JP5686608B2 - 陽極酸化皮膜の封孔処理方法 - Google Patents
陽極酸化皮膜の封孔処理方法 Download PDFInfo
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- JP5686608B2 JP5686608B2 JP2011001374A JP2011001374A JP5686608B2 JP 5686608 B2 JP5686608 B2 JP 5686608B2 JP 2011001374 A JP2011001374 A JP 2011001374A JP 2011001374 A JP2011001374 A JP 2011001374A JP 5686608 B2 JP5686608 B2 JP 5686608B2
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- oxide film
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- 238000007789 sealing Methods 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 12
- 238000011282 treatment Methods 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 10
- 239000010407 anodic oxide Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 7
- 229910021645 metal ion Inorganic materials 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- DBJLJFTWODWSOF-UHFFFAOYSA-L nickel(ii) fluoride Chemical compound F[Ni]F DBJLJFTWODWSOF-UHFFFAOYSA-L 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000001878 scanning electron micrograph Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000002087 whitening effect Effects 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000036571 hydration Effects 0.000 description 2
- 238000006703 hydration reaction Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229940078494 nickel acetate Drugs 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
- C25D11/246—Chemical after-treatment for sealing layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/26—Anodisation of refractory metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/30—Anodisation of magnesium or alloys based thereon
Description
この種の陽極酸化皮膜は、金属表面に形成した数十nm〜数百nmの極く薄いバリア層と、その上に形成した孔径100Å〜600Åレベルの無数の孔を有する蜂の巣状の多孔質層からなり、多孔質層の厚みは電解時間によって定まる。
金属がアルミニウム及びその合金である場合であって防錆を主な目的とする場合に、厚みを3μm〜30μmレベルに設定する場合が多く、電解液も硫酸水溶液を用いた硫酸アルマイトが主流となっている。
なお、用途に応じてシュウ酸や各種有機酸が電解液として用いられている。
封孔処理の方法としては、酢酸ニッケル水溶液に浸漬処理するNi塩封孔、加圧水蒸気による水和処理及びこれらを組み合せた二段封孔処理等が一般に行われている。
しかし、これらの封孔処理は未だ耐食性が不充分であり、本出願人は先に多孔質性陽極酸化皮膜を封孔処理液に浸漬した状態で液加圧処理したり、さらに減圧処理や電解中和処理と組み合せた封孔処理方法を提案している(特許文献1)。
この特許文献1に開示する封孔処理方法は、耐食性の向上、特に耐アルカリ性の向上に非常に有効であるがアルミニウム製品の用途によっては、雨水等の水により表面が白化し装飾性が低下することが問題となる場合がある。
同公報に、水和処理剤に酢酸アンモニウム等の弱酸性水溶液に浸漬することで白化防止効果があることが記載されているが、本発明はさらなる改善を図ったものである。
ここで封孔金属とは、陽極酸化皮膜の孔中に析出させる金属をいい、Ni,Co,Cuのいずれかのイオンが含まれる水溶液に陽極酸化皮膜を浸漬することで封孔金属が析出する。
例えば、Ni塩封孔剤を用いて封孔処理した硫酸陽極酸化皮膜の断面を走査型電子顕微鏡(SEM)を用いてEDS分析(Energy Dispersed Spectroscopy)すると、陽極酸化皮膜の最上部に高濃度のNiを含有する薄い層が観察できるとともに、この高濃度層のNi含有量が分析される。
詳細は後述するが、この高濃度層の表面からの深さが0.15μm以上で且つ、この高濃度層における封孔金属の含有量が1.5mmol/g以上であると耐水性に優れていた。
本発明は、先に提案した特許文献1の技術と組み合せることで耐食性及び耐水性に優れた陽極酸化皮膜となり、その場合に前記封孔処理液に浸漬した状態で、減圧又は加圧処理するとよい。
なお、アンモニウム水を用いてpH5.5〜5.8の範囲に調整した。
その陽極酸化皮膜の断面SEM像を図2(a)に示す。
皮膜表面側にNiの高濃度層が認められ、その厚み(深さ)は0.36μmでNiの含有量はEDS分析にて含有質量割合を分析し、原子量Ni=58.7の値を用いて算出すると封孔金属Niの含有量は2.7mmol/gであった。
図1の表では純水に40℃×240時間浸漬した後に表面に白化が認められなかったものを耐水性試験で評価「○」と表示し、白化したものを評価「×」と表示した。
その結果、サンプルNo.1は耐水性に優れていた。
その断面SEM像を図2(b)に示す。
この結果から封孔金属イオン濃度30〜60mmol/l、フッ素イオン濃度70〜120mmol/lの範囲では、いずれも耐水性に優れていた。
なお、好ましくは封孔金属イオン濃度34〜55mmol/l、フッ素イオン濃度70〜110mmol/lの範囲である。
このSEM像を図2(c)に示す。
なお、参考に比較例5(サンプルNo.15)は酢酸ニッケルによる90℃×20分の高温封孔処理をした。
その結果、SEM像を図2(d)に示すようにNi高濃度層の厚みが0.14μmでNi含有量は0.4mmol/gであった。
さらに参考のために図1の表には表示を省略したが、実施例1と同じ封孔液条件で低温封孔処理のみ実施し、水蒸気封孔処理をしなかったところ、Ni高濃度の厚みが0.14μmであり、耐水性が実施例1よりもやや劣っていた。
従って、低温封孔処理後に水蒸気封孔処理をする二段封孔処理が好ましいことも明らかになった。
Claims (2)
- 金属表面に多孔性陽極酸化皮膜を形成後に、フッ化ニッケルと酸性フッ化アンモニウムを用いて調整した、Niイオンからなる封孔金属イオン濃度30〜60mmol/l、フッ素イオン濃度70〜120mmol/lの封孔処理液に浸漬することで、封孔金属の含有量が1.5mmol/g以上である高濃度層の厚みが表面から0.15μm以上深く存在する陽極酸化皮膜を形成し、その後に140℃以上で水蒸気封孔処理することを特徴とする陽極酸化皮膜の封孔処理方法。
- 前記封孔処理液に浸漬した状態で、減圧又は加圧処理することを特徴とする請求項1記載の陽極酸化皮膜の封孔処理方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011001374A JP5686608B2 (ja) | 2011-01-06 | 2011-01-06 | 陽極酸化皮膜の封孔処理方法 |
US13/671,047 US20130140184A1 (en) | 2011-01-06 | 2012-11-07 | Anodized member and method for sealing anodic oxide coating |
US15/354,309 US20170067177A1 (en) | 2011-01-06 | 2016-11-17 | Anodized member and method for sealing anodic oxide coating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011001374A JP5686608B2 (ja) | 2011-01-06 | 2011-01-06 | 陽極酸化皮膜の封孔処理方法 |
Publications (2)
Publication Number | Publication Date |
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JP2012144750A JP2012144750A (ja) | 2012-08-02 |
JP5686608B2 true JP5686608B2 (ja) | 2015-03-18 |
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JP2011001374A Active JP5686608B2 (ja) | 2011-01-06 | 2011-01-06 | 陽極酸化皮膜の封孔処理方法 |
Country Status (2)
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US (2) | US20130140184A1 (ja) |
JP (1) | JP5686608B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015111239A1 (ja) * | 2014-01-27 | 2015-07-30 | アイシン軽金属株式会社 | 陽極酸化処理部材及びその封孔処理方法 |
JP6667191B2 (ja) * | 2016-03-30 | 2020-03-18 | アイシン軽金属株式会社 | アルミニウムの表面処理方法 |
JP7352322B1 (ja) | 2023-02-28 | 2023-09-28 | ミクロエース株式会社 | アルミニウムまたはアルミニウム合金の表面処理方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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DE3500079A1 (de) * | 1985-01-03 | 1986-07-10 | Henkel KGaA, 4000 Düsseldorf | Mittel und verfahren zur erzeugung farbloser verdichtungsschichten auf anodisierten aluminiumoberflaechen |
JPH03277797A (ja) * | 1990-03-27 | 1991-12-09 | Okuno Seiyaku Kogyo Kk | アルミニウム陽極酸化皮膜の封孔処理方法 |
JPH08134694A (ja) * | 1994-11-10 | 1996-05-28 | Natl Inst For Res In Inorg Mater | 超耐アルカリ性酸化アルミニウム複合膜とその製造方 法 |
DE60212508T2 (de) * | 2001-07-23 | 2007-02-15 | Fuji Photo Film Co., Ltd., Minami-Ashigara | Vorläufer für eine lithographische Druckplatte |
JP3987326B2 (ja) * | 2001-11-22 | 2007-10-10 | 日本化学産業株式会社 | アルミニウム又はアルミニウム合金の陽極酸化皮膜の封孔処理方法 |
US7299749B2 (en) * | 2003-02-10 | 2007-11-27 | Fujifilm Corporation | Lithographic printing plate support and production method thereof |
US20060286487A1 (en) * | 2005-06-20 | 2006-12-21 | Hill Charles D | Process for coating thick resist over polymer features |
JP4884813B2 (ja) * | 2006-03-22 | 2012-02-29 | アイシン軽金属株式会社 | 陽極酸化皮膜の封孔処理方法及び陽極酸化処理部材 |
JP4974986B2 (ja) * | 2007-09-28 | 2012-07-11 | 富士フイルム株式会社 | 太陽電池用基板および太陽電池 |
US20120132529A1 (en) * | 2010-11-30 | 2012-05-31 | Katholieke Universiteit Leuven, K.U.Leuven R&D | Method for precisely controlled masked anodization |
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2011
- 2011-01-06 JP JP2011001374A patent/JP5686608B2/ja active Active
-
2012
- 2012-11-07 US US13/671,047 patent/US20130140184A1/en not_active Abandoned
-
2016
- 2016-11-17 US US15/354,309 patent/US20170067177A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20130140184A1 (en) | 2013-06-06 |
JP2012144750A (ja) | 2012-08-02 |
US20170067177A1 (en) | 2017-03-09 |
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