JP5576527B2 - カメラモジュールの製造装置及び方法 - Google Patents
カメラモジュールの製造装置及び方法 Download PDFInfo
- Publication number
- JP5576527B2 JP5576527B2 JP2013078265A JP2013078265A JP5576527B2 JP 5576527 B2 JP5576527 B2 JP 5576527B2 JP 2013078265 A JP2013078265 A JP 2013078265A JP 2013078265 A JP2013078265 A JP 2013078265A JP 5576527 B2 JP5576527 B2 JP 5576527B2
- Authority
- JP
- Japan
- Prior art keywords
- pcb
- image sensor
- camera module
- gyro
- bonding head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Description
115 接着剤
120 イメージセンサ
130 赤外線遮断フィルタ
140 レンズ
150 レンズハウジングモジュール
610 ボンディングヘッド
612 ヒーティング手段
620 PCB支持手段
621 水平部材
622 垂直部材
625 ジャイロ手段
700 レンズハウジングモジュール
110m 実装領域
110t 突条
Claims (6)
- D/A(Die Attach)工法を活用したカメラモジュールの製造装置であって、
本体の所定部位にはヒーティング手段が備えられており、イメージセンサをピックアップしてPCBの上部内側底面上に載置させた後、前記ヒーティング手段で熱を加えて前記イメージセンサと前記PCBとの間に塗布された接着剤を硬化させるボンディングヘッドと、
前記PCBを下部から支持するものであって、その本体の所定部位にはPCBジャイロ手段が設けられており、前記ボンディングヘッドで前記イメージセンサをピックアップして前記PCBに載置させる際に、前記PCBと前記イメージセンサとの傾き偏差を前記ジャイロ手段によって補償するPCB支持手段と、を含み、
前記接着剤は前記PCBの前記上部内側底面に塗布されており、
前記PCB支持手段は、前記PCBの前記上部内側底面の傾きが水平に調節されるように、前記ジャイロ手段を通じて前記PCBの底面を支持している、
カメラモジュールの製造装置。 - 前記PCBは、その中心部にイメージセンサ実装領域が形成され、その領域の外枠には所定高さの突条が形成された構造を有する、請求項1に記載のカメラモジュールの製造装置。
- 前記突条は、前記イメージセンサ実装領域の外枠に沿って「口」字状に形成される、請求項2に記載のカメラモジュールの製造装置。
- 前記突条は、前記イメージセンサがPCBに載置されて、前記イメージセンサとPCBとの間に塗布された接着剤が硬化された状態でのPCBの底面からイメージセンサの上端部までの高さと同じ高さに形成される、請求項2に記載のカメラモジュールの製造装置。
- 前記ボンディングヘッドに備えられるヒーティング手段は電気ヒータである、請求項1に記載のカメラモジュールの製造装置。
- 前記PCB支持手段に備えられるPCBジャイロ手段は、ボール方式のセンタジャイロ治具、4ボールピン治具、板バネテンション治具のうち何れか一つである、請求項1に記載のカメラモジュールの製造装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120050831A KR101387295B1 (ko) | 2012-05-14 | 2012-05-14 | 카메라 모듈의 제조 장치 및 방법 |
KR10-2012-0050831 | 2012-05-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013240043A JP2013240043A (ja) | 2013-11-28 |
JP5576527B2 true JP5576527B2 (ja) | 2014-08-20 |
Family
ID=49547714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013078265A Active JP5576527B2 (ja) | 2012-05-14 | 2013-04-04 | カメラモジュールの製造装置及び方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9004132B2 (ja) |
JP (1) | JP5576527B2 (ja) |
KR (1) | KR101387295B1 (ja) |
CN (1) | CN103428413B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101332082B1 (ko) * | 2012-06-18 | 2013-11-22 | 삼성전기주식회사 | 카메라 모듈의 제조장치 |
KR101332156B1 (ko) * | 2012-06-18 | 2013-11-26 | 삼성전기주식회사 | 카메라 모듈의 제조장치 |
US10375383B2 (en) * | 2014-04-17 | 2019-08-06 | SZ DJI Technology Co., Ltd. | Method and apparatus for adjusting installation flatness of lens in real time |
KR101972363B1 (ko) * | 2014-08-13 | 2019-08-16 | 가부시키가이샤 신가와 | 실장 장치 및 측정 방법 |
WO2016100756A1 (en) * | 2014-12-17 | 2016-06-23 | The Lightco Inc. | Methods and apparatus for implementing and using camera devices |
US9715078B2 (en) | 2015-05-14 | 2017-07-25 | Microsoft Technology Licensing, Llc | Adjustable lens mount |
WO2017110627A1 (ja) * | 2015-12-24 | 2017-06-29 | 京セラ株式会社 | 撮像素子実装用基板および撮像装置 |
KR20180059301A (ko) * | 2016-11-25 | 2018-06-04 | 주식회사 탑 엔지니어링 | 틸트 보정이 가능한 카메라 모듈 하우징, 카메라 모듈 제조장치 및 제조방법 |
KR102229860B1 (ko) * | 2019-02-07 | 2021-03-19 | (주)에이피텍 | 카트리지 일체형 디스펜싱 용액 경화 히터 |
KR102191179B1 (ko) * | 2019-02-07 | 2020-12-15 | (주)에이피텍 | 정렬판이 포함되는 펄스 히트 파워 디스펜싱 용액 경화 히터 |
JP7441030B2 (ja) | 2019-10-31 | 2024-02-29 | キヤノン株式会社 | 電子モジュールの製造方法、光学モジュールの製造方法、電子モジュール、光学モジュール及び機器 |
KR102444815B1 (ko) | 2021-01-12 | 2022-09-19 | 주식회사 뷰웍스 | 이미지 센서 어셈블리 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05343658A (ja) * | 1992-06-09 | 1993-12-24 | Sony Corp | 固体撮像装置のパッケージ構造 |
JP2006013073A (ja) | 2004-06-24 | 2006-01-12 | Sharp Corp | ボンディング装置、ボンディング方法及び半導体装置の製造方法 |
CN101218539B (zh) * | 2005-07-05 | 2011-07-13 | 日立化成工业株式会社 | 感光性粘接剂组合物、以及使用其所得粘接薄膜、粘接薄片、贴有粘接剂层的半导体晶圆、半导体装置及电子零件 |
JP2007294793A (ja) | 2006-04-27 | 2007-11-08 | Fujifilm Corp | イメージセンサチップの固定方法 |
KR100831710B1 (ko) | 2006-08-17 | 2008-05-22 | 삼성전기주식회사 | 카메라 모듈의 조립 장치 및 그 조립 방법 |
KR100845547B1 (ko) | 2006-10-10 | 2008-07-10 | 삼성전기주식회사 | 카메라 모듈과 이의 조립 장치 |
JP5096723B2 (ja) * | 2006-10-19 | 2012-12-12 | 積水化学工業株式会社 | 半導体装置及びその製造方法 |
JP5320736B2 (ja) * | 2007-12-28 | 2013-10-23 | 株式会社ニコン | 半導体ウエハ貼り合わせ装置 |
US7892883B2 (en) * | 2008-05-30 | 2011-02-22 | Intel Corporation | Clipless integrated heat spreader process and materials |
-
2012
- 2012-05-14 KR KR1020120050831A patent/KR101387295B1/ko active IP Right Grant
-
2013
- 2013-03-13 US US13/801,062 patent/US9004132B2/en active Active
- 2013-04-04 JP JP2013078265A patent/JP5576527B2/ja active Active
- 2013-05-14 CN CN201310178091.3A patent/CN103428413B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20130299081A1 (en) | 2013-11-14 |
CN103428413A (zh) | 2013-12-04 |
JP2013240043A (ja) | 2013-11-28 |
KR20130127135A (ko) | 2013-11-22 |
US9004132B2 (en) | 2015-04-14 |
CN103428413B (zh) | 2016-09-14 |
KR101387295B1 (ko) | 2014-04-18 |
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