JP5580065B2 - 圧着端子 - Google Patents
圧着端子 Download PDFInfo
- Publication number
- JP5580065B2 JP5580065B2 JP2010020359A JP2010020359A JP5580065B2 JP 5580065 B2 JP5580065 B2 JP 5580065B2 JP 2010020359 A JP2010020359 A JP 2010020359A JP 2010020359 A JP2010020359 A JP 2010020359A JP 5580065 B2 JP5580065 B2 JP 5580065B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- crimping
- crimp terminal
- serrations
- serration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims description 149
- 238000002788 crimping Methods 0.000 claims description 82
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000006835 compression Effects 0.000 description 11
- 238000007906 compression Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
12 導体圧着部
13 底板
13a 内面
14 導体加締片
16 セレーション
17 セレーション
17a 凹部
17b 凸部
W 電線
Wa 導体
Wc 素線
Claims (1)
- 電線の導体の端末に圧着して接続される導体圧着部を有し、該導体圧着部が、底板と該底板の両側に延設されて該底板の内面上に配された前記導体を包むように加締められる一対の導体加締片とで断面略U字状に形成され、該導体圧着部の内面に、所定の方向に沿って平行に延びる凹溝状の複数本のセレーションが形成された圧着端子において、
前記導体圧着部の内面に、該内面の周縁部を残して、減肉厚により一段凹ませた凹部が設けられ、その凹部の内底面に前記複数本のセレーションが形成されていることを特徴とする圧着端子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010020359A JP5580065B2 (ja) | 2009-04-07 | 2010-02-01 | 圧着端子 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009093158 | 2009-04-07 | ||
JP2009093158 | 2009-04-07 | ||
JP2010020359A JP5580065B2 (ja) | 2009-04-07 | 2010-02-01 | 圧着端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010262915A JP2010262915A (ja) | 2010-11-18 |
JP5580065B2 true JP5580065B2 (ja) | 2014-08-27 |
Family
ID=43360817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010020359A Active JP5580065B2 (ja) | 2009-04-07 | 2010-02-01 | 圧着端子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5580065B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7364394B2 (ja) * | 2019-09-04 | 2023-10-18 | 矢崎総業株式会社 | 圧着端子及び端子付き電線 |
JP7467516B2 (ja) | 2022-02-16 | 2024-04-15 | 矢崎総業株式会社 | 圧着端子 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5167321U (ja) * | 1974-11-25 | 1976-05-27 | ||
JPS51153742U (ja) * | 1975-05-30 | 1976-12-08 | ||
JP3868234B2 (ja) * | 2001-07-13 | 2007-01-17 | 矢崎総業株式会社 | 圧着端子 |
JP4364262B2 (ja) * | 2007-06-05 | 2009-11-11 | 範雄 加藤 | 圧着端子 |
-
2010
- 2010-02-01 JP JP2010020359A patent/JP5580065B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010262915A (ja) | 2010-11-18 |
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