JP5634169B2 - Lighting device - Google Patents

Description

  The present invention relates to an illumination device including a light emitting element typified by a light emitting diode. The lighting device can be suitably used for, for example, a backlight power source for an electronic display and a fluorescent lamp.

  In recent years, lighting devices including light emitting elements have been developed. As a lighting device, for example, a linear lighting device disclosed in Patent Document 1 is known. The lighting device described in Patent Document 1 has a groove that opens to the upper surface side, a long case in which a mounting substrate on which a plurality of LED lamps are mounted is attached to a side surface of the groove, and an upper side of the mounting substrate. A light transmissive cover is provided that is positioned and attached to the side of the groove.

  Since the light emitting element generates heat during the light emission, the mounting substrate on which the light emitting element is mounted is thermally expanded. In order to relieve the stress due to the thermal expansion of the mounting substrate, in the lighting device described in Patent Document 1, a space is formed between the lower surface of the mounting substrate and the bottom surface of the groove of the long case. By forming the space in this way, it is possible to suppress a situation in which the mounting substrate is peeled off from the long case or the mounting substrate is deformed.

JP 2010-49902 A

  However, in the lighting device described in Patent Document 1, the mounting substrate is attached to the side surface of the groove of the long case, and the entire lower surface of the mounting substrate is not in contact with the long case. Therefore, the efficiency of heat radiation from the mounting substrate to the long case is reduced. For this reason, heat from the mounting substrate is easily transmitted to the light-transmitting cover through the side surface of the groove. As a result, there is a possibility that the light transmissive cover is deformed or the light transmissive property of the cover is lowered.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination device that can efficiently dissipate heat to the outside by suppressing the transfer of heat from the mounting substrate to the cover.

An illumination device according to an aspect of the present invention includes a housing having an opening along one side surface in a longitudinal direction, a substrate disposed inside the housing so as to face the opening, and disposed on the substrate. And a transparent plate held in the opening so as to face the LED lamp, wherein the housing is disposed on the transparent plate from a position closest to the LED lamp. The part that reaches the holding part has a first region that is thinner than the parts on both sides thereof, and has a second region that has the largest thickness on the side opposite to the transparent plate with respect to the substrate. The
It is characterized in that the end of the second region is a closed flat surface .
As a preferred aspect of the present invention, it is desirable that a plurality of the LED lamps are arranged on the substrate.
As a preferred aspect of the present invention, it is desirable that the plurality of LED lamps are arranged in a line, and the transparent plate is arranged along the arrangement of the LED lamps.
As a preferred aspect of the present invention, it is desirable that the thickness of the casing in the first region is the smallest among the thicknesses of the casing.
As a preferred aspect of the present invention, it is desirable that a concave curved surface is provided inside the housing with respect to the first region.

In the illuminating device based on said aspect, since a housing | casing has the 2nd groove part extended in a longitudinal direction in the side surface of the 1st groove part located between a mounting substrate and a transparent resin board, it is efficient externally. Can dissipate heat. This is because the heat transmission path from the mounting substrate to the transparent resin plate can be lengthened, and heat is hardly transmitted from the mounting substrate to the transparent resin plate. Therefore, heat transfer from the mounting board to the cover can be suppressed, and heat from the mounting board can be efficiently transferred to the lower surface side of the housing.

It is a cross-sectional perspective view which shows the illuminating device of one Embodiment of this invention. It is sectional drawing of the illuminating device shown in FIG. It is a top view of the illuminating device shown in FIG. It is a fragmentary sectional perspective view which shows the LED lamp in the illuminating device shown in FIG. It is sectional drawing which shows the heat transfer path | route in the illuminating device shown in FIG. It is sectional drawing which shows the 1st modification of the illuminating device of one Embodiment of this invention. It is a top view which shows the 2nd modification of the illuminating device of one Embodiment of this invention.

  Hereinafter, an illuminating device according to an embodiment of the present invention will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the illuminating device according to the present invention may include any constituent member that is not shown in each drawing referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1-5, the illuminating device 1 of one Embodiment of this invention has the elongate housing | casing 5 which has the 1st groove part 3 which opens to an upper surface side and extends in a longitudinal direction, A mounting substrate 7 held between both side surfaces 3b of the first groove 3 so as to be separated from the bottom surface 3a of the first groove 3, a plurality of LED lamps 9 disposed on the upper surface of the mounting substrate 7, and the mounting substrate And a transparent resin plate 11 held between both side surfaces 3b of the first groove portion 3 so as to be separated from the mounting substrate 7 and located on the upper surface side of the housing.

  And the housing | casing 5 has the 2nd groove part 13 extended in the longitudinal direction on the side surface 3b of the 1st groove part 3 located between the mounting substrate 7 and the transparent resin board 11. FIG. Since the second groove portion 13 is provided, as shown in FIG. 5, the heat transfer path from the mounting substrate 7 to the transparent resin plate 11 is lengthened and narrowed, so that the mounting substrate 7 The thermal resistance up to the transparent resin plate 11 can be increased. Therefore, it becomes difficult to transfer heat from the mounting substrate 7 to the transparent resin plate 11. Therefore, the possibility that the transparent resin plate 11 is deformed or the light transmittance of the transparent resin plate 11 is reduced can be suppressed. In FIG. 5, the heat transfer path is schematically represented by black arrows.

  Further, the housing 5 has the second groove portion 13 extending in the longitudinal direction on the side surface 3b of the first groove portion 3 located between the mounting substrate 7 and the transparent resin plate 11, so that the LED The light emitted from the lamp 9 in the direction of the side surface 3b of the first groove 3 and the light reflected from the LED lamp 9 by the transparent resin plate 11 and emitted in the direction of the side surface 3b of the first groove 3 are the second Is incident on the inner side of the groove 13 and is irregularly reflected on the inner side of the second groove 13. By the light absorption of the second groove 13 caused by the irregular reflection, the lighting device 1 can emit light having a desired light distribution directly from the LED lamp 9 via the transparent resin plate 11. That is, the light emitted from the LED lamp 9 toward the side surface 3b of the first groove 3 and the light reflected from the LED lamp 9 at the transparent resin plate 11 and emitted toward the side surface 3b of the first groove 3 are emitted. Reflected between both side surfaces 3b of the first groove 3 and radiated to the outside of the lighting device 11 through the transparent resin plate 11, the light distribution of the lighting device 1 is suppressed from changing.

The lighting device 1 of the present embodiment includes a long casing 5. The housing 5 has a first groove 3 that opens to the upper surface side and extends in the longitudinal direction. For this reason, when viewed in a cross-section in a plane perpendicular to the longitudinal direction of the long casing 5, the casing 5 has a U-shape that opens to the upper surface side.

  The first groove portion 3 opens on the upper surface side of the housing 5 and opens on both side surfaces in the longitudinal direction of the housing 5. A mounting substrate 7, a plurality of LED lamps 9 and a transparent resin plate 11 are disposed in the first groove 3. Thus, when the 1st groove part 3 is opened with respect to the both sides of the longitudinal direction of the housing | casing 5, in order to seal the LED lamp 9, for example, it is LED on the both sides of the housing 5 in the longitudinal direction. A cap for sealing the lamp 9 is preferably mounted.

  Note that the first groove 3 may open to the upper surface side of the housing 5 and may have side surfaces in the longitudinal direction and the short side direction formed by the housing 5. In other words, the first groove portion 3 may be formed by forming a concave portion extending in the longitudinal direction on the upper surface side of the housing 5.

  Further, the housing 5 has a second groove portion 13 extending in the longitudinal direction on the side surface 3 b of the first groove portion 3 located between the mounting substrate 7 and the transparent resin plate 11. As described above, since the side surface 3b of the first groove portion 3 located between the mounting substrate 7 and the transparent resin plate 11 has the second groove portion 13 that opens to the first groove portion 3, The heat transfer path from the mounting substrate 7 to the transparent resin plate 11 can be lengthened.

  In addition, since the second groove portion 13 is provided, a portion in which the second groove portion 13 is formed in a cross-sectional view in a plane perpendicular to the longitudinal direction of the long casing 5. The thickness of the casing 5 in the above becomes relatively small. Therefore, the heat transmitted from the mounting substrate 7 to the portion of the housing 5 in contact with the mounting substrate 7 is not easily transmitted to the upper surface side of the housing 5 where the transparent resin plate 11 is held.

  In the cross section perpendicular to the longitudinal direction of the housing 5, the thickness of the portion located on the upper surface side of the housing 5 with respect to the mounting substrate 7 is larger than the thickness of the portion located on the lower surface side of the housing 5 with respect to the mounting substrate 7. Small is preferable. In such a case, the heat transmitted to the portion of the housing 5 that contacts the mounting substrate 7 is more difficult to transmit to the upper surface side of the housing 5 where the transparent resin plate 11 is held. This is because heat can be relatively easily transferred to the lower surface side of the plate.

  In particular, the thickness of the entire portion of the housing 5 positioned on the upper surface side of the housing 5 with respect to the mounting substrate 7 in the cross section perpendicular to the longitudinal direction is not limited to the portion where the second groove 13 is formed. It is preferable that the thickness of the entire portion located on the lower surface side of the housing 5 is smaller than that of the substrate 7. In such a case, the heat transmitted to the portion of the housing 5 that contacts the mounting substrate 7 is more difficult to be transmitted to the upper surface side of the housing 5 where the transparent resin plate 11 is held. This is because heat is relatively more easily transferred to the lower surface side of 5.

  Further, it is more preferable that the casing 5 has the smallest thickness in the portion where the second groove 13 is formed in a cross section perpendicular to the longitudinal direction of the casing 5 and the mounting substrate 7. In such a case, the heat flow transmitted from the mounting substrate 7 to the transparent resin plate 11 can be more reliably suppressed at the portion where the second groove 13 is formed.

  Moreover, it is preferable that the inner surface of the second groove portion 13 is separated from the mounting substrate 7. By having the 2nd groove part 13, the flow of the heat | fever transmitted from the mounting substrate 7 to the upper surface side of the housing | casing 5 can be inhibited. At this time, when the inner surface of the second groove portion 13 is separated from the mounting substrate 7, it is possible to suppress heat from being directly transmitted from the mounting substrate 7 to the second groove portion 13. In other words, the heat transfer path from the mounting substrate 7 to the transparent resin plate 11 can be lengthened more reliably.

  As shown in FIG. 6, the second groove portion 13 is open to the first groove portion 3 in a cross section perpendicular to the longitudinal direction of the housing 5 and the mounting substrate 7, and has a U shape having a bottom surface and a pair of side surfaces. However, as shown in FIG. 2, it is preferable that the inner surface of the second groove portion 13 has a curved shape in a cross section perpendicular to the longitudinal direction of the housing 5 and the mounting substrate 7. By having the 2nd groove part 13, the flow of the heat | fever transmitted from the mounting substrate 7 to the upper surface side of the housing | casing 5 can be inhibited.

  However, in the portion where the second groove 13 in the housing 5 is formed, the flow of heat is inhibited as described above, so the portion in the housing 5 where the second groove 13 is formed is A relatively large thermal stress is likely to be applied. When the inner surface of the second groove portion 13 has a curved shape, the above-described thermal stress is suppressed from being excessively concentrated on a part of the inner surface of the second groove portion 13, so that the durability of the housing 5 is improved. Can be improved.

  In addition, since the thickness of the housing 5 in the portion where the second groove 13 is formed is relatively small, when a stress is applied to the side surface of the housing 5 from the outside, this portion of the housing 5 is relatively Easily elastically deformed. However, as described above, when the inner surface of the second groove portion 13 has a curved shape, the stress is suppressed from being concentrated on a part of the second groove portion 13. Therefore, the durability of the housing 5 can be improved.

  In addition, in the cross section perpendicular to the longitudinal direction of the housing 5 and the mounting substrate 7, it is preferable that the bottom surface of the second groove portion 13 is located on the side of the side surface of the transparent resin plate 11. This is because when the second concave portion 13 is formed in this way, the heat transfer path from the mounting substrate 7 to the transparent resin plate 11 can be lengthened more reliably.

  As the housing 5, it is preferable to use a member having good thermal conductivity. Specifically, a metal such as stainless steel, aluminum, or copper, a ceramic such as aluminum oxide, titanium oxide, zirconium oxide, or yttrium oxide, or a resin can be used. In particular, it is preferable to use aluminum which is excellent in thermal conductivity and can keep its shape stably.

  The illuminating device 1 of the present embodiment includes a long plate-like mounting substrate 7 held between both side surfaces 3b of the first groove portion 3. Further, the mounting substrate 7 is disposed so as to be separated from the bottom surface 3 a of the first groove portion 3. Thus, since the mounting substrate 7 and the bottom surface 3a of the first groove portion 3 are separated from each other, even if the mounting substrate 7 is thermally expanded by the heat generated from the LED lamp 9, the thermal expansion is caused. Stress can be relaxed.

  Further, the heat capacity of the housing 5 on the lower surface side of the housing 5 from the mounting substrate 7 increases from the bottom surface 3 a to the side portion 3 b of the first groove 3, and the housing on the lower surface side of the housing 5 from the mounting substrate 7. 5, the heat dissipating area on the inner side and the outer side of the first groove portion 3 increases from the bottom surface 3 a to the side portion 3 b of the first groove portion 3. While being more difficult to be transmitted to the upper surface side, heat is relatively more easily transmitted to the lower surface side of the housing 5. The longitudinal direction of the long casing 5 and the longitudinal direction of the long mounting board 7 of the present embodiment are the same direction.

Although the mounting substrate 7 may be held by bonding the side surface of the mounting substrate 7 to the side surface 3b of the first groove 3, the side surface 3b of the first groove 3 is attached to the side surface 3b of the first groove 3 as in the lighting device 1 of the present embodiment. Forming the convex portion 3 c, the mounting substrate 7 is formed on the first groove portion 3 so that the side surface 3 b of the first groove portion 3 contacts the side surface of the mounting substrate 7 and the convex portion 3 c contacts the lower surface of the mounting substrate 7. It is preferable to hold between both side surfaces 3b. Since the mounting substrate 7 is held by the housing 5 from the two directions of the side surface and the lower surface, the mounting substrate 7 can be stably held. In addition, since the bonding surface between the mounting substrate 7 and the housing 5 can be increased, heat transfer from the mounting substrate 7 to the housing 5 can be efficiently performed.

  Further, since the convex portion 3 c is in contact with the lower surface of the mounting substrate 7, not the upper surface of the mounting substrate 7, the lower surface side of the housing 5 is moved from the upper surface side of the housing 5 holding the transparent resin plate 11. Heat from the mounting substrate 7 is easily transferred. Therefore, the heat transmitted to the transparent resin plate 11 can be reduced.

  Furthermore, when the convex part 3c is formed in the side surface 3b of the 1st groove part 3, it has the screwing hole which the mounting substrate 7 penetrates toward the lower surface from the upper surface, and was inserted in this screwing hole It is preferable that the mounting substrate 7 is fixed to the housing 5 with screws. As a result, the mounting substrate 7 can be held more firmly and stably.

  The mounting substrate 7 is not particularly limited as long as it is a member on which the LED lamp 9 can be mounted. In order to efficiently dissipate the heat generated from the LED lamp 9, it is preferable to use a member having good thermal conductivity as in the case 5. Specifically, a metal such as stainless steel, aluminum or copper having a wiring pattern formed through an insulating layer on the surface on which the LED lamp 9 is mounted, and a wiring pattern is formed on the surface on which the LED lamp 9 is mounted. Ceramics such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide, or resin can be used. In particular, it is preferable to use aluminum having a wiring pattern formed through an insulating layer on the surface on which the LED lamp 9 which is excellent in thermal conductivity and can keep its shape stably is mounted.

  The lighting device 1 of the present embodiment includes a plurality of LED lamps 9 disposed on the upper surface of the mounting substrate 7 as the light emitting device 9. As shown in FIG. 4, the LED lamp 9 in the present embodiment is disposed so as to surround the light emitting element 19 on the base body 17, the light emitting element 19 disposed on the upper surface of the base body 17, and the upper surface of the base body 17. And a wavelength conversion member 23 disposed on the frame 21. Light emitted from the light emitting element 19 is emitted upward of the LED lamp 9.

  In the illuminating device 1 of this embodiment, as shown in FIG. 3, the some LED lamp 9 is arrange | positioned along the virtual straight line extended in the longitudinal direction of the housing | casing 5 and the mounting board 7 at predetermined intervals, respectively. Has been. As described above, since the plurality of LED lamps 9 are arranged at regular intervals, the luminance unevenness of the lighting device 1 can be reduced.

  The LED lamps 9 in the present embodiment are arranged in a line along the virtual straight line X, but are not particularly limited to this. For example, as shown in FIG. 7, there is no problem even if a plurality of LED lamps 9 are arranged in two rows.

  The lighting device 1 of the present embodiment is located on the upper surface side of the housing 5 with respect to the mounting substrate 7 and has a plate shape held between both side surfaces 3b of the first groove portion 3 so as to be separated from the mounting substrate 7. A transparent resin plate 11 is provided. In the present embodiment, the transparent resin plate 11 is used as a cover member that protects the LED lamp 9. The light emitted from the LED lamp 9 passes through the transparent resin plate 11 and is emitted to the outside.

  Since the transparent resin plate 11 is separated from the mounting substrate 7 and the LED lamp 9, the direct transfer of heat from the mounting substrate 7 and the LED lamp 9 to the transparent resin plate 11 is suppressed. Further, since the transparent resin plate 11 is separated from the mounting substrate 7, even when the mounting substrate 7 is thermally expanded by the heat generated from the LED lamp 9, stress due to this thermal expansion can be relieved. .

  The transparent resin plate 11 may be held between both side surfaces 3b of the first groove portion 3 so as to be separated from the mounting substrate 7, but in the lighting device 1 of the present embodiment, the housing 5 has the second A third groove portion 25 for holding the transparent resin plate 11 extending in the longitudinal direction is provided on the side surface 3b of the first groove portion 3 located on the upper surface side of the groove portion 13, and the third groove portion 25 includes A transparent resin plate 11 is sandwiched. Thus, since the housing 5 has the third groove portion 25 and the transparent resin plate 11 is sandwiched between the third groove portions 25, the transparent resin plate 11 can be stably held. The positional deviation of the transparent resin plate 11 can be suppressed.

  It is preferable that the upper surface which is the light emitting surface of the LED lamp 9 and the lower surface of the transparent resin plate 11 are parallel. Thus, when the LED lamp 9 and the transparent resin plate 11 are located, it is possible to suppress the light emitted from the LED lamp 9 from being reflected by the lower surface of the transparent resin plate 11. Therefore, the light output can be improved.

  In particular, the LED lamp 9 and the transparent resin plate 11 have an optical axis of the LED lamp 9 and a central axis in a direction perpendicular to the lower surface of the transparent resin plate 11 in a cross section perpendicular to the longitudinal direction of the housing 5 and the mounting substrate 7. It is preferable to agree. In such a case, it is possible to further suppress the light emitted from the LED lamp 9 from being reflected by the lower surface of the transparent resin plate 11. Therefore, the light output can be further improved.

  As the transparent resin plate 11, it is not necessary to be strictly transparent, but it is preferable to use a resin member having good light transmittance. Specifically, for example, a silicone resin, an acrylic resin, or an epoxy resin can be used as the transparent resin plate 11.

  A connector connected to an electronic component such as a resistor or a capacitor or a power cord from an external power source may be mounted on the lower surface of the mounting substrate 7. By incorporating such an electronic component, the amount of light of the LED lamp 9 can be adjusted. Moreover, you may use the thing provided with the electronic circuit for controlling the light output of the LED lamp 9 as an electronic component.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

  For example, in the illuminating device 1 of this embodiment, the surface where the 1st groove part 3 opens of the housing | casing 5 is made into the upper surface for convenience. Therefore, the lighting device 1 is not limited to the case where the upper surface of the housing 5 is always positioned upward. Specifically, when the lighting device 1 of the present embodiment is used as lighting by being embedded in the ceiling, the actual vertical direction and the vertical direction according to the description of the lighting device 1 of the present embodiment are reversed. . Thus, there is no problem even if the vertical direction of the lighting device 1 in the above description is different from the vertical direction in the actual usage state of the lighting device 1.

DESCRIPTION OF SYMBOLS 1 ... Illuminating device 3 ... 1st groove part 3a ... Bottom 3b ... Side surface 3c ... Convex part 5 ... Housing 7 ... Mounting board 9 ... LED lamp (light emission) apparatus)
DESCRIPTION OF SYMBOLS 11 ... Transparent resin board 13 ... 2nd groove part 17 ... Base | substrate 19 ... Light emitting element 21 ... Frame body 23 ... Wavelength conversion member 25 ... 3rd groove part

Claims (5)

A housing having an opening along one side surface in the longitudinal direction, a substrate disposed inside the housing so as to face the opening, an LED lamp disposed on the substrate, and facing the LED lamp Thus, a lighting device having a transparent plate held in the housing,
The housing has a first region whose thickness is thinner than the portions on both sides thereof at a portion from the position closest to the LED lamp to the holding portion of the transparent plate, and is transparent to the substrate. A lighting device having a second region having the largest thickness on the side opposite to the plate, and having a flat surface with an end of the second region closed .   The lighting device according to claim 1, wherein a plurality of the LED lamps are arranged on the substrate.   The lighting device according to claim 2, wherein the plurality of LED lamps are arranged in a line, and the transparent plate is arranged along an array of the LED lamps.   4. The lighting device according to claim 1, wherein a thickness of the casing in the first region is the smallest among the thicknesses of the casing. The lighting device according to claim 1, wherein a concave curved surface is provided inside the housing with respect to the first region.

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