JP5610000B2 - Heating element storage device - Google Patents

Heating element storage device Download PDF

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JP5610000B2
JP5610000B2 JP2013006904A JP2013006904A JP5610000B2 JP 5610000 B2 JP5610000 B2 JP 5610000B2 JP 2013006904 A JP2013006904 A JP 2013006904A JP 2013006904 A JP2013006904 A JP 2013006904A JP 5610000 B2 JP5610000 B2 JP 5610000B2
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heat
heating element
storage device
air
plate
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JP2013065913A (en
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杉山 誠
誠 杉山
村山 拓也
拓也 村山
若菜 野上
若菜 野上
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Description

本発明は、熱交換装置を用いた発熱体収納装置に関するものである。   The present invention relates to a heating element storage device using a heat exchange device.

例えば、携帯電話の基地局は、数十アンペア以上の電流が流れることから、ある点では発熱体とも表現される。つまり、冷却をすることがその動作を安定化させるためには極めて重要なものとなる。このような携帯電話の基地局はその冷却を行う為に次のような構成をとっている。(図13参照)。   For example, since a current of several tens of amperes or more flows in a mobile phone base station, it is also expressed as a heating element in a certain point. In other words, cooling is extremely important in order to stabilize the operation. Such a mobile phone base station has the following configuration in order to cool the base station. (See FIG. 13).

すなわち、図示しないが、発熱体となる送・受信機を収納したキャビネットと、キャビネットの開口部に装着された冷却装置である熱交換装置(101)とを備えた構成となっていた。そして、図9に示すように、熱交換装置101の構造としては、外気用の第1吸込口107と第1吐出口108およびキャビネット内用の第2吸込口109および第2吐出口110を有する本体ケース111と、この本体ケース111内に設けられた外気用の第1送風機112およびキャビネット内用の第2送風機113と、前記本体ケース111内において室外空気とキャビネット内空気との熱交換を行う熱交換器114とを備えた構成となっていた。(なお、これに類似する先行文献としては特開2000−161875号公報)。   That is, although not shown in the figure, it has a configuration including a cabinet that houses a transmitter / receiver serving as a heating element, and a heat exchange device (101) that is a cooling device attached to an opening of the cabinet. As shown in FIG. 9, the structure of the heat exchange device 101 includes a first suction port 107 and a first discharge port 108 for outside air, and a second suction port 109 and a second discharge port 110 for use in the cabinet. The main body case 111, the first blower 112 for outside air and the second blower 113 for inside the cabinet provided in the main body case 111, and heat exchange between outdoor air and cabinet air are performed in the main body case 111. The heat exchanger 114 is included. (Note that Japanese Laid-Open Patent Publication No. 2000-161875 is a prior art similar to this).

特開2000−161875号公報JP 2000-161875 A

上記従来の冷却装置においては、キャビネット内に配置された発熱体素子(例えば、半導体)自体の周囲温度を所定の温度以下に保つために、大きな風量の冷却空気を流さなくてはならなかった。すなわち、高温環境を嫌う発熱体素子がキャビネット内で分散して配置されているので、小さな風量では、配置された場所によっては冷却空気が発熱体の発熱によって高温になってしまい、冷却できない発熱体素子ができてしまうことになる。従って、キャビネット内のどの場所でも所定の温度以下に保つために、従来は冷却装置の風量を大きくすることで冷却を行っていた。そのため、外気用の第1送風機112およびキャビネット内用の第2送風機113は大きな能力を有する送風機を用いることとなり、結果として冷却装置の大型化をまねいていた。   In the above-described conventional cooling device, in order to keep the ambient temperature of the heating element (for example, a semiconductor) arranged in the cabinet below a predetermined temperature, a large amount of cooling air has to flow. In other words, since the heating element that dislikes the high temperature environment is distributed and arranged in the cabinet, the cooling air becomes a high temperature due to the heat generated by the heating element depending on where it is arranged, and the heating element cannot be cooled. An element will be created. Therefore, in order to keep the temperature below a predetermined temperature everywhere in the cabinet, cooling is conventionally performed by increasing the air volume of the cooling device. For this reason, the first blower 112 for the outside air and the second blower 113 for the inside of the cabinet use a blower having a large capacity, resulting in an increase in the size of the cooling device.

そこで、本発明は、キャビネット内で熱移動をさせて冷却すべき場所を集中させることで、発熱体素子が他の発熱体に及ぼす影響を小さくし、キャビネットの排出空気を従来に比べ高温とし、冷却装置の冷却能力を向上することで、冷却装置を小型化し、結果とし て、発熱体収納装置を小型化することを目的とするものである。   Therefore, the present invention reduces the influence of the heat generating element on other heat generating elements by concentrating the places to be cooled by moving the heat in the cabinet, and makes the exhaust air of the cabinet higher temperature than before, The purpose is to downsize the cooling device by improving the cooling capacity of the cooling device, and consequently downsize the heating element storage device.

そして、この目的を達成する為に本発明は、空気取入口と空気排出口とこの空気排出口の近傍に設けた送風ファンを有し、内部を仕切板によって2つの区画に区分したキャビネットと、この2つの区画の一方の区画は、電子回路を搭載した発熱体を設けた発熱部とし、他方の区画には、放熱板を設け、前記発熱体から発生した熱を集めて放出する放熱部とし、前記空気取入口は、前記発熱部の外壁に設け、前記仕切板の下部のみに、前記発熱部と前記放熱部とを連通する開口を設け、前記発熱体には、発生する熱を吸収して移動させる熱移動手段を設け、この熱移動手段は、前記仕切板を貫通して前記発熱体と前記放熱板を連絡した構成の発熱体収納装置であって、前記空気取入口から取入れた空気が、前記発熱部、前記開口の順で通過し、前記放熱部で吸熱した後に前記空気排出口から外部に送出されるものであり、これにより、所期の目的を達成するものである。 And in order to achieve this object, the present invention has an air intake port, an air discharge port, a blower fan provided in the vicinity of the air discharge port, and a cabinet whose interior is divided into two sections by a partition plate, One of the two compartments is a heat generating portion provided with a heat generating body on which an electronic circuit is mounted, and the other compartment is provided with a heat radiating plate to collect and release heat generated from the heat generating body. The air intake is provided on an outer wall of the heat generating portion, and an opening for communicating the heat generating portion and the heat radiating portion is provided only at a lower portion of the partition plate, so that the heat generating body absorbs generated heat. The heat transfer means is a heating element storage device having a configuration in which the heating element and the heat dissipation plate are connected to each other through the partition plate, and the air taken in from the air intake port. Passes in the order of the heating part and the opening, Wherein after heat absorption by the serial radiator unit is intended to be delivered from the air outlet to the outside, thereby, it is to achieve the intended purpose.

以上のように本発明は、空気取入口と空気排出口とこの空気排出口の近傍に設けた送風ファンを有し、内部を仕切板によって2つの区画に区分したキャビネットと、この2つの区画の一方の区画は、電子回路を搭載した発熱体を設けた発熱部とし、他方の区画には、放熱板を設け、前記発熱体から発生した熱を集めて放出する放熱部とし、前記空気取入口は、前記発熱部の外壁に設け、前記仕切板の下部のみに、前記発熱部と前記放熱部とを連通する開口を設け、前記発熱体には、発生する熱を吸収して移動させる熱移動手段を設け、この熱移動手段は、前記仕切板を貫通して前記発熱体と前記放熱板を連絡した構成の発熱体収納装置であって、前記空気取入口から取入れた空気が、前記発熱部、前記開口の順で通過し、前記放熱部で吸熱した後に前記空気排出口から外部に送出されるものであるので、前記排出口からの吹出し空気温度を従来に比べ高くするこができ、冷却能力を向上させることができる。すなわち、本発明においては、熱移動手段によって、上流に位置する発熱体素子の影響で下流に位置する発熱体素子の周囲温度が上がることを抑制することができるため、キャビネットの排出空気を従来に比べ高温とすることができ、冷却装置の冷却能力を向上することができるため、冷却装置を小型化することができ、結果として、発熱体収納装置を小型化することを目的とするものである。 As described above, the present invention has an air intake port, an air discharge port, a blower fan provided in the vicinity of the air discharge port, and a cabinet whose interior is divided into two sections by a partition plate, and the two sections. One section is a heat generating portion provided with a heat generating body on which an electronic circuit is mounted, and the other section is provided with a heat radiating plate, a heat radiating portion that collects and discharges heat generated from the heat generating body, and the air intake port. Is provided on the outer wall of the heat generating part, and an opening for communicating the heat generating part and the heat radiating part is provided only at the lower part of the partition plate, and the heat generating element absorbs and moves the generated heat. The heat transfer means is a heating element storage device having a configuration in which the heating element and the heat dissipation plate are communicated with each other through the partition plate, and the air taken in from the air inlet is the heating part. , Pass in the order of the opening, and absorb heat at the heat dissipation part The so from the air discharge port is intended to be delivered to the outside after the blowing air temperature from the discharge port can this be higher than the conventional, it is possible to improve the cooling capacity. That is, in the present invention, the heat transfer means can suppress an increase in the ambient temperature of the heating element located downstream due to the influence of the heating element located upstream. Compared to a higher temperature, the cooling capacity of the cooling device can be improved, so that the cooling device can be reduced in size, and as a result, the heating element storage device is reduced in size. .

本発明の一実施形態の設置例を示す斜視図The perspective view which shows the example of installation of one Embodiment of this invention 本発明の一実施形態の発熱体収納装置の分解斜視図1 is an exploded perspective view of a heating element storage device according to an embodiment of the present invention. 本発明の一実施形態の発熱体収納装置(キャビネット側)の断面図Sectional drawing of the heat generating body storage apparatus (cabinet side) of one Embodiment of this invention 本発明の一実施形態の発熱体収納装置に用いる基板の斜視図The perspective view of the board | substrate used for the heat generating body accommodating apparatus of one Embodiment of this invention. 本発明の一実施形態の発熱体収納装置に用いる基板の取付図The attachment figure of the board | substrate used for the heat generating body storage apparatus of one Embodiment of this invention 本発明の一実施形態の発熱体収納装置の放熱部の斜視図The perspective view of the thermal radiation part of the heat generating body accommodating apparatus of one Embodiment of this invention. 本発明の一実施形態の発熱体収納装置に用いる基板の斜視図The perspective view of the board | substrate used for the heat generating body accommodating apparatus of one Embodiment of this invention. 本発明の一実施形態の発熱体収納装置に用いる基板のフランジ部の斜視図The perspective view of the flange part of the board | substrate used for the heat generating body accommodating apparatus of one Embodiment of this invention. 本発明の一実施形態の発熱体収納装置に用いる基板のフランジ部の斜視図The perspective view of the flange part of the board | substrate used for the heat generating body accommodating apparatus of one Embodiment of this invention. 本発明の第2の実施形態の発熱体収納装置の分解斜視図The disassembled perspective view of the heat generating body accommodating apparatus of the 2nd Embodiment of this invention. 本発明の第2の実施形態の発熱体収納装置(キャビネット側)の断面図Sectional drawing of the heat generating body accommodating apparatus (cabinet side) of the 2nd Embodiment of this invention. 本発明の第2の実施形態の発熱体収納装置の放熱部の斜視図The perspective view of the thermal radiation part of the heat generating body accommodating apparatus of the 2nd Embodiment of this invention. 従来の熱交換装置の構成図Configuration diagram of conventional heat exchanger

以下、本発明の実施の形態について図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(実施の形態1)
図1において、1はビルディングを示し、その屋上2には、携帯電話の基地局となる発熱体収納装置3が設けられている。発熱体収納装置3は箱状のキャビネット4とこのキャビネット4内に設けた送・受信機5と前記キャビネット4の前面開口部にドアのごとく開閉自在に設けた冷却装置6とにより構成されている。
(Embodiment 1)
In FIG. 1, reference numeral 1 denotes a building, and a rooftop 2 is provided with a heating element storage device 3 serving as a mobile phone base station. The heating element storage device 3 includes a box-shaped cabinet 4, a transmitter / receiver 5 provided in the cabinet 4, and a cooling device 6 provided at the front opening of the cabinet 4 so as to be opened and closed like a door. .

図2は、発熱体収納装置3の内部構成を説明するための分解図である。冷却装置6は、図2に示すように、外気(第1環境)用の第1吸気口7と第1吐出口8およびキャビネット4内(第2環境、以降、内気と呼ぶ)用の第2吸気口9および第2吐出口10を有する本体ケース11と、この本体ケース11内に設けられた外気用の第1送風ファン12、およびキャビネット4内、すなわち内気用の第2送風ファン13と、前記本体ケース11内において外気と内気との熱交換を行う熱交換器14とを備えている。第1送風ファン12、熱交換器14、第2送風ファン13は、この順で下からほぼ一列に並んで配置されている。   FIG. 2 is an exploded view for explaining the internal configuration of the heating element storage device 3. As shown in FIG. 2, the cooling device 6 includes a first air inlet 7 for the outside air (first environment), a first outlet 8, and a second inside the cabinet 4 (second environment, hereinafter referred to as inside air). A main body case 11 having an intake port 9 and a second discharge port 10, a first blower fan 12 for the outside air provided in the main body case 11, and a second blower fan 13 for the inside of the cabinet 4, that is, the inside air, The main body case 11 includes a heat exchanger 14 that performs heat exchange between outside air and inside air. The 1st ventilation fan 12, the heat exchanger 14, and the 2nd ventilation fan 13 are arranged in a line from the bottom in this order.

詳細には図示しないが、熱交換器14は、長方形状で合成樹脂製の複数の板体をそれぞれ所定間隔を離した状態で重合させた構成としている。この板体の表面には、その表面をレーン状に仕切る複数の整流壁をそれぞれ設けている。この重合された板体の間に、第1環境の空気(外気)、第2環境の空気(内気)とを交互に流し、冷たい外気と温かい内気の間で熱交換を行うものである。   Although not shown in detail, the heat exchanger 14 has a rectangular configuration in which a plurality of synthetic resin plates are polymerized in a state of being spaced apart from each other by a predetermined distance. A plurality of rectifying walls are provided on the surface of the plate body to partition the surface into lanes. Between the superposed plates, air in the first environment (outside air) and air in the second environment (inside air) are alternately flowed to perform heat exchange between the cold outside air and the warm inside air.

さて、以上のような冷却装置6によれば、キャビネット4内で送・受信機5によって高温となった空気(内気)は、冷却装置6の第2吸気口9から第2送風ファン13に吸引される。第2送風ファン13から吹き出された空気は、熱交換器14へと送られる。一方、冷たい外気は,第1送風ファン12の運転によって第1吸気口7から吸い込まれ、さらに、熱交換器14へと送られる。熱交換器14では、冷たい外気と高温の内気との間で熱交換が行われ、冷やされた内気は、第2吐出口10からキャビネット4内に吹き出され、外気は、第1吐出口8より再び外気へと放出されることになる。   Now, according to the cooling device 6 as described above, the air (inside air) that has been heated by the transmitter / receiver 5 in the cabinet 4 is sucked into the second blower fan 13 from the second air inlet 9 of the cooling device 6. Is done. The air blown out from the second blower fan 13 is sent to the heat exchanger 14. On the other hand, the cold outside air is sucked from the first air inlet 7 by the operation of the first blower fan 12 and further sent to the heat exchanger 14. In the heat exchanger 14, heat exchange is performed between cold outside air and high temperature inside air, and the cooled inside air is blown into the cabinet 4 from the second discharge port 10, and the outside air is discharged from the first discharge port 8. It will be released again to the outside air.

次に、キャビネット4内の構成について説明する。図3に示すように、キャビネット4内には、基板上に設けられた送・受信機5が、基板面を縦にして冷却装置6側(ドア側)から差し込むようにして設けられ、複数の基板が略平行に並んでいる。キャビネット4の冷却装置6側には、冷却装置6の第2吸気口9と連通する空気排出口9aと、冷却装置6の第2吐出口10と連通する空気取入口10aが設けられている。キャビネット4内は、キャビネット4の背面15側、すなわち、冷却装置6とは対面となる側(放熱部17)と、送・受信機5を設けた部分(発熱部18)を区画する仕切板16を設ける。仕切板16は、放熱部17と発熱部18を完全に区画するものではなく、その下部に放熱部17と発熱部18とを連通する開口19を設ける。放熱部17の上部には、キャビネット4内の空気を循環させる第1の循環ファン20が設けられており、空気排出口9a(冷却装置6の第2吸気口9)へと連絡している。一方、発熱部18の上部にもキャビネット4内の空気を循環するため、第2の循環ファン21が設けられ、空気排出口9a(冷却装置6の第2吸気口9)へと連絡している。   Next, the configuration within the cabinet 4 will be described. As shown in FIG. 3, a transmitter / receiver 5 provided on a substrate is provided in the cabinet 4 so as to be inserted from the cooling device 6 side (door side) with the substrate surface vertical. The substrates are arranged substantially in parallel. On the cooling device 6 side of the cabinet 4, an air discharge port 9 a that communicates with the second intake port 9 of the cooling device 6 and an air intake port 10 a that communicates with the second discharge port 10 of the cooling device 6 are provided. In the cabinet 4, the partition plate 16 that partitions the back surface 15 side of the cabinet 4, that is, the side facing the cooling device 6 (heat dissipating part 17) and the part provided with the transmitter / receiver 5 (heat generating part 18). Is provided. The partition plate 16 does not completely divide the heat radiating part 17 and the heat generating part 18, and an opening 19 is provided below the heat radiating part 17 and the heat generating part 18. A first circulation fan 20 that circulates the air in the cabinet 4 is provided above the heat radiating unit 17 and communicates with the air discharge port 9a (the second air intake port 9 of the cooling device 6). On the other hand, in order to circulate the air in the cabinet 4 also in the upper part of the heat generating part 18, a second circulation fan 21 is provided and communicates with the air discharge port 9a (the second air intake port 9 of the cooling device 6). .

送・受信機5が設けられた基板28は、図4に示すように、高温となる発熱体素子22が設けられた基板本体23と、放熱板24と、発熱体素子22から発生する熱を受け取って放熱板24へと導く熱移動手段25とで構成されている。熱移動手段25には、例としてヒートパイプが用いられる。熱移動手段25には、断熱処理を施し、発熱部18内に熱を逃がさないようにする。基板28は、図5に示すように、放熱板24側を奥側にしてキャビネット4の開口側から挿入する。仕切板16には、基板挿入孔26が設けられ、この基板挿入孔26に放熱板24を貫通させる。こうして、放熱部17に放熱板24が配置され、発熱部18に基板本体23が配置されるようになる。放熱板24は、図6に示すように、上下方向に平行になるように、放熱部17に突き出して設けられる。   As shown in FIG. 4, the substrate 28 provided with the transmitter / receiver 5 generates heat generated from the substrate body 23 provided with the heating element 22, the heat radiating plate 24, and the heating element 22. It comprises heat transfer means 25 that receives and guides it to the heat sink 24. As the heat transfer means 25, for example, a heat pipe is used. The heat transfer means 25 is subjected to a heat insulation process so that heat is not released into the heat generating portion 18. As shown in FIG. 5, the substrate 28 is inserted from the opening side of the cabinet 4 with the heat radiating plate 24 side as the back side. The partition plate 16 is provided with a substrate insertion hole 26, and the heat sink 24 is passed through the substrate insertion hole 26. Thus, the heat radiating plate 24 is disposed in the heat radiating portion 17 and the substrate body 23 is disposed in the heat generating portion 18. As shown in FIG. 6, the heat radiating plate 24 protrudes from the heat radiating portion 17 so as to be parallel to the vertical direction.

上記構成において、キャビネット4内の空気の流れを説明する。冷却装置6において冷却された空気はキャビネット4の空気取入口10a(第2吐出口10)からキャビネット4内の発熱部18に送り込まれる。発熱部18では、第2の循環ファン21によって、この冷却空気の一部が上昇し、そのまま発熱部18内の冷却を行い、空気排出口9a(冷却装置6の第2吸気口9)へと送られることになる(第1の送風経路)。一方、発熱部18に流入した空気の残りは、第1の循環ファン20の運転によって、仕切板16の下に設けられた開口19から放熱部17へと吸い込まれる。この冷却空気は、放熱部17を上昇し、第1の循環ファン20から空気排出口9a(冷却装置6の第2吸気口9)へと送られることになる(第2の送風経路)。一方で、熱移動手段25は、発熱体素子22から発生した熱を放熱板24へと移動して、放熱部17は高温となっている。この高温となった放熱部17に吸い込まれた冷却空気が通過することによってキャビネット4内の冷却を行うものである。   In the above configuration, the flow of air in the cabinet 4 will be described. The air cooled in the cooling device 6 is sent from the air intake port 10 a (second discharge port 10) of the cabinet 4 to the heat generating part 18 in the cabinet 4. In the heat generating part 18, a part of the cooling air is raised by the second circulation fan 21, and the heat generating part 18 is cooled as it is, to the air discharge port 9a (the second air intake port 9 of the cooling device 6). It will be sent (1st ventilation path). On the other hand, the remainder of the air that has flowed into the heat generating portion 18 is sucked into the heat radiating portion 17 from the opening 19 provided below the partition plate 16 by the operation of the first circulation fan 20. This cooling air ascends the heat radiating portion 17 and is sent from the first circulation fan 20 to the air discharge port 9a (second air intake port 9 of the cooling device 6) (second air supply path). On the other hand, the heat transfer means 25 moves the heat generated from the heating element 22 to the heat radiating plate 24, and the heat radiating portion 17 is at a high temperature. The inside of the cabinet 4 is cooled by the passage of the cooling air sucked into the heat radiating portion 17 having a high temperature.

このように、キャビネット4内で送・受信機5の発熱体素子22から発生する熱の大部分は、熱移動手段25によって放熱部17に集められ、その放熱部17において冷却空気により冷却されるため、上流に位置する発熱体素子22の影響による下流に位置する発熱体素子22の周囲温度上昇を抑制することができるとともに、放熱部17の下流に発熱体素子22が存在しないため放熱部17の下流における温度は従来のキャビネットに比べ高温とすることができ、空気排出口9aから冷却装置6に供給されるキャビネット4内空気を従来に比べ高温とすることができる。よって、冷却装置6において、内気と外気の温度差が大きくなることで、冷却能力が向上し、冷却装置6を小型化することができ、結果として、発熱体収納装置3を小型化することができる。   Thus, most of the heat generated from the heating element 22 of the transmitter / receiver 5 in the cabinet 4 is collected by the heat transfer means 25 in the heat radiating portion 17 and is cooled by the cooling air in the heat radiating portion 17. Therefore, an increase in the ambient temperature of the heat generating element 22 located downstream due to the influence of the heat generating element 22 positioned upstream can be suppressed, and since the heat generating element 22 does not exist downstream of the heat dissipating part 17, the heat dissipating part 17. The downstream temperature can be higher than that of the conventional cabinet, and the air in the cabinet 4 supplied to the cooling device 6 from the air discharge port 9a can be higher than that of the conventional cabinet. Therefore, in the cooling device 6, the temperature difference between the inside air and the outside air is increased, so that the cooling capacity is improved and the cooling device 6 can be downsized. As a result, the heating element storage device 3 can be downsized. it can.

また、図7では、送・受信機5が設けられた基板本体29が、熱移動機能を備えたものになっている。基板本体29上の発熱体素子22は、伝熱しやすいよう基板本体29と密着している。基板本体29には、その先端に放熱板24が設けられている。このような構成によれば、基板本体29全体に熱を受けることができるため、放熱効果が高くなる効果がある。   In FIG. 7, the substrate body 29 provided with the transmitter / receiver 5 has a heat transfer function. The heating element 22 on the substrate body 29 is in close contact with the substrate body 29 so as to facilitate heat transfer. A heat sink 24 is provided at the tip of the substrate body 29. According to such a configuration, since the heat can be received by the entire substrate body 29, there is an effect that the heat dissipation effect is enhanced.

また、図8に示すように、放熱板24と基板28との間には、フランジ27が設けられ、基板挿入孔26と接合するようにする。フランジ27の周囲には、パッキンを設けて基板挿入孔26と密着嵌合させ、放熱部17と発熱部18との間を仕切っても良い。   Further, as shown in FIG. 8, a flange 27 is provided between the heat dissipation plate 24 and the substrate 28 so as to be joined to the substrate insertion hole 26. A packing may be provided around the flange 27 to closely fit the board insertion hole 26 so as to partition the heat radiating portion 17 and the heat generating portion 18.

また、図9に示すように、フランジ27の外周と基板挿入孔26の内周とが勘合するようにしても良い。さらには、フランジ27の外周側は、放熱部17側を小さくしたテーパー型としてもよい。このテーパーは、基板28を押し込むことによって、フランジ27が基板挿入孔26に密着して嵌合することになる。また、このテーパーを設けたフランジ27は、金属製とするとよい。金属製のフランジ27は、発熱部18、放熱部17の温度上昇によって膨張し、基板挿入孔26との嵌合密度がより強固になる。   Further, as shown in FIG. 9, the outer periphery of the flange 27 and the inner periphery of the substrate insertion hole 26 may be fitted. Furthermore, the outer peripheral side of the flange 27 may be a tapered type in which the heat radiating portion 17 side is made smaller. This taper causes the flange 27 to be brought into close contact with the board insertion hole 26 when the board 28 is pushed in. The flange 27 provided with the taper is preferably made of metal. The metal flange 27 expands due to the temperature rise of the heat generating portion 18 and the heat radiating portion 17, and the fitting density with the board insertion hole 26 becomes stronger.

本実施の形態では、放熱部17側に設けられた第1の循環ファン20と、発熱部18側に設けられた第2の循環ファン21を別に設けることとしたが、放熱部17と発熱部18の風路が合流した後の空気排出口9a(第2吸気口9)近傍に、循環ファンを設けても良い。   In the present embodiment, the first circulation fan 20 provided on the heat radiating unit 17 side and the second circulation fan 21 provided on the heat generating unit 18 side are provided separately, but the heat radiating unit 17 and the heat generating unit are provided. A circulation fan may be provided in the vicinity of the air discharge port 9a (second intake port 9) after the 18 air paths merge.

(実施の形態2)
図10〜12を用いて、本発明の第2の実施の形態について説明する。
(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIGS.

図10は、第2の実施の形態による発熱体収納装置3の分解図である。冷却装置6の構成は第1の実施の形態と同じであるので、その説明は省略する。   FIG. 10 is an exploded view of the heating element storage device 3 according to the second embodiment. Since the configuration of the cooling device 6 is the same as that of the first embodiment, the description thereof is omitted.

図10〜12に示すように、キャビネット4内には、第1の実施の形態と同様、基板上に設けられた送・受信機5が、基板面を縦にして冷却装置6側(ドア側)から差し込むようにして設けられ、複数の基板が略平行に並んでいる。キャビネット4の冷却装置6側には、冷却装置6の第2吸気口9と連通する空気排出口9aと、冷却装置6の第2吐出口10と連通する空気取入口10aが設けられている。キャビネット4内は、キャビネット4の背面15側、すなわち、冷却装置6とは対面となる側(放熱部17)と、送・受信機5を設けた部分(発熱部18)を区画する仕切板16を設ける。仕切板16は、放熱部17と発熱部18を完全に区画している。放熱部17の下側のキャビネット4の壁面には、外部から空気を吸い込む放熱部吸込口30が設けられている。放熱部17の上側のキャビネット4の壁面には、外部へ空気を排出する放熱部排出口31が設けられている。さらに、放熱部排出口31の上流側には、放熱部ファン32が設けられている。   As shown in FIGS. 10 to 12, in the cabinet 4, as in the first embodiment, the transmitter / receiver 5 provided on the substrate is placed on the cooling device 6 side (door side) with the substrate surface vertical. And a plurality of substrates are arranged substantially in parallel. On the cooling device 6 side of the cabinet 4, an air discharge port 9 a that communicates with the second intake port 9 of the cooling device 6 and an air intake port 10 a that communicates with the second discharge port 10 of the cooling device 6 are provided. In the cabinet 4, the partition plate 16 that partitions the back surface 15 side of the cabinet 4, that is, the side facing the cooling device 6 (heat dissipating part 17) and the part provided with the transmitter / receiver 5 (heat generating part 18). Is provided. The partition plate 16 completely partitions the heat radiating portion 17 and the heat generating portion 18. The wall surface of the cabinet 4 below the heat radiating portion 17 is provided with a heat radiating portion suction port 30 for sucking air from the outside. On the wall surface of the cabinet 4 on the upper side of the heat radiating portion 17, a heat radiating portion discharge port 31 for discharging air to the outside is provided. Further, a heat radiating unit fan 32 is provided on the upstream side of the heat radiating unit discharge port 31.

上記構成によれば、送・受信機5から発生した熱は、熱移動手段(図10〜12では図示せず)によって放熱部17に集められる。すなわち、送・受信機5を備えた発熱部18は、外部と完全に隔離された状態になり、塵埃等が浸入しない状態となる。熱が集められた放熱部17には、放熱部ファン32の運転により、放熱部吸込口30から外部の冷たい空気が吸い込まれる。この冷たい空気は放熱板24から熱を奪うことによって放熱部17の冷却が行われる。放熱部17を通過した空気は放熱部排出口31から再び外部へと放出される。   According to the said structure, the heat which generate | occur | produced from the transmitter / receiver 5 is collected by the thermal radiation part 17 by a heat transfer means (not shown in FIGS. 10-12). That is, the heat generating part 18 provided with the transmitter / receiver 5 is in a state of being completely isolated from the outside and is in a state in which dust or the like does not enter. The cold air outside is sucked into the heat radiating part 17 where the heat is collected by the operation of the heat radiating part fan 32 from the heat radiating part suction port 30. The cold air removes heat from the heat radiating plate 24 to cool the heat radiating portion 17. The air that has passed through the heat radiating portion 17 is discharged to the outside from the heat radiating portion discharge port 31 again.

仕切板16には、第1の実施の形態同様、基板挿入孔26が設けられており、この基板挿入孔26に基板28(放熱板24)を通し、フランジで仕切板16と接合している。   As in the first embodiment, the partition plate 16 is provided with a substrate insertion hole 26. A substrate 28 (heat radiating plate 24) is passed through the substrate insertion hole 26 and joined to the partition plate 16 with a flange. .

本発明は、空気取入口と空気排出口を有し、内部を仕切板によって2つの区画に区分したキャビネットと、この2つの区画の一方の区画は、電子回路を搭載した発熱体を設けた発熱部とし、他方の区画には、放熱板を設け、前記発熱体から発生した熱を集めて放出する放熱部とし、前記空気取入口は、前記発熱部の外壁に設け、前記仕切板には、前記発熱部と前記放熱部とを連通する開口を設け、前記発熱体には、発生する熱を吸収して移動させる熱移動手段を設け、この熱移動手段は、前記仕切板を貫通して前記発熱体と前記放熱板を連絡し、前記空気取入口から発熱部を通過し、前記空気排出口へと送る第1の送風経路と、前記空気取入口から前記開口を通過し、前記放熱部で吸熱した後に前記空気排出口から外部に送出される第2の送風経路を有するものであるので、熱交換効率を向上させることができる。すなわち、本発明においては、熱移動手段によって、キャビネット内で高温となる部分を放熱部に集中して設けることになるので、内部に発熱する機器を設けたキャビネット、部屋などの冷却に有用である。   The present invention has a cabinet having an air inlet and an air outlet, the interior of which is divided into two compartments by a partition plate, and one of the two compartments is a heat generator provided with a heating element on which an electronic circuit is mounted. And the other section is provided with a heat radiating plate, a heat radiating portion that collects and releases the heat generated from the heating element, the air intake is provided on the outer wall of the heat generating portion, An opening for communicating the heat generating part and the heat radiating part is provided, and the heat generating body is provided with a heat moving means for absorbing and moving the generated heat, and the heat moving means passes through the partition plate and passes through the partition plate. A heat generating body and the heat radiating plate are connected, a first air passage that passes through the heat generating portion from the air intake port and is sent to the air discharge port, and passes through the opening from the air intake port, After the heat absorption, a second feed is sent out from the air outlet. Since those having a path, thereby improving the heat exchange efficiency. That is, in the present invention, the heat transfer means concentrates the high temperature part in the cabinet on the heat dissipating part, so that it is useful for cooling a cabinet, room or the like provided with a device that generates heat inside. .

1 ビルディング
2 屋上
3 発熱体収納装置
4 キャビネット
5 送・受信機
6 冷却装置
7 第1吸気口
8 第1吐出口
9 第2吸気口
9a 空気排出口
10 第2吐出口
10a 空気取入口
11 本体ケース
12 第1送風ファン
13 第2送風ファン
14 熱交換器
15 背面
16 仕切板
17 放熱部
18 発熱部
19 開口
20 第1の循環ファン
21 第2の循環ファン
22 発熱体素子
23 基板本体
24 放熱板
25 熱移動手段
26 基板挿入孔
27 フランジ
28 基板
29 基板本体
30 放熱部吸込口
31 放熱部排出口
32 放熱部ファン
DESCRIPTION OF SYMBOLS 1 Building 2 Rooftop 3 Heating-element storage apparatus 4 Cabinet 5 Transmitter / receiver 6 Cooling device 7 1st inlet port 8 1st discharge port 9 2nd intake port 9a Air exhaust port 10 2nd discharge port 10a Air intake port 11 Main body case DESCRIPTION OF SYMBOLS 12 1st ventilation fan 13 2nd ventilation fan 14 Heat exchanger 15 Back surface 16 Partition plate 17 Heat radiation part 18 Heat generation part 19 Opening 20 1st circulation fan 21 2nd circulation fan 22 Heating body element 23 Substrate body 24 Heat radiation plate 25 Heat transfer means 26 Substrate insertion hole 27 Flange 28 Substrate 29 Substrate body 30 Heat sink inlet 31 Heat sink outlet 32 Heat sink fan

Claims (13)

空気取入口と空気排出口とこの空気排出口の近傍に設けた送風ファンを有し、内部を仕切板によって2つの区画に区分したキャビネットと、この2つの区画の一方の区画は、電子回路を搭載した発熱体を設けた発熱部とし、他方の区画には、放熱板を設け、前記発熱体から発生した熱を集めて放出する放熱部とし、前記空気取入口は、前記発熱部の外壁に設け、前記仕切板の下部のみに、前記発熱部と前記放熱部とを連通する開口を設け、前記発熱体には、発生する熱を吸収して移動させる熱移動手段を設け、この熱移動手段は、前記仕切板を貫通して前記発熱体と前記放熱板を連絡した構成の発熱体収納装置であって、前記空気取入口から取入れた空気が、前記発熱部、前記開口の順で通過し、前記放熱部で吸熱した後に前記空気排出口から外部に送出される発熱体収納装置。 A cabinet having an air inlet, an air outlet, and a blower fan provided in the vicinity of the air outlet, the interior of which is divided into two sections by a partition plate, and one of the two sections has an electronic circuit. A heat generating part provided with a mounted heat generating element, a heat radiating plate in the other section, a heat radiating part that collects and releases the heat generated from the heat generating element, and the air intake port on the outer wall of the heat generating part Provided, an opening for communicating the heat generating portion and the heat radiating portion is provided only at a lower portion of the partition plate, and the heat generating body is provided with a heat moving means for absorbing and moving the generated heat. Is a heating element storage device having a configuration in which the heating element and the heat dissipation plate are connected through the partition plate, and air taken in from the air inlet passes in the order of the heating part and the opening. , After absorbing heat at the heat radiating part Heating medium storage device to be sent to an external. 前記キャビネットに併設し、前記空気排出口から吹き出した空気を冷却した後に前記空気取入口に送り込む冷却装置を設けた請求項1に記載の発熱体収納装置。 The heating element storage device according to claim 1, further comprising a cooling device that is provided in the cabinet and that cools the air blown from the air discharge port and then sends the air to the air intake port. 前記発熱体は、電子部品を搭載した回路基板であって、前記熱移動手段は、一方をこの回路基板上の高発熱部品に接触させ、他方を前記放熱板に接触させた請求項1または2に記載の発熱体収納装置。 The heating element is a circuit board on which an electronic component is mounted, and one of the heat transfer means is in contact with a high heat generation component on the circuit board and the other is in contact with the heat sink. The heating element storage device according to 1. 前記熱移動手段は、ヒートパイプであることを特徴とする請求項1〜3いずれかひとつに記載の発熱体収納装置。 The heating element storage device according to any one of claims 1 to 3, wherein the heat transfer means is a heat pipe. 前記発熱部における前記熱移動手段に断熱処理を施した請求項1〜4いずれかひとつに記載の発熱体収納装置。 The heating element storage device according to any one of claims 1 to 4, wherein the heat transfer means in the heating portion is subjected to a heat insulation process. 前記発熱体は、前記熱移動手段と前記放熱板とを一体にして構成され、前記仕切板には放熱板貫通孔を設け、前記発熱体は、前記放熱板貫通孔に前記発熱部側から貫通して設置する請求項1〜5いずれかひとつに記載の発熱体収納装置。 The heat generating body is configured by integrating the heat transfer means and the heat radiating plate, and the partition plate is provided with a heat radiating plate through hole, and the heat generating body penetrates the heat radiating plate through hole from the heat generating portion side. The heating element storage device according to any one of claims 1 to 5 installed. 前記発熱体に、前記放熱板貫通孔を塞ぐようにフランジ接合する仕切板接合板を設け、前記仕切板に密着して接合する請求項6記載の発熱体収納装置。 The heating element storage device according to claim 6, wherein the heating element is provided with a partition plate bonding plate that is flange-bonded so as to close the through-hole of the heat dissipation plate, and is closely bonded to the partition plate. 前記仕切板接合板と前記仕切板との接合面にパッキンを設けた請求項7記載の発熱体収納装置。 The heating element storage device according to claim 7, wherein packing is provided on a joint surface between the partition plate joining plate and the partition plate. 前記発熱体に、仕切板嵌合板を設け、この仕切板嵌合板が前記放熱板貫通孔に嵌合して固定される請求項6記載の発熱体収納装置。 The heating element storage device according to claim 6, wherein a partition plate fitting plate is provided on the heating element, and the partition plate fitting plate is fitted and fixed to the heat radiating plate through hole. 前記仕切板嵌合板の周囲にパッキンを設けた請求項9記載の発熱体収納装置。 The heating element storage device according to claim 9, wherein packing is provided around the partition plate fitting plate. 前記仕切板嵌合板は金属である請求項9または10記載の発熱体収納装置。 The heating element storage device according to claim 9 or 10, wherein the partition plate fitting plate is made of metal. 前記発熱体は、基板上に電子回路を搭載したものであって、鉛直方向に平行かつ前記空気取入口に直交するように配置したことを特徴とする請求項1〜11いずれかひとつに記載の発熱体収納装置。 12. The heating element according to claim 1, wherein an electronic circuit is mounted on a substrate, and is arranged so as to be parallel to a vertical direction and orthogonal to the air intake port. Heating element storage device. 前記仕切板に設けた前記開口は、前記キャビネット下部に設けた請求項1〜12いずれかひとつに記載の発熱体収納装置。 The heating element storage device according to any one of claims 1 to 12, wherein the opening provided in the partition plate is provided in a lower portion of the cabinet.
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