JP2005324247A - Ceramic chip for soldering iron and its production method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce damage and to reduce the frequency of exchange even in the case a lead-free soldering material is used. <P>SOLUTION: The ceramic chip A provided at the tip of a soldering iron or the tip of a soldering robot comprises: a body 1 formed into a prescribed shape and provided with a point part composed of a metal part 2 for performing soldering at the tip; a heater 3 arranged at a position separated from the point part (metal part 2) in the body 1 and heating the metal part 2; and a thermocouple sensor 4 arranged at a prescribed position between the metal part 2 in the body 1 and the heater 3 and detecting the temperature of the metal part 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a ceramic chip for a soldering iron attached to the tip of a soldering iron or a soldering robot, and a method for manufacturing the ceramic chip for soldering iron.

  Soldering is used when joining printed circuit board wiring and components, joining transformers and coils, and joining metal to metal. The solder material used for such soldering work is generally eutectic solder containing lead.

  However, recently there has been a change in the direction to use lead-free solder that does not add lead as a solder material, so that a predetermined soldering operation is performed using a soldering iron with a metal chip attached. It has become.

  The lead-free solder material is mainly composed of tin. When this lead-free solder material is used, metal melting in the metal chip is faster than conventional eutectic solder, the metal chip is more damaged, and replacement of the metal chip due to damage There is a problem that the frequency is high, and as a result, there is a problem that the cost required for the metal tip and the cost required for replacing the metal tip are increased.

  For this reason, even when a lead-free solder material is used, it is required to develop a chip that has little damage and can reduce the replacement frequency.

  A ceramic chip for a soldering iron according to the present invention that solves the above problems is a ceramic chip for a soldering iron provided at the tip of a soldering iron or the tip of a soldering robot, and is molded into a predetermined shape and soldered to the tip. A ceramic chip body provided with a point portion made of a metal portion to be attached, a heater disposed at a position spaced apart from the point portion in the ceramic chip body, and a heater for heating the point portion; The thermoelectric sensor is disposed at a predetermined position between the point portion and the heater and detects the temperature of the point portion.

  In the above-mentioned ceramic chip for soldering iron, the metal part constituting the point part provided at the tip of the ceramic chip body is plated with a metal having wettability to the solder, sprayed, metal fitting of a rod-shaped material, It is preferable that they are integrated by any means of pressure welding, induction baking, sintering, or mixing powdered metal into the ceramic raw material and sintering.

  In any of the above-mentioned soldering ceramic chips, the base material constituting the ceramic chip body is alumina, silica, zirconia, aluminum titanate, silicon nitride, aluminum nitride, aluminum carbonate, silicon carbide, aluminum nitride, artificial sapphire , A ceramic made of a material selected from artificial ruby and artificial diamond, and is preferably formed by sintering a heater material around the ceramic material or winding a heater material around the surface.

  In any one of the above ceramic chips for soldering, it is preferable that a thermocouple sensor is sintered or retrofitted on a point portion provided at the tip of the ceramic chip body or in the vicinity of the point portion.

  Further, in any one of the above ceramic chips for a soldering iron, a hollow portion is formed in the ceramic chip main body along the longitudinal direction, and the surface from the hollow portion is disposed between the point portion of the ceramic chip main body and the heater arrangement position. Further, a metal pipe is arranged from the periphery of the hole formed in the ceramic chip body to the tip portion, and the inert gas supplied through the hollow portion is ejected from the hole and It is preferable to circulate in the direction of the point portion through a metal pipe.

  In any of the above-described ceramic chips for a soldering iron, the heater terminal and the thermocouple sensor terminal mounting portion provided on the ceramic chip may have the same size and shape. However, since there is a possibility that the + and-terminals of the thermocouple sensor may be mistakenly inserted, it is preferable to form the ceramic chip body with different dimensions and shapes on the rear end side.

  The method of manufacturing a ceramic chip for a soldering iron according to the present invention includes a step of patterning a heating element in advance at a position corresponding to the body portion of the ceramic chip body and molding the ceramic chip body with the ceramic material. After the protective layer is formed, the shape of the ceramic chip body is formed, and the formed ceramic chip body is sintered.

  In the ceramic chip for soldering iron (hereinafter simply referred to as “ceramic chip”) according to the present invention, a heater is disposed at a position separated from the point portion in the ceramic chip body in which the point portion at the tip made of a metal portion is formed. Since a thermocouple sensor that detects the temperature of the point part is arranged at a predetermined position between the point part and the heater, the point part can be heated without connecting the heater directly to the point part. The temperature of the metal part can be detected by a thermocouple sensor arranged at a predetermined position between the part and the heater.

  Since the metal part constituting the point part is separated from the heater, even if the metal melts and damages as the number of soldering operations increases, only the metal constituting the point part is repaired by machining. I can do it. Moreover, since the point part and the heater are separated, the heater current does not leak to the metal of the point part. For this reason, even if it is a case where an electronic component is soldered, an electric current does not flow into a soldering part but a safe soldering operation | work with respect to an electronic component can be advanced.

  The ceramic chip body is made of ceramic, and the tip of the ceramic chip body is plated, sprayed, fitted with rod-shaped material, pressure welded, induction-baked, sintered, etc. Since the point part consisting of the metal part is provided by adopting the method of the above, even if it is damaged by using lead-free solder material, the metal constituting the point part is repaired by cutting or grinding I can do it.

  In particular, the metal of the point part is cut or ground by fitting a metal material with a rod-like part to the ceramic body or by integrating it by means of pressure welding, induction baking, sintering, etc. A new metal surface can be exposed. For this reason, even if the metal is melted and damaged by using a lead-free solder material, it is possible to repair it by applying the above processing, and the cost as a part and the labor required for replacement Can be reduced.

  The material constituting the ceramic chip body is selected from alumina, silica, zirconia, aluminum titanate, silicon nitride, aluminum nitride, aluminum carbonate, silicon carbide, aluminum nitride, artificial sapphire, artificial ruby and artificial diamond. When the heater material is sintered around the selected ceramic material or the heater material is wound around the surface, the heater can be processed in the same process as the production of the ceramic chip body.

  In addition, when a thermocouple sensor is sintered or retrofitted to a point part consisting of a metal part provided at the tip of the ceramic chip body, the temperature of the point part itself that is actually soldered can be detected, so it is accurate. Temperature control can be realized.

  Also, when the ceramic chip body is formed in a hollow shape, a hole from the hollow part toward the surface is formed on the tip side, and a metal pipe that induces the flow of inert gas is arranged at the tip part of the ceramic chip In this case, by supplying an inert gas to the hollow portion, the inert gas can be heated by a heater and ejected from the hole and guided to the tip side of the ceramic chip body along the metal pipe. For this reason, it becomes possible to protect the point part which performs a soldering operation | work with an inert gas, and can aim at stabilization of the quality of a soldering part.

  Also, the heater terminal and thermocouple sensor terminal mounting part provided on the ceramic chip were formed with different dimensions and shapes on the rear end side of the ceramic chip to prevent incorrect insertion of the + and-terminals of the thermocouple sensor. In this case, when the worn ceramic chip is replaced, wiring of the heater and thermocouple sensor can be performed quickly and reliably.

  Further, when manufacturing the ceramic chip, when the ceramic chip body is formed of a ceramic material, a heating element is patterned in advance at a position corresponding to the body part of the ceramic chip body, and a protective layer is formed on the heating element. By forming the shape of the ceramic chip main body and further sintering the formed ceramic chip main body, the sensor chip main body and the heater can be processed in a simple process.

  Hereinafter, the configuration of a ceramic chip according to the present invention will be described with reference to the drawings. FIG. 1 is a diagram schematically illustrating the configuration of a ceramic chip according to the present invention. FIG. 2 is a diagram for explaining an application example of a ceramic chip.

  The ceramic chip A shown in FIG. 1 is a ceramic material selected from alumina, silica, zirconia, aluminum titanate, silicon nitride, aluminum nitride, aluminum carbonate, silicon carbide, aluminum nitride, artificial sapphire, artificial ruby, and artificial diamond. The rod-shaped ceramic ceramic chip main body (hereinafter simply referred to as “main body”) 1 is formed. The main body 1 includes a rod-like body portion 1a, a tapered portion 1b formed on the front end side of the body portion 1a, and a terminal portion 1c formed on the rear end side of the body portion 1a. Yes.

  A point portion made of the metal portion 2 is provided at a further tip portion of the tapered portion 1 b of the main body 1. The metal portion 2 is formed of a metal having good wettability with respect to the solder, and is processed to be described later and integrated with the tip end side of the tapered portion 1b.

  The metal having good twistability with respect to the solder constituting the metal portion 2 is not particularly limited as long as it can exhibit good wettability with respect to the solder when soldering. Typical examples of such metals include metals such as platinum, rhodium, silver, silver palladium, gold, iron, copper, nickel, tungsten, and molybdenum, and alloys thereof. Can be used.

  As a method of integrating the metal constituting the metal part 2 with the tip part of the taper part 1b of the main body 1, there is a surface processing method such as plating or thermal spraying. In the metal part 2 configured by adopting this processing method, It is formed in layers on the surface of the ceramic that is the base material of the tapered portion 1b.

  When the metal part 2 is configured, a preselected metal is formed in a rod shape or a pellet shape, and a base such as a hole or a flat surface is processed in the taper part 1b, and these metals are used as the base. On the other hand, it is possible to fit, press-fit, and induction-bake, including press fitting and shrink fitting. In this case, since the metal part 2 is formed of the same metal up to the center, it is possible to form a new surface by exposing the base material by cutting or grinding the surface along the taper part 1b.

  Furthermore, when the metal part 2 is configured, there is a method in which a rod-shaped or pellet-shaped metal is wound and sintered at the stage of forming the kneaded ceramic material into the material of the main body 1 (for example, a round bar-shaped material). Alternatively, the selected metal may be formed into a powder or granular form and mixed with the ceramic raw material, and after kneading the ceramic raw material, the raw material of the main body 1 may be molded and sintered.

  When forming the metal part 2, which metal is used and which method is used for integration is not limited, depending on the selected metal and the work purpose of the ceramic chip. It is preferable to select an optimum method.

  For example, the metal part 2 can be formed by plating the surface of the ceramic base material of the taper part 1b with gold or silver, and can also be formed by plating molybdenum, tungsten or copper. Similarly, a bar made of any one of the metals is formed, and a hole for fitting the bar is formed at the tip of the tapered portion 1b of the main body 1, and the bar is press-fitted into the hole and integrated. It is possible to integrate the rods formed of the metal when the main body 1 is sintered, and to integrate them together with the sintering. Further, the metal can be sprayed.

  In addition, the taper 1b in which the metal part 2 is integrated does not necessarily have a structure that cannot be separated from the body 1a of the main body 1. For example, the main body 1 includes a cylindrical portion (body 1a) and a tapered portion ( The ceramic chip A may be formed by separately manufacturing the taper portion 1b) and integrating them by means such as press fitting and shrink fitting.

  A heater portion 3 is provided in a portion of the body portion 1a of the main body 1 that is close to the tapered portion 1b. The heater unit 3 has a heating element wound around the body 1a, or a heating element is wound when the main body 1 is sintered, or a ceramic material kneaded prior to sintering the main body 1 is formed in a flat plate shape. After patterning at the time, it is formed by winding and sintering, and the terminals 3a and 3b are extended to the terminal portion 1c of the main body 1 and connected to an external line (not shown).

  In particular, by forming a gap between the heater part 3 and the metal part 2 without connecting them directly, the heat from the heater part 3 is transferred to the metal part 2 through the main body 1, but the heater part 3 The applied current does not leak to the metal part 2. For this reason, it can be preferably used for soldering electronic components.

  The heater unit 3 has a function of heating the ceramic base material of the main body 1. For this reason, the heater 3 should just have the said function, and does not necessarily need to be a heating wire. Examples of the heater 3 include a high frequency heater, a laser (semiconductor laser, Nd: YAG laser, etc.), a light beam, hot air, and the like.

  However, in this embodiment, the heater unit 3 is constituted by a nichrome wire heater.

  The detection part of the thermocouple sensor 4 is provided in the taper part 1b of the main body 1 at a position as close as possible to the metal part 2. This detector measures the temperature of the metal part 2 and controls the energization of the heater part 3 based on the measurement result so that the temperature of the metal part 2 is within a substantially constant range. The terminals 4a and 4b of the thermocouple sensor 4 are extended to a terminal portion 1c provided at the rear end of the main body 1 and connected to an external line (not shown).

  The thermocouple sensor 4 may be any sensor as long as the measurement current can be changed according to the temperature, and the material is not limited. In particular, the thermocouple 4 detects the temperature of the metal part 2, and the detection part can detect the more accurate temperature as it approaches the metal part 2. Therefore, the detection part of the thermocouple sensor 4 may be in contact with the metal part 2, and in this case, it is possible to detect an accurate temperature and realize good temperature control.

  For example, the metal part 2 is constituted by the detection part of the thermocouple sensor 4, that is, the metal part 2 is constituted by a metal pair such as platinum-platinum rhodium, chromel-alumel, iron-constantan, etc. constituting the thermocouple sensor 4. Thus, it is possible to realize extremely accurate temperature control. Therefore, as the metal constituting the metal part 2, it is possible to use a metal capable of exhibiting the function as the thermocouple sensor 4 in addition to the metal group described above.

  When the detection part of the thermocouple sensor 4 is used as the metal part 2, since the temperature of the solder can be directly detected, which is advantageous when controlling the temperature, a current flows through the metal part 2. However, this current is extremely weak and does not pose a major problem when soldering electronic components.

  A hole 5 is formed in the center of the body 1a of the main body 1 as a hollow portion in the longitudinal direction and the bottom reaches a position close to the taper 1b, and a plurality of holes communicated with the hole 5 in the taper 1b. 6 is formed. The hole 5 opens at the terminal portion 1c of the main body 1 and is connected to an inert gas supply means (not shown) having a function of supplying an inert gas such as nitrogen gas or argon gas.

  A stainless steel pipe 7 is provided from the body portion 1a of the main body 1 to the tapered portion 1b. The pipe 7 has a closed portion 7a formed at the end on the body portion 1a side (terminal portion 1c side) and a tapered portion 7b formed at the distal end side. A gap 8 having the measured dimensions is formed.

  For this reason, the flow direction of the inert gas injected from the hole 6 formed in the tapered portion 1b through the hole 5 formed in the main body 1 is changed by the pipe 7 along the surface of the tapered portion 1b. It is possible to regulate in the direction.

  In the present invention, it is not always necessary to form the holes 5 and the holes 6 in the main body 1, and there is no problem even if the main body 1 is simply formed in a rod shape.

  In the ceramic chip A configured as described above, it is not shown on the terminals 3a and 3b of the heater 3 from the rear end side (terminal portion 1c side) with respect to a hand that is not shown in the figure or attached to the robot. An energizing means is connected, a temperature control means (not shown) is connected to the terminals 4a and 4b of the thermocouple sensor 4, and an inert gas supply means is connected to the hole 5, and then the heater 3 is energized and the thermocouple sensor 4 is energized. Thus, it is possible to perform a soldering operation on a target portion while measuring and controlling the temperature of the metal part 2.

  In particular, if the wettability of the metal part 2 at the point part deteriorates as the number of soldering operations increases, or the shape changes as the metal part 2 is consumed, the metal part By cutting or grinding the surface of 2 to expose a new metal surface, it is possible to improve wettability or to restore the shape.

  In the present invention, the shape of the tip portion (point portion) of the main body 1 constituting the ceramic chip A is not limited to the conical shape of FIG. 1, but is a 45-degree cut type, U-shape, V-shape. , W type, driver type, or other shapes. That is, the shape of the main body 1 should be appropriately set according to the intended work content and the shape of the object to be soldered, and should not be set uniquely.

  Next, a method for manufacturing the ceramic chip A will be briefly described. The main body 1 constituting the ceramic chip A is formed of ceramic. The ceramic material forming the main body 1 is selected from the above-mentioned alumina, silica, zirconia, aluminum titanate, silicon nitride, aluminum nitride, aluminum carbonate, silicon carbide, aluminum nitride, artificial sapphire, artificial ruby, artificial diamond, A clay-like material obtained by kneading the selected ceramic material powder under optimum conditions is formed into the shape of the main body 1.

  At this time, it is not always necessary to form the main body 1 as a body portion 1a and a taper portion 1b continuous. The main body 1 has a thickness corresponding to the outer diameter of the body portion 1a and the length of the main body 1 ( You may shape | mold as a round bar-shaped raw material with the length which added the length of the trunk | drum 1a and the length of the taper part 1b.

  Further, the kneaded ceramic material is formed into a flat plate shape, and a heating element constituting the heater 3 is patterned on a portion corresponding to the body portion 1a, and then this flat plate is wound to form a round bar shape. It is possible to form the main body 1 in which the heater 3 is formed in advance by sintering at a temperature.

  In addition, when a heating element is patterned on a ceramic material formed into a flat plate shape, a metal bar constituting the metal portion 2 is arranged at a portion corresponding to the point portion, and the flat plate is wound and formed in this state. It is also possible to sinter.

  When the material formed and sintered as described above has a round bar shape, the portion corresponding to the taper portion 1b in the material is cut into a taper shape to form the metal portion 2 and the taper portion 1b. In addition, the ceramic chip A can be manufactured by forming the terminal portions 3a, 3b, 4a, and 4b on the rear end side of the body portion 1a.

  Next, different examples of the ceramic chip will be described with reference to FIG. In the figure, the same reference numerals are given to the same portions as those in the above-described embodiment or portions having the same functions, and the description thereof is omitted.

  The ceramic chip B shown in FIG. 2A has an elliptical cross section of the main body 1, and a terminal portion 1 c is formed on the rear end side of the main body 1. In the terminal portion 1c, the terminals 3a and 3b of the heater 3 and the terminals 4a and 4b of the thermocouple sensor 4 are formed to have different width dimensions, and wiring to be connected when the ceramic chip B is replaced is provided. There is no confusion.

  The ceramic chip C shown in FIG. 2B has a main body 1 having a circular cross section. Even in the ceramic chip C configured as described above, the terminals 3a and 3b of the heater 3 and the terminals 4a and 4b of the thermocouple sensor 4 are formed with different width dimensions, and are connected when they are replaced. The wiring should not be confused.

  The ceramic chip D shown in FIG. 2C has a main body 1 having a square cross section. Even in the ceramic chip D configured as described above, the terminals 3a and 3b of the heater 3 and the terminals 4a and 4b of the thermocouple sensor 4 are formed with different width dimensions, and are connected when they are replaced. The wiring should not be confused.

  The ceramic chip E shown in FIG. 4D has a cross section of the main body 1 formed in a triangle. Even in the ceramic chip E configured as described above, the terminals 3a and 3b of the heater 3 and the terminals 4a and 4b of the thermocouple sensor 4 are formed with different width dimensions, and are connected when they are replaced. The wiring should not be confused.

  The ceramic chips A to E according to the present invention can be used with either a soldering iron of a type that is used by an operator by hand or a soldering iron of a type that is used by being attached to a robot. It is advantageous to realize cost reduction.

It is a figure which illustrates typically the composition of the ceramic chip concerning the present invention. It is a figure explaining the example of application of a ceramic chip.

Explanation of symbols

A to E Ceramic chip 1 Main body 1a Body 1b Tapered portion 1c Terminal portion 2 Metal portion 3 Heater portion 3a, 3b Terminal 4 Thermocouple sensor 4a, 4b Terminal 5 Hole 6 Hole 7 Pipe 7a Closed portion 7b Tapered portion 8 Gap

Claims (7)

A ceramic chip body for a soldering iron provided at a tip of a soldering iron or a soldering robot, and a ceramic chip body provided with a point portion formed of a metal portion which is molded into a predetermined shape and soldered to the tip; A heater that is disposed at a position spaced apart from the point portion in the ceramic chip body and that heats the point portion; and a point that is disposed at a predetermined position between the point portion and the heater in the ceramic chip body. And a thermocouple sensor for detecting the temperature of the part. The metal part constituting the point part provided at the tip of the ceramic chip main body is plated, sprayed, metal fitting of bar material, pressure welding, induction baking, sintering, or powder. 2. The ceramic chip for a soldering iron according to claim 1, wherein the metal is mixed into the ceramic raw material and integrated by any means of sintering. The base material constituting the ceramic chip body is selected from alumina, silica, zirconia, aluminum titanate, silicon nitride, aluminum nitride, aluminum carbonate, silicon carbide, aluminum nitride, artificial sapphire, artificial ruby and artificial diamond. The ceramic chip for a soldering iron according to claim 1 or 2, wherein the ceramic material is a ceramic material comprising a heater material sintered on the ceramic material or a heater material wound around the ceramic material. The ceramic chip for a soldering iron according to any one of claims 1 to 3, wherein a thermocouple sensor is sintered or retrofitted to a point portion provided at a tip of the ceramic chip body or in the vicinity of the point portion. . A hollow portion is formed in the ceramic chip body along the longitudinal direction, and a hole is formed from the hollow portion to the surface between the point portion of the ceramic chip body and the position where the heater is disposed. A metal pipe is arranged from the periphery of the formed hole to the tip, so that the inert gas supplied through the hollow portion is ejected from the hole and circulated in the direction of the point portion through the metal pipe. The ceramic chip for a soldering iron according to any one of claims 1 to 4, wherein the ceramic chip is for a soldering iron. 6. The heater terminal and the thermocouple sensor terminal mounting portion provided on the ceramic chip are formed with different sizes and shapes on the rear end side of the ceramic chip body. A ceramic chip for a soldering iron according to any one of the above. When forming the ceramic chip body with the ceramic material, after previously forming a heating element in a position corresponding to the body portion of the ceramic chip body and forming a protective layer on the heating element, the shape of the ceramic chip body is formed, Furthermore, the method for producing a ceramic chip for a soldering iron, comprising sintering the molded ceramic chip body.

Images