JP5628908B2 - インクジェット可能な銀−塩化銀組成物 - Google Patents
インクジェット可能な銀−塩化銀組成物 Download PDFInfo
- Publication number
- JP5628908B2 JP5628908B2 JP2012515180A JP2012515180A JP5628908B2 JP 5628908 B2 JP5628908 B2 JP 5628908B2 JP 2012515180 A JP2012515180 A JP 2012515180A JP 2012515180 A JP2012515180 A JP 2012515180A JP 5628908 B2 JP5628908 B2 JP 5628908B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- ink
- silver chloride
- inkjet
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 34
- GTKRFUAGOKINCA-UHFFFAOYSA-M chlorosilver;silver Chemical compound [Ag].[Ag]Cl GTKRFUAGOKINCA-UHFFFAOYSA-M 0.000 title claims description 20
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 28
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 25
- 239000004332 silver Substances 0.000 claims description 22
- 229910052709 silver Inorganic materials 0.000 claims description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- 239000002904 solvent Substances 0.000 claims description 14
- 229920005596 polymer binder Polymers 0.000 claims description 9
- 239000002491 polymer binding agent Substances 0.000 claims description 9
- 239000003906 humectant Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 230000003020 moisturizing effect Effects 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 44
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 23
- 229920003023 plastic Polymers 0.000 description 11
- 239000004033 plastic Substances 0.000 description 11
- 238000007639 printing Methods 0.000 description 10
- 238000003756 stirring Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- FSCIDASGDAWVED-UHFFFAOYSA-N dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC FSCIDASGDAWVED-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000008103 glucose Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000009210 therapy by ultrasound Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000008280 blood Substances 0.000 description 2
- 210000004369 blood Anatomy 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000386 athletic effect Effects 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007647 flexography Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Molecular Biology (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Pathology (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18651209P | 2009-06-12 | 2009-06-12 | |
| US61/186,512 | 2009-06-12 | ||
| PCT/US2010/038300 WO2010144790A1 (en) | 2009-06-12 | 2010-06-11 | Ink jettable silver/silver chloride compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012530153A JP2012530153A (ja) | 2012-11-29 |
| JP2012530153A5 JP2012530153A5 (cg-RX-API-DMAC7.html) | 2014-10-02 |
| JP5628908B2 true JP5628908B2 (ja) | 2014-11-19 |
Family
ID=42556453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012515180A Expired - Fee Related JP5628908B2 (ja) | 2009-06-12 | 2010-06-11 | インクジェット可能な銀−塩化銀組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9255208B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2440624B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5628908B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20120027519A (cg-RX-API-DMAC7.html) |
| CN (1) | CN102459478B (cg-RX-API-DMAC7.html) |
| TW (1) | TW201111452A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2010144790A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8828201B2 (en) * | 2009-07-02 | 2014-09-09 | Dexcom, Inc. | Analyte sensors and methods of manufacturing same |
| US8802568B2 (en) | 2012-09-27 | 2014-08-12 | Sensirion Ag | Method for manufacturing chemical sensor with multiple sensor cells |
| US11371951B2 (en) | 2012-09-27 | 2022-06-28 | Sensirion Ag | Gas sensor comprising a set of one or more sensor cells |
| US10072177B2 (en) * | 2014-11-06 | 2018-09-11 | E I Du Pont De Nemours And Company | Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics |
| US10323157B2 (en) * | 2015-08-20 | 2019-06-18 | Parker-Hannifin Corporation | Silver-silver chloride compositions and electrical devices containing the same |
| US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
| CN113932699A (zh) * | 2021-09-23 | 2022-01-14 | 浦江荣达量具有限公司 | 一种数显卡尺容栅传感器制造工艺 |
| CN115966331B (zh) * | 2022-12-29 | 2025-03-11 | 苏州泓湃科技有限公司 | Cgm生物传感器参比电极用银/氯化银浆料及其制备方法和应用 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5051208A (en) * | 1990-06-29 | 1991-09-24 | Advanced Products Inc. | Silver/silver chloride compositions |
| US5565143A (en) * | 1995-05-05 | 1996-10-15 | E. I. Du Pont De Nemours And Company | Water-based silver-silver chloride compositions |
| US5855850A (en) | 1995-09-29 | 1999-01-05 | Rosemount Analytical Inc. | Micromachined photoionization detector |
| JP2000508825A (ja) * | 1996-04-29 | 2000-07-11 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 生体医療用電極用の導電体、およびそれから作成された生体医療用電極 |
| US5851438A (en) * | 1997-08-29 | 1998-12-22 | E. I. Du Pont De Nemours And Company | Thick film compositions for making medical electrodes |
| US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
| GB0427164D0 (en) * | 2004-12-11 | 2005-01-12 | Eastman Kodak Co | Conductive silver dispersions and uses thereof |
| JP4858057B2 (ja) * | 2006-09-29 | 2012-01-18 | 大日本印刷株式会社 | 導電性基板の製造方法 |
-
2010
- 2010-06-11 KR KR1020127000797A patent/KR20120027519A/ko not_active Ceased
- 2010-06-11 JP JP2012515180A patent/JP5628908B2/ja not_active Expired - Fee Related
- 2010-06-11 WO PCT/US2010/038300 patent/WO2010144790A1/en not_active Ceased
- 2010-06-11 CN CN201080025659.2A patent/CN102459478B/zh not_active Expired - Fee Related
- 2010-06-11 US US13/383,491 patent/US9255208B2/en active Active
- 2010-06-11 TW TW099119180A patent/TW201111452A/zh unknown
- 2010-06-11 EP EP10724671.2A patent/EP2440624B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010144790A1 (en) | 2010-12-16 |
| JP2012530153A (ja) | 2012-11-29 |
| TW201111452A (en) | 2011-04-01 |
| EP2440624B1 (en) | 2014-11-19 |
| CN102459478A (zh) | 2012-05-16 |
| CN102459478B (zh) | 2015-04-22 |
| EP2440624A1 (en) | 2012-04-18 |
| US20120138871A1 (en) | 2012-06-07 |
| US9255208B2 (en) | 2016-02-09 |
| KR20120027519A (ko) | 2012-03-21 |
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