JP5598231B2 - Polishing object loading jig, polishing method for polishing object, and manufacturing method of glass substrate for magnetic disk - Google Patents

Description

  The present invention is a method of loading an object to be efficiently loaded with a plurality of objects to be polished in a polishing process for polishing the object to be polished held by a carrier disposed between an upper surface plate and a lower surface plate of a double-side polishing apparatus. The present invention relates to a jig and a method for polishing an object to be polished, and a method for manufacturing a glass substrate for a magnetic disk.

  For example, in a polishing step for double-side polishing an object to be polished (work) having an upper main plane and a lower main plane, the upper main plane of a plurality of objects to be polished by a double-side polishing apparatus having an upper surface plate and a lower surface plate And the lower main plane are simultaneously polished (for example, see Patent Documents 1 and 2).

  In the double-side polishing apparatus, a plurality of holding holes are provided in the carrier disposed between the upper surface plate and the lower surface plate, and when the polishing process is completed, an operator removes the object to be polished from each holding hole of the carrier. After being taken out, one object to be polished is inserted into each holding hole of the carrier by hand.

JP 2002-355552 A JP 2006-221734 A

  Conventionally, in the work process of inserting the object to be polished into each holding hole of the carrier of the double-side polishing apparatus, since the carrier has many holding holes, the operator inserts the object to be polished into all the holding holes. A considerable amount of time is required, and accordingly, the time during which the double-side polishing apparatus is stopped (non-polishing time) becomes long, and the polishing efficiency of the double-side polishing apparatus decreases.

  SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide an object loading jig, a method for polishing an object to be polished, and a method for manufacturing a glass substrate for a magnetic disk, which have solved the above problems.

In order to solve the above problems , according to one aspect of the present invention ,
A polishing step for polishing an object to be polished held by a carrier disposed between the upper surface plate and the lower surface plate using a double-side polishing apparatus having an upper surface plate and a lower surface plate. A workpiece loading jig for simultaneously loading a plurality of workpieces into each of the plurality of holding holes,
A first jig having a plurality of insertion holes arranged to face the plurality of holding holes of the carrier;
A second jig that has a plurality of standby holes that are overlaid on an upper surface of the first jig and that wait for the plurality of objects to be polished that are loaded into the plurality of holding holes of the carrier. ,
The first jig and the second jig are supported so that their respective contact surfaces are slidable in the horizontal direction .
The plurality of insertion holes and the plurality of standby holes are configured such that the first jig is placed on the upper surface of the carrier and the second jig is slid so that the object to be polished is An object-to-be-grounded loading jig is provided so as to be accommodated in the holding hole while passing through the insertion hole .

  According to the present invention, the plurality of standby holes of the second jig overlaid on the upper surface of the first jig are slid so as to coincide with the plurality of holding holes of the carrier. A plurality of stored objects to be polished can be inserted into a plurality of holding holes of the carrier in a lump through a plurality of insertion holes of the first jig, thereby shortening the stop time of the double-side polishing apparatus. Polishing efficiency can be increased.

It is a perspective view of one Example of a to-be-polished object loading jig by the present invention. It is a top view of a to-be-polished object loading jig. It is a longitudinal cross-sectional view of the to-be-polished material loading jig along the AA line in FIG. It is a figure which expands and shows the center positioning part of a to-be-polished object loading jig. It is a figure which expands and shows the peripheral part of a to-be-polished body loading jig. It is a longitudinal cross-sectional view which expands and shows the state which accumulated the insertion hole of the 1st jig | tool and the standby hole of the 2nd jig | tool. It is a longitudinal cross-sectional view which expands and shows the state which matched the holding hole of a carrier and the insertion hole of a 1st jig | tool, and shifted the standby hole of the 2nd jig | tool. The longitudinal cross-sectional view which expands and shows the state by which the holding hole of the carrier and the insertion hole of the first jig are matched and the standby hole of the second jig is matched and the glass substrate W is loaded in the holding hole It is. It is a front view which shows schematic structure of a double-side polish apparatus. It is a perspective view which shows the structure where a carrier interposes between an upper surface plate and a lower surface plate. It is a top view which shows arrangement | positioning of each carrier distribute | arranged to the lower surface plate. It is a front view which shows the grinding | polishing state which the upper surface plate fell. It is a top view which shows the modification 1 of a to-be-polished object loading jig. It is a longitudinal cross-sectional view which shows the modification 1 of the to-be-polished body loading jig in alignment with the BB line in FIG. It is a figure which expands and shows the peripheral part of the modification 1 of a to-be-polished object loading jig. It is a figure which expands and shows the peripheral part of the modification 2 of a to-be-polished object loading jig. It is a longitudinal cross-sectional view which expands and shows the positioning part which matches the holding hole of the carrier of the modification 3, and the insertion hole of a 1st jig | tool. It is a longitudinal cross-sectional view which expands and shows the state which matched the holding hole of the carrier of the modification 3, and the insertion hole of the 1st jig | tool, and matched the standby hole of the 2nd jig | tool.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

[Configuration of object loading jig]
FIG. 1 is a perspective view of an embodiment of an object loading jig according to the present invention. FIG. 2 is a plan view of the workpiece loading jig. Hereinafter, a case where double-side polishing is performed using a glass substrate used for a magnetic recording disk as an object to be polished will be described.

  As shown in FIGS. 1 and 2, the workpiece loading jig 10 has a configuration in which a second jig 30 is slidably superimposed on the upper surface of the first jig 20.

  The first jig 20 includes a first flat portion 22 formed in a circular shape, and reinforcing ribs 24 that are coupled to the outer periphery of the first flat portion 22 and formed in an annular shape. The first planar portion 22 is provided with a plurality of circular insertion holes 40 through which a glass substrate as an object to be polished passes.

  The first planar portion 22 is formed of a relatively soft resin material (for example, vinyl chloride: PVC (Poly vinyl chloride)), and is configured so as not to damage the glass substrate even if it contacts the glass substrate. ing.

  In addition, a plurality of protrusions 27 are formed at predetermined intervals on the lower surface of the first flat portion 22 so as to form gaps so as not to be in close contact with the carrier upper surface.

  The plurality of insertion holes 40 are formed to have the same arrangement pattern as the plurality of holding holes provided in the carrier of the double-side polishing apparatus described later (the pitch at the center of each hole is the same as the holding hole of the carrier). Moreover, the inner diameter of each insertion hole 40 is formed to be slightly larger than the outer diameter of the glass substrate.

  In the first jig 20, it is possible to provide a protective material made of, for example, a nonwoven fabric or foamed polyurethane on the upper surface of the first flat portion 22 that comes into contact with the object to be polished. This is preferable from the viewpoint of suppressing generation of scratches.

  The reinforcing rib 24 is formed in an annular shape from a metal such as aluminum, for example, and the peripheral portion of the first flat surface portion 22 is fastened to the lower surface. A pair of handles 26 formed in a U-shape are fixed to two locations on the outer peripheral surface of the reinforcing rib 24. The pair of handles 26 are provided on the outer periphery of the annular reinforcing rib 24 at positions spaced by 180 degrees so that the operator can easily hold them with both hands. In addition, since the to-be-polished body loading jig 10 is reduced in weight, it can be operated by one worker.

  The second jig 30 has a second flat portion 32 formed of a relatively soft resin material (for example, vinyl chloride). Similarly to the first flat surface portion 22, the second flat surface portion 32 is formed of a relatively soft resin material (for example, vinyl chloride: PVC (Poly vinyl chloride)). The glass substrate is configured not to be damaged.

  The second plane portion 32 has a plurality of circular standby holes 50 in which glass substrates are accommodated. In the plurality of standby holes 50, the first jig 20 is placed on the upper surface of the carrier, and the second jig 30 is slid, so that the glass substrate as the object to be polished becomes the standby holes 50 and the insertion holes. It is opened so that it can be accommodated in the holding hole 112 of the carrier 110 while passing through 40 (see FIG. 4C).

  As shown in FIGS. 1 and 2, the plurality of insertion holes 40 and the plurality of standby holes 50 when the plurality of objects to be polished are accommodated in the plurality of standby holes 50 are in positions shifted from each other. Then, after the first jig 20 is placed on the upper surface of the carrier 110 (see FIG. 4B), the second jig 30 is slid along the upper surface of the first jig 20. The polishing body is allowed to pass through the plurality of standby holes 50 and the plurality of insertion holes 40, and the plurality of objects to be polished housed in the plurality of standby holes 50 are simultaneously dropped into the plurality of holding holes 112 of the carrier 110. Inserted (see FIG. 4C).

  Further, the first flat surface portion 22 and the second flat surface portion 32 are made of a sheet-like member having a thickness that does not curve when the object to be polished is loaded into the holding hole 112 of the carrier 110. In addition, if the 1st plane part 22 and the 2nd plane part 32 are comprised by the transparent member or the translucent member which has a predetermined color, since an operator can visually observe the downward carrier from upper direction, alignment is possible. It becomes easier and more preferable.

  The plurality of insertion holes 40 and the plurality of standby holes 50 are arranged to be uniform within the concentric circumference. Each insertion hole 40 and each standby hole 50 are larger than a glass substrate as an object to be polished, and are formed to be the same as or smaller than a holding hole 112 of a carrier 110 described later. In addition, it is more preferable that at least the first flat surface portion 22 of the first flat surface portion 22 and the second flat surface portion 32 is transparent, which facilitates alignment with the carrier 110.

  FIG. 3A is a longitudinal sectional view of the polishing object loading jig along the line AA in FIG. 2. FIG. 3B is an enlarged view showing the center positioning portion of the workpiece loading jig.

  As shown in FIGS. 3A and 3B, the first planar portion 22 and the second planar portion 32 are provided with a center positioning portion 60 that penetrates the center. The center positioning portion 60 is formed on a shaft 62 that passes through the center holes of the first plane portion 22 and the second plane portion 32, a collar portion 64 provided at the lower end of the shaft 62, and an upper portion of the shaft 62. And a male threaded portion 66.

  Two nuts 68 and 69 are screwed into the male thread portion 66, and the flange portion 64 comes into contact with the lower surface of the first flat surface portion 22 by tightening the nuts 68 and 69. Therefore, the center positioning portion 60 supports the first flat surface portion 22 and the second flat surface portion 32 so that they can rotate around the shaft 62. In other words, the first flat surface portion 22 and the second flat surface portion 32 are held so that the center portion thereof is rotatable between the flange portion 64 and the nuts 68 and 69.

  The second flat surface portion 32 is provided with an operation portion 70 that stands on the upper surface so as to extend in the radial direction. Accordingly, the operation unit 70 is rotated, and the second flat surface portion 32 slides in the horizontal direction (circumferential direction) with respect to the first flat surface portion 22, and the plurality of insertion holes 40 and the plurality of standby holes 50. The relative position can be matched.

  In addition, the operation unit 70 has an upper end formed higher than the reinforcing rib 24, and an end 72 that extends to the outer peripheral side protrudes outside the reinforcing rib 24. In addition, on the upper surface of the reinforcing rib 24, there are a pair of stoppers 71, 71 that regulate the rotation operation range β of the operation unit 70. The pair of stoppers 71, 71 are provided with a circumferential separation distance so that the rotation operation range β is wider than the circumferential shift amount (angle α) between each insertion hole 40 and each standby hole 50. (Β> α). When the operation unit 70 is rotated from the position indicated by the solid line in FIG. 2 to the position indicated by the alternate long and short dash line in FIG. 2, the second flat part 32 is partially moved with respect to the upper surface of the first flat part 22. Turn while touching.

  When an operator loads a plurality of glass substrates into a double-side polishing apparatus 200 (see FIG. 5), which will be described later, the operator rotates the operation unit 70 so that the second planar portion 32 is a shaft 62 of the center positioning unit 60. And the positions of the plurality of standby holes 50 can be moved to positions corresponding to the plurality of insertion holes 40.

  Further, the flange portion 64 of the center positioning portion 60 is fitted into the center hole 114 of the carrier 110 of the double-side polishing apparatus, so that the center of the workpiece loading jig 10 is aligned with the center of the carrier 110. To do. Since the outer diameter of the collar portion 64 is slightly smaller than the inner diameter of the center hole 114, the operator can easily align the center of the polishing object loading jig 10.

  Also, as shown in FIG. 3A, a plurality of protrusions 27 are formed on the lower surface of the first flat portion 22 at predetermined intervals so as to form gaps so as not to be in close contact with the upper surface of the carrier 110. For example, when a liquid such as a polishing liquid or water is present on the upper surface of the carrier 110, the upper surface of the carrier 110 may be firmly adsorbed by being in close contact with the lower surface of the first planar portion 22 without a gap. In this case, when removing the workpiece loading jig 10 upward, the carrier 110 is lifted together, and the carrier 110 is displaced from a predetermined position of the double-side polishing apparatus, or the carrier 110 is displaced. May cause problems such as Therefore, by providing the plurality of protrusions 27 on the lower surface of the first flat portion 22 at a predetermined interval, it is possible to prevent the upper surface of the carrier 110 from being in close contact with the lower surface of the first flat portion 22 and being firmly adsorbed. Therefore, the polishing object loading jig 10 placed on the upper surface of the carrier 110 can be easily removed.

  FIG. 3C is an enlarged view of the peripheral edge of the workpiece loading jig. As shown in FIG. 3C, the reinforcing rib 24 has a rectangular cross-sectional shape, and the outer peripheral edge portion of the first plane portion 22 is fastened to the lower surface of the reinforcing rib 24 with screws 25. Since the first flat surface portion 22 is fixed to the reinforcing rib 24, the flat surface state can be maintained.

Further, the reinforcing rib 24 is inserted so that the outer peripheral edge portion of the second flat surface portion 32 faces the inner peripheral surface of the reinforcing rib 24. Therefore, when placing the polishing object loading jig 10 on the upper surface of the carrier 110, the reinforcing ribs 24 insert the first planar portion 22, the second planar portion 32, and the plurality of standby holes 50. The load on the glass substrate is supported.
[Glass substrate loading operation]
FIG. 4A is an enlarged longitudinal sectional view showing a state in which the insertion hole of the first jig and the standby hole of the second jig are overlapped. As shown in FIG. 4A, the inner diameter D1 of each insertion hole 40 is substantially the same as the inner diameter D2 of each standby hole 50 (D1≈D2), and is slightly larger than the outer diameter of the object to be polished (glass substrate). large. Further, the inner peripheral upper edge portion of the lower insertion hole 40 is provided with a chamfer 42 so as to guide the outer peripheral edge portion of the glass substrate to the center side when the glass substrate is dropped.

  FIG. 4B is an enlarged longitudinal sectional view showing a state in which the holding hole of the carrier is aligned with the insertion hole of the first jig and the standby hole of the second jig is shifted. As shown in FIG. 4B, the workpiece loading jig 10 has a plurality of glass substrates W inserted into the plurality of standby holes 50 before being conveyed to the double-side polishing apparatus 200 in advance. Further, the polishing object loading jig 10 is placed on the upper surface of the carrier 110 and the center position thereof is positioned by fitting the flange portion 64 of the center positioning portion 60 into the center hole 114 of the carrier 110.

  In the workpiece loading jig 10, the positions of the plurality of standby holes 50 are shifted from the plurality of insertion holes 40 by a predetermined angle (angle α in FIG. 2) in the horizontal direction before the loading operation. Therefore, when the glass substrate W is inserted into each standby hole 50, the glass substrate W is placed on the upper surface of the first flat surface portion 22 below the glass substrate W. In addition, since it mounts in the area | region made into the crescent shape among the parts surrounding the circumference | surroundings of the insertion hole 40 as an upper surface of the 1st plane part 22 which contacts the lower surface of the glass substrate W, a contact area is small.

  Further, by preparing a larger number of objects to be polished 10 than the number of carriers 110, it is possible to efficiently load each carrier of the double-side polishing apparatus 200.

  FIG. 4C shows a state in which the holding hole 112 of the carrier is aligned with the insertion hole 40 of the first jig and the standby hole 50 of the second jig is aligned, and the glass substrate W is loaded in the holding hole 112. It is a longitudinal cross-sectional view shown expanding. As shown in FIG. 4C, after aligning the center positions of the first plane part 22 and the second plane part 32 with the center of the carrier 110, the first plane part 22 is rotated in the circumferential direction to make a plurality of positions. The position of the insertion hole 40 is matched with the position of each holding hole 112 of the carrier 110. Then, when the operation unit 70 is slid (rotated) in the circumferential direction, the second flat surface portion 32 rotates about the center positioning portion 60, and the plurality of standby holes 50 are inserted into the plurality of insertion holes. Move to a position that matches 40.

When the plurality of standby holes 50 coincide with the plurality of insertion holes 40, the first flat portion 22 existing below each standby hole 50 is relatively separated from each standby hole 50. Therefore, each glass substrate W accommodated in each standby hole 50 drops and is loaded into the holding hole 112 of the carrier 110 while passing through each insertion hole 40 by its own weight. Thus, after aligning the center position and circumferential position with respect to the carrier 110 using the workpiece loading jig 10, the operation unit 70 is rotated by a predetermined angle and stored in the plurality of standby holes 50. All the glass substrates W can be loaded into each holding hole 112 of the carrier 110 at a time, and the glass substrate loading time to the double-side polishing apparatus can be shortened.
[Configuration of double-side polishing machine]
FIG. 5 is a front view showing a schematic configuration of the double-side polishing apparatus. In FIG. 5, a sun gear 203 and an internal gear 205 shown in FIG.

  As shown in FIG. 5, the double-side polishing apparatus 200 is configured to simultaneously polish the upper main plane and the lower main plane of a plurality of glass substrates W, and includes a base 220, an upper surface plate 201, and a lower surface plate. A panel 202 and an elevating mechanism 208 are provided. A lower surface plate 202 is rotatably supported on an upper portion of the base 220, and a surface plate driving motor for driving the upper surface plate 201 is attached inside the base 220.

  The upper surface plate 201 has an upper polishing pad 130 that is disposed above the lower surface plate 202 and that polishes the upper main plane of the plurality of glass substrates W held by the carrier 110. Further, the lower surface plate 202 includes a lower polishing pad 140 for polishing the lower main plane of the plurality of glass substrates W held on the carrier 110.

  The lifting mechanism 208 is supported by a gate-shaped frame 206 that stands above the base 220, and has a lifting cylinder device 209 that lifts the upper surface plate 201 when the glass substrate is replaced. The lifting cylinder device 209 is attached to the center of the frame 206. The piston rod 254 of the lifting cylinder device 209 extends downward, and a support mechanism 207 that supports the upper surface plate 201 is connected to the lower end portion thereof.

  The support mechanism 207 includes a support column 207 a that extends downward, and a fixed base 207 b that is fixed to the upper surface of the upper surface plate 201. The fixed base 207b is provided with a lock mechanism 260 that is coupled to a groove 262a provided in the rotary shaft 205 of the surface plate drive motor.

  The lock mechanism 260 includes a lock pin 281 coupled to the groove 262a and a shaft 282 that couples the lock pin 281 to the fixed base 207b.

The upper surface plate 201 rises when the glass substrate is replaced by the ascending operation of the piston rod 254 of the elevating cylinder device 209 and descends when polishing. Further, the lifting cylinder device 209 and the surface plate drive motor of the lifting mechanism 208 are controlled by the control unit 210.
[Carrier mounting structure]
FIG. 6 is a perspective view showing a configuration in which a carrier is interposed between an upper surface plate and a lower surface plate. FIG. 7 is a plan view showing the arrangement of the carriers arranged on the lower surface plate.

  As shown in FIGS. 6 and 7, the upper surface plate 201 is rotatably supported by the rotation shaft 150. The sun gear 203 provided on the rotating shaft 150 meshes with a gear 204 formed on the outer periphery of the plurality of carriers 110. Further, the gears 204 of the plurality of carriers 110 mesh with the internal gear 205. Each of these gears 203, 204, 205 constitutes a planetary gear mechanism, and each carrier 110 revolves around the rotating shaft 150 while rotating by the rotation of the sun gear 203 and the internal gear 205.

Thus, the glass substrate W inserted into the holding hole 112 of each carrier 110 is double-side polished while sliding on the upper polishing pad 130 fixed to the upper surface plate 201 and the lower polishing pad 140 fixed to the lower surface plate 202. Is done. Further, a center hole 114 is provided at the center of each carrier 110 to be fitted and positioned by the center positioning portion 60 of the polishing object loading jig 10.
[Glass substrate polishing procedure]
Here, an operation procedure for loading a plurality of glass substrates W into the holding holes 112 of the carrier 110 using the workpiece loading jig 10 will be described.
(Procedure 1) When loading a plurality of glass substrates W into the holding holes 112 of the carrier 110 using the polishing object loading jig 10, the piston rod 254 of the lifting / lowering cylinder device 209 is lifted to increase the position. The board 201 is separated from the carrier 110 (see FIG. 5).
(Procedure 2) Each glass substrate W after the polishing process is recovered from the holding hole 112 of the carrier 110 and transferred to the cleaning process.
(Procedure 3) Next, the glass substrate W holds the handle 26 of the object loading jig 10 accommodated in each standby hole 50, and the object loading jig 10 is attached to the carrier 110 of the double-side polishing apparatus 200. Place above.
(Procedure 4) The flange 64 provided at the lower end of the center positioning portion 60 of the polishing object loading jig 10 is fitted into the center hole 114 provided in the center of the carrier 110 so that the polishing object loading jig 10 The center position is made to coincide with the center of the carrier 110 (see FIG. 3B).
(Procedure 5) The workpiece loading jig 10 is rotated in the circumferential direction so that the positions of the insertion holes 40 of the first jig 20 coincide with the holding holes 112 of the carrier 110 (see FIG. 4B). The insertion holes 40 of the first jig 20 and the standby holes 50 of the second jig 30 have the same arrangement pattern as each holding hole 112 of the carrier 110 (a pattern in which the pitch and distance of each hole are the same). ), If the position of one standby hole 50 among the plurality of standby holes 50 is made to coincide with the insertion hole 40, the positions of the other standby holes 50 can all be made to coincide with the insertion hole 40. it can.
(Procedure 6) The operation part 70 of the workpiece loading jig 10 is rotated in the circumferential direction to rotate the second jig 30 in the circumferential direction by a predetermined angle. Thereby, when each standby hole 50 of the second jig 30 is shifted in advance by a predetermined angle (for example, the angle α shown in FIG. 2) with respect to each insertion hole 40 of the first jig 20, It is rotated in the predetermined angle dividing direction.
(Procedure 7) When each standby hole 50 of the second jig 30 is rotated to a position that coincides with each insertion hole 40 of the first jig 20, each glass substrate W accommodated in each standby hole 50 Are simultaneously dropped by their own weight into the holding holes 112 of the carrier 110 while passing through the standby hole 50 and the insertion hole 40, and are loaded together (see FIG. 4C). Thus, each glass substrate W loaded in each holding hole 112 of the carrier 110 is held in a state where the lower surface is in sliding contact with the lower polishing pad 140 of the lower surface plate 202. For example, when five carriers 110 are provided in one double-side polishing apparatus 200, the loading operation using the polishing object loading jig 10 is performed five times. The work of loading the glass substrate W using the workpiece loading jig 10 may be performed by one worker or in cooperation with a plurality of workers.
(Procedure 8) After the glass substrate W is loaded in all the holding holes 112 of each carrier 110, the handle 26 of the polished object loading jig 10 is gripped to remove the polished object loading jig 10 from the double-side polishing apparatus 200. Remove.
(Procedure 9) As shown in FIG. 8, the cylinder device 209 for raising and lowering the double-side polishing apparatus 200 is operated to lower the piston rod 254, and the upper polishing pad 130 of the upper surface plate 201 is the glass substrate as the object to be polished. Abutting on the upper surface of W (the sun gear 203 and the internal gear 205 are omitted in FIG. 8).
(Procedure 10) The lock pin 281 of the lock mechanism 260 is coupled to the groove 262a of the rotary shaft 205. Thereafter, the upper main plate 201, the lower surface plate 202, the sun gear 203, and the internal gear 205 are rotated by a drive motor, and the upper main plane and lower main plate of each glass substrate W inserted into the holding holes 112 of the carrier 110 are rotated. Polish the plane.

  As described above, when the object to be polished loading jig 10 is used, a plurality of glass substrates W can be loaded at a time on each carrier 110, so that the time required for loading work required to load the glass substrates W is reduced. As a result, the stop time of the double-side polishing apparatus 200 is shortened and the polishing efficiency of the polishing process is increased.

Here, a modified example will be described.
[Modification 1]
FIG. 9 is a plan view showing a modified example of the workpiece loading jig. FIG. 10A is a longitudinal sectional view showing a first modification of the workpiece loading jig along the line B-B in FIG. 9. FIG. 10B is an enlarged view showing the peripheral edge portion of Modification Example 1 of the polishing object loading jig. In FIG. 9, FIG. 10A, and FIG.

  As shown in FIGS. 9 and 10A, in the polished body loading jig 10A of Modification 1, the reinforcing rib portion 24 is formed of a resin material. Therefore, the weight is reduced as compared with the above embodiment.

  In addition, the reinforcing rib 24 has a pressing portion 300 that presses the second jig 30 from above at a plurality of locations (for example, four locations in the circumferential direction). The presser portions 300 are provided at equal intervals (90 ° intervals in the case of four locations) in the circumferential direction of the reinforcing rib 24 formed in an annular shape.

  As shown in FIG. 10B, the presser part 300 is a metal plate (for example, stainless steel having corrosion resistance) bent into a crank shape, and is fixed to the upper surface of the reinforcing rib 24 by screws 306. 302 and an abutting portion 304 that extends to the inside of the reinforcing rib 24 and abuts against the peripheral edge of the second flat surface portion 32. The pressing portion 300 is fixed to the upper surface of the reinforcing rib 24 so that the abutting portion 304 brings the second flat portion 32 into close contact with the first flat portion 22.

  Thereby, since the 2nd plane part 32 is hold | maintained in the close_contact | adhered state pressed by the 1st plane part 22, each waiting hole 50 of the 2nd jig | tool 30 is inserted in each 1st jig | tool 20 each. When the rotation operation is performed so as to coincide with the hole 40 (see step 6 described above), the biting phenomenon in which the glass substrate W is sandwiched in the gap between the first jig 20 and the second jig 30 is prevented. Is done.

This is because at least one of the first jig 20 or the second jig 30 bends downward due to the mass of the plurality of glass substrates W, and between the first jig 20 and the second jig 30. There is a risk of gaps. However, by providing the presser portion 300 at a plurality of locations, the peripheral portion of the second planar portion 32 can be brought into close contact with the first planar portion 22 to suppress the occurrence of the biting phenomenon.
[Modification 2]
FIG. 10C is an enlarged view of the peripheral edge portion of Modification 2 of the workpiece loading jig. As shown in FIG. 10C, in the second modification, a pressing portion 310 that protrudes to the inner peripheral side of the reinforcing rib 24 is provided integrally with the reinforcing rib 24. The holding portions 310 are provided at a plurality of locations on the inner peripheral side of the reinforcing rib 24, and the second jig 30 is placed in a state where the second jig 30 is placed on the upper surface of the first jig 20. The outer peripheral edge of the

Therefore, in the second modification, as in the first modification, the second flat surface portion 32 is held in close contact with the first flat surface portion 22, and thus the second jig 30. When the standby holes 50 are rotated so as to coincide with the respective insertion holes 40 of the first jig 20 (see the procedure 6 described above), the glass substrate W is connected to the first jig 20 and the second jig. The biting phenomenon sandwiched in the gap between the tool 30 is prevented.
[Modification 3]
FIG. 11A is an enlarged longitudinal sectional view showing a positioning portion that matches the holding hole of the carrier and the insertion hole of the first jig in the third modification. As shown in FIG. 11A, the carrier 110 is provided with a positioning hole 116. A positioning pin 28 protrudes downward from the lower surface of the first jig 20. The positioning pin 28 has a projecting length shorter than the thickness of the carrier 110 and is provided so as not to damage the lower polishing pad 140 disposed below the carrier 110.

  Since the outer diameter of the positioning pin 28 is smaller than that of the positioning hole 116, when the first jig 20 is rotated in the circumferential direction and reaches a position facing the upper side of the positioning hole 116, The first jig 20, the second jig 30, and the plurality of glass substrates are fitted into the positioning holes 116. Thereby, each insertion hole 40 of the first jig 20 is positioned at a position that coincides with each holding hole 112 of the carrier 110. Thus, after aligning the center position of the 1st plane part 22 and the 2nd plane part 32 which were mentioned above to the center of the carrier 110, positioning is carried out by rotating the 1st plane part 22 to the circumferential direction. The pins 28 can be fitted into the positioning holes 116 so that the positions of the plurality of insertion holes 40 can be adjusted to the positions of the holding holes 112 of the carrier 110.

  In FIG. 11B, the holding hole 112 of the carrier and the insertion hole 40 of the first jig are matched with each other and the standby hole 50 of the second jig is matched, and the glass substrate W is loaded into the holding hole 112. It is a longitudinal cross-sectional view which expands and shows the state performed. As shown in FIG. 11B, by sliding the operation portion 70 described above in the circumferential direction, the second flat surface portion 32 rotates around the center positioning portion 60, and the plurality of standby holes 50 are formed in the plurality of standby holes 50. It is moved to a position that coincides with the insertion hole 40.

  When the plurality of standby holes 50 coincide with the plurality of insertion holes 40, each glass substrate W accommodated in the plurality of standby holes 50 falls through the insertion holes 40 into the holding holes 112 of the passing carrier 110 by its own weight. Loaded.

In the third modification, the first flat surface portion 22 is rotated in the circumferential direction and the positioning pins 28 are fitted into the positioning holes 116, so that the positions of the plurality of insertion holes 40 are set to the holding holes 112 of the carrier 110. Therefore, the alignment work time can be shortened.
[Method of manufacturing glass substrate for magnetic disk]
In general, the manufacturing process of a magnetic disk glass substrate and a magnetic disk includes the following steps. (Step 1) After processing the glass base substrate formed by the float method, the fusion method or the press molding method into a disk shape having a circular hole in the central portion, the inner peripheral side surface and the outer peripheral side surface are chamfered.
(Step 2) The side surface portion and the chamfered portion of the glass substrate are end-polished.
(Step 3) The main plane of the glass substrate is polished. The polishing step may be primary polishing only, primary polishing and secondary polishing may be performed, or tertiary polishing may be performed after secondary polishing.
(Step 4) Precision cleaning of the glass substrate is performed to obtain a glass substrate for magnetic disk.
(Step 5) A thin film such as a magnetic layer is formed on a glass substrate for a magnetic recording medium to manufacture a magnetic disk.

  In the manufacturing process of the magnetic disk glass substrate and the magnetic disk, (step 2) at least one of the main surface wraps (eg, loose abrasive wraps, fixed abrasive wraps, etc.) before and after the end face polishing step is performed. Alternatively, glass substrate cleaning (inter-process cleaning) and glass substrate surface etching (inter-process etching) may be performed between the processes. Note that main surface lap (for example, loose abrasive wrap, fixed abrasive wrap, etc.) is polishing of the main surface in a broad sense.

  Furthermore, when high mechanical strength is required for the glass substrate for magnetic disks, a strengthening step (for example, a chemical strengthening step) for forming a reinforcing layer on the surface layer of the glass substrate is performed before the polishing step, after the polishing step, or between the polishing steps. May be implemented.

  In the present invention, the glass substrate for a magnetic disk may be amorphous glass, crystallized glass, or tempered glass (for example, chemically tempered glass) having a tempered layer on the surface layer of the glass substrate. Further, the glass base substrate of the glass substrate of the present invention may be made by a float method, may be made by a fusion method, or may be made by a press molding method.

  The present invention relates to a step of polishing a main surface of a glass substrate using a double-side polishing apparatus, and relates to polishing of a glass substrate for a magnetic disk. The present invention can be applied in the step of polishing the main plane of the glass substrate, and the main plane is lapped (for example, loose abrasive wrap, fixed abrasive wrap, etc.), primary polishing, secondary polishing, and tertiary polishing. Applicable to process.

  In the above embodiment, the description has been given by taking the double-side polishing apparatus for polishing the glass substrate for magnetic recording as an example. However, the present invention is not limited to this, and the present invention is also applied to those for polishing glass used for other purposes. Of course you can.

  Specific examples of glass substrates to which the present invention can be applied include glass substrates for magnetic recording media, photomasks, displays for liquid crystals and organic EL, optical components such as optical pickup elements, optical filters, and optical lenses. It is mentioned as a typical thing.

  Further, the number of glass substrates and the number of carriers placed on the lower platen are not limited to those in the above embodiment, and any number may be used as long as a plurality of glass substrates can be simultaneously polished in a single polishing step.

  Moreover, although the thing of the structure which raises / lowers an upper surface plate using an air cylinder was illustrated in the said Example, not only this but the structure which raises / lowers an upper surface plate using drive means other than an air cylinder may be sufficient. Of course.

10, 10A Polishing object loading jig 20 First jig 22 First plane portion 24 Reinforcing rib 26 Handle 27 Projection 28 Positioning pin 30 Second jig 32 Second plane portion 40 Insertion hole 42 Chamfer 50 Standby hole 60 Center positioning part 62 Shaft 64 Gutter part 66 Male thread part 68, 69 Nut 70 Operation part 71 Stopper 110 Carrier 112 Holding hole 114 Center hole 116 Positioning hole 130 Upper polishing pad 140 Lower polishing pad 150 Rotating shaft 200 Double-side polishing Device 220 Base 201 Upper surface plate 202 Lower surface plate 203 Sun gear 204 Gear 205 Internal gear 208 Lifting mechanism 209 Lifting cylinder device 205 Rotating shaft 206 Frame 207 Support mechanism 254 Piston rod 260 Lock mechanism 262a Groove 281 Lock pin 282 Shaft 300, 310 Holding part 302 Fixing part 04 contact portion

Claims (14)

A polishing step for polishing an object to be polished held by a carrier disposed between the upper surface plate and the lower surface plate using a double-side polishing apparatus having an upper surface plate and a lower surface plate. A workpiece loading jig for simultaneously loading a plurality of workpieces into each of the plurality of holding holes,
A first jig having a plurality of insertion holes arranged to face the plurality of holding holes of the carrier;
A second jig that has a plurality of standby holes that are overlaid on an upper surface of the first jig and that wait for the plurality of objects to be polished that are loaded into the plurality of holding holes of the carrier. ,
The first jig and the second jig are supported so that their respective contact surfaces are slidable in the horizontal direction .
The plurality of insertion holes and the plurality of standby holes are configured such that the first jig is placed on the upper surface of the carrier and the second jig is slid so that the object to be polished is A polishing object loading jig opened so as to be accommodated in the holding hole while passing through the insertion hole . The plurality of insertion holes and the plurality of standby holes when the plurality of objects to be polished are accommodated in the plurality of standby holes are shifted from each other, and the first jig is an upper surface of the carrier. After the second jig is slid along the upper surface of the first jig, the object to be polished can pass through the plurality of standby holes and the plurality of insertion holes. 2. The polishing object loading jig according to claim 1 , wherein the plurality of objects to be polished housed in the plurality of standby holes are simultaneously dropped and inserted into the plurality of holding holes of the carrier. 3. The polishing object loading jig according to claim 1, wherein the plurality of insertion holes and the plurality of standby holes are larger than the object to be polished and are formed to be the same as or smaller than the holding hole of the carrier. Said second jig between said first jig, polished body according to any one of claims 1 to 3 having a centering portion which the center of the planar portion to align with the center of the upper surface of the carrier Loading jig. The center positioning part has a fitting part fitted in a center hole formed in the center of the carrier,
The polishing object loading jig according to claim 4 , wherein the fitting portion is formed to have a size slightly smaller than the center hole. The first jig and the second jig are rotated in the circumferential direction of the carrier in a state in which the fitting portion is fitted and positioned in the center hole of the carrier, and the first jig and the second jig are rotated with respect to the carrier. The polishing object loading jig according to claim 5 , wherein the direction position is aligned. The first jig is polished body the coupling device according to any one of claims 1 to 6 having a positioning portion for positioning the circumferential position relative to the carrier. The to-be-polished object according to any one of claims 1 to 7 , wherein a reinforcing rib formed in an annular shape is provided at least on an outer periphery of the first jig or the second jig. Body loading jig. The polishing object loading jig according to claim 8 , wherein the first jig has a holding portion that presses the second jig. The first jig or of the second jig, at least the polished body the coupling device according to any one of the first jig of claims 1 to 9 flat portion is formed by a transparent member . The polishing object loading jig according to any one of claims 1 to 10 , wherein the first jig has a protrusion that forms a gap with the carrier. The object to be polished is polished body the coupling device according to any one of claims 1 to 11 which is a glass substrate for a magnetic disk. In the polishing method of the object to be polished, the upper main plane and the lower main plane of the object to be polished are
A method for polishing an object to be polished, wherein a plurality of objects to be polished are set in each holding hole of a carrier using the object to be polished material loading jig according to any one of claims 1 to 12 . A processing step of chamfering an inner peripheral side surface and an outer peripheral side surface after processing a plate-shaped glass base substrate having a main plane and a side surface into a disk shape having a circular hole in the center, and the side surface portion and the chamfering of the glass substrate Glass substrate for magnetic disk, comprising: polishing step 1 for polishing the end face of the substrate; polishing step 2 for polishing the main plane of the glass substrate; and a cleaning step of precisely cleaning the glass substrate to obtain a glass substrate for magnetic disk In the manufacturing method of
In the polishing step 2, a plurality of glass substrates are set in each holding hole of a carrier using the workpiece loading jig according to any one of claims 1 to 12 , and then the plurality of glass substrates are polished. A method for producing a glass substrate for a disk.

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