JP2008165699A - Radiator and device with radiator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiator which is capable of simplifying an arrangement configuration of a device including a heat dissipating mechanism, and a device provided with the radiator. <P>SOLUTION: A radiator 10 externally attached to an enclosure 51 for storing a main body therein includes an air duct 7 which is attached to the outside of the enclosure 51 and allows air being a cooling medium to flow therein, a motor fan 3 which inhales air to cause the air to flow to the air duct, a heat dissipating member 5 which connects a heating body 53 placed in the main body and the air duct through the enclosure. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat dissipation device and a device with a heat dissipation device, and more specifically to a heat dissipation device that dissipates heat generated from a heating element such as a semiconductor device and the device with the heat dissipation device.

  Many semiconductor devices are used in electronic devices including computers, various mechanical devices, transport machines including automobiles, and the like, and a lot of heat is generated from these semiconductor devices. In these apparatuses, as the capacity of the apparatus is increased, the size of the apparatus is reduced, and the processing speed is increased. If sufficient heat dissipation is not performed, the temperature of the semiconductor device rises and normal operation cannot be performed.

  The rise in temperature of the semiconductor device has been a problem for a long time, and many efforts have been made especially for personal computers and automobiles that are strongly demanded to be reduced in size and weight. For example, in order to dissipate the heat of the MPU (Micro Processing Unit) of a personal computer, the heat generated from the MPU is transferred to the outer frame fin via the heat sink on the outer frame with fins attached to one end of the heat sink in the personal computer casing. A configuration has been proposed in which the fins and the like are cooled by a motor fan and the MPU is also cooled by an air flow by the motor fan (Patent Document 1). According to the said structure, since a fin is provided in the motor fan side, an air blower is reduced in size, and since heat conductivity is given to the outer frame of a motor fan, heat dissipation efficiency can be improved.

In addition, for the purpose of reducing the number of parts of the heat dissipation mechanism of electronic devices, especially portable personal computers, and reducing the heat resistance of the heat dissipation path, a heat dissipation fan with a structure (frame body) and a heat pipe are arranged in the housing, The structure which presses the cooling end side of a heat pipe against the said structure of a thermal radiation fan was proposed (patent document 2). According to this structure, the heat sink conventionally interposed between the heat pipe and the heat radiating fan outer frame can be omitted, and the heat resistance of the heat radiating path can be reduced.
JP-A-8-274480 Japanese Patent Laid-Open No. 10-275032

  However, as described above, in the configuration in which the heat dissipating fan is arranged in the housing, it is mixed with various electronic components such as semiconductor devices in the main body of the electronic device (heating element-heat spreader-heat dissipating member-heat dissipating fin-attachment). All of the motor fans including the parts, the frame, etc. must be arranged in the casing, and the arrangement of the arrangement is complicated in the casing. As a result, it is necessary to form a structure that performs the original function of the device while forming (a heating fan-heat spreader-heat radiation member-heat radiation fin-mounting portion, motor fan including a frame, etc.). It is inevitable that the process is complicated. In addition, with this complicated arrangement configuration, a wasteful space is generated between the components little by little, and the inside of the housing including (a heating fan-a heat spreader-a heat radiating member-a heat radiating fin-an attachment portion, a motor fan including a frame, etc.) The total space tends to increase.

  An object of the present invention is to provide a heat radiating device capable of simplifying the arrangement configuration of a device including a heat radiating mechanism and a device with a heat radiating device equipped with the heat radiating device.

  The heat dissipating device of the present invention is attached to the outside of the housing for housing the main body, passes through an air passage for flowing air as a cooling medium, a motor fan for sucking and flowing air into the air passage, and an opening portion of the housing. And a heat dissipating member for connecting the heating element and the air passage located in the main body.

  If this structure is followed, the part of the heat radiating member which carries the heat | fever of the heat generating body which becomes high temperature in a housing | casing to the air path outside a housing | casing will be located in the housing | casing and the exterior. In the housing, in order to allow sufficient heat exchange with the heating element at the high temperature side end of the heat radiating member, a structure that ensures sufficiently high thermal conductivity is formed, and an opening through which the heat radiating member is passed is provided. Just form it. For this reason, the arrangement configuration of the heat dissipation mechanism in the housing can be greatly simplified. As a result, the manufacturing process of the device with a heat dissipation mechanism can be simplified. Further, since the air flow is made to flow away from the components of the apparatus main body, the flow resistance due to components other than the low temperature side end of the heat radiating member can be reduced, leading to an increase in heat dissipation efficiency from the low temperature side end of the heat radiating member. Note that the heating element is not limited to a semiconductor device, and may be anything that generates heat.

  Furthermore, as a secondary effect, although depending on the form of the opening of the casing wall through which the heat dissipation member passes, the air flow as the cooling medium passes through the air passage outside the casing without passing through the casing. Air flow cannot pass through. For this reason, it is suitable with respect to the apparatus which dislikes the rising of the dust by an air flow, and the apparatus which dislikes the drying promotion effect by an air flow.

  Moreover, a heat pipe can be used for said heat radiating member. Thereby, the heat generated in the heating element can be efficiently carried to the air passage, and the heat can be dissipated into the air flow on the low temperature side of the heat pipe.

  Further, the air passage can be formed in a cylindrical shape. With this configuration, the air flow resistance can be reduced as compared with the case where the main body is mixed in the housing. Particularly in the case of a cylindrical body having a straight axis, the flow resistance can be dramatically reduced. As a result, it is possible to improve heat dissipation at the low temperature side end portion of the heat radiating member and improve the overall heat radiating performance. This is an effect that can be realized only when air is used as a heat medium and an air flow path is provided externally. In other words, in the case of a liquid heat medium, the liquid flow path must be formed in a closed path, and in the case of a gas other than air, a recovery path in the same closed path is required. The effect cannot be as great as in the case of. In addition, the cross-sectional shape of a cylindrical body should just be cylindrical regardless of shapes, such as a circle, a semicircle, an ellipse, a square, a rectangle, and a hexagon. Of course, one side of the cross section of the air flow path may be shared by the housing of the main body device.

  Further, the motor fan can be positioned in the air passage, and the rotation axis of the motor fan can be aligned in the air flow direction of the air passage. With this configuration, the air passage can be made compact and the conductance of the air flow can be increased. Therefore, the overall size of the device to which the heat radiating device is attached can be made smaller and thinner.

In addition, the motor fan can be configured such that the stator is positioned outside the fan blade attached to the rotor. As a result, the torque acting on the fan blades can be increased, and this increase in torque can be reduced in size, thickness, weight, energy saving (longer rechargeable battery charging cycle), etc. Can be used. It can also be used to improve the flow rate and flow rate of the air flow.
Also,

  In the motor fan described above, the end portion of the core core of the stator is viewed along the rotation axis of the motor fan, and the permanent magnet attached to the tip of the fan blade is overlapped when the fan blade rotates. It may be arranged as such. Thereby, torque can be further increased and it can contribute to size reduction and thickness reduction of a motor fan or a heat dissipation device and a device with a heat dissipation device.

  The apparatus with a heat dissipation device of the present invention is a state in which the main body is housed in the housing, and any of the heat dissipation devices is mounted in the housing through the opening of the housing through one end of the heat dissipation member. It is attached to the housing.

  With this configuration, the arrangement of the apparatus can be simplified, and as a result, the manufacturing process can be simplified. Further, since the air flow can flow away from the parts of the apparatus main body, the flow resistance due to the parts other than the low temperature side end of the heat radiating member can be reduced, so that the heat at the low temperature side end of the heat radiating member can be reduced. It can be used to enhance the diffusion. The device with a heat dissipation device is not limited to electronic devices, and may be a device in any field. For example, various printing devices that emphasize prevention of electrical troubles such as short circuits caused by dust in the device due to air flow inside the housing may be used, and it is important to avoid diffusion of dust in the air due to air flow inside the housing It may be a simple device.

  Further, the main body is a personal computer main body, the heating element is a semiconductor device, the casing is a flat box, and the heat dissipation device can be attached to the side of the casing. Thereby, it is possible to reduce the thickness of the notebook computer. In addition, by disposing the semiconductor device in the vicinity of the housing wall near the heat dissipation device, the heat pipe can be shortened, which can contribute to weight reduction.

  According to the heat radiating device and the device with the heat radiating device of the present invention, the arrangement configuration of the main body part and the heat radiating mechanism in the housing can be simplified.

(Embodiment 1)
FIG. 1 is a perspective view showing a heat dissipation device 10 and a device 50 with a heat dissipation device in Embodiment 1 of the present invention. The heat dissipation device 10 is attached to the outside of the casing 51 of the apparatus main body, and the air passage 7 is formed by the casing 11 of the heat dissipation apparatus and the side portion of the casing 51 of the apparatus main body. The air passage 7 is formed from an opening 7 a where the motor fan 3 is located to an exhaust port 7 b provided at the other end of the housing 11. Further, the heat radiating member 5 provided with the heat radiating fins 5a in the air passage 7 of the heat radiating device 10 passes through an opening (not shown) provided in a side portion of the casing 51 of the device main body, and then the heat spreader 9. It extends to. A semiconductor device 53 is disposed on the back surface of the heat spreader 9.

  The heat generated in the semiconductor device 53 is conducted from the heat spreader 9 to the heat radiation member 5 to the heat radiation fin 5a. The air flow sucked and driven by the motor fan 3 hits the heat radiating fins 5a, takes heat from the heat radiating fins 5a, and is discharged from the exhaust port 7b. Since the air flow passes straight through the air passage 7, it is possible to greatly improve the conductance of the air flow as compared with the case where the air flow is mixedly loaded in the casing 51 of the apparatus main body, and as a result, in terms of air flow. Heat dissipation can be improved.

  Further, the area of the heat dissipating fins 5a can be expanded as long as the air passage 7 allows without being obstructed by other parts that perform the function of the apparatus main body. That is, in the present embodiment, the spatial restriction on the radiation fins 5a is reduced as compared with the case where it is arranged in the casing 51 of the conventional apparatus main body, and the heat radiation performance of the radiation fins can be improved.

  Further, regarding the arrangement configuration of the components of the device 50 with the heat radiating device, the position of the semiconductor device 53 is arranged close to the heat radiating device 10, thereby simplifying the arrangement of the components of the main body of the device with little influence. An arrangement can be created. This is also true for the arrangement of the components of the apparatus main body and the arrangement of the components of the heat dissipation device. For example, on the apparatus main body side, the heat radiating device 10 should be taken into consideration by providing an opening through which the heat radiating member 5 is provided on the side of the casing 51, removing power from the motor fan 3, and the housing of the heat radiating apparatus 10. It is only necessary to consider the attachment of the body 11. For this reason, the manufacture of the heat dissipation device 10 can be performed almost independently of the manufacture of the device main body, and the manufacture of the device main body and the heat dissipation device 10 can be simplified. As a result, in a predetermined case, it is possible to reduce the manufacturing cost of the device with a heat dissipation device.

  Further, in the heat radiating device 10, the air flow hardly affects the inside of the casing 51 of the apparatus main body. For example, an opening (not illustrated) provided in the casing 51 of the apparatus main body (not illustrated) is reduced, or the heat radiating member 5. The effect of the air flow can be eliminated by applying a treatment to fill the gap between the opening and the opening. Depending on the apparatus, for example, in a printing machine or the like, it is not desirable to generate an air flow in the housing in order to prevent an electrical trouble such as a short circuit caused by dust in the apparatus. In addition, there is an apparatus in which dust does not flow favorably within the casing 51 of the apparatus body. The device with a heat dissipation device of the present embodiment can be suitably used for the device as described above.

  As long as the heat dissipation member has good thermal conductivity, copper, aluminum, etc. can be used. However, the heat pipe has a large heat transport amount with a small temperature difference, and the maximum heat transport amount. Is also very large, and should be used as a heat dissipation member. Commercially available heat pipes with various specifications can be used.

  Although FIG. 1 shows the case where the heat radiating device 10 is attached to the side portion of the casing 51 of the apparatus main body, the heat radiating apparatus 10 is attached to either the upper part or the lower part (bottom surface) of the casing 51 of the apparatus main body. Can do. Further, in the air passage of FIG. 1, the rotation axis of the motor fan 3 is configured to be aligned with the direction of the air flow of the air passage 7, but there are some devices that cannot have the structure of FIG. 1. FIG. 2 is a diagram illustrating the heat dissipation device 10 when the direction of the rotation axis of the motor fan is arranged to intersect the air flow. Such a configuration is suitable for a case where the mounting area of the heat radiating device 10 to the main body casing 51 cannot be increased.

  Next, the motor fan 3 will be described. 3-5 is a figure which shows the motor fan 3 used for the thermal radiation apparatus 10 shown in either FIG. 1 or FIG. In the stator, coils 3c each having a winding wound around an iron core 3d are arranged along the circumference, and a back yoke 3b is passed between the coils. Each motor fan 3 is characterized in that it has a structure in which a stator is arranged on the outer peripheral side of a rotor provided with fan blades 3a. A permanent magnet 3m is attached to the tip of the fan blade 3a of the rotor so that a rotational driving force can be obtained between the magnetic flux generated by the coil 3c disposed on the stator. The polarities of the permanent magnets are arranged so as to be opposite to each other in the adjacent fan blades 3a.

  In the motor fan 3 of FIG. 3, the fan blade 3a is formed of a soft magnetic material and functions as a yoke. As a result, magnetic flux leakage can be suppressed in the magnetic circuit of the motor fan 3. Further, in the motor fan 3 of FIG. 4, the blade connecting ring 3y that connects the tips of the fan blades 3a is formed of a soft magnetic material and functions as a yoke. The blade connection ring 3y formed of a soft magnetic material also suppresses leakage of magnetic flux and increases the torque of the motor. In this case, the fan blade 3a may be a resin or a soft magnetic material. Further, in the motor fan 3 of FIG. 5, as shown in the shape of the iron core 3d, the end of the iron core 3d and the tip of the fan blade 3a are viewed along the rotation axis (axis) and are mutually rotated. To overlap. Thereby, the torque of the motor can be further increased. The stator core of the motor fan in any of FIGS. 3 to 5 can be manufactured from a laminated steel plate or a powder magnetic material, but the stator core 3d in FIG. 5 is preferably manufactured from a powder magnetic material. .

  Conventionally, since a motor fan is formed by a rotor having permanent magnets arranged in an annular shape and a stator arranged inside the annular shape, the torque is small, and a sufficient amount is required unless the fan blades are large. It was difficult to obtain a flow of air at a flow rate. As described above, by arranging the stator on the outer peripheral side of the fan blade 3a of the rotor, a high torque can be generated, and this high torque can be used for miniaturization of the motor fan. Therefore, by using the motor fan in the motor fan 3 of the heat dissipation device 10 shown in FIG. 1 or FIG. 2, the heat dissipation device 10 can be easily reduced in size and thickness.

(Embodiment 2)
FIG. 6 is a diagram showing the heat dissipation device 10 and the personal computer 50 with a heat dissipation device according to Embodiment 2 of the present invention. The heat radiating device 10 is attached to the side of the casing 51 of the personal computer 50. In the heat radiating device 10, the air passage 7 is formed by a housing 51 of the personal computer and a housing 11 of the heat radiating device 10, and has a linear cylindrical body. The electric power of the motor fan 3 is supplied from the power source of the personal computer main body by the lead wire 23, but may be supplied from the external power outlet to the personal computer by a plug.

  A heat pipe is used for the heat radiating member 5, and heat generated in the semiconductor device 53 is conveyed to the air passage side. The heat pipe 5 can carry a large amount of heat even if the temperature difference is small, and the maximum heat carrying amount is also large. It is preferable that the heat pipe 5 ensure a planar contact so as to exchange heat sufficiently between the heat spreader 9 that exchanges heat with the semiconductor device 53 and the high-temperature side end. The heat pipe 5 passes through a hole (not shown) provided in the housing side portion of the personal computer 50, and performs heat transport using the heat spreader side as a high temperature side end and the air flow side (radiation fin 5a side) as a low temperature side end. The air flow sucked and driven by the motor fan 3 strikes the heat radiating fins 5a, takes heat, and is discharged from the exhaust opening 7b.

  7 and 8 are side views of the apparatus with a heat dissipation device of FIG. 6 as viewed from the air suction side. FIG. 7 shows a case where the cross section of the air passage 7 has a rectangular tube shape, and FIG. 8 shows a case where the cross section of the air passage 7 has a semicircular shape. In either case, the side portion of the personal computer casing 51 is used as a cylindrical wall surrounding the air passage. In addition, any one of the motor fan 3 shown in FIGS. 3 to 5 can be used as the motor fan 3, which facilitates downsizing and thinning.

Since the air flow passes straight through the air passage 7, the conductance of the air flow can be greatly improved as compared with the case where the air flow is stored in the housing 51 of the personal computer as in the past, and as a result, heat is dissipated in terms of air flow. Can increase the sex. Further, the area of the heat dissipating fin 5a can be expanded as long as the air passage 7 allows without being obstructed by other parts that fulfill the functions of a personal computer. That is, in the present embodiment, the spatial restriction on the heat radiating fins 5a is reduced as compared with the case where the heat radiating fins 5a are arranged in the case 51 of the conventional personal computer.

  Further, regarding the arrangement configuration of the parts of the personal computer 50 with the heat radiating device, by arranging the position of the semiconductor device 53 at a position close to the heat radiating device 10, the simplified arrangement without affecting the arrangement of the personal computer parts. You can create a configuration. This is also true for the arrangement of the parts of the personal computer and the arrangement of the parts of the heat dissipation device. For example, on the personal computer side, the heat radiating device 10 is taken into consideration in that an opening for passing the heat radiating member 5 is provided in the side portion of the housing 51, the power supply of the motor fan 3 is taken, and the housing of the heat radiating device 10. 11 should be taken into consideration. For this reason, the manufacture of the heat dissipation device 10 can be performed almost independently of the manufacture of the personal computer main body, and the manufacture of the personal computer main body and the heat dissipation device 10 can be simplified. As a result, in a predetermined case, the production cost of the personal computer with the heat dissipation device can be reduced.

  Although the embodiments and examples of the present invention have been described above, the embodiments and examples of the present invention disclosed above are merely examples, and the scope of the present invention is the implementation of these inventions. It is not limited to the form. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  According to the apparatus with a heat dissipation device of the present invention, it is possible to simplify the arrangement configuration of the main body components and the heat dissipation mechanism in the housing, while suppressing the temperature rise of the semiconductor device, simplifying the manufacturing process, and the device This effectively works to realize downsizing and thinning.

It is a figure which shows the heat radiating device and the apparatus with a heat radiating device in Embodiment 1 of this invention. It is a figure which shows the modification of the thermal radiation apparatus of FIG. It is explanatory drawing of a motor fan. It is a figure which shows the modification of the motor fan of FIG. It is a figure which shows another modification of the motor fan of FIG. It is a figure which shows the thermal radiation apparatus in Embodiment 2 of this invention and an apparatus with a thermal radiation apparatus. It is the side view seen from the air suction side of the apparatus of FIG. It is a figure which shows the modification of the apparatus of FIG.

Explanation of symbols

  3 motor fan, 3a fan blade, 3b back yoke, 3c coil, 3d iron core, 3m permanent magnet, 3y blade connecting ring, 5 heat dissipating member (heat pipe), 5a heat dissipating fin, 7 air passage, 7a suction opening, 7b exhaust Mouth, 9 Heat spreader, 10 Heat dissipating device, 11 Heat dissipating device case, 23 Motor fan power supply lead wire, 50 Heat dissipating device (PC), 51 Case, 53 Semiconductor device.

Claims (8)

An air passage which is attached to the outside of the housing for storing the main body and allows air as a cooling medium to flow;
A motor fan that sucks and flows air into the air passage;
A heat dissipating device comprising: a heat dissipating member that passes through the opening of the housing and connects the heating element located in the main body and the air passage.   The heat radiating device according to claim 1, wherein the heat radiating member is a heat pipe.   The heat radiating device according to claim 1, wherein the air passage is configured in a cylindrical shape.   The heat radiating device according to any one of claims 1 to 3, wherein the motor fan is located in an air passage, and a rotation axis of the motor fan is aligned in a direction of air flow in the air passage.   The heat radiating device according to claim 1, wherein the motor fan has a configuration in which a stator is positioned outside a fan blade attached to a rotor.   In the motor fan, the end of the core iron core of the stator is arranged so as to overlap with the permanent magnet attached to the tip of the fan blade when the fan blade rotates when viewed along the rotation axis of the motor fan. The heat radiating device according to claim 1, wherein the heat radiating device is provided.   The main body is housed in the housing, and the heat dissipation device according to any one of claims 1 to 6 is mounted in the housing through the opening of the housing through one end of the heat dissipation member. A device with a heat dissipation device, characterized in that it is attached.   The main body is a personal computer main body, the heating element is a semiconductor device, the casing is a flat box, and the heat dissipation device is attached to a side portion of the casing. Item 8. A device with a heat dissipation device according to Item 7.

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