JP5716281B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device used for a lighting fixture, a display, a backlight of a mobile phone, a moving image illumination auxiliary light source, and other general consumer light sources, and a manufacturing method thereof.

  In recent years, along with the downsizing and weight reduction of electronic devices, various types of light emitting devices (light emitting diodes) mounted thereon have been developed. In these light emitting devices, for example, a light emitting element is mounted on one of a pair of lead frames using an adhesive member such as silver (Ag) paste, and the other lead frame and the light emitting element are electrically connected using a wire or the like. (For example, patent document 1).

JP 2006-313943 A

In recent years, there has been a demand for further downsizing of the light emitting device as described above. However, when the lead frame itself of the light emitting device is downsized, the area where the light emitting element is placed becomes small, and the bonding strength of the light emitting element is reduced.
SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting device that is small and lightweight, and in which a light emitting element does not easily fall off, and a method for manufacturing the same.

  The present invention includes a light emitting element having a positive electrode and a negative electrode on the same surface side, a first conductive member and a second conductive member that are spaced apart from each other, and an adhesive member that connects the light emitting element and the conductive member. In the apparatus, the adhesive member has an insulating region and a conductive region, and is connected to the upper surface and the side surface of the first conductive member and the second conductive member. The positive electrode and the negative electrode of the light emitting element are the adhesive member. The present invention relates to a light emitting device connected on the conductive region. According to this configuration, it is possible to obtain a light-emitting device that is small and lightweight, and can increase the bonding strength between the light-emitting element and the conductive member.

  It is preferable that an adhesive member is filled between the first conductive member and the second conductive member. According to this configuration, the bonding strength between the light emitting element and the conductive member can be increased.

  The positive electrode of the light emitting element is disposed on the first conductive member, the negative electrode of the light emitting element is disposed on the second conductive member, and the conductive region of the adhesive member is a positive electrode of the first conductive member and the light emitting element. It is preferable to be provided between the electrodes and between the second conductive member and the negative electrode of the light emitting element. According to this configuration, a small and lightweight light emitting device can be obtained.

  It is preferable that the first conductive member and the second conductive member have a protruding portion that protrudes toward an outer edge adjacent to each other, and the upper surface and the lower surface of the protruding portion are sandwiched between adhesive members. According to such a configuration, the anchor effect of the adhesive member to the conductive member can be exhibited, and the light emitting element can be prevented from falling off. In addition, the mechanical strength of the light emitting device can be increased.

  In addition, the present invention provides a conductive member forming step of forming a first conductive member and a second conductive member that are separated from each other on a support substrate, and an insulating member and a conductive material on the first conductive member and the second conductive member. A die bonding step of extending a part of the adhesive member between the first conductive member and the second conductive member by crimping the light emitting element via the adhesive member containing the conductive filler. It relates to a manufacturing method. According to such a configuration, it is possible to obtain a light-emitting device that is small and lightweight and in which the light-emitting element is difficult to drop off.

  In the conductive member forming step, it is preferable that a protrusion is formed on the outer edges of the first conductive member and the second conductive member adjacent to each other, and a part of the adhesive member is extended below the protrusion in the die bonding step. According to such a configuration, a light emitting device in which the light emitting element is difficult to drop off can be obtained.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to obtain a small and lightweight light-emitting device, the joint strength of a light emitting element and a conductive member can be improved.

It is a schematic perspective view which shows the light-emitting device which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing which shows the light-emitting device which concerns on Embodiment 1 of this invention. It is the schematic sectional drawing which expanded a part of light-emitting device which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing which shows the manufacturing process of the light-emitting device which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing which shows the application example of the light-emitting device which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing which shows the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the light-emitting device which concerns on the 3rd Embodiment of this invention.

  Hereinafter, a light emitting device according to the present invention will be described with reference to embodiments and examples. However, the present invention is not limited to this embodiment and example.

<Embodiment 1>
FIG. 1 is a schematic perspective view showing a light-emitting device according to Embodiment 1 of the present invention. FIG. 2 is a schematic cross-sectional view showing the light emitting device according to Embodiment 1 of the present invention. FIG. 3 is an enlarged schematic cross-sectional view of a part of the light emitting device according to Embodiment 1 of the present invention.

(Structure of light emitting device)
In the light emitting device 100 of the present embodiment, the light emitting element 104 is connected to the first conductive member 101 and the second conductive member 102 that are separated from each other, and the light emitting element 104 is connected to the first conductive member 101 and the second conductive member 102. And an adhesive member 103. The light emitting element 104 includes a positive electrode 104a and a negative electrode 104b on the same surface side. The adhesive member 103 has an insulating region 103a and a conductive region 103b. Examples of the adhesive member 103 include an anisotropic conductive material in which a conductive filler is mixed with an insulating member. The adhesive member 103 is connected to the upper and side surfaces of the first conductive member 101 and the second conductive member 102. The positive electrode 104 a and the negative electrode 104 b of the light emitting element 104 are connected on the conductive region 103 b of the adhesive member 103. Specifically, the positive electrode 104 a of the light emitting element 104 is disposed on the first conductive member 101, and the negative electrode 104 b of the light emitting element 104 is disposed on the second conductive member 102. The conductive region 103 b of the adhesive member 103 is provided at least between the first conductive member 101 and the positive electrode 104 a of the light emitting element 104 and between the second conductive member 102 and the negative electrode 104 b of the light emitting element 104. The conductive region 103b is surrounded by the insulating region 103a. That is, the two conductive regions 103b are separated by the insulating region 103a.
Metal bumps 105 such as Au may be provided on the positive electrode 104 a and the negative electrode 104 b of the light emitting element 104. In this case, the positive electrode 104 a and the negative electrode 104 b of the light emitting element 104 are connected to the conductive region 103 b of the adhesive member 103 through the metal bump 105.
The light emitting device 100 includes a light emitting element 104 and a sealing member 106 that covers at least one surface of the first conductive member 101 and the second conductive member 102. The sealing member 106 forms part of the upper surface, the side surface, and the lower surface of the light emitting device 100. The lower surfaces of the first conductive member 101 and the second conductive member 102 are exposed to the outside and form a part of the lower surface of the light emitting device 100. The first conductive member 101 and the second conductive member 102 are preferably flush with the lower surface of the sealing member 106.

  In this embodiment mode, the light-emitting element 104 does not use a conductive wire, and the positive electrode 104 a and the negative electrode 104 b are directly bonded to the first conductive member 101 and the second conductive member 102 using the adhesive member 103. . Thereby, the thickness of the light emitting device can be suppressed. In addition, since it is not necessary to provide a bonding region for the wire to the conductive member, the light emitting device can be reduced in size. In addition, since the adhesive member 103 is connected to the top and side surfaces of the first conductive member 101 and the second conductive member 102, a bonding area between the conductive member and the adhesive member is ensured even in a miniaturized light emitting device. be able to.

(Method for manufacturing light emitting device)
Next, a method for manufacturing the light emitting device according to this embodiment will be described. FIG. 4 is a schematic cross-sectional view showing the manufacturing process of the light emitting device according to the present embodiment.

  The light emitting device manufacturing method according to the present embodiment mainly includes a conductive member forming step of forming a first conductive member and a second conductive member that are separated from each other on a support substrate, and a first conductive member and a second conductive member. A die bonding step of extending a part of the adhesive member between the first conductive member and the second conductive member by crimping the light emitting element via the adhesive member on the member;

(Conductive member forming process)
First, a support substrate is prepared. The support substrate is a plate-like or sheet-like member used to form the first conductive member and the second conductive member, and is removed before the light-emitting device is separated, and thus is provided in the light-emitting device. There is no member. The support substrate is not particularly limited, and is preferably a conductive substrate.

Examples of the support substrate include those made of stainless steel (SUS), and various stainless steels such as an altensite system, a ferrite system, and an austenite system can be used. Preferably, a stainless ferritic, particularly preferably 400 system, are of 300 system, ^{further, SUS430 (10.4 × 10 -6 /K),SUS444(10.6×10} -6 / K ^{), SUS303 (18.7 × 10 -6} /K),SUS304(17.3×10 -6 / K) and the like are preferably used. When the 400 series stainless steel is subjected to an acid treatment as a pretreatment for plating, the surface becomes more rough than the 300 series stainless steel. Accordingly, when a plating layer is formed on 400 series stainless steel that has been subjected to acid treatment, the surface of the plating layer is also likely to be rough. Thereby, adhesiveness with resin which comprises a sealing member can be improved. In addition, the surface of 300 series is hardly roughened by acid treatment. For this reason, if 300 series stainless steel is used, it is easy to improve the glossiness of the surface of the plating layer, whereby the reflectance from the light emitting element is improved and a light emitting device with high light extraction efficiency can be obtained.
The thickness of the support substrate is preferably a plate-shaped member having a thickness of about 10 μm to 300 μm, and the support substrate may be slit, grooved, or corrugated to reduce warpage after resin molding.

A resist is applied as a protective film on the upper surface of the support substrate. The thickness of the conductive member formed later can be adjusted by the thickness of the resist. Here, the resist is provided only on the upper surface (surface on which the conductive member is formed) of the support substrate, but may be formed on the lower surface (surface on the opposite side). Thereby, it can prevent that a conductive member is formed in the lower surface side of a support substrate by the plating mentioned later. When the protective film (resist) is a resist formed by photolithography, either a positive type or a negative type may be used. In addition, a method of attaching a resist formed by screen printing or a sheet-like resist can be used.
After the applied resist is dried, a mask having an opening having a predetermined pattern shape is directly or indirectly disposed on the resist, and exposure is performed by irradiating ultraviolet rays. Then, by processing with an etching agent, as shown in FIG. 4A, a protective film having a plurality of openings spaced from each other is formed. Here, if necessary, acid activation treatment or the like may be performed.

Next, a conductive member is formed in the opening of the protective film. Examples of the method for forming the conductive member include electrolytic plating, electroless plating, sputtering, vapor deposition, and CVD.
In each forming method, the conductive member can be formed to be thicker than the protective film by adjusting the conditions. Thus, the conductive member may be formed up to the upper surface of the protective film, and the protruding portion may be formed as shown in FIG.

  Thereafter, the protective film is washed and removed, thereby forming a first conductive member and a second conductive member that are separated from each other, as shown in FIG.

(Die bonding process)
Next, the light emitting element is placed on the first conductive member and the second conductive member via an adhesive member. The adhesive member is formed so as to be interposed between the first conductive member and the second conductive member and the light emitting element.

  FIG. 4D shows a state in which an adhesive member is provided on the first conductive member and the second conductive member. Examples of the method for forming the adhesive member include dispensing, pin transfer, and printing.

It is preferable to use an anisotropic conductive material for the adhesive member. An anisotropic conductive material refers to a material obtained by mixing a conductive filler in which a resin ball is covered with a metal layer, a conductive filler in which the outer layer of the metal layer is covered with an insulating film, and the like in an insulating member such as a resin.
As the adhesive member, a paste or solid (sheet, block, powder) can be used, and a paste is particularly preferable. The shape of the adhesive member can be appropriately selected according to the composition of the adhesive member, the shape of the conductive member, the shape of the electrode of the light emitting element, and the like.

  Such an adhesive member is preferably formed continuously on the first conductive member and the second conductive member. When the light emitting element is placed, when an anisotropic conductive material is sandwiched between the positive electrode and the negative electrode of the light emitting element and the first conductive member and the second conductive member and the light emitting element is pressed, The material is pressurized only in the region below the electrode of the light emitting element. Thereby, when the conductive filler dispersed in the anisotropic conductive material is pressed, a conductive region that is conductive by the conductive filler is formed only in this region. In the case of a conductive filler that covers the outer shell with an insulating film, the outermost insulating film is broken by being pressed by the electrode of the light emitting element, and the exposed metal layer is electrically contacted with the electrode and the conductive member. Connection occurs. The region where no pressure is applied forms an insulating region because the surface of the conductive filler is covered with the insulating member. Thereby, the insulation between positive and negative electrodes is maintained. Even when the distance between the electrodes and the conductive member is narrow, the light emitting element can be mounted without causing a short circuit.

  Further, when the light emitting element is placed, a part of the adhesive member enters between the first conductive member and the second conductive member by pressing the light emitting element. By extending the adhesive member between the first conductive member and the second conductive member, it is possible to secure a sufficient bonding area between the first conductive member, the second conductive member, and the adhesive member. When the first conductive member and the second conductive member have protrusions that protrude toward the outer edges adjacent to each other, a part of the adhesive member is first adjusted by adjusting the pressure when the light emitting element is pressure-bonded. The conductive member and the second conductive member can extend below the lower surfaces of the protrusions.

  In the die bonding step, metal bumps such as Au may be formed on the positive electrode and the negative electrode of the light emitting element, and the anisotropic conductive material may be pressed with the metal bumps. Thereby, even when the electrode and the conductive member are thin, the light emitting element can be mounted without causing a short circuit. It is preferable that the surface of the metal bump formed on each electrode of the light-emitting element is configured to be substantially on the same plane because each metal bump can be uniformly pressed against the anisotropic conductive member.

(Sealing member forming step)
Next, a sealing member that covers the light emitting element is formed by a method such as transfer molding, potting, or printing. FIG. 4F illustrates a state where a sealing member is formed on the light emitting element. The sealing member may have a flat upper surface, or may be formed in a curved shape in which the center is recessed or protruded. Further, the sealing member may have a single layer structure or a multilayer structure of two or more layers having different compositions.

(Support substrate removal process)
After the sealing member is cured, the support substrate is peeled off and removed. Thereby, the bottom surfaces of the first conductive member and the second conductive member are exposed. FIG. 4G is a diagram showing a state where the support substrate is peeled off. As a method for removing the support substrate 111, a method of physically peeling, a method of selectively removing the support substrate by etching, or the like can be used.

(Dicing process)
Through the above steps, an assembly of light emitting devices can be obtained. In the assembly of the light emitting devices, the light emitting elements are separated into individual pieces by cutting at a separating portion indicated by a dotted line in FIG. 4G, that is, at a position where the sealing member between the light emitting elements is divided. A light emitting device as shown in FIG. Various methods such as dicing with a blade and dicing with a laser beam can be used as the method of dividing into pieces.

Although FIG. 2 shows a state in which the light emitting elements are individually divided, the light emitting elements may be divided into two or four arrays or aggregates depending on the purpose.
Moreover, in FIG. 1, it cut | disconnects in the position spaced apart from a 1st conductive member and a 2nd conductive member, However, Not only this, It cut | disconnects in the position containing at least one of a 1st conductive member and a 2nd conductive member May be. When cutting at a position away from the conductive member, the portion to be cut is only a resin such as a sealing member or an adhesive member, so cutting is easier than when cutting the conductive member and the resin together. Can do. When cutting at a position including the conductive member, the conductive member is exposed also on the side surface of the light emitting device, and solder or the like is easily joined.

  Hereinafter, each component of the light emitting device of the present embodiment will be described in detail.

(Conductive member)
The conductive member is electrically connected to the light emitting element and functions as a pair of electrodes for energizing electricity supplied from the outside. The conductive member has a first conductive member and a second conductive member that are separated from each other.

The positive electrode of the light emitting element is connected to the upper surface of the first conductive member via an adhesive member. The second conductive member is connected to the upper surface of the negative electrode of the light emitting element via an adhesive member. The upper surfaces of the first conductive member and the second conductive member may be larger than the area that can be connected to the electrode of the light emitting element. The shapes of the upper surfaces of the first conductive member and the second conductive member can be various, for example, a substantially square shape when viewed from above, a polygonal shape, or a shape having a notch in these shapes. In addition, it is preferable that the region where the electrode of the light emitting element is arranged be a flat surface. As for a 1st conductive member and a 2nd conductive member, a lower surface forms the outer surface (for example, lower surface or back surface) of a light-emitting device. That is, the lower surfaces of the first conductive member and the second conductive member are exposed to the outside without being covered with the sealing member.
The lower surfaces of the first conductive member and the second conductive member are preferably substantially flat surfaces as the outer surface of the light emitting device, but may have fine irregularities or the like.

  The film thicknesses of the first conductive member and the second conductive member may be different from each other, but are preferably substantially equal. Specifically, it is preferably about 10 μm to 100 μm, and particularly preferably about 45 μm to 95 μm. By setting it as the thickness of such a range, when forming a conductive member by the plating method, for example, it can be set as the conductive member of a uniform film thickness. In particular, by setting the thickness to about 100 μm or less, the light-emitting device can be further reduced in size and weight because the thickness is extremely thin that cannot be realized with a lead frame that has been used conventionally.

The first conductive member and the second conductive member may be formed of different materials, but are preferably formed of the same material. Thereby, it can manufacture more simply.
For example, metals or alloys such as copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum (for example, eutectic solder such as iron-nickel alloy, phosphor bronze, iron-containing copper, Au-Sn, SnAgCu, SnAgCuIn solder etc.), oxide conductors (eg ITO etc.) and the like. The first and second conductive members may be either a single layer or a stacked layer.

  In particular, the first and second conductive members are preferably plated, and more preferably a laminated structure of plated. Specifically, it is preferable to provide a material capable of reflecting light from the light emitting element and the wavelength conversion member on the uppermost layer of the conductive member (on the side where the light emitting element is placed). Specifically, Au, Ag, Cu, Pt, Pd, Al, W, Mo, Ru, Rh and the like are preferable. Furthermore, it is preferable that the outermost surface has high reflectivity and high gloss. Specifically, the reflectance in the visible region is preferably 70% or more. In that case, Au, Al, Ag, Ru, Rh, Pt, Pd, and the like are preferable, and Ag is particularly preferable. For example, the glossiness of the surface is preferably 0.5 or more, more preferably 1.0 or more. The glossiness shown here is a number obtained by 45 ° irradiation and vertical light reception using a minute surface color difference meter VSR 300A manufactured by Nippon Denshoku Industries Co., Ltd.

  The distance between the first conductive member and the second conductive member is suitably 10 μm to 500 μm. Thereby, a short circuit between conductive members can be prevented. In particular, when the conductive member contains a material that easily causes migration, such as Ag, the distance between the first conductive member and the second conductive member is preferably 200 μm or more.

In the case where the conductive member is a plated layer made of metal, the linear expansion coefficient is defined by the composition thereof, and therefore, the conductive layer is preferably relatively close to the support substrate. For example, SUS430 having a linear expansion coefficient of 10.4 × 10 ⁻⁶ / K is used as the support substrate, and a conductive member is formed thereon with a linear expansion coefficient of 14.2 × 10 ⁻⁶ / K from the lowermost layer side. Some Au (0.04-0.1
μm), Ni having a linear expansion coefficient of 12.8 × 10 ⁻⁶ / K (or Cu having a linear expansion coefficient of 16.8 × 10 ⁻⁶ / K) (40-70 μm), Au (0.01-0. And a laminated structure such as Ag (2 to ⁶ μm) having a linear expansion coefficient of 119.7 × 10 ⁻⁶ / K is preferable. The top layer of Ag has a linear expansion coefficient that is significantly different from that of other layers of metal, but it is because priority is given to the reflectance of light from the light emitting element, and the influence on the warp is extremely weak because of its extremely thin thickness. In practical use, there is no problem.

  Although the outer edges of the first conductive member and the second conductive member may be flat surfaces, it is preferable that the outer edges of the first conductive member and the second conductive member have a protruding portion in consideration of adhesion to the adhesive member and the sealing member. The protrusion is preferably provided at a position separated from the lower surface of the conductive member. Moreover, it is preferable that a part of adhesive member is extended below the lower surface of a protrusion part. Thereby, it can prevent that an adhesive member peels from a conductive member.

  FIG. 3 is an enlarged schematic cross-sectional view of a region surrounded by a dotted line in the light emitting device of FIG. For example, as illustrated in FIG. 3, the protruding portion 101 x protrudes toward the outer edges adjacent to each other between the first conductive member 101 and the second conductive member 102, and the upper surface and the lower surface of the protruding portion 101 x are sandwiched between the adhesive members. It is preferable to arrange as described above. Thereby, even if a conductive member is thin thickness, mechanical strength can be raised more.

  The protrusion can be provided at any position around the first conductive member and the second conductive member. The protrusions may be provided partially, for example, only on the two side surfaces of the conductive member having a square shape in a top view, but are preferably formed over the entire periphery of the first conductive member and the second conductive member. . Thereby, dropping off from the sealing member or the adhesive member can be prevented more reliably.

(Adhesive member)
The adhesive member is a member that adheres the light emitting element to the first conductive member and the second conductive member. The adhesive member is preferably an anisotropic conductive material in which a conductive filler is mixed with an insulating member such as a resin.

  As the insulating member, a resin excellent in heat resistance is preferable. Specifically, as the resin having excellent heat resistance, an epoxy resin composition, a silicone resin composition, a polyimide resin composition, a modified resin thereof, a hybrid resin, or the like can be used. Since light resistance and adhesiveness are favorable, it is preferable.

The structure of the conductive filler may be any of the following (A1) to (A4).
(A1) A resin ball covered with a metal layer (A2) (A1) covered with an insulating film (A3) A metal ball (A4) A metal ball covered with another metal

  Specific examples of the structure of the conductive filler include resin balls / nickel / insulating film, resin balls / nickel / gold / insulating film, nickel / gold, nickel, lead-free solder particles and the like in order from the inside. Examples of the resin ball material include styrene, acrylic, and titanium oxide.

  It is preferable to use a conductive filler having a particle size in the range of 1 μm to 20 μm. Thereby, it becomes possible to prevent the leakage between the conductive fillers, and the conductive fillers can be well distributed in the paste. Further, when the light emitting element is pressure-bonded, it is possible to prevent the light emitting element from being damaged. In particular, it is preferable to use one having a particle size smaller than the thickness of the metal bump or conductive member provided on the electrode of the light emitting element. Thereby, a short circuit between the light emitting element and the conductive member can be prevented.

The adhesive _{member, Al 2 O 3, TiO 2} , white filler such as ZrO ₂ may be added. Thereby, it can shield light by reflecting the light from a light emitting element.

  The adhesive member may be provided so as to cover the side surface of the light emitting element. Thereby, peeling of the light emitting element from the adhesive member can be prevented. Furthermore, by using a light-shielding adhesive member, light from the light emitting element can be prevented from leaking in the lateral direction, and light can be efficiently extracted in the upper surface direction. The adhesive member may cover substantially the entire side surface of the light emitting element, but as shown in FIG. 5, it is preferable that at least the upper surface facing the electrode forming surface of the light emitting element is exposed from the adhesive member.

(Light emitting element)
In the present invention, a semiconductor element having a structure in which a positive electrode and a negative electrode are formed on the same surface side can be used as the light emitting element.

As the semiconductor light emitting element, one having an arbitrary wavelength can be selected. For example, the blue, the green light emitting element, ZnSe and nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), used after using GaP be able to. Furthermore, a semiconductor light emitting element made of a material higher than this can also be used. The composition, emission color, size, number, and the like of the light emitting element to be used can be appropriately selected according to the purpose.
In the case of a light emitting device having a wavelength conversion member, a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferred. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal.

  Further, a light-emitting element that outputs not only light in the visible light region but also ultraviolet rays and infrared rays can be obtained. Furthermore, a light receiving element or the like can be mounted together with or independently of the light emitting element, and a protective element or the like can also be mounted.

  In particular, when an anisotropic conductive material is used as the adhesive member, the face-down structure is effective for increasing the light emission efficiency. In addition, metal bumps may be provided on the electrodes of the light emitting element in order to prevent a short circuit between the electrodes and to prevent unlighting due to a thermal shock or a thermal cycle. The thickness of the metal bump is preferably thicker than the particle size of the conductive filler of the adhesive member.

There is no particular limitation on the shape of the electrode of the light-emitting element, and a substantially rectangular shape, a circular shape, or the like can be used.
The distance between the positive and negative electrodes is preferably larger than the particle size of the conductive filler of the adhesive member. Thereby, the short circuit between electrodes can be prevented.

(Sealing member)
The sealing member covers at least one surface of the first conductive member and the second conductive member together with the light emitting element. The sealing member has a function of protecting electronic components such as a light emitting element, a light receiving element, and a protective element from dust, moisture, external force, and the like.

As a material for the sealing member, a material having translucency capable of transmitting light from the light emitting element and having light resistance and insulation is preferable. Specifically, silicone resin composition, modified silicone resin composition, epoxy resin composition, modified epoxy resin composition, acrylic resin composition, etc., silicone resin, epoxy resin, urea resin, fluororesin, and at least these resins Examples thereof include inorganic substances such as a hybrid resin containing one or more kinds, glass, and silica sol. Moreover, not only these organic substances but also inorganic substances such as glass and silica sol can be used.
The sealing member can contain a colorant, a light diffusing agent, a light reflecting material, various fillers, a wavelength conversion member (for example, a phosphor) and the like as desired.
The shape of the outer surface of the sealing member can be variously selected according to the light distribution characteristics and the like. For example, the directivity can be adjusted by making the upper surface into a convex lens shape, a concave lens shape, a Fresnel lens shape, or the like. In addition to the sealing member, a lens-shaped member may be provided separately. Furthermore, when using a molded body with a phosphor (for example, a plate-shaped molded body with a phosphor, a dome-shaped molded body with a phosphor, etc.), a material excellent in adhesion to the molded body with a phosphor is used as a sealing member. It is preferable to select. In addition to the resin composition, an inorganic substance such as glass can be used as the phosphor-containing molded body.

The sealing member can also contain a phosphor that emits light having a different wavelength by absorbing at least part of the light from the light emitting element as a wavelength conversion member.
As a fluorescent substance, what converts the light from a light emitting element into a shorter wavelength may be sufficient, However, The thing converted into a long wavelength from a viewpoint of light extraction efficiency is preferable. Further, the present invention is not limited to this, and those that further convert light converted by other phosphors can be used. Such a wavelength conversion member is composed of a single layer containing one kind of phosphor, a single layer in which two or more kinds of phosphors are mixed, and two or more layers in which two or more kinds of phosphors are contained in separate layers. The laminate may be any one of two or more layers of a single layer in which two or more kinds of fluorescent materials are mixed.

Examples of the phosphor include nitride phosphors and oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce, and more specifically, (a) Eu-activated α or β Mainly activated by sialon-type phosphors, various alkaline earth metal nitride silicate phosphors, various alkaline earth metal aluminum nitride silicon phosphors, (b) lanthanoid elements such as Eu, and transition metal elements such as Mn Alkaline earth metal halogen apatite phosphor, alkaline earth halosilicate phosphor, alkaline earth metal silicate phosphor, alkaline earth metal borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth Runs of metal silicate, alkaline earth metal sulfide, alkaline earth metal thiogallate, alkaline earth metal silicon nitride, germanate, (c) Ce, etc. Selected from rare earth aluminates, rare earth silicates, alkaline earth metal rare earth silicates that are mainly activated with a Tanoid element, and organic and organic complexes that are mainly activated with a lanthanoid element such as (d) Eu It is preferable that it is at least any one or more. Among these, a YAG phosphor that is a rare earth aluminate phosphor mainly activated by a lanthanoid element such as Ce is preferable. YAG-based phosphors include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y ₃ (Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce , (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ . Also, some or all Tb of Y, Lu, etc. _Tb 3 _Al 5 _O 12 was replaced _{with: Ce, Lu 3 Al 5 O} 12: may be Ce or the like. Furthermore, phosphors other than the above phosphors having the same performance, function, and effect can also be used.

Moreover, what apply | coated fluorescent substance to other molded objects, such as glass and a resin composition, can also be used. Moreover, a fluorescent substance containing molded object can also be used. Specifically, phosphor-containing glass, YAG sintered body, sintered body such as YAG and Al ₂ O ₃ , SiO ₂ , B ₂ O ₃ , crystallized inorganic bulk body in which YAG is precipitated in an inorganic melt Etc. A phosphor that is integrally molded with epoxy, silicone, hybrid resin, or the like may be used.
<Embodiment 2>
FIG. 6 is a schematic cross-sectional view showing a light-emitting device according to Embodiment 2 of the present invention. The description which overlaps with Embodiment 1 may be omitted.

In the light emitting device 200 according to the present embodiment, the light emitting element 104 is connected to the first conductive member 101 and the second conductive member 102 that are separated from each other, and the light emitting element 104 is connected to the first conductive member 101 and the second conductive member 102. And an adhesive member 103. The light emitting element 104 includes a positive electrode 104a and a negative electrode 104b on the same surface side. The adhesive member 103 has an insulating region 103a and a conductive region 103b, and is connected to the upper surfaces and side surfaces of the first conductive member 101 and the second conductive member 102. The positive electrode 104 a and the negative electrode 104 b of the light emitting element 104 are connected on the conductive region 103 b of the adhesive member 103. Specifically, the positive electrode 104 a of the light emitting element 104 is disposed on the first conductive member 101, and the negative electrode 104 b of the light emitting element 104 is disposed on the second conductive member 102. The conductive region 103 b of the adhesive member 103 is provided at least between the first conductive member 101 and the positive electrode 104 a of the light emitting element 104 and between the second conductive member 102 and the negative electrode 104 b of the light emitting element 104. The positive electrode 104 a and the negative electrode 104 b of the light emitting element 104 may be connected to the adhesive member 103 via the metal bump 105.
In addition, the light emitting device 200 of the present embodiment includes a base body 107 that covers at least part of the outer edges of the first conductive member 101 and the second conductive member 102. The base body 107 is a member capable of blocking light from the light emitting element 104, and forms a recess 108 that houses the light emitting element 104. A part of the upper surface of the first conductive member 101 and the second conductive member 102 is exposed at the bottom surface of the recess 108. The base 107 forms part of the upper surface, side surface, and part of the lower surface of the light emitting device 200. The lower surfaces of the first conductive member 101 and the second conductive member 102 are exposed from the lower surface (back surface) of the base body 107 and form part of the lower surface of the light emitting device 200.
A sealing member 106 is provided in the recess 108 so as to cover the light emitting element 104.

(Substrate)
In this embodiment mode, the base body includes a resin capable of blocking light from the light emitting element by adding various fillers having a light blocking property. The base includes a first conductive member excluding a region between the first conductive member and the second conductive member, a bottom surface portion 107a that covers an outer edge of the second conductive member, and a top surface of the first conductive member and the second conductive member. And a side wall 107b provided around the light emitting element. By providing such a light-shielding substrate, light from the light-emitting element can be prevented from being emitted from the lateral direction of the light-emitting device to the outside, and light extraction efficiency in the upper surface direction can be improved. it can. The base body may not have the side wall 107b, that is, may include only the bottom surface portion 107a. Both the bottom surface portion 107a and the side wall 107b of the substrate may have a thickness that can suppress leakage of light from the light emitting element to the outside.

  The substrate may be any member that can block light from the light emitting element, and preferably has a small difference in linear expansion coefficient from the support substrate. Furthermore, it is preferable to use an insulating member. As a preferable material, a resin such as a thermosetting resin or a thermoplastic resin can be used. In particular, when the film thickness of the first conductive member and the second conductive member is as thin as about 25 μm to 200 μm, a thermosetting resin is preferable. As a result, an extremely thin substrate can be obtained. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins, modified silicone resin compositions such as epoxy-modified silicone resins, polyimide resin compositions, modified polyimide resin compositions, etc. Can be mentioned.

  In particular, a thermosetting resin is preferable, and a resin described in JP-A-2006-156704 is preferable. For example, among thermosetting resins, epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, urethane resins and the like are preferable. Specifically, (i) an epoxy resin composed of triglycidyl isocyanurate and hydrogenated bisphenol A diglycidyl ether, and (ii) hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride It is preferable to use a solid epoxy resin composition containing a colorless and transparent mixture obtained by dissolving and mixing an acid anhydride composed of an acid with an epoxy resin so as to have an equivalent amount. Furthermore, with respect to 100 parts by weight of these mixtures, 0.5 parts by weight of DBU (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator, 1 part by weight of ethylene glycol as a co-catalyst, oxidation A solid epoxy resin composition in which 10 parts by weight of a titanium pigment and 50 parts by weight of glass fiber are added and partially cured by heating to form a B stage is preferable.

  Moreover, the thermosetting epoxy resin composition which has the epoxy resin containing a triazine derivative epoxy resin as an essential component as described in international publication number WO2007 / 015426 is preferable. As the triazine derivative epoxy resin, for example, it is preferable to include a 1,3,5-triazine nucleus derivative epoxy resin. In particular, an epoxy resin having an isocyanurate ring is excellent in light resistance and electrical insulation. It is desirable to have a divalent, more preferably a trivalent epoxy group for one isocyanurate ring. Specifically, tris (2,3-epoxypropyl) isocyanurate, tris (α-methylglycidyl) isocyanurate, or the like can be used. The softening point of the triazine derivative epoxy resin is preferably 90 to 125 ° C. These triazine derivative epoxy resins may be used in combination with a hydrogenated epoxy resin or other epoxy resins. Furthermore, in the case of a silicone resin composition, a silicone resin containing a methyl silicone resin is preferable.

  When using a triazine derivative epoxy resin, it is preferable to use an acid anhydride which acts as a curing agent. In particular, light resistance can be improved by using an acid anhydride which is non-aromatic and does not have a carbon-carbon double bond. Specific examples include hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, hydrogenated methylnadic acid anhydride, and the like. In particular, methylhexahydrophthalic anhydride is preferred. Moreover, it is preferable to use an antioxidant. As the antioxidant, for example, phenol-based and sulfur-based antioxidants can be used. Moreover, as a curing catalyst, a well-known thing can be used in the said field | area.

  And the filler for providing light-shielding property in these resin, and various additives can be mixed as needed. In the present invention, these are referred to as a light-shielding resin constituting the substrate.

For example, fine particles such as TiO ₂ , SiO ₂ , Al ₂ O ₃ , MgO, MgCO ₃ , CaCO ₃ , Mg (OH) ₂ , and Ca (OH) ₂ are mixed in these resins. By doing so, the light transmittance can be adjusted. By using such a filler, it is preferable to adjust so as to shield about 60% or more of light from the light emitting element, more preferably about 90%. Here, either the light may be reflected or absorbed by the substrate, but when the light emitting device is used for lighting or the like, it is more preferable that the light is shielded by reflection. Therefore, it is preferable that the reflectance with respect to the light from the light emitting element is 60% or more, and more preferable that reflect 90% or more.

  Various fillers as described above can be used alone or in combination of two or more. For example, it is possible to use a combination of a filler for adjusting the reflectance and a filler for adjusting the linear expansion coefficient as will be described later.

For example, when TiO ₂ is used as a white filler, it is preferably added in an amount of 10 to 30 wt%, more preferably 15 to 25 wt%. TiO ₂ may be either a rutile type or an anatase type. The rutile type is preferable from the viewpoint of light shielding properties and light resistance. Furthermore, when it is desired to improve dispersibility and light resistance, a filler modified by surface treatment can also be used. For the surface treatment of the filler made of TiO _2, hydrated oxides such as alumina, silica and zinc oxide, oxides and the like can be used. In addition to these, as a filler mainly for adjusting the linear expansion coefficient, SiO ₂ is preferably used in a range of 60 to 80 wt%, and more preferably 65 to 75 wt%. As the SiO _2, less amorphous silica coefficient of linear expansion than the crystalline silica is preferable. Further, a filler having a particle size of 100 μm or less, and further a filler of 60 μm or less is preferable. Further, a spherical filler is preferable, and this can improve the filling property when the substrate is molded. Further, in the case of use for a display or the like and when it is desired to improve contrast, the filler preferably has a light absorption rate of 60% or more from the light emitting element, and more preferably 90% or more. In such cases, as the filler, carbon such as acetylene black, activated carbon, graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide, molybdenum oxide, or colored organic pigments are used depending on the purpose. It is preferable to do.

Further, it is preferable to control the linear expansion coefficient of the base so that the difference from the linear expansion coefficient of the support substrate which is removed (peeled) before being separated into pieces is reduced. The difference is preferably 30% or less, more preferably 10% or less. When a SUS plate is used as the support substrate, the difference in coefficient of linear expansion is preferably 20 ppm or less, and more preferably 10 ppm or less. In this case, it is preferable to add 70 wt% or more, preferably 85 wt% or more of the filler. Thereby, since the residual stress between the support substrate and the base can be controlled (relaxed), the warpage of the assembly of the light emitting devices before being separated into pieces can be reduced. By reducing the warpage, it is possible to reduce internal damage and to suppress the positional deviation when dividing into individual pieces and to manufacture with high yield. For example, the linear expansion coefficient of the substrate is preferably adjusted to 5 to 25 × 10 ⁻⁶ / K, more preferably 7 to 15 × 10 ⁻⁶ / K. Thereby, it is possible to easily suppress the warpage that occurs during cooling after the base is molded, and it is possible to manufacture with high yield. In addition, in this specification, a linear expansion coefficient refers to the linear expansion coefficient below the glass transition temperature of the base | substrate which consists of light-shielding resin adjusted with various fillers. It is preferable that the linear expansion coefficient in this temperature region is close to the linear expansion coefficient of the support substrate.

  From another point of view, it is preferable to control the linear expansion coefficient of the base so that the difference between the linear expansion coefficients of the first conductive member and the second conductive member is small. The difference is preferably 40% or less, more preferably 20% or less. Thereby, in the light emitting device after separation, the first conductive member, the second conductive member, and the base are prevented from peeling off, and the light emitting device having excellent reliability can be obtained.

(Method for Manufacturing Light Emitting Device According to Embodiment 2)
In the method for manufacturing the light emitting device according to the present embodiment, the first conductive member is formed after forming the first conductive member and the second conductive member in the conductive member forming step in the method for manufacturing the light emitting device according to the first embodiment. Forming a protective film between the first conductive member and the second conductive member, and forming a base after the conductive member forming step. In the sealing member forming step, the sealing member is formed in the recess surrounded by the base. Is substantially the same as the manufacturing method of the light emitting device according to Embodiment 1.

(Conductive member forming process)
As in the method for manufacturing the light-emitting device according to Embodiment 1, by plating on a support substrate on which a protective film having a plurality of openings spaced apart from each other is formed using a metal, the inside of the openings of the protective film Forming a first conductive member and a second conductive member.

After plating, the portion of the protective film excluding the region located between the first conductive member and the second conductive member is removed. In addition, when the 1st conductive member and the 2nd conductive member have a protrusion part in an extension, a protective film is further formed on the area | region which left this protective film. This protective film is formed to at least the same position as or higher than the top surfaces of the first conductive member and the second conductive member.
(Substrate formation process)
Next, a base made of a light shielding resin capable of reflecting light from the light emitting element is formed.
As a method for forming the substrate, methods such as injection molding, transfer molding, and compression molding can be used. For example, when the substrate is formed by transfer molding, the support substrate on which a plurality of conductive members including the first conductive member and the second conductive member are formed is set so as to be sandwiched between the upper mold and the lower mold. At this time, you may set in a metal mold | die via a release sheet | seat. Resin pellets that are raw materials of the base are inserted in the mold, and the support substrate and the resin pellets are heated. After melting the resin pellets, pressurize and fill the mold. The heating temperature, heating time, pressure, and the like can be appropriately adjusted according to the composition of the resin used. After curing, the molded product can be obtained by removing from the mold.
Thereafter, the protective film formed between the first conductive member and the second conductive member is removed.
(Die bonding process)
A die bonding step is performed after the substrate forming step. The die bonding step can be performed in the same manner as the method for manufacturing the light emitting device according to Embodiment 1.

(Sealing member forming step)
Next, a sealing member that covers the light emitting element is formed. When the sealing member is formed in the recess formed by the base, it is preferable to fill the recess with a translucent resin by using potting. Here, the sealing member is provided so as to have substantially the same height as the side wall of the base body, but is not limited thereto, and may be formed so as to be lower or higher than the side wall of the base body. Further, the sealing member may have a flat upper surface, or may be formed in a curved shape in which the center is recessed or protruded. Thereby, the directivity can be adjusted. Further, the sealing member may have a single layer structure or a multilayer structure including two or more layers.

<Embodiment 3>
FIG. 7 is a schematic cross-sectional view showing a light-emitting device according to Embodiment 4 of the present invention. The description which overlaps with Embodiment 1 may be omitted.

In the light emitting device 300 of the present embodiment, the light emitting element 104 is connected to the first conductive member 101 and the second conductive member 102 that are separated from each other, and the light emitting element 104 is connected to the first conductive member 101 and the second conductive member 102. And an adhesive member 103. The light emitting element 104 includes a positive electrode 104a and a negative electrode 104b on the same surface side. The adhesive member 103 has an insulating region 103a and a conductive region 103b, and is connected to the upper surfaces and side surfaces of the first conductive member 101 and the second conductive member 102. The positive electrode 104 a and the negative electrode 104 b of the light emitting element 104 are connected on the conductive region 103 b of the adhesive member 103. The light emitting device 300 includes a light emitting element 104 and a sealing member 106 that covers at least one surface of the first conductive member 101 and the second conductive member 102.
In the present embodiment, metal bumps 105 are respectively provided on the upper surfaces of the first conductive member 101 and the second conductive member 102, and the light-emitting element 104 of the light-emitting element 104 is formed on the metal bump 105 via the adhesive member 103. The positive electrode 104a and the negative electrode 104b are connected. The metal bump 105 is provided at a position corresponding to the electrode pattern of the light emitting element 104 on the upper surface of the first conductive member 101 and the second conductive member 102. The conductive region 103b of the adhesive member 103 includes metal bumps 105 provided on the upper surfaces of the first conductive member 101 and the second conductive member 102, and the positive electrode 104a and the negative electrode 104b of the light emitting element 104 disposed above the conductive bumps 103b. It is provided between. Thus, by providing a metal bump on the upper surface of the conductive member and providing the adhesive member on the metal bump, the bonding strength between the adhesive member and the conductive member can be increased.

  The light emitting device of the present invention can be used for various display devices, lighting fixtures, displays, backlight light sources for liquid crystal displays, and the like.

100, 200, 300 Light-emitting device 101 First conductive member 102 Second conductive member 101x Protruding portion 103 Adhesive member 103a Insulating region 103b Conductive region 104 Light-emitting element 104a Electrode 105 Metal bump 106 Sealing member 107 Base 107a Base bottom portion 107b Base Side wall 108 Recess 109 Protective film 110 Support substrate

Claims (6)

A light emitting device having a positive electrode and a negative electrode on the same surface side;
A first conductive member and a second conductive member spaced apart from each other;
In a light emitting device comprising: an adhesive member that connects the light emitting element and the conductive member;
The first conductive member and the second conductive member have a protruding portion that protrudes toward an outer edge adjacent to each other,
The adhesive member has an insulating region and a conductive region, is connected to the upper surface and the side surface of the first conductive member and the second conductive member, and is between the first conductive member and the second conductive member. Sandwiched between the upper surface and the lower surface of the protrusion,
The positive electrode and the negative electrode of the light emitting element are connected to the conductive region of the adhesive member,
The bottom surface of the first conductive member and the second conductive member and the filled adhesive member form part of the bottom surface of the light emitting device. A positive electrode of the light emitting element is disposed on the first conductive member, and a negative electrode of the light emitting element is disposed on the second conductive member;
The conductive region of the adhesive member is provided between the first conductive member and the positive electrode of the light emitting element, and between the second conductive member and the negative electrode of the light emitting element. The light emitting device according to claim 1. The adhesive member, the light emitting device according to claim 1 or 2, characterized in that the white filler is contained. The adhesive member is an anisotropic conductive material in which a conductive filler is mixed with an insulating member,
The conductive filler, resin balls coated with metal layers, light-emitting device according to any one of claims 1 to 3, characterized in that covered by the insulating film. A conductive member forming step of forming a first conductive member and a second conductive member spaced apart from each other on the support substrate;
A light emitting element is pressure-bonded onto the first conductive member and the second conductive member via an adhesive member containing an insulating member and a conductive filler, whereby a part of the adhesive member is connected to the first conductive member and the second conductive member. a die bonding process to extend between the second conductive member, only containing,
In the conductive member forming step, a protrusion is formed on the outer edges of the first conductive member and the second conductive member adjacent to each other,
In the die bonding step, a part of the adhesive member is extended under the protruding portion . In the conductive member forming step, the first conductive member and the second conductive member are formed on a support substrate by plating,
6. The method of manufacturing a light emitting device according to claim 5 , wherein the support substrate is removed before the light emitting device is separated.

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