JP5626258B2 - Cooling system - Google Patents

Description

  The present invention relates to a cooling device having air blowing means.

  As this type of cooling device, for example, Patent Literature 1 and Patent Literature 2 disclose devices including rotating air blowing means and a casing.

  Another Patent Document 3 discloses a device in which a heating element and a heat dissipating means are arranged in a case and cooled by blowing air from an external blowing means.

Japanese Utility Model Publication No. 62-16791 Japanese Patent Laid-Open No. 2001-3900 JP 2006-78534 A

  In the above configuration, a product that requires a cooling device is required to have high performance, and it is essential to improve cooling performance and reduce noise in the cooling device.

  Further, in the conventional structure, the heat dissipating means cannot be arranged at an ideal position, the heat dissipating efficiency is deteriorated, and there is a problem that the arrangement layout of the heating elements and the heat dissipating means is changed many times.

  In view of the above problems, an object of the present invention is to provide a cooling device capable of improving the cooling performance and the degree of freedom of arrangement layout.

The cooling device according to claim 1 , further comprising a case, an external air blowing unit that blows air into the case, and a cooling module formed by combining the internal air blowing unit and the heat radiating unit, and generates heat by the external air blowing unit and the cooling module. A structure that performs heat dissipation of the body, a duct that forms an air passage is disposed in the cooling module, a heat transfer member is provided between the heating element and the cooling module, and the external air blowing means in the heat transfer member The internal air blowing means is disposed on the side, and air is blown from the external air blowing means toward the internal air blowing means and the heat transfer member. Since the means is incorporated and the heat dissipating means is cooled, the cooling capacity can be improved in combination with cooling the heat dissipating means by blowing air from the external air blowing means. Further, since the cooling performance is improved, the layout of the heat dissipating means can be given more freedom.

Further , by forming the air passage with a duct, the air from the external air blowing means is guided to the cooling module, and the cooling capacity can be further enhanced as a cooling device.

Further , since the heat from the heating element can be guided to the cooling module by the heat transfer member, the heating element can be effectively radiated without being influenced by the layout of the heating elements.

  Furthermore, in the middle of heat transfer from the heating element to the heat dissipation means through the heat transfer member, heat can be effectively taken away from the heat transfer member by blowing air from the external blowing means, and the heat dissipation means can be reduced in size.

A cooling apparatus according to claim 2, by using a cooling module for cooling the heating element, it is possible to reduce the influence of cooling Previous Symbol the heating element due to the arrangement of the radiation means.

  According to the configuration of the first aspect, the cooling performance and the degree of freedom of the layout can be improved.

Further , the cooling capacity can be further enhanced as a cooling device.

Moreover , it becomes possible to radiate heat effectively from the heating element.

Furthermore, heat can be effectively taken from the heat transfer member by blowing air from the external blowing means, and the heat dissipation means can be reduced.

According to the structure of Claim 2, it becomes possible to make it difficult to receive the influence of the cooling to a heat generating body by arrangement | positioning of a thermal radiation means.

It is a whole perspective view of the cooling device in one example of the present invention. It is a front view same as the above. FIG. 3 is a cross-sectional view taken along line AA in FIG. It is a graph which shows the air volume-static pressure characteristic of a present Example and a prior art example. It is a graph which shows the maximum air volume-noise characteristic of a present Example and a prior art example. It is a circuit diagram of the induction heating apparatus which shows 2nd Example of this invention. It is a top view of a cooling module and its periphery same as the above. It is a side view of a cooling module and its periphery same as the above. It is a top view showing the whole structure of a cooling device same as the above. It is a top view showing the whole structure of the cooling device which shows another example same as the above. It is a top view showing the whole structure of the cooling device which shows another example same as the above.

  Hereinafter, preferred embodiments of a cooling device according to the present invention will be described with reference to the accompanying drawings. FIG. 1 and FIG. 2 show an external configuration of a square axial fan motor 1 as a cooling device. Reference numeral 2 denotes a rotating fan, and 3 is a substantially square casing that forms an outer shape of the fan motor 1. As is well known, the fan 2 includes a plurality of blades 5 having the same shape around the cup-shaped rotor 4. Although not shown here, a shaft at the center of the fan 2 is a casing. 3 is supported by a bearing provided in the bearing 3. The fan 2 is rotated about the shaft by an electromagnetic action between a magnet (not shown) attached to the inner peripheral surface of the rotor 4 and a motor unit 6 as a drive source to be described later.

  Here, the structure of the fan 2 and the casing 3 will be described in more detail with reference to FIG. The blade 5 of the fan 2 has a blade body 5A extending from the outer peripheral surface of the rotor 4 toward the inner surface of the axial flow path 16, and extends further in the outer peripheral direction than the blade body 5A on one side of the blade body 5A. It is formed by a tongue-like overlap portion 5B to be provided.

  The casing 3 has a structure in which a frame-shaped outer case portion 11 that forms the outer periphery of the casing 3 and a central portion 12 that holds the bearing are coupled by spokes 13 that are connecting portions. A suction side bell mouth 14 is formed on one side of the outer case portion 11, and a discharge side bell mouth 15 is formed on the other side of the outer case portion 11. The suction side bell mouth 14 has a suction port 14A that sucks ambient air into the casing 3 as the fan 2 rotates, and has an inclined surface 14B that tapers toward the suction port 14A. The discharge-side bell mouth 15 has a discharge port 15A for discharging the air that has passed through the fan 2 from the suction port 14A to the outside of the casing 3, and has an inclined surface 15B that extends in a tapered shape toward the discharge port 15A.

  The suction side bell mouth 14 including the suction port 14A and the discharge side bell mouth 15 including the discharge port 15A are disposed along the axial direction of the rotating fan 2, and the suction side bell mouth 14 and the discharge side bell mouth 14 are disposed. A cylindrical shaft flow path 16 is formed in the casing 3 so as to be rotatable between the mouse 15 and the fan 2. The inner diameter dimension of the axial channel 16 is narrower than the inner diameter dimension of the suction port 14A because the suction side bell mouth 14 is provided with the inclined surface 14B, and the discharge side bell mouth 15 is provided with the inclined surface 15B. Therefore, it is formed narrower than the inner diameter of the discharge port 15A.

  What should be noted in this embodiment is that the overlap portion 5B corresponding to the outer peripheral portion of the blade 5 overlaps the suction side bell mouth 14 and the inner surface of the shaft flow path 16 as a reference. The angle α of the inclined surface 14B of the suction side bell mouth 14 with respect to the inner surface of the flow channel 16 is formed to be 40 ° ± 10 °.

  More specifically, the overlap portion 5B of the blade 5 is located outside the base end of the inclined surface 14B of the suction side bell mouth 14 connected to the inner surface of the axial flow path 16, so that both overlap each other. It overlaps. The outer end of the blade body 5A is in close contact with the inner surface of the axial flow path 16 without contact, while the outer end of the overlap portion 5B is in close contact with the inclined surface 14B of the suction side bell mouth 14 without contact. Are arranged as follows. By providing the overlap portion 5B overlapping the suction side bell mouth 14, air sucked along the inclined surface 14B from the suction port 14A of the suction side bell mouth 14 during rotation of the fan 2 is sucked into the suction port 14A. Therefore, air can be smoothly guided from the suction side bell mouth 14 to the axial flow path 16 side.

  Further, the inclined surface 14B of the suction side bell mouth 14 is formed such that its axial expansion angle α is 40 ° ± 10 °. This is a range in which favorable characteristics regarding static pressure and noise were obtained from the results of experiments at various angles α. Details of the experimental results will be described later.

  Next, the effect | action is demonstrated about the said structure. When the fan 2 rotates around the shaft by energization of the motor unit 6, the air sucked from the suction port 14 </ b> A of the suction side bell mouth 14 is discharged from the shaft channel 16 to the discharge port 15 </ b> A of the discharge side bell mouth 15. Such an air flow is formed. Here, the air sucked from the suction port 14A of the suction side bell mouth 14 does not wrap around at the edge of the suction port 14A by the overlap portion 5B of the blade 5 that is close to and opposed to the inclined surface 14B. Along the inclined surface 14B having an angle α (= 40 ° ± 10 °), while maintaining high static pressure and low noise, scraping quickly toward the axial flow path 16 with a desired air volume without generating turbulent flow. Is included. Since this air is finally discharged from the discharge port 15A to the outside of the casing 3 along the inclined surface 15B of the discharge side bell mouth 15 from the axial flow path 16, a high air volume, It becomes possible to achieve static pressure and low noise.

  Next, a comparison of the characteristics of the cooling device between the present embodiment and the conventional example will be described with reference to the graphs of FIGS. In each of these drawings, in the cooling device of the conventional example, the overlap portion 5B as described above is not formed on the blade 5, and the angle α of the inclined surface 14B is formed to be less than 30 °. As shown in FIG. 4, the cooling device of the present example has an air volume-static pressure characteristic superior to the cooling device of the conventional example. If the air volume is the same, the static air pressure is higher and the static pressure is the same. If there is, it turns out that it is higher air volume. Further, as shown in FIG. 5, the cooling device of the present example has a maximum air volume-noise superior to the cooling device of the conventional example, and it can be seen that the noise is lower if the same maximum air volume.

  As described above, in this embodiment, in the cooling device provided with the fan 2 as the rotating air blowing means and the casing 3, the suction side outer periphery of the suction side bell mouth 14 which is the bell mouth formed in the casing 3 is 40 ° ±. The overlap portion 5 that is the outer periphery of the fan 2 is overlapped with the suction side bell mouth 14.

  In this way, the inclined surface 14B that is the suction side outer periphery of the suction side bell mouth 14 is formed at an angle α of 40 ° ± 10 °, thereby forming the inclined surface 14B of the suction side bell mouth 14 at an angle α other than that. It is possible to obtain static pressure and noise characteristics superior to the above. In addition, by overlapping the overlap portion 5B, which is the outer periphery of the fan 2, with the suction side bell mouth 14, the air sucked in the diagonal direction along the bell mouth shape having the inclined surface 14B becomes the edge of the suction port 14A. It is possible to prevent a turbulent flow from occurring at the part, and to prevent noise deterioration and air volume reduction. As a result, it is possible to provide a cooling device that realizes a high air volume, high static pressure, and low noise.

  Next, a second embodiment of the present invention will be described with reference to FIGS. First, the circuit configuration of the induction heating device will be described with reference to FIG. 6 as a cooling target of the cooling device proposed in the present embodiment. In the figure, 21 is an AC power source, 22 is a diode stack as a rectifier, 23 and 24 are choke coils and smoothing capacitors forming a smoothing circuit, 25 is an induction heating coil, and 26 is an LC resonance circuit together with the induction heating coil 25. A resonant capacitor 27 is an IGBT (insulated gate bipolar transistor) corresponding to a switching element. Here, the diode stack 22 and the IGBT 27 attached to a control board (not shown) for controlling induction heating correspond to a heating element as a heating component.

  The diode stack 22 performs full-wave rectification on the power supply voltage from the AC power supply 21 to convert it into direct current, and smoothes the direct current voltage with the choke coil 23 and the smoothing capacitor 24. Then, a high frequency current generated by switching the IGBT 27 from the smoothed DC voltage is passed through a parallel resonance circuit of the induction heating coil 25 and the resonance capacitor, thereby inductively heating a load (not shown) adjacent to the induction heating coil 25. It is the composition to do. Note that the configuration of the induction heating device shown in FIG. 6 is merely an example, and various modifications are possible, such as using a switching element other than the IGBT 27.

  Next, the features of the cooling device in the present embodiment will be described in order from FIG. 7 and 8 showing the configuration of the cooling module 31 and its surroundings, the diode stack 22 and the IGBT 27 constituting the induction heating device are directly attached to the radiator 32 as a heating element. The radiator 32 is made of a metal material having good thermal conductivity, such as aluminum, and is provided so that heat from the diode stack 22 and the IGBT 27 can be quickly transferred. In addition, a cooling fan 33 as a cooling device having a structure as shown in FIG. 1 is incorporated in the radiator 32 to forcibly cool the radiator 32, for example. The radiator 32 and the cooling fan 33 constitute a cooling module 31 that radiates heat from the diode stack 22 and the IGBT 27.

  In FIG. 7 and FIG. 8, the blowing direction of the cooling fan 33 is indicated by an arrow. The cooling fan 33 includes a suction port 33A for sucking air and a discharge port 33B for discharging air, which are arranged along the rotation axis direction of a built-in fan (not shown). An outlet 33B is provided. The diode stack 22 and the IGBT 27 are thermally connected to the other side of the radiator 32, and the heat transmitted from the diode stack 22 and the IGBT 27 to the radiator 32 is discharged from the discharge port 33 </ b> B of the cooling fan 33. Heat is effectively exchanged with the air.

  FIG. 9 shows a state in which the cooling device of this embodiment is incorporated in the induction heating device. In the figure, reference numeral 41 denotes a rectangular box-shaped case, and 42 denotes a substrate mounted in the case 41 and mounted with an induction heating device, that is, a printed circuit board. Here, the cooling module 31 is placed on one side of the printed circuit board 42. A diode stack 22 and an IGBT 27 are provided. Further, an external fan 43 different from the cooling fan 33 is provided on one side of the case 41 so that air around the case 41 is introduced into the case 41.

  In FIG. 9, the blowing direction of the external fan 43 is indicated by an arrow. In the external fan 43, a suction port 43A for sucking air and a discharge port 43B for discharging air are arranged along the rotation axis direction of a built-in fan (not shown), and the discharge port 43B is an outer surface of the case 41. Provided. As a result, the air sucked from the suction port 43A passes through the external fan 43 and is sent out from the discharge port 43B toward the cooling module 31 inside the case 41, where it is forced toward the radiator 32 by the cooling fan 33. It is designed to blow air.

  In the embodiment shown in FIG. 9, the temperature of the radiator 32 in the case 41 rises as the diode stack 22 and the IGBT 27 generate heat, but the fan of the cooling fan 33 incorporated in the radiator 32 that becomes high temperature rotates. Compared with the conventional structure in which the radiator 32 is cooled only by air blown from the external fan 43 by driving and forcibly cooling the radiator 32, the cooling performance for the diode stack 22 and the IGBT 27, which are heating elements, is improved. In addition, the radiator 32 and the external fan 43 can be reduced by the amount of such improved cooling performance.

Further, a cooling module 31 that incorporates a cooling fan 33 to the radiator 32, derived by using the cooling heat-generating components of the heating device, the influence of cooling to or diode stack 22 by the arrangement of the heat sink 32 release IGBT27 Can be difficult. Therefore, the heat radiator 32, the diode stack 22 and the IGBT 27 can be freely arranged on the printed circuit board 42.

  Further, here, the cooling module 31 is arranged inside the case 41 in the air blowing direction from the external fan 43, and the air sent out from the external fan 43 is directly taken in from the suction port 33A of the cooling fan 33 to be discharged from the discharge port 33B. Therefore, the diode stack 22 and the IGBT 27 can be efficiently cooled.

  As described above, in this embodiment, the cooling module is formed by combining the case 41, the external fan 43 serving as the external air blowing means for blowing air into the case 41, the cooling fan 33 serving as the internal air blowing means, and the radiator 32 serving as the heat radiation means. 31 and the external fan 43 and the cooling module 31 are configured to dissipate heat from the diode stack 22 and the IGBT 27, which are heating elements.

  With this configuration, the cooling fan 33 is incorporated in the radiator 32 that receives heat from the diode stack 22 and the IGBT 27 and becomes high temperature, and the radiator 32 is forcibly cooled. Combined with cooling, the cooling capacity can be improved. Further, since the cooling performance is improved, the radiator 32 and the external fan 43 can be reduced, and the layout of the radiator 32 with respect to the air path of the external fan 43 can have more flexibility.

  Next, another modification will be described with reference to FIG. Here, in order to partition the air path from the external fan 43 through the cooling module 31 to the outside of the case 41, the discharge port 43 </ b> B of the external fan 43 and one side of the cooling module 31 are formed inside the case 41. A cylindrical duct 45 is disposed therebetween, and another cylindrical duct 46 is disposed between the other side of the cooling module 31 and the other side opening of the case 41. In this modified example, in order to form the air path from the external fan 43 at the shortest distance, the straight cylindrical ducts 45 and 46 are arranged, but the arrangement layout of the diode stack 22 and the IGBT 27 is taken into consideration. One or both of the ducts 45 and 46 may be formed in a curved shape.

  In this example, the air discharged from the discharge port 43B of the external fan 43 is supplied to the cooling fan 33 of the cooling module 31 through the duct 45 without waste, and it is possible to efficiently apply the cold air to the radiator 32. Further, the air deprived of heat from the radiator 32 is discharged to the outside from the other side of the case 41 as it is without being diffused into the case 41 through another duct 46, and an unnecessary temperature rise inside the case 41 is caused. Factors can be eliminated. In addition, the air passing through the duct 46 is quickly discharged to the outside of the case 41 without being stayed in the duct 46 by the ventilation of the cooling fan 33 as well as the external fan 43.

  As described above, in this modification, the ducts 45 and 46 for forming the air path from the external fan 43 and the like are arranged on one side and the other side of the cooling module 31, respectively. In this case, the air path from the external fan 43 is formed separately from other parts by the ducts 45 and 46, so that the air blown from the external fan 43 is directly guided to the cooling module 31 and is directly discharged from the cooling module 31. Thus, air supply and exhaust can be promoted, and the cooling capacity of the cooling device can be further enhanced.

  FIG. 11 shows still another modification of the cooling device. In the figure, 51 is a heat pipe as a heat transfer member for transferring heat from the diode stack 22 or IGBT 27 to the radiator 32 of the cooling module 31. This heat pipe 51 injects a very small amount of hydraulic fluid into a tubular body such as copper having excellent thermal conductivity, and circulates the hydraulic fluid inside the tubular body, and is extremely superior to hydraulic fluid that moves at the speed of sound. It has a high thermal response. One end of the heat pipe 51 is thermally connected to the diode stack 22 and the IGBT 27, and the other end is thermally connected to the other side of the radiator 32. That is, the heat pipe 51 is provided inside the case 41 so as to straddle between the separated diode stack 22 or IGBT 27 and the radiator 32, and the cooling module 31 having the cooling fan 33 is connected to the external fan 43 as much as possible. You can get closer.

  In FIG. 11, the blowing direction of the external fan 43 is indicated by an arrow. In this example, not only air is blown from the external fan 43 toward the cooling fan 33, but also air is blown from the external fan 43 toward the heat pipe 51. In this way, heat can be effectively taken from the heat pipe 51 by the air blown from the external fan 43 while the heat is transferred from the diode stack 22 or the IGBT 27 to the radiator 32 through the heat pipe 51. Can be reduced. In addition, you may arrange | position the ducts 45 and 46 as shown in FIG.

As described above, in this modification, the heat pipe 51 as the heat transfer member is provided between the diode stack 22 or IGBT 27 that is a heat generating element and the cooling module 31, and the cooling fan is provided on the external fan 43 side of the heat pipe 51. 33 is arranged to blow air from the external fan 43 toward the cooling fan 33 and the heat pipe 51. In this way, heat from the diode stack 22 and the IGBT 27 can be guided to the cooling module 31 at a distant position by the heat pipe 51, so that the cooling fan 33 is not affected by the layout of the diode stack 22 and the IGBT 27. Thus, the cooling module 31 having the above can be brought close to the external fan 43, and the diode stack 22 and the IGBT 27 can be effectively dissipated. Further, while heat is transferred from the diode stack 22 or the IGBT 27 to the radiator 32 through the heat pipe 51, heat can be effectively taken away from the heat pipe 51 by blowing air from the external fan 43, and the radiator 32 is reduced in size. it can.

  In addition, this invention is not limited to the said Example, It can change in the range which does not deviate from the meaning of this invention.

22 Diode stack (heating element)
27 IGBT (heating element)
31 Cooling module 32 Radiator (Heat dissipation means)
33 Cooling fan (internal ventilation means)
41 Case 43 External fan (external ventilation means)
45, 46 Duct 51 Heat pipe (heat transfer member)

Claims (2)

A case, an external air blowing means for blowing air into the case, and a cooling module formed by combining the internal air blowing means and the heat radiating means,
The external air blowing means and the cooling module are configured to radiate heat from the heating element,
A duct forming an air passage is disposed in the cooling module;
Providing a heat transfer member between the heating element and the cooling module;
Arranging the internal air blowing means on the external air blowing means side of the heat transfer member;
The direction from the outside air blowing means and the heat transfer member and said inner blowing means, cooling device being characterized in that a configuration for performing blowing. The heating element is for controlling the induction heating, and wherein the cooling module by using the cooling of the heating element, that by the arrangement of the prior SL radiating means is less affected by the cooling to the heating element The cooling device according to claim 1.

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