JP5674127B2 - Embossed hologram chip and manufacturing method thereof - Google Patents

Description

  The invention according to this application relates to a structure of an object that is easily forged, such as cards, banknotes, securities, and the like, and a chip used for authenticating the authenticity of the object, and a method of manufacturing the chip. .

  Today there are many cards called the card society, such as bank cash cards, credit cards of credit companies, etc., cards related to the owner's property, prepaid cards that are securities and driver's licenses, health insurance cards, passports, etc. Cards related to identification are used.

  Many of the cards that are related to property and securities are written on the magnetic stripes on the front or back side, and the magnetic information is written using an automatic machine such as ATM (Automatic Teller's Machine) or a manual reader. Magnetic information is read from the stripe and various processes are executed.

  FIG. 1A shows an example of a current cash card. In this figure, reference numeral 1 denotes a cash card body made of plastic or the like, on the front side of which is formed a magnetic stripe 2 on which information is recorded and an arrow 3 indicating the insertion direction of the cash card. In addition, although illustration was abbreviate | omitted, a required item is published as an embossed character.

  Information written on the magnetic stripe can be easily read using a device called a skimmer, so that a counterfeit card is created and used, causing damage.

  As a countermeasure, an IC card incorporating a semiconductor memory has been used, and banks and the like are becoming popular as an alternative to a magnetic card.

  However, even with this IC card, it is possible to read the information stored in the memory, and it cannot be said that it is absolutely safe if counterfeiting takes time. In addition, IC cards are very expensive compared to magnetic cards and cannot be expected to spread quickly.

  In the case of a bank cash card, it only needs to be usable in one country, but in the case of a credit card, it must be usable in a foreign country. For all magnetic cards used around the world, It is virtually impossible to replace a certain credit card with an IC card with a unified standard.

  In addition, cash card and credit card are provided with embossed information such as the owner name, and since this information is also used for magnetic information, the embossed information is a clue for creating counterfeit cards. Yes.

  If these magnetic cards or IC cards are lost or stolen, the owner is easily aware of the fact, but if they return to their hands after the theft, especially if they return without knowing the theft, they are counterfeit Damage is likely to occur due to the use of cards.

  As a means for determining the suitability of a card user rather than preventing unauthorized use by preventing counterfeiting of a card, a password composed of four digits has been used so far. A number that can be inferred is often used for this password, and many damages have been caused so far. In recent years, not only analogy but also snooping of a personal identification number by means of voyeurism or the like has been carried out, and it has become extremely difficult to prevent unauthorized use by the personal identification number.

  In order to prevent damage caused by counterfeit cards, biometrics technology that uses pattern recognition technology has been partially adopted. Representative biometric authentication technologies include iris authentication, fingerprint authentication, palm print authentication, finger vein authentication, palm vein authentication, and palmar vein authentication. Among these authentications, there are contact type and non-contact type authentication. However, in any case, it is necessary to register a pattern in advance, and it takes time to register the pattern, and it also takes time for authentication, which increases the operation cost.

  In the case of the contact type, since it is necessary to directly touch the detection device, there is a problem of hygiene or physiological aversion. Further, when the authentication part is injured or in the worst case, the authentication part is lost, biometric authentication is impossible. Moreover, since only partial authentication is performed in the authentication process, it cannot be said that it is perfect.

  In addition, a biometric authentication system that can only be used by the cardholder itself is not possible even if he / she tries to ask the agent to handle the card because the card usage time or the card processing device is not familiar. This is also inconvenient for the user.

  As one means for preventing counterfeiting, an embossed hologram in which unevenness is formed on a plastic is attached to a credit card, prepaid card, banknote, securities or the like. Since this embossed hologram is very difficult to duplicate, it is virtually impossible to forge the cards with the embossed hologram, but in the current usage form, humans also read it at a glance Therefore, it is possible to forge and use a card or the like using a similar embossed hologram.

  As with cards, counterfeiting occurs frequently, and there are so-called counterfeit brands that cannot be ignored. Some counterfeit brand products can be identified as unauthentic at first glance, but some are so sophisticated that it is extremely difficult to identify that they are not genuine.

  Also, in some areas, the perception that a fake brand product is an illegal one is rare, and it may be distributed with the knowledge that it is a fake brand product. In recent years, such fake brand products are also sold directly to consumers on the Internet without going through a distribution mechanism.

  Furthermore, there are cases in which the chassis number of a stolen car is altered and exported overseas as not being a stolen car.

  In order to deal with such a situation, a genuine manufacturer or seller creates and attaches a certificate as much as the genuine product to the purchaser, but even the certificate is forged. Sometimes.

  In addition, by attaching a tag that is difficult to duplicate, such as a hologram, to a genuine product, it is easy to confirm that it is a genuine product. is not.

  In the authentication chip, the operator who inserts the card into the terminal device confirms the authentication pattern by visual inspection, that is, sensory sense, and is not read by the card terminal device.

  Sensory authentication is effective for primary screening due to variations in the ability of individuals to authenticate, and even the same person due to variations in authentication environment, psychological state, physical condition, etc. The reliability is low.

  Also, since sensory authentication depends on the recognition ability of the authenticating individual, only a few of it's relatively simple patterns can be used.

  Authentication by an auxiliary instrument is performed by using a magnifier such as a fine line, special line, micro character, special shape screen, or a magnifier, or by using a special filter that generates optical interference.

  Specifically, materials with special optical properties such as luminescent substrates, luminescent laminate films, luminescent inks, thermochromic inks, photochromic inks, etc. are mixed into substrates, laminate films, inks, special filters, ultraviolet lamps, etc. However, these devices are also unreliable because the final certification relies on human sensuality.

  In the authentication by mechanical processing, authentication is performed by mechanically detecting the characteristics of a material, and detection targets include detection of magnetic and optical characteristics.

  Specifically, light-emitting materials and magnetic materials are mixed into base materials, laminate films, inks, etc., using detection devices, and specific information encoded is given magnetically or optically using OCR characters or magnetic bar codes. However, there are some that use magnetic / optical detection equipment.

  As an authentication technique based on machine processing, there is an artifact-metric system that uses non-reproducible artifacts randomly arranged in a medium instead of information unique to a living body.

  In Artifact Metrics, granular light reflection pattern, optical fiber transmitted light pattern, polymer fiber parallax image pattern, fiber image pattern, magnetic fiber magnetic pattern, random recorded magnetic pattern, magnetic stripe random magnetic pattern A pattern formed by chance, such as a random charge amount pattern of a memory cell, a resonance pattern of a conductive fiber, or a resonance pattern of a vibration seal is used.

  Items subject to illegal use or counterfeiting of the card include “card description information” given when the card is issued to the user and “card body information” given in the card manufacturing process.

  The card description information is information that is printed / applied to the card body when the card is issued, and includes information related to issuance such as holder information and expiration date.

  Tampering, which is a typical form of fraudulent use, is an act of rewriting all or part of the card description information, and is performed by deleting legitimate information and adding unauthorized information.

  The card body information is information held by the card itself excluding the card description information from the issued card, and the physical shape of the card, the background pattern mainly given in the pre-printing process, the underlying printing layer, and the protective laminate layer Etc., information associated with the card substrate.

  Counterfeiting is a fraudulent act performed on the card body, which is performed by copying or imitating a pattern or pattern, which is information attached to the card body, to produce a card that approximates the appearance. This is done using a printer or the like by reading a design or pattern given to a simple card ticket surface with a scanner or the like, adding processing or correction.

  There are many anti-counterfeiting techniques for the card body depending on the combination of the printing method, ink, and printing pattern, even if it is limited to the printing technique, but no definitive one currently exists.

  Authentication methods for counterfeiting can be broadly divided into sensory, auxiliary, and machine processing.

  Sensory authentication authenticates authenticity with human senses such as visual and tactile sensations. For visual ones, a hologram that changes the pattern or color assigned by changing the color, watermark, and viewing angle of the main body. Examples of tactile sensations include detection of a given uneven shape, detection of the texture of a card body, and the like. Specifically, logo marks, special fonts, anti-copying image lines, special color inks, holograms, optically changing materials, latent image patterns, etc. that are difficult to duplicate and copy, and that can be easily authenticated visually, There are those that perform finger-like and visual authentication such as embossing, concavity and convexity, and perforation.

  In general, a mechanical reading of a pattern such as biometrics or artifact metrics is read by an imaging device and authenticated by a pattern recognition technique. Therefore, there is a possibility of counterfeiting by copying technology.

A card using an embossed hologram as a hard-to-copy card is disclosed in JP-B-6-85102, JP-A-11-272836, JP-A-2000-298880, JP-A-2000-163530, and JP-T2000-51481. No. 2, JP-A-2002-74283, JP-A-2002-347373, and Japanese Patent No. 2522681 .

The structure and manufacturing method of the card with the embossed hologram are shown in and JP 2004-117636 Patent JP-A-11-180079.

WO2007 / 072794 and WO2007 / 072793 by the present applicant disclose a technique for authenticating the authenticity of the card itself by using an embossed hologram.

Japanese Patent Application No. 2007-312861, which is a prior application by the present applicant, describes an invention of an authenticity determination member and an authenticity determination method for identifying a genuine product and a counterfeit product by a combination of an IC tag and an embossed hologram. .

Japanese Examined Patent Publication No. 6-85102 Japanese Patent Laid-Open No. 11-272836 JP 2000-298880 A JP 2000-163530 A Special Table 2000-51481 JP 2002-74283 A JP 2002-347373 A Japanese Patent No. 2522681 Japanese Patent Laid-Open No. 11-180079 JP 2004-117636 A WO2007 / 072794 WO2007 / 072793

  In the present application, the structure of the embossed hologram chip and the structure of the embossed hologram chip that can be added to a cash card or a credit card that has been conventionally used without any basic changes and is effectively used for discrimination of counterfeit products. To provide a novel structure of embossed hologram chips described in WO27 / 072794, WO27 / 072793, and Japanese Patent Application No. 27-312861, and a method of manufacturing these embossed hologram chips. Is an issue.

  In order to solve the above-mentioned problems, this application provides the following means.

  Hologram pits are regularly arranged on the embossed hologram chip, and pits that generate the hologram phenomenon are randomly arranged.

  Use multiple lights.

  A hologram chip original plate having a size corresponding to a plurality of embossed hologram chips is created, and a plurality of embossed hologram chips are cut out from the original plate.

  Sprinkle uncured resin and cure.

  An embossed hologram chip manufacturing stamper is created, and an embossed hologram chip is manufactured using the stamper.

Since the embossed hologram using the interference of light has a three-dimensional structure, it is impossible to copy other than manufacturing a replica directly from the original.
Also, an embossed hologram pattern that is randomly formed based on random numbers or by chance cannot be analyzed, and cannot be forged by analysis.

Description of monochromatic embossed hologram chip with pits. An example of pit arrangement of a monochromatic embossed hologram chip having pits. An example of pit arrangement of a monochromatic embossed hologram chip created based on random numbers. Example of pit arrangement of multicolor embossed hologram chip. Example of pit arrangement of multicolor embossed hologram chip. An example of pit arrangement of a multicolor embossed hologram chip created based on random numbers. Example of structure of monochromatic embossed hologram chip. 6 shows another embodiment of a monochromatic embossed hologram chip structure. Example of structure of multicolor embossed hologram chip. 6 shows another embodiment of the structure of a multicolor embossed hologram chip. FIG. 11 illustrates the multi-color embossed hologram chip of FIG. 10. FIG. 9 is still another embodiment of the structure of a multicolor embossed hologram chip. Description of the multicolor embossed hologram chip of FIG. FIG. 9 is still another embodiment of the structure of a multicolor embossed hologram chip. FIG. 15 is a description of the multicolor embossed hologram chip of FIG. 14. Description of a monochromatic embossed hologram chip having protrusions. Description of a multicolor embossed hologram chip having protrusions. Description of monochromatic embossed hologram chip with pits and protrusions. Description of a multicolor embossed hologram chip with pits and protrusions. Explanation of the principle of structural color. Explanation of pits that develop emboss hologram phenomenon and structural color phenomenon. Explanation of protrusions that develop emboss hologram phenomenon and structural color phenomenon. Description of a method for obtaining a plurality of embossed hologram chips. Description of a method for obtaining a plurality of cards having an embossed hologram chip. Description of another method for obtaining a plurality of embossed hologram chips. Description of still another method for obtaining a plurality of embossed hologram chips. Description of still another method for obtaining a plurality of embossed hologram chips. Description of still another method for obtaining a plurality of embossed hologram chips. Description of the principle method of manufacturing a monochromatic embossed hologram chip with pits. Description of another method of manufacturing a monochromatic embossed hologram chip with pits. Description of yet another method for manufacturing a monochromatic embossed hologram chip having pits. Description of yet another method for manufacturing a monochromatic embossed hologram chip having pits. Explanation of the principle method of manufacturing a monochromatic embossed hologram chip having pits using a stamper. Description of another method for manufacturing a monochromatic embossed hologram chip having pits using a stamper. Description of still another method for manufacturing a monochromatic embossed hologram chip having pits using a stamper. Description of still another method for manufacturing a monochromatic embossed hologram chip having pits using a stamper. Description of a method for irregularly arranging pits or protrusions of a monochromatic embossed hologram chip. Description of a method for irregularly arranging pits or protrusions of a multicolor embossed hologram chip.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. First, an embossed hologram chip (chip) disclosed in WO27 / 072794, WO27 / 072793 and Japanese Patent Application No. 27-312861 will be described. To do.

FIG. 1 shows a basic configuration of a card to which a monochromatic hologram chip by the applicant is attached.
(A) is an overall view of the card, (b) is a cross-sectional view of the card, (c) is a cross-sectional view of the hologram chip, (d) is a functional explanatory diagram of the hologram chip, and (e) is an output detection signal. .

  In this card 1, a surface plate 4 is attached on a card base 6 which is light-impermeable, and a hologram chip 5 is attached thereto. A magnetic stripe 2 and an arrow 3 are formed on the surface plate 4.

(C) shows the basic structure of the hologram chip.
Embossed hologram pits (pits) 7 having a depth of ¼ wavelength of used incident light and flat portions 8 where no pits are formed are arranged on the hologram chip substrate 5. The substrate 5 and the pit 7 are formed with a reflective layer of metal or the like thereon. Reference numeral 9 denotes a protective coating.

The function of the hologram chip will be described with reference to (d).
Light having a wavelength of λ incident through the protective coating 9 is reflected by the flat portion 8 and the flat bottom of the pit 7, and light having a wavelength λ indicated by a solid line arrow is detected outside.
At the edge of the pit 7, the phase of the light reflected at the upper end and the light reflected at the lower end are 180 ° different from each other. .

  As shown in (e), the reflected light detection signal dip at the edge of the boundary between the flat portion 8 and the pit 7, and this dip occurs twice for one pit 6. By utilizing this fact, the pit 7 can be detected.

FIG. 2 shows an example of a hologram chip in which pits 7 and flat portions 8 are regularly arranged.
In this figure, 5 is a hologram chip, 6 is a pit, and 7 is a flat portion.
Although the flat part 7 is visible in (a), it does not actually appear as in (b).

  It should be noted that the pit arrangement need not be regular, and it may be desirable to arrange the pits irregularly.

FIG. 3 shows an example of the arrangement of hologram chips based on binary data obtained by randomizing the pit arrangement of embossed holograms configured as pits.
This binary data can be obtained by detecting radiation emitted by nuclear decay of radioactive material.

On this hologram chip, an embossed hologram is arranged as a square of a 32 × 32 matrix of 1024-bit binary data.
In this figure, blanks are displayed at locations where binary data “0” is written, and “*” is displayed at locations where binary data “1” is written.

FIG. 4 shows a basic configuration of a multi-color hologram chip using light of a plurality of wavelengths (in this example, red light R, green light G, and blue light B) by the applicant.
(A) is a sectional view thereof, (b) is a functional explanatory diagram thereof, (c) is an output detection signal of red light, (d) is an output detection signal of green light, and (e) is output. This is a blue light detection signal.

In (a), pits 11 _R , 11 _G and 11 _B having a depth of ¼ wavelength of the red incident light R, the green incident light G and the blue incident light B used for the hologram chip substrate 10 and these pits are formed. a flat portion 11 _W which are not is disposed. On the hologram chip substrate 10 and the pits 11 _R , 11 _G and 11 _B , a reflective layer such as a metal is formed. Reference numeral 12 denotes a protective coating.

The hologram chip will be further described with reference to (b).
The pit 11 _R having a depth of ¼ of the wavelength λ _R of the red light R used for the substrate 10, the pit 11 _G having a depth of ¼ of the wavelength λ _G of the green light G, and the wavelength of the blue light B It pits 11 _B having a quarter of the depth of lambda _B is formed.

The red light having a wavelength of λ _R incident through the protective coating 12 is reflected outside the edge of the pit 11 _R , and the light of the wavelength λ _R indicated by the solid line arrow is detected.
Pits 11 _R edge at different red light phase of 180 ° reflected red light and a lower end which is reflected by the upper end, to meet off out each other, the red light of the wavelength lambda _R as shown by the broken line arrow r is detected Not.

The green light having a wavelength of λ _G incident through the protective coating 12 is reflected outside the edge of the pit 11 _G , and the green light of the wavelength λ _G indicated by the solid arrow is detected.
Pits 11 _G edges in the green light phase, which is reflected by the green light and the lower reflected at the top is different from 180 °, to meet off out each other, a green light having a wavelength lambda _G as indicated by broken line arrows g is detected Not.

The blue light having a wavelength of λ _B incident through the protective coating 12 is reflected at a portion other than the edge of the pit 11 _B , and the blue light of the wavelength λ _B indicated by the solid line arrow is detected.
Pits 11 differs been the 180 ° blue light phase reflected by blue light and the lower reflection at the upper end in the edge of the _B, to meet off out each other, the blue light of the wavelength lambda _B as indicated by the broken line arrow b is detected Not.

(C), the red light detection signal by dipping the boundary of the flat portion 13 and the pit 11 _R, this dip occurs twice for one pit 11 _R.
(D), the green light detection signal by dipping the boundary of the flat portion 13 and the pit 11 _G, this dip occurs twice for one pit 11 _R.
(E), the blue light detection signal by dipping the boundary of the flat portion 13 and the pit 11 _B, this dip occurs twice for one pit 11R.
By utilizing these things, the pits 11 _R , 11 _G , and 11 _B can be reliably detected.

FIG. 5 shows an example of a hologram chip in which pits and flat portions are regularly arranged by the applicant.
In this figure, 10 is a hologram chip, 11 _R , 11 _G and 11 _B are pits, and 11 _W is a flat portion.
Although a flat portion is visible in (a), it does not actually appear as in (b).

  It should be noted that the pit arrangement need not be regular, and it may be desirable to arrange the pits irregularly.

FIG. 6 shows an example of a hologram chip obtained by artificially obtaining an embossed hologram configured as a pit or a convex portion by the applicant.
“R”, “G”, “B” and white light “W” can be expressed in quaternary numbers, which are four 2-bit numbers, ie, “00”, “01”, “10”. , “11”.

  Based on this fact, by treating R, G, B, and W as quaternary numbers in the same manner as the binary numbers shown in FIG. 4, the quaternary matrix shown in FIG. 6 is obtained.

  Based on the applicant's own prior invention described above, the structure of a hologram chip having a configuration more suitable for practical use and the method of manufacturing a hologram chip according to the prior art invention will be described below.

<Monochromatic Embossed Hologram Example 1>
FIG. 7 shows a first embodiment of the basic structure of a single color pit.
In this figure, reference numeral 15 denotes a hologram chip base, on which a pit 16 having a depth of a quarter wavelength of the incident light used and a flat portion 17 where no pit is formed are arranged. The hologram chip base 15 and the pits 16 are formed with a reflective layer such as metal. At the edge of the pit 16, the incident light dip shown in FIG. Reference numeral 18 denotes a protective coating.

<Monochromatic Embossed Hologram Example 2>
FIG. 8 shows another embodiment 2 of the basic structure of the monochromatic pit.
In this figure, reference numeral 20 denotes a hologram chip substrate, in which pits having a depth of ¼ wavelength of used incident light are formed in advance, and some of them are filled with a resin 24. .

  In this way, the hologram chip base 20 is provided with the pit 21 having a depth of ¼ wavelength of the incident light used and the flat portion 22 where no pit is formed. The hologram chip base 20 and the pit 21 are formed with a reflective layer of metal or the like thereon. At the edge of the pit 21 formed in this manner, the incident light dip shown in FIG. 1 occurs. Reference numeral 23 denotes a protective coating.

<Multicolor Embossed Hologram Example 1>
FIG. 9 shows a first embodiment of the basic structure of a multicolor pit.
In this figure, reference numeral 25 denotes a hologram chip substrate, and pits 26 _R , 26 _G , and pits 26 _R , 26 _G , having a depth of ¼ of the wavelength of incident light, for example, red light R, green light G, and blue light B, are used. 26 _B and a flat portion 27 where no pit is formed are arranged. On the hologram chip base 25 and the pits 26 _R , 26 _G , 26 _B , a reflective layer such as a metal is formed. At the edges of the pits 26 _R , 26 _G , 26 _B , the incident light R, G, B dip shown in FIG. 4 occurs. Reference numeral 18 denotes a protective coating.

<Multi-color embossed hologram example 2>
FIG. 10 shows another embodiment 2 of the basic structure of the multicolor pit.
In this figure, 30 is a hologram chip base, using incident light in the longest wavelength in the hologram chip base 30, for example, a quarter wavelength of the red light R, the depth of the pit is pre-formed, the pits 31 _R Is filled with no resin, the pit 31 _G is filled with resin so that the depth after filling is ¼ wavelength of the green light G, and the pit 31 _B is filled with blue light B The resin is filled so as to have a quarter wavelength, and the pits _31W are completely filled. Further, a reflective layer made of metal or the like is formed on the upper surface including these pits.
Reference numeral 33 denotes a protective coating.

FIG. 11 shows the operation of the hologram chip shown in FIG.
When red light R, green light G, and blue light B are incident on the hologram chip having such a configuration, only red light R is not emitted from the edge of the pit 31 _R as shown in FIG. green light G and blue light B is emitted, only the green light G is the edge of the pit 31 _G is not emitted, the other red light R and the blue light B is emitted, the blue light B at the edge of the pit 31 _B only it does not exit, the other red light R及緑color light G emitted, in other parts, including the edge of the pit 31 _W if all of the light emitted.
Signals by these emitted lights R, G, and B are shown in (b), (c), and (d).

<Multi-color embossed hologram example 3>
FIG. 12 shows another embodiment 3 of the basic structure of the multicolor pit.
Unlike the multicolor pit embodiments 1 and 2, in this embodiment, a plurality of types of resins having different refractive indexes of the resin filled in the pits are used.
In this figure, reference numeral 35 denotes a hologram chip substrate. A pit having a depth of the longest wavelength in the incident light used, for example, a quarter wavelength of red light R, is formed in advance on the hologram chip substrate 35, and is formed on the upper surface including the inner surface of the pit. A reflective layer 38 of metal or the like is formed.
Some of the pits are filled with resin 37 _R , 37 _G , 37 _B , 37 _W whose refractive index is selected so that the effective depth is 1/4 of the wavelength of green light G and blue light B. . The resin 37 _W is a reflector that reflects light of all wavelengths.
Reference numeral 39 denotes a protective coating.

FIG. 13 shows the operation of the hologram chip shown in FIG.
When red light R, green light G, and blue light B are incident on the hologram chip having such a configuration, only red light R is not emitted from the edge of the pit 31R as shown in FIG. The light G and the blue light B are emitted, only the green light G is not emitted at the edge of the pit 31 _G , the other red light R and the blue light B are emitted, and only the blue light B is emitted at the edge of the pit 31 _B. Are not emitted, and other red light R and green light G are emitted, and all the light is emitted in other portions including the edge and the inside of the pit 39.
Signals by these emitted lights R, G, and B are shown in (b), (c), and (d).

<Multicolor Embossed Hologram Example 4>
FIG. 14 shows another embodiment 4 of the basic structure of the multicolor pit.
In this embodiment, in addition to a plurality of types of resins having different refractive indexes as in Embodiment 3, a resin that reflects all light is used.
In this figure, reference numeral 40 denotes a hologram chip substrate. On the hologram chip substrate 40, pits deeper than the longest wavelength in the incident light to be used, for example, a quarter wavelength of the red light R, are formed in advance. A reflective layer 42 of metal or the like is formed.
Some of the pits are filled with resin 41 _R , 41 _G , 41 _B whose refractive index is selected so that the effective depth is 1/4 of the wavelength of green light G and blue light B. The remaining pits 41 _N are filled with a resin that collects light of all wavelengths, and the pits 41 _W are filled with a resin that reflects light of all wavelengths.
Reference numeral 43 denotes a protective coating.

FIG. 15 shows the operation of the hologram chip shown in FIG.
When red light R, green light G, and blue light B are incident on the hologram chip having such a configuration, only red light R is not emitted from the edge of the pit 41 _R as shown in FIG. green light G and blue light B is emitted, only the green light G is the edge of the pit 41 _G is not emitted, the other red light R and the blue light B is emitted, the blue light B at the edge of the pit 41 _B Only the other red light R and green light G are emitted, and not all the light is emitted at the edge and inside of the pit 41 _N , and all other parts including the edge and inside of the pit 41 are emitted. Light is emitted.
Signals by these emitted lights R, G, and B are shown in (b), (c), and (d).

  An embossed hologram chip for obtaining an embossed hologram not by pits but by protrusions will be described.

<Monochromatic Embossed Hologram Example 3>
FIG. 16 shows an embossed hologram chip for obtaining a monochromatic embossed hologram by projections.
In (a), reference numeral 50 denotes a hologram chip substrate, on which a projection 52 having a height of a quarter wavelength of the used incident light and a flat portion 51 on which no projection is formed are arranged. The hologram chip base 50 and the protrusion 52 are formed with a reflective layer of metal or the like thereon.
Reference numeral 53 denotes a protective coating.

As shown in FIG. 5B, the incident light dip similar to that shown in FIG.
The signal by this emitted light is shown in (c).

<Multicolor Embossed Hologram Example 5>
FIG. 17 shows an embossed hologram chip for obtaining a monochromatic embossed hologram by projections.
In (a), reference numeral 55 denotes a hologram chip base, and projections 56 _R and 56 _{G having} a height that is ¼ of the wavelength of the incident light used, for example, red light R, green light G, and blue light B, on the hologram chip base 55. , 56 _B and the flat portion 56 _W which pits are not formed is disposed. On the hologram chip base 55 and the protrusions 56 _R , 56 _G , 56 _B , a reflective layer such as a metal is formed.
Reference numeral 58 denotes a protective coating.

As shown in FIG. 4B, the dip of the incident light R, G, B similar to that shown in FIG. 4 occurs at the edges of the pits 56 _R , 56 _G , 56 _B.
Signals by these emitted lights R, G, and B are shown in (c), (d), and (e).

  An embossed hologram chip for obtaining an embossed hologram by pits and protrusions will be described.

<Monochromatic Embossed Hologram Example 4>
FIG. 18 shows an embossed hologram chip for obtaining a monochromatic embossed hologram by pits and protrusions.
In (a), reference numeral 60 denotes a hologram chip base. The hologram chip base 60 has a pit 63 having a depth of ¼ wavelength of the used incident light, a protrusion 62 having a height of ¼ wavelength of the used incident light, and a pit. A flat portion 61 on which no protrusion is formed is disposed. The hologram chip base 60, the pits 63, and the protrusions 62 are formed with a reflective layer such as metal.
Reference numeral 65 denotes a protective coating.

As shown in FIG. 1B, the incident light dip similar to that shown in FIG. 1 occurs at the edge of the pit 63 and the edge of the protrusion 62.
The signal by this emitted light is shown in (c).

Similar to the embossed hologram, there is a phenomenon of structural color expressed by a transparent medium having a thickness of 1/4 of the wavelength of the light, whereas the embossed hologram does not emit only light having a quarter wavelength. The structural color is a phenomenon that ¼ wavelength light is emitted strongly. That is, when light is incident, the light is not observed in the embossed hologram, whereas in the structural color, the light is observed stronger than the other light.
Next, a hologram-structural color chip that can simultaneously use an embossed hologram and a structural color will be described.

First, the principle that the structural color appears will be described with reference to FIG.
Materials called “hologram flakes” or simply “holograms (flakes)” that exhibit structural colors are commercially available. Hologram flakes are not holograms but, like holograms, transparent bodies that are not colored by light interference appear to be colored.
In the embodiments described below, a structural color developing body such as a hologram frame is called a structural color piece.

In this figure, 70 is a thin layer of a translucent medium having a thickness d of, for example, a PET resin, placed in a medium having an absolute refractive index n ₀ , and the absolute refractive index is n ₁ . Reference numeral 71 denotes an incident surface of the translucent medium 70, and reference numeral 72 denotes a reflecting surface.
The reflective surface 72 may be a reflective film such as a metal.

As shown in (a), the incident light having a wavelength λ ₁ that is perpendicularly incident on the incident surface 71 of the translucent medium 70 having the absolute refractive index n ₁ from the medium having the absolute refractive index n ₀ is A part of the light is reflected by the incident surface 71 of the medium having a different refractive index, and the other part is incident on the translucent medium 70.
The light of wavelength λ1 is incident on the translucent medium 70 perpendicularly, that is, with an incident angle θ of 0 °, but here, it is displayed with a slight angle in the relationship shown in the figure.

The light incident on the light-transmitting medium 70 is reflected by the output end face 72 due to the difference in the refractive index of the medium, and is emitted from the light-transmitting medium 70 having the refractive index n _{1 into the} medium having the absolute refractive index n _0. Is done.

In this case, when m is a positive integer and d = (m + 1/2) λ ₁ / 2n, that is, when the condition of λ ₁ = 2dn / (m + 1/2) is satisfied, as shown in (a) The phase of the light reflected by the surface 71 and the phase of the light transmitted through the translucent medium 70 and reflected by the reflecting surface 72 are the same. Here, n is a relative refractive index, and n = n ₁ / n ₀ .
As a result, the emission of light having the wavelength λ ₁ becomes strong.

As shown in (b), when the condition of d = (m + 1/2) λ ₂ / 2n, that is, λ ₂ = 2dn / m is satisfied, the phase and translucency of the light reflected by the incident surface 71 The phases of the light transmitted through the medium 70 and reflected by the reflecting surface 72 are different by half a wavelength and cancel each other.
As a result, the emission of light of wavelength λ2 becomes weak.

As shown in (c), light incident obliquely at an incident angle of θ _i that is not 0 ° is refracted at the incident surface 71 at a refraction angle θr, but is relatively refracted with respect to the incident angle θ _i and the refraction angle θ _r. The relationship of sin θ _i / sin θ _r = n is established between the rate n. Based on this relationship, the light entering at the incident angle theta _i is incident at angle of refraction θr to the reflecting surface 72, is reflected at the reflection angle theta _r, emitted at emission angle theta _i from the incident surface 71.

Light having a wavelength of λ ₃ that is incident on the incident surface 71 at an incident angle θ _i and is refracted at a refraction angle θ _r is d = (m + 1/2) λ ₃ / 2ncos θ _r , ie, λ ₃ , where m is a positive integer. = 2dncos θ _r / (m + 1/2) When the condition is satisfied, the phase of the light reflected by the incident surface 71 at the reflection angle θ _i and the light transmitting medium 70 and reflected by the reflecting surface 72 are incident. The phases of light refracted from the surface 71 and emitted at the emission angle θ _i are the same.
As a result, the emission of light having the wavelength λ ₃ becomes strong.

As shown in (d), when light having a wavelength of λ ₄ is incident on the incident surface 51 at an incident angle θ _i and refracted at a refraction angle θ _r , d = (m + 1/2) λ ₄ / 2ncos θ _r , That is, when the condition of λ ₄ = 2dncos θ _r / m is satisfied, the phase of the light reflected by the incident surface 71 at the reflection angle θ _i and the light-transmitting medium 70 and reflected by the reflecting surface 72 are reflected. The phase of the light refracted from 71 and emitted at the exit angle θ _i is different by a half wavelength.
As a result, emission of light of wavelength lambda ₄ is weakened.

The wavelength λ _{3 of} the light thus selected and emitted or the wavelength of the light λ ₄ not emitted depends on the cosine “cos θ _r ” of the refraction angle θ _r . Reflection angle theta _r depends on the incident angle theta _i, since the incident angle theta _i varies steplessly between 90 ° from 0 °, and emits lists the results is selected in (a) and (c) The wavelength of light or non-emitted light shown in (c) and (d) also changes steplessly.
The color that appears in this way is called a structural color, and many colors that have a complex color due to the multi-layer structure exist in nature such as bird feathers, beetle feathers, butterfly scales, and shells.

<Hologram-Structural Color Chip Example 1>
FIG. 21 shows an explanation of the principle of a hologram-structured color chip constituted by pits.
In this figure, reference numeral 70 denotes a base 71, a translucent cover, 72 and 73, pits, 74, a translucent resin, and 75, 76, a light reflecting material such as metal.
The base 71, the translucent cover 72, and the translucent resin 74 have different refractive indexes.

  Since the pit 72 is filled with a translucent resin 74, the optical length of the pit 72 is different from the physical length. Therefore, light having a wavelength of λ1 is not emitted in a portion where the reflective film is present, and a structural color having a wavelength of λ2 due to the translucent resin 74 is observed in the pit except the portion where the reflective film 75 is present.

Since the pit 73 is filled with the translucent cover resin 71, the optical length of the pit 73 is different from the physical length. Therefore, light having a wavelength of λ ₃ is not emitted in a portion where the reflective film is present, and a structural color having a wavelength of λ ₄ due to the translucent resin 71 is observed in the pit except the portion where the reflective film 76 is present. In addition, a structural color of λ ₅ depending on the thickness of the translucent cover is observed in a portion where no pit exists.

<Hologram-Structural Color Chip Example 2>
FIG. 22 shows an explanation of the principle of a hologram-structured color chip constituted by protrusions.
In this figure, reference numeral 80 denotes a base 81, a translucent cover, 82, 83 a projection made of a translucent resin, and 84, 85, a light reflecting material such as metal.
The base body 80, the translucent cover 81, and the translucent resins 82 and 83 have different refractive indexes.

Since the protrusions 82 and 83 are translucent resin, the optical height of the protrusions 82 and 83 is different from the physical height due to the refractive index. Therefore, light having a wavelength of λ ₁ corresponding to the refractive index of the translucent cover 81 is not emitted due to the hologram phenomenon in the portion where the reflection film 84 of the protrusion 82 is present, and the translucent resin 82 is present in a portion where the reflection film 84 is not present. A structural color phenomenon appears and light of λ ₂ corresponding to the refractive index is observed.
A structural color of λ ₂ corresponding to the refractive index of the translucent resin 83 is observed when the reflection film 85 of the protrusion 83 is inside, and all light is emitted when the reflection film 85 is present.

  If the thickness of the cover material is optically meaningful, a structural color having a different wavelength can be obtained between the cover material and the upper surface of the base material or the protrusion.

《Embossed hologram chip manufacturing method》
Next, a method for manufacturing an embossed hologram chip will be described.

<Example 1 of Embossing Hologram Chip Manufacturing Method>
FIG. 23 shows a first embodiment of the embossed hologram chip manufacturing method.
Reference numeral 1 in (a) denotes an original plate having an area equivalent to 16 embossed hologram chips.
Pits 103 are formed on the original plate 1.
The original plate 1 on which the pits 103 are formed in this way is cut into an appropriate size as shown in FIG.

<Example 2 of Embossing Hologram Chip Manufacturing Method>
FIG. 24 shows a manufacturing method for forming an embossed hologram chip directly on a card or the like.
Reference numeral 105 in (a) denotes an original plate having an area equivalent to 16 cards.
By forming a pit in a part of the original plate 105 using a mask or the like, a card original plate with a chip 107 is obtained, and the original plate is cut as shown in FIG. .

<Example 3 of Embossing Hologram Chip Manufacturing Method>
FIG. 25 shows a chip manufacturing method in which the pit arrangement is fixed and only pit information is determined by chance.
Reference numeral 110 in (a) denotes an original plate having an area equivalent to 16 chips, and pits are regularly or irregularly arranged on the entire chip original plate 110.

  A light-transmitting uncured resin is sprayed on the original plate and cured to obtain a chip original plate, and the original plate is cut as shown in FIG.

<Example 4 of Embossing Hologram Chip Manufacturing Method>
FIG. 26 shows a manufacturing method of another form of the chip shown in FIG.
Reference numeral 115 in FIG. 5A denotes an original plate having an area equivalent to 16 chips, and pits are regularly or irregularly arranged on the entire surface of the chip original plate 115 except for the outer peripheral portion .

  A light-transmitting uncured resin is sprayed on the original plate and cured. In this way, a chip original plate is obtained, and this original plate is cut into an appropriate size as shown in FIG.

<Example 5 of Embossing Hologram Chip Manufacturing Method>
FIG. 27 shows a manufacturing method of still another embodiment of the chip shown in FIG.
Reference numeral 120 in (a) denotes an original plate having an area equivalent to 16 chips, and pits are regularly or irregularly arranged over the entire surface of the chip original plate 120.
A non-curable resin is injected or masked into a hole corresponding to a portion corresponding to the outermost peripheral portion of the chip.

  A light-transmitting uncured resin is sprayed on the original plate and cured to obtain a chip original plate with authentication information, and this original plate is cut into an appropriate size as shown in FIG.

<Example 6 of Embossing Hologram Chip Manufacturing Method>
FIG. 28 shows a chip manufacturing method in which pits are irregularly arranged. In this embodiment, the shape of the pit is not circular but elongated, but a circular pit can also be formed.

Reference numeral 130 in FIG. 4A denotes an original plate having an area equivalent to 16 chips. In the original chip plate 130, elongated pits are irregularly arranged over the entire surface of the chip.
The pits having such a shape are obtained by spraying a liquid material that corrodes or dissolves the original plate on the original plate 130 from an inclined direction.
In addition, if sprayed from the vertical direction, the shape of the pit becomes circular.

  A light-transmitting uncured resin is sprayed on the original plate and cured to obtain a chip original plate with authentication information, and this original plate is cut as shown in FIG.

In the embodiment shown in FIGS. 29 to 32, an original plate on which pits having the same depth are formed in advance for a monochromatic hologram is used.
The pits can be arranged either regularly or irregularly, but the embodiment will be described with reference to an original plate having regularly arranged pits.
Further, the original plate can be either one having the area of a plurality of chips shown in FIGS. 27 to 29 or one having the area of a single chip.

<Example 7 of Embossing Hologram Chip Manufacturing Method>
FIG. 29 shows the most basic embodiment.
140 shown in (1) is a chip original plate in which pits 141 having a depth of ¼ of the wavelength of the used light are formed in advance.

(2) Fill all pits with uncured resin monomer 143. For example, an ultraviolet curable resin is used as the uncured resin monomer.

(3) Finally, a monomer at a position not to be a pit is irradiated with ultraviolet rays to be cured into a polymer.

(4) The uncured resin monomer that has not been irradiated with ultraviolet rays and is not cured is removed from the pit.

(5) The reflective film 142 is formed on the inner surface of the original plate, the cured resin, and the pits.

(6) The whole is covered with a light transmissive resin cover 145.

<Example 8 of Embossing Hologram Chip Manufacturing Method>
FIG. 30 shows another embodiment.
140 shown in (1) is a chip original plate in which pits 141 having a depth of ¼ of the wavelength of the used light are formed in advance.

(2) The uncured resin monomer 143 is filled into pits that are not final pits. For the uncured resin monomer, a thermosetting resin is used in addition to the ultraviolet curable resin.

(3) The monomer is cured to a polymer.

(4) The reflective film 142 is formed on the inner surface of the original plate, the cured resin, and the pits.

(5) The whole is covered with a light transmissive resin cover 145.

  In the chip configured as described above, incident light is not emitted from the edge of the pit 141 but emitted from other portions.

<Example 9 of Embossing Hologram Chip Manufacturing Method>
FIG. 31 shows still another embodiment.
140 shown in (1) is a chip original plate in which pits 141 having a depth of ¼ of the wavelength of the used light are formed in advance.

(2) Fill all pits with uncured resin monomer 143. An ultraviolet curable resin is used for the uncured resin monomer.

(3) A photoresist film 146 is applied to the entire surface.

(4) The photoresist film at the position to be pits is irradiated with ultraviolet rays to form a cured photoresist film 147.

(5) The uncured photoresist film that is not irradiated with ultraviolet rays is removed.

(6) An uncured resin monomer not covered with the photoresist film is irradiated with ultraviolet rays and cured to form a polymer 144.

(7) The uncured resin monomer which is covered with the photoresist film and the photoresist film and is not irradiated with ultraviolet rays and is not cured is removed from the pits.

(8) The reflective film 142 is formed on the inner surface of the original plate, the cured resin, and the pits.

(9) The whole is covered with a light transmissive resin cover 145.

<Example 10 of Embossing Hologram Chip Manufacturing Method>
FIG. 32 shows still another embodiment.
140 shown in (1) is a chip original plate in which pits 141 having a depth of ¼ of the wavelength of the used light are formed in advance.

(2) Fill all pits with uncured resin monomer 143. An ultraviolet curable resin is used for the uncured resin monomer.

(3) A protective film 147 is formed on the uncured resin monomer 143 of the pit that is finally formed as a pit. For the uncured resin monomer, a thermosetting resin is used in addition to the ultraviolet curable resin.

(4) An uncured resin monomer that is not covered with the protective film is irradiated with ultraviolet rays and cured to obtain a polymer 144.

(5) The uncured resin monomer that is covered with the protective film and is not cured by being irradiated with ultraviolet rays is removed from the pits.

(6) The reflective film 142 is formed on the inner surface of the original plate, the cured resin, and the pits.

(7) The whole is covered with a light transmissive resin cover 145.

  In the chip configured as described above, incident light is not emitted from the edge of the pit 141 but emitted from other portions.

<Example 11 of Embossing Hologram Chip Manufacturing Method>
In the embodiments of FIGS. 29 to 32, the chip original plate on which pits having a depth of ¼ of the wavelength of the used light are formed is used. Can also be supported.

In the embodiment shown in FIG. 33 to FIG. 36, a pit is formed on a flat original plate using a stamper without using an original plate in which pits having the same depth for a monochromatic hologram are previously formed on the original plate.
The pits can be arranged either regularly or irregularly, but the embodiment will be described with reference to an original plate having regularly arranged pits.
Further, the original plate can be either one having the area of a plurality of chips shown in FIGS. 27 to 29 or one having the area of a single chip.

<Example 12 of Embossing Hologram Chip Manufacturing Method>
FIG. 33 shows the most basic embodiment.
150 shown in (1) is a chip original plate mold such as a mold in which a pit mold 151 having a depth of ¼ of the wavelength of the used light is previously formed.

(2) Fill all pit molds with uncured resin monomer 152. For example, an ultraviolet curable resin is used as the uncured resin monomer.

(3) Finally, ultraviolet rays are irradiated to a monomer at a position that is not a pit type, and the polymer is cured.

(4) The uncured resin monomer that has not been irradiated with ultraviolet rays and has not been cured is removed from the pit mold.

(5) The stamper 154 is formed using the chip original plate mold in which the pit mold is formed.

(6) The stamper 154 is released from the chip original plate mold 150.

(7) The flat original plate is pressed using the stamper 154 to form the original plate 160 with pits.

(8) The original plate 160 with pits is released from the stamper 154.

(9) The reflective film 162 is formed on the original plate 160 with pits.

(10) The whole is covered with a light transmissive resin cover 163.

<Example 13 of Embossing Hologram Chip Manufacturing Method>
FIG. 34 shows another embodiment.
150 shown in (1) is a chip original plate mold such as a mold in which a pit mold 151 having a depth of ¼ of the wavelength of the used light is previously formed.

(2) The uncured resin monomer 152 is filled into a pit type that is not a final pit. For the uncured resin monomer, a thermosetting resin is used in addition to the ultraviolet curable resin.

(3) The monomer is cured to form a polymer 153.

(4) The stamper 154 is formed using the chip original plate mold in which the pit mold is formed.

(5) The stamper 154 is released from the chip original plate mold 150.

  Subsequent processes are the same as (7) to (9) shown in FIG.

<Example 14 of Embossing Hologram Chip Manufacturing Method>
FIG. 35 shows still another embodiment.
150 shown in (1) is a chip original plate mold such as a mold in which a pit mold 151 having a depth of ¼ of the wavelength of the used light is previously formed.

(2) Fill all pit molds with uncured resin monomer 152. An ultraviolet curable resin is used for the uncured resin monomer.

(3) A photoresist film 156 is applied to the entire surface.

(4) Irradiate the photoresist film at the pit type position with ultraviolet rays to form a cured photoresist film 157.

(5) The uncured photoresist film that is not irradiated with ultraviolet rays is removed.

(6) An uncured resin monomer that is not covered with the photoresist film is irradiated with ultraviolet rays and cured to form a polymer 153.

(7) The uncured resin monomer that is covered with the photoresist film and the photoresist film and is not irradiated with ultraviolet rays and is not cured is removed from the pit mold.

(8) The stamper 154 is formed using the chip original plate mold in which the pit mold is formed.

(9) The stamper 154 is released from the chip original plate mold 150.

  Subsequent processes are the same as (7) to (9) shown in FIG.

<Example 15 of Embossing Hologram Chip Manufacturing Method>
FIG. 36 shows still another embodiment.
150 shown in (1) is a chip original plate mold such as a mold in which a pit mold 151 having a depth of ¼ of the wavelength of the used light is previously formed.

(2) Fill all pit molds with uncured resin monomer 152. An ultraviolet curable resin is used for the uncured resin monomer.

(3) A protective film 155 is formed on a pit-type uncured resin monomer 152 that is finally formed into a pit-type. For the uncured resin monomer, a thermosetting resin is used in addition to the ultraviolet curable resin.

(4) An uncured resin monomer that is not covered with a protective film is irradiated with ultraviolet rays and cured to form a polymer 153.

(5) The uncured resin monomer that is covered with the protective film and is not cured by being irradiated with ultraviolet rays is removed from the pit mold.

(6) The stamper 154 is formed using the chip original plate mold in which the pit mold is formed.

(7) The stamper 154 is released from the chip original plate mold 150.

  Subsequent processes are the same as (7) to (9) shown in FIG.

  In the embodiments of FIGS. 33 to 36, a chip original plate in which a pit type having a depth of ¼ of the wavelength of the used light is formed is used. By using a plurality of pit type depths, It can also handle multicolor light.

<Embossed hologram chip manufacturing method example 16>
A method for irregularly arranging the pits or protrusions of the monochromatic embossed hologram chip will be briefly described.
In FIG. 37, 170 is a chip in which pits 171 are irregularly arranged, and (a) is a view from above.
(B) And (c) is sectional drawing at the time of using the pit 171. FIG.

The pits are formed by opening the substrate 170 to a depth of a quarter wavelength of the used light by means such as etching.
Reference numeral 172 denotes a cover.

  It is also possible to obtain the substrate 170 by opening it into a thin film having a quarter wavelength of the used light instead of etching the substrate 170.

(D) And (e) is sectional drawing at the time of using the protrusion 176. FIG.
The protrusions 176 are formed by spreading thin pieces having a thickness of ¼ wavelength of the used light on the base 175.
Reference numeral 177 denotes a cover.

<Example 17 of Embossing Hologram Chip Manufacturing Method>
A method for irregularly arranging the pits or protrusions of the multicolor embossed hologram chip will be briefly described.
In FIG. 38, 180 is a chip in which pits 181R, 181G, 181B having different depths are irregularly arranged, and (a) is a view from above.
(B) And (c) is sectional drawing at the time of using the pit 171. FIG.
The pits are formed by opening the substrate 180 to a depth of a quarter wavelength of the used light by means such as etching.
Reference numeral 182 denotes a cover.

  It is also possible to obtain the substrate 180 by opening it into a thin film having a quarter wavelength of the used light, instead of etching the substrate 180.

(D) And (e) is sectional drawing at the time of using the protrusion 176. FIG.
The protrusions 176 are formed by spreading thin pieces 186R, 186G, and 186B having a thickness of ¼ wavelength of the used light on the base 175.
Reference numeral 187 denotes a cover.

  The authentic authentication chip and the card having the authentic authentication chip described above can be used for bank cash cards, credit cards, prepaid cards, point cards, securities, ID cards, entrance certificates, certificates, and the like.

  In addition, an optical pattern is generated by the interference of incident light and reflected light as in the embossed hologram, that is, a chip made of natural or artificial material that emits nacreous or has an iridescent color is used in place of the hologram chip. You can also

1 Card 5 Embossed hologram chip 7, 11, 16, 21, 26, 31, 36, 41 Embossed hologram pit 52, 56, 62, 68 Embossed hologram projection 72, 73 Embossed hologram-structural color pit 84, 85 Embossed hologram-structure Color projection 1,105,110,115,120,130 Master plate 140 Chip substrate 150 Substrate type 154 Stamper

Claims (24)

A plurality of pits having a depth of ¼ of the wavelength of the used light are formed over the entire surface excluding the outer periphery of the flat substrate ;
A reflective layer is formed on the substrate and the pit;
A translucent protective coating is formed covering the reflective layer on the substrate and the reflective layer in the pit;
The thickness of the protective coating formed on the pit was set to ¼ wavelength of the used light: an embossed hologram chip. The depth of the pits is uniform;
The pits were unevenly arranged on the substrate:
The embossed hologram chip according to claim 1. The depth of the pits is uniform;
The pit is filled with resin;
The amount of resin filled is different:
The embossed hologram chip according to claim 1. The depth of the pits is uniform;
A plurality of types of resins are filled in the pits;
The plurality of types of resins have different refractive indexes:
The embossed hologram chip according to claim 1. The pit depth is non-uniform;
The embossed hologram chip according to claim 1. A plurality of protrusions formed on a flat substrate;
A reflective layer is formed on the substrate and the protrusion;
A translucent protective coating is formed to cover the reflective layer on the substrate and the reflective layer of the protrusion;
The height of the protrusion is a quarter wavelength of the used light: an embossed hologram chip. The height of the protrusion is uniform;
The protrusions were non-uniformly disposed on the substrate:
The embossed hologram chip according to claim 6. The height of the protrusion is non-uniform;
The embossed hologram chip according to claim 6. A plurality of pits and protrusions formed on a flat substrate;
A reflective layer is formed on the substrate, the pits and the protrusions;
A translucent protective coating is formed to cover the reflective layer on the substrate, the reflective layer in the pit, and the reflective layer on the protrusion;
The thickness of the protective coating formed on the pits and the height of the protrusions were set to ¼ wavelength of the used light: an embossed hologram chip. The depth of the pits and the height of the protrusions are uniform;
The pits were unevenly arranged on the substrate:
The embossed hologram chip according to claim 9. The depth of the pits and the height of the protrusions are non-uniform;
The pits were unevenly arranged on the substrate:
The embossed hologram chip according to claim 9. A plurality of pits are formed on a flat substrate;
A reflective layer is formed only near the boundary between the substrate and the pit;
A translucent resin is filled on the substrate and in the pits;
The resin thickness in the pit was set to a quarter wavelength of the used light: an embossed hologram chip. The resin has a plurality of different refractive indices:
The embossed hologram chip according to claim 12. A plurality of protrusions made of translucent resin are formed on a flat substrate;
A reflective layer is formed only on the peripheral edge of the protrusion;
The thickness of the protrusion was set to ¼ wavelength of the used light: an embossed hologram chip. The resin has a plurality of different refractive indices:
The embossed hologram chip according to claim 14. A plurality of protrusions made of translucent resin are formed on a flat substrate;
A reflective layer is formed only on the portion excluding the peripheral edge of the protrusion;
The thickness of the protrusion was set to ¼ wavelength of the used light: an embossed hologram chip. Prepare an embossed hologram master plate with multiple pits;
Filling all of the plurality of pits with uncured resin:
Selectively curing the uncured resin;
Removing the uncured resin that has not been cured;
Forming a reflective layer on the cured resin and the embossed hologram master;
A translucent protective coating is formed on the reflective layer:
Embossed hologram chip manufacturing method. The depth of the pit is plural:
The embossed hologram chip manufacturing method according to claim 17. Prepare an embossed hologram master plate with multiple pits;
Selectively filling the plurality of pits with uncured resin:
Curing the uncured resin;
Forming a reflective layer on the cured resin and the embossed hologram master;
A translucent protective coating is formed on the reflective layer:
Embossed hologram chip manufacturing method. The depth of the pit is plural:
The method for manufacturing an embossed hologram chip according to claim 19. Prepare an original plate with multiple pit molds;
Filling all of the plurality of pit molds with uncured resin:
Selectively curing the uncured resin;
Removing the uncured resin that has not been cured;
Filling the cured resin and the original plate with a stamper resin to form an embossed hologram chip stamper;
An embossed hologram master plate is formed by pressing the embossed hologram chip stamper on an embossed hologram chip resin;
Forming a reflective layer on the embossed hologram master;
A translucent protective coating is formed on the reflective layer:
Embossed hologram chip manufacturing method. The pit type pit has a plurality of depths:
The method of manufacturing an embossed hologram chip according to claim 21. Prepare an original plate with multiple pit molds;
Selectively filling the plurality of pit molds with uncured resin:
Curing the uncured resin;
Filling the cured resin and the original plate with a stamper resin to form an embossed hologram chip stamper;
An embossed hologram master plate is formed by pressing the embossed hologram chip stamper on an embossed hologram chip resin;
Forming a reflective layer on the embossed hologram master;
A translucent protective coating is formed on the reflective layer:
Embossed hologram chip manufacturing method. The pit type pit has a plurality of depths:
The method of manufacturing an embossed hologram chip according to claim 23.

Images