JP5697759B2 - ハンドヘルドモバイルコンピューティングデバイス用電気流体力学冷却 - Google Patents
ハンドヘルドモバイルコンピューティングデバイス用電気流体力学冷却 Download PDFInfo
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- JP5697759B2 JP5697759B2 JP2013544879A JP2013544879A JP5697759B2 JP 5697759 B2 JP5697759 B2 JP 5697759B2 JP 2013544879 A JP2013544879 A JP 2013544879A JP 2013544879 A JP2013544879 A JP 2013544879A JP 5697759 B2 JP5697759 B2 JP 5697759B2
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- 238000001816 cooling Methods 0.000 title description 18
- 239000002245 particle Substances 0.000 claims description 19
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- 230000007935 neutral effect Effects 0.000 description 5
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- 238000012546 transfer Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 1
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- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 239000004744 fabric Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C2201/00—Details of magnetic or electrostatic separation
- B03C2201/14—Details of magnetic or electrostatic separation the gas being moved electro-kinetically
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (10)
- タッチスクリーンインタフェースを含むハンドヘルドモバイルコンピューティングデバイス;及び
前記ハンドヘルドモバイルコンピューティングデバイスに含まれた電気流体力学送風機(EAM)であって、
第1の電極と、
第2の電極と、
入口と、
出口と、を含み、前記EAMの前記入口及び前記出口の少なくとも一方は、前記タッチスクリーンインタフェースの対向する端部に配置されるとともに、前記ハンドヘルドモバイルコンピューティングデバイスの少なくとも1つの表面側に含まれる、
EAM;を有し、
前記EAMは、前記第1の電極及び前記第2の電極に印加された電界に応じて、前記第1の電極を囲む荷電空気分子又は荷電粒子の少なくとも一方を前記第2の電極に向けて加速することによって、前記タッチスクリーンインタフェースの表面を冷却するように前記タッチスクリーンインタフェースの表面を横切る空気流を作り出し、前記空気流は、前記EAMの前記入口に引き込まれる空気及び前記EAMの出口から放出される空気から作り出される、
装置。 - 前記EAMの前記入口及び前記出口はそれぞれ、前記ハンドヘルドモバイルコンピューティングデバイスの反対の表面側に含まれる、
請求項1に記載の装置。 - 前記EAMの前記入口及び前記出口はそれぞれ、前記ハンドヘルドモバイルコンピューティングデバイスの隣接する表面側に含まれる、
請求項1に記載の装置。 - 前記ハンドヘルドモバイルコンピューティングデバイスに含まれた熱交換器をさらに有し、前記EAMの出口は前記熱交換器に結合される、
請求項1に記載の装置。 - 前記EAMの前記第1の電極は、前記第1の電極を囲む空気分子及び粒子の少なくとも一方をイオン化させるコロナ放電電極を有する、
請求項1に記載の装置。 - タッチスクリーンインタフェースを含むハンドヘルドモバイルコンピューティングデバイスに含まれる電気流体力学送風機(EAM)の第1の電極と第2の電極との間に電界を印加するステップであって、前記電界の印加は前記第1の電極を囲む荷電空気分子及び荷電粒子の少なくとも一方を前記第2の電極に向かって、前記タッチスクリーンインタフェースの表面を冷却するように前記タッチスクリーンインタフェースの表面を横切る空気流を作り出すように引き込み、前記空気流は前記EAMの入口に引き込まれる空気及び前記EAMの出口から放出される空気から作り出される、ステップを有し;
前記EAMの前記入口及び前記出口の少なくとも一方は、前記タッチスクリーンインタフェースの対向する端部に配置されるとともに、前記ハンドヘルドモバイルコンピューティングデバイスの少なくとも1つの表面側に含まれる、
方法。 - 前記EAMの前記入口及び前記出口はそれぞれ、前記ハンドヘルドモバイルコンピューティングデバイスの反対の表面側に含まれる、
請求項6に記載の方法。 - 前記EAMの前記入口及び前記出口はそれぞれ、前記ハンドヘルドモバイルコンピューティングデバイスの隣接する表面側に含まれる、
請求項6に記載の方法。 - 前記EAMの出口は、前記ハンドヘルドモバイルコンピューティングデバイスに含まれた熱交換器に結合される、
請求項6に記載の方法。 - 前記EAMの前記第1の電極は、前記第1の電極を囲む空気分子及び粒子の少なくとも一方をイオン化させるコロナ電極を有する、
請求項6に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/978,392 | 2010-12-23 | ||
US12/978,392 US20120162903A1 (en) | 2010-12-23 | 2010-12-23 | Electro-hydrodynamic cooling for handheld mobile computing device |
PCT/US2011/066095 WO2012088074A2 (en) | 2010-12-23 | 2011-12-20 | Electro-hydrodynamic cooling for handheld mobile computing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014502752A JP2014502752A (ja) | 2014-02-03 |
JP5697759B2 true JP5697759B2 (ja) | 2015-04-08 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2013544879A Active JP5697759B2 (ja) | 2010-12-23 | 2011-12-20 | ハンドヘルドモバイルコンピューティングデバイス用電気流体力学冷却 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20120162903A1 (ja) |
EP (1) | EP2656166A4 (ja) |
JP (1) | JP5697759B2 (ja) |
KR (1) | KR101512582B1 (ja) |
CN (1) | CN102859466B (ja) |
TW (1) | TWI474156B (ja) |
WO (1) | WO2012088074A2 (ja) |
Families Citing this family (10)
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US8712598B2 (en) * | 2011-01-14 | 2014-04-29 | Microsoft Corporation | Adaptive flow for thermal cooling of devices |
US8817472B2 (en) * | 2011-06-13 | 2014-08-26 | Broadcom Corporation | Methods and systems for on-chip osmotic airflow cooling |
US20130063368A1 (en) * | 2011-09-14 | 2013-03-14 | Microsoft Corporation | Touch-screen surface temperature control |
EP2759782A1 (en) * | 2013-01-25 | 2014-07-30 | ABB Research Ltd. | Cooling apparatus using electro-hydrodynamic air moving means |
CN103987230B (zh) * | 2013-02-07 | 2017-08-11 | 建准电机工业股份有限公司 | 具有导风功能的手持式电子装置 |
TWI563905B (en) * | 2013-02-18 | 2016-12-21 | Sunonwealth Electr Mach Ind Co | Hand-held electronic device |
CN104955316B (zh) * | 2015-06-11 | 2018-11-09 | 联想(北京)有限公司 | 电子设备及散热方法 |
US20180317339A1 (en) * | 2017-05-01 | 2018-11-01 | Essential Products, Inc. | Passive heat transport subsystems in handheld electronic devices |
SE543734C2 (en) * | 2019-03-11 | 2021-07-06 | Apr Tech Ab | Cooling of electronic components with an electrohydrodynamic flow unit |
US20220210945A1 (en) * | 2019-04-29 | 2022-06-30 | Ventiva, Inc. | Ionic wind generator |
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JP3963786B2 (ja) * | 2002-06-11 | 2007-08-22 | 富士通株式会社 | 情報処理装置 |
KR100582893B1 (ko) * | 2004-09-10 | 2006-05-25 | 삼성전자주식회사 | Ehd기술을 이용한 유체 회전장치 |
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JP4675666B2 (ja) * | 2005-04-15 | 2011-04-27 | 株式会社東芝 | 電子機器 |
KR20060120904A (ko) * | 2005-05-23 | 2006-11-28 | 삼성에스디아이 주식회사 | 전자소자의 방열 구조 및 이를 구비하는 플라즈마디스플레이 장치 |
JP4738121B2 (ja) * | 2005-09-30 | 2011-08-03 | 三洋電機株式会社 | 電子機器の冷却装置および電子機器 |
US7545640B2 (en) | 2007-02-16 | 2009-06-09 | Intel Corporation | Various methods, apparatuses, and systems that use ionic wind to affect heat transfer |
JP4921249B2 (ja) * | 2007-05-29 | 2012-04-25 | シャープ株式会社 | 送風装置 |
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-
2010
- 2010-12-23 US US12/978,392 patent/US20120162903A1/en not_active Abandoned
-
2011
- 2011-12-20 CN CN201180004146.8A patent/CN102859466B/zh not_active Expired - Fee Related
- 2011-12-20 JP JP2013544879A patent/JP5697759B2/ja active Active
- 2011-12-20 KR KR1020137016037A patent/KR101512582B1/ko active IP Right Grant
- 2011-12-20 WO PCT/US2011/066095 patent/WO2012088074A2/en active Application Filing
- 2011-12-20 EP EP11850256.6A patent/EP2656166A4/en not_active Withdrawn
- 2011-12-22 TW TW100147960A patent/TWI474156B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2012088074A2 (en) | 2012-06-28 |
EP2656166A2 (en) | 2013-10-30 |
JP2014502752A (ja) | 2014-02-03 |
TW201241606A (en) | 2012-10-16 |
CN102859466A (zh) | 2013-01-02 |
KR20130114680A (ko) | 2013-10-17 |
EP2656166A4 (en) | 2016-04-27 |
WO2012088074A3 (en) | 2012-09-13 |
US20120162903A1 (en) | 2012-06-28 |
CN102859466B (zh) | 2016-04-27 |
TWI474156B (zh) | 2015-02-21 |
KR101512582B1 (ko) | 2015-04-15 |
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