and the bed layer, when forming the other layer constituting the intermediate layer 2, the oxide superconducting layer 3, etc., inevitably heated, Alternatively, when receiving a thermal history as a result of the heat treatment, it is possible to effectively suppress a part of the constituent elements of the substrate 1 from diffusing to the oxide superconducting layer 3 side through the bed layer. As an example of the case where a diffusion preventing layer is interposed between the base material 1 and the bed layer, a combination using Al ₂ O ₃ as the diffusion preventing layer and Y ₂ O ₃ as the bed layer can be exemplified.

  The intermediate layer 2 may have a multilayer structure in which a cap layer is further laminated on the metal oxide layer. The cap layer has a function of controlling the orientation of the oxide superconducting layer 3, diffuses the elements constituting the oxide superconducting layer 3 into the intermediate layer 2, and intermediates between the gas used for stacking the oxide superconducting layer 3 and the intermediate layer It has a function of suppressing the reaction with the layer 2 and the like.

The cap layer is formed through a process of epitaxially growing on the surface of the metal oxide layer, and then growing the grains in the lateral direction (plane direction) (overgrowth) and selectively growing the crystal grains in the in-plane direction. The ones made are preferred. Such a cap layer has a higher degree of in-plane orientation than the metal oxide layer.
The material of the cap layer is not particularly limited as long as it can exhibit the above functions, but specifically, preferred examples include CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd ₂ O ₃ , and Zr ₂ O. ₃ , Ho ₂ O ₃ , Nd ₂ O _{3 and the} like. When the material of the cap layer is CeO ₂ , the cap layer may contain a Ce—M—O-based oxide in which part of Ce is substituted with another metal atom or metal ion.
The cap layer can be formed by a PLD method (pulse laser deposition method), a sputtering method, or the like, but it is preferable to use the PLD method from the viewpoint of obtaining a high film formation rate.

The thickness of the intermediate layer 2 may be appropriately adjusted according to the purpose, but is usually 0.1 to 5 μm.
When the intermediate layer 2 has a multi-layer structure in which a cap layer is laminated on the metal oxide layer, the thickness of the cap layer is usually 0.1 to 1.5 μm.

The intermediate layer 2 is formed by physical vapor deposition such as sputtering, vacuum vapor deposition, laser vapor deposition, electron beam vapor deposition, or ion beam assisted vapor deposition (hereinafter abbreviated as IBAD); chemical vapor deposition (CVD). ); Coating pyrolysis method (MOD method); lamination can be performed by a known method for forming an oxide thin film such as thermal spraying. In particular, the metal oxide layer formed by the IBAD method is preferable in that the crystal orientation is high and the effect of controlling the crystal orientation of the oxide superconducting layer 3 and the cap layer is high. The IBAD method is a method of orienting crystal axes by irradiating an ion beam at a predetermined angle with respect to a crystal deposition surface during deposition. Usually, an argon (Ar) ion beam is used as the ion beam. For example, the intermediate layer 2 made of Gd ₂ Zr ₂ O ₇ , MgO or ZrO ₂ —Y ₂ O ₃ (YSZ) can reduce the value of ΔΦ (FWHM: full width at half maximum) which is an index representing the degree of orientation in the IBAD method. Therefore, it is particularly suitable.

The oxide superconducting layer 3 can be widely applied with an oxide superconductor having a generally known composition, such as REBa ₂ Cu ₃ O _y (RE is Y, La, Nd, Sm, Er, Gd, etc. A material made of a material that represents a rare earth element, specifically, Y123 (YBa ₂ Cu ₃ O _y ) or Gd123 (GdBa ₂ Cu ₃ O _y ) can be exemplified. Further, other oxide superconductors, for _{example, Bi 2 Sr 2 Ca n-} 1 Cu n for _{O 4 + 2n + δ} becomes may be used in compositions such as those made of other oxide superconductors having high critical temperatures representative Of course.
The oxide superconducting layer 3 is formed by physical vapor deposition such as sputtering, vacuum vapor deposition, laser vapor deposition, or electron beam vapor deposition; chemical vapor deposition (CVD); coating pyrolysis (MOD). Among them, the laser vapor deposition method is preferable.
The oxide superconducting layer 3 has a thickness of about 0.5 to 5 μm and preferably a uniform thickness.

The silver layer 7 formed so as to cover the upper surface of the oxide superconducting layer 3 is formed by a vapor phase method such as a sputtering method, and has a thickness of about 1 to 30 μm. The silver layer 7 formed by the vapor phase method forms a film by depositing silver particles on the surface of the oxide superconducting layer 3. Therefore, the silver layer 7 is not a uniform film as a whole, and there may be variations in film thickness and film surface shape. Details of the method of forming the silver layer 7 will be described later.
The reason why the silver layer 7 is provided is that silver is doped in an annealing process in which oxygen is doped into the oxide superconducting layer 3 and the oxide superconducting layer 3 has a good conductivity and low contact resistance. The point which has a property which makes it difficult to escape oxygen from the oxide superconductor layer 3 can be mentioned.

Although details of the manufacturing method of the oxide superconducting wire according to the present embodiment will be described later, as shown in FIG. 1, the oxide superconducting wire 10 is formed on the silver layer 7 side of the superconducting laminate 5. A grooved portion 11 is provided so as to reach the base material 1 from the silver layer 7 along the longitudinal direction from an intermediate portion in the width direction, and is attached to the upper surface on the silver layer 7 side where the grooved portion 11 is provided. The solder layer 12 is laminated, and the superconducting laminate 5 is folded in two via the grooved portion 11 so that the solder layer 12 is on the inner side.
That is, the oxide superconducting wire 10 has a groove processing in which a superconducting laminate 5 in which a base material 1, an intermediate layer 2, an oxide superconducting layer 3 and a silver layer 7 are laminated in this order reaches the base material 1 from the silver layer 7. It has a structure in which the solder layer 12 is sandwiched between the part 11 and the solder layer 12.

Next, with reference to FIG. 3, the manufacturing method of the oxide superconducting wire 10 of this embodiment is demonstrated.
The manufacturing method of the oxide superconducting wire 10 of the present embodiment includes a first step of preparing a superconducting laminate 5 in which a base material 1, an intermediate layer 2, an oxide superconducting layer 3, and a silver layer 7 are laminated in this order; Groove processing is performed on the silver layer 7 side of the superconducting laminate 5 so as to reach the substrate 1 from the silver layer 7 along the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate 5. The second step, the third step of forming the solder layer 12 on the upper surface on the silver layer 7 side where the groove processing portion 11 is provided, and the groove processing portion 11 so that the solder layer 12 is inside. A fourth step of folding the superconducting laminate 5 in half, and a fifth step of fixing the superconducting laminate 5 by heating the superconducting laminate 5 folded in half to melt and solidify the solder layer 12. A process.

First, the superconducting laminate 5 described above is prepared (first step). As an example, after forming a diffusion prevention layer and a bed layer on the substrate 1 by sputtering, an intermediate layer 2 is formed on the bed layer by IBAD, and then a cap layer and an oxide superconducting layer 3 are formed by PLD. Next, a silver layer 7 is formed on the upper surface of the oxide superconducting layer 3 to produce a superconducting laminate 5.
The formation method of the silver layer 7 is not specifically limited, A conventionally well-known method can be applied, However, It is preferable to form by the vapor phase method. Examples of the vapor phase method include physical vapor deposition methods such as sputtering, vacuum vapor deposition, laser vapor deposition, and electron beam vapor deposition, and chemical vapor deposition (CVD). The sputtering method is particularly preferable because the cost is low. As the sputtering method, any of an ion beam sputtering method, a DC (direct current) sputtering method, an RF (high frequency) sputtering method, and a magnetron sputtering method may be used.

  The thickness of the silver layer 7 to be formed is about 1 to 30 μm, and when formed by a vapor phase method such as sputtering as described above, it is about 0.5 to 26 μm. The silver layer 7 formed by the vapor phase method forms a film by depositing silver particles on the surface (film formation surface) of the superconducting laminate 5. Therefore, the silver layer 7 is not a uniform film as a whole, and there may be variations in film thickness and film surface shape.

Next, the silver layer 7 side of the superconducting laminate 5 is grooved so as to reach the base material 1 from the silver layer 7 along the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate 5 to form the groove processing portion 11 Provided (second step). The formation method of the groove processing part 11 is not specifically limited, A conventionally well-known method can be applied, However, It is preferable to form with a laser or a rotary blade. As shown in FIG. 3, when using the laser processing machine 13, there is no possibility that the superconducting laminate 5 is deformed by stress or pressure during processing. The width and depth of the grooved portion 11 can be easily adjusted by adjusting the laser output and the thickness of the rotary blade. In addition, more accurate adjustment is possible by changing the transport speed of the superconducting laminate 5.
The width of the groove processing portion 11 is set to about 20 to 100 μm, and the depth of the groove processing portion 11 is set to reach a depth of about 1/3 to 1/2 of the thickness of the substrate 1.
If the base material 1 is folded in half without providing the groove processing portion 11, many irregular cracks are generated in the bent portion of the oxide superconducting layer 3, and the superconducting characteristics of the oxide superconducting wire 10 are deteriorated. . On the other hand, by providing the groove processed portion 11, when the superconducting laminate 5 is folded in half, an unnecessary crack does not occur in the oxide superconducting layer 3, so that the oxide superconducting wire 10 that suppresses deterioration of superconducting characteristics is provided. can do.

  Next, the solder layer 12 is formed on the upper surface on the silver layer 7 side where the groove processing portion 11 is provided (third step). The thickness of the solder layer 12 is about 20 to 30 μm. The solder layer may be formed by attaching a solder tape, or may be formed by soldering. Moreover, tin, a tin-silver alloy, a tin-bismuth alloy, or the like can be appropriately used as a material for the solder layer.

  Next, the superconducting laminate 5 is folded into two via the grooved portion 11 so that the solder layer 12 is on the inner side (fourth step). The superconducting laminate 5 can be easily bent through the groove processing portion 11. As described above, it is preferable to provide the grooved portion 11 so as to reach a depth of about 1/3 to 1/2 of the thickness of the substrate 1 from the viewpoint of bending.

Next, the superconducting laminate 5 folded in half is heated to melt and solidify the solder layer 12 to fix the superconducting laminate 5 (fifth step).
The oxide superconducting wire 10 can be manufactured through the above steps.

Furthermore, the manufacturing method of the oxide superconducting wire 10 of the present embodiment will be described using an oxide superconducting wire manufacturing apparatus 30 (hereinafter referred to as “manufacturing apparatus 30”).
As shown in FIG. 4, the manufacturing apparatus 30 includes a laser processing mechanism 13 for grooving the superconducting laminate 5, a solder alignment mechanism 50 for stacking a solder layer along the solder tape 20 on the superconducting laminate 5, A folding mechanism 40 that folds the superconducting laminate 5 through the groove processing portion and a fixing mechanism 60 that fixes the folded superconducting laminate 5 are provided.
Specifically, the manufacturing apparatus 30 is provided with the superconducting laminate 5 wound thereon, the first reel device 31 capable of feeding the superconducting laminate 5 and the second reel capable of feeding the solder tape 20 provided with the solder tape 20 wound thereon. A device 32; a transport roller 51 that guides the superconducting laminate 5 and the solder tape 20 delivered to the solder alignment mechanism 50; and a winding device 33 that winds up the oxide superconducting wire 1 formed by the fixing mechanism 60. It has.

As shown in FIG. 4, the fixing mechanism 60 includes a main heating mechanism (heating unit) 61 that heats the superconducting laminate 5 in which the solder layers are laminated and folded in half to a temperature equal to or higher than the melting point of the solder layers. And a pair of pressure rollers 62 that cool gradually while pressing so as to fix the superconducting laminate 5 made to be fixed.
The superconducting laminate 5 folded in half is heated to a predetermined temperature by being inserted through the heating mechanism 61. The pressure roller 62 has a heater (not shown) and a brush (not shown) attached on the outer peripheral surface of the pressure roller 62.
The oxide superconducting wire 10 is manufactured through the above steps.

The oxide superconducting wire 10 of this embodiment has a configuration in which a superconducting laminate 5 in which only the solder layer 12 is laminated is folded in two so that the oxide superconducting layer 3 is sandwiched between the base materials 1. Therefore, a configuration in which the oxide superconducting layer 3 is shielded from the outside can be realized without increasing the overall thickness of the wire.
Therefore, since the permeation of moisture into the oxide superconducting layer 3 is suppressed, the oxide superconducting layer 3 is not damaged by moisture, and the superconducting characteristics can be prevented from deteriorating.

Further, the oxide superconducting wire 10 of the present embodiment has a configuration in which the base material 1 is located outside the oxide superconducting layer 3.
Therefore, since the oxide superconducting layer 3 can be configured to be shielded from the outside by the base material 1, it can be prevented from being damaged by an external impact, and the superconducting characteristics can be prevented from deteriorating.

  Also, the oxide superconducting wire 10 of the present embodiment includes a superconducting laminate 5 in which the base material 1, the intermediate layer 2, the oxide superconducting layer 3 and the silver layer 7 are laminated in this order from the silver layer 7 to the base material 1. This is a configuration in which the solder layer 12 is sandwiched between the groove processing portion 11 reaching the end. Therefore, the oxide superconducting layer 3 is located near the neutral axis of the oxide superconducting wire 10 and is not easily subjected to tensile stress and compressive stress. Therefore, it is not necessary to consider the front and back of the wire when winding the wire around a winding drum to form a superconducting coil, and therefore the oxide superconducting wire 10 of this embodiment is preferably used as a superconducting coil. Can do.

  Furthermore, since the oxide superconducting wire 10 of the present embodiment has a configuration in which the superconducting laminate 5 in which only the solder layer 12 is laminated as described above is folded in two, the wire can be miniaturized. When a coil is processed into a superconducting coil, the time required for winding can be shortened, and the handleability is good.

The manufacturing method of the oxide superconducting wire 10 of the present invention is configured such that the superconducting laminate 5 in which only the solder layer 12 is laminated is folded in two so that the oxide superconducting layer 3 is sandwiched between the base materials 1.
Therefore, the oxide superconducting wire 10 having a configuration in which the oxide superconducting layer 3 is shielded from the outside can be manufactured without making the entire thickness of the wire more than necessary. Accordingly, since the infiltration of moisture into the oxide superconducting layer 3 is suppressed, the oxide superconducting layer 3 is not damaged by moisture, and the oxide superconducting wire 10 that prevents deterioration of superconducting characteristics can be manufactured.

In the manufacturing method of the oxide superconducting wire 10 according to the present embodiment, the silver layer 7 side of the superconducting laminate 5 is moved from the intermediate portion in the width direction of the superconducting laminate 5 along the longitudinal direction from the silver layer 7 to the substrate 1. It is the structure which has the process (2nd process) which provides the groove process part 11 by groove-growing so that it may reach.
By providing the grooved portion 11 on the silver layer 7 side of the superconducting laminate 5, when the superconducting laminate 5 is folded in half, unnecessary cracks do not occur in the oxide superconducting layer 3, thereby suppressing deterioration of superconducting characteristics. The oxide superconducting wire 10 can be manufactured.
Moreover, the manufacturing method of the oxide superconducting wire of this embodiment can also be set as the structure which has the process of providing the said groove processing part 11 with a laser or a rotary blade in a 2nd process. In this case, the width and depth of the grooved portion 11 can be easily adjusted by adjusting the laser output and the thickness of the rotary blade.

  The manufacturing method of the oxide superconducting wire 10 of this embodiment includes a step (fifth step) of heating the superconducting laminate 5 folded in half to melt and solidify the solder layer 12 to fix the superconducting laminate 5. It is a configuration. Therefore, in the unlikely event that a part of the silver layer 7 is peeled to form a peeled portion and a part of the oxide superconducting layer 3 is exposed, the peeled portion of the silver layer 7 is melted by the molten solder layer 12 And a structure for shielding the oxide superconducting layer 3 from the outside can be realized. Therefore, even when the silver layer 7 has a peeling portion, it is possible to suppress the ingress of moisture into the oxide superconducting layer 3 and the deterioration of the superconducting characteristics.

Such a peeling portion of the silver layer 7 is not frequently formed, but can be formed when a part of the silver layer 7 is slightly peeled during the manufacturing process. For example, when the silver layer 7 is formed in a state where the foreign matter mixed in during the manufacturing process such as the formation of the intermediate layer 2 or the oxide superconducting layer 3 is not removed and is attached to the oxide superconducting layer 3, the foreign matter In some cases, part of the silver layer 7 may be peeled off along with the peeling. Cleaning the wire is effective to prevent foreign material from mixing in, but it is difficult to remove the foreign material adhering to the wire by air cleaning, etc.If the surface of the wire is brushed and cleaned, the surface film will be damaged, The characteristics may deteriorate. Since there is a high possibility that a peeling portion will be formed on the silver layer 7 due to an increase in the length of the wire and the number of manufactured wires, it is possible to peel off after forming the silver layer 7 by completely eliminating the introduction of the peeling portion into the silver layer 7. It is more realistic to repair the part.
According to the manufacturing method of the oxide superconducting wire 10 of the present embodiment, it is possible to simplify the manufacturing process, reduce the defective product rate, and improve the productivity.

[Second Embodiment]
FIG. 5 is a cross-sectional perspective view of the superconducting laminate used in the second embodiment of the oxide superconducting wire according to the present invention.
In the superconducting laminate 5B shown in FIG. 5, an intermediate layer 2, an oxide superconducting layer 3, and a silver layer 7 are sequentially laminated on a base material 1, and a metal stabilizing layer 8 is laminated on the silver layer 7. It has a structure.
FIG. 6 is a cross-sectional perspective view showing a second embodiment (oxide superconducting wire 10B) of the oxide superconducting wire according to the present invention.

  The superconducting laminate 5B used for the oxide superconducting wire 10B of the present embodiment is formed on the upper surface of the oxide superconducting layer 3 in addition to the configuration of the superconducting laminate 5 used for the oxide superconducting wire 10 of the first embodiment. The metal stabilization layer 8 is laminated on the silver layer 7 formed. In FIG. 5, the same code | symbol is attached | subjected to the component same as the oxide superconducting wire 10 of the said 1st Embodiment, and description is abbreviate | omitted.

The metal stabilizing layer 8 is made of a highly conductive metal material. When the oxide superconducting layer 3 is about to transition from the superconducting state to the normal conducting state, the current of the oxide superconducting layer 3 is commutated together with the silver layer 7. To act as a bypass.
The metal material constituting the metal stabilizing layer 8 is not particularly limited as long as it has good conductivity, but copper alloys such as copper, brass (Cu—Zn alloy), Cu—Ni alloy, stainless steel, etc. It is preferable to use those made of a relatively inexpensive material, and among them, copper is preferable because it has high conductivity and is inexpensive.
When the oxide superconducting wire 10B is used for a superconducting fault current limiter, the metal stabilizing layer 8 is made of a resistance metal material, and a Ni-based alloy such as Ni—Cr can be used.

The formation method of the metal stabilization layer 8 is not specifically limited, For example, it can form by laminating | stacking the metal tape which consists of good electroconductive materials, such as copper, on the silver layer 7 through bonding agents, such as a solder.
The thickness of the metal stabilizing layer 8 is not particularly limited and can be adjusted as appropriate, but is preferably 10 to 300 μm. By setting the lower limit value or more, a higher effect of stabilizing the oxide superconducting layer 3 can be obtained, and by setting the upper limit value or less, the oxide superconducting wire 10B can be thinned.

FIG. 6 is a cross-sectional perspective view showing a second embodiment of the oxide superconducting wire according to the present invention. Although details of the manufacturing method of the oxide superconducting wire according to the present embodiment will be described later, the oxide superconducting wire 10B is disposed on the metal stabilization layer 8 side of the superconducting laminate 5B from the intermediate portion in the width direction of the superconducting laminate 5B. A grooved portion 11B is provided so as to reach the base material 1 from the metal stabilizing layer 8 along the longitudinal direction, and the solder layer is attached to the upper surface of the metal stabilizing layer 8 side where the grooved portion 11B is provided. 12 is laminated, and the superconducting laminate 5B is folded in two via the groove processing portion 11B so that the solder layer 12 is inside.
That is, the oxide superconducting wire 10 </ b> B has a structure in which the metal stabilization layer 8 is interposed between the solder layer 12 and the silver layer 7.
Therefore, the oxide superconducting wire 10B of the present embodiment is compared with a structure in which a silver stabilizing layer is provided on the entire outer periphery of a superconducting laminate in which oxide superconducting layers are laminated, and a copper stabilizing layer is further provided. The overall thickness of the wire does not increase and the critical current density does not decrease.

Next, the manufacturing method of the oxide superconducting wire 10B of this embodiment is demonstrated.
The manufacturing method of the oxide superconducting wire 10B of the present embodiment is as follows. First, in the first step of the manufacturing method of the oxide superconducting wire 10 of the first embodiment described above, after the silver layer 7 is laminated, The metal stabilizing layer 8 is laminated to prepare a superconducting laminate 5B.
Next, in the second step of the manufacturing method of the oxide superconducting wire 10 according to the first embodiment described above, the metal stabilizing layer 8 side of the superconducting laminate 5B is moved in the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate 5B. A groove is formed so as to reach the base material 1 from the silver layer 7 along the groove.
Next, in the third step of the manufacturing method of the oxide superconducting wire 10 of the first embodiment described above, the solder layer 12 is formed on the upper surface on the metal stabilization layer 8 side where the grooved portion 11B is provided.
Then, the process similar to the 4th process and the 5th process of the manufacturing method of the oxide superconducting wire 10 of the above-mentioned 1st Embodiment is performed.
The oxide superconducting wire 10B of this embodiment can be manufactured by the above process.

In the first step, the metal stabilization layer 8 can be formed by bonding a metal tape. Since the thickness of the metal stabilization layer 8 can be easily adjusted by adjusting the thickness of the metal tape, it is easy to ensure a sufficient thickness to stabilize the oxide superconducting layer 3, and the oxidation effect is high. It becomes the object superconducting wire 10B.
Next, in the second step, the metal stabilizing layer 8 side of the superconducting laminate 5B is grooved to provide the grooved portion 11B, but the bending is performed between the second step and the third step of the first embodiment described above. Two metal tapes having the same width as that of the subsequent superconducting laminate 5B may be bonded to the silver layer 7 so as not to cover the grooved portion 11B.

Further, in the first step, the metal stabilization layer 8 can also be electroplated. The material constituting the metal stabilizing layer 8 is preferably a highly conductive metal, such as Cu or Al. Cu is particularly preferable because it has high conductivity. The thickness of the metal stabilizing layer 8 is not particularly limited and can be changed as appropriate. However, the thickness can be set to about 10 to 100 μm, preferably 20 μm to 100 μm, and more preferably 20 μm to 50 μm. preferable.
A higher effect of stabilizing the oxide superconducting layer 3 can be obtained by setting the thickness of the metal stabilizing layer 8 to 10 μm or more, and the oxide superconducting wire 10B can be made thinner by setting the thickness to 100 μm or less.

  The oxide superconducting wire 10B of the present embodiment is configured to include a metal stabilizing layer 8 on the surface of the silver layer 7 on the solder layer 12 side in addition to the configuration of the oxide superconducting wire 10 of the first embodiment. Therefore, according to the oxide superconducting wire 10B of the present embodiment, in addition to the effect of the oxide superconducting wire 10 of the first embodiment, the effect of stabilizing the oxide superconducting layer 3 is further enhanced. In addition, since the surface of the oxide superconducting layer 3 on the solder layer 12 side is covered with the silver layer 7 and the metal stabilizing layer 8, the oxide superconducting wire 10 of the first embodiment is more reliably oxidized. It is possible to prevent moisture from entering the superconducting layer 3 and prevent the oxide superconducting layer 3 from being damaged by moisture and degrading the superconducting characteristics.

Further, the oxide superconducting wire 10B of the present embodiment can be configured such that the metal stabilization layer 8 is formed by bonding a metal tape or plating.
When the metal stabilization layer 8 is formed by bonding a metal tape, the thickness of the metal stabilization layer 8 can be easily adjusted by adjusting the thickness of the metal tape, so that the oxide superconducting layer 3 can be stabilized. Thus, the oxide superconducting wire 10B having a sufficient stabilization effect can be easily obtained. Moreover, when the metal stabilization layer 8 is formed by plating, the metal stabilization layer 8 is formed so as to cover the surface of the silver layer. Therefore, since superconducting laminate 5B can be more effectively shielded from the outside, deterioration of oxide superconducting layer 10B due to moisture can be more reliably suppressed.

  The manufacturing method of the oxide superconducting wire 10B according to the present embodiment includes a step of forming the silver layer 7 and the metal stabilizing layer 8 on the surface of the oxide superconducting layer 3 on the solder layer 12 side. The oxide superconducting wire 10 </ b> B in which the effect of stabilizing the layer 3 is further improved can be manufactured. In addition, since the oxide superconducting wire 10B having a structure in which the surface on the solder layer 12 side of the oxide superconducting layer 3 is laminated by the silver layer 7 and the metal stabilizing layer 8 can be manufactured, the oxide superconducting layer 3 is more effectively produced. Therefore, it is possible to provide the oxide superconducting wire 10B that can more reliably prevent the oxide superconducting layer 3 from being damaged by moisture and degrading the superconducting characteristics.

In addition, in the manufacturing method of the oxide superconducting wire 10B of the present invention, in the first step of the first embodiment described above, a metal tape is bonded onto the silver layer 7, or the silver layer 7 is plated with a metal. Thus, the metal stabilizing layer 8 may be laminated on the silver layer 7.
When the metal stabilizing layer 8 is formed by bonding a metal tape, the thickness of the metal stabilizing layer 8 can be easily adjusted by adjusting the thickness of the metal tape, so that the oxide superconducting layer 3 is stabilized. Therefore, it is possible to manufacture the oxide superconducting wire 10B having a sufficient stabilizing effect and a sufficient stabilizing effect. Further, when the metal stabilizing layer 8 is formed by plating, the metal stabilizing layer 8 is formed so as to cover the surface of the silver layer 7. Therefore, since superconducting laminate 5B can be more effectively shielded from the outside, it is possible to provide oxide superconducting wire 10B that more reliably suppresses deterioration of oxide superconducting layer 3 due to moisture.

In the manufacturing method of the oxide superconducting wire 10B of the present embodiment, the metal stabilizing layer 8 side of the superconducting laminate 5B is moved from the silver layer 7 to the base material along the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate 5B. 1 is a configuration having a step (second step) of providing a groove processing portion 11 </ b> B by grooving so as to reach 1.
By providing the grooved portion 11B on the metal stabilizing layer 8 side of the superconducting laminate 5B, when the superconducting laminate 5B is folded in half, no cracks are generated in the oxide superconducting layer 3, thereby suppressing deterioration of the superconducting characteristics. Oxide superconducting wire 10B can be manufactured.
Moreover, the manufacturing method of the oxide superconducting wire of this embodiment can also be set as the structure which has the process of providing the said groove processing part 11B with a laser or a rotary blade in a 2nd process. In this case, the width and depth of the grooved portion 11B can be easily adjusted by adjusting the laser output and the thickness of the rotary blade.

The manufacturing method of the oxide superconducting wire 10B of the present embodiment includes a step (fifth step) of heating the folded superconducting laminate 5B to melt and solidify the solder layer 12 to fix the superconducting laminate 5B. It is a configuration. Even if a large peeling portion of about several tens of μm is formed in the silver layer and the peeling portion is not sufficiently filled with the metal stabilization layer 8, the metal stabilization layer 8 is covered with the solder layer 12. By being configured, the oxide superconducting layer 3 can be completely shielded from the outside, and the oxide superconducting layer 3 can be prevented from being deteriorated by moisture.
Furthermore, even if there is a pinhole in the metal stabilization layer 8 formed by the plating method, the pinhole can be blocked by the solder layer 12.

Such a peeling portion of the silver layer 7 is not frequently formed, but rarely, a part of the silver layer 7 may be slightly peeled off during the manufacturing process. For example, when the silver layer 7 is formed in a state where the foreign matter mixed in during the manufacturing process is not removed and is attached to the oxide superconducting layer 3, a part of the silver layer 7 is also peeled off as the foreign matter is peeled off. May end up.
Cleaning the wire is effective to prevent foreign material from mixing in, but it is difficult to remove the foreign material adhering to the wire by air cleaning, etc.If the surface of the wire is brushed and cleaned, the surface film will be damaged, The characteristics may deteriorate. Since there is a high possibility that a peeling portion will be formed on the silver layer 7 due to an increase in the length of the wire and the number of manufactured wires, it is possible to peel off after forming the silver layer 7 by completely eliminating the introduction of the peeling portion into the silver layer 7. It is more realistic to repair the part.

  According to the oxide superconducting wire 10B and the manufacturing method thereof according to the present embodiment, a foreign matter should be mixed and a peeled portion is introduced into the silver layer, and the peeled portion is also filled with the metal stabilization layer 8 formed by plating. Even in such a case, the structure in which the oxide superconducting layer 3 is completely shielded from the outside by covering the peeled portion can be realized by the structure covered with the solder layer 12. Therefore, according to the manufacturing method of the oxide superconducting wire 10B of the present embodiment, it is possible to simplify the manufacturing process, reduce the defective product rate, and improve the productivity.

  As described above, the oxide superconducting wire and the manufacturing method thereof according to the present invention have been described. In the above embodiment, each part of the oxide superconducting wire and each part constituting the apparatus used for the manufacturing method of the oxide superconducting wire are examples. The present invention can be changed as appropriate without departing from the scope of the present invention.

"Example 1"
An intermediate of a composition of Gd ₂ Zr ₂ O ₇ (GZO) having a thickness of 1.0 μm on a tape-shaped metal substrate made of Hastelloy C276 (trade name, manufactured by Haynes, USA) having a width of 10 mm and a thickness of 100 μm by the IBAD method. Then, a cap layer having a composition of CeO _{2 having a} thickness of 1.0 μm was formed on the alignment layer by the PLD method. Next, an oxide superconducting layer having a composition of GdBa ₂ Cu ₃ O _7-x having a thickness of 1.0 μm is formed on the cap layer by a PLD method, and a thickness of ₂ μm is formed on the oxide superconducting layer by a sputtering method. A superconducting laminate was produced by forming a silver layer.
Next, using the apparatus shown in FIG. 4, the superconducting laminate is grooved, the solder layer is laminated along the solder tape, folded in half, and heated to melt the solder in the solder layer. Then, the superconducting laminate folded in half was fixed to produce an oxide superconducting wire.
The critical current value at the liquid nitrogen temperature (77K) of the superconducting laminate is Ic = 400A, the critical current value at the liquid nitrogen temperature (77K) of the oxide superconducting wire is Ic = 380A, and the deterioration of the superconducting characteristics is It was 5%.

“Comparative Example 1”
After producing a superconducting laminate in the same manner as in Example 1 and using the apparatus shown in FIG. 4, the superconducting laminate was not subjected to grooving, but the solder layer was laminated along the solder tape and folded in half. Then, by heating, the solder of the solder layer was melted, and the superconducting laminate that was folded in two was fixed, thereby producing an oxide superconducting wire.
The critical current value at the liquid nitrogen temperature (77K) of the superconducting laminate is Ic = 400A, the critical current value at the liquid nitrogen temperature (77K) of the oxide superconducting wire is Ic = 320A, and the deterioration of the superconducting characteristics is 20%.

From the above results, the superconducting laminate in which the base material, the intermediate layer, the oxide superconducting layer, and the silver layer are laminated in this order is obtained from the silver layer to the base material. It is a structure that is folded in half with the solder layer sandwiched through the groove processing part that reaches, and the oxide superconducting layer is covered with a base material that is folded in half, so that the superconducting property degradation is reduced to 5% Can be suppressed. Such a decrease in superconducting characteristics is due to the provision of the grooved portion.
On the other hand, since the oxide superconducting wire of Comparative Example 1 has a configuration in which the superconducting laminate is folded in two without using the grooved portion, the deterioration of the superconducting property was 20%. Such a decrease in superconducting characteristics is attributed to cracks occurring in multiple directions in the oxide superconducting layer by folding the superconducting laminate in half.

"Pressure cooker test"
The oxide superconducting wire of Example 1 and the superconducting laminate were subjected to a pressure cooker test held in an atmosphere of a temperature of 120 ° C., a humidity of 100%, and a pressure of 2 atmospheres, and each oxide superconducting wire after a test time of 100 hours passed. The critical current value Ic at a liquid nitrogen temperature (77 K) was measured.
For the oxide superconducting wire of Example 1, the critical current value before the pressure cooker test was Ic0 = 380A, the critical current value after the test was Ic = 380A, and the decrease in superconducting characteristics was 0%. .
On the other hand, for the superconducting laminate, the critical current value before the pressure cooker test was Ic0 = 400A, the critical current value after the test was Ic = 0A, and the decrease in superconducting characteristics was 100%.

  Based on the above results, the oxide superconducting wire of Example 1 according to the present invention has a configuration in which both surfaces of the oxide superconducting layer are covered with a base material folded in half. It is clear that intrusion can be suppressed and deterioration of the oxide superconducting layer due to moisture penetration can be suppressed.

  The present invention can be used for an oxide superconducting wire used in various electric power devices such as a superconducting motor and a current limiting device.

DESCRIPTION OF SYMBOLS 1 ... Base material, 2 ... Intermediate | middle layer, 3 ... Oxide superconducting layer, 5, 5B ... Superconducting laminated body, 7 ... Silver layer, 8 ... Metal stabilization layer, 10, 10B ... Oxide superconducting wire, 11, 11B ... Groove processing part, 12 ... solder layer, 13 ... laser processing machine, 20 ... solder tape, 30 ... oxide superconducting wire manufacturing device, 31 ... first reel device, 32 ... second reel device, 33 ... winding device, DESCRIPTION OF SYMBOLS 40 ... Bending mechanism, 50 ... Solder alignment mechanism, 51 ... Conveyance roller, 60 ... Fixing mechanism, 61 ... This heating mechanism (heating part), 62 ... Pressure roller

Claims (7)

  A superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order is folded in half with a solder layer interposed through a grooved portion that reaches from the silver layer to the base material. An oxide superconducting wire characterized by   The oxide superconducting wire according to claim 1, wherein a metal stabilizing layer is interposed between the solder layer and the silver layer.   The oxide superconducting wire according to claim 2, wherein the metal stabilizing layer is formed by bonding a metal tape or plating. A first step of preparing a superconducting laminate in which a base material, an intermediate layer, an oxide superconducting layer, and a silver layer are laminated in this order;
A second step of grooving the silver layer side of the superconducting laminate so as to reach the substrate from the silver layer along the longitudinal direction from the intermediate portion in the width direction of the superconducting laminate;
A third step of forming a solder layer on the upper surface of the silver layer side provided with the grooved portion;
A fourth step of folding the superconducting laminate in half via the grooved portion so that the solder layer is on the inside;
A fifth step of fixing the superconducting laminate by heating the superconducting laminate folded in half to melt and solidify the solder layer;
A method for producing an oxide superconducting wire characterized by comprising:   In the first step, after laminating the silver layer, a metal stabilizing layer is laminated on the silver layer, and in the second step, the metal stabilizing layer side of the superconducting laminate is disposed on the superconducting laminate. A groove is formed by grooving from the intermediate portion in the width direction along the longitudinal direction so as to reach the substrate from the metal stabilization layer, and the metal stabilization provided with the grooving portion in the third step. The method for producing an oxide superconducting wire according to claim 4, wherein a solder layer is formed on the upper surface of the layer side.   6. In the first step, a metal stabilization layer is laminated on the silver layer by bonding a metal tape on the silver layer or plating the silver layer with a metal. The manufacturing method of the oxide superconducting wire of description. In the said 2nd process, the said groove processing part is provided with a laser or a rotary blade, The manufacturing method of the oxide superconducting wire as described in any one of Claims 4-6 characterized by the above-mentioned.

Images