JP5703576B2 - Vibration device - Google Patents

Description

The present invention relates to a vibrating device .

As a vibrating device such as a crystal oscillator, a vibrating device including a tuning fork type vibrating piece including a plurality of vibrating arms is known (for example, see Patent Document 1).
For example, the resonator element described in Patent Literature 1 includes a base portion and two vibrating arms extending from the base portion so as to be parallel to each other.
Such a vibrating piece is normally used in a state of being housed in a package and is fixed to the package with an adhesive.
In addition, the resonator element described in Patent Document 1 includes an impact relaxation portion that reduces an impact when an impact is received in the thickness direction (a direction perpendicular to the direction in which the vibrating arms are arranged). Thereby, when the vibration piece device in a state where the vibration piece is accommodated in the package is subjected to an impact in the thickness direction of the vibration piece, it is possible to prevent the vibrating arm and the package from contacting each other.

  However, in the resonator element described in Patent Document 1, when an impact is received in the direction in which the vibrating arms are arranged, the vibrating arm may come into contact with a portion other than the vibrating arm of the vibrating element or a package. In addition, the resonator element described in Patent Document 1 does not have a configuration that reduces the impact on the vibrating arm when such contact occurs. For this reason, in the vibrating device in which the resonator element described in Patent Document 1 is housed in a package, there is a possibility that damage such as cracking or chipping may occur in the vibrating arm when receiving an impact in the direction in which the vibrating arms are arranged.

JP 2007-49748 A

An object of the present invention is to provide a vibration device that can improve impact resistance.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Application Example 1]
The vibration device of the present invention includes a base,
A plurality of vibrating arms extending in a first direction from the base and arranged along a second direction intersecting the first direction;
A pair of outer arm portions provided on both outer sides in the second direction with respect to the plurality of vibrating arms and extending from the base portion in the first direction;
The provided apart with respect to the vibrating arms at least tip portions of the outer arms, when the vibrating arm is deformed along the second direction, and a blocking portion for preventing the deformation of the vibrating arm ,
A buffer portion provided at least in a portion of the blocking portion facing the vibrating arm, and having shock absorption ;
A vibrating piece having
A package for storing the vibrating piece,
The blocking portion is curved so as to move away from the vibrating arm as it goes to the tip side in a plan view ,
The vibrating piece is characterized in that a region on the base end side of the blocking portion is connected to the package in each of the outer arm portions .

According to the present invention as described above, the blocking portion can prevent a bending deformation of a predetermined amount or more in the second direction of each vibrating arm. Therefore, it is possible to prevent each vibrating arm from breaking when the vibrating piece receives a large impact.
Further, when the blocking portion comes into contact with the vibrating arm, the shock to the vibrating arm is absorbed (relaxed) by the buffering portion, so that damage such as cracking or chipping of the vibrating arm can be prevented.
For this reason, the vibration device according to the present invention has excellent impact resistance.

[Application Example 2]
In the vibration device according to the aspect of the invention, it is preferable that the blocking portion is connected to or integrated with the base portion.
As a result, when the vibrating piece is formed by etching or the like, the blocking portion can be formed simultaneously with the vibrating arm and the base portion. Further, the positional relationship between the blocking portion and the vibrating arm can be defined with high accuracy.

[Application Example 3 ]
In the vibration device according to the aspect of the invention, it is preferable that the distal end portion of each outer arm portion contacts the distal end portion of the vibrating arm due to the deformation.
Thereby, the amount of bending deformation of each vibrating arm in the second direction can be suppressed.

[Application Example 4 ]
In the vibration device of the present invention, it has an inner arm portion that is provided between two adjacent vibrating arms and extends from the base portion in the first direction,
It is preferable that the blocking portion is provided at least at a tip portion of the inner arm portion.
Thereby, when a plurality of vibrating arms are bent and deformed in the second direction, it is possible to prevent two adjacent vibrating arms from contacting each other.

[Application Example 5 ]
In the vibrating device of the present invention, the base and the plurality of vibrating arms are accommodated in a package,
The blocking unit preferably prevents the outermost vibrating arm of the plurality of vibrating arms from deforming in the second direction and contacting the inner wall surface of the package.
As a result, when the resonator element is used in a state of being accommodated in the package, damage such as cracking or chipping of the vibrating arm can be prevented.

[Application Example 6 ]
In the vibration device according to the aspect of the invention, it is preferable that the buffer portion is formed near the surface of the blocking portion.
Thereby, a buffer part can be provided in a desired position comparatively easily.
[Application Example 7 ]
In the vibrating device of the present invention, each of the vibrating arms is provided with an adjustment film that adjusts a resonance frequency of the vibration, and the constituent material of the adjustment film and the constituent material of the buffer portion are the same type. preferable.
Thereby, an adjustment film | membrane and a buffer part can be formed simultaneously. Therefore, the manufacturing process of the resonator element can be simplified, and as a result, the cost of the resonator element can be reduced.

[Application Example 8 ]
In the vibrating device according to the aspect of the invention, it is preferable that the blocking portion is in contact with the adjustment film due to the deformation of the vibrating arm.
Thereby, it is possible to improve the shock absorption when the vibrating arm comes into contact with the blocking portion (buffer portion).

[Application Example 9 ]
In the vibrating device according to the aspect of the invention, it is preferable that the blocking portion is configured to be in surface contact with the vibrating arm by the deformation of the vibrating arm.
As a result, when the vibrating arm and the blocking portion come into contact with each other, it is possible to prevent or alleviate the impact locally applied to the vibrating arm.

[Application Example 10 ]
In the vibrating device according to the aspect of the invention, it is preferable that the blocking portion is configured to come into contact with a plurality of positions in the longitudinal direction of the vibrating arm by the deformation of the vibrating arm.
As a result, when the vibrating arm and the blocking portion come into contact with each other, it is possible to prevent or alleviate the impact locally applied to the vibrating arm.

[Application Example 11 ]
In the vibration device of the present invention, the blocking portion is provided in each of a portion corresponding to the tip portion of the vibrating arm and a portion corresponding to a region between the tip portion and the base portion of the vibrating arm,
It is preferable that the blocking portion on the distal end side of each blocking portion is located on the distal side from the vibrating arm in contact with the blocking portion on the proximal end side.

It is sectional drawing which shows the vibration device which concerns on 1st Embodiment of this invention. FIG. 2 is a top view showing a vibrating piece provided in the vibrating device shown in FIG. 1. (A) is the sectional view on the AA line in FIG. 2, (b) is the sectional view on the BB line in FIG. FIG. 3 is a top view for explaining the operation of the resonator element shown in FIG. 2. It is a top view which shows the vibration piece with which the vibration device which concerns on 2nd Embodiment of this invention was equipped. It is a top view which shows the vibration piece with which the vibration device which concerns on 3rd Embodiment of this invention was equipped. It is a top view which shows the vibration piece with which the vibration device which concerns on 4th Embodiment of this invention was equipped. It is a top view which shows the vibration piece with which the vibration device which concerns on 5th Embodiment of this invention was equipped.

Hereinafter will be described in detail with reference to an embodiment showing a vibration device of the present invention in the accompanying drawings.

1 to 4, for convenience of explanation, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other. In the following, the direction parallel to the X axis (second direction) is the “X axis direction”, the direction parallel to the Y axis (first direction) is the Y axis direction, and the direction parallel to the Z axis (third Is referred to as the Z-axis direction. In the following description, for convenience of explanation, the upper side in FIG. 1 is referred to as “upper”, the lower side as “lower”, the right side as “right”, and the left side as “left”.
A vibrating device 1 illustrated in FIG. 1 includes a vibrating piece 2 and a package 3 that houses the vibrating piece 2.
Hereinafter, each part which comprises the vibration device 1 is demonstrated in detail sequentially.

(Vibration piece)
First, the resonator element 2 will be described.
The vibrating piece 2 is a tuning fork type vibrating piece as shown in FIG. The resonator element 2 includes a vibration substrate 21, excitation electrode groups 22 and 23 and connection electrodes 41 and 42 provided on the vibration substrate 21.

The vibration substrate 21 includes a base portion 27, two (one pair) vibration arms 28 and 29, and a pair of arm portions 25.
The vibration substrate (piezoelectric substrate) 21 is made of a piezoelectric material.
Examples of the piezoelectric material include crystal, lithium tantalate, lithium niobate, lithium borate, and barium titanate. In particular, the piezoelectric material constituting the vibration substrate 21 is preferably quartz. When the vibration substrate 21 is made of quartz, the vibration characteristics of the vibration substrate 21 can be made excellent. Further, the vibration substrate 21 can be formed with high dimensional accuracy by etching.

In such a vibration substrate 21, the base 27 has a plate shape whose thickness direction is the Z-axis direction.
The base portion 27 is connected to two vibrating arms 28 and 29 and two arm portions 24 and 25.
The two vibrating arms 28 and 29 are provided to extend from the base 27 so as to be parallel to each other. More specifically, the two vibrating arms 28 and 29 respectively extend from the base portion 27 in the Y axis direction and are arranged side by side in the X axis direction.

Each of the vibrating arms 28 and 29 has a longitudinal shape, and an end portion (base end portion) on the base portion 27 side is a fixed end, and an end portion (tip end portion) opposite to the base portion 27 is a free end.
The vibrating arms 28 and 29 are formed to have the same width. Thereby, when the vibrating arms 28 and 29 are vibrated in opposite directions (in opposite phases), vibration leakage can be reduced.

  Further, an adjustment film (weight) 281 for adjusting the resonance frequency of the vibration of the vibration arm 28 is provided at the tip of the vibration arm 28. Similarly, an adjustment film (weight) 291 for adjusting the resonance frequency of the vibrating arm 29 is provided at the tip of the vibrating arm 29. By adjusting the masses of the adjustment films 281 and 291 respectively, the resonance frequencies of the vibrating arms 28 and 29 can be adjusted.

Each of the adjustment films 281 and 291 is in the form of a thin film formed on the surface of the tip of the vibrating arms 28 and 29.
In addition, the constituent material of each of the adjustment films 281 and 291 is not particularly limited as long as it can be formed on the tip portions of the vibrating arms 28 and 29. For example, a resin material or a metal material can be used.

Note that, if necessary, a mass portion (hammer head) having a larger cross-sectional area than the base end portion may be provided at each distal end portion of the vibrating arms 28 and 29. In this case, the vibrating piece 2 can be made smaller, and the vibration frequency of the vibrating arms 28 and 29 can be further reduced.
Further, the cross section of each vibrating arm 28, 29 is rectangular. The cross-sectional shape of each vibrating arm 28, 29 is not limited to a quadrangle. For example, by forming grooves along the Y-axis direction on the upper surface and the lower surface of each vibrating arm 28, 29, an H-shape is formed. It may be done.

As shown in FIG. 3, an excitation electrode group 22 is provided on such a vibrating arm 28, and an excitation electrode group 23 is provided on the vibrating arm 29.
The excitation electrode group 22 has a function of bending vibration (excitation) of the vibrating arm 28 by energization. The excitation electrode group 23 has a function of bending vibration (excitation) of the vibrating arm 29 by energization.
Such an excitation electrode group 22 includes the excitation electrode 221 provided on the upper surface of the vibrating arm 28, the excitation electrode 222 provided on the lower surface of the vibrating arm 28, and one side surface of the vibrating arm 28. The excitation electrode 223 provided and the excitation electrode 224 provided on the other side surface of the vibrating arm 28 are configured.

The excitation electrodes 221, 222, 223, and 224 respectively extend from the vicinity of the proximal end of the vibrating arm 28 to the vicinity of the distal end portion. Further, the widths of the excitation electrodes 221, 222, 223, and 224 in the X-axis direction are constant over the entire region in the Y-axis direction.
Similarly, the excitation electrode group 23 includes the excitation electrode 231 provided on the upper surface of the vibration arm 29 described above, the excitation electrode 232 provided on the lower surface of the vibration arm 29, and one side surface of the vibration arm 29. The excitation electrode 233 provided and the excitation electrode 234 provided on the other side surface of the vibrating arm 29 are configured.

The excitation electrodes 231, 232, 233, and 234 extend from the vicinity of the proximal end of the vibrating arm 29 to the vicinity of the distal end portion, respectively. Further, the widths of the excitation electrodes 231, 232, 233, and 234 in the X-axis direction are constant over the entire region in the Y-axis direction.
Such excitation electrodes 221, 222, 233, and 234 are electrically connected to a connection electrode 41 (to be described later) via a wiring (not shown). Further, the excitation electrodes 223, 224, 231 and 232 are electrically connected to a connection electrode 42 described later via a wiring (not shown).

In the resonator element 2 having such a configuration, when a voltage is applied between the connection electrode 41 and the connection electrode 42, the excitation electrodes 221, 222, 233, 234 and the excitation electrodes 223, 224, 231, 232 are reversed in polarity. In this manner, voltages in the direction including the X-axis direction component are applied to the vibrating arms 28 and 29, respectively. The vibrating arms 28 and 29 can be flexibly vibrated at a certain frequency (resonance frequency) due to the inverse piezoelectric effect of the piezoelectric material. At this time, the vibrating arms 28 and 29 are flexibly vibrated in directions opposite to each other.
Further, when the vibrating arms 28 and 29 are bent and vibrated, a voltage is generated between the connection electrodes 41 and 42 at a certain frequency due to the piezoelectric effect of the piezoelectric material. Utilizing these properties, the resonator element 2 can generate an electrical signal that vibrates at a resonance frequency.

Such excitation electrode groups 22 and 23, connection electrodes 41 and 42, and wiring (not shown) are electrically conductive such as aluminum, aluminum alloy, silver, silver alloy, gold, gold alloy, chromium, and chromium alloy, respectively. It can be formed of an excellent metal material.
Examples of methods for forming these electrodes include physical film formation methods such as sputtering and vacuum deposition, chemical vapor deposition methods such as CVD, and various coating methods such as an ink jet method.

A pair of (two) arm portions (outer arm portions) 24, which are parallel to the vibrating arms 28 and 29 on both outer sides in the X-axis direction with respect to the two vibrating arms 28 and 29, 25 is provided.
The two arm portions 24 and 25 are provided to extend from the base portion 27 so as to be parallel to each other. More specifically, the two arm portions 24 and 25 each extend from the base portion 27 in the Y-axis direction and are arranged side by side in the X-axis direction.
In the present embodiment, the arm portions 24 and 25 are set to such a length that the tip portions thereof are opposed to the middle portions of the vibrating arms 28 and 29.
In addition, a buffer portion 241 having shock absorption is provided at the distal end portion of the arm portion 24. Similarly, a buffer portion 251 having shock absorption is provided at the distal end portion of the arm portion 25.

Here, the distal ends of the arm portions 24 and 25 are provided apart from the respective vibrating arms 28 and 29, and when the vibrating arms 28 and 29 are bent and deformed in the X-axis direction, 29, a blocking portion (regulating portion) that contacts at least one of the vibrating arms and blocks (regulates) further bending deformation is configured.
More specifically, for example, as shown in FIG. 4, when the package 3 receives an external force F in the X-axis direction (impact force in the direction from the left side to the right side in FIG. 4), the vibrating arms 28 and 29 Although it is bent and deformed to the left in the axial direction, the vibrating arm 28 comes into contact with the distal end portion (blocking portion) of the arm portion 24 and further bending deformation is blocked.
Such tip portions (hereinafter also simply referred to as “blocking portions”) of the arm portions 24 and 25 can prevent bending deformation of the vibrating arms 28 and 29 by a predetermined amount or more in the X-axis direction. Therefore, it is possible to prevent the vibrating arms 28 and 29 from breaking when the vibrating piece 2 receives a large impact.

As shown in FIG. 4, the portion 2411 on the vibrating arm 28 side of the tip portion (blocking portion) of the arm portion 24 vibrates when the vibrating arm 28 is bent and deformed in the X-axis direction toward the arm portion 24 side. Contact the arm 28. Similarly, the portion 2511 on the vibrating arm 29 side of the tip portion (blocking portion) of the arm portion 25 comes into contact with the vibrating arm 29 when the vibrating arm 29 is bent and deformed in the X-axis direction toward the arm portion 25 side.
Since shock absorbing parts 241 and 251 having shock absorption are provided in portions 2411 and 2511 where the vibrating arms 28 and 29 of the tip portions (blocking portions) of the arm portions 24 and 25 are in contact with each other, When the distal end portion (blocking portion) of 25 comes into contact with the vibrating arm 28 or 29, the shock to the vibrating arms 28 and 29 is absorbed (relaxed) by the buffer portions 241 and 251. Etc. can be prevented.
Thus, the tip portions (blocking portions) of the arm portions 24 and 25 prevent the two vibrating arms 28 and 29 from bending and deforming in the X-axis direction and coming into contact with the inner wall surface of the package 3. Thereby, when the vibrating reed 2 is used in a state of being accommodated in the package 3, damage such as cracking or chipping of the vibrating arms 28 and 29 can be prevented.

In addition, since the distal end portions (blocking portions) of the arm portions 24 and 25 are connected to or integrated with the base portion 27, when the vibrating piece 2 is formed by etching or the like, the vibration arms 28 and 29 and the base portion 27 At the same time, the arm portions 24 and 25 (blocking portions) can be formed. Further, the positional relationship between the arm portions 24 and 25 and the vibrating arms 28 and 29 can be defined with high accuracy.
In addition, since the blocking portions as described above are provided at least at the tip portions of the arm portions 24 and 25, the arm portions 24 and 25 can be provided without changing the separation distance of the blocking portions with respect to the vibrating arms 28 and 29. The bending deformation amount in the X-axis direction of the vibrating arms 28 and 29 when the blocking portion and the vibrating arms 28 and 29 come into contact with each other can be adjusted according to the length. Therefore, damage to the vibrating arms 28 and 29 can be surely prevented, and the degree of freedom in designing the resonator element 2 is increased. For example, the amount of bending deformation decreases as the length of the arm portions 24 and 25 increases, and increases as the length of the arm portions 24 and 25 decreases. Even if the amount of bending deformation is the same, the distance between the arm portion 24 and the vibrating arm 28 and the distance between the arm portion 25 and the vibrating arm 29 can be reduced by shortening the length of the arm portions 24 and 25. The separation distance can be reduced, and the size of the resonator element 2 can be reduced. Further, depending on the width and length of the arm portions 24 and 25, in addition to the shock absorption properties of the buffer portions 241 and 251 and the shock absorption property due to the bending elasticity of the arm portions 24 and 25, the impact on the vibrating arms 28 and 29 is reduced. Can also be absorbed.

  Further, the portions 2411 and 2511 of the tip portions (blocking portions) of the arm portions 24 and 25 have curved convex surfaces that protrude from the vibrating arms 28 and 29 side, respectively. Therefore, the distal end portion (blocking portion) of the arm portion 24 comes into surface contact with the vibrating arm 28 by the bending deformation of the vibrating arm 28 as described above. Similarly, the distal end portion (blocking portion) of the arm portion 25 comes into surface contact with the vibrating arm 29 due to the bending deformation of the vibrating arm 29 as described above. Thereby, when the vibrating arms 28 and 29 come into contact with the tip portions (blocking portions) of the arm portions 24 and 25, it is possible to prevent or alleviate the impact locally applied to the vibrating arms 28 and 29. it can.

The buffer portions 241 and 251 are formed in the vicinity of the surfaces of the tip portions (blocking portions) of the arm portions 24 and 25. Thereby, the buffer parts 241 and 251 can be provided relatively easily at a desired position.
Examples of the method for forming the buffer portions 241 and 251 include physical film formation methods such as sputtering and vacuum vapor deposition, chemical vapor deposition such as CVD, and various coating methods such as an ink jet method.

In addition, the constituent material of each of the buffer portions 241 and 251 is not particularly limited as long as it has shock absorption and can be formed on the surfaces of the arm portions 24 and 25. For example, resin material, metal Materials can be used.
More specifically, such resin materials include polyolefins such as polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), cyclic polyolefin, modified polyolefin, polyvinyl chloride, and polyvinylidene chloride. , Polystyrene, polyamide, polyimide, polyamideimide, polycarbonate, poly- (4-methylpentene-1), ionomer, acrylic resin, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene copolymer Polymer (AS resin), butadiene-styrene copolymer, polyoxymethylene, polyvinyl alcohol (PVA), ethylene-vinyl alcohol copolymer (EVOH), polyethylene terephthalate ( ET), polybutylene terephthalate (PBT), polyester such as polycyclohexane terephthalate (PCT), polyether, polyether ketone (PEK), polyether ether ketone (PEEK), polyether imide, polyacetal (POM), polyphenylene oxide, Modified polyphenylene oxide, polysulfone, polyether sulfone, polyphenylene sulfide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluororesins, styrene, polyolefin, polyvinyl chloride, Various thermoplastics such as polyurethane, polyester, polyamide, polybutadiene, trans polyisoprene, fluororubber, chlorinated polyethylene Elastomers, epoxy resins, phenolic resins, urea resins, melamine resins, unsaturated polyesters, silicone resins, polyurethanes, etc., or copolymers, blends, polymer alloys, etc. mainly composed of these, are included. Alternatively, two or more kinds can be used in combination (for example, as a laminate of two or more layers).
Examples of the metal material include aluminum, an aluminum alloy, silver, a silver alloy, gold, a gold alloy, chromium, a chromium alloy, and the like, and one of these or a combination of two or more thereof (for example, two or more layers) As a laminate).

The constituent materials of the buffer portions 241 and 251 are preferably the same type as the constituent materials of the adjustment films 281 and 291 provided on the vibrating arms 28 and 29 described above. Thereby, the adjustment films 281 and 291 and the buffer portions 241 and 251 can be formed simultaneously. Therefore, the manufacturing process of the resonator element 2 can be simplified, and as a result, the cost of the resonator element 2 can be reduced.
In addition, the thickness (average thickness) of the buffer portions 241 and 251 is not particularly limited as long as it can exhibit the above-described shock absorption, but is preferably, for example, 1 to 1000 μm. . Further, the thickness of the buffer portions 241 and 251 can be made substantially the same as that of the adjustment films 281 and 291 when formed simultaneously with the adjustment films 281 and 291 as described above.

Further, the separation distance between the arm portion 24 and the vibrating arm 28 and the separation distance between the arm portion 25 and the vibrating arm 29 do not disturb the desired excitation of the vibrating arms 28 and 29, respectively. Although it will not specifically limit if it can prevent the damage of 29, For example, it sets substantially equal to the separation distance between the vibrating arms 28 and 29, for example.
A connection electrode 42 is provided on the lower surface of the arm portion 24, while a connection electrode 41 is provided on the lower surface of the arm portion 25. As will be described later, the electrodes are electrically connected to the electrodes 35a and 35b via the conductive adhesives 36a and 36b, and are fixed to the base substrate 31 of the package 3.

(package)
Next, the package 3 that houses and fixes the resonator element 2 will be described.
As illustrated in FIG. 1, the package 3 includes a plate-like base substrate 31, a frame-like frame member 32, and a plate-like lid member 33. The base substrate 31, the frame member 32, and the lid member 33 are laminated in this order from the lower side to the upper side, and the base substrate 31 and the frame member 32, and the frame member 32 and the lid member 33 are respectively adhesives or Joined with brazing material. The package 3 stores the resonator element 2 in an internal space 37 defined by the base substrate 31, the frame member 32, and the lid member 33. In addition to the vibrating piece 2, an electronic component that drives the vibrating piece 2 and the like can be housed in the package 3.

As the constituent material of the base substrate 31, those having insulating properties (non-conductive) are preferable. For example, various glass materials, various ceramic materials such as oxide ceramics, nitride ceramics, carbide ceramics, polyimide, etc. Various resin materials can be used.
In addition, as the constituent material of the frame member 32 and the lid member 33, for example, the same constituent material as that of the base substrate 31, various metal materials such as Al and Cu, various glass materials, and the like can be used. In particular, when a material having light transmissivity such as a glass material is used as a constituent material of the lid member 33, if a metal covering portion (not shown) is formed on the vibrating piece 2 in advance, the vibrating piece 2 is packaged. Even after being housed in 3, by irradiating the metal coating part with a laser through the lid member 33, the metal coating part is removed to reduce the mass of the resonator element 2 (by a mass reduction method). ), The frequency of the resonator element 2 can be adjusted.

  A pair of mount electrodes 35 a and 35 b are formed on the upper surface of the base substrate 31 so as to be exposed to the internal space 37. On the mount electrodes 35a and 35b, epoxy-based and polyimide-based conductive adhesives 36a and 36b containing conductive particles are respectively applied (stacked). The above-described vibrating piece 2 is placed on the agents 36a and 36b. Thereby, the resonator element 2 (base portion 27) is securely fixed to the mount electrodes 35a and 35b (base substrate 31).

This fixing is performed by bonding the vibrating piece 2 to the conductive electrode 36 a so that the conductive adhesive 36 a contacts the connection electrode 41 of the vibrating piece 2 and the conductive adhesive 36 b contacts the connection electrode 42 of the vibrating piece 2. It is carried out by placing on the agents 36a and 36b. Accordingly, the resonator element 2 is fixed to the base substrate 31 via the conductive adhesives 36a and 36b, and the connection electrode 41 and the mount electrode 35a are electrically connected via the conductive adhesive 36a. The connection electrode 42 and the mount electrode 35b are electrically connected through the conductive adhesive 36b.
The conductive adhesives 36a and 36b are located on a line segment that passes through the center of gravity of the resonator element 2 and extends in the X-axis direction when viewed from the Z-axis direction. Thereby, even when the resonator element 2 is fixed to the package 3 at a part in the Y-axis direction, the resonator element 2 can be stably fixed to the package 3.

Further, four external terminals 34 a, 34 b, 34 c, 34 d are provided on the lower surface of the base substrate 31.
Out of these four external terminals 34a to 34d, the external terminals 34a and 34b are electrically connected to the mount electrodes 35a and 35b via conductor posts (not shown) provided in via holes formed in the base substrate 31, respectively. It is a hot terminal connected to. The other two external terminals 34c and 34d are used to increase the bonding strength and equalize the distance between the package 3 and the mounting board when the package 3 is mounted on the mounting board, respectively. This is a dummy terminal.
Such mount electrodes 35a and 35b and external terminals 34a to 34d can be formed, for example, by applying gold plating to an underlying layer of tungsten and nickel plating.

  The mount electrodes 35a and 35b and the connection electrodes 41 and 42 may be electrically connected through a metal wire (bonding wire) formed by, for example, a wire bonding technique. In this case, the resonator element 2 can be fixed to the base substrate 31 through an adhesive having no conductivity instead of the conductive adhesives 36a and 36b. Further, when an electronic component is accommodated in the package 3, the lower surface of the base substrate 31 may be used to check the characteristics of the electronic component and various information in the electronic component (for example, temperature compensation information of the vibration device) as necessary. A write terminal for rewriting (adjustment) may be formed. Further, the fixed position of the resonator element 2 with respect to the package 3 is not limited to the arm portions 24 and 25 described above, and may be, for example, the base portion 27.

According to the first embodiment as described above, the tip portions (blocking portions) of the arm portions 24 and 25 can prevent bending deformation of the vibrating arms 28 and 29 by a predetermined amount or more in the X-axis direction. . Therefore, it is possible to prevent the vibrating arms 28 and 29 from breaking when the vibrating piece 2 receives a large impact.
Further, shock absorbing portions 241 and 251 having shock absorption properties are provided at portions where the vibrating arms 28 or 29 of the tip portions (blocking portions) of the arm portions 24 and 25 are in contact with each other. When the part (blocking part) comes into contact with the vibrating arm 28 or 29, the shock to the vibrating arms 28 and 29 is absorbed (relaxed) by the buffer parts 241 and 251. Can be prevented.
For this reason, the resonator element 2 has excellent impact resistance.
In addition, the vibrating device 1 in which such a vibrating piece 2 is housed in the package 3 also has excellent impact resistance.

Second Embodiment
Next, a second embodiment of the vibration device of the present invention will be described.
FIG. 5 is a top view showing a resonator element included in the resonator device according to the second embodiment of the invention.
Hereinafter, the vibration device according to the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

The vibration device of the second embodiment is substantially the same as that of the first embodiment except that the configurations of the blocking unit and the buffer unit are different. In FIG. 5, the same reference numerals are given to the same configurations as those in the above-described embodiment.
As illustrated in FIG. 5, the vibration device 1 </ b> A according to the present embodiment includes a vibration piece 2 </ b> A housed in a package 3.

In this vibrating piece 2A, a pair of (two) arm portions (outer arm portions) are arranged on both outer sides in the X-axis direction with respect to the two vibrating arms 28 and 29 so as to be parallel to the vibrating arms 28 and 29. 24A and 25A are provided.
The two arm portions 24A and 25A extend from the base portion 27 in the Y-axis direction and are arranged side by side in the X-axis direction.
In the present embodiment, the arm portions 24 </ b> A and 25 </ b> A are set to such a length that the tip portions thereof are opposed to the tip portions of the vibrating arms 28 and 29.
In addition, a buffer portion 241A having shock absorption is provided at the tip of the arm portion 24A. Similarly, a shock-absorbing buffer 251A is provided at the tip of the arm 25A.

Here, the distal ends of the arm portions 24A and 25A are provided apart from the vibrating arms 28 and 29, and when the vibrating arms 28 and 29 are bent and deformed in the X-axis direction, 29, a blocking portion (regulating portion) that contacts at least one of the vibrating arms and blocks (regulates) further bending deformation is configured.
Further, the portion 2411A on the vibrating arm 28 side of the tip portion (blocking portion) of the arm portion 24A comes into contact with the vibrating arm 28 when the vibrating arm 28 is bent and deformed in the X-axis direction toward the arm portion 24A. Similarly, a portion 2511A on the vibrating arm 29 side of the tip portion (blocking portion) of the arm portion 25A comes into contact with the vibrating arm 29 when the vibrating arm 29 is bent and deformed in the X-axis direction toward the arm portion 25A.

  In such a vibrating piece 2A, when receiving an impact, the distal ends of the arm portions 24A and 25A come into contact with the distal ends of the vibrating arms 28 and 29. Therefore, in the X-axis direction of the vibrating arms 28 and 29, The amount of bending deformation can be suppressed. Further, if the bending rigidity of the arm portions 24A and 25A is set high, the bending deformation amount in the X-axis direction of the vibrating arms 28 and 29 when the distal ends of the arm portions 24A and 25A and the vibrating arms 28 and 29 come into contact with each other. Can be defined with high accuracy. On the other hand, if the bending rigidity of the arm portions 24A and 25A is set low, the impact on the vibrating arms 28 and 29 is caused by the shock absorption due to the bending elasticity of the arm portions 24A and 25A in addition to the shock absorbing properties of the buffer portions 241A and 251A. Can also be effectively absorbed. If the bending rigidity of the arm portions 24A and 25A is set low, the arm portions 24A and 25A may be brought into surface contact with the vibrating arms 28 and 29 in a state where the arm portions 24A and 25A are bent and deformed by contact with the vibrating arms 28 and 29 or by external force. it can.

Further, as described above, since the tip portions of the arm portions 24A and 25A are opposed to the tip portions of the vibrating arms 28 and 29, the tip portions (blocking portions) of the arm portions 24A and 25A are the vibrating arms 28 as described above. , 29 come into contact with the adjustment films 281, 291 of the vibrating arms 28, 29 by bending deformation in the X-axis direction. Thereby, it is possible to improve the shock absorption when the vibrating arms 28 and 29 come into contact with the blocking portions (the buffer portions 241A and 251A).
According to the second embodiment as described above, the same effects as those of the first embodiment described above can be obtained.

<Third Embodiment>
Next, a third embodiment of the vibration device of the invention will be described.
FIG. 6 is a top view showing a resonator element included in the resonator device according to the third embodiment of the invention.
Hereinafter, the vibration device according to the third embodiment will be described focusing on differences from the above-described embodiment, and description of similar matters will be omitted.
The vibration device of the third embodiment is substantially the same as that of the first embodiment except that the configurations of the blocking unit and the buffer unit are different. In FIG. 6, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 6, the vibrating device 1 </ b> B of the present embodiment includes a vibrating piece 2 </ b> B housed in the package 3.
In the resonator element 2B, a pair of (two) arm portions (outer arm portions) are provided on both outer sides in the X-axis direction with respect to the two vibrating arms 28 and 29 so as to be parallel to the vibrating arms 28 and 29. 24B and 25B are provided.
The two arm portions 24B and 25B respectively extend from the base portion 27 in the Y-axis direction and are arranged side by side in the X-axis direction.

In the present embodiment, the arm portions 24 </ b> B and 25 </ b> B are set to such a length that the tip portions thereof are opposed to the tip portions of the vibrating arms 28 and 29.
In addition, the arm portions 24B and 25B have a wider distance on the distal end side than on the proximal end side.
In addition, a buffer portion 241B having shock absorption is provided at the tip of the arm portion 24B, and a buffer portion 242B having shock absorption is also provided in the middle of the arm portion 24B. Similarly, a shock absorbing part 251B having shock absorption is provided at the tip of the arm part 25B, and a shock absorbing part 252B having shock absorption is provided in the middle of the arm part 25B.

Here, the distal end portions and intermediate portions of the arm portions 24B and 25B are provided apart from the vibrating arms 28 and 29, and vibrate when the vibrating arms 28 and 29 are bent and deformed in the X-axis direction. A blocking portion (restricting portion) is configured to be in contact with at least one vibrating arm of the arms 28 and 29 to block (restrict) further bending deformation.
Further, the portion 2411B on the vibrating arm 28 side of the tip portion (blocking portion) of the arm portion 24B comes into contact with the vibrating arm 28 when the vibrating arm 28 is bent and deformed in the X-axis direction toward the arm portion 24B. At the same time, the portion 2421B on the vibrating arm 28 side in the middle of the arm 24B (blocking portion) comes into contact with the vibrating arm 28 when the vibrating arm 28 is bent and deformed in the X-axis direction toward the arm 24B.
Similarly, the portion 2511B on the vibrating arm 29 side of the tip portion (blocking portion) of the arm portion 25B comes into contact with the vibrating arm 29 when the vibrating arm 29 is bent and deformed in the X-axis direction toward the arm portion 25B. At the same time, the portion 2521B on the vibrating arm 29 side in the middle (blocking portion) of the arm portion 25B comes into contact with the vibrating arm 29 when the vibrating arm 29 is bent and deformed in the X-axis direction toward the arm portion 25B.

  As described above, the portions 2411B, 2421B, 2511B, and 2521B (blocking portions) of the arm portions 24B and 25B are in contact with a plurality of positions in the longitudinal direction of the vibrating arms 28 and 29 by the bending deformation of the vibrating arms 28 and 29 as described above. Is configured to do. As a result, when the vibrating arms 28 and 29 are in contact with the portions 2411B, 2421B, 2511B, and 2521B (blocking portions) of the arm portions 24B and 25B, it is possible to prevent a shock from being locally applied to the vibrating arms 28 and 29. Or it can be relaxed.

In addition, the portions 2421B and 2521B in the middle of the arm portions 24B and 25B (blocking portions) have curved convex surfaces that are convex on the vibrating arms 28 and 29 sides, respectively. Therefore, a portion 2421B in the middle (blocking portion) of the arm portion 24B comes into surface contact with the vibrating arm 28 by the bending deformation of the vibrating arm 28 as described above. Similarly, a portion 2521B in the middle (blocking portion) of the arm portion 25B comes into surface contact with the vibrating arm 29B by the bending deformation of the vibrating arm 29 as described above. Thereby, when the vibrating arms 28 and 29 are in contact with the portions 2421B and 2521B in the middle of the arm portions 24B and 25B (blocking portions), it is possible to prevent a shock from being locally applied to the vibrating arms 28 and 29, or Can be relaxed.
According to the third embodiment as described above, the same effects as those of the first embodiment described above can be obtained.

<Fourth embodiment>
Next, a fourth embodiment of the vibration device of the invention will be described.
FIG. 7 is a top view showing a resonator element included in a resonator device according to the fourth embodiment of the invention.
Hereinafter, the vibration device according to the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.
The vibration device of the fourth embodiment is substantially the same as that of the first embodiment except that the configurations of the blocking unit and the buffer unit are different. In FIG. 7, the same reference numerals are given to the same components as those in the above-described embodiment.

As shown in FIG. 7, the vibrating device 1 </ b> C of the present embodiment includes a vibrating piece 2 </ b> C housed in the package 3.
In the resonator element 2C, one arm portion (inner arm portion) 26 extending in the Y-axis direction from the base portion 27 is provided between the two vibrating arms 28 and 29 so as to be parallel to the vibrating arms 28 and 29. Is provided. As with the first embodiment described above, a pair of (two) arms are provided on both outer sides in the X-axis direction with respect to the two vibrating arms 28 and 29 so as to be parallel to the vibrating arms 28 and 29. Portions (outer arm portions) 24A and 25A are provided.

In the present embodiment, the arm portion 26 is set to such a length that the tip portion thereof faces the tip portions of the vibrating arms 28 and 29.
In addition, a buffer portion 261 having shock absorption is provided at the distal end portion of the arm portion 26.
Here, the distal end portion of the arm portion 26 is provided to be separated from the vibrating arms 28 and 29, and when the vibrating arms 28 and 29 are bent and deformed in the X-axis direction, the vibrating arms 28 and 29 have a distal end portion. A blocking part (regulating part) that contacts (controls) further bending deformation is formed by contacting at least one of the vibrating arms.

Further, the portion 2611 on the vibrating arm 28 side of the tip portion (blocking portion) of the arm portion 26 comes into contact with the vibrating arm 28 when the vibrating arm 28 is bent and deformed in the X-axis direction toward the arm portion 26 side. Similarly, the portion 2612 on the vibrating arm 29 side of the tip portion (blocking portion) of the arm portion 26 comes into contact with the vibrating arm 29 when the vibrating arm 29 is bent and deformed in the X-axis direction toward the arm portion 26 side.
By providing the arm portion 26 having such a buffer portion 261 between the vibrating arms 28 and 29, when the vibrating arms 28 and 29 are bent and deformed in the X-axis direction, the two adjacent vibrating arms 28 and 29 can be prevented from contacting each other.
According to the fourth embodiment as described above, the same effects as those of the first embodiment described above can be obtained.

<Fifth Embodiment>
Next, a fifth embodiment of the vibration device of the invention will be described.
FIG. 8 is a top view showing a resonator element included in the resonator device according to the fifth embodiment of the invention.
Hereinafter, the vibration device according to the fifth embodiment will be described focusing on the differences from the above-described embodiment, and description of similar matters will be omitted.
The vibration device of the fifth embodiment is substantially the same as that of the first embodiment except that the configurations of the blocking unit and the buffer unit are different. In FIG. 5, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 8, the vibration device according to the present embodiment includes a vibration piece 2 </ b> D housed in the package 3.
The vibrating piece 2D includes a frame portion 30 that is formed integrally with the base portion 27 and surrounds the two vibrating arms 28 and 29 when viewed from the Z-axis direction.
When viewed from the Z-axis direction, the frame portion 30 has a quadrangular annular shape including a pair of sides parallel to the Y-axis direction and a pair of sides parallel to the X-axis direction.

Protrusions 301 and 302 projecting inward are provided on a pair of sides parallel to the Y-axis direction of the frame 30.
The protrusions 301 and 302 are opposed to intermediate portions of the vibrating arms 28 and 29. The protruding portion 301 is provided with a shock absorbing portion 303 having shock absorption. Similarly, the protruding portion 302 is provided with a shock absorbing portion 304 having shock absorption.
In addition, shock absorbing portions 305 and 306 having shock absorption are provided in portions 3051 and 3061 facing the tip portions of the vibrating arms 28 and 29 of the frame portion 30.

Here, the projecting portions 301 and 302 and the portions of the frame portion 30 facing the tip portions of the vibrating arms 28 and 29 are provided apart from the vibrating arms 28 and 29, and the vibrating arms 28 and 29 are X When it is bent and deformed in the axial direction, it constitutes a blocking portion (restricting portion) that contacts at least one vibrating arm of the vibrating arms 28 and 29 to prevent (restrict) further bending deformation.
Further, the portion 3031 on the vibrating arm 28 side of the protruding portion 301 (blocking portion) comes into contact with the vibrating arm 28 when the vibrating arm 28 is bent and deformed in the X-axis direction toward the protruding portion 301 side. At the same time, the portion 3051 of the frame 30 facing the vibrating arm 28 comes into contact with the vibrating arm 28 when the vibrating arm 28 is bent and deformed in the X-axis direction toward the portion 3051.
Similarly, the portion 3041 on the vibrating arm 29 side of the protruding portion 302 (blocking portion) comes into contact with the vibrating arm 29 when the vibrating arm 29 is bent and deformed in the X-axis direction toward the protruding portion 302 side. At the same time, the portion 3061 facing the vibrating arm 29 of the frame 30 comes into contact with the vibrating arm 29 when the vibrating arm 29 is bent and deformed in the X-axis direction toward the portion 3061 side.

In such a vibrating piece 2D, since the blocking portion as described above is provided on the inner peripheral surface of the frame portion 30, for example, a part of the frame member 32 of the package 3 of the first embodiment described above. Alternatively, by using the entire frame portion 30, the size of the vibrating device in plan view can be made the same as the size of the vibrating piece 2D in plan view. Thereby, a so-called chip size package can be realized.
According to the fifth embodiment as described above, the same effects as those of the first embodiment described above can be obtained.

The vibration device of each embodiment as described above can be applied to various electronic devices, and the obtained electronic device has high reliability.
The electronic apparatus provided with the vibration device of the present invention is not particularly limited. For example, a personal computer (mobile personal computer), a mobile phone, a digital still camera, an ink jet type ejection device (for example, an ink jet printer), and a laptop personal computer. , TV, video camera, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, video phone, security TV monitor, electronic binoculars POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring equipment, instruments (eg, vehicle, aircraft, ship) Instrumentation), hula Simulator, and the like.

Above, replacing the vibration device of the present invention has been described with reference to the illustrated embodiments, the present invention is not limited thereto, each part of the structure, with an arbitrary configuration having the same function can do. In addition, any other component may be added to the present invention. Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

For example, in the above-described embodiment, the case where the resonator element has two vibrating arms has been described as an example. However, the blocking unit is configured such that the outermost vibrating arm among the plurality of vibrating arms is bent and deformed in the X-axis direction. However, the number of vibrating arms may be three or more as long as the contact with the inner wall surface of the package can be prevented.
In the embodiment described above, the case where the blocking portion is formed integrally with the base has been described as an example. However, the blocking portion may be configured separately from the base 27. In addition, for example, the blocking unit may be configured by a protrusion protruding in the Z-axis direction on the base substrate of the package.

Further, in the above-described embodiment, each vibration arm is made of a piezoelectric material, and the configuration in which each vibration arm is excited by energizing the excitation electrode provided on each vibration arm has been described as an example. For example, a configuration may be adopted in which a piezoelectric element in which an electrode layer, a piezoelectric layer, and an electrode layer are stacked in this order is provided on each vibrating arm, and the vibrating arm is vibrated by expansion and contraction of the piezoelectric element. .
The vibration direction of the vibrating arm is not limited to that of the above-described embodiment, and the present invention can be applied to a vibrating piece having a vibrating arm having an arbitrary vibration direction.
The vibration device of the present invention includes a piezoelectric oscillator such as a crystal oscillator (SPXO), a voltage controlled crystal oscillator (VCXO), a temperature compensated crystal oscillator (TCXO), a crystal oscillator with a thermostatic bath (OCXO), a gyro sensor, an elasticity It is applied to surface wave (SAW) filters.

  DESCRIPTION OF SYMBOLS 1 ... Vibration device 1A ... Vibration device 1B ... Vibration device 1C ... Vibration device 2 ... Vibration piece 2A ... Vibration piece 2B ... Vibration piece 2C ... Vibration piece 2D ... Vibration piece 3 ... Package 21 ………… Vibration substrate 22 …… Excitation electrode group 23 …… Excitation electrode group 24 …… Arms 24A …… Arms 24B …… Arms 25 ··· Arms 25A ··· Arms 25B ··· Arms 26 ··· Arms Part 27 ... Base 28 ... Vibration arm 29 ... Vibration arm 29B ... Vibration arm 30 ... Frame part 31 ... Base substrate 32 ... Frame member 33 ... Lid member 34a ... External terminal 34b ... External terminal 34c ... External terminal 34d ... External terminal 35a ... Mount electrode 35b ... Mount electrode 36a ... Conductive adhesive 36b ... Conductive adhesive 37 ... Internal space 41 ... Connection electrode 42 Connection electrode 221 Excitation electrode 222 Excitation electrode 223 Excitation electrode 224 Excitation electrode 231 Excitation electrode 232 Excitation electrode 233 Excitation electrode 234 Excitation electrode 241 Buffer 241A Buffer part 241B Buffer part 242B Buffer part 251 Buffer part 251A Buffer part 251B Buffer part 251B Buffer part 252B Buffer part 261 Buffer part 281 Adjustment film 291 Adjustment film 301 ............ Projection part 302 ...... Projection part 303 ... Buffer part 304 ... Buffer part 305 ... Buffer part 306 ... Buffer part 2411 ... Part 2411A ... Part 2411B ... Part 2421B ... Part 2511A ... Part 2511A ... part 2511B ... part 2521B ... part 2611 ... part 2612 ... part 303 ‥‥ part 3041 ‥‥ part 3051 ‥‥ part 3061 ‥‥ part F ‥‥ external force

Claims (11)

The base,
A plurality of vibrating arms extending in a first direction from the base and arranged along a second direction intersecting the first direction;
A pair of outer arm portions provided on both outer sides in the second direction with respect to the plurality of vibrating arms and extending from the base portion in the first direction;
The provided apart with respect to the vibrating arms at least tip portions of the outer arms, when the vibrating arm is deformed along the second direction, and a blocking portion for preventing the deformation of the vibrating arm ,
A buffer portion provided at least in a portion of the blocking portion facing the vibrating arm, and having shock absorption ;
A vibrating piece having
A package for storing the vibrating piece,
The blocking portion is curved so as to move away from the vibrating arm as it goes to the tip side in a plan view ,
The vibrating device is characterized in that a region closer to the base end side than the blocking portion is connected to the package in each of the outer arm portions . The vibrating device according to claim 1, wherein the blocking portion is connected to or integrated with the base portion. 3. The vibrating device according to claim 1 , wherein the distal end portion of each outer arm portion contacts the distal end portion of the vibrating arm by the deformation. An inner arm portion provided between the two adjacent vibrating arms and extending in the first direction from the base portion;
The vibration device according to claim 1 , wherein the blocking portion is provided at least at a tip portion of the inner arm portion. The base and the plurality of vibrating arms are accommodated in a package,
The blocking unit according to any one outermost of the vibrating arm is deformed in the second direction of claims 1 to 4 to prevent the contact with the inner wall surface of the package of the plurality of vibrating arms Vibration device . The vibrating device according to claim 1 , wherein the buffer portion is formed near the surface of the blocking portion. The vibrating device according to claim 6 , wherein each vibrating arm is provided with an adjustment film for adjusting a resonance frequency of the vibration, and a constituent material of the adjustment film and a constituent material of the buffer portion are the same. The vibrating device according to claim 7 , wherein the blocking unit is in contact with the adjustment film by the deformation of the vibrating arm. The vibrating device according to claim 1 , wherein the blocking unit is configured to come into surface contact with the vibrating arm by the deformation of the vibrating arm. The vibrating device according to claim 1 , wherein the blocking unit is configured to come into contact with a plurality of positions in a longitudinal direction of the vibrating arm by the deformation of the vibrating arm. The blocking portion is provided in a portion corresponding to the tip portion of the vibrating arm and a portion corresponding to a region between the tip portion of the vibrating arm and the base portion, respectively.
Wherein the blocking portion of the distal end side of the blocking portion, than the blocking portion of the base end side, in any one of the vibration claims 1 positioned distally from the arm 10 in contact The described vibration device .

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