JP5653983B2 - Module manufacturing method and module - Google Patents

Description

  The present invention relates to a module manufacturing method and a module.

  When positioning two members, it is known to perform positioning by forming a positioning hole in one member, forming a positioning pin in the other member, and inserting the positioning pin into the positioning hole. For example, in the field of optical modules used for optical communication, it is known that positioning holes and positioning pins are used when positioning a transparent substrate on which a photoelectric conversion element is mounted and a support member that supports an end of an optical fiber. (See, for example, Patent Document 1).

  In the optical module of Patent Document 1, a photoelectric conversion element (optical element) is mounted on one surface of a transparent substrate (transparent resin substrate), and a support member that supports an end of an optical fiber on the other surface of the transparent substrate Is arranged. In the optical module of Patent Document 2, a photoelectric conversion element is mounted on one surface of a transparent substrate (light transmissive carrier), and a support member that supports an end portion of the optical fiber on the other surface of the transparent substrate. (Optical coupling member) is arranged.

JP 2007-271998 A JP 2012-60125 A

  In Patent Document 1, a transparent substrate (transparent resin substrate) is connected to a circuit board via a relay substrate (resin substrate with coaxial via (interposer)). In Patent Document 2, the transparent substrate (light transmissive carrier) is connected to the circuit substrate (circuit carrier) via a box-shaped relay substrate (carrier substrate). As described above, in Patent Documents 1 and 2, the transparent substrate is connected to the circuit board via the relay substrate, and the transparent substrate is not directly connected to the circuit board. As a result, with the configurations as in Patent Documents 1 and 2, the entire module becomes thick, and the height of the module cannot be reduced. Even if the transparent substrate is directly connected to the circuit board, the height of the module cannot be reduced by simply stacking the circuit board, the transparent substrate, and the support member.

  Even when the member connected to the circuit board is not a transparent substrate, when the second member is positioned by the positioning hole and the positioning pin with respect to the first member mounted on the circuit board, the module Low profile is required.

  An object of the present invention is to reduce the height of a module when positioning a second member with a positioning hole and a positioning pin with respect to a first member mounted on a circuit board. Another object of the present invention is to facilitate positioning of two members positioned by positioning holes and positioning pins when a structure with a low-profile module is employed.

A main invention for achieving the above object is a method of manufacturing a module having a circuit board, a first member mounted on the circuit board, and a second member positioned with respect to the first member. A circuit board having a window formed thereon, the circuit board having the first member mounted on a first surface of the circuit board so as to close the window; The second member is inserted into the window while being guided by the edge of the window from the second surface side opposite to the first surface of the substrate, and the first member and the second A module manufacturing method for positioning the first member and the second member by inserting a positioning pin provided in the other member into a positioning hole provided in one member of the member And the window is rectangular. The rectangular corner of the window is formed with a recess, and the recess is formed with a rounded portion of the diameter of the tool when the window is formed by router processing. In the module manufacturing method, a linear edge between the concave portion and the concave portion functions as a guide for the side surface of the second member .

  Other characteristics of the present invention will be made clear by the description and drawings described later.

  According to the present invention, it is possible to reduce the height of the module and to easily position the two members positioned by the positioning hole and the positioning pin.

1A to 1C are explanatory diagrams of the outline of the present embodiment. FIG. 1D is an explanatory diagram of a comparative example. FIG. 2A is an explanatory diagram of the positioning according to the present embodiment. FIG. 2B is an explanatory diagram of the positioning of the comparative example. FIG. 3 is an explanatory diagram of a pluggable optical transceiver. 4A is a perspective view of the circuit board 10 and the like in the housing 1A of the optical module 1 as viewed obliquely from above. FIG. 4B is a perspective view of the circuit board 10 and the like as viewed obliquely from below. FIG. 5 is a diagram of the circuit board 10 and the like viewed from below. FIG. 6 is a schematic configuration diagram of the optical module 1 inserted into the cage 2. FIG. 7 is a perspective view of a fixture 62 for fixing the optical path changer 40. FIG. 8 is an explanatory diagram of the arrangement of the circuit board 10, the glass substrate 20, and the optical path changer 40. FIG. 9A is an explanatory diagram of the positioning hole 23 of the first embodiment. FIG. 9B is an explanatory diagram of the positioning hole 23 ′ of the reference example. FIG. 10A is an explanatory diagram of the positioning pin 43 of the first embodiment. FIG. 10B is an explanatory diagram of the positioning pin 43 ′ of the first reference example. FIG. 10C is an explanatory diagram of the positioning pin 43 ″ of the second reference example. FIG. 11 is a flowchart of the method for manufacturing the optical module 1. FIG. 12A is a view of the accommodation window 12 of the circuit board 10 as viewed from below. FIG. 12B is an explanatory diagram of the outer dimensions of the optical path changer 40. FIG. 12C is an explanatory diagram of the shape of the positioning pin 43 and the amount of displacement of the positioning pin shaft with respect to the shaft of the positioning hole 23. 13A and 13B are explanatory diagrams of a reference example of a fixing method using the adhesive 65. FIG. FIG. 14A is a view of the housing window 12 of the circuit board 10 according to the second embodiment as viewed from below. FIG. 14B is an explanatory diagram of the outer dimensions of the optical path converter 40 of the second embodiment. FIG. 15A is an explanatory diagram of an adhesive application range viewed from the lower side (the optical path converter 40 side). FIG. 15B is a schematic explanatory view of the optical path changer 40 fixed with the adhesive 65 as viewed from obliquely below. FIG. 16 is an explanatory diagram of how to peel off the adhesive 65 of the second embodiment. FIG. 17 is a schematic configuration diagram of an optical module according to the third embodiment.

  At least the following matters will be apparent from the description and drawings described below.

A method of manufacturing a module having a circuit board, a first member mounted on the circuit board, and a second member positioned with respect to the first member, wherein the circuit has a window formed therein. Preparing a circuit board having the first member mounted on a first surface of the circuit board so as to close the window, the board being opposite to the first surface of the circuit board; The second member is inserted into the window by being guided by the edge of the window from the second surface side, and positioning provided on one of the first member and the second member A module manufacturing method for positioning the first member and the second member by inserting a positioning pin provided on the other member into the hole becomes clear.
According to such a module manufacturing method, it is possible to reduce the height of the module and to easily position the two members positioned by the positioning hole and the positioning pin.

  The positioning pin is preferably frustoconical. This is particularly effective in such a case.

  When the second member is brought into contact with the edge of the window, it is preferable that the top portion of the positioning pin is located in the opening of the positioning hole. Accordingly, the positioning pin can be inserted into the positioning hole without bringing the top of the positioning pin into contact with the edge of the positioning hole.

  The difference between the dimension of the window and the dimension of the second member in the direction parallel to the circuit board is preferably smaller than the dimension of the tapered surface of the positioning pin having the truncated cone shape in the direction. Thereby, when the said 2nd member is made to contact the edge of the said window, the top part of the said positioning pin can be located in the opening of the said positioning hole.

  The one member having the positioning hole is preferably harder than the other member having the positioning pin. This is particularly effective in such a case.

  The positioning hole is preferably a non-through hole with a deep back. In such a case, it is effective to make the positioning pin have a truncated cone shape.

  The positioning hole is preferably formed by blasting. In such a case, the positioning hole becomes a non-through hole with a deep back.

  The window is preferably formed by router processing and has a recess for avoiding contact between the roundness formed by the router processing and the second member. Thereby, the second member can be normally guided by the edge of the window.

  After positioning the first member and the second member, an adhesive is applied so as to cover a part of the recess without covering all of the recess, and the adhesion covering the recess It is desirable to form a space between the agent and the first member, and fix the second member to the circuit board with the adhesive. Thereby, the front-end | tip of the tool which peels an adhesive agent can be made to enter the said space, and it becomes possible to peel an adhesive agent so that a said 2nd member may not be damaged.

  When peeling the adhesive with a tool, the tip of the tool enters the space, the tool is brought into contact with the edge of the recess, the contact point is used as a fulcrum, and the adhesive is applied at the tip of the tool. It is desirable to remove. Thereby, it becomes easy to peel off the adhesive.

  The first member is a transparent substrate that can transmit light, the second member is a support member that supports an optical fiber that transmits light, and the transparent substrate faces the transparent substrate. A photoelectric conversion element that emits light or receives light that has passed through the transparent substrate is mounted, and the support member forms an optical path between the photoelectric conversion element and the optical fiber together with the transparent substrate. It is preferable that the transparent substrate and the support member are positioned by inserting the positioning pins of the support member into the positioning holes of the transparent substrate. This facilitates positioning of the transparent substrate and the support member.

A circuit board on which a window is formed; a first member mounted on the first surface of the circuit board so as to close the window; and a second surface side opposite to the first surface of the circuit board. And a second member that is positioned with respect to the first member, and a positioning hole is provided in one of the first member and the second member. The other member is provided with a frustoconical positioning pin, and when the second member is brought into contact with the edge of the window, the top of the positioning pin is positioned within the opening of the positioning hole. A module characterized by
According to such a module, it is possible to reduce the height of the module and to easily position the two members positioned by the positioning hole and the positioning pin.

A circuit board on which a window is formed; a first member mounted on the first surface of the circuit board so as to close the window; and a second surface side opposite to the first surface of the circuit board. And a second member that is positioned with respect to the first member, and a positioning hole is provided in one of the first member and the second member. The other member is provided with a frustoconical positioning pin, and the difference between the dimension of the window and the dimension of the second member in the direction parallel to the circuit board is the positioning of the frustoconical shape. The module is characterized by being smaller than the dimension in the said direction of the taper surface of the pin.
According to such a module, it is possible to reduce the height of the module and to easily position the two members positioned by the positioning hole and the positioning pin.

=== Overview ===
1A to 1C are explanatory diagrams of the outline of the present embodiment. FIG. 1D is an explanatory diagram of a comparative example.

  As shown in FIGS. 1A and 1B, the circuit board 10 is provided with a receiving window 12 (window). A glass substrate 20 (first member, transparent substrate) is mounted on the first surface, which is one surface of the circuit substrate 10, so as to close the accommodation window 12.

  The optical path changer 40 (second member, support member) is positioned and attached to the glass substrate 20. The glass substrate 20 is provided with positioning holes 23, and the optical path converter 40 is provided with positioning pins 43. By inserting the positioning pin 43 into the positioning hole 23, the optical path changer 40 is positioned with respect to the glass substrate 20.

  The optical path changer 40 is inserted into the receiving window 12 of the circuit board 10 from the second surface side opposite to the first surface on which the glass substrate 20 is mounted. Since a part of the optical path changer 40 is disposed in the receiving window 12, the module can be reduced in height as compared with the case where the circuit board 10, the glass substrate 20 and the optical path changer 40 are simply stacked. Can do.

  As can be seen by comparing FIG. 1C (this embodiment) and FIG. 1D (comparative example), in this embodiment, the receiving window 12 is formed in accordance with the outer shape of the optical path converter 40. This is because the optical path changer 40 is guided (guided) by the edge of the accommodation window 12 when the optical path changer 40 is inserted into the accommodation window 12 from the second surface side (see FIG. 1B).

  FIG. 2A is an explanatory diagram of the positioning according to the present embodiment. In this embodiment, since the optical path changer 40 is guided by the edge of the receiving window 12 before the positioning pin 43 is inserted into the positioning hole 23, the displacement between the axis of the positioning pin 43 and the axis of the positioning hole 23. Hardly occurs. For this reason, in this embodiment, it becomes easy to insert the positioning pin 43 into the positioning hole 23.

  FIG. 2B is an explanatory diagram of the positioning of the comparative example. In the comparative example, the amount of deviation between the axis of the positioning pin 43 and the axis of the positioning hole 23 increases. For this reason, in the comparative example, it is difficult to position the top of the positioning pin 43 within the opening of the positioning hole 23 and to insert the positioning pin 43 into the positioning hole 23 in comparison with the present embodiment.

  In particular, when the positioning pin 43 has a tapered surface such as a truncated cone shape or a conical shape, the positioning surface 43A of the positioning pin 43 comes into contact with the edge of the positioning hole 23 as shown in FIG. (Or the positioning hole 23) may be damaged. As a result, a problem of contamination and a problem of deterioration of positioning accuracy occur. However, according to the present embodiment, since the displacement between the positioning pin 43 and the positioning hole 23 during positioning is small, damage to the positioning pin 43 can be suppressed. As a result, according to the present embodiment, contamination can be suppressed and positioning accuracy can be improved.

=== First Embodiment ===
<Overall configuration>
FIG. 3 is an explanatory diagram of a pluggable optical transceiver. An optical transceiver having both an optical transmitter and an optical receiver is sometimes referred to as an optical transceiver, but here, an optical transceiver having only one is also referred to as an optical transceiver. The pluggable optical transceiver in the figure is of the QSFP type (QSFP: Quad Small Form Factor Pluggable) defined by MSA (Multi Source Agreement). The pluggable optical transceiver has an optical module 1 and a cage 2.

  In the drawing, two types of optical modules 1 are depicted. As shown in the drawing, an optical fiber (including a cord) may be fixed to the optical module 1 or may be detachable. One of the two cages 2 in the figure is drawn with the heat sink 3 removed and partially broken so that the inside can be seen.

  In the following description, front and rear, top and bottom, and left and right are defined as shown in FIG. That is, the insertion port side of the cage 2 into which the optical module 1 is inserted is referred to as “front”, and the opposite side is referred to as “rear”. In the optical module 1, the side from which the optical fiber (including the cord) extends is referred to as “front”, and the opposite side is referred to as “rear”. Further, when viewed from the main board on which the cage 2 is provided, the side of the surface on which the cage 2 is provided is “upper”, and the opposite side is “lower”. Also, the direction orthogonal to the front-rear direction and the up-down direction is referred to as “left-right”.

  A cage 2 is installed on the main board on the communication device side (host side). The cage 2 is provided on a main board of a blade server in the data center, for example.

  The optical module 1 is detachably inserted into the cage 2. The optical module 1 includes a photoelectric conversion element 31 and a circuit board 10 in a housing 1A, and mutually converts an optical signal transmitted / received by an optical fiber and an electric signal processed by a main board on a communication device side. To do.

  The cage 2 accommodates the optical module 1 in a detachable manner. The cage 2 is a box-shaped member having a rectangular section in the front-rear direction with an insertion slot for inserting the optical module 1 on the front side. The cage 2 is formed by bending a metal plate so as to open the front side. An accommodating portion for accommodating the optical module 1 is formed in the cage 2 by bending the metal plate into a rectangular cross section. A connector 2 </ b> A is provided on the rear side inside the cage 2. When the optical module 1 is inserted into the cage 2, the circuit board in the optical module 1 is electrically and mechanically connected to the connector 2 </ b> A in the cage 2. Thereby, an electrical signal is transmitted between the optical module 1 and the main board.

  The upper surface of the cage 2 has an opening, and a heat sink 3 is attached so as to close the opening. The heat sink 3 includes a large number of heat radiation fins (heat radiation pins) for radiating the heat of the optical module 1 inserted into the cage 2 to the outside.

<Internal configuration of optical module 1>
4A is a perspective view of the circuit board 10 and the like in the housing 1A of the optical module 1 as viewed obliquely from above. FIG. 4B is a perspective view of the circuit board 10 and the like as viewed obliquely from below. FIG. 5 is a diagram of the circuit board 10 and the like viewed from below. FIG. 6 is a schematic configuration diagram of the optical module 1 inserted into the cage 2.

  As shown in the figure, the optical module 1 includes a circuit board 10, a glass substrate 20, and an optical path changer 40 in a housing 1A.

  The circuit board 10 is a plate-like printed board that constitutes an electronic circuit. A connection portion 11 (card edge connector) for connecting to a connector 2A (connector socket) in the cage 2 is formed at the rear end portion of the circuit board 10. The connection portion 11 is formed on both upper and lower surfaces of the circuit board 10 and a large number of terminals are formed side by side in the left-right direction.

  An accommodation window 12 for accommodating the optical path converter 40 is formed in the circuit board 10. A circuit board side electrode 13 is formed on the upper surface of the circuit board 10 so as to surround the housing window 12. A glass substrate 20 is mounted on the upper surface (first surface) of the circuit board 10 so as to close the housing window 12. In other words, the housing window 12 of the circuit board 10 is positioned below the glass substrate 20, and the housing window 12 of the circuit board 10 is closed by the lower surface of the glass substrate 20. A glass substrate side electrode 22 is formed on the lower surface of the glass substrate 20, and the glass substrate 20 is connected to the circuit substrate side electrode 13 and the glass substrate side electrode 22 while closing the housing window 12 of the circuit substrate 10. It is mounted on the circuit board 10.

  The housing window 12 is a through hole (opening) formed in the circuit board 10. The upper portion of the optical path changer 40 is inserted into the accommodation window 12. The lower part of the optical path changer 40 protrudes downward from the receiving window 12, and the optical fiber 50 extends forward from the protruding part. However, when the optical path changer 40 is thinner than the circuit board 10, the lower part of the optical path changer 40 does not protrude downward from the receiving window 12. In this case, if the reflecting portion 42 is configured to reflect light at an obtuse angle, the optical fiber 50 can be easily pulled out from the optical path converter 40.

  The receiving window 12 is formed in a rectangular shape by performing router processing on the circuit board 10. When the receiving window 12 is processed with a tool (router), the corner of the receiving window 12 is rounded in the diameter of the tool, so that the rounded portion does not interfere (contact) with the optical path changer 40. In addition, the housing window 12 has a recess 12A. The linear edge between the recess 12 </ b> A and the recess 12 </ b> A functions as a guide for the side surface of the optical path converter 40.

  The glass substrate 20 is a transparent glass substrate that can transmit light. A plurality of through vias 21 are formed in the glass substrate 20 along the shape of the receiving window 12 of the circuit board 10.

  A glass substrate side electrode 22 is formed on the lower surface of the glass substrate 20 (the surface opposite to the mounting surface on which the light emitting unit 31 is mounted). The glass substrate side electrode 22 is formed outside the through via 21. Further, the glass substrate side electrode 22 is formed along the outside of the accommodation window 12 of the circuit board 10. The glass substrate side electrode 22 is electrically connected to the circuit substrate side electrode 13 on the upper surface of the circuit substrate 10. The through via 21 is used for wiring between the glass substrate side electrode 22, the light emitting unit 31, and the driving element 32.

  Two positioning holes 23 for positioning the optical path changer 40 are formed on the lower surface of the glass substrate 20. The positioning hole 23 does not penetrate the glass substrate 20 and is formed to be a non-through hole. By making the positioning hole 23 a non-through hole, it becomes possible to mount a component (for example, the drive element 32) on the upper side of the positioning hole 23 and to arrange a wiring to the component. The degree of freedom of component mounting and wiring on the upper surface is increased. As a result, the glass substrate 20 can be downsized.

  A light emitting unit 31 is mounted on the upper surface of the glass substrate 20. A driving element 32 for driving the light emitting unit 31 is also mounted on the upper surface of the glass substrate 20 (the mounting surface of the light emitting unit 31). The light emitting unit 31 and the driving element 32 are disposed inside the through via 21. In other words, the light emitting unit 31 and the driving element 32 are mounted on the upper surface of the glass substrate 20 so as to be positioned above the receiving window 12 of the circuit board 10.

  The light emitting unit 31 is a photoelectric conversion element that converts an optical signal and an electrical signal. Here, a VCSEL (Vertical Cavity Surface Emitting Laser) that emits light perpendicular to the substrate is employed as the light emitting unit 31. Note that a light receiving unit that converts an optical signal into an electrical signal may be mounted on the glass substrate 20 as a photoelectric conversion element. Further, both the light emitting unit and the light receiving unit may be mounted on the glass substrate 20.

  The light emitting unit side electrode 31A and the light emitting surface 31B of the light emitting unit 31 are formed on the lower surface (the surface on the glass substrate 20 side). The light emitting unit 31 is flip-chip mounted on the glass substrate 20 and irradiates light toward the glass substrate 20. Since the light emitting unit side electrode 31A and the light emitting surface 31B of the light emitting unit 31 are located on the same side (the lower surface on the side of the glass substrate 20), if the light emitting unit 31 is flip-chip mounted on the glass substrate 20, the light emitting surface 31B. Faces the glass substrate 20, and the light emitting surface 31B is not exposed to the outside.

  In FIG. 6, one light emitting surface 31B of the light emitting unit 31 is depicted, but the light emitting unit 31 includes a plurality of light emitting surfaces 31B arranged in a direction perpendicular to the paper surface.

  The optical path converter 40 is an optical member that converts the optical path of the light emitted from the light emitting unit 31. The optical path converter 40 also functions as a support member that supports one end of the optical fiber 50 and forms the optical path between the light emitting unit 31 and the optical fiber 50 together with the transparent substrate. The optical path changer 40 is a member (second member) that is positioned and attached to the glass substrate 20. The optical path changer 40 is inserted into the receiving window 12 from the lower side of the circuit board 10.

  The optical path changer 40 includes a lens unit 41 and a reflection unit 42. The lens unit 41 is formed on the upper surface of the optical path changer 40. The reflection part 42 is formed on the lower surface of the optical path changer 40.

  The lens portion 41 is a portion formed in a convex lens shape so that light can be focused. However, the lens portion 41 is formed in a concave portion recessed from the upper surface so as not to protrude from the upper surface of the optical path changer 40. By forming the lens portion 41 so as to be recessed from the upper surface of the optical path changer 40, the upper surface of the optical path changer 40 and the lower surface of the glass substrate 20 can be brought into surface contact. The lens unit 41 focuses the light emitted from the light emitting unit 31, guides the light to the reflecting unit 42, and causes the light to enter the optical fiber 50. When the light receiving unit is mounted on the glass substrate 20, the lens unit 41 focuses the light reflected from the reflecting unit 42 on the light receiving unit. The lens unit 41 faces the light emitting surface 31B of the light emitting unit 31 with the glass substrate 20 interposed therebetween.

  The reflection part 42 is a part for reflecting light. The optical axis of the light emitted from the light emitting unit 31 is the vertical direction (the direction perpendicular to the substrate such as the circuit board 10 or the glass substrate 20), but the optical axis of the light reflected by the reflecting unit 42 is the front-rear direction (circuit (Direction parallel to the substrate such as the substrate 10 or the glass substrate 20). The light reflected by the reflection unit 42 enters the optical fiber 50 attached to the optical path changer 40. When the light receiving part is mounted on the glass substrate 20, the reflecting part 42 reflects the light emitted from the optical fiber 50, guides it to the lens part 41, and focuses it on the light receiving part.

  In addition, the reflection part 42 in a figure is drawn so that the optical axis of reflected light may become the front-back direction (direction parallel to substrates, such as the circuit board 10 and the glass substrate 20). However, the reflection part 42 is not restricted to what reflects light at 90 degree | times. The reflection unit 42 may be configured to reflect light at an obtuse angle (for example, about 100 degrees). The light whose optical axis is in the vertical direction (direction perpendicular to the substrate such as the circuit board 10 or the glass substrate 20) has a component in the front-rear direction (direction parallel to the substrate such as the circuit board 10 or the glass substrate 20). It only has to be reflected. For example, when the root of the optical fiber 50 is relatively above the optical path converter 40 or when the thickness of the optical path converter 40 is thinner than the thickness of the circuit board 10, the optical fiber 50 is pulled out from the optical path converter 40. In order to facilitate, it is preferable that the reflecting portion 42 be configured to reflect light at an obtuse angle.

  One end of the optical fiber 50 is supported on the fiber support 44 of the optical path converter 40, and the optical fiber 50 extends from the front side of the optical path converter 40. The optical fiber 50 is aligned and attached so as to have a predetermined positional relationship with respect to the lens portion 41 and the reflecting portion 42 of the optical path changer 40.

  In the optical path changer 40 in the figure, a lens portion 41 is provided only at a site where light enters. However, a lens part may be provided also in the part which emits light, and optical path changer 40 may be provided with two lens parts. If the two lens portions are collimator lenses, parallel light can be propagated in the optical path changer 40.

  On the upper surface of the optical path changer 40, two positioning pins 43 for insertion into the positioning holes 23 of the glass substrate 20 are formed so as to protrude. The positioning pin 43 of the optical path converter 40 is fitted into the positioning hole 23 of the glass substrate 20, whereby the optical axis of the lens unit 41 of the optical path converter 40 and the optical axis of the light emitting unit 31 mounted on the glass substrate 20. Alignment is performed.

  The optical path converter 40 is integrally formed of resin. That is, the lens part 41, the reflection part 42, the positioning pin 43, and the fiber support part 44 of the optical path changer 40 are integrally formed of resin.

  As shown in FIG. 6, a heat dissipation sheet 61 is disposed above the light emitting unit 31 and the drive element 32. The heat radiation sheet 61 is made of a material having high thermal conductivity, and conducts heat generated from the light emitting unit 31 and the driving element 32 to the heat sink 3 of the cage 2.

  FIG. 7 is a perspective view of a fixture 62 for fixing the optical path changer 40. The fixture 62 includes a main body 63 obtained by bending a metal plate in a U-shaped cross section and a hook plate 64. A hook plate 64 is fixed to one end of the U-shaped main body 63, and an engaging portion 63 </ b> A for hooking the hook plate 64 is formed on the other end of the main body 63. When the hook plate 64 is hooked on the engaging portion 63A of the main body 63, the fixture 62 tightens members inside the main body 63 (the glass substrate 20, the light emitting portion 31, the optical path changer 40, the heat radiation sheet 61, and the like) from above and below. .

  The fixture 62 urges the optical path converter 40 upward by the hook plate 64 and urges the glass substrate 20 downward by the main body 63 via the heat dissipation sheet 61. That is, the fixture 62 functions as a biasing member that biases a force in a direction in which the positioning pin 43 of the optical path converter 40 is inserted into the positioning hole 23 of the glass substrate 20. Thereby, fitting with the positioning hole 23 of the glass substrate 20 and the positioning pin 43 of the optical path changer 40 becomes reliable, and it becomes difficult to remove | deviate.

  In addition, the hook plate 64 of the fixture 62 covers the outside of the reflecting portion 42 of the optical path converter 40. Thereby, it is possible to prevent dust from entering the reflecting portion 42. If dust adheres to the reflector 42, the optical characteristics of the reflector 42 may change. However, the hook plate 64 covers the outside of the reflector 42, so that the optical characteristics of the reflector 42 are improved. Change can be prevented.

  Further, the fixture 62 functions as a biasing member that biases a force in a direction in which the light emitting unit 31 or the driving element 32 and the heat dissipation sheet 61 are brought into close contact with each other. Thereby, the heat generated from the light emitting unit 31 and the drive element 32 is easily conducted to the heat radiating sheet 61.

Since the state in which the positioning pin 43 is inserted into the positioning hole 23 is held by the fixture 62, the optical path converter 40 can be removed from the glass substrate 20 by removing the fixture 62. That is, the glass substrate 20 and the optical path changer 40 are positioned by inserting the positioning pins 43 into the positioning holes 23 so as to be detachable. Thereby, the process of attaching the optical path changer 40 to the glass substrate 20 becomes simpler than the case of bonding and fixing. Further, since the optical path changer 40 is detachably attached, it can be replaced even if a failure occurs in the optical path changer 40. (On the other hand, when the optical path converter 40 is bonded and fixed to the glass substrate 20, if the optical path converter 40 breaks down, the glass substrate 20 (and the circuit board 10) also needs to be replaced. It will take.)
<Disposition and low profile of the circuit board 10, the glass substrate 20, and the optical path converter 40>
FIG. 8 is an explanatory diagram of the arrangement of the circuit board 10, the glass substrate 20, and the optical path changer 40. As shown in the figure, the thickness (dimension in the vertical direction) of the circuit board 10 is 1.0 mm, the thickness of the glass substrate 20 is 0.7 mm, the thickness of the driving element 32 is 0.3 mm, and the optical path converter 40 The thickness is 1.8 mm. Since the light emitting unit 31 is thinner than the drive element 32, the thickness of the light emitting unit 31 is ignored here.

  The optical path changer 40 is a thicker part than the others in order to ensure the dimensions of the reflecting portion 42 and to ensure the dimensions for connecting the end of the optical fiber 50. And when the circuit board 10, the glass substrate 20, and the optical path changer 40 are simply stacked and arranged by arranging the thick upper part of the optical path changer 40 in the receiving window 12 (or via a relay board). Compared with the case where the glass substrate 20 and the optical path changer 40 are attached to the circuit board 10), the height of the optical module is reduced.

  Specifically, although the 0.7 mm glass substrate 20 and the 1.8 mm optical path changer 40 positioned by the positioning holes 23 and the positioning pins 43 are attached to the 1.0 mm circuit board 10, Is 2.8 mm (= 1.8 mm + 0.7 mm + 0.3 mm). On the other hand, if the circuit board 10, the glass substrate 20, and the optical path changer 40 are simply stacked and arranged, the total thickness is at least 3.8 mm (= 1.0 mm + 0.7 mm + 0.3 mm + 1.8 mm). . In addition, when the glass substrate 20 is mounted on the circuit board 10 via the relay board, the whole becomes thicker.

<Shape of positioning hole 23 and positioning pin 43>
FIG. 9A is an explanatory diagram of the positioning hole 23 of the first embodiment. FIG. 9B is an explanatory diagram of the positioning hole 23 ′ of the reference example. In the first embodiment, a non-through hole is formed as a positioning hole 23 in the glass substrate 20. The reason for making the non-through hole is that by making the positioning hole 23 a non-through hole, the degree of freedom of component mounting and wiring on the upper surface of the glass substrate 20 increases.

  As a method for forming the non-through hole in the glass substrate 20, a processing method using a drill is conceivable. When the non-processed hole is formed by the drill, as shown in FIG. 9B, a hole having a constant diameter regardless of the depth is formed in the glass substrate 20 '. However, machining with a drill may be costly. Therefore, in the first embodiment, sandblasting that can form non-through holes at low cost is employed. However, when the non-through hole is formed by sandblasting, the hole diameter (opening diameter) on the surface of the glass substrate 20 can be formed with high accuracy, but the shape becomes deep (see FIG. 9A). For this reason, the dimensional accuracy of the hole diameter and depth is low at the back of the hole.

  FIG. 10A is an explanatory diagram of the positioning pin 43 of the first embodiment. FIG. 10B is an explanatory diagram of the positioning pin 43 ′ of the first reference example. FIG. 10C is an explanatory diagram of the positioning pin 43 ″ of the second reference example.

  The positioning pin 43 ″ of the second reference example shown in FIG. 10C has a cylindrical shape (dimension cylinder shape) with a constant pin diameter. In the case of such a cylindrical positioning pin 43 ″, a deep constriction as shown in FIG. 9A is obtained. It cannot be positioned by being inserted into the remaining positioning hole 23. Further, if the positioning hole 23 has a shape as shown in FIG. 9B, it may be possible to perform positioning by inserting the positioning pin 43 ″ of the second reference example shown in FIG. 10C. Due to the tolerance, a gap is required between the positioning hole 23 ′ and the positioning pin 43 ″, and a positioning error is generated by this gap.

  The positioning pin 43 ′ of the first reference example shown in FIG. 10B has a conical shape. When the positioning pin 43 ′ having such a shape is inserted into the positioning hole 23 having a narrow back as shown in FIG. 9A, the tip of the positioning pin 43 ′ may come into contact with the bottom of the positioning hole 23. Cannot perform positioning.

  It is possible to reduce the height of the positioning pin 43 ′ of the first reference example so that the tip of the positioning pin 43 ′ does not contact the bottom of the positioning hole 23. However, in this case, since the angle of the tapered surface becomes small (because the positioning pin 43 ′ has a flat shape as a whole), it becomes difficult to insert into the positioning hole 23 or fit into the positioning hole 23. As a result, the optical axis may be shifted.

  On the other hand, the positioning pin 43 of the first embodiment has a truncated cone shape as shown in FIG. 10A. Since the positioning pin 43 has a truncated cone shape, the tip of the positioning pin 43 is unlikely to contact the bottom of the positioning hole 23 even if the positioning pin 43 is inserted into the narrowed positioning hole 23 as shown in FIG. 9A. Even if the angle of the truncated cone-shaped tapered surface 43 </ b> A is increased, the tip of the positioning pin 43 is difficult to contact the bottom of the positioning hole 23.

  Further, according to the positioning pin 43 of the first embodiment, the truncated conical tapered surface 43A can contact the positioning hole 23 on the surface of the glass substrate 20 without any gap (because it can contact the edge of the positioning hole 23 without any gap). , Positioning errors can be suppressed. Thereby, in 1st Embodiment, the positioning accuracy of the direction (direction parallel to the surface of the glass substrate 20) perpendicular | vertical to the axial direction of the positioning hole 23 or the positioning pin 43 can be made high.

  For the above reason, the truncated cone shaped positioning pin 43 is employed in the first embodiment.

<Manufacturing method>
FIG. 11 is a flowchart of the method for manufacturing the optical module 1.

  First, the operator prepares the circuit board 10 on which the glass substrate 20 is mounted (S101). An accommodation window 12 is formed on the circuit board 10, and a glass substrate 20 is mounted on the upper surface of the circuit board 10 so as to close the accommodation window 12. On the upper surface of the glass substrate 20, the light emitting unit 31 and the driving element 32 are already mounted. A positioning hole 23 is formed on the lower surface of the glass substrate 20.

FIG. 12A is a view of the accommodation window 12 of the circuit board 10 as viewed from below. FIG. 12B is an explanatory diagram of the outer dimensions of the optical path changer 40.
The inner dimension (reference dimension) of the housing window 12 is set to be about 0.1 mm larger than the outer dimension of the optical path converter 40. Specifically, the inner dimension in the front-rear direction of the housing window 12 is 10.1 mm, and the inner dimension in the left-right direction is 6.1 mm. (The outer dimension of the optical path changer 40 in the front-rear direction is 10.0 mm, and the outer dimension in the left-right direction is 6.0 mm. See FIG. 12B). However, here, the inner dimension of the linear edge between the recess 12 </ b> A and the recess 12 </ b> A is the inner dimension of the receiving window 12.

  Further, as shown in FIG. 12A, the tolerance of the receiving window 12 is set to 0.1 mm. In the drawing, the tolerance of the inner dimension of the receiving window 12 is drawn to be set to 0.1 mm, but actually, the tolerance of the inner dimension of the receiving window 12 and the mounting accuracy of the glass substrate 20 are The total accuracy is plus or minus 0.1 mm (here, the mounting error of the glass substrate 20 is zero). In addition, although the tolerance is set also in the outer dimension of the optical path changer 40, since it is a magnitude | size which can be disregarded compared with the tolerance of the accommodation window 12, in order to simplify description, as shown in FIG. Then, the tolerance of the optical path changer 40 is not considered.

  Next, the operator attaches the optical path changer 40 to the glass substrate 20. One end of the optical fiber 50 is attached in advance to the optical path converter 40 (specifically, the fiber support 44 of the optical path converter 40).

  Since the height (here, 0.5 mm) of the positioning pin 43 is lower than the thickness (here, 1.0 mm) of the circuit board 10, the optical path changer 40 is inserted before the positioning pin 43 is inserted into the positioning hole 23. Is inserted into the receiving window 12 of the circuit board 10. In addition, since there is almost no gap between the housing window 12 of the circuit board 10 and the optical path converter 40, the operator holds the upper portion of the optical path converter 40 while bringing the side surface of the optical path converter 40 into contact with the edge of the housing window 12. It will be inserted into the receiving window 12. That is, the operator inserts the optical path converter 40 into the receiving window 12 while guiding the side surface of the optical path converter 40 with the edge of the receiving window 12 (S102). The optical path changer 40 is guided by the edge of the receiving window 12, so that the movement range in the direction parallel to the circuit board 10 is limited.

  When the operator continues to insert the optical path converter 40 into the receiving window 12, the positioning pin 43 of the optical path converter 40 reaches the positioning hole 23 of the glass substrate 20, and the positioning pin 43 is inserted into the positioning hole 23 (S103). . At this time, since the optical path changer 40 is guided by the edge of the receiving window 12, there is almost no deviation between the axis of the positioning pin 43 and the axis of the positioning hole 23. For this reason, the positioning pin 43 can be easily inserted into the positioning hole 23. Hereinafter, this point will be described.

  FIG. 12C is an explanatory diagram of the shape of the positioning pin 43 and the amount of displacement of the positioning pin shaft with respect to the shaft of the positioning hole 23. Here, the axial direction of the positioning pin 43 and the positioning hole 23 is the Z direction, and the direction perpendicular to the axial direction of the positioning pin 43 and the positioning hole 23 (the direction parallel to the circuit board 10 and the glass substrate 20) is the Y direction. .

  The shape of the positioning pin 43 is a truncated cone shape as already described. The opening diameter of the positioning hole and the diameter of the base of the positioning pin 43 are 1000 μm, and the dimension (height) in the Z direction of the positioning pin 43 is 500 μm. The bus forming the tapered surface 43A of the positioning pin 43 is inclined 50 degrees with respect to the Y direction (inclined 50 degrees with respect to the upper surface of the optical path converter 40). The length of the bus forming the tapered surface 42A of the positioning pin 43 is about 650 μm (= 500 mm / sin 50 °).

  The axis of the positioning pin 43 is only shifted by 200 μm at the maximum in the Y direction with respect to the axis of the positioning hole 23. The reason why the displacement amount is 200 μm at the maximum is that the reference dimension of the receiving window 12 is 100 μm (= 0.1 mm) larger than that of the optical path changer 40, and the tolerance of the receiving window 12 (actually, within the receiving window 12) This is because the sum of the dimensional tolerance and the mounting accuracy of the glass substrate 20 is plus or minus 100 μm.

  In the first embodiment, the amount of deviation between the axis of the positioning pin 43 and the axis of the positioning hole 23 is 200 μm at the maximum, compared with the opening diameter of the positioning hole 23 and the diameter of the base of the positioning pin 43 (here 1000 μm). Small. For this reason, the positioning pin 43 can be easily inserted into the positioning hole 23.

  Furthermore, in the first embodiment, when the side surface of the optical path changer 40 is brought into contact with the edge of the receiving window 12, the top of the frustoconical positioning pin 43 is positioned within the opening of the positioning hole 23. For this reason, if the optical path converter 40 is guided to the edge of the receiving window 12 and the optical path converter 40 is brought close to the glass substrate 20, the top of the frustoconical positioning pin 43 does not contact the edge of the positioning hole 23. Since the top of the positioning pin 43 enters the positioning hole 23, the positioning pin 43 can be easily inserted into the positioning hole 23. If the top of the frustoconical positioning pin 43 is located away from the opening of the positioning hole 23, it becomes difficult to insert the positioning pin 43 into the positioning hole 23.

  In the first embodiment, since the top of the positioning pin 43 is positioned within the opening of the positioning hole 23 when the side surface of the optical path converter 40 is brought into contact with the edge of the receiving window 12, the optical path conversion with the receiving window 12 is performed. The gap (the difference between the inner dimension of the receiving window 12 and the outer dimension of the optical path changer 40 in the direction parallel to the circuit board: 200 μm at the maximum) in the Y direction of the taper surface 43A of the positioning pin 43 is It is designed to be smaller than the dimension (dimension in the direction parallel to the circuit board 10: about 420 μm here). If the clearance between the receiving window 12 and the optical path changer 40 is larger than the dimension in the Y direction of the taper surface 43A of the positioning pin 43, the top of the positioning pin 43 may be disengaged from the opening of the positioning hole 23. Is difficult to insert into the positioning hole 23.

By the way, if the top of the positioning pin 43 is out of the opening of the positioning hole 23, the edge of the positioning hole 23 comes into contact with the top of the positioning pin 43 when the positioning pin 43 is inserted into the positioning hole 23. Since the frustoconical positioning pin 43 has a smaller radius of curvature toward the top, the portion with the smaller radius of curvature (top) comes into contact with the edge of the positioning hole 23. In the first embodiment, since the glass substrate 20 having the positioning hole 23 is a harder member than the optical path converter 40 having the positioning pin 43, when the vicinity of the top of the positioning pin 43 comes into contact with the edge of the positioning hole 43, the positioning pin 43 is easily damaged.
If the top of the positioning pin 43 is disengaged from the opening of the positioning hole 23, when the positioning pin 43 is inserted into the positioning hole 23, the tapered surface 43A is positioned over the entire length (about 650 μm) of the tapered surface 43A. It will be in contact with the edge of the hole 23. That is, the region where the tapered surface 43A is worn becomes longer. For this reason, the positioning pin 43 is easily damaged.

  Thus, if the gap between the receiving window 12 and the optical path changer 40 is larger than the dimension in the Y direction of the tapered surface 43A of the positioning pin 43, the positioning pin 43 is likely to be damaged. As a result, a problem of contamination and a problem of a decrease in positioning accuracy are likely to occur (see FIG. 2B). On the other hand, in 1st Embodiment, 43 A of taper surfaces of the positioning pin 43 will contact the edge of the positioning hole 23 in the position away from the top part (refer FIG. 12C). For this reason, in the first embodiment, the radius of curvature of the tapered surface 43A in contact with the edge of the positioning hole 23 is small, and the length of the region where the tapered surface 43A is worn (about 310 μm) can be shortened. For this reason, damage to the positioning pin 43 can be suppressed in the first embodiment. Moreover, as a result of suppressing damage to the positioning pin 43, contamination can be suppressed and positioning accuracy can be improved (see FIG. 2A).

  As described above, the operator inserts the positioning pin 43 into the positioning hole 23 and positions the glass substrate 20 and the optical path converter 40 (S103). Thereafter, as shown in FIG. 7, the operator fixes the optical path converter 40 to the glass substrate 20 with the fixture 62 (S <b> 104), and completes the optical module 1 by incorporating these members in the housing 1 </ b> A.

=== Second Embodiment ===
In the first embodiment described above, the optical path changer 40 is fixed to the glass substrate 20 using the fixture 62 (see S104 in FIGS. 7 and 11). However, the method for fixing the optical path changer 40 is not limited to the method using the fixture 62.

  13A and 13B are explanatory diagrams of a reference example of a fixing method using the adhesive 65. FIG.

  Also in the reference example, the operator inserts the optical path converter 40 into the housing window 12 while guiding the side surface of the optical path converter 40 with the edge of the housing window 12 (see S102 in FIG. 11), and positions the positioning pin 43. The glass substrate 20 and the optical path converter 40 are positioned by inserting into the hole 23 (see S103). Thereafter, as shown in FIGS. 13A and 13B, the worker applies an ultraviolet curable resin as an adhesive 65 between the circuit board 10 and the optical path changer 40, and irradiates the ultraviolet curable resin with ultraviolet rays. 65 is cured. In the reference example, the optical path changer 40 is indirectly fixed to the glass substrate 10 by being fixed to the circuit board 10 with the adhesive 65.

  By the way, after manufacturing the optical module 1, for example, after the quality evaluation process, there are cases where it is desired to remove each component constituting the optical module 1 and reuse the component. In this case, in order to remove the optical path changer 40, it is necessary to remove the cured adhesive 65 (in contrast, in the first embodiment, the optical path changer 40 can be removed by removing the fixture 62). .

  However, since the receiving window 12 is formed in accordance with the outer shape of the optical path changer 40 so that the side of the optical path changer 40 can be guided by the edge of the receiving window 12, the optical path changer 40 fixed by the adhesive 65 and There is almost no gap between the circuit board 10 and the circuit board 10. Under such circumstances, if the adhesive 65 is peeled off using a tool such as a hand grinder as shown in FIG. 13C, the optical path converter 40 may be damaged. Further, as shown in FIG. 13C, when a force is applied from the tool from the optical path changer 40 side to the glass substrate 20 side, the circuit board 10 is damaged or a connection failure between the circuit board 10 and the glass substrate 20 occurs. There is a risk that

  Therefore, when the optical path changer 40 is fixed using the adhesive 65, the following is preferable.

  FIG. 14A is a view of the housing window 12 of the circuit board 10 according to the second embodiment as viewed from below. FIG. 14B is an explanatory diagram of the outer dimensions of the optical path converter 40 of the second embodiment. Similar to the first embodiment, the inner dimension (reference dimension) of the receiving window 12 is set to be approximately 0.1 mm larger than the outer dimension of the optical path converter 40. Further, as in the first embodiment, the recess 12B and the recess 12C are formed in the receiving window 12 so that the rounded portion by the router processing does not interfere (contact) with the optical path changer 40. A linear edge between the concave portion (the concave portion 12B or the concave portion 12C) and the concave portion functions as a guide for the side surface of the optical path converter 40. In the first embodiment, all the recesses 12A are formed on the long sides of the rectangular receiving window 12 (two recesses 12A are formed on each of the two long sides). On the other hand, in 2nd Embodiment, as shown to FIG. 14A, while one recessed part 12B is formed in two long sides of the accommodation window 12, one of the two short sides of the accommodation window 12 is shown. Two concave portions 12C are formed on the short side.

  Also in the second embodiment, the operator inserts the optical path converter 40 into the receiving window 12 while guiding the side surface of the optical path converter 40 with the edge of the receiving window 12 (see S102 in FIG. 11), and the positioning pin 43. Is inserted into the positioning hole 23 (see S103), and the glass substrate 20 and the optical path changer 40 are positioned. Thereafter, the operator applies an ultraviolet curable resin as an adhesive 65 between the circuit board 10 and the optical path converter 40 in order to fix the optical path converter 40.

  FIG. 15A is an explanatory diagram of an adhesive application range viewed from the lower side (the optical path converter 40 side). FIG. 15B is a schematic explanatory view of the optical path changer 40 fixed with the adhesive 65 as viewed from obliquely below.

  The adhesive 65 is applied to three locations between the circuit board 10 and the optical path changer 40. In any bonding location, the adhesive 65 covers the circuit board 10 so as to cover only a part of the concave part (so that a part of the concave part is exposed) without covering the whole concave part (the concave part 12B or the concave part 12C). And the optical path changer 40. At this time, a part of the adhesive 65 (an adhesive covering the recess) is applied so as to straddle the recess, and another part of the adhesive 65 (an adhesive not covering the recess) is applied to the recess of the circuit board 10. It is applied between the linear edge between them (portion serving as a guide) and the optical path changer 40. In addition, since a part of the adhesive 65 is applied so as to straddle the concave portion, the adhesive 65 is bonded so that a space is formed between the adhesive 65 and the glass substrate 20 (not shown in FIG. 15B). Agent 65 is applied.

  The operator thus applies the ultraviolet curable resin as the adhesive 65 and then irradiates the ultraviolet curable resin with ultraviolet rays to cure the adhesive 65. Thus, the optical path changer 40 is indirectly fixed to the glass substrate 10 by being fixed to the circuit board 10 with the adhesive 65. In addition, since a part of the adhesive 65 was applied so as to straddle the concave portion (the concave portion 12B or the concave portion 12C), in this portion, the solidified adhesive 65 and the glass substrate on the upper side (see the arrow indicating “up” in FIG. 15B). 20 (not shown in FIG. 15B), a space is formed. That is, a space is formed between the adhesive 65 that covers the recess and the glass substrate 20.

  FIG. 16 is an explanatory diagram of how to peel off the adhesive 65 of the second embodiment.

  When peeling off the adhesive 65, first, the operator inserts the tip of a tool such as tweezers into the recess (in the drawing, the recess 12B). Since the adhesive 65 is applied so that a part of the recess is exposed, the tip of the tool can be inserted into the recess. Next, the operator forms a space between the solidified adhesive 65 and the glass substrate 20 (not shown in FIG. 15B) on the upper side (see the arrow indicating “up” in FIG. 16). Insert the tip of the tool into the space. Then, the operator applies a force to the adhesive 65 in the direction of peeling from the circuit board 10 (in the direction of the arrow in FIG. 16), and peels off the adhesive 65. In addition, since the adhesive 65 is solidified, by applying a force to a part of the adhesive 65, the entire adhesive 65 is peeled off.

  According to said 2nd Embodiment, after positioning the glass substrate 20 (1st member) and the optical path changer 40 (2nd member) similarly to 1st Embodiment, it is a recessed part (recessed part 12B and recessed part 12C). The adhesive 65 is applied so as to cover a part of the recess without covering all of the above) to form a space between the adhesive 65 covering the recess and the glass substrate 20, and the optical path changer 40 is formed by the adhesive 65. Is fixed to the circuit board 10 (see FIGS. 15A and 15B). When the adhesive 65 is applied in this manner, the tool can be inserted into the space between the adhesive 65 covering the recess and the glass substrate 20 when the adhesive 65 is peeled off with a tool (see FIG. 16). ). Thus, when the adhesive 65 is peeled off with a tool, the optical path changer 40 is not damaged by the tool. In addition, since a force is applied to the adhesive 65 in the direction of peeling from the circuit board 10, the peeling force is not easily applied to the glass substrate 20, so that connection failure between the circuit board 10 and the glass substrate 20 can be suppressed.

  Further, when applying a force to the adhesive 65 in the direction of peeling from the circuit board 10, the operator brings the tool into contact with the edge of the concave portion (the concave portion 12B in FIG. 16), and uses the contact point as a fulcrum, with the tip of the tool. A force may be applied to the adhesive 65. Thereby, since the adhesive can be peeled off at the tip of the tool using the “lever principle”, the adhesive 65 can be easily peeled off.

=== Third Embodiment ===
The optical module 1 of the first embodiment described above is configured to dissipate heat to the heat sink 3 attached to the upper part of the cage 2. However, the optical module 1 is not limited to such a configuration.

  FIG. 17 is a schematic configuration diagram of an optical module according to the third embodiment. The same members as those in the first embodiment are denoted by the same reference numerals.

  The optical module according to the third embodiment also includes a circuit board 10, a glass substrate 20, and an optical path converter 40. Each component of the third embodiment is arranged by vertically inverting each component of the optical module 1 of the first embodiment. The optical module according to the third embodiment is configured to radiate heat generated from the light emitting unit 31 and the driving element 32 to the lower side (the main board side to which the cage 2 is grounded) via the heat radiating sheet 61. .

  Also in the third embodiment, the accommodation window 12 is formed in the circuit board 10. A glass substrate 20 is mounted on the lower surface (first surface) of the circuit board 10 so as to close the housing window 12. A light emitting unit 31 and a driving element 32 are mounted on the lower surface of the glass substrate 20. A positioning hole 23 is formed on the upper surface of the glass substrate 20.

  A positioning pin 43 is formed on the lower surface of the optical path changer 40. By positioning the positioning pin 43 in the positioning hole 23 of the glass substrate 20, the optical path converter 40 and the glass substrate 20 are positioned, and the optical axis of the lens portion 41 of the optical path converter 40 and the glass substrate 20 are mounted. The alignment with the optical axis of the light emitting unit 31 is performed. In the third embodiment, the height of the optical module is reduced by arranging the lower portion of the thick optical path changer 40 in the receiving window 12.

  When manufacturing the optical module of the third embodiment, the optical path converter 40 is guided by the edge of the housing window 12 from the upper surface (second surface) side of the circuit board 10, so that the optical path converter 40 is accommodated in the housing window. 12 is inserted. This facilitates the insertion of the positioning pin 43 into the positioning hole 23. The positioning pin 43 of the third embodiment is also in the shape of a truncated cone, but by guiding the optical path converter 40 by the edge of the receiving window 12, damage to the positioning pin 43 can be suppressed as in the first embodiment.

=== Others ===
The above-described embodiments are for facilitating the understanding of the present invention, and are not intended to limit the present invention. The present invention can be modified and improved without departing from the gist thereof, and it goes without saying that the present invention includes equivalents thereof. In particular, the embodiments described below are also included in the present invention.

<Positioning hole and positioning pin>
The positioning hole is formed by sandblasting, but the positioning hole may be formed by any other processing method such as etching. Even in other processing methods, if the positioning hole has a constricted shape, a frustoconical positioning pin is inserted to thereby make a direction perpendicular to the axial direction of the positioning hole or the positioning pin (glass substrate 20 The positioning accuracy in the direction parallel to the surface of the surface can be increased.

  Further, the positioning hole may be a hole having a constant diameter as shown in FIG. Further, the positioning pin may have a conical shape as shown in FIG. 10B or a cylindrical shape as shown in FIG. 10C instead of the truncated cone shape. Further, the positioning hole may be a through hole instead of a non-through hole. However, in this case, the degree of freedom of component mounting and wiring on the surface of the glass substrate 20 is reduced. As described above, even when the shape of the positioning hole or the positioning pin is different from the above-described embodiment, the optical path converter 40 is guided by the edge of the receiving window 12 and the optical path converter 40 is inserted into the receiving window 12. This facilitates insertion of the positioning pins into the positioning holes.

  In the above-described embodiment, the positioning holes 23 are formed in the glass substrate 20 and the positioning pins 43 are formed in the optical path converter 40. However, the positioning holes and the positioning pins may be arranged in reverse. That is, a positioning pin is formed in the glass substrate 20 (first member mounted on the circuit board), and a positioning hole is formed in the optical path converter 40 (second member positioned with respect to the first member). May be.

<About dimensions of housing window, optical path changer and positioning pin>
In the above-described embodiment, as shown in FIGS. 12A to 12C, the difference (up to 200 μm) between the size of the receiving window and the size of the optical path changer in the direction parallel to the circuit board is equal to It was smaller than the dimension in the Y direction (about 420 μm). By making the dimensions of the receiving window 12, the optical path changer 40, and the positioning pin 43 in such a relationship, the top of the frustoconical positioning pin 43 is surely positioned within the opening of the positioning hole 23. However, the dimensions of the receiving window 12, the optical path changer 40, and the positioning pin 43 are not limited to such a relationship.

  For example, the difference between the dimension of the receiving window and the dimension of the optical path converter in the direction parallel to the circuit board may be larger than the dimension of the taper surface of the positioning pin 43 in the Y direction. In such a case, the top of the frustoconical positioning pin 43 may not be positioned within the opening of the positioning hole 23 (the certainty that the top of the frustoconical positioning pin 43 is positioned within the opening of the positioning hole 23). But decrease). However, if the optical path changer 40 is inserted into the accommodation window 12 while guiding the optical path changer 40 to the edge of the accommodation window 12, the movement range of the optical path changer 40 relative to the circuit board 10 is limited. It becomes easy to insert into the positioning pin 43.

<About glass substrate>
In the above-described embodiment, the glass substrate 20 is mounted on the circuit board as a transparent substrate that can transmit light. However, the transparent substrate capable of transmitting light is not limited to glass, and may be made of resin, for example.

<About optical modules>
In the above embodiment, the QSFP type optical module has been described. However, the present invention is not limited to this type. It is also possible to apply to other types of optical modules (for example, CXP type and SFP type).

  Moreover, although the above-mentioned embodiment demonstrated the optical module used for optical communication, modules other than an optical module may be used. For example, when a module used for telecommunications has a circuit board, a first member mounted on the circuit board, and a second member positioned with respect to the first member, the housing window is blocked. As described above, the second member may be inserted into the accommodation window of the circuit board on which the first member is mounted while being guided by the edge of the accommodation window. Even in such a case, it is possible to reduce the height of the module and to easily position the two members positioned by the positioning holes and the positioning pins. In the case of a module used for telecommunications, the first member mounted on the circuit board is not a transparent substrate and does not include a support member that supports the optical fiber 50.

1 optical module, 1A housing,
2 cage, 2A connector, 3 heat sink,
10 circuit boards, 11 connections,
12 receiving window (window), 12A recess, 13 circuit board side electrode,
20 glass substrate (first member, transparent substrate), 21 through via,
22 glass substrate side electrode, 23 positioning hole,
31 light emitting part, 31A light emitting part side electrode, 31B light emitting surface, 32 drive element,
40 optical path changer (second member, support member), 41 lens unit, 42 reflection unit,
43 locating pin, 43A taper surface, 44 fiber support,
50 optical fiber, 61 heat dissipation sheet, 62 fixture,
63 body, 63A engaging part, 64 hook plate

Claims (12)

A method of manufacturing a module comprising a circuit board, a first member mounted on the circuit board, and a second member positioned with respect to the first member,
A circuit board having a window formed thereon, the circuit board having the first member mounted on a first surface of the circuit board so as to close the window;
Inserting the second member into the window while being guided by the edge of the window from the second surface side opposite to the first surface of the circuit board; and
By inserting a positioning pin provided in the other member into a positioning hole provided in one of the first member and the second member, the first member and the second member as well as a module manufacturing method for performing positioning a,
The window is formed in a rectangular shape,
A concave portion is formed at the corner of the rectangular window,
The concave portion is formed with a rounded portion of the diameter of the tool when the window is formed by router processing,
The module manufacturing method , wherein a linear edge between the recess and the recess functions as a guide for a side surface of the second member . The module manufacturing method according to claim 1,
The module manufacturing method, wherein the positioning pin has a truncated cone shape. The module manufacturing method according to claim 2,
The module manufacturing method, wherein when the second member is brought into contact with an edge of the window, a top portion of the positioning pin is positioned in an opening of the positioning hole. The module manufacturing method according to claim 2 or 3,
The difference between the dimension of the window and the dimension of the second member in the direction parallel to the circuit board is:
The module manufacturing method characterized by being smaller than the dimension in the said direction of the taper surface of the said positioning pin of the said truncated cone shape. The module manufacturing method according to claim 3 or 4,
The module manufacturing method, wherein the one member having the positioning hole is harder than the other member having the positioning pin. A module manufacturing method according to any one of claims 2 to 5,
The module manufacturing method, wherein the positioning hole is a non-through hole with a deep back. The module manufacturing method according to claim 6,
The module manufacturing method, wherein the positioning hole is formed by blasting. It is a module manufacturing method in any one of Claims 1-7 ,
After positioning the first member and the second member, an adhesive is applied so as to cover a part of the recess without covering all of the recess, and the adhesion covering the recess A module manufacturing method, wherein a space is formed between an agent and the first member, and the second member is fixed to the circuit board by the adhesive. The module manufacturing method according to claim 8 ,
When peeling the adhesive with a tool,
Let the tip of the tool enter the space;
A module manufacturing method, wherein the tool is brought into contact with an edge of the recess, and the adhesive is peeled off at the tip of the tool with the contact point as a fulcrum. It is a module manufacturing method in any one of Claims 1-9 ,
The first member is a transparent substrate capable of transmitting light;
The second member is a support member that supports an optical fiber that transmits light,
The transparent substrate is mounted with a photoelectric conversion element that emits light toward the transparent substrate or receives light transmitted through the transparent substrate,
The support member forms an optical path between the photoelectric conversion element and the optical fiber together with the transparent substrate,
A module manufacturing method, wherein the transparent substrate and the support member are positioned by inserting the positioning pins of the support member into the positioning holes of the transparent substrate. A circuit board with a window formed thereon;
A first member mounted on the first surface of the circuit board so as to close the window;
A second member inserted into the window from a second surface side opposite to the first surface of the circuit board and positioned with respect to the first member;
The window is formed in a rectangular shape,
A concave portion is formed at the corner of the rectangular window,
The concave portion is formed with a rounded portion of the diameter of the tool when the window is formed by router processing,
A positioning hole is provided in one of the first member and the second member, and a truncated cone-shaped positioning pin is provided in the other member,
The module, wherein the top of the positioning pin is positioned within the opening of the positioning hole when the second member is brought into contact with a linear edge between the concave portion and the concave portion of the window. A circuit board with a window formed thereon;
A first member mounted on the first surface of the circuit board so as to close the window;
A second member inserted into the window from a second surface side opposite to the first surface of the circuit board and positioned with respect to the first member;
A positioning hole is provided in one of the first member and the second member, and a truncated cone-shaped positioning pin is provided in the other member,
The difference between the dimensions of said second member of the window in the direction parallel to the circuit board, rather than the dimension in the direction of the tapered surface of the positioning pin of the frustoconical, rather small,
The window is formed in a rectangular shape,
A concave portion is formed at the corner of the rectangular window,
The concave portion is formed with a rounded portion of the diameter of the tool when the window is formed by router processing,
The module , wherein a linear edge between the recess and the recess functions as a guide for a side surface of the second member .

Images