JP2019109720A - Method for manufacturing conductive sheet for touch panel - Google Patents

Abstract

To provide a conductive sheet for a touch panel which is excellent in the conductivity of a thin metal wire and can acquire a touch panel which makes a screen difficult to be whitish, in other words, makes the screen look more blackish when a screen display is black or when a backlight is turned off.SOLUTION: A method for manufacturing a conductive sheet for a touch panel having a substrate and thin metal wires arranged on the substrate includes: a step A for forming a composition layer containing metal containing particles on the substrate; a step B for performing processing for inhibiting the metal containing particles from being mutually fused to the composition layer; and a step C for heating the processed composition layer, or irradiating the processed composition layer with light to form thin metal wires in this order.SELECTED DRAWING: None

Description

  The present invention relates to a method of manufacturing a conductive sheet for a touch panel.

  In recent years, smart phones, tablet terminals, portable game devices and the like are equipped with a touch panel having an image display device and a capacitive touch sensor arranged on the image display device and capable of multipoint detection. Is increasing. As the conductive sheet for a touch panel used in the manufacture of such a touch panel, one in which metal thin wires are arranged on a transparent base material is known. Further, a silver halide-containing photosensitive material comprising silver halide, gelatin and a polymer different from gelatin, wherein the mass ratio (Y / X) of gelatin mass X to polymer mass Y (Y / X) is 0.1 or more Forming a conductive layer, Step B of forming a conductive portion comprising a metal fine wire containing metallic silver and gelatin after developing and exposing a silver halide-containing photosensitive layer, and Step B A method for producing a conductive sheet, comprising: a step C of heat-treating the support having the conductive portion; and a step D of treating the support having the conductive portion with a proteolytic enzyme that degrades gelatin. Described and patented 2) “print a coating liquid containing metal or metal oxide fine particles in a pattern on a transparent substrate to form a printing layer, and bake the printing layer to form a patterned metal particle sintered film "The manufacturing method of the conductive substrate to form" is described.

JP, 2014-209332, A JP, 2010-219076, A

The present inventors applied the conductive substrate manufactured by the manufacturing method described in Patent Document 1 and the conductive sheet manufactured by the manufacturing method described in Patent Document 2 to a touch panel, and the screen display was black. Or, it was found that when the backlight is off, the screen may appear white.
Therefore, according to the present invention, a touch panel which is excellent in the conductivity of metal thin wires, and in which the screen is not easily whitened in other words, when the screen display is black or when the backlight is extinguished An object of the invention is to provide a conductive sheet for

  MEANS TO SOLVE THE PROBLEM The present inventors discovered that the said subject was achieved by the following structures, as a result of earnestly examining in order to achieve the said subject.

[1] A method for producing a conductive sheet for a touch panel, having a substrate and fine metal wires disposed on the substrate, wherein the step A of forming a composition layer containing metal-containing particles on the substrate And B, the composition layer is treated to inhibit the metal-containing particles from being fused to each other, and the composition layer after the treatment is heated, or the composition layer after the treatment is irradiated with light. And the process C of forming a metal fine wire, and the manufacturing method of the electroconductive sheet for touch panels which has this order.
[2] The production of the conductive sheet for a touch panel according to [1], wherein the treatment is a treatment in which the composition layer is brought into contact with a solution containing a metal adsorbing substituent or a compound having a metal adsorbing structure. Method.
[3] The metal adsorptive substituent is at least one selected from the group consisting of a carboxyl group or a salt thereof, an acid amide group, an amino group, an imidazole group, a pyrazole group, a thiol group, a thioether group, and a disulfide group The manufacturing method of the electroconductive sheet for touch panels as described in [2] which exists.
[4] The method for producing a conductive sheet for a touch panel according to [2] or [3], wherein the compound contains two or more thiol groups.
[5] The method for producing a conductive sheet for a touch panel according to any one of [2] to [4], wherein the compound has at least one selected from the group consisting of a pyrimidine ring and a triazine ring.
[6] The conductive sheet for a touch panel according to any one of [1] to [5], further comprising a step b of smoothing the composition layer after the step A and before the step B. Production method.
[7] The method for producing a conductive sheet for a touch panel according to [6], wherein the step b is a calendering step of passing the substrate having the composition layer under pressure between at least a pair of rolls.
[8] The composition layer further contains a binder, and after step A, before step b, further comprising a step a of removing the binder from the composition layer, [6] or [7] ] The manufacturing method of the electroconductive sheet for touchscreens as described in these.
[9] Step A forms a silver halide-containing photosensitive layer containing silver halide and a binder on a substrate, exposes the silver halide-containing photosensitive layer, develops it, The manufacturing method of the conductive sheet for touch panels in any one of [1]-[8] which is a process of forming the composition layer containing silver and a binder.
[10] The method for producing a conductive sheet for a touch panel according to [9], wherein the binder contains gelatin.
[11] The conductive sheet for a touch panel according to any one of [1] to [10], wherein the method of heating the composition layer in step C is a method of heating the composition layer using superheated steam. Production method.
[12] In the step C, the method for irradiating the composition layer with light is a method for irradiating the composition layer with pulsed light from a xenon flash lamp, for the touch panel according to any one of [1] to [11] Method of manufacturing a conductive sheet

  According to the present invention, the conductivity of the fine metal wire is excellent, and the screen is less likely to be white, in other words, it looks more black (hereinafter simply referred to as “black” when the screen display is black or the backlight is off). It is possible to provide a conductive sheet for a touch panel from which a touch panel can be obtained.

It is a cross-sectional schematic diagram showing one form of the conductive sheet for touch panels. It is a partial top view which shows one form of the electroconductive part formed of a metal fine wire. It is a cross-sectional schematic diagram showing one form of the conductive sheet for touch panels. It is process drawing which shows the manufacturing method which concerns on 1st Embodiment of this invention. It is process drawing which shows the manufacturing method which concerns on 1st Embodiment of this invention. It is process drawing which shows the manufacturing method which concerns on 1st Embodiment of this invention.

Hereinafter, the present invention will be described in detail.
The description of the configuration requirements described below may be made based on the representative embodiments of the present invention, but the present invention is not limited to such embodiments.
In addition, in this specification, the numerical range represented using "-" means the range which includes the numerical value described before and after "-" as a lower limit and an upper limit.

[Method of manufacturing conductive sheet for touch panel]
The conductive sheet for a touch panel manufactured by the method of manufacturing a conductive sheet for a touch panel according to an embodiment of the present invention has a base and fine metal wires disposed on the base. When such a touch panel conductive sheet is applied to a touch panel, the screen is black when the screen display is black or when the backlight is off (hereinafter, also simply referred to as “black display”). I have been keenly examining the causes that appear white. As a result, in the case of a black display, the external light is often relatively stronger than the light emitted from the inside of the touch panel, and in such a case, the thin metal wire of the touch panel reflects the external light , I noticed that the screen looks white.

  In the production of a conductive sheet for a touch panel, a composition layer containing metal-containing particles is formed on a substrate (corresponding to step A described later), this composition layer is heated, or this composition is In general, the metal-containing particles are fused to each other by light irradiation to the layer (corresponding to step C described later) to form a metal fine wire. In this case, it is presumed that when the metal-containing particles to be formed are fused to each other, a smoother surface is formed, whereby external light is likely to be reflected.

The method for producing a conductive sheet for a touch panel according to the present invention has a step B of performing a process of inhibiting fusion between a plurality of metal-containing particles with respect to the composition layer between the step A and the step C. Therefore, it is presumed that the metal fine wire formed in the step C is difficult to reflect external light and easy to absorb external light because the surface is not smoother while maintaining lower electrical resistivity. Therefore, it is presumed that a touch panel with more blackness can be obtained.
Below, the manufacturing method of the electroconductive sheet for touchscreens of this invention is explained in full detail for every embodiment.

First Embodiment
The method for manufacturing a conductive sheet for a touch panel according to the first embodiment of the present invention has the following steps in this order.
After forming a silver halide-containing photosensitive layer containing a silver halide, a binder and a solvent (which will be described later if necessary) on a substrate, and exposing the silver halide-containing photosensitive layer, development is carried out A step of processing to form a composition layer containing metallic silver and a binder (corresponding to step A).
A step of subjecting the composition layer to a treatment that inhibits the metal-containing particles from adhering to each other (this corresponds to step B).
A step of heating the composition layer after treatment or irradiating the composition layer after treatment with light to form a metal fine wire (corresponding to step C).

  Before describing each process in detail, the conductive sheet for a touch panel manufactured by the method for manufacturing a conductive sheet for a touch panel according to the above embodiment will be described.

<Configuration of Conductive Sheet for Touch Panel>
FIG. 1 is a schematic cross-sectional view of an embodiment of a conductive sheet for a touch panel. The touch panel conductive sheet 10 includes a base 12 and a conductive portion 16 formed of a plurality of thin metal wires 14.
Below, each layer which comprises the electroconductive sheet 10 for touchscreens is explained in full detail.

(Base material)
The substrate is not particularly limited, and known substrates can be used. Among them, a transparent substrate is preferable, and a plastic film is more preferable.
Specific examples of the material constituting the substrate include polyethylene terephthalate (258 ° C.), polycycloolefin (134 ° C.), polycarbonate (250 ° C.), acrylic resin (128 ° C.), polyethylene naphthalate (269 ° C.), polyethylene ( Melting points such as 135 ° C), polypropylene (163 ° C), polystyrene (230 ° C), polyvinyl chloride (180 ° C), polyvinylidene chloride (212 ° C), and triacetylcellulose (290 ° C) at about 290 ° C or less Certain plastic films are preferred, and polyethylene terephthalate, polycycloolefin or polycarbonate is more preferred. In addition, the numerical value in () is melting | fusing point. The total light transmittance of the substrate is preferably 85% to 100%.
The thickness of the substrate is not particularly limited, but generally 25 to 500 μm is preferable. In addition, when serving also the function of a touch surface other than the function of a base material (namely, when arrange | positioned at the outermost surface of a touch panel), it is also preferable to design by the thickness exceeding 500 micrometers.

The substrate is preferably a treated substrate which has been subjected to at least one treatment selected from the group consisting of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet radiation treatment, and the atmospheric pressure plasma treated substrate is more preferred. preferable.
Since the treated substrate has a substituent such as a hydroxy group on the surface, adhesion to the composition layer described later and metal thin lines described later is further improved.
Further, the shape of the substrate is not particularly limited. It may be flat or three-dimensional having a curved surface.

The substrate may be a substrate with a subbing layer having on the surface a subbing layer containing a polymer different from the below-described gelatin (hereinafter also referred to as “specific polymer”). By forming a photosensitive layer to be described later on the undercoat layer, the adhesion between the substrate, the composition layer to be described later, and the metal thin line to be described later is further improved.
Although the formation method in particular of undercoat is not restrict | limited, For example, the composition for undercoat formation containing specific polymer is apply | coated on a base material, and the method of heat-processing as needed is mentioned. The composition for forming a subbing layer may contain a solvent. The type of solvent is not particularly limited, and examples thereof include solvents used in the composition for forming a photosensitive layer described later. Moreover, you may use the latex containing the microparticles | fine-particles of the polymer mentioned later as a composition for undercoat layer formation containing specific polymer.
The thickness of the undercoat layer is not particularly limited, but is preferably 0.02 to 0.3 μm from the viewpoint of further improving the adhesion between the substrate and the composition layer described later and metal fine wires described later.
The undercoat layer is not particularly limited, and a suitable application example of the first adhesive layer described in, for example, JP 2008-208310 A can be suitably used.

The refractive index of the undercoat layer is not particularly limited, but in general, 1.40 to 1.75 is preferable, and 1.50 to 1.65 is more preferable.
The magnitude relationship between the refractive index of the undercoat layer, the substrate, and the binder portion in the conductive layer described later is not particularly limited, but the refractive index of the undercoat layer is not less than the refractive index of the substrate, and the refractive index of the undercoat layer is The refractive index of the binder portion in the conductive layer to be described later or less, or the refractive index of the undercoat layer is not more than the refractive index of the base material, and the refractive index of the undercoat layer is the refractive index of the binder portion in the conductive layer described later It is preferable that it is more than.

In other words, the above relationship is as follows.
· Preferred embodiment (refractive index of base material) ((refractive index of undercoat layer) ((refractive index of binder part in conductive layer)
(Refractive index of base material) ≧ (refractive index of undercoat layer) ≧ (refractive index of binder portion in conductive layer)

The above relationship is satisfied even when the laminate according to the embodiment of the present invention has a substrate, an undercoat layer, and a layer other than the conductive layer (for example, an antihalation layer to be described later). preferable. That is, it is preferable that the following relationship be satisfied.
(Refractive index of base material) ≦ (refractive index of undercoat layer) ≦ (refractive index of antihalation layer) ≦ (refractive index of binder portion in conductive layer)
(Refractive index of base material) ≧ (refractive index of undercoat layer) ≧ (refractive index of antihalation layer) ≧ (refractive index of binder portion in conductive layer)

  When the refractive index of the binder layer in the undercoat layer, the substrate, and the conductive layer described later has the above relationship, the conductive property described later when the screen display is black or when the backlight is extinguished The reflection of external light in the binder portion in the layer is further suppressed, and as a result, it is preferable in that the screen is less likely to be white. The refractive index of each layer can be measured by the method described in the examples.

  Further, in the above laminate, although the absolute value of the difference in refractive index between adjacent layers is not particularly limited, the refractive index between adjacent layers can be obtained in that a laminate having more excellent effects of the present invention can be obtained. It is preferable that the absolute value of the difference of is smaller. By adjusting the absolute value of the difference in refractive index between adjacent layers to a smaller value, reflection of external light from the opening (nonconductive part) of the conductive layer can be further suppressed.

The thickness of the undercoat layer is not particularly limited, but is preferably 0.010 to 0.200 μm, and more preferably 0.070 to 0.150 μm.
The composition for forming the undercoat layer is not particularly limited, and a composition containing a known polymer or the like can be used. Examples of the polymer include polyester resins, acrylic resins, and urethane resins. As a composition for forming the undercoat layer, a mixture having both a resin having a chemical structure similar to that of the resin component constituting the base and a resin having a chemical structure similar to that of the resin component constituting the conductive layer described later For example, since desired refractive index adjustment becomes easy, it can be used suitably.
Further, as a method of adjusting the refractive index, a method of adding inorganic fine particles can also be used. Specific examples of the inorganic fine particles include titanium oxide, titanium nitride, aluminum oxide, aluminum nitride, zirconium oxide, magnesium fluoride and the like. The particle diameter of the inorganic fine particles is preferably 0.5 μm or less, more preferably 0.1 μm or less, and particularly preferably 0.05 μm or less from the viewpoint of suppressing an increase in haze (cloudiness) accompanying light scattering.

(Conductive part)
A conductive part consists of a metal fine wire provided on the above-mentioned base material, and metal silver (it corresponds to metal content particle) and a binder are contained in a metal fine wire. In addition, in FIG. 1, although the metal fine wire 14 is formed only on one surface of the base material 12, it is not limited to said form, Even if the metal fine wire 14 is arrange | positioned on both surfaces of the base material 12 Good.
Moreover, in FIG. 1, although the number of the thin metal wires 14 in the electroconductive part 16 is four, the number in particular is not restrict | limited.

When using gelatin described later as a binder, the volume ratio (A / B) of metal silver in the metal fine wire to the volume B of volume A and gelatin is not particularly limited, but in general, 0.3 to 10.0 is preferable. . The method of measuring the volume A of metallic silver and the volume B of gelatin is as follows.
The volume of the metallic silver is obtained by first measuring the metallic silver content in the metallic fine wire using fluorescent X-ray measurement, and converting the value into specific gravity. The volume of gelatin is obtained by first measuring the content of gelatin in the metal fine wire using the BCA method (biciconic acid method), and converting the value into specific gravity.

It is preferable that substantially no gelatin is contained on the base 12 (area 18) between the thin metal wires 14 of FIG. The substantial absence of gelatin means that the content of gelatin is less than 0.002 mg / cm ² , preferably 0.001 mg / cm ² or less. The lower limit is not particularly limited, but is preferably 0 mg / cm ² .
In particular, it is preferable that substantially no gelatin is contained on the entire surface of the substrate 12 except the region where the metal thin wires 14 are present.
For example, as shown in FIG. 3, a conductive sheet 100 including a base 12, a conductive portion 16 composed of fine metal wires 14 disposed on the base 12, and a binder portion 22 disposed between the fine metal wires 14. It can be mentioned. By providing the binder portion 22 between the thin metal wires 14, ion migration between the thin metal wires 14 is further suppressed. In the present specification, the conductive part and the binder part may be collectively referred to as a conductive layer.

The line width of the thin metal wire is not particularly limited, but is preferably 30 μm or less. Within the above range, a low resistance electrode can be formed more easily.
When the thin metal wire is applied as a peripheral wiring (leadout wiring) in the conductive sheet for a touch panel, the width of the thin metal wire is preferably 500 μm or less, more preferably 50 μm or less, and still more preferably 30 μm or less. Within the above range, a low resistance touch panel electrode can be formed more easily.
Although the thickness in particular of a metal fine wire is not restrict | limited, 0.0001-0.2 mm is preferable. Within the above range, an electrode having lower resistance and superior durability can be formed more easily.

  There are no particular limitations on the pattern of the conductive portion made of metal fine wires, and triangles such as regular triangles, isosceles triangles, and right triangles; squares such as squares, rectangles, rhombuses, parallelograms, and trapezoids; It is preferable that it is a polygon and a (positive) n-gon such as a (positive) octagon; a geometric figure combining a circle, an ellipse, a star and the like; It is more preferable that By mesh-like, as shown in FIG. 2, it is intended a shape including a plurality of square grids 20 constituted by intersecting metal thin wires 14.

The length Pa of one side of the grating 20 is not particularly limited, but is preferably 10 to 500 μm. When the side length of the unit cell is in the above range, the transparency can also be kept excellent, and when the conductive sheet for a touch panel is mounted on the front of the display, the display can be visually recognized without discomfort can do.
From the viewpoint of visible light transmittance, the aperture ratio of the conductive portion formed of the fine metal wire is preferably 85% or more, more preferably 90% or more, and still more preferably 95% or more. The opening ratio corresponds to the ratio of the area on the substrate excluding the area where the metal thin wire is present to the whole.

  The fine metal wire of the present embodiment contains metallic silver. The fine metal wires may contain metals other than metallic silver (for example, gold, copper, etc.).

The thin metal wire of the present embodiment contains a binder. The binder is not particularly limited, and known binders can be used. Among them, the binder preferably contains a specific polymer in that a conductive sheet for a touch panel having the more excellent effect of the present invention can be obtained.
When a specific polymer is contained in the metal thin wire, the content mass ratio of the content of metal silver to the content of the specific polymer in the metal thin wire (content of metal silver / content of specific polymer) is not particularly limited. 0.3-0.9 are preferable and 0.4-0.7 are more preferable at the point which a metal fine wire has the outstanding strength.

As the specific polymer, a protein-free polymer is preferable. In other words, polymers that are not degraded by proteolytic enzymes are preferred.
More specifically, for example, acrylic resin, styrene resin, vinyl resin, polyolefin resin, polyester resin, polyurethane resin, polyamide resin, polycarbonate resin, polydiene resin, epoxy resin, silicone resin Examples of the resin include at least one resin selected from the group consisting of a resin, a cellulose-based polymer, and a chitosan-based polymer, and a copolymer including monomers constituting the resin. Among them, at least one resin selected from the group consisting of an acrylic resin, a styrene resin, and a polyester resin, or a copolymer made of monomers constituting these resins is preferable.

  The specific polymer may contain a reactive group capable of reacting with the crosslinkable group in the crosslinker described later. The type of reactive group is not particularly limited as long as it can react with the crosslinkable group, and examples thereof include a hydroxyl group, an isocyanate group, a carboxylic acid group, a carboxylic acid anhydride group, an epoxy group, an amino group, and a halogenated alkyl group Can be mentioned.

  Specific examples of the specific polymer include, for example, the polymers described in paragraphs 0028 to 0047 of JP-A-2014-209332, the contents of which are incorporated herein.

  In addition, although each process which concerns on the said embodiment is demonstrated below, in the meaning of each process which concerns on 1st Embodiment, the description of "-1" is attached | subjected to the symbol showing each process. For example, the term “step A-1” is to be read as “step A according to the first embodiment”. The above-mentioned notation is the same also in explanation of each process concerning a 2nd embodiment mentioned below.

  Further, the binder preferably contains gelatin. The gelatin is not particularly limited, and lime-processed gelatin and acid-processed gelatin can be used, and a hydrolyzate of gelatin, an enzyme-degraded product of gelatin, and a gelatin modified with an amino group or a carboxyl group (phthalated gelatin , Acetylated gelatin) can also be used.

<Step A-1: Composition Layer Forming Step>
Step A-1 forms a silver halide-containing photosensitive layer containing a silver halide, a binder and, optionally, a solvent, on a substrate, and exposes the silver halide-containing photosensitive layer Then, development is carried out to form a composition layer containing metallic silver and a binder (and, if necessary, a solvent). In this step, a photosensitive layer-attached substrate having a silver halide-containing photosensitive layer disposed on the substrate is obtained.
The components of the binder are not particularly limited, but it is preferable to contain gelatin and the specific polymer described above, and in the following, the case of containing gelatin and the specific polymer as a binder will be described as a typical example.

  More specifically, as shown in FIG. 4, the present step is, as shown in FIG. 4, silver halide 24 (for example, silver bromide particles, silver chlorobromide particles, and silver iodobromide particles) and gelatin on the substrate 12 And forming a silver halide-containing photosensitive layer 26 containing a specific polymer (note that both gelatin and the specific polymer correspond to a binder). In FIGS. 4 and 5, although the silver halide 24 is shown in the form of grains, it is exaggerated for the purpose of helping the understanding of the present invention. It does not accurately reflect the amount etc. Hereinafter, the silver halide-containing photosensitive layer is also simply referred to as a photosensitive layer.

The method for forming the silver halide-containing photosensitive layer is not particularly limited on the substrate (as the substrate, which has already been described as the substrate of the conductive sheet for touch panel), and known methods may be used. it can. Among them, a method of applying a photosensitive layer-forming composition to be described later on a substrate and drying it as necessary, since the silver halide-containing photosensitive layer can be more easily formed on the substrate It can be mentioned.
In addition, as a method of forming a silver halide containing photosensitive layer on a base material, the die coating system is preferable, for example. Examples of the die coating method include a slide coating method, an extrusion coating method, and a curtain coating method.

  Also, in this step, after the silver halide-containing photosensitive layer is formed on the base material, a protection (for example, gelatin and a specific polymer) is further contained on the silver halide-containing photosensitive layer. Preferably, the method further comprises the step of forming a layer. By forming the protective layer, the scratch resistance performance and mechanical properties of the silver halide-containing photosensitive layer are improved.

  The method of forming the protective layer is not particularly limited, but a method of forming a silver halide-containing photosensitive layer using a composition for forming a protective layer containing a binder (for example, gelatin and a specific polymer), etc. It can be mentioned. More specifically, a method of forming a protective layer by applying a composition for forming a protective layer on a silver halide-containing photosensitive layer, a composition for forming a silver halide-containing photosensitive layer, and a protective layer It may be formed by simultaneous multilayer coating with a forming composition.

The thickness of the protective layer is not particularly limited, but generally, 0.03 to 0.3 μm is preferable. The protective layer may contain other materials other than the above-described materials, as needed. For example, other materials which may be contained in the silver halide-containing photosensitive layer described later (for example, an antistatic agent, a surfactant, an antifoggant, a hardener, and an anti-black pot agent etc.) may be mentioned. Be
The protective layer preferably contains, similarly to the silver halide-containing photosensitive layer, a crosslinking agent used to crosslink the polymers with each other.

After the silver halide-containing photosensitive layer formed by the above method is exposed (FIG. 5), development is performed to form a composition layer containing metallic silver and a binder on the substrate. In addition, it is preferable that exposure is implemented in pattern shape, and the composition layer containing metallic silver is formed in an exposure part. On the other hand, in the unexposed area, silver halide is eluted by development processing described later, and a layer containing a binder (nonconductive layer) is formed. The nonconductive layer is substantially free of metallic silver.
More specifically, as shown in FIG. 5, the silver halide-containing photosensitive layer 26 is exposed. That is, light is irradiated to the silver halide-containing photosensitive layer 26 through a mask pattern corresponding to a predetermined exposure pattern. Alternatively, the silver halide-containing photosensitive layer 26 is exposed to a predetermined exposure pattern by digital writing exposure to the silver halide-containing photosensitive layer 26. When exposed to light energy, the silver halide 24 is photosensitive to form fine silver nuclei which can not be observed with the naked eye called "latent image". Thereafter, development processing is performed to amplify the latent image into a visualized image which can be observed with the naked eye, whereby the composition layer 15 and the nonconductive portion 28 are formed as shown in FIG.

When the silver halide-containing photosensitive layer is patternwise exposed, the silver halide in the silver halide-containing photosensitive layer forms a latent image in the exposed area. The exposed portion is developed to form a composition layer containing metallic silver and a binder. On the other hand, in the unexposed area, silver halide is eluted during development, and as a result, a transparent layer is formed.
The light source for exposure is not particularly limited, and visible light and light such as ultraviolet light or radiation such as X-ray can be used.
The method of pattern exposure is not particularly limited, and may be surface exposure through a photomask or scanning exposure with a laser beam. In addition, the shape in particular of a pattern is not restrict | limited, According to the metal fine wire to form, it adjusts suitably.

The developing method is not particularly limited, and for example, known methods used for silver salt photographic film, printing paper, film for printing plate making, emulsion mask for photomask, etc. can be used.
The developer is not particularly limited, and, for example, PQ (phenidone hydroquinone) developer, MQ (Metol hydroquinone) developer, and MAA (methol ascorbic acid) developer can also be used.
The process may further include a fixing process performed for the purpose of removing and stabilizing the silver halide in the unexposed area. The fixing step is carried out simultaneously with and / or after the development. As a fixing method, a method used for a silver salt photographic film, a printing paper, a film for printing plate making, an emulsion mask for a photomask and the like can be used.
The fixing temperature is preferably 20 to 50 ° C., and more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, and more preferably 7 seconds to 50 seconds.
The composition layer may be further rinsed and / or stabilized.

(Composition for forming photosensitive layer)
The composition for forming a photosensitive layer contains silver halide, a binder (gelatin and a specific polymer), and, if necessary, a solvent. The definitions of gelatin and specific polymer are as described above.

-Silver halide The halogen atom contained in silver halide may be any of a chlorine atom, a bromine atom, an iodine atom and a fluorine atom, or a combination thereof. For example, silver chloride mainly composed of silver chloride, silver bromide or silver iodide is preferred, and further silver halide mainly composed of silver bromide or silver chloride is more preferred. As silver halide, silver chlorobromide, silver iodochlorobromide or silver iodobromide is also preferable. Among them, silver chlorobromide, silver bromide, silver iodochlorobromide, or silver iodobromide is more preferable, and silver chlorobromide or silver iodochlorobromide containing 50 mol% or more of silver chloride is particularly preferable. .
Here, "silver halide mainly composed of silver bromide" refers to silver halide having a molar fraction of 50% or more of bromide ion in the silver halide composition. The silver bromide grains mainly comprising silver bromide may contain iodide ion or chloride ion in addition to bromide ion.

The silver halide is in the form of solid particles, and the average grain size of the silver halide is preferably 0.1 to 1000 nm (1 μm) in sphere equivalent diameter, and more preferably 0.1 to 300 nm, 1 More preferably, it is -200 nm.
The equivalent spherical diameter of silver halide grains is the diameter of a grain having the same volume as that of the spherical shape.

The shape of the silver halide grains is not particularly limited. Examples of the shape include spheres, cubes, flat plates (hexagonal flat plates, triangular flat plates, square flat plates, etc.), octahedrons, tetrahedrons and the like.
In addition, rhodium compounds used for stabilization and / or sensitization of silver halide and metal compounds belonging to group VIII or VIIB such as iridium compounds and palladium compounds are disclosed in JP-A The descriptions in paragraphs 0039 to 0042 of 2009-188360 can be referred to. Further, for chemical sensitization, the technical description in paragraph 0043 of JP-A-2009-188360 can be referred to.

-Solvent It is preferable that the composition for photosensitive layer formation contains a solvent.
As the solvent to be used, for example, water, organic solvents (for example, alcohols such as methanol; ketones such as acetone; amides such as formamide; sulfoxides such as dimethyl sulfoxide; sulfoxides such as dimethyl sulfoxide; esters such as ethyl acetate; ethers Etc.), ionic liquids, or mixed solvents thereof.

-Others The composition for photosensitive layer formation may contain other materials other than the material mentioned above as needed. For example, it is preferable that a cross-linking agent used to cross-link specific polymers is contained. By containing the crosslinking agent, crosslinking between molecules of the specific polymer proceeds, and even when gelatin is decomposed and removed in the process described later, the connection between the metal silver in the metal fine wire is maintained, and as a result, The conductive sheet for a touch panel has more excellent conductive characteristics.

<Step B-1: Inhibition Treatment Step>
Step B-1 is a step of subjecting the composition layer to a treatment that inhibits the metal-containing particles (in this embodiment, metallic silver) from being fused to each other.
In this step, when metal thin wires are formed by step C described later, the fusion between metal silvers is inhibited particularly on the surface of the composition layer, and as a result, the surface of the metal thin wires formed in step C It is presumed that the surface is roughened.

The method of the treatment is not particularly limited, and the composition layer is a gas containing a compound having a metal-adsorptive substituent or a metal-adsorptive structure (hereinafter, these may be collectively referred to as a "metal-adsorptive site"), And / or a method of contacting with a solution is preferred. Among them, a method of contacting the composition layer with a solution containing the above-mentioned compound is preferable.
The method for bringing the solution and the composition layer into contact with each other is not particularly limited, and examples thereof include a method of immersing the composition layer in the solution and a method of applying the solution to the composition layer. More preferred. The method of immersing the composition layer in the solution is preferable because it can be carried out more stably with a simpler device, and if it can be washed after immersion, excess solution can be more easily removed.

  Further, the method of bringing the composition layer into contact with a gas containing a compound having a metal adsorptive site and / or a solution is characterized in that metallic silver is easily adsorbed by the compound on the surface of the composition layer. Have. Thereby, in process C mentioned later, it is more easy to inhibit that metallic silver fuses mutually on the surface of a composition layer. On the other hand, in the inside of the composition layer, the adhesion of metallic silver to each other is relatively unlikely to be inhibited. Therefore, the conductive sheet for a touch panel manufactured by the manufacturing method having the above method can easily obtain metal fine wires that are more difficult to reflect external light while having more excellent conductivity.

  The metal-adsorptive substituent is not particularly limited, but as a metal-adsorbable substituent, a carboxyl group or a salt thereof, an acid amide group can be obtained in that a conductive sheet for a touch panel having a more excellent effect of the present invention can be obtained. And at least one selected from the group consisting of an amino group, an imidazole group, a pyrazole group, a thiol group, a thioether group, and a disulfide group.

The metal adsorptive structure is not particularly limited, but a nitrogen-containing heterocycle is preferable, a 5- or 6-membered azole is preferable, and a 5-membered azole is more preferable.
Examples of the hetero ring include tetrazole ring, triazole ring, imidazole ring, thiadiazole ring, oxadiazole ring, selenadiazole ring, oxazole ring, thiazole ring, benzoxazole ring, benzthiazole ring, benzimidazole ring, pyrimidine ring, Triazaindene ring, tetraazaindene ring, benzoindazole ring, benzotriazole ring, benzoxazole ring, benzothiazole ring, benzothiazole ring, pyridine ring, quinoline ring, piperidine ring, piperazine ring, quinoxaline ring, morpholine ring, and pentaazaindene ring Etc.
These rings may have a substituent, and examples of the substituent include a nitro group, a halogen atom (eg, chlorine atom and bromine atom), a cyano group, and a substituted or unsubstituted alkyl group (eg, Methyl group, ethyl group, propyl group, t-butyl group, and cyanoethyl group, aryl group (eg, phenyl group, 4-methanesulfonamidophenyl group, 4-methylphenyl group, 3,4-diphenyl group) A chlorophenyl group and a naphthyl group), an alkenyl group (eg, an allyl group), an aralkyl group (eg, a benzyl group, a 4-methylbenzyl group, and a phenethyl group), and a sulfonyl group (eg, Each of a methanesulfonyl group, an ethanesulfonyl group, and a p-toluenesulfonyl group), a carbamoyl group (eg, an unsubstituted carbamoyl group, methyl car Moyl group and phenylcarbamoyl group), sulfamoyl group (eg, unsubstituted sulfamoyl group, methylsulfamoyl group and phenylsulfamoyl group), carbonamide group (eg, acetamide group, And each group of benzamide group, sulfonamide group (for example, each group of methane sulfonamide group, benzene sulfonamide group, and p-toluene sulfonamide group), acyloxy group (for example, acetyloxy group, and benzoyl group) Each group of oxy group, sulfonyloxy group (for example, methanesulfonyloxy group), ureido group (for example, each of unsubstituted ureido group, methyl ureido group, ethyl ureido group, and phenyl ureido group), acyl group (for example, For example, acetyl group and benzoyl group), oxycarbo Le group (e.g., methoxycarbonyl group, and each group of phenoxycarbonyl group), a hydroxyl group, and the like. The substituent may be multiply substituted in one ring.

As the above compound, a compound having a nitrogen-containing six-membered ring (nitrogen-containing six-membered ring compound) is preferable, and as the nitrogen-containing six-membered ring compound, a triazine ring, a pyrimidine ring, a pyridine ring, a pyrroline ring, a piperidine ring, a pyridazine ring, Alternatively, compounds having a pyrazine ring are preferable, and compounds having a triazine ring or a pyrimidine ring are more preferable. These nitrogen-containing six-membered ring compounds may have a substituent, and as the substituent, an alkyl group having 1 to 6 carbon atoms (preferably 1 to 3 carbon atoms) or 1 to 6 carbon atoms (preferably 1 to 6 carbon atoms) 3) alkoxy group, hydroxyl group, carboxyl group, mercapto group, alkoxyalkyl group having 1 to 6 (preferably 1 to 3) carbon atoms, and hydroxyalkyl group having 1 to 6 (preferably 1 to 3) carbon atoms It can be mentioned.
Specific examples of the nitrogen-containing six-membered ring compound include triazine, methyl triazine, dimethyl triazine, hydroxyethyl triazine, pyrimidine, 4-methyl pyrimidine, pyridine and pyrroline.

  The above compound may have one type of metal adsorptive site alone or may have two or more types, but it is possible to obtain a conductive sheet for a touch panel having a further excellent effect of the present invention, It is preferable that the said compound has 2 or more types of metal adsorptive site | parts.

  Above all, the compound preferably has two or more metal adsorptive groups in one molecule, and two or more thiols in that a conductive sheet for a touch panel having the further excellent effect of the present invention can be obtained. Compounds having a group are more preferred.

  Moreover, it is also preferable that it is a compound which has at least 1 sort (s) selected from the group which consists of a pyrimidine ring and a triazine ring as another form of the said compound.

One preferred embodiment of the above-mentioned compound is a compound represented by the general formula (1).
General formula (1) (X-L ¹ ) _n -Y- (L ² -Z) _m
X represents a metal adsorbing substituent. Examples of the metal-adsorptive substituent include a carboxyl group or a salt thereof, an acid amide group, an amino group, an imidazole group, a pyrazole group, a thiol group, and an alkyl thioether group. The amino group includes a primary amino group, a secondary amino group, and a tertiary amino group.
Y represents an n + m-valent heterocycle. Specific examples of the heterocycle are as described above. The n + m-valent heterocycle represents a structure in which n + m bonds extend from the corresponding heterocycle. For example, the residue which pulled out n + m hydrogen atoms from the heterocycle is mentioned.
Z represents a substituent other than a metal adsorptive substituent. As said substituent, a hydroxyl group is mentioned, for example.
L ¹ and L ² represent a single bond or a divalent linking group. As a divalent linking group, —S—, —O—, —NR ^x — (wherein R ^x is a hydrogen atom or a hydrocarbon group which may have a hetero atom), a carbonyl group, a hydrocarbon group (for example, , An alkylene group, an alkenylene group, an arylene group), and a group obtained by combining these.
n represents an integer of 1 or more, preferably 1 to 3, more preferably 1 to 2, and still more preferably 2.
m represents an integer of 0 or more, preferably 0 to 2, and more preferably 0.

Although the specific example of the said compound is shown below, as a compound, it is not restrict | limited to the following.

<Step C-1: Heating / Light Irradiation Step>
The step C-1 is a step of heating the composition layer after the treatment of the step B-1 or irradiating the composition layer after the treatment with light to form fine metal wires. In this step, metallic silver (corresponding to metal-containing particles) is fused to each other to form fine metal wires.

When the composition layer after treatment is heated, the method of heating is not particularly limited, and examples thereof include treatment of bringing a substrate on which the composition layer is disposed into contact with superheated steam. The superheated steam may be superheated steam or may be a mixture of the superheated steam and another gas.
The contact time of the superheated steam with the composition layer is preferably 10 to 70 seconds. When the contact time is 10 seconds or more, the effect of improving the conductivity is large. Moreover, it is more preferable at the point of the balance of the improvement of electroconductivity, and economics as it is 70 seconds or less.
Moreover, the supply amount of the superheated steam is preferably in the range of 500 to 600 g / m ³ , and the temperature of the superheated steam is preferably 100 to 160 ° C. (preferably 100 to 120 ° C.) at 1 atm.

  As another method of heat treatment, it is 100 to 200 ° C. (preferably 100 to 150 ° C., more preferably 110 to 130 ° C.) for 1 to 240 minutes (preferably 60 to 150 minutes, more preferably 90 to 120 minutes) The method of heat-processing is mentioned.

  When the composition layer after the treatment is irradiated with light, the method of light irradiation is not particularly limited, but a method of irradiating the composition layer with pulsed light from a xenon flash lamp is preferable. When pulsed light from a xenon flash lamp is irradiated, the metallic silver is easily fused to each other to form a fine metal wire.

Although the irradiation amount of pulse light is not particularly limited, 1 to 1500 J per pulse is preferable, 100 to 1000 J is more preferable, and 500 to 800 J is further preferable. The irradiation dose can be measured using a general ultraviolet luminometer. A common ultraviolet luminometer can use the luminometer which has a detection peak in 300-400 nm, for example.
Although the number of times of irradiation with pulsed light is not particularly limited, it is preferably 1 to 2000 times, and more preferably 1 to 50 times.

<Other process>
The manufacturing method of the conductive sheet for a touch panel concerning the above-mentioned embodiment may have other processes in the range which produces the effect of the present invention. Below, as another process, a smoothing process, a binder removal process, and an undercoat formation process are mentioned, for example.

(Step b-1: smoothing step)
It is preferable that the manufacturing method of this electroconductive sheet for this touch panels has the process of smoothing a composition layer after process A-1 and before process B-1. The adhesiveness to the base material of the metal fine wire obtained by this process is easier to be improved.

Although the method in particular of the smoothing process is not restrict | limited, For example, the calendering process in which the base material which has a composition layer is passed under pressure between at least a pair of rolls is preferable. Hereinafter, the smoothing process using a calender roll is described as a calendar process.
Rolls used for calendering include plastic rolls and metal rolls. A plastic roll is preferred from the viewpoint of preventing wrinkles. The pressure between the rolls is not particularly limited, but generally, 2 MPa or more is preferable, 4 MPa or more is more preferable, and 120 MPa or less is preferable. The pressure between the rolls is measured using a prescale (for high pressure) manufactured by Fujifilm Corporation.
The surface roughness Ra of the roll used for the calendering treatment is preferably 0 to 2.0 μm, and more preferably 0.3 to 1.0 μm, in that the obtained thin metal wire is less visible.

  Although the temperature of the smoothing treatment is not particularly limited, 10 ° C. (without temperature control) to 100 ° C. is preferable, and it varies depending on the pattern density of the conductive portion, shape and binder type, but 10 ° C. (without temperature control) More preferably, it is -50 ° C.

(Step a-1: binder removal step)
It is preferable that the method for producing a conductive sheet for a touch panel further includes a step of removing the binder after the step A-1 and before the step b-1. By removing the binder, the content of metallic silver in the composition layer is relatively increased as a result, and thus, fine metal wires having more excellent conductivity can be obtained.
The binder removal step may be a step of removing the whole of the binder, or a step of removing a part of the binder. Note that removing a part of the binder may be a method of removing a part of the total content of the binder in the composition layer, or the composition layer contains two or more binders. In some cases, methods for removing some types of binders (for example, when the composition contains a specific polymer and gelatin, a step of removing all or part of gelatin only) may be mentioned. In addition to the composition layer, the binder may be removed from the portion other than the composition layer (for example, non-conductive portion) in the binder removal step.

Although the method for removing the binder is not particularly limited, for example, when gelatin is removed from the binder, a method of degrading and removing gelatin using a proteolytic enzyme, and degrading and removing gelatin using a predetermined oxidizing agent Methods are included.
In addition, as a method of decomposing-removing gelatin using a proteolytic enzyme, the method of Unexamined-Japanese-Patent No. 2014-209332, Paragraph 0084-0077 can be employ | adopted, for example.
Moreover, as a method of decomposing-removing gelatin using an oxidizing agent, the method as described in stage 0064-0066 of Unexamined-Japanese-Patent No. 2014-112512 is employable, for example.
Moreover, when removing specific polymer etc., a well-known solvent process etc. are mentioned.

(Undercoat formation process)
The subbing layer forming step is a step of forming a subbing layer on the substrate to obtain a subbing layer-provided substrate prior to step A-1. Although it does not restrict | limit especially as a method to form an undercoat layer on a base material, The method of apply | coating the composition for undercoat layer formation on a base material is mentioned. The form of the composition for forming an undercoat layer is as described above.
In the undercoat layer forming step, the absolute value of the difference in refractive index between the formed undercoat layer and the adjacent other layers (such as the substrate and the binder portion of the conductive layer) is smaller, It is preferable to be adjusted. The method of adjusting the difference in refractive index between the undercoat layer and the other adjacent layer is not particularly limited, but methods of adjusting the type of each component contained in the composition used to form each layer may be mentioned. Be

Second Embodiment
The method for producing a conductive sheet for a touch panel according to the second embodiment of the present invention has the following steps in this order.
A step of applying a composition containing metal-containing particles in a pattern on a substrate to obtain a composition layer (Step A).
A step of subjecting the composition layer to a treatment that inhibits the metal-containing particles from fusing together (Step B).
A step of heating the composition layer after treatment or irradiating the composition layer after treatment with light to form fine metal wires (step C).

<Step A-2>
The method for applying the composition in a pattern on the substrate is not particularly limited, and any known method can be used. Among them, a method of printing the composition on a substrate is preferable in that fine metal thin wires are easily obtained as a result. The printing method is not particularly limited, but gravure printing, flexographic printing, screen printing, or inkjet printing is preferable, and inkjet printing is more preferable.
The composition layer formed on the substrate contains metal-containing particles (and, optionally, one or more selected from the group consisting of a solvent and a binder). Below, each component in a composition layer is explained in full detail.

(Metal-containing particles)
The metal-containing particles may be particles containing one or more metals, and the type of metal is not particularly limited, but gold, silver, platinum, palladium, rhodium, iridium, ruthenium, and osmium, etc. Noble metals; copper, nickel, tin, iron, chromium, aluminum, molybdenum, tungsten, zinc, titanium, and base metals such as lead.
Among them, gold, silver, copper, or nickel is preferable from the viewpoint that the obtained metal fine wire has higher conductivity, and that the metal-containing particles in the composition are less likely to aggregate in step C described later. , Silver or copper is more preferred.
The metals may be used alone or in combination of two or more.

  The metal-containing particles may be a metal atom-containing oxide (metal oxide) or the like. Examples of metal oxides include silver oxide, cuprous oxide, cupric oxide, and mixtures thereof. Among them, oxides of copper (cuprous oxide, cupric oxide or a mixture thereof) are preferable. Note that the metal oxide also includes a form in which the surface of the metal atom is oxidized (the central portion is not oxidized or hardly oxidized), and as the metal-containing particle, the surface is oxidized. Copper is also preferred.

  The method for preparing the metal-containing particles is not particularly limited, but physical methods obtained by grinding metal powder using a mechanochemical method etc .; chemical vapor deposition, vapor deposition, sputtering, thermal plasma, and Chemical dry methods such as laser method; thermal decomposition method, chemical reduction method, electrolysis method, ultrasonic method, laser ablation method, supercritical fluid method, and chemical wet method such as microwave synthesis method; Etc. can be used.

  The metal-containing particles may be coated with a binder such as a water-soluble polymer such as polyvinyl pyrrolidone, a graft copolymer, or the like, a surfactant, or the like.

  The average primary particle diameter of the metal-containing particles is not particularly limited, but a range of 1 to 200 nm is preferable. When the average primary particle diameter is 1 nm or more, the dispersion stability in the composition is good, and the conductivity when forming the conductive pattern is good. On the other hand, when the average primary particle diameter is 200 nm or less, the melting point is maintained low, and higher conductivity can be obtained.

(Other ingredients)
The composition and the composition layer may contain other components other than the metal-containing particles. As another component, a solvent, a binder, etc. are mentioned, for example.

-Solvent The solvent is not particularly limited, and examples thereof include water, an organic solvent, and a mixture thereof.
As an organic solvent, alcohols such as methanol, ethanol, n-propanol, isopropanol, n-butanol, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, and glycerin; and aromatic hydrocarbons such as toluene and xylene Ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone; esters such as methyl acetate, ethyl acetate, propyl acetate, butyl acetate and isobutyl acetate; tetrahydrofuran, dioxane, ethylene glycol monomethyl ether (methyl cellosolve), ethylene Ethers such as glycol monoethyl ether (ethyl cellosolve) and ethylene glycol monobutyl ether (butyl cellosolve); hexane, decane, dode Emissions, and aliphatic hydrocarbons tetradecane; alicyclic hydrocarbons such as cyclohexane; and the like.

Binder The binder is not particularly limited, and known binders can be used. As the binder, gelatin, which has already been described, and a specific polymer can be used. Moreover, polyester resin, acrylic resin, urethane resin, etc. can also be used as a binder.

<Step B-2: Inhibition Treatment Step>
The form of the inhibition processing step of step B-2 is the same as the form described as step B-1 according to the first embodiment, and the description will be omitted.

<Step C-2: Heating / Light Irradiation Step>
It does not restrict | limit especially as a heating process of process C-2, You may carry out on the conditions which metal-containing particle | grain fuse | melts and metal fine wire has desired electrical conductivity. More specifically, the method described as the process C-1 according to the first embodiment can be applied. Further, the heating conditions described on pages 35 to 36 of WO 2002/35554 can also be applied.
Moreover, it is also preferable to heat the composition layer after a process with the surface wave plasma which generate | occur | produces by application of a microwave energy as process C-2. As said method, it describes, for example in Unexamined-Japanese-Patent No.2010-219076, Paragraph 0027-0034, and said description is integrated in this specification.
Moreover, the method of irradiating and heating an electromagnetic wave of 300 MHz-300 GHz to the composition layer after a process is also applicable as another method. The above method is described, for example, in paragraphs 0021 to 0022 of JP-A-2008-243946, and the above description is incorporated in the present specification.

<Other process>
The manufacturing method of the electroconductive sheet for touch panels which concerns on this embodiment may have a smoothing process, a binder removal process, etc. as processes other than the above. In addition, about the form of a smoothing process and a binder removal process, it is as having already demonstrated as process b-1 which concerns on 1st Embodiment, and process a-1.

  Hereinafter, the present invention will be described in more detail based on examples. Materials, amounts used, proportions, treatment contents, treatment procedures and the like shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Accordingly, the scope of the present invention should not be construed as limited by the following examples.

Example 1
[Preparation of silver halide emulsion]
<Formation of particles>
The following solution 1 was prepared and maintained at 30 ° C., pH 4.5. Next, the following two liquids and three liquids are prepared with the following composition and amount, and an amount corresponding to 90% by mass of the total amount of each is simultaneously added to one liquid over 20 minutes while stirring, A mixed solution was obtained. In the mixed solution, core particles having an equivalent sphere diameter of 0.12 μm on average were formed. Next, the following solutions 4 and 5 were added to the mixture over 8 minutes, and the remainder (10% by mass) of solutions 2 and 3 were further added over 2 minutes. At this time, in the mixed solution, the particles had grown to an average of 0.15 μm in equivalent sphere diameter. Next, 0.15 g of potassium iodide was added to the mixture, and the mixture was aged for 5 minutes to complete particle formation. The term "gelatin" as used hereinafter refers to both high molecular weight gelatin and low molecular weight gelatin in one solution.

1 liquid;
Water: 750 ml
・ High molecular weight gelatin (molecular weight is 300,000): 9 g
・ Low molecular weight gelatin (molecular weight is 15,000): 4.5 g
Sodium chloride: 3 g
・ 1,3-dimethyl imidazolidine 2-thione: 20 mg
-Sodium benzenethiosulfonate: 10 mg
Citric acid: 0.7 g

2 liquids;
Water: 300 ml
Silver nitrate: 150 g

3 liquids;
Water: 300 ml
Sodium chloride: 38 g
-Potassium bromide: 32 g
-Potassium hexachloroiridium (III) (The content of potassium hexachloroiridium (III) is 20% by mass, and further 0.005% by mass of KCl): 8 ml
Ammonium hexachlororhodate (the content of ammonium hexachlororhodate is 20% by mass, and further contains 0.001% by mass of NaCl): 10 ml

4 liquids;
Water: 100 ml
Silver nitrate: 50 g

5 liquids;
Water: 100 ml
Sodium chloride: 13 g
-Potassium bromide: 11 g
Yellow blood salt (potassium hexacyanoferrate (II)): 5 mg

<Preparation of emulsion>
Next, the obtained particles were washed with water by a flocculation method according to a conventional method. Specifically, the temperature of the mixture was lowered to 35 ° C. and sulfuric acid was added to lower the pH until the silver halide was precipitated (the range of pH was 3.6 ± 0.2). Next, the supernatant portion (about 3 liters) of the mixed solution was removed (first water washing). Next, 3 liters of distilled water was added to the mixture, and sulfuric acid was further added until the silver halide was precipitated. Next, the supernatant portion (3 liters) of the mixed solution was removed (second water washing). Next, the same operation as the second water washing was repeated once more (third water washing) to obtain an emulsion, and the water washing and desalting step was completed. Next, the pH of the resulting emulsion is adjusted to 6.4 and the pAg to 7.5, and the emulsion is prepared by using 3.9 g of high molecular weight gelatin, 10 mg of sodium benzenethiosulfonate, 3 mg of sodium benzenethiosulfinate, and thio 15 mg of sodium sulfate and 10 mg of chloroauric acid were added, and chemical sensitization was performed at 55 ° C. to obtain optimum sensitivity. Next, 100 mg of 1,3,3a, 7-tetraazaindene as a stabilizer and 100 mg of Proxel (trade name, manufactured by ICI Co., Ltd.) as a preservative were added to the emulsion. The emulsion finally obtained contains 0.08 mol% of silver iodide, and the ratio of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide, and the average particle size is 0.15 μm, It was a silver iodochlorobromide cubic grain emulsion with a variation coefficient of 10%.

Preparation of Coating Solution 1 Containing Silver Halide
In the above emulsion, 1,3,3a, 7-tetraazaindene (1.2 × 10 ⁻⁴ mol / mol Ag), hydroquinone (1.2 × 10 ⁻² mol / mol Ag), citric acid (3.0 × 10 ⁻⁴ mol / mol Ag), 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt (0.90 g / mol Ag) and a trace amount of a hardener added I got Next, the pH of the composition was adjusted to 5.6 using citric acid.
In the above composition, a polymer represented by the following (P-1) (hereinafter referred to as “P-1”) and a dispersant comprising a dialkylphenyl PEO (PEO is an abbreviation of polyethylene oxide) sulfuric acid ester and water Polymer latex containing (ratio of content of dispersant to content of P-1 (dispersant / P-1, unit is g / g) is 2.0 / 100 = 0.02, The solid content is 22% by mass), the mass ratio of the content of P-1 to the content of gelatin in the composition (P-1 / gelatin, unit g / g) is 0.2 The polymer latex-containing composition was obtained by adding it to 1/1. Here, in the polymer latex-containing composition, the content mass ratio R1 of the content of P-1 to the content of silver halide (P-1 / silver halide, unit is g / g) is 0.024. (Note that the above R 1 is the same as in the finally obtained silver halide-containing coating solution 1).

Further, EPOXY RESIN DY 022 (trade name: manufactured by Nagase ChemteX Co., Ltd.) as a crosslinking agent was added to the polymer latex-containing composition to obtain a silver halide-containing coating solution 1. The amount of the crosslinking agent added was adjusted so that the amount of the crosslinking agent in the silver halide-containing photosensitive layer described later was 0.09 g / m ² .
In addition, P-1 was synthesize | combined with reference to the patent 3305459 and the patent 3754745.

[Formation of conductive sheet for touch panel]
The conductive sheet for a touch panel was formed through the following steps.

<Composition Layer Forming Step>
The composition 1 for forming an undercoat layer described later is applied to one surface of a biaxially oriented PET (polyethylene terephthalate) substrate having a thickness of 40 μm so that the film thickness after drying becomes 60 nm, and dried at 90 ° C. for 1 minute , And a substrate with a subbing layer was produced. The thickness of the undercoat layer was measured with an electronic micro thickness gauge manufactured by Anritsu Corporation.

(Composition 1 for forming undercoat layer (composition of curable composition 1))
The composition of the composition 1 for forming an undercoat layer is as follows.
Acrylic polymer: 66.4 parts by mass ("AS-563A", manufactured by Daicel Finechem Co., Ltd., solid content: 27.5% by mass)
Carbodiimide-based crosslinking agent: 16.6 parts by mass ("Carbodilite V-02-L2", manufactured by Nisshinbo Chemical Co., Ltd., solid content: 10% by mass)
Colloidal silica: 4.4 parts by mass ("Snowtex XL" manufactured by Nissan Chemical Industries, Ltd., solid content: 10% by mass, water dilution)
Slip agent: 27.7 parts by mass (Carnauba wax, "Cerosol 524", manufactured by Chukyo Yushi Co., Ltd., solid content: 3% by mass, water dilution)
Anionic surfactant: 23.3 parts by mass ("Lapisol A-90", manufactured by NOF Corporation, solid content: 1 mass%, aqueous solution)
Nonionic surfactant: 14.6 parts by mass ("Naroacty CL 95" manufactured by Sanyo Chemical Industries, Ltd., solid content: 1% by mass, aqueous solution)
Distilled water: 847.0 parts by mass

  Next, on the undercoat layer of the substrate with the undercoat layer, the following composition adjustment coating solution 1, the above silver halide containing coating solution 1, and the composition adjustment coating solution 2 described below are applied in order from the undercoat layer side Simultaneous multilayer coating was carried out with a liquid flow ratio (composition adjustment coating solution 1 / silver halide containing coating solution 1 / composition adjustment coating solution 2) 25/25/1 to form a silver halide containing photosensitive layer on the substrate. This was designated as sheet A.

Composition adjustment coating solution 1 is such that the content mass ratio of the content of P-1 to the content of gelatin (content of P-1 / content of gelatin, unit g / g) is 3/1 It is obtained by adding a dye which is decolorized by an alkali of a developing solution, which has an optical density of about 1.0 and is described later, to a mixed solution of gelatin and a polymer latex.
Further, the concentration of the composition adjusting coating solution 1 was adjusted so that the content (coating amount) of P-1 in the layer formed by the composition adjusting coating solution 1 was 0.65 g / m ² . In addition, since the dye is contained in the layer formed by the composition adjustment coating solution 1, it has an antihalation function.

Composition adjustment coating solution 2 has a gelatin content, a P-1 content, and a content weight ratio of a content of colloidal silica (Snowtex ST-C, manufactured by Nissan Chemical Industries, Ltd.) (P-1). The content of each component / the content of colloidal silica / the content of gelatin, and the unit g / g / g) are each mixed so as to be 0.5 / 1.5 / 1. Further, the concentration of the composition adjustment coating solution 2 was adjusted so that the content of gelatin in the layer formed from the composition adjustment coating solution 2 was 0.10 g / m ² .

In the layer formed of the silver halide-containing coating solution 1, the content of silver is 7.4 g / m ² , the content of P-1 is 0.26 g / m ² , and the content of gelatin is It was 1.02 g / m ² .

(Exposure and development)
A photomask having the following openings is disposed on one side (the silver halide-containing photosensitive layer side) of the sheet A, and exposure is performed using parallel light using a high pressure mercury lamp as a light source through the photomask did. The sheet A after exposure was developed with a developer described below, and was further processed using a fixing solution (trade name: N3X-R for CN16X, manufactured by Fujifilm Corporation). Next, the treated sheet A is rinsed with pure water and dried to contain Ag, a mesh-like composition layer having a line width of 3 μm, a layer containing gelatin and P-1, and ) Was obtained on the substrate (sheet B).

(Photo mask)
The photomask had the following openings 1 to 3.
-Opening 1:
An opening for forming a mesh-like metal thin wire, wherein the line width of the linear opening corresponding to the metal thin line is 1.0 μm, and the pitch (distance) of the linear opening is 300 μm, An opening in which the mesh formed by the lines is square (2 cm square).
The five openings 1 are arranged in one photomask.

・ Opening part 2:
It is an opening for forming a plurality of lead-out wiring, and it is formed such that the lead-out wiring to be formed is electrically connected to the mesh-like metal fine wire formed by the opening 1 at one end thereof An opening formed so that the width of the lead-out wiring to be formed is 10 μm and the interval between the lead-out wirings to be formed is 10 μm.

・ Opening part 3:
-An opening for forming a connection, which is on the side opposite to the side electrically connected to the mesh-like metal thin wire formed by the opening 1 among the lead-out wires formed by the opening 2 An opening for forming a connection (size 0.2 mm × 3 mm) for connecting to a flexible printed wiring board at the end.

(Composition of developer)
The composition of the developer is as follows.
・ Hydroquinone: 0.037 mol / L
N-methylaminophenol: 0.016 mol / L
-Sodium metaborate: 0.140 mol / L
Sodium hydroxide: 0.360 mol / L
-Sodium bromide: 0.031 mol / L
-Potassium metabisulfite: 0.187 mol / L

<Binder removal process>
The sheet B was immersed in an aqueous solution of a proteolytic enzyme (“Bioplase AL-15FG” manufactured by Nagase ChemteX Co., Ltd.) (content of proteolytic enzyme: 0.5 mass%, liquid temperature: 40 ° C.) for 120 seconds. Next, the sheet B after immersion is taken out of the aqueous solution of proteolytic enzyme, immersed in warm water (liquid temperature: 50 ° C.) for 120 seconds, washed, and made of Ag-containing metal fine wire (line width 3 μm). From the mesh and the layer containing gelatin and P-1, a sheet C having a nonconductive part from which gelatin was removed was obtained.

<Smoothing process (calendering process)>
The sheet C was subjected to calendering at a pressure of 30 kN using a calender device comprising a combination of metal rollers and resin rollers. The obtained sheet was called sheet D.

<Inhibition treatment process>
The sheet D was immersed in a 0.3% by weight aqueous solution of compound A at 30 ° C. for 120 seconds, washed with running water for 90 seconds, and dried at 65 ° C. for 15 minutes to give a sheet E.
(Compound A)

<Heating / light irradiation process>
The sheet E was heated by passing it through a 150 ° C. superheated steam tank for 120 seconds. The obtained sheet was called sheet F.

(Comparative Example 1: Preparation of Conductive Sheet for Touch Panel)
A sheet G was produced in the same manner as the sheet F except that the inhibition treatment step was not performed.

(Comparative Example 2: Preparation of Conductive Sheet for Touch Panel)
Copper nanoparticle toluene dispersion (manufactured by ULVAC Materials, Inc. (copper nanoparticle toluene dispersion with an average primary particle diameter of 5 nm, solid content 30 mass%), polyethylene terephthalate (PET) sheet with a thickness of 100 μm (Toray Industries, Ltd.) Manufactured by “Lumirror T60”, total light transmittance: 89%, glass transition temperature: 110 ° C., melting point: 260 ° C., width 2 mm by inkjet printing (using “DMP-2831” manufactured by FUJIFILM Dimatix Co., Ltd.) An electrode pattern consisting of lines was drawn. Next, the solvent component was dried and heated at 130 ° C. for 30 minutes to remove the organic matter, to form a print layer, and a sheet with a print layer was obtained.
Next, the sheet with the print layer was fired using an electric furnace (manufactured by Nemus Corporation) to obtain a sheet H. As a specific method of baking, the temperature was raised to 180 ° C. at 10 ° C./min in a reducing atmosphere of 4% hydrogen and 96% argon, and then held for 60 minutes, and then naturally cooled.

Example 2
In place of “composition 1 for forming an undercoat layer (curable composition 1)” used when preparing a substrate with an undercoat layer in the composition layer forming step of Example 1, for forming an undercoat layer described later Composition 2 (curable composition 2) was coated on a substrate such that the film thickness after drying was 110 nm, and dried at 90 ° C. for 1 minute to produce a substrate with a subbing layer A sheet I was produced in the same manner as in Example 1.

  The sheet I has a base material, an undercoat layer, a layer (hereinafter also referred to as an “antihalation layer”) formed by the composition adjustment coating solution 1, and a binder portion in the conductive layer in the following order: 1.64, 1.57, 1 It had a refractive index of .49 and 1.49. The refractive index of the substrate is measured using an Abbe refractometer (Abgo refractometer manufactured by Atago Co., Ltd.) using a light source as a sodium lamp (Na-D line) and a mounting solution using methylene iodide at 23 ° C., relative humidity Under 65%, the refractive index of the substrate (two orthogonal directions, or the longitudinal direction and the width direction were measured, and the average value of those values) was measured. The refractive index of each layer produced the dry film of each layer independently for measurement, and was measured with an Abbe refractometer like the base material.

  When the refractive index of the sheet F is evaluated by the same method as described above, the order of 1.64, 1.49, 1.49, and 1. in the order of the base material, the undercoat layer, the antihalation layer, and the binder portion in the conductive layer. It had a refractive index of 49.

(Composition 2 for forming undercoat layer (Curable Composition 2))
The composition of the composition 2 for forming an undercoat layer is as follows.
Acrylic polymer: 31.6 parts by mass ("AS-563A", manufactured by Daicel Finechem Co., Ltd., solid content: 27.5% by mass)
-Polyester-based polymer: 34.8 parts by mass ("Plus Coat Z-592", manufactured by HALO Chemical Industry Co., Ltd., solid content: 25.0% by mass)
Carbodiimide-based crosslinking agent: 16.6 parts by mass ("Carbodilite V-02-L2", manufactured by Nisshinbo Chemical Co., Ltd., solid content: 10% by mass)
Colloidal silica: 4.4 parts by mass ("Snowtex XL" manufactured by Nissan Chemical Industries, Ltd., solid content: 10% by mass, water dilution)
Slip agent: 27.7 parts by mass (Carnauba wax, "Cerosol 524", manufactured by Chukyo Yushi Co., Ltd., solid content: 3% by mass, water dilution)
Anionic surfactant: 23.3 parts by mass ("Lapisol A-90", manufactured by NOF Corporation, solid content: 1 mass%, aqueous solution)
Nonionic surfactant: 14.6 parts by mass ("Naroacty CL 95" manufactured by Sanyo Chemical Industries, Ltd., solid content: 1% by mass, aqueous solution)
Distilled water: 847.0 parts by mass

[Example 3]
In place of “composition 1 for forming an undercoat layer (curable composition 1)” used when preparing a substrate with an undercoat layer in the composition layer forming step of Example 1, for forming an undercoat layer described later Composition 3 (Curable Composition 3) was coated on a substrate such that the film thickness after drying was 110 nm, and dried at 90 ° C. for 1 minute to produce a substrate with a subbing layer A sheet J was produced in the same manner as in Example 1.

  The sheet J had a refractive index of 1.64, 1.57, 1.49, 1.49 in the order of the base material, the undercoat layer, the antihalation layer, and the binder portion in the conductive layer.

(Composition 3 for forming undercoat layer (composition of curable composition 3))
The composition of the composition 3 for forming an undercoat layer is as follows.
Acrylic polymer: 35.3 parts by mass ("AS-563A", manufactured by Daicel Finechem Co., Ltd., solid content: 27.5% by mass)
Polyester-based polymer: 26.6 parts by mass
("Plus Coat Z-592", manufactured by Yuka Chemical Industry Co., Ltd., solid content: 25.0% by mass)
Carbodiimide-based crosslinking agent: 16.6 parts by mass ("Carbodilite V-02-L2", manufactured by Nisshinbo Chemical Co., Ltd., solid content: 10% by mass)
Colloidal silica: 1.6 parts by mass ("Snowtex XL", manufactured by Nissan Chemical Industries, Ltd., solid content: 10% by mass, water dilution)
・ Zirconium oxide dispersion liquid: 21.3 parts by mass (“SZR-CW”, manufactured by Sakai Chemical Industry Co., Ltd., solid content: 30 mass%, water dilution liquid)
Slip agent: 27.7 parts by mass (Carnauba wax, "Cerosol 524", manufactured by Chukyo Yushi Co., Ltd., solid content: 3% by mass, water dilution)
Anionic surfactant: 23.3 parts by mass ("Lapisol A-90", manufactured by NOF Corporation, solid content: 1 mass%, aqueous solution)
Nonionic surfactant: 14.6 parts by mass ("Naroacty CL 95" manufactured by Sanyo Chemical Industries, Ltd., solid content: 1% by mass, aqueous solution)
Distilled water: 833.0 parts by mass

Example 4
In place of “composition 1 for forming an undercoat layer (curable composition 1)” used when preparing a substrate with an undercoat layer in the composition layer forming step of Example 1, for forming an undercoat layer described later Composition 4 (Curable Composition 4) was coated on a substrate such that the film thickness after drying was 120 nm, and dried at 90 ° C. for 1 minute to produce a substrate with a subbing layer A sheet K was produced in the same manner as in Example 1.

  The sheet K had a refractive index of 1.64, 1.55, 1.49, and 1.49 in the order of the base material, the undercoat layer, the antihalation layer, and the binder portion in the conductive layer.

(Composition 4 for forming undercoat layer (composition of curable composition 4))
The composition of the composition 4 for forming an undercoat layer is as follows.
Acrylic polymer: 83.0 parts by mass (P-2 (described later): solid content: 22.0% by mass)
Carbodiimide-based crosslinking agent: 16.6 parts by mass ("Carbodilite V-02-L2", manufactured by Nisshinbo Chemical Co., Ltd., solid content: 10% by mass)
Colloidal silica: 4.4 parts by mass ("Snowtex XL", manufactured by Nissan Chemical Industries, Ltd., solid content: 10% by mass, water dilution)
Slip agent: 27.7 parts by mass (Carnauba wax, "Cerosol 524", manufactured by Chukyo Yushi Co., Ltd., solid content: 3% by mass, water dilution)
Anionic surfactant: 23.3 parts by mass ("Lapisol A-90", manufactured by NOF Corporation, solid content: 1 mass%, aqueous solution)
Nonionic surfactant: 14.6 parts by mass ("Naroacty CL 95" manufactured by Sanyo Chemical Industries, Ltd., solid content: 1% by mass, aqueous solution)
Distilled water: 785.3 parts by mass

  The above acrylic polymer is a polymer latex (P-2) containing a polymer (hereinafter referred to as "P-2"), a dialkyl phenyl PEO (PEO is an abbreviation of polyethylene oxide), a dispersant comprising sulfuric acid ester, and water. The content mass ratio of the content of the dispersant to the content of (dispersant / (P-2), unit: g / g) is 2.0 / 100 = 0.02, and the solid content is 22. 0% by mass).

[Example 5]
In place of “composition 1 for forming an undercoat layer (curable composition 1)” used when preparing a substrate with an undercoat layer in the composition layer forming step of Example 1, for forming an undercoat layer described later Composition 5 (Curable Composition 5) was coated on a substrate such that the film thickness after drying was 100 nm, and dried at 90 ° C. for 1 minute to produce a substrate with a subbing layer A sheet L was produced in the same manner as in Example 1.

  The sheet L had a refractive index of 1.64, 1.58, 1.49, 1.49 in the order of the base material, the undercoat layer, the antihalation layer, and the binder portion in the conductive layer.

(Composition 5 for forming undercoat layer (composition of curable composition 5))
The composition of the composition 5 for forming an undercoat layer is as follows.
Acrylic polymer: 23.4 parts by mass ("AS-563A", manufactured by Daicel Finechem Co., Ltd., solid content: 27.5% by mass)
Polyester-based polymer: 19.4 parts by mass
("Plus Coat Z-592", manufactured by Yuka Chemical Industry Co., Ltd., solid content: 25.0% by mass)
Carbodiimide-based crosslinking agent: 20.1 parts by mass ("Carbodilite V-02-L2", manufactured by Nisshinbo Chemical Co., Ltd., solid content: 10% by mass)
Colloidal silica: 3.2 parts by mass ("Snowtex ZL" manufactured by Nissan Chemical Industries, Ltd., solid content: 10% by mass, water dilution solution)
Zirconium oxide dispersion: 14.0 parts by mass ("SZR-CW", manufactured by Sakai Chemical Industry Co., Ltd., solid content: 30% by mass, water dilution liquid)
Slip agent: 16.9 parts by mass (Carnauba wax, "Cerosol 524", manufactured by Chukyo Yushi Co., Ltd., solid content: 3% by mass, water dilution)
Anionic surfactant: 58.1 parts by mass ("Lapisol A-90", manufactured by NOF Corporation, solid content: 1% by mass, aqueous solution)
-Nonionic surfactant: 73.0 parts by mass ("Naroacty CL 95", Sanyo Chemical Industries, Ltd., solid content: 1% by mass, aqueous solution)
Distilled water: 772.0 parts by mass

[Example 6]
In place of “composition 1 for forming an undercoat layer (curable composition 1)” used when preparing a substrate with an undercoat layer in the composition layer forming step of Example 1, for forming an undercoat layer described later Composition 6 (Curable Composition 6) was coated on a substrate such that the film thickness after drying was 100 nm, and dried at 90 ° C. for 1 minute to produce a substrate with an undercoat layer. A sheet M was produced in the same manner as in Example 1.

  The sheet M had a refractive index of 1.64, 1.58, 1.49, 1.49 in the order of the base material, the undercoat layer, the antihalation layer, and the binder portion of the conductive layer.

(Composition 6 for forming undercoat layer (composition of curable composition 6))
The composition of the composition 6 for forming the undercoat layer is as follows.
Acrylic polymer: 25.6 parts by mass ("AS-563A", manufactured by Daicel Finechem Co., Ltd., solid content: 27.5% by mass)
Polyester-based polymer: 21.2 parts by mass ("Plus Coat Z-690", manufactured by HAKOKA CHEMICAL INDUSTRY CO., LTD., Solid content: 25.0% by mass)
Carbodiimide-based crosslinking agent: 22.0 parts by mass ("Carbodilite V-02-L2", Nisshinbo Co., Ltd., solid content: 10% by mass)
Colloidal silica: 3.2 parts by mass ("Snowtex ZL" manufactured by Nissan Chemical Industries, Ltd., solid content: 10% by mass, water dilution solution)
Slip agent: 18.5 parts by mass (Carnauba wax, "Cerosol 524", manufactured by Chukyo Yushi Co., Ltd., solid content: 3% by mass, water dilution)
Anionic surfactant: 58.2 parts by mass ("Lapisol A-90", manufactured by NOF Corporation, solid content: 1% by mass, aqueous solution)
Nonionic surfactant: 73.2 parts by mass ("Naroacty CL 95", Sanyo Chemical Industries, Ltd., solid content: 1% by mass, aqueous solution)
Distilled water: 778.2 parts by mass

[Evaluation of the degree of whitening (darkening)]
The Lenovo YOGA Tablet 2-830L was disassembled and the display and cover glass were removed. The sheets F to M were bonded to each other between the taken out display and the cover glass using a 3M transparent adhesive film 8146-4 to prepare a sample for evaluation. The above-mentioned touch panel was energized to check the operation, and a black image was displayed, and the appearance of the panel was evaluated by 10 persons. For each panel, the degree of whitening was graded in 5 steps from 1 (low) to 5 (high), and the evaluation points were averaged for each sample and evaluated according to the following criteria. The results are shown in Table 1.

AA: It worked fine and the black display was very good. (The score was 1.0 or more and 1.5 or less.)
A: It worked normally and the black display was good (the score was more than 1.5 and less than 2.0).
B: Operation was normal, but whitening was observed in part (the score was more than 2.0 and less than 4.0).
C: Normal operation but whitening was observed (the score was more than 4.0 and less than 5.0).
D: It did not work properly.

From the above results, the conductive sheet for a touch panel manufactured by the manufacturing method of Examples 1 to 6 had the effect of the present invention. On the other hand, the conductive sheet for a touch panel manufactured by the manufacturing method of Comparative Examples 1 and 2 did not have the effect of the present invention.
In addition, from the above results, the method for producing a conductive sheet for a touch panel according to the embodiment of the present invention includes adjusting the refractive index of the layer, more specifically, the refractive index of the base between the base and the conductive layer Better black tightness in combination with the method of providing an intermediate layer (subbing layer and / or antihalation layer) having a smaller refractive index than the refractive index of the binder part in the conductive layer. It turned out that a good image is obtained and can be used suitably in combination.

DESCRIPTION OF SYMBOLS 10 Conductive sheet 12 for touch panels Base material 14 metal fine wire 15 composition layer 16 conductive part 18 area 20 lattice 22 binder part 24 silver halide 26 silver halide containing photosensitive layer 28 non-conductive part

Claims (12)

It is a manufacturing method of the conductive sheet for touch panels which has a substrate and the metal thin wire arranged on the substrate,
Step A of forming a composition layer containing metal-containing particles on the substrate
Applying a treatment to the composition layer to inhibit the metal-containing particles from fusing to each other;
A step C of heating the composition layer after the treatment or irradiating the composition layer after the treatment with light to form the metal thin wire; .   The method for producing a conductive sheet for a touch panel according to claim 1, wherein the treatment is a treatment in which the composition layer is brought into contact with a solution containing a metal adsorbing substituent or a compound having a metal adsorbing structure. .   The metal adsorbing substituent is at least one selected from the group consisting of a carboxyl group or a salt thereof, an acid amide group, an amino group, an imidazole group, a pyrazole group, a thiol group, a thioether group, and a disulfide group. The manufacturing method of the electroconductive sheet for touchscreens of Claim 2.   The method for producing a conductive sheet for a touch panel according to claim 2, wherein the compound contains two or more thiol groups.   The manufacturing method of the conductive sheet for touchscreens as described in any one of Claims 2-4 which the said compound has at least 1 sort (s) selected from the group which consists of a pyrimidine ring and a triazine ring.   The conductive sheet for a touch panel according to any one of claims 1 to 5, further comprising a step b of smoothing the composition layer after the step A and before the step B. Production method.   The manufacturing method of the conductive sheet for touchscreens of Claim 6 which is a calendering process which the said process b passes under pressure between at least a pair of rolls the said base material which has the said composition layer under pressure. The composition layer further contains a binder,
The method for producing a conductive sheet for a touch panel according to claim 6, further comprising a step a of removing the binder from the composition layer after the step A and before the step b. .   In the step A, a silver halide-containing photosensitive layer containing silver halide and a binder is formed on the substrate, and the silver halide-containing photosensitive layer is exposed and then developed to form a metal. The manufacturing method of the conductive sheet for touchscreens as described in any one of Claims 1-8 which is a process of forming the said composition layer containing silver and a binder.   The method for producing a conductive sheet for a touch panel according to claim 9, wherein the binder contains gelatin.   The conductive sheet according to any one of claims 1 to 10, wherein in the step C, the method of heating the composition layer is a method of heating the composition layer using superheated steam. Production method.   The method according to any one of claims 1 to 11, wherein, in the step C, the method of irradiating the composition layer with light is a method of irradiating the composition layer with pulsed light from a xenon flash lamp. Method of manufacturing a conductive sheet