JP5576090B2 - Soldering method and apparatus - Google Patents

Description

  The present invention relates to a soldering method and apparatus using ultrasonic vibration.

  There are various members to be soldered. Among them, unlike printed boards, there are cases where lead wires are soldered to a base material such as glass or ceramic that does not have an alloy bond, etc. Soldering to a member is difficult to weld to the surface even if molten solder is simply attached.

  For this reason, a vibrator, a chip that transmits vibration from the vibrator and ultrasonically vibrates, and a heating means that heats the chip are provided, and the tip of the heated and ultrasonically vibrated chip is placed on the surface of the substrate. Patent Documents 1 and 2 that perform soldering work while pressing are known.

JP 2001-102610 A JP-A-7-204838

  However, in the soldering apparatus of the above-mentioned patent document 1, the heating means is configured by providing a heater inside the bag having the tip on the tip side, and the vibration characteristics when transmitting ultrasonic vibration to the chip are within the bag. There is a problem that it may be hindered when the chip is changed by the heater and the chip is ultrasonically vibrated smoothly.

  On the other hand, in the soldering apparatus of Patent Document 2, an electric heater configured by winding a coiled resistance wire around a ridge is used as a heating means, and a chip is formed by Joule heat generated when electricity is passed through the conducting wire. Heat is transmitted, but the heat transferred from the resistance wire to the periphery of the cocoon is transferred to the chip side after being transmitted to the axis side of the cocoon, so the heat conduction to the chip side is slow, and the resistance to the surface of the cocoon Even when the line contact is not good, the heat conduction to the chip side becomes slow. As a result, the amount of heat conducted to the chip side may be insufficient with respect to the amount of heat that moves from the chip side to the base material side when performing soldering on the base material by moving the wrinkles, and smooth soldering There is a problem that it may be difficult to work.

  The present invention solves the above-described problem, and includes a vibrator, a chip that is ultrasonically vibrated by transmission of vibrations from the vibrator, and a heating unit that heats the chip. Glass, ceramic, TTO mask, Another object is to provide a soldering method and apparatus capable of performing soldering work efficiently by smoothly ultrasonically vibrating and heating a chip when soldering to a difficult-to-solder metal or the like. Objective.

  In order to solve the above problems, the present invention firstly includes a vibrator 12, a chip 7 that is ultrasonically vibrated by transmission of vibration from the vibrator 12, and a heating means 8 that heats the chip 7. 7 is a soldering apparatus for performing soldering work, and the coil 7 is made of a conductor, and a coil for generating heat by generating electromotive force by electromagnetic induction is used as the heating means 8, and the coil is disposed on the tip side. By inserting the flange 6 having the chip 7 into the inner peripheral side of the coil 8 and forming a clearance between the outer peripheral surface of the chip 7 and the inner peripheral surface of the coil 8, the chip 7 and the coil 8 are not contacted with each other. The chip 7 is ultrasonically vibrated in the non-contact state.

  Secondly, a movable frame 4 that slides in the wiring direction of the substrate 1 is provided, the collar 6 is supported by the movable frame 4 so as to be capable of ultrasonic vibration, and the coil 8 is fixed to the movable frame 4 side. Thus, the cage 6 is ultrasonically vibrated with respect to the movable frame 4 and the coil 8.

  Third, the flange 6 is inclined in the moving direction of the movable frame 4 during the soldering operation of the substrate 1, and the tip surface of the chip 7 is in contact with the substrate 1 with respect to the axis of the flange 6. It is characterized by being inclined.

  The fourth feature is that a feeding means 9 for feeding the lead wire 21 or the linear solder 11 coated with solder on the chip side is provided.

Fifth, at least the tip side of the chip 7 is made of molybdenum or a molybdenum alloy .

Sixth, there is a soldering method in which a soldering operation is performed by a chip 7 that is ultrasonically vibrated by the vibration from the vibrator 12 and heated by the heating means 8, and the chip 7 is constituted by a conductor, and by electromagnetic induction The heating means 8 is configured by a coil that generates heat by generating an electromotive force, and a flange 6 having the tip 7 on the tip side is inserted into the inner peripheral side of the coil 8. By forming a clearance between the coil 7 and the inner peripheral surface of the coil 8, the chip 7 and the coil 8 are brought into a non-contact state, and the chip 7 is ultrasonically vibrated in the non-contact state.

  According to the present invention, since the chip itself made of a conductor generates heat by electromagnetic induction, it becomes possible to quickly and efficiently heat the entire chip without substantially changing the vibration characteristics of the chip. There is an effect that can be performed more smoothly.

  In addition, if the electromagnetic induction means is constituted by a coil and the tip having the tip on the tip side is inserted into the inner peripheral side of the coil and the tip is vibrated ultrasonically, the tip can be more quickly generated by a large electromotive force. Can be heated, and the scissors are arranged using the space on the inner peripheral side of the coil, so that the entire structure can be made compact.

  Furthermore, if a scissors is inserted into the inner peripheral side of the coil so as not to come into contact with the coil, the ultrasonic vibration of the chip prevents the member constituting the heating means from being damaged, and the heating means is configured. This eliminates the trouble of mounting the member to be mounted on the chip side, and makes it possible to keep the manufacturing cost low.

Incidentally, a conductor having at least tip end side with high heat transfer rate of the chip, be constructed specifically by molybdenum or molybdenum alloy, thereby improving the efficiency of the wear resistance and thermal conductivity of the chip, the chip more smoothly Ultra There is an effect that the sound wave can be vibrated.

It is a side view which shows typically the structure of the soldering apparatus to which this invention is applied. It is a principal part enlarged view of the soldering apparatus which shows the structure of a chip | tip and a heating means. It is a principal part side view of the bag which shows another Example.

Hereinafter, embodiments of the present invention will be described based on illustrated examples.
FIG. 1 is a side view schematically showing a configuration of a soldering apparatus to which the present invention is applied, and FIG. 2 is an enlarged view of a main part of the soldering apparatus showing a configuration of a chip and heating means. The illustrated soldering apparatus places a substrate (base material) 1 and slides in a wiring direction (front-rear direction) with respect to a mounting table 3 constituting a part of a fixed frame 2 and the substrate 1 on the mounting table 3. Heating means for heating the movable frame 4 that moves, the vertical ridge 6 that is supported by the movable frame 4 so as to be movable up and down, and the tip (tip) 7 side provided at the lower end that is the tip of the ridge 6 8 and a feeding device (feeding means) 9 for feeding linear solder (thread solder) 11 to the chip 7 side.

  The substrate 1 is made of an inorganic material such as ITO (indium tin oxide), glass, ceramic, oxide film, or a metal with difficulty soldering used as transparent power, and is formed in a shape in a plan view.

  The flange 6 includes the tip 7 on the distal end side, the vibrator 12 on the proximal end side, and the vertical direction in which the proximal end is integrally connected to the vibrator 12 and the distal end is integrally connected to the chip 7. And a column-shaped horn 13 that extends in the direction of the wiring, and moves in the wiring direction integrally with the movable frame 4 and moves up and down with respect to the movable frame 4.

  The vibrator 12 is formed in a cylindrical shape in the vertical direction, has an electrostrictive element 12a such as a piezo in the middle, and is configured to vibrate ultrasonically by high-frequency power generated from an ultrasonic oscillator (not shown). ing.

  The horn 13 is configured to transmit the ultrasonic vibration from the vibrator 12 to the chip 7 side by propagating from the vibrator 12 side part to the chip 7 side part through the midway part. The location is an amplifying portion 16 that is formed in a tapered shape with a diameter that decreases from the proximal end to the distal end side, which is substantially the same diameter as the transducer 12, and amplifies the amplitude of the ultrasonic vibration. The propagation part 17 is formed in a cylindrical shape having a diameter substantially the same as the tip diameter, which is the minimum diameter of the amplification part 16.

  The chip 7 is formed in a vertical cylindrical shape having a diameter smaller than the diameter of the vibrator 12 and larger than the diameter of the propagation portion 16 of the horn 13, and the propagation surface 17 of the horn 13 is the R surface 6 a. Are connected smoothly.

Among the shapes trowel of 6, at least the horn 13 and the chip 7 is constituted by iron or copper which is a conductor, in particular, the chip 7 is at least the tip portion 7a is higher heat transfer guide of such as molybdenum (Mo) or a molybdenum alloy It is comprised by the conductor which has a rate. In particular, molybdenum, wear resistance was good, the efficiency of thermal conduction is high, has excellent characteristics as a conductor, an ultrasonic vibration properties are also good materials. The entire chip 7 may be made of molybdenum, molybdenum alloy, or the like, or the surface of the chip 7 may be coated with molybdenum, molybdenum alloy, or the like.

  The feeding device 9 is composed of a reel around which the thread solder 11 is wound, and the thread solder 11 fed from the reel 9 is inserted into the inner peripheral side of the guide cylinder 18 that is a guide member. A space is guided between the chip 7 and the substrate 1. Incidentally, when the reel 9 is rotationally driven, the thread solder 11 wound around the reel 9 is sequentially fed out to the guide tube 18 side.

  The heating means 8 is composed of a cylindrical coil extending in the vertical direction, and the coil 8 is substantially fixed in shape and is not elastically deformed. The coil 8 is supported and fixed to the movable frame 4 side by attaching the linear conductor 8 a constituting the coil 8 to the movable frame 4 side via the support bracket 19. Incidentally, the conductor 8 a may be supported on a member that supports the flange 6 on the movable frame 4, and the coil 8 may be moved up and down integrally with the flange 6.

  The above-mentioned flange 6 is inserted from above into the inner peripheral side of the coil 8, and during the soldering operation in which the chip is ultrasonically vibrated while the solder wire 11 is pressed against the substrate 1 by the tip of the chip 7, 7 is located on the inner peripheral side of the coil 8, and the inner peripheral surface of the coil 8 and the outer peripheral surface of the tip 7 of the flange 6 are close to each other in a non-contact state.

  When an AC voltage is applied to the coil 8, the magnetic field on the inner peripheral side of the coil 8 changes with time, and an electromotive force is generated in the chip 7, the horn 13, and the like composed of conductors. Due to this electromotive force, an overcurrent is generated in the chip 7 or the horn 13, and the chip 7 itself generates heat due to Joule heat. That is, the coil 8 constitutes an electromagnetic induction means, and this electromagnetic induction means 8 serves as a heating means for induction heating the chip 7.

  The soldering method using the soldering apparatus having the above configuration will be described. After the chip 7 is moved upward so as to be separated from the substrate 1 on the mounting table 3, the movable frame 4 is slid to move the tip of the chip 7. Is positioned at a soldering position of the substrate 1. Subsequently, the feeding device 9 feeds the thread solder 11 between the chip 7 and the substrate 1, presses the fed thread solder 11 against the substrate 1 by the tip of the chip 11, and the chip 7 is induced by induction heating by the coil 8. The yarn solder 11 is welded onto the substrate 1 by generating heat and oscillating ultrasonically with the vibrator 12.

  Then, the movable frame 4 is slid and driven, and the collar 6 is moved in the wiring direction, whereby a strip-like solder extending in the wiring direction is formed on the substrate 1. Incidentally, a lead wire (conductive wire) is placed on the belt-like solder of the substrate 1 and heated to solder the lead wire to the substrate 1.

  According to the present soldering apparatus configured as described above, the temperature of the chip 7 can be quickly raised without unevenness by causing the chip 7 itself to generate heat by electromotive force caused by electromagnetic induction. It is prevented that the efficiency of the soldering operation is reduced due to insufficient heating. Further, since the peripheral surface of the chip 7 is covered with the coil 8, heat radiation from the chip 7 side is suppressed, and the chip 7 can be heated more efficiently.

  The welding member fed from the feeding device 9 and welded to the substrate 1 has been described as the thread solder 11. However, instead of the thread solder 11, a lead wire (conductive wire) 21 whose surface is coated with solder is used. May be. In this case, when the above-described method is performed, the lead wire 21 is soldered on the substrate 1 along the wiring direction. Incidentally, in this case, a holding member 22 that holds and holds the distal end portion 21a of the lead wire 21 that is extended and protrudes from the substrate 1 may be provided on the mounting bracket 23 fixed to the fixed frame side.

  If the leading end portion 21a of the lead wire 21 is held by the holding member 22, the lead wire 21 can be moved without causing the feeding device 9 to rotate by sliding the movable frame 4 away from the holding member 22. It becomes possible to feed out from the feeding device 9.

Next, points different from the above-described example will be described with reference to FIG.
FIG. 3 is a side view of an essential part of a bag showing another embodiment. The trough 6 illustrated inclines toward the moving direction side of the movable frame 4 during the soldering operation from the distal end portion toward the proximal end portion. In addition to this, the tip surface of the chip 7 is inclined with respect to the axis of the flange 6 so as to come into surface contact with the substrate 1, thereby reducing the movement resistance of the flange 6 during the soldering operation. The

1 Substrate (base material)
4 Movable frame 6 ７ 7 Tip (tip)
8 Coils (heating means, electromagnetic induction means)
9 Feeding device (feeding means, reel)
11 Yarn solder (Linear solder)
12 vibrator 21 lead wire (conductive wire)

Claims (6)

  An oscillator (12), a chip (7) that is ultrasonically vibrated by transmission of vibration from the oscillator (12), and a heating means (8) that heats the chip (7) are provided, and the chip (7) A soldering apparatus for performing a soldering operation, wherein the coil (7) is made of a conductor, and a coil that generates heat by generating electromotive force by electromagnetic induction is the heating means (8), A flange (6) having the tip (7) on the tip side is inserted into the inner peripheral side of the coil (8), and a clearance is provided between the outer peripheral surface of the tip (7) and the inner peripheral surface of the coil (8). A soldering device for forming the chip (7) and the coil (8) in a non-contact state by forming and ultrasonically vibrating the chip (7) in the non-contact state.   A movable frame (4) slidably moved in the wiring direction of the substrate (1) is provided, the hook (6) is supported on the movable frame (4) so as to be capable of ultrasonic vibration, and the coil (8) is movable frame. The soldering device according to claim 1, wherein the flange (6) ultrasonically vibrates with respect to the movable frame (4) and the coil (8) by being fixed to the (4) side.   The flange (6) is inclined in the moving direction of the movable frame (4) during the soldering operation of the substrate (1), and the tip surface of the chip (7) is in surface contact with the substrate (1). The soldering apparatus according to claim 2, wherein the soldering apparatus is inclined with respect to the axis of (6).   4. The soldering apparatus according to claim 1, further comprising feeding means (9) for feeding out a lead wire (21) or a linear solder (11) coated with solder on the chip side. The soldering device according to claim 1, 2, 3, or 4, wherein at least the tip side of the chip (7) is made of molybdenum or a molybdenum alloy .   A soldering method in which a soldering operation is performed by a chip (7) that is ultrasonically vibrated by vibration from a vibrator (12) and heated by a heating means (8), and the chip (7) is constituted by a conductor. The heating means (8) is constituted by a coil that generates heat by electromagnetic induction to generate heat from the tip (7), and the flange (6) having the tip (7) on the tip side is provided with a coil (8). ) Is inserted into the inner peripheral side of the chip (7) and a clearance is formed between the outer peripheral surface of the chip (7) and the inner peripheral surface of the coil (8), so that the chip (7) and the coil (8) are not contacted with each other. A soldering method in which the chip (7) is ultrasonically vibrated in a non-contact state.

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