JP5602761B2 - 分離した微細構造を有する微小電気機械システムデバイス及びその製造方法 - Google Patents

分離した微細構造を有する微小電気機械システムデバイス及びその製造方法 Download PDF

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Publication number
JP5602761B2
JP5602761B2 JP2011542203A JP2011542203A JP5602761B2 JP 5602761 B2 JP5602761 B2 JP 5602761B2 JP 2011542203 A JP2011542203 A JP 2011542203A JP 2011542203 A JP2011542203 A JP 2011542203A JP 5602761 B2 JP5602761 B2 JP 5602761B2
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layer
isolation trench
nitride
polysilicon structure
sacrificial
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JP2012512754A5 (enExample
JP2012512754A (ja
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ゼット． ジャン、リサ
エイチ． カーリン、リサ
ビー． モンテス、ルベン
タエ パク、ウー
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NXP USA Inc
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NXP USA Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/00698—Electrical characteristics, e.g. by doping materials

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
JP2011542203A 2008-12-19 2009-11-25 分離した微細構造を有する微小電気機械システムデバイス及びその製造方法 Expired - Fee Related JP5602761B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/340,202 2008-12-19
US12/340,202 US7943525B2 (en) 2008-12-19 2008-12-19 Method of producing microelectromechanical device with isolated microstructures
PCT/US2009/065905 WO2010080229A1 (en) 2008-12-19 2009-11-25 Microelectromechanical device with isolated microstructures and method of producing same

Publications (3)

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JP2012512754A JP2012512754A (ja) 2012-06-07
JP2012512754A5 JP2012512754A5 (enExample) 2013-01-17
JP5602761B2 true JP5602761B2 (ja) 2014-10-08

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JP2011542203A Expired - Fee Related JP5602761B2 (ja) 2008-12-19 2009-11-25 分離した微細構造を有する微小電気機械システムデバイス及びその製造方法

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US (1) US7943525B2 (enExample)
JP (1) JP5602761B2 (enExample)
CN (1) CN102257609B (enExample)
TW (1) TW201034933A (enExample)
WO (1) WO2010080229A1 (enExample)

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US20100289065A1 (en) * 2009-05-12 2010-11-18 Pixart Imaging Incorporation Mems integrated chip with cross-area interconnection
TW201109267A (en) * 2009-09-08 2011-03-16 Jung-Tang Huang A general strength and sensitivity enhancement method for micromachined devices
TWI388496B (zh) * 2010-01-12 2013-03-11 Maxchip Electronics Corp 微機電系統結構及其製造方法
EP2426083A3 (en) * 2010-09-03 2013-11-13 Domintech Co., LTD. Mems sensor package
CN108470679B (zh) * 2011-01-25 2022-03-29 Ev 集团 E·索尔纳有限责任公司 用于永久接合晶片的方法
CN102183677B (zh) * 2011-03-15 2012-08-08 迈尔森电子（天津）有限公司 集成惯性传感器与压力传感器及其形成方法
US8673756B2 (en) * 2011-04-14 2014-03-18 Robert Bosch Gmbh Out-of-plane spacer defined electrode
US8610222B2 (en) 2011-04-18 2013-12-17 Freescale Semiconductor, Inc. MEMS device with central anchor for stress isolation
US8846129B2 (en) * 2012-02-13 2014-09-30 Taiwan Semiconductor Manufacturing Company, Ltd. Biological sensing structures and methods of forming the same
US8828772B2 (en) * 2012-03-05 2014-09-09 Taiwan Semiconductor Manufacturing Co., Ltd. High aspect ratio MEMS devices and methods for forming the same
US9469522B2 (en) * 2013-03-15 2016-10-18 Robert Bosch Gmbh Epi-poly etch stop for out of plane spacer defined electrode
US9079763B2 (en) 2013-04-22 2015-07-14 Freescale Semiconductor, Inc. MEMS device with stress isolation and method of fabrication
US9034679B2 (en) 2013-06-25 2015-05-19 Freescale Semiconductor, Inc. Method for fabricating multiple types of MEMS devices
DE102014202820A1 (de) * 2014-02-17 2015-08-20 Robert Bosch Gmbh Schichtenanordnung für ein mikromechanisches Bauelement
US9617142B1 (en) * 2015-09-30 2017-04-11 Mems Drive, Inc. MEMS grid for manipulating structural parameters of MEMS devices
EP3153851B1 (en) 2015-10-06 2024-05-01 Carrier Corporation Mems die with sensing structures
CN105890827B (zh) * 2016-01-18 2019-05-21 广东合微集成电路技术有限公司 一种电容式压力传感器及其制造方法
US9950920B2 (en) 2016-01-22 2018-04-24 United Microelectronics Corp. Micro-electro-mechanical system structure and method for forming the same
KR102088584B1 (ko) * 2018-11-28 2020-03-12 한국과학기술원 Mems 멤브레인 구조체 및 그 제조방법
DE102020202262A1 (de) * 2020-02-21 2021-08-26 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer nanoskaligen Kanalstruktur
IT202000011755A1 (it) * 2020-05-20 2021-11-20 St Microelectronics Srl Procedimento di fabbricazione di un dispositivo micro-elettro-meccanico, in particolare sensore di movimento con comando/rilevazione di tipo capacitivo, e relativo dispositivo mems
CN113387319B (zh) * 2021-06-11 2023-07-14 中国兵器工业集团第二一四研究所苏州研发中心 基于多通孔硅基板的mems芯片封装结构及其制备方法
CN116902904A (zh) * 2023-07-14 2023-10-20 绍兴中芯集成电路制造股份有限公司 一种mems器件、mems器件的制备方法和电子装置

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US6199874B1 (en) 1993-05-26 2001-03-13 Cornell Research Foundation Inc. Microelectromechanical accelerometer for automotive applications
US5580815A (en) * 1993-08-12 1996-12-03 Motorola Inc. Process for forming field isolation and a structure over a semiconductor substrate
US6121552A (en) 1997-06-13 2000-09-19 The Regents Of The University Of Caliofornia Microfabricated high aspect ratio device with an electrical isolation trench
DE69942486D1 (de) 1998-01-15 2010-07-22 Cornell Res Foundation Inc Grabenisolation für mikromechanische bauelemente
JP4214584B2 (ja) * 1998-11-27 2009-01-28 株式会社デンソー 半導体力学量センサおよびその製造方法
US6395644B1 (en) 2000-01-18 2002-05-28 Advanced Micro Devices, Inc. Process for fabricating a semiconductor device using a silicon-rich silicon nitride ARC
DE10065013B4 (de) * 2000-12-23 2009-12-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
KR100443126B1 (ko) 2002-08-19 2004-08-04 삼성전자주식회사 트렌치 구조물 및 이의 형성 방법
US6770506B2 (en) 2002-12-23 2004-08-03 Motorola, Inc. Release etch method for micromachined sensors
US6936491B2 (en) 2003-06-04 2005-08-30 Robert Bosch Gmbh Method of fabricating microelectromechanical systems and devices having trench isolated contacts
US20060148133A1 (en) 2005-01-03 2006-07-06 Analog Devices, Inc. Method of forming a MEMS device
US7372617B2 (en) * 2005-07-06 2008-05-13 Peter Enoksson Hidden hinge MEMS device
JP2008080444A (ja) * 2006-09-27 2008-04-10 Toshiba Corp Ｍｅｍｓ素子製造方法およびｍｅｍｓ素子
DE102006052630A1 (de) * 2006-10-19 2008-04-24 Robert Bosch Gmbh Mikromechanisches Bauelement mit monolithisch integrierter Schaltung und Verfahren zur Herstellung eines Bauelements

Also Published As

Publication number Publication date
CN102257609B (zh) 2014-02-12
WO2010080229A1 (en) 2010-07-15
CN102257609A (zh) 2011-11-23
JP2012512754A (ja) 2012-06-07
US20100155861A1 (en) 2010-06-24
TW201034933A (en) 2010-10-01
US7943525B2 (en) 2011-05-17

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