JP5662885B2 - Method for producing conductive substrate - Google Patents
Method for producing conductive substrate Download PDFInfo
- Publication number
- JP5662885B2 JP5662885B2 JP2011144702A JP2011144702A JP5662885B2 JP 5662885 B2 JP5662885 B2 JP 5662885B2 JP 2011144702 A JP2011144702 A JP 2011144702A JP 2011144702 A JP2011144702 A JP 2011144702A JP 5662885 B2 JP5662885 B2 JP 5662885B2
- Authority
- JP
- Japan
- Prior art keywords
- temporary support
- conductive layer
- layer
- conductive
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 53
- 239000000758 substrate Substances 0.000 title claims description 41
- 239000010410 layer Substances 0.000 claims description 175
- 239000010408 film Substances 0.000 claims description 93
- 229910052709 silver Inorganic materials 0.000 claims description 52
- 239000004332 silver Substances 0.000 claims description 52
- 239000000839 emulsion Substances 0.000 claims description 51
- 239000011230 binding agent Substances 0.000 claims description 46
- 239000004816 latex Substances 0.000 claims description 46
- 229920000126 latex Polymers 0.000 claims description 46
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 40
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 35
- -1 silver halide Chemical class 0.000 claims description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 26
- 108010010803 Gelatin Proteins 0.000 claims description 22
- 229920000159 gelatin Polymers 0.000 claims description 22
- 239000008273 gelatin Substances 0.000 claims description 22
- 235000019322 gelatine Nutrition 0.000 claims description 22
- 235000011852 gelatine desserts Nutrition 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 11
- 230000008961 swelling Effects 0.000 claims description 9
- 239000012789 electroconductive film Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 238000012546 transfer Methods 0.000 description 16
- 230000000844 anti-bacterial effect Effects 0.000 description 15
- 238000011161 development Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000011282 treatment Methods 0.000 description 10
- 239000012298 atmosphere Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 239000011241 protective layer Substances 0.000 description 9
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000670 limiting effect Effects 0.000 description 6
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
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- 241000894006 Bacteria Species 0.000 description 4
- 229920002284 Cellulose triacetate Polymers 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 229920002492 poly(sulfone) Polymers 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 4
- 239000011780 sodium chloride Substances 0.000 description 4
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 229910021607 Silver chloride Inorganic materials 0.000 description 3
- 229910021612 Silver iodide Inorganic materials 0.000 description 3
- 230000001580 bacterial effect Effects 0.000 description 3
- 238000011081 inoculation Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BDDLHHRCDSJVKV-UHFFFAOYSA-N 7028-40-2 Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O BDDLHHRCDSJVKV-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
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- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
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- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- SRNKZYRMFBGSGE-UHFFFAOYSA-N [1,2,4]triazolo[1,5-a]pyrimidine Chemical compound N1=CC=CN2N=CN=C21 SRNKZYRMFBGSGE-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
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- 125000000524 functional group Chemical group 0.000 description 2
- 150000004676 glycans Chemical class 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001282 polysaccharide Polymers 0.000 description 2
- 239000005017 polysaccharide Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 235000010265 sodium sulphite Nutrition 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- 239000006228 supernatant Substances 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- NZKWZUOYGAKOQC-UHFFFAOYSA-H tripotassium;hexachloroiridium(3-) Chemical compound [Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[K+].[K+].[K+].[Ir+3] NZKWZUOYGAKOQC-UHFFFAOYSA-H 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- FYHIXFCITOCVKH-UHFFFAOYSA-N 1,3-dimethylimidazolidine-2-thione Chemical compound CN1CCN(C)C1=S FYHIXFCITOCVKH-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JKFYKCYQEWQPTM-UHFFFAOYSA-N 2-azaniumyl-2-(4-fluorophenyl)acetate Chemical compound OC(=O)C(N)C1=CC=C(F)C=C1 JKFYKCYQEWQPTM-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229920001661 Chitosan Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241000588724 Escherichia coli Species 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 206010027146 Melanoderma Diseases 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 108010039918 Polylysine Proteins 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 241000191967 Staphylococcus aureus Species 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- SJOOOZPMQAWAOP-UHFFFAOYSA-N [Ag].BrCl Chemical compound [Ag].BrCl SJOOOZPMQAWAOP-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 description 1
- 230000000843 anti-fungal effect Effects 0.000 description 1
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- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- ASPXBYAQZVXSNS-UHFFFAOYSA-N azane;sulfurous acid;hydrate Chemical compound N.N.O.OS(O)=O ASPXBYAQZVXSNS-UHFFFAOYSA-N 0.000 description 1
- DMSMPAJRVJJAGA-UHFFFAOYSA-N benzo[d]isothiazol-3-one Chemical compound C1=CC=C2C(=O)NSC2=C1 DMSMPAJRVJJAGA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
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- 208000028659 discharge Diseases 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
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- 230000016615 flocculation Effects 0.000 description 1
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- 239000000499 gel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 239000002608 ionic liquid Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
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- 239000006224 matting agent Substances 0.000 description 1
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
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- 238000009832 plasma treatment Methods 0.000 description 1
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- 229920000915 polyvinyl chloride Polymers 0.000 description 1
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- 238000010248 power generation Methods 0.000 description 1
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- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- ZUNKMNLKJXRCDM-UHFFFAOYSA-N silver bromoiodide Chemical compound [Ag].IBr ZUNKMNLKJXRCDM-UHFFFAOYSA-N 0.000 description 1
- 229940045105 silver iodide Drugs 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- IKTXPEUEHIYXND-UHFFFAOYSA-N silver nitrate hydrate Chemical compound O.[Ag+].[O-][N+]([O-])=O IKTXPEUEHIYXND-UHFFFAOYSA-N 0.000 description 1
- 235000012247 sodium ferrocyanide Nutrition 0.000 description 1
- BZHOWMPPNDKQSQ-UHFFFAOYSA-M sodium;sulfidosulfonylbenzene Chemical compound [Na+].[O-]S(=O)(=S)C1=CC=CC=C1 BZHOWMPPNDKQSQ-UHFFFAOYSA-M 0.000 description 1
- 241000894007 species Species 0.000 description 1
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- 235000019698 starch Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
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- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
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Images
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
本発明は、導電性フイルムの導電層を基材に転写することを含む導電性基材の製造方法に関する。 The present invention relates to a method for producing a conductive substrate including transferring a conductive layer of a conductive film to the substrate.
導電性フイルムは、表示デバイス、センサー、太陽光発電素子等に広く用いられている。導電性フイルムの製造方法として、めっき法、真空成形法、印刷法等が知られ、これらの方法により支持体上に導電層を形成し、導電性フイルムを得ることができる。
しかし、上記方法で得られる導電性フイルムは、製造に時間を要する上に製造コストも比較的高く、面内での厚みの均一性も十分でなかった。
一方、銀塩方式で製造される導電性フイルムも知られている。この導電性フイルムは、支持体に設けられたハロゲン化銀含有乳剤層を、金属銀からなる導電部を形成するように露光して製造され、生産性も高い（例えば、特許文献１〜４参照）。
Conductive films are widely used for display devices, sensors, solar power generation elements and the like. As a method for producing a conductive film, a plating method, a vacuum forming method, a printing method, and the like are known, and a conductive layer can be formed on a support by these methods to obtain a conductive film.
However, the conductive film obtained by the above method requires time for production, is relatively high in production cost, and does not have sufficient thickness uniformity in the plane.
On the other hand, a conductive film manufactured by a silver salt method is also known. This conductive film is manufactured by exposing a silver halide-containing emulsion layer provided on a support so as to form a conductive portion made of metallic silver, and has high productivity (for example, see Patent Documents 1 to 4). ).
導電性フイルムには、当該フイルムが有する導電層を被転写体に転写するための転写用導電性フイルムも知られている。例えば特許文献５には、仮支持体上に金属層と透明導電層と接着層とを有する転写フィルムが開示され、該仮支持体を剥離することで被転写体に導電性を付与することが記載されている。 As the conductive film, there is also known a transfer conductive film for transferring a conductive layer of the film to a transfer target. For example, Patent Document 5 discloses a transfer film having a metal layer, a transparent conductive layer, and an adhesive layer on a temporary support, and it is possible to impart conductivity to the transfer target by peeling the temporary support. Have been described.
本発明は、導電性に優れた導電性基材をより簡便に製造する方法の提供を課題とする。 This invention makes it a subject to provide the method of manufacturing the electroconductive base material excellent in electroconductivity more simply.
本発明の課題は、下記の手段によって達成された。
＜１＞仮支持体と、該仮支持体に設けられた、金属銀部を含む導電層とを備えた導電性フイルムから、該導電層を基材に転写することを含む導電性基材の製造方法であって、
該金属銀部は、ハロゲン化銀、バインダーおよびラテックスを含有し、かつ該ラテックスと該バインダーの質量比（ラテックス／バインダー）が０．２／１以上である銀塩含有乳剤層を露光し、現像処理することによって形成されたものであり、
該導電性フイルムと該基材とを、該導電性フイルムの該仮支持体が外側となるように張り合わせる工程、及び
該導電層から該仮支持体を剥離する工程
を含む、製造方法。
＜２＞仮支持体と、該仮支持体に設けられた、金属銀部を含む導電層とを備えた導電性フイルムから、該導電層を基材に転写することを含む導電性基材の製造方法であって、
該金属銀部は、ハロゲン化銀、バインダーおよびラテックスを含有し、かつ該ラテックスと該バインダーの質量比（ラテックス／バインダー）が０．２／１以上である銀塩含有乳剤層を露光し、現像処理することによって形成されたものであり、
該導電性フイルムと該基材とを、該導電性フイルムの該仮支持体が外側となるように張り合わせる工程、
該導電層と水とを接触させて該導電層を膨潤させ、これにより該仮支持体と該導電層との接着力を低下させる工程、及び
該導電層から該仮支持体を剥離する工程
を含む、製造方法。
＜３＞前記導電層と３０℃以上の水とを接触させて該導電層を膨潤させる、＜２＞に記載の製造方法。
＜４＞前記導電性フイルムを３０℃以上の水中、９０℃以上の水蒸気中、又は９０℃以上かつ相対湿度６０％以上の雰囲気中に保持し、これにより前記導電層を膨潤させる、＜３＞に記載の製造方法。
＜５＞膨潤していない導電層と前記仮支持体との剥離接着力が１００〜１００００Ｎ／ｃｍである、＜１＞〜＜４＞のいずれか１項に記載の製造方法。
＜６＞膨潤していない導電層と前記仮支持体との剥離接着力が２００〜２０００Ｎ／ｃｍである、＜５＞に記載の製造方法。
＜７＞膨潤させた後の導電層と前記仮支持体との剥離接着力が９９Ｎ／ｃｍ以下である、＜２＞〜＜６＞のいずれか１項に記載の製造方法。
＜８＞前記導電性フイルムの表面抵抗率が１００Ω／ｓｑ以下である、＜１＞〜＜７＞のいずれか１項に記載の製造方法。
＜９＞転写された導電層と前記基材との接触抵抗が１００Ω以下である、＜１＞〜＜８＞のいずれか１項に記載の製造方法。
＜１０＞前記バインダーがゼラチンである、＜１＞〜＜９＞のいずれか１項に記載の製造方法。
＜１１＞前記ラテックスがアクリル系ラテックスである、＜１＞〜＜１０＞のいずれか１項に記載の製造方法。
＜１２＞前記銀塩含有乳剤層における銀とバインダーの体積比（銀／バインダー）が１／１以上である、＜１＞〜＜１１＞のいずれか１項に記載の製造方法。
＜１３＞前記銀塩含有乳剤層が少なくとも２層からなり、最下層にラテックスを含有する、＜１＞〜＜１２＞のいずれか１項に記載の製造方法。
＜１４＞前記導電層及び／又は前記基材に粘着層が設けられている、＜１＞〜＜１３＞いずれか１項に記載の製造方法。
＜１５＞前記金属銀部のパターンが、細線にて構成された多数の格子の交点を有するメッシュ状パターンである、＜１＞〜＜１４＞のいずれか１項に記載の製造方法。
＜１６＞仮支持体と、該仮支持体に設けられた、金属部を含む導電層とを備えた導電性フイルムから、該導電層を基材に転写することを含む導電性基材の製造方法であって、
該導電層が、バインダーおよびラテックスを含有し、該ラテックスと該バインダーの質量比（ラテックス／バインダー）が０．２／１以上であり、
該導電性フイルムと該基材とを、該導電性フイルムの該仮支持体が外側となるように張り合わせる工程、及び
該導電層から該仮支持体を剥離する工程
を含む、製造方法。
The object of the present invention has been achieved by the following means.
<1> A conductive substrate including a temporary support and a conductive film provided on the temporary support, the conductive layer including a metallic silver portion, and transferring the conductive layer to the substrate. A manufacturing method comprising:
The metallic silver portion is exposed to a silver salt-containing emulsion layer containing silver halide , a binder, and a latex , and a mass ratio of the latex to the binder (latex / binder) of 0.2 / 1 or more. Formed by processing,
A production method comprising the steps of bonding the conductive film and the substrate so that the temporary support of the conductive film is on the outside, and peeling the temporary support from the conductive layer.
<2> A conductive substrate including a temporary support and a conductive film provided on the temporary support, the conductive layer including a metallic silver portion, and transferring the conductive layer to the substrate. A manufacturing method comprising:
The metallic silver portion is exposed to a silver salt-containing emulsion layer containing silver halide , a binder, and a latex , and a mass ratio of the latex to the binder (latex / binder) of 0.2 / 1 or more. Formed by processing,
Bonding the conductive film and the substrate so that the temporary support of the conductive film is on the outside;
Bringing the conductive layer into contact with water to swell the conductive layer, thereby reducing the adhesive force between the temporary support and the conductive layer; and peeling the temporary support from the conductive layer. A manufacturing method.
<3> the conductive layer and contacting the 30 ° C. or more water swelling the conductive layer, the production method according to <2>.
<4> The conductive film to 30 ° C. or more water, water vapor above 90 ° C., or 90 ° C. or higher and held in an atmosphere of a relative humidity of 60% or more, thereby swelling the conductive layer, <3> The manufacturing method as described in.
<5> The swelling and non conductive layer peel strength between the temporary support is 100~10000N / cm, the manufacturing method according to any one of <1> to <4>.
<6> The production method according to <5>, wherein the peel adhesion between the non-swelled conductive layer and the temporary support is 200 to 2000 N / cm.
<7> the conductive layer after swollen peel adhesion strength between the temporary support is not more than 99N / cm, the manufacturing method according to any one of <2> to <6>.
<8> The surface resistivity of the conductive film is not more than 100 [Omega / sq, the production method according to any one of <1> to <7>.
<9> contact resistance of the transferred conductive layer and said substrate is less than 100 [Omega, the production method according to any one of <1> to <8>.
<10> The binder is gelatin, the production method according to any one of <1> to <9>.
<11> the latex is an acrylic latex, the production method according to any one of <1> to <10>.
<12> The volume ratio of silver and binder in the silver salt-containing emulsion layer (silver / binder) is 1/1 or more, the production method according to any one of <1> to <11>.
<13> The consists silver salt-containing emulsion layer is at least two layers, containing a latex bottom layer, the manufacturing method according to any one of <1> to <12>.
<14> the conductive layer and / or adhesive layer on the base material is provided, <1> to <13> The method according to any one.
<15> pattern of the metallic silver portion is a mesh pattern having an intersection of a number of lattices that are composed of thin lines, the production method according to any one of <1> to <14>.
< 16 > Manufacture of a conductive substrate including transferring a conductive layer to a substrate from a conductive film including a temporary support and a conductive layer including a metal part provided on the temporary support. A method,
The conductive layer contains a binder and a latex, and the mass ratio of the latex to the binder (latex / binder) is 0.2 / 1 or more,
A production method comprising the steps of bonding the conductive film and the substrate so that the temporary support of the conductive film is on the outside, and peeling the temporary support from the conductive layer.
本発明の製造方法に用いる導電性フイルムは、導電性フイルムの導電層がバインダーを含有し、柔軟性に優れるために、導電層と仮支持体との密着性が良好である一方、導電層と仮支持体との剥離も容易に行うことができる。本発明の製造方法によれば、上記導電性フイルムから導電層を基材に転写するため、導電性フイルムにおける導電層の形状を保った状態で当該導電層を容易に転写することができ、これにより導電性に優れた導電性基材を製造することができる。
また、本発明の製造方法で製造した導電性フイルムは、抗菌・防カビ効果を有する。
The conductive film used in the production method of the present invention has good adhesion between the conductive layer and the temporary support, because the conductive layer of the conductive film contains a binder and is excellent in flexibility. Peeling from the temporary support can be easily performed. According to the production method of the present invention, since the conductive layer is transferred from the conductive film to the substrate, the conductive layer can be easily transferred while maintaining the shape of the conductive layer in the conductive film. Thus, it is possible to produce a conductive substrate having excellent conductivity.
In addition, the conductive film produced by the production method of the present invention has antibacterial and antifungal effects.
本発明に用いる導電性フイルムについて以下に詳細に説明する。 The conductive film used in the present invention will be described in detail below.
本発明に用いる導電性フイルムは、仮支持体上に銀塩方式で形成された導電層を有する。本発明に用いる導電性フイルムは、導電層を被転写体である基材に転写し、該基材に導電性を付与するのに用いられる。
本発明の導電性フイルムの各層の構成について以下に説明する。
The conductive film used in the present invention has a conductive layer formed by a silver salt method on a temporary support. The conductive film used in the present invention is used to transfer a conductive layer to a substrate that is a transfer target and to impart conductivity to the substrate.
The structure of each layer of the conductive film of the present invention will be described below.
［仮支持体］
本発明に用いる導電性フイルムの仮支持体としては、プラスチックフイルム、プラスチック板などを挙げることができる。上記プラスチックフイルムおよびプラスチック板の原料としては、例えば、ポリエチレンテレフタレート（ＰＥＴ）、およびポリエチレンナフタレート（ＰＥＮ）などのポリエステル類；ポリエチレン（ＰＥ）、ポリプロピレン（ＰＰ）、ポリスチレン、ＥＶＡなどのポリオレフィン類；ポリ塩化ビニル、ポリ塩化ビニリデンなどのビニル系樹脂；その他、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリサルホン（ＰＳＦ）、ポリエーテルサルホン（ＰＥＳ）、ポリカーボネート（ＰＣ）、ポリアミド、ポリイミド、アクリル樹脂、トリアセチルセルロース（ＴＡＣ）などを用いることができるが、良好な加工性、密着性及び剥離性を得る観点からはＰＥＴを好適に用いることができる。上記仮支持体は、目的に応じて着色されていてもよい。
上記プラスチックフイルム及びプラスチック板は、単層で用いることもできるが、２層以上を組合わせた多層フイルムとして用いることもできる。
仮支持体の厚みは１０〜５００μｍであることが好ましく、５０〜２５０μｍであることがより好ましい。
[Temporary support]
Examples of the temporary support for the conductive film used in the present invention include a plastic film and a plastic plate. Examples of the raw material for the plastic film and the plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene and EVA; Vinyl resins such as vinyl chloride and polyvinylidene chloride; others, polyetheretherketone (PEEK), polysulfone (PSF), polyethersulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetylcellulose (TAC) or the like can be used, but PET can be suitably used from the viewpoint of obtaining good processability, adhesion, and peelability. The temporary support may be colored according to the purpose.
The plastic film and the plastic plate can be used as a single layer, but can also be used as a multilayer film in which two or more layers are combined.
The thickness of the temporary support is preferably 10 to 500 μm, and more preferably 50 to 250 μm.
本発明に用いる仮支持体には、該支持体に対する導電層の密着性をより高める目的で、予め、薬品処理、機械的処理、コロナ放電処理、火焔処理、紫外線処理、高周波処理、グロー放電処理、活性プラズマ処理、レーザ処理、混酸処理、オゾン酸処理等の表面活性処理を施しておいてもよい。 The temporary support used in the present invention is preliminarily treated with chemical treatment, mechanical treatment, corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment for the purpose of further improving the adhesion of the conductive layer to the support. Further, surface activation treatment such as active plasma treatment, laser treatment, mixed acid treatment, ozone acid treatment, etc. may be performed.
本発明に用いる導電性フイルムでは、仮支持体と導電層との間に下塗り層は存在しないことが好ましい。すなわち、仮支持体上に導電層が直接設けられていることが好ましい。 In the conductive film used in the present invention, it is preferable that no undercoat layer exists between the temporary support and the conductive layer. That is, it is preferable that the conductive layer is directly provided on the temporary support.
［導電層］
本発明に用いる導電性フイルムにおいて、上記仮支持体上に設けられる導電層は、仮支持体上に塗設されたハロゲン化銀及びバインダーを含有する銀塩含有乳剤層を所望の形状パターンで露光及び現像処理することで形成される。前記パターンを細線からなる多数の格子の交点を有するメッシュ状パターンとすることで、細線状の導電部分とそれ以外の開口部分とを含む導電層を形成させることができ、これにより、導電層の光透過性を向上させることもできる。
上記銀塩含有乳剤層は、ハロゲン化銀とバインダーの他、溶媒や染料等の添加剤を含んでもよい。上記銀塩含有乳剤層は１層でもよく、２層以上設けてもよい。乳剤層の厚さは、好ましくは０．０５〜２０μｍ、より好ましくは０．１〜１０μｍである。
本発明に用いる導電性フイルムにおいて、仮支持体と導電層との剥離接着力（剥離接着強さ）は、１００〜１００００Ｎ／ｃｍであることが好ましく、１００〜５０００Ｎ／ｃｍであることがより好ましく、２００〜２０００Ｎ／ｃｍであることがさらに好ましく、３００〜１６００Ｎ／ｃｍであることが特に好ましく、３５０〜１０００Ｎ／ｃｍであることが殊更に好ましい。当該剥離接着力は、後述するような導電層の膨潤が引き起こされていない状態における剥離接着力であり、より具体的には、２５℃、相対湿度４５％における値である。
本発明において、剥離接着力は、ＪＩＳＫ６８５４に準じて測定した値であり、引張速度５０ｍｍ／ｍｉｎの条件下で測定した９０°剥離接着力である。剥離接着力は、電動式タテ型フォースゲージスタンド（ＦＧＳ−ＶＣシリーズ、日本電産シンポ社製）を用いて測定することができる。
[Conductive layer]
In the conductive film used in the present invention, the conductive layer provided on the temporary support is formed by exposing a silver salt-containing emulsion layer containing silver halide and a binder coated on the temporary support in a desired shape pattern. And development processing. By forming the pattern into a mesh pattern having intersections of a large number of lattices made of fine lines, a conductive layer including a fine line-shaped conductive portion and other opening portions can be formed. Light transmittance can also be improved.
The silver salt-containing emulsion layer may contain additives such as a solvent and a dye in addition to silver halide and a binder. The silver salt-containing emulsion layer may be a single layer or two or more layers. The thickness of the emulsion layer is preferably 0.05 to 20 μm, more preferably 0.1 to 10 μm.
In the conductive film used in the present invention, the peel adhesive strength (peel adhesive strength) between the temporary support and the conductive layer is preferably 100 to 10000 N / cm, more preferably 100 to 5000 N / cm. 200 to 2000 N / cm, more preferably 300 to 1600 N / cm, particularly preferably 350 to 1000 N / cm. The peeling adhesive force is a peeling adhesive force in a state where the swelling of the conductive layer as described later is not caused, and more specifically is a value at 25 ° C. and a relative humidity of 45%.
In the present invention, the peel adhesive force is a value measured according to JISK6854, and is a 90 ° peel adhesive force measured under the condition of a tensile speed of 50 mm / min. The peel adhesive force can be measured using an electric vertical force gauge stand (FGS-VC series, manufactured by Nidec Sympo Corporation).
（銀塩）
上記銀塩含有乳剤層における銀塩はハロゲン化銀である。本発明においては、光センサーとしての特性に優れるハロゲン化銀を用いることが好ましく、ハロゲン化銀に関する銀塩写真フイルムや印画紙、印刷製版用フイルム、フォトマスク用エマルジョンマスク等で用いられる技術は、本発明においても用いることができる。
上記ハロゲン化銀に含有されるハロゲン元素は、塩素、臭素、ヨウ素及びフッ素のいずれであってもよく、これらの組み合わせでもよい。例えば、ＡｇＣｌ、ＡｇＢｒ、ＡｇＩを主体としたハロゲン化銀を好適に用いることができる。また、塩臭化銀、沃塩臭化銀、沃臭化銀を主体としたハロゲン化銀も好適に用いることができる。ここで、「ＡｇＢｒを主体としたハロゲン化銀」とは、ハロゲン化銀組成物中に占める臭化物イオンのモル分率が５０％以上のハロゲン化銀をいう。すなわち、ＡｇＢｒを主体としたハロゲン化銀粒子は、臭化物イオンのほかに、沃化物イオン、塩化物イオン等を含有してもよい。他のハロゲン化銀（ＡｇＣｌ、ＡｇＩ等）を主体としたハロゲン化銀についても、上記「ＡｇＢｒ」を当該他のハロゲン化銀に置き換えて解釈する。
銀塩含有乳剤層中のハロゲン化銀の含有量に特に制限はないが、銀に換算して０．１〜４０ｇ／ｍ2であることが好ましく、０．５〜２５ｇ／ｍ2であることがより好ましく、さらに３〜２５ｇ／ｍ2、特に５〜２５ｇ／ｍ2、殊更７〜２５ｇ／ｍ2であることが好ましい。
(Silver salt)
The silver salt in the silver salt-containing emulsion layer is silver halide. In the present invention, it is preferable to use a silver halide having excellent characteristics as an optical sensor, and a technique used in a silver salt photographic film or photographic paper, a printing plate-making film, a photomask emulsion mask, etc. relating to silver halide, It can also be used in the present invention.
The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. For example, silver halide mainly composed of AgCl, AgBr, and AgI can be preferably used. Further, silver halides mainly composed of silver chlorobromide, silver iodochlorobromide, and silver iodobromide can also be suitably used. Here, “a silver halide mainly composed of AgBr” refers to a silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more. That is, silver halide grains mainly composed of AgBr may contain iodide ions, chloride ions and the like in addition to bromide ions. For silver halides mainly composed of other silver halides (AgCl, AgI, etc.), the above “AgBr” is replaced with the other silver halides.
Although there is no restriction | limiting in particular in content of the silver halide in a silver salt containing emulsion layer, It is preferable that it is 0.1-40 g / m < 2 > in conversion to silver, and it is 0.5-25 g / m < 2 >. Is more preferably 3 to 25 g / m 2 , particularly 5 to 25 g / m 2 , and particularly preferably 7 to 25 g / m 2 .
（バインダー）
上記銀塩含有乳剤層には、ハロゲン化銀粒子を均一に分散させ、かつ銀塩含有乳剤層と支持体との密着を補助する目的でバインダーが含まれる。当該バインダーとしては、非水溶性ポリマー及び水溶性ポリマーのいずれを用いてもよいが、水溶性ポリマーを用いることが好ましい。具体的には、ゼラチン、ポリビニルアルコール（ＰＶＡ）、ポリビニルピロリドン（ＰＶＰ）、澱粉等の多糖類、セルロースおよびその誘導体、ポリエチレンオキサイド、ポリサッカライド、ポリビニルアミン、キトサン、ポリリジン、ポリアクリル酸、ポリアルギン酸、ポリヒアルロン酸、カルボキシセルロース等を銀塩含有乳剤層のバインダーとして用いることができる。
本発明においては、上記銀塩含有乳剤層のバインダーとして、ゼラチンが好適に用いられる。
上記銀塩含有乳剤層中のバインダーの含有量に特に制限はなく、分散性と密着性を発揮し得る範囲で適宜決定することができるが、銀（Ａｇ）／バインダー（体積比）で１／１以上であることが好ましく、１／１〜４／１であることがより好ましく、１／１〜２．３／１であることがさらに好ましい。
(binder)
The silver salt-containing emulsion layer contains a binder for the purpose of uniformly dispersing silver halide grains and assisting the adhesion between the silver salt-containing emulsion layer and the support. As the binder, either a water-insoluble polymer or a water-soluble polymer may be used, but a water-soluble polymer is preferably used. Specifically, gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), polysaccharides such as starch, cellulose and derivatives thereof, polyethylene oxide, polysaccharides, polyvinylamine, chitosan, polylysine, polyacrylic acid, polyalginic acid, Polyhyaluronic acid, carboxycellulose and the like can be used as a binder for the silver salt-containing emulsion layer.
In the present invention, gelatin is preferably used as the binder of the silver salt-containing emulsion layer.
There is no restriction | limiting in particular in content of the binder in the said silver salt containing emulsion layer, Although it can determine suitably in the range which can exhibit a dispersibility and adhesiveness, it is 1 / (silver (Ag) / binder (volume ratio)). It is preferably 1 or more, more preferably 1/1 to 4/1, and further preferably 1/1 to 2.3 / 1.
（溶媒）
上記銀塩含有乳剤層の形成に用いられる溶媒に特に制限はなく、例えば、水、有機溶媒（例えば、メタノール等のアルコール類、アセトン等のケトン類、ホルムアミド等のアミド類、ジメチルスルホキシド等のスルホキシド類、酢酸エチル等のエステル類、エーテル類等）、イオン性液体、及びこれらの混合溶媒を挙げることができる。
上記銀塩含有乳剤層に用いられる溶媒の含有量は、銀塩含有乳剤層に含有される溶媒以外の成分の合計１００質量部に対して３０〜９０質量部の範囲であり、５０〜８０質量部の範囲であることが好ましい。
(solvent)
The solvent used for forming the silver salt-containing emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, etc. , Esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
The content of the solvent used in the silver salt-containing emulsion layer is in the range of 30 to 90 parts by mass and 50 to 80 parts by mass with respect to 100 parts by mass in total of components other than the solvent contained in the silver salt-containing emulsion layer. The range of parts is preferred.
（ラテックス）
上記銀塩含有乳剤層には、支持体との密着性を向上させる観点からラテックスを用いる。ラテックスは、中でもアクリル系ラテックスを好適に含有させることができる。アクリル系ラテックスとしては、アクリル酸のアルキルエステル及びメタクリル酸のアルキルエステルから選ばれる少なくとも１種のモノマーを含む重合体の水系媒体中の分散物を好適に用いることができる。なかでもアクリル酸メチル、アクリル酸エチル、アクリル酸プロピル、アクリル酸ブチル、メタクリル酸メチル、メタクリル酸エチル、メタクリル酸プロピル、メタクリル酸ブチル等から選ばれる少なくとも１種のモノマーを含む重合体の水系媒体中の分散物が好ましい。
上記銀塩含有乳剤層におけるラテックス／バインダー（質量比）は０．１／１以上であることが好ましく、０．２／１〜１／１であることがより好ましく、０．３／１〜０．８／１であることがさらに好ましく、０．３／１〜０．６／１であることが特に好ましい。
銀塩含有乳剤層を２層以上設ける場合には、ラテックスは少なくとも最下層に含有させることが好ましい。ラテックスを最下層に含有させることで、露光後の導電層と仮支持体との密着性が向上しうる。
ただし、本発明では、銀塩含有乳剤層におけるラテックス／バインダー（質量比）は０．２／１以上である。
(latex)
The above silver salt-containing emulsion layer, Ru with latex from the viewpoint of improving the adhesion to the support. Among these latexes, an acrylic latex can be preferably contained. As the acrylic latex, a dispersion in an aqueous medium of a polymer containing at least one monomer selected from alkyl esters of acrylic acid and alkyl esters of methacrylic acid can be suitably used. Among them, in an aqueous medium of a polymer containing at least one monomer selected from methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate and the like A dispersion of is preferred.
The latex / binder (mass ratio) in the silver salt-containing emulsion layer is preferably 0.1 / 1 or more, more preferably 0.2 / 1 to 1/1, and 0.3 / 1 to 0. Is more preferably 0.8 / 1, and particularly preferably 0.3 / 1 to 0.6 / 1.
When two or more silver salt-containing emulsion layers are provided, the latex is preferably contained in at least the lowest layer. By containing latex in the lowermost layer, the adhesion between the conductive layer after exposure and the temporary support can be improved.
However, in the present invention, the latex / binder (mass ratio) in the silver salt-containing emulsion layer is 0.2 / 1 or more.
（その他の添加剤）
上記銀塩含有乳剤層には、さらに各種添加剤が含まれてもよい。当該添加剤として、例えば、増粘剤、酸化防止剤、マット剤、滑剤、帯電防止剤、造核促進剤、分光増感色素、界面活性剤、カブリ防止剤、硬膜剤、黒ポツ防止剤などを挙げることができる。
(Other additives)
The silver salt-containing emulsion layer may further contain various additives. Examples of the additive include a thickener, an antioxidant, a matting agent, a lubricant, an antistatic agent, a nucleation accelerator, a spectral sensitizing dye, a surfactant, an antifoggant, a hardening agent, and an anti-black spot agent. And so on.
［保護層］
本発明に用いる導電性フイルムには、導電層上に保護層が設けられていてもよい。保護層を設けることで、導電性フイルムからの導電層の脱落をより抑制することができる。保護層は、ゼラチンや高分子ポリマー等からなることが好ましい。保護層の厚みは０．０２〜０．２μｍであることが好ましく、０．０５〜０．１μｍであることがより好ましい。また、保護層は、導電層上に直接設けられていてもよいし、導電層上に下塗り層を設けてからその上に設けてもよい。
[Protective layer]
In the conductive film used in the present invention, a protective layer may be provided on the conductive layer. By providing the protective layer, dropping of the conductive layer from the conductive film can be further suppressed. The protective layer is preferably made of gelatin or a polymer. The thickness of the protective layer is preferably 0.02 to 0.2 μm, more preferably 0.05 to 0.1 μm. Further, the protective layer may be provided directly on the conductive layer, or may be provided thereon after providing an undercoat layer on the conductive layer.
［粘着層］
本発明に用いる導電性フイルムには、仮支持体から最も遠い層、すなわち、導電層又は保護層上に、さらに粘着層が設けられていてもよい。粘着層を設けることで、該粘着層と被転写体である基材とを密着させることができ、その後仮支持体を剥離することで、導電層を基材に転写することができる。なお、基材上に粘着層が形成されている場合には、通常、導電性フイルムに粘着層を設ける必要はない。
粘着層に特に制限はないが、例えば、ポリイミド樹脂、（メタ）アクリル樹脂、ウレタン樹脂、ポリフェニレンエーテル樹脂、ポリエーテルイミド樹脂、フェノキシ樹脂等が挙げられる。これらは架橋性官能基を有することが好ましい。架橋性官能基として、例えば、エポキシ基、水酸基、カルボキシル基等が挙げられる。
粘着層は、熱硬化性樹脂や光硬化性樹脂を含有してもよい。
粘着層の厚みは１〜１０００μｍであることが好ましく、１０〜１００μｍであることがより好ましい。
[Adhesive layer]
In the conductive film used in the present invention, an adhesive layer may be further provided on the layer farthest from the temporary support, that is, the conductive layer or the protective layer. By providing the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer and the substrate to be transferred can be brought into close contact with each other, and then the conductive support can be transferred to the substrate by peeling the temporary support. In addition, when the adhesion layer is formed on the base material, it is usually unnecessary to provide the adhesion layer on the conductive film.
Although there is no restriction | limiting in particular in the adhesion layer, For example, a polyimide resin, a (meth) acrylic resin, a urethane resin, a polyphenylene ether resin, a polyetherimide resin, a phenoxy resin etc. are mentioned. These preferably have a crosslinkable functional group. Examples of the crosslinkable functional group include an epoxy group, a hydroxyl group, and a carboxyl group.
The pressure-sensitive adhesive layer may contain a thermosetting resin or a photocurable resin.
The thickness of the adhesive layer is preferably 1 to 1000 μm, more preferably 10 to 100 μm.
［導電性フイルムの作製］
本発明に用いる導電性フイルムは、仮支持体上に設けられた銀塩含有乳剤層を所望のパターンに露光した後現像処理し、該仮支持体上に、所望の形状の金属銀部を含む導電層を形成させることで得られる。露光は銀塩含有乳剤層全体に行ってもよく、この場合には、支持体上全体に金属銀部が形成される。本発明において、露光、現像処理によって形成されるパターンは、メッシュ状で、且つ、直線が略直交した形態の直線格子パターンや、交差部間の導電部分が少なくとも１つの湾曲を有する波線格子パターン等であることが好ましい。導電層の金属銀部の形状がメッシュパターンである場合において、メッシュパターンのピッチ（金属銀部の線幅と開口部の幅の合計）に特に制限はないが、１００〜６００μｍであることが好ましく、１００〜４００μｍであることがより好ましい。また、金属銀部の形状がメッシュパターンである場合において、金属銀部の線幅は、３０μｍ以下であることが好ましく、０．５〜３０μｍであることがより好ましく、１〜２０μｍであることがさらに好ましい。
[Preparation of conductive film]
The conductive film used in the present invention includes a silver salt-containing emulsion layer provided on a temporary support, which is exposed to a desired pattern and developed, and includes a metallic silver portion having a desired shape on the temporary support. It is obtained by forming a conductive layer. Exposure may be performed on the entire silver salt-containing emulsion layer. In this case, a metallic silver portion is formed on the entire support. In the present invention, the pattern formed by the exposure and development processes is a mesh-like linear lattice pattern in which straight lines are substantially orthogonal, a wavy lattice pattern in which a conductive portion between intersecting portions has at least one curve, or the like. It is preferable that In the case where the shape of the metallic silver portion of the conductive layer is a mesh pattern, there is no particular limitation on the pitch of the mesh pattern (the total of the line width of the metallic silver portion and the width of the opening), but it is preferably 100 to 600 μm. 100 to 400 μm is more preferable. Moreover, when the shape of a metallic silver part is a mesh pattern, it is preferable that the line | wire width of a metallic silver part is 30 micrometers or less, It is more preferable that it is 0.5-30 micrometers, It is 1-20 micrometers. Further preferred.
（パターン露光）
銀塩含有乳剤層をパターン状に露光する方法は、フォトマスクを利用した面露光で行ってもよいし、レーザービームによる走査露光で行ってもよい。この際、レンズを用いた屈折式露光でも反射鏡を用いた反射式露光でもよく、コンタクト露光、プロキシミティー露光、縮小投影露光、反射投影露光等の露光方式を用いることができる。
(Pattern exposure)
The method of exposing the silver salt-containing emulsion layer in a pattern may be performed by surface exposure using a photomask or by scanning exposure using a laser beam. At this time, refractive exposure using a lens or reflection exposure using a reflecting mirror may be used, and exposure methods such as contact exposure, proximity exposure, reduced projection exposure, and reflection projection exposure can be used.
（現像処理）
銀塩含有乳剤層は、露光がなされた後、さらに現像処理が施される。現像処理は、銀塩写真フイルムや印画紙、印刷製版用フイルム、フォトマスク用エマルジョンマスク等に用いられる通常の現像処理の技術を用いることができる。バインダーの膨潤を防ぎ、仮支持体と導電層との密着性を向上させる観点から、現像処理は２５℃以下で行うことが好ましく、１０〜２５℃で行うことが好ましい。
本発明では、露光及び現像処理を行うことによって、露光部分に導電部分（金属銀部）が形成されると共に、未露光部に開口部（光透過性部）が形成される。乳剤層への現像処理は、未露光部分の銀塩を除去して安定化させる目的で行われる定着処理を含むことができる。乳剤層に対する定着処理は、銀塩写真フイルムや印画紙、印刷製版用フイルム、フォトマスク用エマルジョンマスク等に用いられる定着処理の技術を用いることができる。
得られた導電性フイルムには、上述の保護層や粘着層を常法により設けることができる。
(Development processing)
The silver salt-containing emulsion layer is further developed after exposure. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. From the viewpoint of preventing the binder from swelling and improving the adhesion between the temporary support and the conductive layer, the development treatment is preferably performed at 25 ° C. or less, and preferably at 10 to 25 ° C.
In the present invention, by performing exposure and development processing, a conductive portion (metal silver portion) is formed in the exposed portion, and an opening portion (light transmissive portion) is formed in the unexposed portion. The development process to the emulsion layer can include a fixing process performed for the purpose of removing and stabilizing the silver salt in the unexposed part. For the fixing process on the emulsion layer, a fixing process technique used for a silver salt photographic film, photographic paper, a printing plate making film, a photomask emulsion mask, or the like can be used.
The obtained conductive film can be provided with the above-mentioned protective layer and adhesive layer by a conventional method.
本発明の導電性フイルムの表面抵抗率は１００Ω／ｓｑ以下であることが好ましく、５０Ω／ｓｑ以下であることがより好ましく、３５Ω／ｓｑ以下であることがさらに好ましい。 The surface resistivity of the conductive film of the present invention is preferably 100 Ω / sq or less, more preferably 50 Ω / sq or less, and further preferably 35 Ω / sq or less.
本発明に用いる導電性フイルムでは、以下に列挙する公知文献に記載の技術を必要により適宜組合わせて使用することができる。
特開2004-221564号公報、特開2004-221565号公報、特開2007-200922号公報、特開2006-352073号公報、WO2006/001461A1号パンフレット、特開2007-129205号公報、特開2007-235115号公報、特開2007-207987号公報、特開2006-012935号公報、特開2006-010795号公報、特開2006-228469号公報、特開2006-332459号公報、特開2007-207987号公報、特開2007-226215号公報、WO2006/088059A1号パンフレット、特開2006-261315号公報、特開2007-072171号公報、特開2007-102200号公報、特開2006-228473号公報、特開2006-269795号公報、特開2006-267635号公報、特開2006-267627号公報、WO2006/098333号パンフレット、特開2006-324203号公報、特開2006-228478号公報、特開2006-228836号公報、特開2006-228480号公報、WO2006/098336A1号パンフレット、WO2006/098338A1号パンフレット、特開2007-009326号公報、特開2006-336057号公報、特開2006-339287号公報、特開2006-336090号公報、特開2006-336099号公報、特開2007-039738号公報、特開2007-039739号公報、特開2007-039740号公報、特開2007-002296号公報、特開2007-084886号公報、特開2007-092146号公報、特開2007-162118号公報、特開2007-200872号公報、特開2007-197809号公報、特開2007-270353号公報、特開2007-308761号公報、特開2006-286410号公報、特開2006-283133号公報、特開2006-283137号公報、特開2006-348351号公報、特開2007-270321号公報、特開2007-270322号公報、WO2006/098335A1号パンフレット、特開2007-088218号公報、特開2007-201378号公報、特開2007-335729号公報、WO2006/098334A1号パンフレット、特開2007-134439号公報、特開2007-149760号公報、特開2007-208133号公報、特開2007-178915号公報、特開2007-334325号公報、特開2007-310091号公報、特開2007-311646号公報、特開2007-013130号公報、特開2006-339526号公報、特開2007-116137号公報、特開2007-088219号公報、特開2007-207883号公報、特開2007-207893号公報、特開2007-207910号公報、特開2007-013130号公報、WO2007/001008号パンフレット、特開2005-302508号公報、特開2005-197234号公報、特開2008-218784号公報、特開2008-227350号公報、特開2008-227351号公報、特開2008-244067号公報、特開2008-267814号公報、特開2008-270405号公報、特開2008-277675号公報、特開2008-277676号公報、特開2008-282840号公報、特開2008-283029号公報、特開2008-288305号公報、特開2008-288419号公報、特開2008-300720号公報、特開2008-300721号公報、特開2009-4213号公報、特開2009-10001号公報、特開2009-16526号公報、特開2009-21334号公報、特開2009-26933号公報、特開2008-147507号公報、特開2008-159770号公報、特開2008-159771号公報、特開2008-171568号公報、特開2008-198388号公報、特開2008-218096号公報、特開2008-218264号公報、特開2008-224916号公報、特開2008-235224号公報、特開2008-235467号公報、特開2008-241987号公報、特開2008-251274号公報、特開2008-251275号公報、特開2008-252046号公報、特開2008-277428号公報、特開2009-21153号公報。
In the conductive film used in the present invention, the techniques described in the publicly known documents listed below can be used in appropriate combinations as necessary.
JP 2004-221564, JP 2004-221565, JP 2007-200922, JP 2006-352073, WO 2006 / 001461A1, pamphlet 2007-129205, JP 2007- JP 235115, JP 2007-207987, JP 2006-012935, 2006-010795, 2006-228469, 2006-332459, 2007-207987 JP, JP 2007-226215, WO 2006 / 088059A1, pamphlet, JP 2006-261315, JP 2007-072171, JP 2007-102200, JP 2006-228473, JP 2006-269795, JP-2006-267635, JP-2006-267627, WO2006 / 098333 pamphlet, JP-2006-324203, JP-2006-228478, JP-2006-228836 JP, JP 2006-228480, WO 2006 / 098336A1, pamphlet, WO 2006 / 098338A1, pamphlet, JP 2007-009326, JP 2006-336057, JP 2006-339287, JP 2006-339 No. 336090 JP, 2006-336099, JP, 2007-039738, JP, 2007-039739, JP, 2007-039740, JP, 2007-002296, JP, 2007-084886, JP 2007-092146, JP 2007-162118, JP 2007-200872, JP 2007-197809, JP 2007-270353, JP 2007-308761, JP 2006 -286410, JP-2006-283133, JP-2006-283137, JP-2006-348351, JP-2007-270321, JP-2007-270322, WO2006 / 098335A1 , JP2007-088218, JP2007-201378, JP2007-335729, WO2006 / 098334A1, pamphlet 2007-134439, JP2007-149760, JP2007 JP-A-208133, JP-A-2007-178915, JP-A-2007-334325, JP-A-2007-310091, JP-A-2007-311646, JP-A-2007-013130, JP-A-2006-339526 JP, JP 2007-116137, JP 2007-088219 JP, 2007-207883, JP 2007-207893, JP 2007-207910, JP 2007-013130, WO 2007/001008, JP 2005-302508, JP JP 2005-197234, JP 2008-218784, JP 2008-227350, JP 2008-227351, JP 2008-244067, JP 2008-267814, JP 2008- 270405, 2008-277675, 2008-277676, 2008-282840, 2008-283029, 2008-288305, 2008-288419 JP, 2008-300720, 2008-300721, 2009-4213, 2009-10001, 2009-16526, 2009-21334, JP2009-26933, 2008-147507, 2008-159770, 2008-159771, 2008-171568, 2008-198388, JP JP 2008-218096, JP 2008-218264, JP 2008-224916, JP 2008-235224, JP 2008-235467, JP 2008-241987, JP 2008-251274, JP 2008-251275, JP 2008-252046, JP 2008 -277428, JP 2009-21153.
［転写］
本発明の製造方法では、導電性フイルムから被転写体となる基材へと導電層が転写される。
[Transfer]
In the production method of the present invention, the conductive layer is transferred from the conductive film to the substrate to be transferred.
（基材）
被転写体となる基材に特に制限はないが、プラスチックフイルム、プラスチック板及びガラス板等を挙げることができる。例えば、ポリエチレンテレフタレート（ＰＥＴ）、およびポリエチレンナフタレート（ＰＥＮ）などのポリエステル類；ポリエチレン（ＰＥ）、ポリプロピレン（ＰＰ）、ポリスチレン、ＥＶＡなどのポリオレフィン類；ポリ塩化ビニル、ポリ塩化ビニリデンなどのビニル系樹脂；その他、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリサルホン（ＰＳＦ）、ポリエーテルサルホン（ＰＥＳ）、ポリカーボネート（ＰＣ）、ポリアミド、ポリイミド、アクリル樹脂、トリアセチルセルロース（ＴＡＣ）などを用いることができる。上記基材は、平板でもよく、曲面形状や凹凸形状等の３次元形状であってもよい。また、上記基材は、目的に応じて着色されていてもよい。
基材の厚みに特に制限はないが、通常には１０〜１０００μｍである。
上記基材には導電層を密着させるために粘着層が設けられていてもよい。粘着層の組成と厚みに特に制限はないが、例えば上述した粘着層の構成と同様のものを用いることができる。
(Base material)
Although there is no restriction | limiting in particular in the base material used as a to-be-transferred body, A plastic film, a plastic plate, a glass plate etc. can be mentioned. For example, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, EVA; vinyl resins such as polyvinyl chloride and polyvinylidene chloride In addition, polyether ether ketone (PEEK), polysulfone (PSF), polyether sulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC) and the like can be used. The substrate may be a flat plate or a three-dimensional shape such as a curved surface shape or an uneven shape. Moreover, the said base material may be colored according to the objective.
Although there is no restriction | limiting in particular in the thickness of a base material, Usually, it is 10-1000 micrometers.
An adhesive layer may be provided on the substrate in order to adhere the conductive layer. Although there is no restriction | limiting in particular in the composition and thickness of an adhesion layer, For example, the thing similar to the structure of the adhesion layer mentioned above can be used.
（転写方法）
本発明の製造方法において、導電性フイルムから基材への導電層の転写は、導電性フイルムと基材とを、当該導電性フイルムの仮支持体側が外側となるように張り合わせる工程と、張り合わせた導電性フイルムの導電層から仮支持体を剥離する工程とを少なくとも含む方法により行われる。
導電性フイルムと基材とを張り合わせた後に、導電性フイルムの導電層と水とを接触させると、導電層中のバインダーを膨潤させることができる。バインダーが膨潤すると、仮支持体と該導電層との剥離接着力は低下する（弱まる）ため、導電層と仮支持体との剥離をより容易に行うことが可能になる。したがって、仮支持体の剥離前に予め導電層を水と接触させておくことが好ましい。ゼラチンは適度な膨潤性を有するため、この観点からも、銀塩含有乳剤層中のバインダーとしてゼラチンを用いることが好ましい。
導電層と水との接触は、基材と張り合わせた導電性フイルムを水中、水蒸気中、又は相対湿度６０〜１００％の雰囲気中に保持することで行うことができる。密着させた導電性フイルムと基材をまるごと水中、水蒸気中、又は相対湿度６０〜１００％の雰囲気中に保持してもよい。
導電性フイルムを水中に保持する場合においては、水温は３０℃以上であることが好ましく、３０〜１００℃であることが好ましい。水温が低すぎると、バインダーが十分膨潤しない場合がある。
導電性フイルムを水蒸気中に維持する場合においては、水蒸気温度は９０℃以上であることが好ましく、９０〜１５０℃であることがより好ましい。水蒸気温度が低すぎると、バインダーが十分膨潤しない場合がある。
導電性フイルムを相対湿度６０〜１００％の雰囲気中に維持する場合においては、当該雰囲気の温度は９０℃以上であることが好ましく、９０〜１５０℃であることがより好ましい。雰囲気中の温度が低すぎると、バインダーが十分膨潤しない場合がある。
(Transfer method)
In the production method of the present invention, the transfer of the conductive layer from the conductive film to the base material includes a step of bonding the conductive film and the base material so that the temporary support side of the conductive film is on the outside, And a step of peeling the temporary support from the conductive layer of the conductive film.
After bonding the conductive film and the substrate, when the conductive layer of the conductive film is brought into contact with water, the binder in the conductive layer can be swollen. When the binder swells, the peel adhesive force between the temporary support and the conductive layer decreases (weakens), so that the conductive layer and the temporary support can be more easily peeled off. Therefore, it is preferable to contact the conductive layer with water in advance before peeling off the temporary support. Since gelatin has an appropriate swelling property, it is preferable to use gelatin as a binder in the silver salt-containing emulsion layer also from this viewpoint.
The contact between the conductive layer and water can be performed by maintaining the conductive film bonded to the base material in water, water vapor, or an atmosphere having a relative humidity of 60 to 100%. You may hold | maintain the electroconductive film and base material to which it was made to adhere | attach the whole in water, water vapor | steam, or the atmosphere of 60-100% of relative humidity.
In the case where the conductive film is held in water, the water temperature is preferably 30 ° C or higher, and preferably 30 to 100 ° C. If the water temperature is too low, the binder may not swell sufficiently.
In the case where the conductive film is maintained in water vapor, the water vapor temperature is preferably 90 ° C. or higher, and more preferably 90 to 150 ° C. If the water vapor temperature is too low, the binder may not swell sufficiently.
In the case where the conductive film is maintained in an atmosphere having a relative humidity of 60 to 100%, the temperature of the atmosphere is preferably 90 ° C. or higher, and more preferably 90 to 150 ° C. If the temperature in the atmosphere is too low, the binder may not swell sufficiently.
上記のように膨潤させた導電層と仮支持体との剥離接着力は、膨潤前に比べて低下していることが好ましく、具体的には、９９Ｎ／ｃｍ以下であることが好ましく、１〜９９Ｎ／ｃｍであることがより好ましく、１〜５０Ｎ／ｃｍであることがさらに好ましく、１〜４０Ｎ／ｃｍであることが特に好ましい。 The peel adhesive strength between the conductive layer swollen as described above and the temporary support is preferably lower than that before swelling, specifically 99 N / cm or less. It is more preferably 99 N / cm, further preferably 1 to 50 N / cm, and particularly preferably 1 to 40 N / cm.
基材に張り合わせた導電性フイルムから仮支持体を剥離することで、導電層が転写された導電性基材を得ることができる。 By peeling the temporary support from the conductive film bonded to the base material, a conductive base material to which the conductive layer is transferred can be obtained.
上記導電性基材の表面抵抗率は、１００Ω／ｓｑ以下であることが好ましく、５０Ω／ｓｑ以下であることがより好ましく、３５Ω／ｓｑ以下であることがさらに好ましい。
また、上記導電性基材において、導電層と基材との接触抵抗は１００Ω以下であることが好ましく、５０Ω以下であることがより好ましく、３５Ω以下であることがさらに好ましい。当該接触抵抗の測定の際には、通常、導電層と基材との間に粘着層が存在しており、さらに保護層が存在する場合もある。
The surface resistivity of the conductive substrate is preferably 100 Ω / sq or less, more preferably 50 Ω / sq or less, and further preferably 35 Ω / sq or less.
In the conductive substrate, the contact resistance between the conductive layer and the substrate is preferably 100Ω or less, more preferably 50Ω or less, and further preferably 35Ω or less. In the measurement of the contact resistance, there is usually an adhesive layer between the conductive layer and the substrate, and there may be a protective layer.
本発明の製造方法で得られた導電性基材は、パーソナルコンピュータやワークステーション等から発生する電波、マイクロ波（極超短波）等の電磁波の遮断用途に用いることができ、静電気を防止する電磁波遮断ネットとして、パソコンや電子医療機器等のシールド・カバーに用いたり、ビル内の部屋等を電磁波シールドするカーテンとしても使用できる。 The conductive substrate obtained by the production method of the present invention can be used for blocking electromagnetic waves such as radio waves and microwaves (extremely short waves) generated from personal computers and workstations, and blocks electromagnetic waves to prevent static electricity. It can be used as a net for shields and covers of personal computers and electronic medical devices, or as a curtain for shielding electromagnetic waves in rooms in buildings.
以下、本発明を実施例に基づきさらに詳細に説明するが、本発明はこれらに限定されるものではない。なお、下記実施例において成分組成を表す％は特に断りのない限り質量％を意味する。
EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these. In the following examples, “%” representing the component composition means “% by mass” unless otherwise specified.
調製例１ 導電性フイルムの調製
［乳剤の調製］
・１液：
水 ７５０ｍＬ
フタル化処理ゼラチン ２０ｇ
塩化ナトリウム ３ｇ
１，３−ジメチルイミダゾリジン−２−チオン ２０ｍｇ
ベンゼンチオスルホン酸ナトリウム １０ｍｇ
クエン酸 ０．７ｇ
・２液：
水 ３００ｍＬ
硝酸銀 １５０ｇ
・３液：
水 ３００ｍＬ
塩化ナトリウム ３８ｇ
臭化カリウム ３２ｇ
ヘキサクロロイリジウム（ＩＩＩ）酸カリウム
（０．００５％ＫＣｌ ２０％水溶液） ５ｍＬ
ヘキサクロロロジウム酸アンモニウム
（０．００１％ＮａＣｌ ２０％水溶液） ７ｍＬ
Preparation Example 1 Preparation of conductive film [Preparation of emulsion]
・ 1 liquid:
750 mL of water
20g phthalated gelatin
Sodium chloride 3g
1,3-Dimethylimidazolidine-2-thione 20mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
・ Two liquids:
300 mL water
150 g silver nitrate
・ Three liquids:
300 mL water
Sodium chloride 38g
Potassium bromide 32g
Hexachloroiridium (III) potassium (0.005
Ammonium hexachlororhodate (0.001
３液に用いるヘキサクロロイリジウム（ＩＩＩ）酸カリウム（０．００５％ＫＣｌ ２０％水溶液）及びヘキサクロロロジウム酸アンモニウム（０．００１％ＮａＣｌ ２０％水溶液）は、それぞれの錯体粉末をそれぞれＫＣｌ２０％水溶液、ＮａＣｌ２０％水溶液に溶解し、４０℃で１２０分間加熱して調製した。
Potassium hexachloroiridium (III) (0.005
３８℃、ｐＨ４．５に保たれた１液に、２液と３液の各々９０％に相当する量を攪拌しながら同時に２０分間にわたって加え、０．１６μｍの核粒子を形成した。続いて下記４液、５液を８分間にわたって加え、さらに、２液と３液の残りの１０％の量を２分間にわたって加え、０．２１μｍまで成長させた。さらに、ヨウ化カリウム０．１５ｇを加え５分間熟成し粒子形成を終了した。 To 1 liquid maintained at 38 ° C. and pH 4.5, 90% of the 2 and 3 liquids were simultaneously added over 20 minutes with stirring to form 0.16 μm core particles. Subsequently, the following 4th and 5th liquids were added over 8 minutes, and the remaining 10% of the 2nd and 3rd liquids were added over 2 minutes to grow to 0.21 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete grain formation.
・４液：
水 １００ｍＬ
硝酸銀 ５０ｇ
・５液：
水 １００ｍＬ
塩化ナトリウム １３ｇ
臭化カリウム １１ｇ
黄血塩 ５ｍｇ
・ 4 liquids:
100mL water
Silver nitrate 50g
・ 5 liquids:
100mL water
Sodium chloride 13g
Potassium bromide 11g
Yellow blood salt 5mg
その後、常法に従ってフロキュレーション法によって水洗した。具体的には、温度を３５℃に下げ、硫酸を用いてハロゲン化銀が沈降するまでｐＨを下げた（ｐＨ３．６±０．２の範囲であった）。次に、上澄み液を約３リットル除去した（第一水洗）。さらに３リットルの蒸留水を加えてから、ハロゲン化銀が沈降するまで硫酸を加えた。再度、上澄み液を３リットル除去した（第二水洗）。第二水洗と同じ操作をさらに１回繰り返して（第三水洗）、水洗・脱塩行程を終了した。水洗・脱塩後の乳剤をｐＨ６．４、ｐＡｇ７．５に調整し、安定剤として１，３，３ａ，７−テトラアザインデン１００ｍｇ、防腐剤としてプロキセル（商品名、ＩＣＩ Ｃｏ．，Ｌｔｄ．製）１００ｍｇを加えた。最終的に塩化銀を７０モル％、沃化銀を０．０８モル％含む平均粒子径０．２２μｍ、変動係数９％のヨウ塩臭化銀立方体粒子乳剤を得た。最終的に乳剤として、ｐＨ＝６．４、ｐＡｇ＝７．５、電導度＝４０００μＳ/ｃｍ、密度＝１．４×１０3ｋｇ/ｍ3、粘度＝２０ｍＰａ・ｓとなった。 Then, it washed with water by the flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C., and the pH was lowered using sulfuric acid until the silver halide precipitated (the pH was in the range of 3.6 ± 0.2). Next, about 3 liters of the supernatant was removed (first water washing). Further, 3 liters of distilled water was added, and sulfuric acid was added until the silver halide settled. Again, 3 liters of the supernatant was removed (second water wash). The same operation as the second water washing was further repeated once (third water washing) to complete the water washing / desalting process. The emulsion after washing with water and desalting was adjusted to pH 6.4 and pAg 7.5, 100 mg of 1,3,3a, 7-tetraazaindene as a stabilizer, and Proxel (trade name, manufactured by ICI Co., Ltd. as a preservative). ) 100 mg was added. Finally, a silver iodochlorobromide cubic grain emulsion containing 70 mol% of silver chloride and 0.08 mol% of silver iodide and having an average grain diameter of 0.22 μm and a coefficient of variation of 9% was obtained. The final emulsion was pH = 6.4, pAg = 7.5, conductivity = 4000 μS / cm, density = 1.4 × 10 3 kg / m 3 , and viscosity = 20 mPa · s.
［乳剤層塗布液の調製］
上記乳剤に下記化合物（Ｃｐｄ−１）８．０×１０-4モル／モルＡｇ、１，３，３ａ，７−テトラアザインデン１．２×１０-4モル／モルＡｇを添加しよく混合した。次いで、膨潤率調製のため必要により、下記化合物（Ｃｐｄ−２）を添加し、クエン酸を用いて塗布液ｐＨを５．６に調整した。
[Preparation of emulsion layer coating solution]
The following compound (Cpd-1) 8.0 × 10 −4 mol / mol Ag, 1,3,3a, 7-tetraazaindene 1.2 × 10 −4 mol / mol Ag was added to the emulsion and mixed well. . Next, the following compound (Cpd-2) was added as necessary for adjusting the swelling ratio, and the coating solution pH was adjusted to 5.6 using citric acid.
また、下記式に示すエチルアクリレートを単量体単位とする重合体からなるラテックスを、乳剤に含まれるゼラチン（バインダー）に対し、ラテックス／ゼラチン（質量比）が０．３／１になるように添加した。 Further, a latex composed of a polymer having ethyl acrylate as a monomer unit represented by the following formula is adjusted so that the latex / gelatin (mass ratio) is 0.3 / 1 with respect to gelatin (binder) contained in the emulsion. Added.
［仮支持体の調製］
厚さが７５〜１８０μｍのＰＥＴフイルムの両面にコロナ放電処理を行ったものを仮支持体として用いた。
[Preparation of temporary support]
A PET film having a thickness of 75 to 180 μm subjected to corona discharge treatment on both sides was used as a temporary support.
［感光フイルムの調製］
上記の仮支持体に、上記の乳剤層塗布液をＡｇ７．８ｇ／ｍ２、ゼラチン１ｇ／ｍ２、ラテックス０．３ｇ／ｍ２（ラテックス／ゼラチン（質量比）０．３／１）になるように塗布した。
[Preparation of photosensitive film]
A temporary support of the above becomes Ag7.8g / m 2 The coating solution for emulsion layer described above, gelatin 1 g / m 2, latex 0.3 g / m 2 (latex / gelatin (weight ratio) 0.3 / 1) It was applied as follows.
得られた感光フイルムは、乳剤層の銀／バインダー体積比率（銀／ＧＥＬ比（ｖｏｌ））が１／１であった。 The resulting photosensitive film had an emulsion layer silver / binder volume ratio (silver / GEL ratio (vol)) of 1/1.
［露光・現像処理］
次いで、上記感光フイルムにライン／スペース＝５μｍ／１９５μｍの現像銀像を与えうる格子状のフォトマスクライン／スペース＝１９５μｍ／５μｍ（ピッチ２００μｍ）の、スペースが格子状であるフォトマスクを介して高圧水銀ランプを光源とした平行光を用いて露光し、引き続き現像、定着、水洗、乾燥という工程を含む処理を行った。
[Exposure and development processing]
Next, a high pressure is applied through a photomask having a grid-like photomask line / space = 195 μm / 5 μm (pitch: 200 μm) that can give a developed silver image of line / space = 5 μm / 195 μm to the photosensitive film. The exposure was carried out using parallel light using a mercury lamp as the light source, and then processing including steps of development, fixing, washing and drying was performed.
（現像液の組成）
現像液１リットル中に、以下の化合物が含まれる。
ハイドロキノン １５ｇ／Ｌ
亜硫酸ナトリウム ３０ｇ／Ｌ
炭酸カリウム ４０ｇ／Ｌ
エチレンジアミン・四酢酸 ２ｇ／Ｌ
臭化カリウム ３ｇ／Ｌ
ポリエチレングリコール２０００ １ｇ／Ｌ
水酸化カリウム ４ｇ／Ｌ
ｐＨ１０．５に調整
(Developer composition)
The following compounds are contained in 1 liter of developer.
Hydroquinone 15g / L
Sodium sulfite 30g / L
Potassium carbonate 40g / L
Ethylenediamine ・ tetraacetic acid 2g / L
Potassium bromide 3g / L
Polyethylene glycol 2000 1g / L
Potassium hydroxide 4g / L
Adjust to pH 10.5
（定着液の組成）
定着液１リットル中に、以下の化合物が含まれる。
チオ硫酸アンモニウム(７５％) ３００ｍｌ
亜硫酸アンモニウム・一水塩 ２５ｇ／Ｌ
１,３-ジアミノプロパン・四酢酸 ８ｇ／Ｌ
酢酸 ５ｇ／Ｌ
アンモニア水(２７％) １ｇ／Ｌ
ヨウ化カリウム ２ｇ／Ｌ
ｐＨ６．２に調整
(Fixing solution composition)
The following compounds are contained in 1 liter of the fixing solution.
300 ml of ammonium thiosulfate (75%)
Ammonium sulfite monohydrate 25g / L
1,3-Diaminopropane ・ tetraacetic acid 8g / L
Acetic acid 5g / L
Ammonia water (27%) 1g / L
Potassium iodide 2g / L
Adjust to pH 6.2
［還元処理］
上記のように現像処理したサンプルを２０℃に保温した亜硫酸ナトリウム(１０ｗｔ％)水溶液に１０分浸漬した。
[Reduction treatment]
The sample developed as described above was immersed in an aqueous solution of sodium sulfite (10 wt%) kept at 20 ° C. for 10 minutes.
上記により導電性フイルムを得た。 A conductive film was obtained as described above.
また、ラテックス／ゼラチン（質量比）を０／１；０．１／１；０．２／１；０．４／１；０．５／１；０．６／１とした各乳剤層塗布液を上記と同様にして調製し、各々を、ゼラチン１ｇ／ｍ２、ラテックス０ｇ／ｍ２；ゼラチン１ｇ／ｍ２、ラテックス０．１ｇ／ｍ２；ゼラチン１ｇ／ｍ２、ラテックス０．２ｇ／ｍ２；ゼラチン１ｇ／ｍ２、ラテックス０．４ｇ／ｍ２；ゼラチン１ｇ／ｍ２、ラテックス０．５ｇ／ｍ２；ゼラチン１ｇ／ｍ２、ラテックス０．６ｇ／ｍ２；となるように仮支持体に塗布した。
塗布後のサンプルを上記と同様に露光、現像、還元処理に付し、導電層のラテックス／ゼラチン比の異なる導電性フイルムを得た。
Each emulsion layer coating solution with latex / gelatin (mass ratio) of 0/1; 0.1 / 1; 0.2 / 1; 0.4 / 1; 0.5 / 1; 0.6 / 1 Were prepared in the same manner as above, and each of them was gelatin 1 g / m 2 , latex 0 g / m 2 ; gelatin 1 g / m 2 , latex 0.1 g / m 2 ; gelatin 1 g / m 2 , latex 0.2 g / m 2 ; gelatin 1 g / m 2 , latex 0.4 g / m 2 ; gelatin 1 g / m 2 , latex 0.5 g / m 2 ; gelatin 1 g / m 2 , latex 0.6 g / m 2 ; Applied to the body.
The coated sample was subjected to exposure, development and reduction treatment in the same manner as described above to obtain conductive films having different latex / gelatin ratios of the conductive layer.
試験例１ 導電性フイルムから基材への導電層の転写
［基材］
被転写体としての基材には、厚さが１００μｍのＰＥＴフイルムを用いた。この基材の片面に、ソーラーエバＲのＲＣ０２Ｂ（三井化学ファブロ社製）を用いて粘着層を設けた。
Test Example 1 Transfer of conductive layer from conductive film to base material [base material]
A PET film having a thickness of 100 μm was used as a substrate as a transfer target. An adhesive layer was provided on one side of the substrate using Solar Eva R RC02B (Mitsui Chemicals Fabro).
［転写］
上記粘着層に、仮支持体側が外側になるように導電性フイルムを張り合わせた後、張り合わされた状態の基材及び導電性フイルムを、９０℃、相対湿度９０％の雰囲気中に１分間保持することで、導電層と水とを接触させた。
次いで、仮支持体を導電層から剥離することで、導電層を基材上に転写し、導電性基材を作製した。
[Transfer]
After the conductive film is laminated to the adhesive layer so that the temporary support side is on the outside, the laminated base material and conductive film are held in an atmosphere of 90 ° C. and 90% relative humidity for 1 minute. Thus, the conductive layer was brought into contact with water.
Next, the temporary support was peeled from the conductive layer, whereby the conductive layer was transferred onto the base material to produce a conductive base material.
上記各導電性フイルム及び各導電性基材を評価した結果を下記表１に示す。 Table 1 below shows the results of evaluating the conductive films and the conductive substrates.
表１中、仮支持体と導電層との密着性は下記基準で評価した。
Ａ：導電層の９０％以上が仮支持体と密着している。
Ｂ：導電層の７０％以上９０％未満が仮支持体と密着している。
Ｃ：導電層の５０％以上７０％未満が仮支持体と密着している。
Ｄ：導電層の５０％以上が仮支持体からはがれている。
また、表１中、転写性は下記評価基準で評価した。
Ａ：導電層と仮支持体との剥離が容易で、転写後の導電層において金属銀部のメッシュ形状が崩れていない。
Ｂ：導電層と仮支持体とを剥離する際に、導電層における金属銀部のメッシュ形状が崩れてしまう。
また、表１中、表面抵抗率及び接触抵抗は、２５℃、相対湿度４５％の条件下で、ロレスタＧＰ（三菱化学アナリック社製）を用いて測定した。
また、表１中、「仮支持体と導電層との剥離接着力」は、２５℃、相対湿度４５％、引張速度５０ｍｍ／ｍｉｎの条件下での９０°剥離接着力であり、「膨潤後の導電層と仮支持体との剥離接着力」は、９０℃、相対湿度９０％の雰囲気中から取り出した導電性フイルムを、２５℃、相対湿度４５％雰囲気下に５分間静置した後、引張速度５０ｍｍ／ｍｉｎで測定した９０°剥離接着力である。剥離接着力は、電動式タテ型フォースゲージスタンド（ＦＧＳ−ＶＣシリーズ、日本電産シンポ社製）を用いて測定した。
In Table 1, the adhesion between the temporary support and the conductive layer was evaluated according to the following criteria.
A: 90% or more of the conductive layer is in close contact with the temporary support.
B: 70% or more and less than 90% of the conductive layer is in close contact with the temporary support.
C: 50% or more and less than 70% of the conductive layer is in close contact with the temporary support.
D: 50% or more of the conductive layer is peeled off from the temporary support.
In Table 1, transferability was evaluated according to the following evaluation criteria.
A: Peeling between the conductive layer and the temporary support is easy, and the mesh shape of the metallic silver portion is not broken in the conductive layer after transfer.
B: When peeling a conductive layer and a temporary support body, the mesh shape of the metal silver part in a conductive layer will collapse.
In Table 1, the surface resistivity and the contact resistance were measured using Loresta GP (manufactured by Mitsubishi Chemical Analytical) under the conditions of 25 ° C. and relative humidity of 45%.
In Table 1, “Peeling adhesive strength between temporary support and conductive layer” is 90 ° peeling adhesive strength under the conditions of 25 ° C., relative humidity 45%, and tensile speed 50 mm / min. The adhesive strength between the conductive layer and the temporary support ”was determined by leaving the conductive film taken out in an atmosphere at 90 ° C. and 90% relative humidity for 5 minutes in an atmosphere at 25 ° C. and 45% relative humidity. 90 ° peel adhesion measured at a pulling speed of 50 mm / min. The peel adhesive strength was measured using an electric vertical force gauge stand (FGS-VC series, manufactured by Nidec Sympo Corporation).
上記表１の結果から、バインダーを含有する銀塩含有乳剤層を露光して導電層を形成させることで、当該導電層と仮支持体との密着性に優れると同時に、導電層と仮支持体との剥離も容易に行える導電性フイルムが得られうることがわかった。そして、この導電性フイルムを用いることで、導電層を容易に、しかもきれいに基材表面に転写でき、導電性に優れた導電性基材が得られることがわかった。
また、本発明に用いる導電性フイルムは、転写前は金属銀部が開口部に対して凸状に膨らんだ形状となっていたが、当該導電性フイルムを用いて製造した導電性基材は、導電層の転写面に設けられた接着層が金属銀部の膨らみを吸収し、表面が平坦な導電層を有するものとなった。
From the results of Table 1 above, by exposing a silver salt-containing emulsion layer containing a binder to form a conductive layer, the conductive layer and the temporary support are excellent in adhesion between the conductive layer and the temporary support. It was found that a conductive film that can be easily peeled off can be obtained. Then, it was found that by using this conductive film, the conductive layer can be easily and cleanly transferred to the surface of the base material, and a conductive base material excellent in conductivity can be obtained.
In addition, the conductive film used in the present invention had a shape in which the metallic silver portion bulged with respect to the opening before transfer, but the conductive base material manufactured using the conductive film is The adhesive layer provided on the transfer surface of the conductive layer absorbed the swelling of the metallic silver portion, and had a conductive layer with a flat surface.
試験例２ 抗菌性試験
本発明の製造方法において基材に転写される導電層の抗菌活性を調べた。上記調製例１において、乳剤層塗布液中のラテックス／ゼラチン（質量比）を０．３／１として調製した導電性フイルムを５０ｍｍ×５０ｍｍの大きさにカットし、エタノールを吸収させた脱脂綿でフイルム全面を軽く２〜３回ふいて乾燥させた導電性フイルムを本発明品とした。また、上記調製例１に記載の仮支持体そのものを５０ｍｍ×５０ｍｍの大きさにカットし、エタノールを吸収させた脱脂綿でフイルム全面を軽く２〜３回ふいて乾燥させたものを比較品とした。
試験菌種としては、黄色ぶどう球菌（Staphylococcus aureus subsp. aureus NBRC 12732株）及び大腸菌（Escherichia coli NBRC 3972株）を用い、それぞれ４×１０５ＣＦＵ／ｍＬの濃度に培養した菌液を用意した。これらの菌液を上記本発明品の導電層側及び比較品の片側にそれぞれ０．４ｍＬ接種し、３５℃で培養し、生菌数（ＣＦＵ／ｍＬ）を調べた。
結果を下記表２に示す。
Test Example 2 Antibacterial Test The antibacterial activity of the conductive layer transferred to the substrate in the production method of the present invention was examined. In the above Preparation Example 1, the conductive film prepared by setting the latex / gelatin (mass ratio) in the emulsion layer coating solution to 0.3 / 1 was cut into a size of 50 mm × 50 mm, and the film was made of absorbent cotton that had absorbed ethanol. A conductive film obtained by lightly wiping the entire surface 2 to 3 times to dry was used as the product of the present invention. In addition, the temporary support itself described in Preparation Example 1 was cut to a size of 50 mm × 50 mm, and the entire surface of the film was lightly wiped 2-3 times with an absorbent cotton that had absorbed ethanol, which was then used as a comparative product. .
As test bacterial species, Staphylococcus aureus subsp. Aureus NBRC 12732 strain and Escherichia coli NBRC 3972 strain were used, and bacterial solutions cultured at a concentration of 4 × 10 5 CFU / mL were prepared. 0.4 mL of each of these bacterial solutions was inoculated on the conductive layer side of the present invention and one side of the comparative product, cultured at 35 ° C., and the viable cell count (CFU / mL) was examined.
The results are shown in Table 2 below.
上記表２の結果から、本発明品が優れた抗菌活性を示すことがわかった。 From the results of Table 2 above, it was found that the product of the present invention exhibits excellent antibacterial activity.
さらに、本発明品の抗菌活性を下記式により与えられる値を抗菌活性値として評価した。抗菌活性値が高いほど、抗菌作用が強い。 Further, the antibacterial activity of the product of the present invention was evaluated as the antibacterial activity value given by the following formula. The higher the antibacterial activity value, the stronger the antibacterial action.
Ｒ＝（Ｕｔ−Ｕ０）−（Ａｔ−Ｕ０）＝Ｕｔ−Ａｔ
Ｒ：抗菌活性値
Ｕ０：比較品への菌の接種直後の生菌数（／ｃｍ２）の対数値の平均値
Ｕｔ：比較品への菌の接種後２４時間経過した後の生菌数（／ｃｍ２）の対数値の平均値
Ａｔ：本発明品への菌の接種後２４時間経過した後の生菌数（／ｃｍ２）の対数値の平均値
R = (U t −U 0 ) − (A t −U 0 ) = U t −A t
R: antibacterial activity value U 0 : average value of logarithmic value of viable cell count (/ cm 2 ) immediately after inoculation of bacteria to comparative product U t : viable bacteria after 24 hours from inoculation of bacteria to comparative product number (/ cm 2) mean value a t of the logarithm: viable cell number after 24 hours after inoculation of bacteria to the present invention product (/ cm 2) of the to-average value of a number
抗菌活性値の結果を下記表３に示す。 The results of antibacterial activity values are shown in Table 3 below.
一般に抗菌活性値が２以上であると、明らかな抗菌効果があると判断できるが、本発明品の抗菌活性値は２を大きく超えていた。本発明の製造方法において基材に転写される導電層は、導電層に占める金属銀部領域の割合が非常に小さくても、抗菌性に優れることがわかった。したがって、本発明の製造方法により製造される導電性基材は、抗菌性に優れることが示された。 In general, when the antibacterial activity value is 2 or more, it can be judged that there is a clear antibacterial effect, but the antibacterial activity value of the product of the present invention greatly exceeded 2. It has been found that the conductive layer transferred to the substrate in the production method of the present invention is excellent in antibacterial properties even if the proportion of the metallic silver portion region in the conductive layer is very small. Therefore, it was shown that the electroconductive base material manufactured by the manufacturing method of this invention is excellent in antibacterial property.
試験例３ 導電性基材の成形
上記調製例１において、乳剤層塗布液中のラテックス／ゼラチン（質量比）を０．３／１として調製したものを上記試験例１に記載の方法で基材に転写して得た導電性基材を、３０ｍｍ×１００ｍｍサイズにカットし、テンシロン万能試験機ＲＴＦシリーズ（エーアンドデイ社製）にセットして下記の条件下で長軸方向に引張延伸した。得られた導電性基材の評価結果を下記表４に示す。
なお、表４における延伸率（％）は、延伸前の長軸方向のメッシュピッチを１００％としたときの延伸後の当該長軸方向のメッシュピッチである。メッシュピッチはマイクロスコープで測定した。
また、金属銀部の破断の有無は、マイクロスコープによる観察により評価した。
また、表面抵抗率は、上記と同様に測定した。
Test Example 3 Molding of Conductive Substrate In Preparation Example 1, the latex / gelatin (mass ratio) in the emulsion layer coating solution prepared at 0.3 / 1 was prepared by the method described in Test Example 1 above. The conductive base material obtained by transferring the material was cut into a size of 30 mm × 100 mm, set in a Tensilon universal testing machine RTF series (manufactured by A & D), and stretched in the major axis direction under the following conditions. The evaluation results of the obtained conductive substrate are shown in Table 4 below.
In addition, the stretch rate (%) in Table 4 is the mesh pitch in the major axis direction after stretching when the mesh pitch in the major axis direction before stretching is 100%. The mesh pitch was measured with a microscope.
Moreover, the presence or absence of the fracture | rupture of a metallic silver part was evaluated by observation with a microscope.
The surface resistivity was measured in the same manner as described above.
表４の結果から、本発明の製造方法で得られた導電性基材は、高度に延伸しても金属銀部の破断が生じにくく低い表面抵抗率を示し、導電性に優れることがわかった。また、延伸された導電性基材は、導電層と基材との密着性が維持されていた。 From the results of Table 4, it was found that the conductive base material obtained by the production method of the present invention is less likely to break the metallic silver part even when highly stretched, exhibits a low surface resistivity, and is excellent in conductivity. . In addition, the stretched conductive base material maintained the adhesion between the conductive layer and the base material.
１０：導電性フイルム
１１：導電層
１２：仮支持体
２１：粘着層
２２：基材（被転写体）
10: Conductive film 11: Conductive layer 12: Temporary support 21: Adhesive layer 22: Base material (transfer object)
Claims (16)
該金属銀部は、ハロゲン化銀、バインダーおよびラテックスを含有し、かつ該ラテックスと該バインダーの質量比（ラテックス／バインダー）が０．２／１以上である銀塩含有乳剤層を露光し、現像処理することによって形成されたものであり、
該導電性フイルムと該基材とを、該導電性フイルムの該仮支持体が外側となるように張り合わせる工程、及び
該導電層から該仮支持体を剥離する工程
を含む、製造方法。 In the manufacturing method of the electroconductive base material including transferring this electroconductive layer to a base material from the electroconductive film provided with the temporary support body and the electroconductive film provided in this temporary support body including the metallic silver part. There,
The metallic silver portion is exposed to a silver salt-containing emulsion layer containing silver halide , a binder, and a latex , and a mass ratio of the latex to the binder (latex / binder) of 0.2 / 1 or more. Formed by processing,
A production method comprising the steps of bonding the conductive film and the substrate so that the temporary support of the conductive film is on the outside, and peeling the temporary support from the conductive layer.
該金属銀部は、ハロゲン化銀、バインダーおよびラテックスを含有し、かつ該ラテックスと該バインダーの質量比（ラテックス／バインダー）が０．２／１以上である銀塩含有乳剤層を露光し、現像処理することによって形成されたものであり、
該導電性フイルムと該基材とを、該導電性フイルムの該仮支持体が外側となるように張り合わせる工程、
該導電層と水とを接触させて該導電層を膨潤させ、これにより該仮支持体と該導電層との接着力を低下させる工程、及び
該導電層から該仮支持体を剥離する工程
を含む、製造方法。 In the manufacturing method of the electroconductive base material including transferring this electroconductive layer to a base material from the electroconductive film provided with the temporary support body and the electroconductive film provided in this temporary support body including the metallic silver part. There,
The metallic silver portion is exposed to a silver salt-containing emulsion layer containing silver halide , a binder, and a latex , and a mass ratio of the latex to the binder (latex / binder) of 0.2 / 1 or more. Formed by processing,
Bonding the conductive film and the substrate so that the temporary support of the conductive film is on the outside;
Bringing the conductive layer into contact with water to swell the conductive layer, thereby reducing the adhesive force between the temporary support and the conductive layer; and peeling the temporary support from the conductive layer. A manufacturing method.
該導電層が、バインダーおよびラテックスを含有し、該ラテックスと該バインダーの質量比（ラテックス／バインダー）が０．２／１以上であり、
該導電性フイルムと該基材とを、該導電性フイルムの該仮支持体が外側となるように張り合わせる工程、及び
該導電層から該仮支持体を剥離する工程
を含む、製造方法。
A method for producing a conductive substrate comprising transferring a conductive layer to a substrate from a conductive film comprising a temporary support and a conductive layer including a metal part provided on the temporary support. And
The conductive layer contains a binder and a latex, and the mass ratio of the latex to the binder (latex / binder) is 0.2 / 1 or more,
A production method comprising the steps of bonding the conductive film and the substrate so that the temporary support of the conductive film is on the outside, and peeling the temporary support from the conductive layer.
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |