JP5593387B2 - データ・センタに関する知識ベースのモデル化のための方法、製品、および装置 - Google Patents
データ・センタに関する知識ベースのモデル化のための方法、製品、および装置 Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/13—Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
- G01K3/02—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values
- G01K3/06—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values in respect of space
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06G—ANALOGUE COMPUTERS
- G06G7/00—Devices in which the computing operation is performed by varying electric or magnetic quantities
- G06G7/48—Analogue computers for specific processes, systems or devices, e.g. simulators
- G06G7/56—Analogue computers for specific processes, systems or devices, e.g. simulators for heat flow
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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Description
上式でzはサーバ・ラックの下部からの距離である。
グラフ700では、z(フィート単位で測定)がx軸にプロットされ、吸気温度Tinlet(摂氏度(℃)で測定)がy軸にプロットされる。上記の数式1は、s曲線の下部および上部におけるs挙動の非対称を許可するが、ここ(数式2)ではこの挙動は無視される。log(x0)パラメータは、下部平坦域と上部平坦域との間の50%に達するz値を与え、以下の数式は、50%での勾配を与える。
上式では、以下の通りである。
x,y 座標
T 値(データ・ポイント)
n 値の数
i データ・ポイント・インデックス
j 補間ポイント・インデックス
wij 重み
rij 補間ポイントとデータ・ポイントとの間の距離
c 平滑パラメータ
b 指数
mu 減衰距離
次に、s曲線タイプは以下のように知識ベースにグループ化することができる。
実際には、近隣ne(r)の選択は、Kの最も近い近隣または既定の半径の領域などの、何らかの発見的基準とすることができる。
Claims (12)
- データ・センタ全体の複数の位置に対して垂直温度分布データを取得するステップと、
それぞれの前記位置に対する前記垂直温度分布データをs曲線としてプロットするステップであって、前記垂直温度分布データは前記s曲線の形状で反映されるそれぞれの前記位置での物理的条件を反映する、プロットするステップと、
それぞれの前記s曲線を前記s曲線の前記形状を特徴付けるパラメータのセットであるs曲線表示として表すステップであって、前記s曲線表示が事前に定義されたs曲線タイプの知識ベース・モデルを構成し、これを基に前記データ・センタ全体にわたる前記複数の位置での温度分布および関連付けられた物理的条件を分析することが可能である、表すステップと、
を含む、データ・センタ内の温度分布をモデル化するための方法。 - 前記温度分布データが、移動測定技術(MMT)を使用して取得される、請求項1に記載の方法。
- 前記パラメータが、s曲線の下部平坦域、s曲線の上部平坦域、s曲線上部のs形の程度、s曲線下部のs形の程度、および、s曲線の中間点が到達する高さのうちの、1つまたは複数を含む、請求項1に記載の方法。
- 前記パラメータのセットが、前記s曲線がそれに関する前記垂直温度分布のプロットである、前記データ・センタ内の特定の位置を記述する1つまたは複数のパラメータをさらに含む、請求項1に記載の方法。
- 前記データ・センタが、サーバ・ラックと、前記サーバ・ラックから熱気を取り込み、高床内の複数の穿孔タイルを通じて前記サーバ・ラックへと送られる冷却気を下地床プレナムに排出するように構成された、1つまたは複数の空調ユニットを備えた、高床冷却システムとを備える、請求項1に記載の方法。
- 前記データ・センタ内の前記サーバ・ラックのうちの1つまたは複数のそれぞれの吸気口側で、垂直温度分布データを取得するステップをさらに含む、請求項5に記載の方法。
- 前記物理的条件が、前記データ・センタ内のサーバ・ラックの位置、サーバ・ラックから空調ユニットまでの距離、サーバ・ラックの高さ、温度フットプリント、サーバ・ラックの露出、天井の高さ、最も近いタイルまでの距離、前記空調ユニットから前記サーバ・ラックへと送られる空気流、前記サーバ・ラック内の開口部、サーバ・ラックの電力消費、および、サーバ・ラックの空気流需要量のうちの、1つまたは複数を含む、請求項5に記載の方法。
- 前記垂直温度分布データが時間T=0について取得され、
時間T=1についてリアルタイム温度データを取得するステップであって、前記リアルタイム・データは、時間T=0について取得された前記データよりも空間的密度が低い、取得するステップと、
前記リアルタイム・データを、前記複数の位置について更新された垂直温度分布データを取得するために、時間T=0について取得された前記データ上に補間するステップと、
をさらに含む、請求項1に記載の方法。 - それぞれの前記位置について前記更新された垂直温度分布データをs曲線としてプロットするステップであって、前記垂直温度分布データが、前記s曲線の形状で反映されるそれぞれの前記位置での更新された物理的条件を反映する、プロットするステップと、
前記更新されたs曲線を、前記知識ベース・モデル内の前記事前に定義されたs曲線タイプと対合するステップと、
をさらに含む、請求項8に記載の方法。 - 事前に定義されたs曲線タイプを同様のパラメータに基づいてグループ化するステップをさらに含む、請求項1に記載の方法。
- 実行された場合、請求項1または請求項8のいずれか一項に記載の方法のすべてのステップを実装する1つまたは複数のプログラム。
- メモリと、
前記メモリに結合され、
請求項1、5、6または8乃至10までのいずれか一項に記載の方法のすべてのステップを実行するためのプログラムを前記メモリに記憶し、記憶したプログラムを実行することで、すべてのステップの動作をすることができるプロセッサ・デバイスと、
を備える、データ・センタ内の温度分布をモデル化するための装置。
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US12/540,213 US8244502B2 (en) | 2009-08-12 | 2009-08-12 | Knowledge-based models for data centers |
US12/540,213 | 2009-08-12 | ||
PCT/US2010/044726 WO2011019611A2 (en) | 2009-08-12 | 2010-08-06 | Knowledge-based models for data centers |
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JP2013502006A JP2013502006A (ja) | 2013-01-17 |
JP5593387B2 true JP5593387B2 (ja) | 2014-09-24 |
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US (1) | US8244502B2 (ja) |
JP (1) | JP5593387B2 (ja) |
KR (1) | KR20120054016A (ja) |
CN (1) | CN102741833B (ja) |
CA (1) | CA2766847A1 (ja) |
DE (1) | DE112010003279T5 (ja) |
GB (1) | GB2484616B (ja) |
TW (1) | TW201106143A (ja) |
WO (1) | WO2011019611A2 (ja) |
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2009
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2010
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- 2010-08-06 JP JP2012524760A patent/JP5593387B2/ja not_active Expired - Fee Related
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US20110040532A1 (en) | 2011-02-17 |
CA2766847A1 (en) | 2011-02-17 |
DE112010003279T5 (de) | 2013-03-14 |
GB2484616A (en) | 2012-04-18 |
WO2011019611A3 (en) | 2014-04-03 |
GB201200474D0 (en) | 2012-02-22 |
CN102741833B (zh) | 2016-03-30 |
TW201106143A (en) | 2011-02-16 |
KR20120054016A (ko) | 2012-05-29 |
US8244502B2 (en) | 2012-08-14 |
JP2013502006A (ja) | 2013-01-17 |
CN102741833A (zh) | 2012-10-17 |
GB2484616B (en) | 2013-12-11 |
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