JP5616279B2 - Substrate holding device, substrate processing apparatus, substrate processing method, and computer-readable recording medium recording substrate processing program - Google Patents

Description

  The present invention relates to a substrate holding apparatus for holding a substrate, a substrate processing apparatus and a substrate processing method for performing various processes on a substrate while holding the substrate, and a computer-readable recording medium on which a substrate processing program is recorded. Is.

  Conventionally, when manufacturing semiconductor components, flat displays, etc., in each manufacturing process, a substrate such as a semiconductor wafer or a liquid crystal substrate is transported while being held horizontally using a substrate transport device, or a substrate processing device is used. Thus, various processes such as cleaning and etching are performed with the substrate held horizontally.

  In the substrate transfer apparatus and the substrate processing apparatus, a plurality of substrate holders are provided so as to be openable and closable, and the substrate is held by sandwiching the edge of the substrate with the plurality of substrate holders.

  In this substrate transport apparatus and substrate processing apparatus, when the substrate is placed on the upper part of a part of the substrate holders without being placed at the normal positions of all the substrate holders, When sandwiched, the edge of the substrate rides on top of some of the substrate holders, and the substrate is inclined without being held horizontally. Therefore, the holding state of the substrate by the substrate holder is detected by the substrate detection means to confirm that the substrate is held well.

  The substrate detection means irradiates a laser beam from the projector toward the surface of the substrate held by the substrate holder, detects the amount of reflected light on the surface of the substrate by the light receiver, and the substrate is detected based on the detected value. It is determined whether or not it is held horizontally without tilting (see, for example, Patent Document 1).

JP 2003-229403 A

  However, the substrate detection means for detecting the state of the substrate in the conventional substrate transfer apparatus or substrate processing apparatus discriminates the state of the substrate by comparing the amount of light detected by the light receiver with a preset threshold value. Even if the substrate is held well by the substrate holder, if the reflectance of the surface of the substrate is low due to the influence of the material of the substrate and the surface (reflection surface), etc. The detection value is also lowered.

  For this reason, in the conventional substrate transfer device and substrate processing device, the amount of light detected by the light receiver due to the influence of the material of the substrate, the state of the surface, etc., even though the substrate is satisfactorily held by the substrate holder, is a threshold value. If it is lower than that, it may be erroneously determined that the substrate is not held well, and the operation rate of the substrate transfer apparatus or the substrate processing apparatus may be reduced.

Therefore, according to the present invention, in the substrate holding device, the substrate holding means for holding the substrate by holding the edge of the substrate, and the substrate is moved when the substrate holding means holds the substrate satisfactorily. First, the substrate pressing means for pressing the substrate, the substrate detecting means for detecting the state of the substrate, and so on, so that the substrate moves when the substrate is not held well by the substrate holding means, A substrate holding unit, a substrate pressing unit, and a control unit for controlling the substrate detection unit, and the control unit performs the step of holding the substrate with the substrate holding unit, and then performs the process of holding the substrate with the substrate detection unit. A state is detected and set as an initial value, and then the substrate is pressed by the substrate pressing unit and a substrate state is detected by the substrate detection unit as a comparison value, and the initial value and the comparison value are compared to compare the substrate. Base by holding means It was to determine the acceptability of the state of retention.

  Further, the substrate pressing means is configured to press the substrate by blowing gas onto the substrate.

  The substrate holding means has a plurality of substrate holding bodies for holding the edge of the substrate, and the substrate pressing means has a substrate pressing mechanism for pressing the substrate in the vicinity of each substrate holding body. I decided to provide it.

According to the present invention, in the substrate processing apparatus for processing a substrate, the substrate holding means for holding the substrate by holding the edge of the substrate, and the substrate holding means holds the substrate satisfactorily The substrate pressing means for pressing the substrate and the substrate for detecting the state of the substrate so that the substrate moves when the substrate does not move and the substrate is not held well by the substrate holding means A control means for controlling the detection means, the substrate holding means, the substrate pressing means, and the substrate detection means, and the control means performs the step of holding the substrate by the substrate holding means, and then the substrate The state of the substrate is detected by the detection means and set as an initial value. Thereafter, the substrate is pressed by the substrate pressing means and the state of the substrate is detected by the substrate detection means as a comparison value, and the initial value and the comparison value are obtained. Compared to the substrate Determining the quality of the holding state of the substrate by means, the substrate is to apply the process to the substrate if it is retained favorably.

  Further, the substrate pressing means is configured to press the substrate by blowing gas onto the substrate.

  The substrate holding means has a plurality of substrate holding bodies for holding the edge of the substrate, and the substrate pressing means has a substrate pressing mechanism for pressing the substrate in the vicinity of each substrate holding body. I decided to provide it.

Further, in the present invention, in the substrate processing method for processing a substrate while holding the substrate, after performing the step of holding the substrate while sandwiching the edge of the substrate, the state of the substrate is detected and set as an initial value. Then, when the substrate is held well , the substrate does not move, and when the substrate is not held well, the state of the substrate is detected while pressing the substrate so that the substrate moves. As a comparison value, the initial value and the comparison value are compared to judge whether the holding state of the substrate is good. When the substrate is held well, the substrate is processed.

  In addition, the substrate is pressed by blowing gas onto the substrate.

  Further, the edge of the substrate is held by a plurality of substrate holders, and the substrate is pressed in the vicinity of the substrate holder.

Further, the substrate holding means for sandwiching the edge of the substrate to hold the substrate, the substrate is not moved when the substrate is satisfactorily held by the substrate holding means, good substrate by the substrate holding means When the substrate processing apparatus is not held in the substrate processing apparatus, the substrate processing apparatus including the substrate pressing unit for pressing the substrate and the substrate detecting unit for detecting the state of the substrate is operated so that the substrate moves. In a computer-readable recording medium that records a substrate processing program for performing processing on a held substrate, after performing the step of holding the substrate, the state of the substrate is detected and set to an initial value, and then the substrate is improved. When held, the substrate does not move, and when the substrate is not held well, the substrate state is detected while pressing the substrate so that the substrate moves, and the comparison value is obtained as the initial value. When Determining the quality of the holding state of the substrate by comparing the 較値, the substrate was to processes the substrate if it is retained favorably.

  In the present invention, it is not erroneously determined that the substrate is not held well due to the influence of the material of the substrate and the surface state, and the holding state of the substrate can be accurately determined, and the substrate is conveyed. The operating rate of the apparatus and the substrate processing apparatus can be improved.

The top view which shows a substrate processing apparatus. Front sectional drawing which shows a substrate processing chamber. FIG. The front expanded sectional view which shows a board | substrate holding means and a board | substrate press means. FIG. Process drawing which shows a substrate processing method. The schematic diagram which shows the change of light quantity.

  Hereinafter, specific configurations of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the substrate processing apparatus 1 includes a substrate loading / unloading base for loading and unloading a plurality of substrates 2 (here, 25, for example, semiconductor substrates) at the front end portion together with a carrier 3. 4, a substrate transport unit 5 for transporting the substrate 2 accommodated in the carrier 3 is formed at the rear part of the substrate loading / unloading table 4, and a cleaning process or an etching process of the substrate 2 is performed at the rear part of the substrate transport unit 5 A substrate processing unit 6 for performing the above is formed.

  The substrate carry-in / out table 4 is configured so that the four carriers 3 can be placed with a space left and right with the four carriers 3 in close contact with the front wall 7 of the substrate transport unit 5.

  The substrate transfer unit 5 forms a transfer chamber 9 that accommodates the substrate transfer device 8 on the front side, and forms a substrate transfer chamber 11 that accommodates the substrate transfer table 10 on the rear side.

  The substrate transport unit 5 transports the substrate 2 between any one of the carriers 3 placed on the substrate carry-in / out table 4 and the substrate delivery table 10 using the substrate transport device 8.

  The substrate processing unit 6 forms a substrate transfer chamber 12 extending in the front-rear direction at the center, and accommodates a substrate transfer device 13 inside the substrate transfer chamber 12.

  Further, the substrate processing unit 6 forms the first to fourth substrate processing chambers 14 to 17 side by side on the left side of the substrate transfer chamber 12 and the fifth to eighth substrate processing on the right side of the substrate transfer chamber 12. The chambers 18 to 21 are formed side by side.

  Then, the substrate processing unit 6 uses the substrate transfer device 13 to transfer the substrate 2 between the substrate delivery chamber 11 of the substrate transfer unit 5 and each of the substrate processing chambers 14 to 21 while holding the substrates 2 horizontally one by one. At the same time, the substrates 2 are processed one by one in each substrate processing chamber 14-21.

  Each of the substrate processing chambers 14 to 21 has the same configuration, and here, the configuration of the first substrate processing chamber 14 will be described as a representative.

  As shown in FIGS. 2 to 5, the substrate processing chamber 14 includes a substrate rotating means 22 for holding and rotating the substrate 2 horizontally, and a processing liquid supply means for supplying a processing liquid to the surface of the substrate 2. 23, processing liquid recovery means 24 for recovering the processing liquid supplied to the surface of the substrate 2, substrate detection means 25 for detecting the state of the substrate 2, and substrate pressing for pressing the substrate 2 upward Means 26, and the substrate rotating means 22, the processing liquid supply means 23, the substrate detecting means 25, and the substrate pressing means 26 are controlled by the control means 27. The control means 27 controls the entire substrate processing apparatus 1 such as the substrate transfer apparatuses 8 and 13.

  The substrate rotating means 22 has a disk-like table 29 mounted horizontally on the upper end of a hollow cylindrical rotating shaft 28 and a substrate holding means 30 for holding the substrate 2 horizontally on the table 29. A rotary drive mechanism 31 is connected to the rotary shaft 28, and the rotary shaft 28 and the table 29 are rotated by the rotary drive mechanism 31 so that the substrate 2 held by the substrate holding means 30 is rotated on the table 29. . The rotation drive mechanism 31 is connected to the control means 27, and the rotation is controlled by the control means 27.

  The substrate holding means 30 holds a plurality of (in this case, three) substrate holders 32 that hold the substrate 2 horizontally by holding the outer peripheral edge of the substrate 2 around the peripheral edge of the table 29 in the circumferential direction. Open and install. The substrate holder 32 is attached to a bracket 33 formed on the lower surface of the table 29 so that the base end portion of the arm portion 34 can be pivoted up and down via a pivot 35, and between the lower surface of the table 29 and the upper surface of the arm portion 34. A spring 36 that biases the arm portion 34 downward is provided, a holding portion 37 that penetrates the table 29 is attached to the upper portion on the proximal end side of the arm portion 34, and a drive rod 38 is attached to the lower end portion on the distal end side of the arm portion 34. Are arranged at intervals. A lift mechanism 39 is connected to the drive rod 38, and the drive rod 38 is lifted and lowered by the lift mechanism 39, and the substrate holder 32 is opened and closed in conjunction therewith, so that the holding portion 37 is closed when the substrate holder 32 is closed. The substrate 2 is held by sandwiching the outer peripheral edge of the substrate 2. The elevating mechanism 39 is connected to the control means 27, and the control means 27 performs elevating control (opening / closing control of the substrate holder 32).

  The substrate rotating means 22 is provided with a lifting rod 40 for raising and lowering the substrate 2 in a hollow portion of the rotating shaft 28 so as to be movable up and down, and a disk-like lifting platform 41 is attached to the upper end portion of the lifting rod 40 to move up and down. A locking pin 42 is attached to the upper surface of the base 41. A lift mechanism 43 is connected to the lift rod 40, and the lift rod 40 and the lift base 41 are moved up and down by the lift mechanism 43 so that the substrate 2 locked by the locking pins 42 is moved up and down. The elevating mechanism 43 is connected to the control means 27, and the elevating control is performed by the control means 27.

  In the processing liquid supply means 23, the arm 44 is disposed above the table 29 so as to be horizontally movable, and a nozzle 45 is attached to the tip of the arm 44. A moving mechanism 46 is connected to the arm 44, and the nozzle 45 is moved by the moving mechanism 46 between a retracted position outside the substrate 2 and a starting position above the center of the substrate 2. The moving mechanism 46 is connected to the control means 27 so that the movement is controlled by the control means 27.

  Further, the processing liquid supply means 23 connects a nozzle 45 to a processing liquid supply source 47 for supplying a processing liquid (cleaning liquid, rinsing liquid, etching liquid, etc.) via a flow rate regulator 48 and a supply flow path 49. The flow rate adjuster 48 adjusts the flow rate of the processing liquid supplied to the nozzle 45. The flow rate regulator 48 is connected to the control means 27 so that the control means 27 performs open / close control and flow rate control.

  The treatment liquid recovery means 24 has an annular cover 50 attached to the upper part of the table 29 via a support column 51, and a cup 52 that is open to the periphery of the table 29 and connected to a drain pipe (not shown). The substrate 2 placed on the table 29 is surrounded by a cover 50 and a cup 52 to prevent the processing liquid from scattering and to collect the processing liquid.

  The substrate detection means 25 attaches a projector 54 to one side of the table 29 via a support column 53 toward the center of the upper surface of the substrate 2, and places a light receiver 56 on the other side of the table 29 via a support column 55. 2 is attached toward the center of the upper surface. The light projector 54 irradiates the upper surface of the substrate 2 with laser light, and is connected to the control means 27 via the drive mechanism 57. The light receiver 56 reflects the laser light (reflected on the upper surface of the substrate 2). The amount of reflected light is detected, and is connected to the control means 27 via the drive mechanism 58.

  The light projector 54 and the light receiver 56 irradiate laser light from the light projector 54 toward the substrate 2 by controlling the drive mechanisms 57 and 58 with the control means 27, and the light receiver 56 determines the amount of reflected light. The state of the substrate 2 held by the substrate holding means 30 is detected from the detected value.

  The substrate detection means 25 only needs to be able to detect the state of the substrate 2 held by the substrate holding means 30, and is not limited to the case where laser light is used, and detects the state of the substrate 2 by taking an image of the substrate 2. It is also possible to use an image recognition device or the like.

  There are a plurality of substrate pressing means 26 below the table 29 and in the vicinity of the position where each substrate holding body 32 of the substrate holding means 30 stops when the substrate 2 is stopped by the substrate rotating means 22 (here, Then, three nozzles 59 serving as substrate pressing mechanisms are arranged facing the lower surface of the upper substrate 2, and a pressure gas supply source for supplying a pressure gas (inert gas such as air or nitrogen) to the nozzle 59. 60 is connected to the opening / closing valve 61 via the supply flow path 62. The on-off valve 61 is connected to the control means 27 and is controlled to be opened and closed by the control means 27.

  Then, the substrate pressing means 26 injects the pressing gas from the nozzle 59 to the lower surface of the substrate 2 through the through hole 63 formed in the table 29 by opening the on-off valve 61 by the control means 27, The substrate 2 is pressed upward by the injection pressure. The control means 27 controls the substrate rotating means 22 so that the through hole 63 of the table 29 is positioned immediately above the nozzle 59 when the table 29 is stopped.

  The substrate pressing means 26 only needs to be able to press the substrate 2 held by the substrate holding means 30, and is not limited to the case where gas is used, and mechanically contacts the substrate 2 directly to press the substrate 2. Also good. When the substrate 2 is pressed in a non-contact manner using gas, the substrate 2 can be pressed without damaging the substrate 2. The substrate pressing means 26 is arranged such that nozzles 59 are arranged in the vicinity of each substrate holding body 32 of the substrate holding means 30 and dispersed at a plurality of locations to press the substrate 2, thereby ejecting from the nozzles 59 toward the substrate 2. The pressure of the pressure gas to be injected can be lowered, the external force exerted on the substrate 2 can be reduced, and the occurrence of warpage of the substrate 2 can be prevented. Further, the substrate pressing means 26 may be configured to concentrate and press the substrate 2 at one place. For example, a pressure gas is injected from the center of the lift 41 of the substrate rotating means 22 toward the center of the lower surface of the substrate 2. Then, the substrate 2 may be pressed. In this case, a discharge port for gas or the like for drying the substrate 2 can be formed in the lifting platform 41, and the drying gas can also be used as the pressing gas.

  The substrate processing apparatus 1 is configured as described above, and processes the substrate 2 in each of the substrate processing chambers 14 to 21 according to the substrate processing program recorded on the recording medium 64 readable by the control means 27 (computer). Like to do. The recording medium 64 may be any medium that can record various programs such as a substrate processing program. Even if it is a semiconductor memory type recording medium such as a ROM or RAM, a disk type recording medium such as a hard disk or CD-ROM. It may be.

  In the substrate processing apparatus 1, the substrate 2 is processed as described below according to the process shown in FIG. 6 by the substrate processing program. In the following description, the processing of the substrate 2 in the substrate processing chamber 14 will be described as a representative, but the same processing is performed in the other substrate processing chambers 15 to 21.

  First, the substrate processing program executes a substrate receiving process in which the substrate 2 is received from the substrate transfer device 13 by the substrate rotating means 22 in the substrate processing chamber 14.

  In this substrate receiving process, the substrate processing program controls the elevating mechanism 43 of the substrate rotating unit 22 by the control unit 27 to raise the elevating rod 40 and the elevating table 41 above the table 29, and from the substrate transfer device 13 to the substrate 2 is received.

  At that time, as shown in FIG. 5A, the substrate processing program controls the lifting mechanism 39 of the substrate holding means 30 by the control means 27 to lower the drive rod 38, and the substrate holding body 32 is moved to the spring 36. It is in the closed state with the urging force of.

  Next, the substrate processing program executes a substrate placing process for placing the substrate 2 on the substrate holding means 30.

  In this substrate placing process, the substrate processing program controls the lifting mechanism 43 of the substrate rotating means 22 by the control means 27 to lower the lifting rod 40 and the lifting base 41 and mount the substrate 2 on the upper part of the substrate holding means 30. Put.

  At that time, as shown in FIG. 5 (b), the substrate processing program controls the lifting mechanism 39 of the substrate holding means 30 by the control means 27 to raise the drive rod 38 to a predetermined position, and the substrate holding body 32. Is opened against the urging force of the spring 36.

  Here, when the position of the substrate 2 is within a predetermined range, the substrate 2 is placed at a predetermined position of the holding portion 37 of the substrate holder 32 as shown by a solid line in FIG. When the position of the substrate 2 is deviated from the predetermined range, the substrate 2 is placed on the upper portion of the holding portion 37 of the substrate holding body 32 as shown by a one-dot chain line in FIG. .

  Next, the substrate processing program executes a substrate holding process for holding the substrate 2 by the substrate holding means 30.

  In this substrate holding process, as shown in FIG. 5C, the substrate processing program controls the lifting mechanism 39 of the substrate holding means 30 by the control means 27 to lower the drive rod 38, and the substrate holding body 32 is spring-loaded. Closed with 36 biasing force.

  At that time, when the substrate 2 is placed at a predetermined position of the holding portion 37 of the substrate holder 32 in the previous substrate placement step, the substrate 2 is shown by a solid line in FIG. When the substrate 2 is placed on the upper portion of the holding portion 37 of the substrate holder 32 in the substrate placing step, the edge of the substrate 2 is satisfactorily held and held by the holding portion 37 of the substrate holder 32. The substrate 2 is not held well because the edge of the substrate 2 rides on the upper portion of the holding portion 37 of the substrate holding body 32 as shown by a one-dot chain line in FIG.

  Subsequent to this substrate holding step (while holding the substrate 2 in the substrate holding step), the substrate processing program detects the state of the substrate 2 with the substrate detecting means 25 and detects the initial value using the detected value as the initial value. Execute the process.

  In this initial value detection step, the substrate processing program controls the drive mechanisms 57 and 58 of the substrate detection means 25 by the control means 27 to irradiate laser light from the projector 54 toward the substrate 2, and The amount of reflected light is measured (see FIG. 7), and the measured value is stored as an initial value.

  Next, the substrate processing program executes a substrate pressing process in which the substrate 2 is pressed by the substrate pressing means 26.

  In this substrate pressing step, as shown in FIG. 5D, the substrate processing program controls the opening / closing valve 61 of the substrate pressing means 26 by the control means 27 so as to open the pressure gas from the nozzle 59 to the lower surface of the substrate 2. And the substrate 2 is pressed upward by the pressure of the pressure gas.

  At that time, if the substrate 2 is satisfactorily held by the substrate holding means 30 in the previous substrate holding step, the substrate 2 is moved upward by the substrate pressing means 26 as shown by a solid line in FIG. Even if the substrate 2 is pressed, the substrate 2 does not move upward. However, if the substrate 2 is not favorably held by the substrate holding means 30 in the substrate holding step, a dashed line in FIG. As indicated by the two-dot chain line, when the substrate 2 is pressed upward by the substrate pressing means 26, the substrate 2 moves upward.

  Subsequent to this substrate pressing step (while the substrate 2 is pressed in the substrate pressing step), the substrate processing program again detects the state of the substrate 2 by the substrate detecting means 25 and uses the detected value as a comparison value. The detection process is executed.

  In this comparison value detection step, the substrate processing program controls the drive mechanisms 57 and 58 of the substrate detection means 25 by the control means 27 to irradiate the laser beam from the projector 54 toward the substrate 2 and The amount of reflected light is measured (see FIG. 7), and the measured value is stored as a comparison value.

  Next, the substrate processing program executes a pass / fail judgment step for judging pass / fail of the holding state of the substrate 2.

  In this pass / fail judgment step, the substrate processing program compares the initial value detected in the initial value detection step by the control means 27 with the comparison value detected in the comparison value detection step. If the difference between the initial value and the comparison value is smaller than a preset value, it is determined that the substrate 2 is well held by the substrate holding means 30, and the subsequent processing of the substrate 2 is continued. . Since the amount of reflected light received by the light receiver 56 is constantly fluctuating, it is determined that the substrate 2 is well held even if it fluctuates within a preset range. On the other hand, if the difference between the initial value and the comparison value is larger than a preset value, it is determined that the substrate 2 is not well held by the substrate holding means 30, and the subsequent processing of the substrate 2 is interrupted. In addition, the operator is notified of the occurrence of an abnormality.

  As schematically shown in FIG. 7, when the substrate 2 is held well by the substrate holding means 30, the substrate 2 moves upward even if the substrate 2 is pressed upward in the substrate pressing step. Although there is almost no difference between the initial value and the comparison value, if the substrate 2 is not well held by the substrate holding means 30, the substrate 2 is moved upward in the substrate pressing step. When pressed, the substrate 2 moves upward and the amount of reflected light received by the light receiver 56 decreases, so that the comparison value becomes smaller than the initial value, and a difference occurs between the initial value and the comparison value. Therefore, it can be determined whether or not the substrate 2 is well held from the difference between the initial value and the comparison value.

  As described above, the substrate processing apparatus 1 detects the state of the substrate 2 while holding the substrate 2 to obtain an initial value, and then detects the state of the substrate 2 while pressing the substrate 2 to make a comparison value. The initial value and the comparison value are compared to determine whether the holding state of the substrate 2 is good or bad.

  Therefore, the substrate processing apparatus 1 can determine whether the holding state of the substrate 2 is good or not without being affected by the material or surface state of the substrate 2, and can accurately determine the holding state of the substrate 2. The throughput in the substrate processing apparatus 1 can be improved.

  In the above description, the case where the present invention is applied to the substrate holding device used for holding the substrate 2 in the substrate processing chambers 14 to 21 of the substrate processing apparatus 1 has been described. The present invention can also be applied to a substrate holding device used for holding the substrate 2 in the substrate transfer device 8 in one transfer chamber 9 and the substrate transfer device 13 in the substrate transfer chamber 12, and also transfers the substrate 2 alone. The present invention can also be applied to a substrate transfer device.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Substrate 3 Carrier 4 Substrate loading / unloading stand 5 Substrate transfer unit 6 Substrate processing unit 7 Front wall 8 Substrate transfer apparatus 9 Transfer chamber 10 Substrate delivery table
11 Substrate delivery chamber 12 Substrate transfer chamber
13 Substrate transfer device 14-21 Substrate processing chamber
22 Substrate rotating means 23 Treatment liquid supply means
24 Treatment liquid recovery means 25 Substrate detection means
26 Substrate pressing means 27 Control means
28 Rotating shaft 29 Table
30 Substrate holding means 31 Rotation drive mechanism
32 Board holder 33 Bracket
34 Arm 35 Axis
36 Spring 37 Holding part
38 Drive rod 39 Lifting mechanism
40 Lifting rod 41 Lifting platform
42 Locking pin 43 Lifting mechanism
44 arm 45 nozzle
46 Moving mechanism 47 Treatment liquid supply source
48 Flow controller 49 Supply flow path
50 Cover 51 Prop
52 Cup 53 Prop
54 Floodlight 55 Post
56 Receiver 57 Drive mechanism
58 Drive mechanism 59 Nozzle
60 Pressed gas supply source 61 Open / close valve
62 Supply flow path 63 Through hole
64 Recording media

Claims (10)

A substrate holding means for holding the substrate by sandwiching the edge of the substrate;
The not moving substrate when the substrate by the substrate holding means are well retained, the so moves the substrate when the substrate by the substrate holding means not well retained, for pressing the substrate Substrate pressing means,
Substrate detection means for detecting the state of the substrate;
Control means for controlling the substrate holding means, the substrate pressing means, and the substrate detecting means;
Have
The control means, after performing the step of holding the substrate by the substrate holding means, detects the state of the substrate by the substrate detection means to be an initial value, and then presses the substrate by the substrate pressing means and detects the substrate A substrate holding apparatus characterized in that the state of the substrate is detected by means and used as a comparison value, and the initial value and the comparison value are compared to determine whether the substrate holding state by the substrate holding means is good or bad.   The substrate holding apparatus according to claim 1, wherein the substrate pressing unit is configured to press the substrate by blowing a gas onto the substrate.   The substrate holding means has a plurality of substrate holding bodies for holding the edge of the substrate, and the substrate pressing means is provided with a substrate pressing mechanism for pressing the substrate in the vicinity of each substrate holding body. The substrate holding apparatus according to claim 1 or 2, wherein In a substrate processing apparatus for processing a substrate,
A substrate holding means for holding the substrate by sandwiching the edge of the substrate;
The not moving substrate when the substrate by the substrate holding means are well retained, the so moves the substrate when the substrate by the substrate holding means not well retained, for pressing the substrate Substrate pressing means,
Substrate detection means for detecting the state of the substrate;
Control means for controlling the substrate holding means, the substrate pressing means, and the substrate detecting means;
Have
The control means, after performing the step of holding the substrate by the substrate holding means, detects the state of the substrate by the substrate detection means to be an initial value, and then presses the substrate by the substrate pressing means and detects the substrate The state of the substrate is detected by means as a comparison value, the initial value is compared with the comparison value to determine whether the substrate holding state by the substrate holding means is good, and the substrate is held well. A substrate processing apparatus characterized in that the substrate is processed.   The substrate processing apparatus according to claim 4, wherein the substrate pressing unit is configured to press the substrate by blowing a gas onto the substrate.   The substrate holding means has a plurality of substrate holding bodies for holding the edge of the substrate, and the substrate pressing means is provided with a substrate pressing mechanism for pressing the substrate in the vicinity of each substrate holding body. The substrate processing apparatus according to claim 4 or 5, wherein In a substrate processing method for processing a substrate while holding the substrate,
After performing the process of holding the substrate by sandwiching the edge of the substrate, the state of the substrate is detected and set as an initial value, and then the substrate does not move when the substrate is held well, If the substrate is not held well, the substrate state is detected while pressing the substrate so that the substrate moves, and a comparison value is detected. The initial value and the comparison value are compared to determine whether the substrate holding state is good. A substrate processing method comprising: determining and processing a substrate when the substrate is held well.   The substrate processing method according to claim 7, wherein the substrate is pressed by blowing a gas onto the substrate.   The substrate processing method according to claim 7 or 8, wherein the edge of the substrate is held by a plurality of substrate holders and the substrate is pressed in the vicinity of the substrate holder. A substrate holding means for holding the substrate by sandwiching the edge of the substrate;
The not moving substrate when the substrate by the substrate holding means are well retained, the so moves the substrate when the substrate by the substrate holding means not well retained, for pressing the substrate Substrate pressing means, and
A substrate detection means for detecting the state of the substrate;
In a computer-readable recording medium that records a substrate processing program for operating a substrate processing apparatus including
After the step of holding the substrate, an initial value to detect the condition of the substrate, then, without moving the substrate when the substrate is retained favorably, when the substrate is not well retained Detects the state of the substrate while pressing the substrate so that the substrate moves, and uses it as a comparison value, compares the initial value with the comparison value to determine whether the substrate is held properly, and holds the substrate well. A computer-readable recording medium having a substrate processing program recorded thereon, wherein the substrate processing program is processed when the substrate is processed.

Images