JP5489646B2 - Soldering method and apparatus - Google Patents

Description

  The present invention relates to a soldering method and apparatus.

  Soldering means for feeding the lead wire by the feeding means, bringing the lead wire into contact with the substrate side, melting the supplied solder by heating the lead wire by the heating means, and soldering the lead wire to the substrate side However, as an improvement of this, the soldering method and apparatus shown in Patent Document 1 in which solder is previously attached to the surface of the substrate by melting or the like and the lead wire is brought into contact with the solder have become known. This soldering method and apparatus eliminates the need for a member for supplying solder to the lead wire and the substrate side during the soldering operation, simplifying the structure, and solder previously attached to the substrate surface to lead It functions as an adhesive layer between the wire and the substrate surface, and the peel strength of the lead wire is improved.

JP 2001-135842 A (FIG. 4-5)

  In the soldering method and apparatus of the above-mentioned literature, a heating means for heating the lead wire by the scissors heated by the heater is configured, and the lead wire is moved in the wiring direction while being pressed against the surface side of the substrate by the scissors. While soldering on the board surface is peeled off by the wrinkles, there is a problem that the efficiency of the soldering work of the lead wire is reduced. On the other hand, in order to prevent the peeling of the solder adhered to the board surface, When the pressing force is weakened, there is a problem that the efficiency of the soldering work is lowered because the lead wire cannot be heated well.

  The present invention solves the above-mentioned problems, and makes the lead wire drawn out contact the solder previously attached to the surface of the substrate, and heats the lead wire to melt the solder and perform soldering. An object of the present invention is to provide a soldering method and apparatus capable of preventing the peeling of solder attached to a substrate and performing an efficient soldering operation.

In order to solve the above-mentioned problems, first, the lead wire 4 is fed out by the feeding means 6, the lead wire 4 is brought into contact with the solder 3 previously attached to the surface of the substrate 2, and the lead wire 4 is heated by the heating means 8. to melt the solder 3 by heating, the lead wire 4 to a soldering method for soldering to the substrate 2 side, the lead wire causes an electromotive force by Ri lead wire 4 to the electromagnetic induction 4 The heating means 8 is constituted by electromagnetic induction means for heating the electromagnetic induction means 8 , and the electromagnetic induction means 8 is a coil, and by electromagnetic induction by the coil 8 positioned in a non-contact state immediately above the lead wire 4 to be fed out. The lead wire 4 is heated .

Second, the lead wire 4 is intermittently soldered to the substrate 2 at predetermined intervals by alternately repeating the movement and energization of the coil 8 .

Third, the solder 3 is formed in advance only at the soldering points P, which are portions where the lead wires 4 are soldered intermittently on the surface of the substrate 2 .

Fourthly, a heating means 8 for feeding the lead wire 4 and a heating means 8 for heating the lead wire 4 brought into contact with the solder 3 previously attached to the surface of the substrate 2 are provided. Is a soldering device for melting the solder 3 and soldering the lead wire 4 to the substrate 2 side, and generating an electromotive force in the lead wire 4 by electromagnetic induction to heat the lead wire 4 The heating means 8 is configured as described above , and the electromagnetic induction means 8 is a coil that performs electromagnetic induction heating of the lead wire 4 and is positioned in a non-contact state immediately above the lead wire 4 that is fed out. It is said.

Fifth, the coil 8 is formed in a cylindrical shape extending in the vertical direction .

Sixth, a columnar magnetic body 12 is inserted on the inner peripheral surface side of the coil 8, and the magnetic body 12 is made of ferrite .

Seventh, a pressing means 7 for pressing the lead wire 4 to contact the solder on the surface of the substrate 2 is provided, and a pressing roller for pressing the lead wire 4 to the substrate 2 side is rotatably supported to thereby rotate the pressing means. 7, and the roller 7 is arranged with respect to the coil 8 only on the upstream side of the downstream side and the upstream side of the lead wire 4 .

Eighth, it is provided with a feeding means 6 for feeding out the lead wire 4 and a heating means 8 for heating the lead wire 4 brought into contact with the solder 3 previously attached to the surface of the substrate 2. Is a soldering device for melting the solder 3 and soldering the lead wire 4 to the substrate 2 side, and generating an electromotive force in the lead wire 4 by electromagnetic induction to heat the lead wire 4 The heating means 8 is constituted by the electromagnetic induction means 8 which is positioned in a non-contact state directly above the lead wire 4 to be fed out and is long in the wiring direction of the lead wire 4, C-shaped or U-shaped The lead wire 8a is bent in a letter shape .

  According to the present invention, when the lead wire is heated by bringing the lead wire into contact with the solder previously adhered on the substrate, the non-contact state is caused by the electromotive force of the lead wire generated by the electromagnetic induction means constituting the heating means. Thus, the lead wire can be heated, so that the lead wire can be efficiently heated and the soldering operation can be smoothly performed while preventing the peeling of the solder adhered to the substrate.

  Also, by coating the surface of the lead wire with solder, there is an effect that the work of soldering the lead wire to the substrate can be performed more efficiently.

  Further, if the electromagnetic induction means is constituted by a coil and a columnar magnetic body, particularly ferrite, is inserted on the inner peripheral surface side of the coil, there is an effect that the lead wire can be heated more quickly.

  Furthermore, by providing a pressing means that presses the lead wire to contact the solder on the surface of the substrate, the lead wire can be reliably brought into contact with the solder on the substrate, so a more efficient soldering operation It can be performed.

  Further, by configuring the pressing means by rotatably supporting a pressing roller for pressing the lead wire to the base material side, the lead wire can be moved to the substrate side without peeling off the solder previously attached to the substrate surface. There is an effect that it can be pressed.

  If the pressing means is arranged only on the upstream side and the downstream side and the upstream side of the lead of the heating means, the configuration can be simplified and the manufacturing cost can be kept low. Incidentally, since the lead wire delivery downstream side of the heating means has already been soldered to the substrate, the need to press the lead wire against the substrate side is lower than the upstream side.

It is a conceptual diagram of the soldering apparatus to which this invention is applied. It is a top view which shows the structure of the board | substrate which solders a lead wire. It is a principal part conceptual diagram of the soldering apparatus which shows another embodiment of this invention. It is a principal part conceptual diagram of the soldering apparatus which shows the other example of a solder layer. It is a principal part conceptual diagram of the soldering apparatus which shows another embodiment of this invention.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
FIG. 1 is a conceptual diagram of a soldering apparatus to which the present invention is applied, and FIG. 2 is a plan view showing a configuration of a substrate for soldering lead wires. The soldering apparatus 1 shown in the figure is made of paste solder previously attached to the surface of a substrate 2 made of an inorganic material such as glass, ceramic, ITO (indium tin oxide), oxide film, or difficult-to-solder metal used for a panel. A lead wire 4 is soldered to a certain solder layer 3.

  The soldering apparatus 1 includes a feeding means 6 that feeds the lead wire 4 toward the solder layer 3 formed on the surface of the substrate 2 and a pressing member that presses and contacts the lead wire 4 against the solder layer 3 on the substrate 2. The main part is composed of the means 7 and the heating means 8 for heating the lead wire 4.

  The surface of the substrate 2 has a strip shape in which the solder layer 3 is formed in the wiring direction. The lead wires 4 drawn out on the strip-like solder layer 3 are sequentially placed. Incidentally, solder is also coated around the lead wire 4.

  The feeding means 6 inserts the reel 9 on which the lead wire 4 is mounted, and the lead wire 4 fed from the reel 9, and guides the lead wire 4 directly below the heating means 8 on the solder layer 3. A guide cylinder (guide member) 11 is provided.

  The pressing means 7 is constituted by a pressing roller that is rotatably supported. The pressing roller 7 and the pressing roller 7 are arranged so that the lead wire 4 fed from the feeding means 6 is pressed and brought into contact with the solder layer 3. A lead wire 4 is sandwiched between the front surface side of the substrate 2 (a solder layer 3 in the illustrated example). When the lead wire 4 is sequentially fed from the feeding means 6, the press roller 7 is rotated and the lead wire 4 is smoothly fed to the downstream side with little resistance. In the illustrated example, one pressing roller 7 is installed on each of the downstream side and the upstream side of the lead wire 4 of the heating unit 8.

  The heating device 8 is composed of a coil wound in a cylindrical shape in the vertical direction, and is disposed in close proximity to the lead wire 4 that is fed out in a non-contact state. A magnetic body 12 formed in a columnar shape in the vertical direction is inserted on the inner peripheral surface side of the coil 8. Specifically, the magnetic pair 12 is composed of a ferrite magnet made of a collection of crystals containing iron oxide, and the magnetic body 12 is also arranged so as not to contact the lead wire 4. . The magnetic body 12 may be made of austenitic stainless steel.

  When an AC voltage is applied to the coil 8 and an AC current is passed, the magnetic field around the lead wire 4 changes over time, and an electromotive force is generated in the lead wire 4, and the electromotive force causes an overcurrent in the lead wire 4. The lead wire 4 itself generates heat due to Joule heat. That is, the coil 8 serves as electromagnetic induction means for heating the lead wire 4 by induction heating.

  The soldering method by the soldering apparatus 1 will be described. The feeding means 6 composed of the reel 9 and the guide cylinder 11, the pressing means 7 composed of a pressing roller, and the heating means 8 composed of a coil are arranged in the wiring direction (in FIG. 1). It is configured to move together in the left direction. Specifically, the reel 9, the guide cylinder 11, the presser roller 7, the coil 8, and the ferrite 12 are attached and supported on a movable frame (not shown) that slides along the wiring direction.

  Then, by this movement and the rotational drive of the reel 9, the lead wire 4 fed out from the reel 9 in the direction opposite to the wiring direction is pressed and brought into contact with the solder layer 3 of the substrate 2 by the pair of pressing rollers 7 and 7. The pressed lead wire 4 is heated by induction heating by the coil 8, and the solder coated on the surface of the lead wire 4 and the solder of the solder layer 3 are melted by the heated lead wire 4 so that the solder on the lead wire 4 side is melted. The lead wire 4 is soldered to the substrate 2 in a state where mixing of the solder and the solder on the solder layer 3 side is minimized.

  In the present soldering apparatus 1 configured as described above, the lead wire 4 is heated by the temperature rise due to its own heat generation. Therefore, the lead wire is efficiently compared with the case where the lead wire 4 is heated by a soldering iron or the like. 4, the coil 8 and the lead wire 4 do not come into contact with each other, so that the solder coated on the lead wire 4 is isolated or the solder layer 3 is peeled off from the substrate 2. Is prevented.

  Further, when the lead wire 4 is paid out, the press roller 7 that presses the lead wire 4 against the substrate 2 is rotated to prevent the press roller 7 and the lead wire 4 and the press roller 7 and the substrate 2 from rubbing. The pressing means 7 prevents the situation where the solder coated on the lead wire 4 is isolated and the situation where the solder layer 3 is peeled off from the substrate 2.

  Further, since the lead wire 4 can be pressed to the substrate 2 side by the magnetic force generated by the magnetic field from the current flowing through the coil 8 and the magnetic field from the current flowing through the lead wire 4, the lead wire 4 and the solder layer 3 can be kept in a good contact state. Thereby, since the contact state of the lead wire 4 with respect to the solder layer 3 can be ensured, the pressing force by the pressing means 7 can be reduced.

  Furthermore, since only the lead wire 4 to be heated generates heat, the possibility of damaging the substrate 2 itself as in the case of heating the lead wire 4 in a non-contact manner with hot air is reduced.

  In this soldering apparatus 1, the pressing rollers 7 are installed on the upstream side and the downstream side of the lead wire 4 with respect to the coil 8. However, the lead wire 4 is already soldered on the downstream side. The presser roller 7 may be omitted because it is a region that is present.

Next, based on FIGS. 3 and 4, different points from the above-described example will be described for another embodiment of the present invention.
FIG. 3 is a conceptual diagram showing the main configuration of a soldering apparatus showing another embodiment of the present invention. In the above-described example, the lead wire 4 is always induction-heated while the coil 8 is moving in the wiring direction, and the lead wire 4 is continuously soldered to the substrate 2. In the example shown in FIG. While the coil 8 is moving in the wiring direction, the lead wire 4 is intermittently induction-heated, and the lead wire is soldered to the substrate 2 side at predetermined intervals (equal intervals in the illustrated example). Go.

  Specifically, the movement and energization of the coil 8 are alternately repeated, whereby the lead wire 4 is soldered to a soldering point P that is intermittently set on the surface of the substrate 2 at predetermined intervals along the wiring direction. Soldering is performed sequentially through the layer 3. Incidentally, the energization time at the soldering point P is approximately 100 ms in the illustrated example.

  In the soldering apparatus 1 configured as described above, the time of the entire soldering work can be shortened by intermittent soldering work as compared with the case of continuous soldering.

  FIG. 4 is a conceptual diagram of a main part of a soldering apparatus showing another example of the solder layer. In FIG. 3, the solder layer 3 is continuously formed in a strip shape in the wiring direction. However, as shown in FIG. 4, the solder layer 3 may be formed only at the soldering point P described above. That is, in FIG. 4, the solder layer 3 is intermittently arranged in the wiring direction. As a result, it is possible to reduce the amount of necessary solder, and the cost can be kept low.

Next, based on FIG. 5, a different point from the above-mentioned form is demonstrated about another embodiment of this invention.
FIG. 5 is a conceptual diagram of a main part of a soldering apparatus showing another embodiment of the present invention. In the example shown in the figure, one heating device 8 that is electromagnetic induction means is formed so as to form an annular shape, a C shape, or a U shape (U shape in the illustrated example) that is long in the direction of the lead wire 4 in plan view. The lead wire 8a is bent to form a surrounding space S that extends in the direction of the lead wire 4 and is surrounded by the lead wire 8a in most of the four directions and open at the top and bottom.

In this heating device 8, when a current is passed through the conductor 8 a, a magnetic field is generated so as to penetrate the surrounding space S up and down. Therefore, the lead wire 4 placed on the solder layer 3 is positioned directly below the surrounding space S. When the heating device 8 is arranged as described above and an AC voltage is applied to the lead wire 8a, the entire portion of the lead wire 4 located on the lower side of the surrounding space S is heated by an overcurrent caused by electromagnetic induction.

  That is, the surrounding space S surrounded by the conductive wire 8a extends in the direction of the lead wire 4 so that a wide range of the lead wire 4 can be induction-heated at a stretch, reducing the amount of movement of the heating device 8 and the like, and soldering It is possible to shorten the attaching time.

2 Substrate 3 Solder layer (solder)
4 Lead wire (conductor)
6 Feeding means 7 Presser roller (pressing means)
8 Coils (heating means, heating device, electromagnetic induction means)
8a Conductor 12 Ferrite (magnetic material)
P Soldering location

Claims (8)

The lead wire (4) is fed by the feeding means (6), the lead wire (4) is brought into contact with the solder (3) previously attached to the surface of the substrate (2), and the lead wire (4) is heated by the heating means (8). ) To melt the solder (3) and to solder the lead wire (4) to the substrate (2) side, and an electromotive force is applied to the lead wire (4) by electromagnetic induction. occurs allowed to constitute the heating means Ri by the electromagnetic induction means (8) for heating the lead wire (4), a said electromagnetic induction means (8) is a coil, a true lead wires unwound (4) A soldering method in which the lead wire (4) is heated by electromagnetic induction by the coil (8) positioned in a non-contact state . The soldering method according to claim 1, wherein the lead wire (4) is intermittently soldered to the substrate (2) at predetermined intervals by alternately repeating movement and energization of the coil (8) . The soldering method according to claim 2, wherein the solder (3) is formed in advance only at a soldering location (P), which is a portion where the lead wire (4) is intermittently soldered on the surface of the substrate (2) . Feeding means (6) for feeding out the lead wire (4) and heating means (8) for heating the lead wire (4) brought into contact with the solder (3) previously attached to the surface of the substrate (2). A soldering device that melts the solder (3) with a heated lead wire (4) and solders the lead wire (4) to the substrate (2) side by electromagnetic induction. The heating means (8) is constituted by an electromagnetic induction means that generates an electromotive force in the lead wire and heats the lead wire (4) , and the electromagnetic induction means (8) A soldering device which is a coil which is positioned in a non-contact state and performs electromagnetic induction heating of the lead wire (4) . The soldering device according to claim 4, wherein the coil (8) is formed in a cylindrical shape extending in the vertical direction . The soldering device according to claim 5 , wherein a columnar magnetic body (12) is inserted into the inner peripheral surface of the coil (8), and the magnetic body (12) is made of ferrite . A pressing means (7) for pressing the lead wire (4) to contact the solder on the surface of the substrate (2) is provided, and a pressing roller for pressing the lead wire (4) against the substrate (2) side is rotatably supported. Thus, the pressing means (7) is configured, and the roller (7) is arranged only on the upstream side and the downstream side and the upstream side of the lead wire (4) with respect to the coil (8). Item 7. A soldering apparatus according to any one of Items 4 to 6 . Feeding means (6) for feeding out the lead wire (4) and heating means (8) for heating the lead wire (4) brought into contact with the solder (3) previously attached to the surface of the substrate (2). A soldering device that melts the solder (3) with a heated lead wire (4) and solders the lead wire (4) to the substrate (2) side by electromagnetic induction. The heating means (8) is constituted by an electromagnetic induction means that generates an electromotive force in the lead wire and heats the lead wire (4) , and the electromagnetic induction means (8) A soldering device which is a lead wire (8a) which is positioned in a non-contact state and is bent in a ring shape, a C shape or a U shape in the wiring direction of the lead wire (4) .

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