JP2014228585A - Method of manufacturing optical module, and optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the yield of an optical module by allowing prior inspection even in the case where a non-through positioning hole is formed on the side opposite to a mounting surface of a photoelectric transducer.SOLUTION: A method of manufacturing an optical module includes: a preparation step (1) of preparing a transparent substrate which has a non-through positioning hole formed on one surface thereof and has a photoelectric transducer mounted on the other surface and can transmit light emitted from the photoelectric transducer or light received by the photoelectric transducer, and a support member which has a positioning pin and supports an optical fiber and forms an optical path between the photoelectric transducer and the optical fiber along with the transparent substrate; a positioning step (2) of inserting the positioning pin of the support member to the positioning hole of the transparent substrate to position the transparent substrate and the support member; and an observation step (3) of observing the positioning hole through the transparent substrate from the side opposite to the surface provided with the positioning hole.

Description

  The present invention relates to an optical module manufacturing method and an optical module.

  In the field of high-speed optical communication using an optical fiber, an optical transceiver is used as a component that mutually converts an electrical signal and an optical signal. The specifications (shape, dimensions, pin assignment, etc.) of pluggable optical transceivers are standardized by MSA (Multi Source Agreement) agreed by an industry group that handles optical transceivers. According to these pluggable optical transceivers, a cage is installed on a main board on the communication device side (host side), and an optical module incorporating a photoelectric conversion element and a circuit board is detachably inserted into the cage. When the optical module is inserted into the cage, the circuit board in the optical module is electrically and mechanically connected to the electrical interface connector in the cage. Thereby, the optical signal transmitted and received by the optical fiber and the electric signal processed by the main board on the communication device side can be converted into each other by the photoelectric conversion element and the circuit board in the optical module.

  In Patent Document 1, a photoelectric conversion element (optical device 2) is mounted on the upper surface of a substrate (reference numeral 1), and a positioning pin (reference numeral 9) is inserted into a positioning hole (reference numeral 11) from the lower surface side of the substrate. It is described that the optical axis of the photoelectric conversion element is aligned with the optical axis of the lens (reference numeral 3) of the optical connector by positioning the substrate and the optical connector.

JP 2005-17684 A

  In Patent Document 1, the positioning hole is formed as a through hole in the substrate. In this case, since an opening is formed on the upper surface of the substrate (the mounting surface of the photoelectric conversion element), there are restrictions on the arrangement of elements and wiring on the upper surface of the substrate. On the other hand, when the positioning hole is a non-through hole, restrictions on the arrangement of elements and wiring on the upper surface of the substrate are reduced, but the positioning hole is located on the opposite side of the upper surface of the substrate (the mounting surface of the photoelectric conversion element). For this reason, it becomes difficult to inspect the position of the positioning hole with respect to the photoelectric conversion element, or to inspect the position of the member positioned by the positioning hole in advance. However, simply inspecting the manufactured optical module without performing the preliminary inspection increases the defect rate of the optical module (lowers the yield), and the manufacturing process is wasteful.

  An object of the present invention is to make it possible to inspect in advance a non-penetrating positioning hole formed on the side opposite to the mounting surface of the photoelectric conversion element, and to improve the yield of the optical module.

  The main invention for achieving the above object is as follows. (1) A non-penetrating positioning hole is formed on one surface, a photoelectric conversion element is mounted on the other surface, and the light emitted from the photoelectric conversion element or the photoelectric A transparent substrate capable of transmitting light received by the conversion element, a positioning pin, supporting an optical fiber, and forming a light path between the photoelectric conversion element and the optical fiber together with the transparent substrate; (2) a positioning step of positioning the transparent substrate and the support member by inserting the positioning pins of the support member into the positioning holes of the transparent substrate, and (3) the positioning And an observation step of observing the positioning hole through the transparent substrate from the side opposite to the surface with the hole.

  Other characteristics of the present invention will be made clear by the description and drawings described later.

  ADVANTAGE OF THE INVENTION According to this invention, the non-penetrating positioning hole formed in the opposite side to the mounting surface of a photoelectric conversion element can be tested in advance, and the yield of an optical module can be improved.

FIG. 1 is an explanatory diagram of a pluggable optical transceiver. FIG. 2A is a perspective view of the circuit board 10 and the like in the housing 1A of the optical module 1 as viewed obliquely from above. FIG. 2B is a perspective view of the circuit board 10 and the like as viewed obliquely from below. FIG. 3 is a schematic configuration diagram of the optical module 1. 4A and 4B are cross-sectional views of the positioning hole 23 and the positioning pin 43. FIG. FIG. 5A is an enlarged view of the vicinity of the root of the positioning pin 43. FIG. 5B is an enlarged view of the vicinity of the root of the positioning pin 43 of the reference example. FIG. 5C is an enlarged view of the vicinity of the root of the positioning pin 43 of the reference example. FIG. 6 is a flowchart of the method for manufacturing the optical module 1. FIGS. 7A and 7B are schematic explanatory views showing a state where the positioning pins 43 are inserted into the positioning holes 23 and the glass substrate 20 and the optical path changer 40 are positioned. FIG. 8 is an explanatory diagram of the state of observation in S003. 9A and 9B are observation images (photographs) when the positioning hole 23 is observed from the upper side through the glass substrate 20. FIG. 9A is an observation image in a normal state. FIG. 9B is an observation image at the time of abnormality. FIG. 10 is an explanatory diagram of the situation of the observation image (photograph). FIG. 11 is a diagram representing FIG. 10. FIG. 12A is a contour extraction image of the observation image of FIG. 9A, and is a contour extraction image in a normal state. FIG. 12B is a contour extraction image of the observation image of FIG. 9B and is a contour extraction image at the time of abnormality. FIG. 13 is an explanatory diagram of a method for fixing the optical path changer 40. FIG. 14 is a flowchart of the manufacturing method of the optical module 1 of the second embodiment. FIG. 15A is an explanatory diagram of a state of observation in S102. FIG. 15B is an explanatory diagram of the positioning pin 43 of the second embodiment. 16A and 16B are explanatory diagrams of a comparative example in which the positioning pin 43 is inserted into the positioning hole 23 without being aligned. FIG. 17 is a flowchart of the manufacturing method of the optical module 1 of the third embodiment. FIG. 18 is an explanatory diagram of the state of the inspection in S201. FIG. 19 is an observation image (photograph) of S201. FIG. 20 is an explanatory diagram of the observation image of FIG. FIG. 21 is an explanatory diagram of the positioning holes of the fourth embodiment.

  At least the following matters will be apparent from the description and drawings described below.

(1) A non-penetrating positioning hole is formed on one surface, a photoelectric conversion element is mounted on the other surface, and the light that is emitted from the photoelectric conversion element or the light that is received by the photoelectric conversion element is transparent. A preparatory step of preparing a substrate and a support member having a positioning pin, supporting an optical fiber, and forming an optical path between the photoelectric conversion element and the optical fiber together with the transparent substrate; A positioning step of positioning the transparent substrate and the support member by inserting the positioning pins of the support member into the positioning holes of the transparent substrate; and (3) a transparent substrate from the side opposite to the surface having the positioning holes. And an observing step of observing the positioning hole through the optical module manufacturing method.
According to such a manufacturing method, a non-penetrating positioning hole formed on the side opposite to the mounting surface of the photoelectric conversion element can be inspected in advance, and the yield of the optical module can be improved.

  It is desirable to inspect the positioning accuracy of the transparent substrate and the support member based on the observation image of the observation step performed after the positioning step. Thereby, the positioning accuracy of the transparent substrate and the support member can be inspected in a state where the positioning pins of the support member are inserted into the positioning holes of the transparent substrate.

  Preferably, the positioning pin has a tapered surface, and the positioning accuracy is inspected according to the positional relationship between the positioning hole and the root of the positioning pin in the observation image. When the positioning pin has a tapered surface, it becomes easy to identify the positioning hole and the root of the positioning pin in the observation image.

  It is desirable that a recess is formed around the base of the positioning pin. By forming the recess, it becomes easier to identify the positioning hole and the root of the positioning pin in the observation image.

  It is desirable that the positioning step is performed after aligning the transparent substrate and the support member in a direction parallel to the surface of the transparent substrate based on an observation image of the observation step. Thereby, the positioning accuracy of the transparent substrate and the support member is increased.

  Preferably, an alignment mark is formed on the top of the positioning pin, and the transparent substrate and the support member are aligned according to the positional relationship between the positioning hole and the alignment mark in the observation image. . Thereby, alignment with the said transparent substrate and the said supporting member becomes easy.

  It is desirable that the position of the positioning hole in the transparent substrate is inspected based on the observation image in the observation step, and the transparent substrate after the inspection is prepared in the preparation step. Thereby, a transparent substrate having a non-penetrating positioning hole formed on the side opposite to the mounting surface of the photoelectric conversion element can be inspected in advance, and the yield of the optical module can be improved.

  An alignment mark formed together with the wiring to the photoelectric conversion element is formed on the one surface, and the positioning with respect to the photoelectric conversion element is performed according to a positional relationship between the positioning hole and the alignment mark in the observation image. It is desirable to inspect the position of the holes. This facilitates inspection of the position of the positioning hole.

A wiring with a metal pattern is formed on a mounting surface on which the photoelectric conversion element is mounted, a non-penetrating positioning hole is formed on a surface opposite to the mounting surface, and the light emitted from the photoelectric conversion element or the photoelectric conversion A transparent substrate capable of transmitting light received by the element, a support member having a positioning pin, supporting the optical fiber, and forming an optical path between the photoelectric conversion element and the optical fiber together with the transparent substrate; An optical module having an optical module, wherein the wiring is not formed in a region of the mounting surface on the back side of the positioning hole, and the positioning hole can be observed from the mounting surface side. Becomes clear.
According to such an optical module, a non-penetrating positioning hole formed on the side opposite to the mounting surface of the photoelectric conversion element can be inspected from the mounting surface side.

  It is preferable that an alignment mark formed together with the wiring is formed in a region on the mounting surface on the back side of the positioning hole. Thereby, the alignment mark can be observed together with the positioning hole.

  A reference hole and a long hole are formed as the positioning hole, and the long hole is formed so that a longitudinal direction thereof is along a line connecting the reference hole and the long hole, and the reference on the mounting surface is formed. It is desirable that the wiring is not formed in the region on the back side of the hole, and the reference hole can be observed from the mounting surface side. Thereby, it is possible to test | inspect the positioning hole which contributes to positioning accuracy among two positioning holes.

=== First Embodiment ===
<Overall configuration>
FIG. 1 is an explanatory diagram of a pluggable optical transceiver. An optical transceiver having both an optical transmitter and an optical receiver is sometimes referred to as an optical transceiver, but here, an optical transceiver having only one is also referred to as an optical transceiver. The pluggable optical transceiver in the figure is of the QSFP type (QSFP: Quad Small Form Factor Pluggable) defined by MSA (Multi Source Agreement). The pluggable optical transceiver has an optical module 1 and a cage 2.

  In the drawing, two types of optical modules 1 are depicted. As shown in the drawing, an optical fiber (including a cord) may be fixed to the optical module 1 or may be detachable. One of the two cages 2 in the figure is drawn with the heat sink 3 removed and partially broken so that the inside can be seen.

  In the following description, as shown in FIG. 1, front and rear, up and down, and left and right are defined. That is, the insertion port side of the cage 2 into which the optical module 1 is inserted is referred to as “front”, and the opposite side is referred to as “rear”. In the optical module 1, the side from which the optical fiber (including the cord) extends is referred to as “front”, and the opposite side is referred to as “rear”. Further, when viewed from the main board on which the cage 2 is provided, the side of the surface on which the cage 2 is provided is “upper”, and the opposite side is “lower”. Also, the direction orthogonal to the front-rear direction and the up-down direction is referred to as “left-right”.

  A cage 2 is installed on the main board on the communication device side (host side). The cage 2 is provided on a main board of a blade server in the data center, for example.

  The optical module 1 is detachably inserted into the cage 2. The optical module 1 includes a photoelectric conversion element 31 and a circuit board 10 in a housing 1A, and mutually converts an optical signal transmitted / received by an optical fiber and an electric signal processed by a main board on a communication device side. To do.

  The cage 2 accommodates the optical module 1 in a detachable manner. The cage 2 is a box-shaped member having a rectangular section in the front-rear direction with an insertion slot for inserting the optical module 1 on the front side. The cage 2 is formed by bending a metal plate so as to open the front side. An accommodating portion for accommodating the optical module 1 is formed in the cage 2 by bending the metal plate into a rectangular cross section. A connector 2 </ b> A is provided on the rear side inside the cage 2. When the optical module 1 is inserted into the cage 2, the circuit board in the optical module 1 is electrically and mechanically connected to the connector 2 </ b> A in the cage 2. Thereby, an electrical signal is transmitted between the optical module 1 and the main board.

  The upper surface of the cage 2 has an opening, and a heat sink 3 is attached so as to close the opening. The heat sink 3 includes a large number of heat radiation fins (heat radiation pins) for radiating the heat of the optical module 1 inserted into the cage 2 to the outside.

<Internal configuration of optical module 1>
FIG. 2A is a perspective view of the circuit board 10 and the like in the housing 1A of the optical module 1 as viewed obliquely from above. FIG. 2B is a perspective view of the circuit board 10 and the like as viewed obliquely from below. FIG. 3 is a schematic configuration diagram of the optical module 1.

  As shown in the figure, the optical module 1 includes a circuit board 10, a glass substrate 20, and an optical path changer 40 in a housing 1A.

  The circuit board 10 is a plate-like printed board that constitutes an electronic circuit. A connection portion 11 (card edge connector) for connecting to a connector 2A (connector socket) in the cage 2 is formed at the rear end portion of the circuit board 10. The connection portion 11 is formed on both upper and lower surfaces of the circuit board 10 and a large number of terminals are formed side by side in the left-right direction.

  An accommodation window 12 for accommodating the optical path converter 40 is formed in the circuit board 10. A circuit board side electrode 13 is formed on the upper surface of the circuit board 10 so as to surround the housing window 12. A glass substrate 20 is mounted on the upper surface of the circuit board 10 so as to close the accommodation window 12. In other words, the housing window 12 of the circuit board 10 is positioned below the glass substrate 20, and the housing window 12 of the circuit board 10 is closed by the lower surface of the glass substrate 20. A glass substrate side electrode 22 is formed on the lower surface of the glass substrate 20, and the glass substrate 20 is connected to the circuit substrate side electrode 13 and the glass substrate side electrode 22 while closing the housing window 12 of the circuit substrate 10. It is mounted on the circuit board 10.

  The housing window 12 is a through hole (opening) formed in the circuit board 10. The upper portion of the optical path changer 40 is inserted into the accommodation window 12. The lower part of the optical path changer 40 protrudes downward from the receiving window 12, and the optical fiber 50 extends forward from the protruding part. However, when the optical path changer 40 is thinner than the circuit board 10, the lower part of the optical path changer 40 does not protrude downward from the receiving window 12. In this case, if the reflecting portion 42 is configured to reflect light at an obtuse angle, the optical fiber 50 can be easily pulled out from the optical path converter 40.

  The glass substrate 20 is a transparent glass substrate that can transmit light. The glass substrate 20 is comprised from glass materials, such as quartz glass and borosilicate glass, for example, and the borosilicate glass is employ | adopted here. A plurality of through vias 21 are formed in the glass substrate 20 along the shape of the receiving window 12 of the circuit board 10.

  A glass substrate side electrode 22 is formed on the lower surface of the glass substrate 20 (the surface opposite to the mounting surface on which the light emitting unit 31 is mounted). The glass substrate side electrode 22 is formed outside the through via 21. Further, the glass substrate side electrode 22 is formed along the outside of the accommodation window 12 of the circuit board 10. The glass substrate side electrode 22 is electrically connected to the circuit substrate side electrode 13 on the upper surface of the circuit substrate 10. The through via 21 is used for wiring between the glass substrate side electrode 22, the light emitting unit 31, and the driving element 32.

  Two positioning holes 23 for positioning the optical path changer 40 are formed on the lower surface of the glass substrate 20. The positioning hole 23 does not penetrate the glass substrate 20 and is formed to be a non-through hole. By making the positioning hole 23 a non-through hole, it becomes possible to mount a component (for example, the drive element 32) on the upper side of the positioning hole 23 and to arrange a wiring to the component. The degree of freedom of component mounting and wiring 27 on the upper surface is increased.

  A wiring 27 made of a metal pattern is formed on the upper surface of the glass substrate 20 in order to mount the light emitting unit 31, the driving element 32, and the like. However, in the region above the positioning hole 23 (the region on the back side of the positioning hole 23 on the mounting surface; the region on the mounting surface facing the positioning hole 23), the wiring 27 made of a metal pattern is not formed. This is because the positioning hole 23 is observed from the upper side of the glass substrate 20 through the glass substrate 20. In FIG. 3, the drive element 32 is drawn above the rear positioning hole 23, but there is a gap between the two drive elements 32 above the rear positioning hole 23 (see FIG. 2A). ), The positioning hole 23 can be observed through the glass substrate 20 from the gap.

  A light emitting unit 31 is mounted on the upper surface of the glass substrate 20. A driving element 32 for driving the light emitting unit 31 is also mounted on the upper surface of the glass substrate 20 (the mounting surface of the light emitting unit 31). The light emitting unit 31 and the driving element 32 are disposed inside the through via 21. In other words, the light emitting unit 31 and the driving element 32 are mounted on the upper surface of the glass substrate 20 so as to be positioned above the receiving window 12 of the circuit board 10.

  The light emitting unit 31 is a photoelectric conversion element that converts an optical signal and an electrical signal. Here, a VCSEL (Vertical Cavity Surface Emitting Laser) that emits light perpendicular to the substrate is employed as the light emitting unit 31. Note that a light receiving unit that converts an optical signal into an electrical signal may be mounted on the glass substrate 20 as a photoelectric conversion element. Further, both the light emitting unit and the light receiving unit may be mounted on the glass substrate 20.

  The light emitting unit side electrode 31A and the light emitting surface 31B of the light emitting unit 31 are formed on the lower surface (the surface on the glass substrate 20 side). The light emitting unit 31 is flip-chip mounted on the glass substrate 20 and irradiates light toward the glass substrate 20. Since the light emitting unit side electrode 31A and the light emitting surface 31B of the light emitting unit 31 are located on the same side (the lower surface on the side of the glass substrate 20), if the light emitting unit 31 is flip-chip mounted on the glass substrate 20, the light emitting surface 31B. Faces the glass substrate 20, and the light emitting surface 31B is not exposed to the outside.

  3 shows one light emitting surface 31B of the light emitting unit 31, the light emitting unit 31 includes a plurality of (for example, four) light emitting surfaces 31B arranged in a direction perpendicular to the paper surface.

  The optical path converter 40 is an optical component that converts the optical path of the light emitted from the light emitting unit 31. The optical path converter 40 also functions as a support member that supports one end of the optical fiber 50 and forms the optical path between the light emitting unit 31 and the optical fiber 50 together with the transparent substrate. The optical path changer 40 is a member that is positioned and attached to the glass substrate 20. The optical path changer 40 is inserted into the receiving window 12 from the lower side of the circuit board 10.

  The optical path changer 40 includes a lens unit 41 and a reflection unit 42. The lens unit 41 is formed on the upper surface of the optical path changer 40. The reflection part 42 is formed on the lower surface of the optical path changer 40.

  The lens portion 41 is a portion formed in a convex lens shape so that light can be focused. However, the lens portion 41 is formed in a concave portion recessed from the upper surface so as not to protrude from the upper surface of the optical path changer 40. Since the lens portion 41 is formed to be recessed from the upper surface of the optical path changer 40, the lens portion 41 is prevented from coming into contact with the lower surface of the glass substrate 20. The lens unit 41 focuses the light emitted from the light emitting unit 31, guides the light to the reflecting unit 42, and causes the light to enter the optical fiber 50. When the light receiving unit is mounted on the glass substrate 20, the lens unit 41 focuses the light reflected from the reflecting unit 42 on the light receiving unit. The lens unit 41 faces the light emitting surface 31B of the light emitting unit 31 with the glass substrate 20 interposed therebetween.

  The reflection part 42 is a part for reflecting light. The optical axis of the light emitted from the light emitting unit 31 is the vertical direction (the direction perpendicular to the substrate such as the circuit board 10 or the glass substrate 20), but the optical axis of the light reflected by the reflecting unit 42 is the front-rear direction (circuit (Direction parallel to the substrate such as the substrate 10 or the glass substrate 20). The light reflected by the reflection unit 42 enters the optical fiber 50 attached to the optical path changer 40. When the light receiving part is mounted on the glass substrate 20, the reflecting part 42 reflects the light emitted from the optical fiber 50, guides it to the lens part 41, and focuses it on the light receiving part.

  In addition, the reflection part 42 in a figure is drawn so that the optical axis of reflected light may become the front-back direction (direction parallel to substrates, such as the circuit board 10 and the glass substrate 20). However, the reflection part 42 is not restricted to what reflects light at 90 degree | times. The reflection unit 42 may be configured to reflect light at an obtuse angle (for example, about 100 degrees). The light whose optical axis is in the vertical direction (direction perpendicular to the substrate such as the circuit board 10 or the glass substrate 20) has a component in the front-rear direction (direction parallel to the substrate such as the circuit board 10 or the glass substrate 20). It only has to be reflected. For example, when the root of the optical fiber 50 is relatively above the optical path converter 40 or when the thickness of the optical path converter 40 is thinner than the thickness of the circuit board 10, the optical fiber 50 is pulled out from the optical path converter 40. In order to facilitate, it is preferable that the reflecting portion 42 be configured to reflect light at an obtuse angle.

  The optical fiber 50 is aligned and attached so as to have a predetermined positional relationship with respect to the lens portion 41 and the reflecting portion 42 of the optical path changer 40.

  In the optical path changer 40 in the figure, a lens portion 41 is provided only at a site where light enters. However, a lens part may be provided also in a part where light is emitted (part facing the end of the optical fiber 50), and the optical path converter 40 may be provided with two lens parts. If the two lens portions are collimator lenses, parallel light can be propagated in the optical path changer 40.

  On the upper surface of the optical path changer 40, two positioning pins 43 for insertion into the positioning holes 23 of the glass substrate 20 are formed so as to protrude. The positioning pin 43 of the optical path converter 40 is fitted into the positioning hole 23 of the glass substrate 20, whereby the optical axis of the lens unit 41 of the optical path converter 40 and the optical axis of the light emitting unit 31 mounted on the glass substrate 20. Alignment is performed.

  The optical path converter 40 is integrally formed of resin. That is, the lens part 41, the reflection part 42, and the positioning pin 43 of the optical path changer 40 are integrally formed of resin. Moreover, the optical path changer 40 is shape | molded by resin which can permeate | transmit light, and here polyetherimide resin is used.

  The optical path changer 40 is a thicker part than the other parts in order to secure the area of the reflection part 42 and to secure the area for connecting the end of the optical fiber 50. However, when the circuit board 10, the glass substrate 20, and the optical path changer 40 are simply stacked by arranging the upper part of the thick optical path changer 40 in the housing window 12 (or via a relay board). Compared with the case where the glass substrate 20 and the optical path changer 40 are attached to the circuit board 10), the height of the optical module is reduced.

<About positioning hole 23 and positioning pin 43>
4A and 4B are cross-sectional views of the positioning hole 23 and the positioning pin 43. FIG.
A non-penetrating positioning hole 23 is formed in the glass substrate 20. By making the positioning hole 23 a non-through hole, the degree of freedom of component mounting and wiring 27 on the upper surface of the glass substrate 20 is increased. As a method for forming the positioning hole 23 in the glass substrate 20, low-cost sand blasting is employed. Since the non-through hole is formed in the glass substrate 20 by sandblasting, the positioning hole 23 has a deep shape.

  The optical path changer 40 is formed with a frustoconical positioning pin 43 having a tapered surface 43A. Since the taper surface 43A of the positioning pin 43 can contact the opening (edge) of the positioning hole 23 without a gap, the positioning error in the direction perpendicular to the axial direction of the positioning pin 43 can be suppressed, and the positional deviation error of the optical axis can be suppressed.

  The opening diameter of the positioning hole 23 and the root diameter of the positioning pin 43 are substantially the same. However, since the tapered surface 43A of the positioning pin 43 is brought into contact with the opening (edge) of the positioning hole 23, the tolerance of each diameter is determined so that the opening diameter of the positioning hole 23 does not exceed the root diameter of the positioning pin 43. It has been. That is, the base diameter of the positioning pin 43 having the tapered surface 43 </ b> A is larger than the opening diameter of the positioning hole 23. For this reason, when the positioning member (positioning hole 23 and positioning pin 43) is viewed from above, the corner of the base of the positioning pin 43 is positioned outside the edge of the opening of the positioning hole 23.

FIG. 5A is an enlarged view of the vicinity of the root of the positioning pin 43.
As shown in FIG. 5A, an annular recess 43 </ b> B is formed on the upper surface of the optical path converter 40 so as to surround the base of the positioning pin 43. Furthermore, the inner side wall surface of the recess 43 </ b> B is an extended surface of the tapered surface 43 </ b> A of the truncated conical positioning pin 43. That is, the taper surface 43 </ b> A of the positioning pin 43 is formed to the inner side (the side opposite to the side where the positioning pin 43 protrudes) from the upper surface of the optical path changer 40.
By forming the recess 43B at the base of the positioning pin 43, the distance L between the edge (A) of the opening of the positioning hole 23 and the corner (B) of the base of the positioning pin 43 when viewed from above. It becomes larger (see FIG. 5A). In other words, the difference between the base diameter of the positioning pin 43 having the tapered surface 43A and the opening diameter of the positioning hole 23 increases. Thereby, as will be described later, when the positioning hole 23 is observed from the upper side through the glass substrate 20, the edge (A) of the opening of the positioning hole 23 and the corner (B) at the base of the positioning pin 43 are It becomes easy to identify.

  FIG. 5B is an enlarged view of the vicinity of the root of the positioning pin 43 of the reference example. The positioning pin 43 of the reference example has no recess 43B. As a result, when viewed from the upper side, the distance L between the edge of the opening of the positioning hole 23 and the corner of the base of the positioning pin 43 becomes small, making it difficult to identify both.

FIG. 5C is an enlarged view of the vicinity of the root of the positioning pin 43 of the reference example. Since the optical path changer 40 is integrally formed of a transparent resin, and the positioning pin 43 is also integrally formed with other parts of the optical path changer 40, as shown in FIG. Corners (portions indicated by arrows in the figure) may be rounded. Since this roundness is not formed uniformly around the positioning pin 43 (because the roundness at the base of the positioning pin 43 cannot be controlled), when this portion comes into contact with the positioning hole 23, the positioning hole 23 or the positioning pin 43 The optical axis on the glass substrate 20 side (the optical axis of the light emitted from the light emitting unit 31) and the optical axis on the optical path changer 40 side (of the lens unit 41). This may cause a positional deviation from the optical axis. On the other hand, as shown in FIG. 5A, if the annular recess 43B is formed on the upper surface of the optical path converter 40 so as to surround the base of the positioning pin 43, the corner of the base of the positioning pin 43 is Even if rounded, the effect that the rounded corner of the positioning pin 43 can be prevented from coming into contact with the positioning hole 23 is obtained.
In addition, even if wear powder is generated when the positioning hole 23 and the positioning pin 43 are in contact with each other, the wear powder enters the concave portion 43B, so that the effect that the wear powder can inhibit positioning is also obtained.

<Method for Manufacturing Optical Module 1>
FIG. 6 is a flowchart of the method for manufacturing the optical module 1. FIGS. 7A and 7B are schematic explanatory views showing a state where the positioning pins 43 are inserted into the positioning holes 23 and the glass substrate 20 and the optical path changer 40 are positioned.

  First, parts constituting the optical module 1 are prepared (S001). The parts to be prepared are the circuit board 10 on which the glass substrate 20 is mounted on the upper surface, and the optical path converter 40. As shown in FIGS. 7A and 7B, the circuit board 10 has an accommodation window 12, and a glass substrate 20 is mounted on the upper surface of the circuit board 10 so as to close the accommodation window 12. A non-penetrating positioning hole 23 is formed on the lower surface of the glass substrate 20, and a light emitting unit 31 is mounted on the upper surface of the glass substrate 20 as a photoelectric conversion element. Positioning pins 43 are formed on the upper surface of the optical path changer 40. The operation of S001 may be performed by an operator's hand or may be performed by an assembly machine.

  Next, the glass substrate 20 and the optical path changer 40 are positioned (S002). At this time, as shown in FIGS. 7A and 7B, the positioning pin 43 of the optical path converter 40 is inserted into the positioning hole 23 of the glass substrate 20 while the upper portion of the optical path converter 40 is disposed in the receiving window 12 of the circuit board 10. The glass substrate 20 and the optical path changer 40 are positioned by inserting. The operation in S002 may be performed by the operator's hand or may be performed by an assembly machine.

  Next, the camera observes the positioning hole 23 through the glass substrate 20 from the upper side of the glass substrate 20 (the side opposite to the surface having the positioning hole 23) (S003).

  FIG. 8 is an explanatory diagram of a state of shooting in S003. In the first embodiment, the positioning hole 23 is observed through the glass substrate 20 with the positioning pin 43 inserted in the positioning hole 23.

  A wiring 27 made of a metal pattern is formed on the upper surface of the glass substrate 20 in order to mount the light emitting unit 31, the driving element 32, and the like. A protective film 28 for protecting the metal pattern is also formed. However, in the region above the positioning hole 23 (the region on the back side of the positioning hole 23 on the mounting surface; the region on the mounting surface facing the positioning hole 23), the wiring 27 made of a metal pattern is not formed. Thereby, the positioning hole 23 can be observed from the upper side of the glass substrate 20 through the glass substrate 20. If the positioning hole 23 can be observed from the upper side of the glass substrate 20 through the glass substrate 20, a transparent (or translucent) protective film 28 may be formed above the positioning hole 23.

  In S003, the camera is set to face the positioning hole 23 on the upper side of the glass substrate 20, and the edge of the opening of the positioning hole 23 and the corner of the base of the positioning pin 43 are included in the observation range. Set up the camera. In addition, the focal plane of the camera is matched with the vicinity of the opening of the positioning hole 23 (the lower surface of the glass substrate 20) so that the edge of the opening of the positioning hole 23 and the corner of the base of the positioning pin 43 are imaged. .

  9A and 9B are observation images (photographs) when the positioning hole 23 is observed from the upper side through the glass substrate 20. FIG. 9A is an observation image in a normal state. FIG. 9B is an observation image at the time of abnormality (when the positioning pin 43 is shifted and inserted). FIG. 10 is an explanatory diagram of the situation of the observation image (photograph). The upper photograph in FIG. 10 is an observation image observed in S003, and the lower photograph is a cross-sectional photograph. The lower photograph in FIG. 10 is not a photograph observed in S003 but a reference photograph for explaining the upper observed image. FIG. 11 is a diagram representing FIG. 10.

  The dark region at the center of the observation images in FIGS. 9A and 9B is a region inside the opening of the positioning hole 23. The positioning hole 23 is formed in the glass substrate 20 by sandblasting, and minute irregularities called chipping are formed on the inner surface of the positioning hole 23, so that the contour of the region having a high density is rough. Since the positioning pin 43 is formed by resin molding and has higher processing accuracy than sandblasting, the contour of the recess 43B of the positioning pin 43 is smooth.

  Since the positioning pin 43 has a tapered surface 43A and the diameter of the root of the positioning pin 43 having the tapered surface 43A is larger than the opening diameter of the positioning hole 23 (the opening diameter of the positioning hole 23 is the root of the positioning pin 43). Therefore, it is observed that the corner of the base of the positioning pin 43 is located outside the edge of the opening of the positioning hole 23. Further, since the recess 43B is formed at the base of the positioning pin 43, the edge of the opening of the positioning hole 23 and the corner of the base of the positioning pin 43 can be easily identified as shown in FIGS. 9A and 9B. Observed (see also FIG. 5A).

  Next, the image processing apparatus (computer) performs image processing on the observation image (S004). Here, the image processing device performs contour extraction processing on the observation image, and extracts the contour of the edge of the opening of the positioning hole 23 and the contour of the corner of the root of the positioning pin 43.

  FIG. 12A is a contour extraction image of the observation image of FIG. 9A, and is a contour extraction image in a normal state. FIG. 12B is a contour extraction image of the observation image of FIG. 9B and is a contour extraction image at the time of abnormality. The inner contour line in the figure indicates the edge of the opening of the positioning hole 23. The outer contour line in the figure shows the corner of the base of the positioning pin 43.

  Since the positioning pin 43 has the tapered surface 43 </ b> A, the root diameter of the positioning pin 43 having the tapered surface 43 </ b> A is larger than the opening diameter of the positioning hole 23. As a result, a contour line indicating the corner of the base of the positioning pin 43 appears outside the contour line indicating the edge of the opening of the positioning hole 23. That is, it becomes easy to identify two contour lines.

  Further, since the recess 43B is formed at the base of the positioning pin 43, the difference between the diameter of the positioning pin 43 having the tapered surface 43A and the opening diameter of the positioning hole 23 is increased. As a result, as shown in FIGS. 12A and 12B, the interval between the two contour lines is widened, and the two contour lines are further easily identified.

  Next, the insertion state of the positioning pin 43 in the positioning hole 23 is inspected (S005). If the insertion state of the positioning pin 43 is normal, as shown in FIG. 12A, the two contour lines are substantially concentric, and the distance between the two contour lines is substantially uniform. On the other hand, if the insertion state of the positioning pin 43 is abnormal, the interval between the two contour lines can be widened as shown in FIG. 12B. For this reason, in S005, the insertion state of the positioning pin 43 is inspected according to whether or not the interval between the two contour lines is equal. This inspection work may be performed visually by the operator, or may be performed by an image processing apparatus (computer) based on the contour extraction image.

  If the insertion state of the positioning pin 43 is abnormal, the positioning of the glass substrate 20 and the optical path converter 40 is performed again (return to S002). If the insertion state of the positioning pin 43 is normal, the optical path converter 40 is fixed to the glass substrate 20 (S006).

FIG. 13 is an explanatory diagram of a method for fixing the optical path changer 40.
As shown in the figure, the worker or the assembling machine applies an ultraviolet curable resin as an adhesive 65 between the circuit board 10 and the optical path changer 40, irradiates the ultraviolet curable resin with ultraviolet rays, and cures the adhesive 65. Let That is, the optical path changer 40 is indirectly fixed to the glass substrate 20 by being fixed to the circuit board 10 with the adhesive 65. However, another fixing method may be adopted to fix the optical path changer 40 directly to the glass substrate 20.

  Finally, quality inspection of the optical module 1 is performed (S007). For example, the optical module 1 is made to output a signal, and whether the output signal is correct or not is inspected. If the positioning accuracy between the glass substrate 20 and the optical path changer 40 is poor, the output signal becomes abnormal and the optical module 1 becomes a defective product. On the other hand, in this embodiment, the positioning hole 23 is observed through the glass substrate 20 (S003), and the optical module 1 is manufactured after confirming the insertion state of the positioning pins 43, so the defect rate is reduced. (Higher yield)

  Note that when the positioning of the glass substrate 20 and the optical path changer 40 is performed again when the optical module 1 is a defective product, the previous assembly process is wasted, but in this embodiment, the yield is increased. Such waste can be reduced. Further, in this embodiment, since the yield is high, it is less likely that the adhesive 65 is peeled off in order to reposition the glass substrate 20 and the optical path converter 40.

  According to the first embodiment, after positioning the glass substrate 20 and the optical path converter 40 by inserting the positioning pins 40 of the optical path converter 40 into the positioning holes 23 of the glass substrate 20 (S002), the glass substrate 20 The positioning hole 23 is observed with a camera through the glass substrate 20 from the upper side (the side opposite to the surface having the positioning hole). As a result, the insertion state (fitting state) of the positioning pin 43 can be inspected.

  In addition, according to the first embodiment, since the positioning pin 43 has the tapered surface 43 </ b> A, the base diameter of the positioning pin 43 having the tapered surface 43 </ b> A is larger than the opening diameter of the positioning hole 23. As a result, since the corner of the base of the positioning pin 43 is observed so as to be located outside the edge of the opening of the positioning hole 23, the insertion state of the positioning pin 43 can be easily inspected based on the observation image.

  Furthermore, according to the first embodiment, since the recess 43B is formed at the root of the positioning pin 43, the difference between the root diameter of the positioning pin 43 having the tapered surface 43A and the opening diameter of the positioning hole 23 is large. Become. As a result, it becomes easier to inspect the insertion state.

=== Second Embodiment ===
FIG. 14 is a flowchart of the manufacturing method of the optical module 1 of the second embodiment.
First, components that constitute the optical module 1 are prepared (S101). As in the first embodiment, the components to be prepared are the circuit board 10 on which the glass substrate 20 is mounted on the upper surface, and the optical path converter 40.

  Next, the positioning hole 23 is observed through the glass substrate 20 from the upper side of the glass substrate 20 (the side opposite to the surface having the positioning hole 23), and the positioning pin 43 is positioned with respect to the positioning hole 23 based on the analysis result of the observation image. Are aligned in the front-rear direction and the left-right direction (direction parallel to the lower surface of the glass substrate 20) (S102). Thereby, the glass substrate 20 and the optical path changer 40 are aligned in the front-rear direction and the left-right direction.

  FIG. 15A is an explanatory diagram of a state of observation in S102. In the second embodiment, the positioning hole 23 is observed through the glass substrate 20 before the positioning pin 43 is inserted into the positioning hole 23. The focal plane of the camera is matched with the vicinity of the top of the positioning pin 43 before being inserted into the positioning hole 23.

  FIG. 15B is an explanatory diagram of the positioning pin 43 of the second embodiment. An alignment mark 44 is formed on the top of the positioning pin 43 of the second embodiment. In the second embodiment, the assembly machine places the positioning pin 43 in the vicinity of the opening of the positioning hole 23, and then inserts the edge of the opening of the positioning hole 23 and the alignment mark 44 of the positioning pin 43 through the glass substrate 20. Observe with camera. The image processing apparatus of the assembly machine calculates the position of the edge of the opening of the positioning hole 23 and the position of the alignment mark 44 of the positioning pin 43 based on the observation image. Then, the assembly machine aligns the positioning pin 43 with respect to the positioning hole 23 based on the calculation result.

  Next, the assembly machine positions the glass substrate 20 and the optical path converter 40 by inserting the positioning pins 43 of the optical path converter 40 into the positioning holes 23 of the glass substrate 20 (S103). In the second embodiment, the positioning pin 43 is inserted into the positioning hole 23 in a state where the positioning hole 23 and the positioning pin 43 are previously aligned in S102. Thereby, the positioning pin 43 is normally inserted in the positioning hole 23, and the positioning accuracy of the glass substrate 20 and the optical path converter 40 becomes high.

Further, if the positioning pin 43 is inserted into the positioning hole 23 in a pre-aligned state, the positioning member (the positioning hole 23 and the positioning pin 43) is less likely to be damaged, as described below. The effect that it becomes difficult to generate | occur | produce is also acquired.
16A and 16B are explanatory diagrams of a comparative example in which the positioning pin 43 is inserted into the positioning hole 23 without being aligned. In a state where the positioning hole 23 and the positioning pin 43 are not aligned, the central axis of the positioning pin 43 is displaced from the central axis of the positioning hole 23 (see FIG. 16A). When the positioning pin 43 is inserted into the positioning hole 23 in such a state, the positioning pin 43 comes into contact with the edge of the positioning hole 23, and the positioning member (the positioning hole 23 and the positioning pin) may be damaged. In particular, when the resin positioning pin 43 having the taper surface 43A is inserted into the positioning hole 23 of the glass substrate 20, the resin taper surface 43A is scraped by the edge of the glass (the edge of the positioning hole 23). The taper surface 43A is worn (see FIG. 16B), and as a result, wear powder may be generated. On the other hand, in the second embodiment, since the positioning pin 43 is inserted into the positioning hole 23 in a pre-aligned state, the positioning member (the positioning hole 23 and the positioning pin 43) is not easily damaged. Wear powder is less likely to be generated.

  After S103, the optical path changer 40 is fixed to the glass substrate 20 (S104), and the quality inspection of the optical module 1 is performed (S105). Since these processes are the same as S006 and S007 of the first embodiment, description thereof will be omitted. In the second embodiment, since the positioning pins 43 are inserted into the positioning holes 23 in a previously aligned state, the positioning accuracy between the glass substrate 20 and the optical path converter 40 is high, and the defect rate is low.

  According to the second embodiment, before the positioning pins 40 of the optical path converter 40 are inserted into the positioning holes 23 of the glass substrate 20, the positioning holes 23 are observed with the camera from the upper side of the glass substrate 20 through the glass substrate 20. doing. Accordingly, the positioning pin 43 can be inserted into the positioning hole 23 in a state where the positioning hole 23 and the positioning pin 43 are previously aligned in a direction parallel to the lower surface of the glass substrate 20.

  Further, according to the second embodiment, the alignment mark 44 is formed on the top of the positioning pin 43. For this reason, since the position of the positioning pin 43 can be detected based on the alignment mark 44, the positioning of the positioning hole 23 and the positioning pin 43 is facilitated.

=== Third Embodiment ===
FIG. 17 is a flowchart of the manufacturing method of the optical module 1 of the third embodiment.
In the third embodiment, first, the inspection apparatus for the glass substrate 20 observes the positioning hole 23 from the upper side of the glass substrate 20 (the side opposite to the surface having the positioning hole 23) through the glass substrate 20, and Quality is inspected (S201). This inspection work may be performed visually by the operator, but here the image processing apparatus (computer) analyzes the observation image and performs the inspection.

  Based on the observation image, the image processing apparatus detects the position of the wiring 27 (metal pattern) on the upper surface of the glass substrate 20 and the position of the positioning hole 23 on the lower surface of the glass substrate 20, and calculates the amount of displacement between them. Then, the quality of the glass substrate 20 is determined based on the positional deviation amount. In the glass substrate 20 having a large positional deviation amount, the optical axis of the light emitting unit 31 mounted on the upper surface of the glass substrate 20 and the optical axis of the lens unit 41 of the optical path converter 40 positioned by the positioning hole 23 are shifted. It is judged as a defective product.

  FIG. 18 is an explanatory diagram of the state of observation in S201. In the third embodiment, the observation target is the glass substrate 20, and the optical path converter 40 is not included in the observation target. The glass substrate 20 at the time of observation may be mounted on the circuit board 10 or may not be mounted on the circuit board 10 yet. Moreover, although the light emission part 31 is mounted in the upper surface of the glass substrate 20 in a figure, the light emission part 31 does not need to be mounted in the glass substrate 20 at the time of observation yet. On the upper surface of the glass substrate 20, a wiring 27 made of a metal pattern and a protective film 28 for protecting the metal pattern are formed.

  FIG. 19 is an observation image (photograph) of S201. FIG. 20 is an explanatory diagram of the observation image of FIG. The hatching in the figure indicates the region of the metal pattern.

  A ground pattern (or power supply pattern) is formed on the upper surface of the glass substrate. Here, the ground pattern occupies most of the observation region (the region excluding the upper portion of the positioning hole 23). However, in the region above the positioning hole 23 (the region on the back side of the positioning hole 23 on the mounting surface; the region of the mounting surface facing the positioning hole 23), the wiring 27 made of a metal pattern is not formed. For this reason, the positioning hole 23 is observed from the upper side of the glass substrate 20 through the glass substrate 20. The image processing apparatus analyzes the position of the metal pattern on the upper surface of the glass substrate 20 and the position of the positioning hole 23 on the lower surface of the glass substrate 20 based on the observation image, and calculates the amount of positional deviation between them.

  In the present embodiment, an alignment mark 27 </ b> A is formed on the upper surface of the glass substrate 20. Since the alignment mark 27A is formed of a metal pattern, the position of the wiring 27 on the upper surface of the glass substrate 20 can be inspected based on the position of the alignment mark 27A. However, the position of the wiring 27 on the upper surface of the glass substrate 20 may be directly detected based on the image of the wiring 27 in the observation image without forming the alignment mark 27A.

  By making the alignment mark 27A smaller than the opening diameter of the positioning hole 23, the alignment mark 27A can be formed in a region above the positioning hole 23 (a region where the wiring 27 is not formed). By forming the alignment mark 27A above the positioning hole 23, it is easy to observe the alignment mark 27A (metal pattern) while observing the positioning hole 23. However, the alignment mark 27A may be formed at a location different from the position above the positioning hole 23.

  In the present embodiment, the glass substrate 20 is designed so that the alignment mark 27 </ b> A is on the central axis of the positioning hole 23. In the case of the observation image as shown in FIG. 19, since the alignment mark 27A on the upper surface of the glass substrate 20 is located at the center of the opening of the positioning hole 23 on the lower surface, it is determined that the glass substrate 20 is normal.

  Next, the parts constituting the optical module 1 are prepared (S202). The parts to be prepared are the circuit board 10 on which the glass substrate 20 that has passed the quality inspection of S201 is mounted, and the optical path converter 40. Then, the glass substrate 20 and the optical path converter 40 are positioned by inserting the positioning pin 43 of the optical path converter 40 into the positioning hole 23 of the glass substrate 20 (S203), and the optical path converter 40 with respect to the glass substrate 20 is obtained. Is fixed (S204). These processes are the same as those already described.

  Finally, quality inspection of the optical module 1 is performed (S205). In 3rd Embodiment, since the optical module 1 is comprised using the glass substrate 20 which passed the test | inspection of S201, the defect rate of the optical module 1 becomes low.

  According to the third embodiment, the positioning hole 23 is observed with the camera from the upper side of the glass substrate 20 through the glass substrate 20 without the optical path changer 40. According to the third embodiment, it is possible to inspect the quality of the glass substrate 20 by inspecting the position of the positioning hole 23 on the lower surface of the glass substrate 20 based on the observation image.

  Further, according to the third embodiment, when the positioning hole 23 is observed with a camera from the upper side of the glass substrate 20 through the glass substrate 20, the metal pattern on the upper surface of the glass substrate 20 is also observed. This makes it possible to inspect the positional relationship between the metal pattern on the upper surface of the glass substrate 20 and the positioning hole 23 on the lower surface of the glass substrate 20 based on the observation image.

  Further, according to the third embodiment, the alignment mark 27 </ b> A made of a metal pattern is formed above the positioning hole 23. Thereby, it becomes easy to detect the position of the metal pattern on the upper surface of the glass substrate 20 and to observe the alignment mark 27 </ b> A together with the observation of the positioning hole 23.

=== Fourth Embodiment ===
The interval between the two positioning holes 23 and the interval between the two positioning pins 43 may be shifted due to a temperature change. In such a case, the positioning pin 43 is not normally inserted into the positioning hole 23, and there is a possibility that a position shift more than expected occurs between the glass substrate 20 and the optical path converter 40. Therefore, in the fourth embodiment, one of the two positioning holes 23 is a reference hole and the other is a long hole.

FIG. 21 is an explanatory diagram of the positioning holes of the fourth embodiment. FIG. 21 is a view of the lower surface of the glass substrate 20 as viewed from below.
A reference hole 23 </ b> A and a long hole 23 </ b> B are formed on the lower surface of the glass substrate 20. The reference hole 23A and the long hole B are formed side by side in the front-rear direction. The reference hole 23A is a non-through hole having a circular opening, and has the same shape as the positioning hole 23 of the previous embodiments. The long hole 23B is a non-through hole in which the longitudinal direction of the opening is along a line connecting the two positioning holes (the reference hole 23A and the long hole 23B). Since the long hole 23B is also formed by sandblasting, it has a deep shape. The width of the long hole 23B is the same length as the diameter of the reference hole 23A. Note that the two positioning pins 43 inserted into the reference hole 23A and the long hole 23B have the same shape as the positioning pin 43 of the above-described embodiment (that is, the two positioning pins 43 have a truncated cone shape).

  One of the two positioning pins 43 of the optical path changer 40 is inserted into the reference hole 23A, and the other is inserted into the long hole 23B. On the reference hole 23A side, the positioning pin 43 is restrained in the front-rear direction and the left-right direction (direction parallel to the surface of the glass substrate 20) perpendicular to the axial direction of the positioning pin 43 with respect to the reference hole 23A. Become. On the other hand, on the side of the long hole 23B, the positioning pin 43 is restrained from the left-right direction by the long hole 23B, but is not restrained from the front-rear direction. For this reason, even if the distance between the two positioning holes 23 or the distance between the two positioning pins 43 changes due to the influence of a temperature change or the like, the two positioning pins 43 are inserted into the reference hole 23A and the long hole 23B, and the glass substrate The optical path changer 40 can be positioned with respect to 20.

  When the reference hole 23A and the long hole 23B are formed on the lower surface of the glass substrate 20 and only one positioning hole is observed through the glass substrate 20, it contributes to the positioning accuracy in both the front-rear direction and the left-right direction. It is desirable to observe the reference hole 23A. For example, as shown in FIG. 3, when the rear positioning hole 23 is blocked by the upper drive element 32 and cannot be observed from the upper side through the glass substrate 20, the long hole 23B is disposed on the rear side, and the reference is provided on the front side. It is preferable to arrange the hole 23A and observe the reference hole 23A through the glass substrate 20 from above. In this case, a wiring 27 made of a metal pattern may be formed above the elongated hole 23B, and mounting parts such as the light emitting unit 31 and the driving element 32 may be arranged.

=== Others ===
The above-described embodiments are for facilitating the understanding of the present invention, and are not intended to limit the present invention. The present invention can be modified and improved without departing from the gist thereof, and it goes without saying that the present invention includes equivalents thereof. In particular, the embodiments described below are also included in the present invention.

<Positioning hole and positioning pin>
The positioning hole 23 described above is a deep non-through hole formed by sandblasting, but may be a positioning hole formed by another processing method or a positioning hole of another shape. For example, the positioning hole 23 may be a hole having a constant diameter and formed by drilling.
The positioning pin 43 described above has a truncated cone shape having a tapered surface 43A, but may have other shapes. For example, the positioning pin may have a conical shape or a cylindrical shape with a constant diameter. However, as described above, when the positioning pin has a tapered surface, the corner of the base of the positioning pin 43 is located outside the edge of the opening of the positioning hole 23 when viewed from above. Makes it easier to identify.

<About optical path converter>
In the above-described embodiment, the optical path changer (optical component) is made of resin. However, the optical component having the positioning pin may not be made of resin.

<About optical modules>
In the above embodiment, the QSFP type optical module has been described. However, the present invention is not limited to this type. It is also possible to apply to other types of optical modules (for example, CXP type and SFP type).

1 optical module, 1A housing,
2 cage, 2A connector, 3 heat sink,
10 circuit boards, 11 connections,
12 receiving window, 13 circuit board side electrode,
20 glass substrate (transparent substrate), 21 through via,
22 glass substrate side electrode, 23 positioning hole,
23A reference hole, 23B oblong hole,
27 wiring, 27A alignment mark, 28 protective film,
31 light emitting part, 31A light emitting part side electrode, 31B light emitting surface, 32 drive element,
40 optical path changer (supporting member), 41 lens part, 42 reflecting part,
43 positioning pin, 43A taper surface, 43B recess,
44 alignment marks,
50 optical fiber, 65 adhesive

Claims (11)

(1) A non-penetrating positioning hole is formed on one surface, a photoelectric conversion element is mounted on the other surface, and the light that is emitted from the photoelectric conversion element or the light that is received by the photoelectric conversion element is transparent. A substrate,
A support member having a positioning pin, supporting an optical fiber, and forming an optical path between the photoelectric conversion element and the optical fiber together with the transparent substrate;
A preparation process to prepare,
(2) a positioning step of positioning the transparent substrate and the support member by inserting the positioning pins of the support member into the positioning holes of the transparent substrate;
(3) an observation step of observing the positioning hole through the transparent substrate from the side opposite to the surface with the positioning hole;
A method for manufacturing an optical module, comprising: It is a manufacturing method of the optical module of Claim 1, Comprising:
A method for manufacturing an optical module, comprising: inspecting positioning accuracy between the transparent substrate and the support member based on an observation image of the observation step performed after the positioning step. It is a manufacturing method of the optical module according to claim 2,
The positioning pin has a tapered surface;
The method of manufacturing an optical module, wherein the positioning accuracy is inspected according to a positional relationship between the positioning hole and the base of the positioning pin in the observation image. It is a manufacturing method of the optical module according to claim 3,
A method of manufacturing an optical module, wherein a recess is formed around a root of the positioning pin. It is a manufacturing method of the optical module in any one of Claims 1-4,
An optical module manufacturing method, wherein the positioning step is performed after aligning the transparent substrate and the support member in a direction parallel to the surface of the transparent substrate based on an observation image of the observation step. . It is a manufacturing method of the optical module according to claim 5,
An alignment mark is formed on the top of the positioning pin,
The method for manufacturing an optical module, wherein the transparent substrate and the support member are aligned according to a positional relationship between the positioning hole and the alignment mark in the observation image. It is a manufacturing method of the optical module in any one of Claims 1-6,
The method of manufacturing an optical module, wherein the position of the positioning hole in the transparent substrate is inspected based on an observation image in the observation step, and the transparent substrate after the inspection is prepared in the preparation step. It is a manufacturing method of the optical module according to claim 7,
An alignment mark formed together with the wiring to the photoelectric conversion element is formed on the one surface,
The method of manufacturing an optical module, wherein the position of the positioning hole with respect to the photoelectric conversion element is inspected according to a positional relationship between the positioning hole and the alignment mark in the observation image. A wiring with a metal pattern is formed on a mounting surface on which the photoelectric conversion element is mounted, a non-penetrating positioning hole is formed on a surface opposite to the mounting surface, and the light emitted from the photoelectric conversion element or the photoelectric conversion A transparent substrate capable of transmitting light received by the element;
A support member having a positioning pin, supporting an optical fiber, and forming an optical path between the photoelectric conversion element and the optical fiber together with the transparent substrate;
An optical module comprising:
The optical module is characterized in that the wiring is not formed in a region of the mounting surface on the back side of the positioning hole, and the positioning hole can be observed from the mounting surface side. The optical module according to claim 9,
An optical module, wherein an alignment mark formed together with the wiring is formed in a region on the back surface of the positioning hole on the mounting surface. The optical module according to claim 9 or 10, wherein
A reference hole and a long hole are formed as the positioning hole,
The long hole is formed such that its longitudinal direction is along a line connecting the reference hole and the long hole,
The optical module is characterized in that the wiring is not formed in a region of the mounting surface on the back side of the reference hole, and the reference hole can be observed from the mounting surface side.