JP5568683B2 - Vapor deposition mask and vapor deposition method using the mask - Google Patents

Description

The present invention relates to a film formation apparatus used for film formation of a material that can be formed by vapor deposition (hereinafter referred to as vapor deposition material) and a manufacturing apparatus including the film formation apparatus. In particular, the present invention relates to a mask for vapor deposition for forming a film by evaporating a vapor deposition material from a vapor deposition source provided facing the substrate, a container for storing the vapor deposition material, and a manufacturing apparatus.

A light-emitting element using an organic compound having characteristics such as thin and light weight, high-speed response, and direct current low-voltage driving as a light emitter is expected to be applied to a next-generation flat panel display. In particular, a display device in which light emitting elements are arranged in a matrix is considered to be superior to a conventional liquid crystal display device in that it has a wide viewing angle and excellent visibility.

The light-emitting mechanism of the light-emitting element is such that electrons injected from the cathode and holes injected from the anode are at the emission center in the organic compound layer by applying a voltage with a layer containing an organic compound between a pair of electrodes. It is said that it recombines to form molecular excitons, and emits energy when the molecular excitons return to the ground state. The excited states are known as singlet excitation and triplet excitation,
It is believed that light emission is possible through either excited state.

For a light-emitting device formed by arranging such light-emitting elements in a matrix, driving methods such as passive matrix driving (simple matrix type) and active matrix driving (active matrix type) can be used. However, when the pixel density increases, the active matrix type in which a switch is provided for each pixel (or one dot) is considered to be advantageous because it can be driven at a lower voltage.

The layer containing an organic compound has a laminated structure represented by “hole transport layer / light emitting layer / electron transport layer”. In addition, EL materials for forming an EL layer are roughly classified into a low molecular (monomer) material and a high molecular (polymer) material, and the low molecular material is formed using an evaporation apparatus.

In a conventional vapor deposition apparatus, a substrate is placed on a substrate holder, and an EL material, that is, a crucible (or vapor deposition boat) enclosing the vapor deposition material, a shutter for preventing the EL material from sublimating from rising, and the EL material in the crucible are heated. And a heater. Then, the EL material heated by the heater is sublimated and deposited on the rotating substrate. At this time, in order to form a film uniformly, the distance between the substrate and the crucible is 1 m or more.

In the conventional vapor deposition apparatus and vapor deposition method, when an EL layer is formed by vapor deposition, most of the sublimated EL material is the inner wall of the deposition chamber of the deposition apparatus, the shutter or the deposition shield (the deposition material adheres to the inner wall of the deposition chamber). It has adhered to the protective plate to prevent it. Therefore, when the EL layer is formed, the utilization efficiency of the expensive EL material is extremely low, about 1% or less, and the manufacturing cost of the light emitting device is very expensive.

Moreover, in order to obtain a uniform film in the conventional vapor deposition apparatus, the distance between the substrate and the vapor deposition source is 1 m or more. Further, when a large-area substrate is used, there is a problem that the film thickness tends to be non-uniform between the central portion and the peripheral portion of the substrate. Furthermore, since the vapor deposition apparatus has a structure in which the substrate is rotated, there is a limit to the vapor deposition apparatus intended for a large area substrate.

In addition, if the large area substrate and the evaporation mask are rotated together, the mask and the substrate may be misaligned. In addition, when the substrate or the mask is heated during vapor deposition, a dimensional change occurs due to thermal expansion. Therefore, dimensional accuracy and position accuracy are reduced due to a difference in thermal expansion coefficient between the mask and the substrate.

In view of these points, the applicant has proposed a vapor deposition apparatus (Patent Document 1 and Patent Document 2) as one means for solving the above-described problems.

JP 2001-247959 A JP 2002-60926 A

The present invention reduces manufacturing costs by increasing the utilization efficiency of EL materials, and
It is an object of the present invention to provide a manufacturing apparatus provided with a vapor deposition apparatus which is one of manufacturing apparatuses with excellent uniformity of layer deposition and throughput.

In the present invention, for example, the substrate size is 320 mm × 400 mm, 370 mm × 470.
mm, 550 mm × 650 mm, 600 mm × 720 mm, 680 mm × 880 mm, 1
000mm x 1200mm, 1100mm x 1250mm, 1150mm x 1300mm
The manufacturing apparatus which deposits EL material efficiently with respect to such a large area board | substrate is provided. In addition, the present invention provides a vapor deposition apparatus that can obtain a uniform film thickness over the entire surface of a large-area substrate.

In addition, since a vapor deposition is selectively performed on a large area substrate, a large mask with high mask accuracy is provided.

In order to solve the above problems, the present invention fixes a mask to the center of thermal expansion in the frame. It is fixed locally at the center of thermal expansion with an adhesive that is resistant to temperature changes. This center of thermal expansion is determined by the frame material, shape, and outer and inner circumferences.

The mask body is formed of a material having substantially the same thermal expansion coefficient as that of the substrate. Since the mask main body is also expanded following the expansion state of the substrate, the deposition position accuracy can be maintained. Even if the frame expands by heating within a certain temperature range and the outer periphery and inner periphery change, the position where the mask is fixed is the center of thermal expansion, so the alignment position does not change.

Further, according to the present invention, the substrate and the mask are fixed without being rotated at the time of vapor deposition. During vapor deposition, the vapor deposition source holder is moved in the X direction, Y direction, or Z direction to form a film on the substrate.

The configuration of the invention disclosed in this specification is a thin plate-like mask having a pattern opening, and the mask is fixed to the frame in an extended state, and the mask passes through the center of thermal expansion in the member of the frame. It is a mask characterized in that it is adhered at a location that coincides with a line.

According to another aspect of the invention, there is provided a thin plate-like mask having a pattern opening, the mask being fixed to the frame in an extended state, and the mask being formed from a line passing through the center of thermal expansion in the frame member. It is a mask characterized in that it is bonded at an outer part and the frame is expanded by heating at the time of vapor deposition to keep the mask stretched.

If the frame is fixed outside the center of thermal expansion, it is possible to prevent the frame from being expanded by heating and the mask body from being pulled to cause deflection. That is, the mask tension can be maintained by utilizing the thermal expansion of the frame. It is preferable to perform deposition while performing heating suitable for the material to be deposited, and a position to be appropriately fixed may be determined so that an appropriate tension is applied to the mask at the heating temperature.

In each of the above configurations, the four corners of the frame may have a curvature.
In each of the above structures, the mask is bonded to the frame with an adhesive having heat resistance. The mask may be fixed to the frame by welding.

According to another aspect of the present invention, there is provided a container for storing a vapor deposition material installed in a vapor deposition source of a vapor deposition apparatus, wherein the cross section in the plane of the container is rectangular or square, and an opening through which the vapor deposition material passes is elongated. It is a container characterized by having a shape.

In the case of co-evaporation, the evaporation source may be attached at any angle so that the evaporation center matches one point of the substrate to be evaporated. However, in order to tilt the angle for each vapor deposition source, a certain distance between the two vapor deposition sources is required. Therefore, it is preferable to make the container into a prismatic shape as shown in FIG. 10 and to adjust the evaporation center in the opening direction of the container. The container is composed of an upper part and a lower part, and a plurality of upper parts having different angles at which the vapor deposition material jumps out from the opening may be prepared and appropriately selected. Since vapor deposition spreads differently depending on the vapor deposition material, two vapor deposition sources with different upper parts may be prepared when performing co-vapor deposition.

According to another aspect of the invention, there is provided a manufacturing method including a load chamber, a transfer chamber connected to the load chamber, a plurality of film forming chambers connected to the transfer chamber, and an installation chamber connected to the film forming chamber. In the apparatus, the plurality of film formation chambers are connected to an evacuation chamber for evacuating the film formation chamber, and a means for fixing the substrate, a mask, a frame for fixing the mask, a mask and the substrate Alignment means for performing alignment of the above, one or two vapor deposition sources, means for moving the vapor deposition sources in the film forming chamber, and means for heating the substrate, and the center of thermal expansion in the frame member The manufacturing apparatus is characterized in that an end portion of the mask is bonded to a position that coincides with a line passing through the line.

According to another aspect of the invention, there is provided a manufacturing method including a load chamber, a transfer chamber connected to the load chamber, a plurality of film forming chambers connected to the transfer chamber, and an installation chamber connected to the film forming chamber. In the apparatus, the plurality of film formation chambers are connected to an evacuation chamber for evacuating the film formation chamber, and a means for fixing the substrate, a mask, a frame for fixing the mask, a mask and the substrate Alignment means for performing alignment, one or two vapor deposition sources, means for moving the vapor deposition sources in the film forming chamber, and means for heating the substrate, and vapor deposition installed in the vapor deposition source The manufacturing apparatus is characterized in that a cross section in a plane of a container for storing a material is rectangular or square, and an opening has an elongated shape.

The said structure WHEREIN: The said container consists of an upper part and a lower part, The evaporation of the material from the said vapor deposition source is adjusted by the opening part shape in the upper part of a container, It is characterized by the above-mentioned. In addition to the upper part and the lower part, the container may be provided with an inner lid having a plurality of holes therein.

Further, in each of the above structures, the film formation chamber and the installation chamber are connected to an evacuation treatment chamber for evacuating the chamber, and have means capable of introducing a material gas or a cleaning gas. It is a feature.

In each of the above structures, the vapor deposition source can move in the X direction, the Y direction, or the Z direction in the film formation chamber.

In each of the above structures, the film formation chamber includes a shutter that partitions the film formation chamber and shields vapor deposition on the substrate.

According to the present invention, since vapor deposition is selectively performed on a large area substrate, a large mask with high mask accuracy can be realized. Further, according to the present invention, it is possible to realize a vapor deposition apparatus that can obtain a uniform film thickness over the entire surface of a large area substrate.

The perspective view and sectional drawing which show the mask of this invention. (Embodiment 1) FIG. 5 shows Embodiment Mode 2. FIG. 4 shows Embodiment 3. The perspective view which shows the mask of this invention. (Embodiment 1) The figure which shows the manufacturing apparatus of a multi-chamber. Example 1 The top view of a vapor deposition apparatus. (Example 2) The figure which shows the mode of an installation room and conveyance. (Example 2) The top view in the film-forming chamber. (Example 3) The top view in the film-forming chamber. (Example 3) The figure which shows the container of this invention. (Embodiment 4) The figure which shows the vapor deposition apparatus of this invention. (Embodiment 4) FIG. 11 illustrates a structure of an active matrix EL display device. FIG. 14 illustrates an example of an electronic device. FIG. 10 is a block diagram of an electronic apparatus shown in Embodiment 6. The block diagram of a controller. FIG. 10 is a diagram illustrating a state in which the electronic device illustrated in the sixth embodiment is being charged.

  Embodiments of the present invention will be described below.

(Embodiment 1)
FIG. 1A is a perspective view of the mask of the present invention. The mask body 122 is fixed at a fixed position A124a arranged on a line passing through the thermal expansion center 121 in the width of the mask frame 120. Further, an arm (not shown) that supports the mask frame in the deposition chamber is also preferably supported at the fixed position A124a.

FIG. 1B is a cross-sectional view when the substrate 124 is mounted during vapor deposition. During deposition, the substrate 124, the mask body 122, and the mask frame 120 are aligned in place, and the mask body is brought into close contact with the deposition surface of the substrate by magnetism (not shown) provided on the back surface of the substrate. . Here, an example of fixing with a magnet is shown, but it may be fixed mechanically. Note that an opening 123 is provided in the mask body, and a vapor deposition material that has passed through the opening 123 is deposited to form a pattern on the substrate 124.

In the present invention, the substrate 124 and the mask body 122 are fixed, and vapor deposition is performed by moving the vapor deposition source in the X direction or the Y direction. The method of moving the vapor deposition source in the X direction or the Y direction is suitable for vapor deposition of a large substrate.

In the present invention, it is preferable to use a mask body using a material having the same thermal expansion coefficient as that of the substrate. For example, when a glass substrate is used, the mask body has a 42 alloy (Fe—Ni alloy: Ni 42%) or 36 invar (Fe—Ni alloy: N) having a thermal expansion coefficient close to that of glass.
i36%) may be used. Although heated at the time of vapor deposition, since the mask body and the substrate have the same expansion amount, misalignment hardly occurs. Although the mask frame 120 is also heated, the position of the center of thermal expansion does not change. Therefore, even if the materials of the mask frame 120 and the mask main body 122 are different and there is a difference in thermal expansion coefficient, misalignment hardly occurs. In particular, the present invention is effective for vapor deposition of a large substrate that is likely to be largely displaced by heating.

The mask may be formed by an etching method or an electroforming method. Further, the mask may be formed by combining an etching method by dry etching or wet etching and an electroforming method performed in an electroforming liquid bath of the same metal as the vapor deposition mask.

Further, in order to maintain the tension of the mask main body 122 in a heated state, the fixing position A124a.
Instead, if the fixing is performed at the fixing position B124b that is on the outer peripheral side of the center of thermal expansion, the tension of the mask body 122 can be maintained using the expansion amount of the mask frame. The distance from the center of thermal expansion to the fixed position B124b is the heating temperature during deposition and the thermal expansion coefficient of the frame,
What is necessary is just to determine suitably according to the outer periphery and inner periphery of a flame | frame.

FIG. 1C shows an example in which the four corners of the mask frame are rounded. By rounding the four corners of the mask, the corners of the mask frame are prevented from being lost due to some collision. In FIG. 1C, 130 is a mask frame, 131 is a thermal expansion center, 132 is a mask body,
133 is an opening.

FIG. 4 shows an example in which a play portion 223b is provided with allowances at the four corners of the opening 223a. Even if tension is applied to the mask body 222 by providing the play portion 223b,
Even if thermal expansion occurs, the mask main body 222 is prevented from cracking from the corner of the adjacent opening. In addition,
In FIG. 4, 220 is a mask frame, 221 is a thermal expansion center, 222 is a mask body, and 224 is a fixed position.

(Embodiment 2)
Here, the configuration of the substrate holding means will be described in detail with reference to FIG. A substrate holding means for supporting the substrate is provided so that a portion which becomes a scribe line is in contact with a large area substrate when performing multi-cavity (forming a plurality of panels from one substrate). That is, the substrate is placed on the substrate holding means, the vapor deposition material is sublimated from the vapor deposition source holder provided below the substrate holding means, and vapor deposition is performed in a region not in contact with the substrate holding means. By doing this, the deflection of the large area substrate is 1
It can be suppressed to mm or less.

2A shows a perspective view of the substrate holding means 301 on which the substrate 303 and the mask 302 are placed, and FIG. 2B shows only the substrate holding means 301.

FIG. 2C shows a cross-sectional view of the substrate holding means in which the substrate 303 is placed on the mask 302. The height h is 10 mm to 50 mm, and the width w is 1 mm to 5 mm. Ti and shape memory alloy). The substrate holding means may be a wire made of a shape memory alloy. The substrate holding means is fixed to the mask 302 by welding or adhesion. Mask 3
02 is fixed to the position of the center of thermal expansion of the mask frame 304 with an adhesive.

By this substrate holding means 301, the deflection of the substrate or the deflection of the mask due to the weight of the substrate can be suppressed. Further, the substrate holding means 301 can suppress the deflection of the mask and keep the tension of the mask.

Further, the shape of the substrate holding means 301 is not limited to that shown in FIGS. 2A to 2C, but is a shape that does not overlap with the opening of the mask provided in the mask.

  This embodiment mode can be freely combined with Embodiment Mode 1.

(Embodiment 3)
Here, an example is shown in which RGB coating is performed by vapor deposition.

FIG. 3A shows an exploded perspective view of a mask composed of a mask frame 420 and a mask main body 422.

The thermal expansion center 421 of the mask frame 420 coincides with the bonding portion 426 with the mask main body 422. The mask main body is provided with an opening 423. Opening 423 is RGB
Are provided in one type of pattern. Here, for simplification, a mask having an opening of 9 rows × 15 columns is shown, but it is needless to say that the number of pixels is not limited, for example, 640 × 480 pixels in the case of the VGA class, In the case of the XGA class, the number of pixels is 1024 × 768, and may be appropriately handled.

Three masks are prepared in order to perform the RGB coating. When three masks are prepared, the mask body is a common mask design, but when the mask body is fixed to the mask frame, it is bonded to each other so that a predetermined pixel position is obtained.
Alternatively, vapor deposition may be performed by shifting the substrate and the mask for each RGB during alignment with one mask. Further, deposition may be performed by shifting the substrate and the mask for each of RGB at the time of alignment with one mask in one chamber.

FIG. 3B shows a perspective view of the substrate after the three types of RGB deposition. Substrate 4
30, a red deposition film 431, a green deposition film 432, and a blue deposition film 433 are regularly deposited. A total of 405 (27 rows × 15 columns) patterns are formed.

  This embodiment can be freely combined with Embodiment 1 or Embodiment 2.

(Embodiment 4)
Here, FIG. 10 shows a container for storing the vapor deposition material. 10A is a perspective view of the container, FIG. 10B is a cross-sectional view cut along a chain line AB, and FIG. 10C is a dotted line C-
It is sectional drawing cut | disconnected by D. FIG.

When the deposition angle of the deposition source is changed, the cylindrical crucible and the heater surrounding it are also tilted. Therefore, when co-evaporation is performed using two crucibles, the distance between them becomes large. When the interval increases, it becomes difficult to uniformly mix two different vapor deposition materials. Moreover, when it is desired to perform deposition while narrowing the distance between the deposition source and the substrate, it is difficult to obtain a uniform film.

Therefore, in the present invention, the evaporation center is adjusted by the opening 810 of the container upper portion 800a, instead of changing the attachment angle of the vapor deposition source. The container is composed of a container upper part 800a, a container lower part 800b, and an inner lid 800c. The inner lid 800c is provided with a plurality of small holes, and the vapor deposition material is passed through the holes during vapor deposition. The container is made of a material such as a sintered body of BN, a composite sintered body of BN and AlN, quartz, or graphite, and can withstand high temperature, high pressure, and reduced pressure. Since the vapor deposition direction and the spreading method differ depending on the vapor deposition material, a container in which the area of the opening 810, the guide portion of the opening, and the position of the opening suitable for each vapor deposition material are adjusted is appropriately prepared.

By setting it as the container of this invention, a vapor deposition center can be adjusted, without tilting the heater of a vapor deposition source. Further, as shown in FIG. 10D, in the co-evaporation, the opening 810a and the opening 81 are used.
Both of 0b face each other, and a plurality of containers containing a plurality of different vapor deposition materials (material A805, material B806) are narrowed, and vapor deposition can be performed while uniformly mixing. FIG.
At 0 (D), the heating means 801 to 804 are connected to different power sources and perform temperature control independently of each other. A uniform film can also be obtained when it is desired to carry out vapor deposition by narrowing the distance between the vapor deposition source and the substrate, for example, to 20 cm or less.

An example different from FIG. 10D is shown in FIG. In FIG. 10E, an opening 810c is an example in which an upper part that evaporates in the vertical direction is used, and an upper part having an opening 810d that is inclined in accordance with that direction is used for evaporation. Also in FIG. 10E, the heating means 801, 803, 807, and 808 are connected to different power sources, and perform temperature adjustment independently of each other.

In addition, since the container of the present invention shown in FIG. 10 has an elongated opening, a uniform vapor deposition region is widened.
It is suitable for the case where vapor deposition is performed uniformly with a large area substrate fixed.

Here, FIG. 11 shows a top view of a film forming apparatus for performing vapor deposition using the container shown in FIG. 10 while fixing a large-area substrate.

The substrate 815 is transferred from the transfer chamber 813 through the shutter 814 to the film formation chamber 812. If necessary, the substrate and the mask (not shown) are aligned in the transfer chamber 813 or the film formation chamber 812.

A container 800 composed of a container upper part 800a having an opening 810 and a container lower part 800b includes:
It is installed in the vapor deposition source holder 811. The evaporation source holder 811 is moved below the substrate 815 by a moving means (not shown) that can move in the film forming chamber 812 in the X direction, the Y direction, or the Z direction.
A chain line in FIG. 11 is an example of a moving path of the evaporation source holder.

In the vapor deposition apparatus shown in FIG. 11, the substrate 813 and the vapor deposition source holder 811 are used during vapor deposition.
Is typically 30 cm or less, preferably 20 cm or less, more preferably 5 cm to 15 cm, and the utilization efficiency of the vapor deposition material is remarkably improved.

Further, since the distance d between the substrate 813 and the vapor deposition source holder 811 is typically reduced to 30 cm or less, preferably 5 cm to 15 cm, the vapor deposition mask (not shown) may be heated. Accordingly, the vapor deposition mask 14 is made of a metal material having a low thermal expansion coefficient that is not easily deformed by heat (for example, a refractory metal such as tungsten, tantalum, chromium, nickel or molybdenum or an alloy containing these elements, a material such as stainless steel, inconel, or hastelloy). ) Is desirable.
For example, a low thermal expansion alloy of 42% nickel and 58% iron can be used. Moreover, in order to cool the vapor deposition mask to be heated, a mechanism for circulating a cooling medium (cooling water, cooling gas) in the vapor deposition mask may be provided.

Note that this embodiment mode can be freely combined with any one of Embodiment Modes 1 to 3.

The present invention having the above-described configuration will be described in more detail with the following examples.

FIG. 5 shows a top view of a multi-chamber manufacturing apparatus. The manufacturing apparatus shown in FIG. 5 has a chamber arrangement for improving tasks.

In the manufacturing apparatus shown in FIG. 5, at least the transfer chambers 504a, 504b, 508, 51
4 is always kept in vacuum, and the film formation chambers 506W1, 506W2, and 506W3 are always kept in vacuum. Therefore, the vacuum evacuation work in the film forming chamber and the nitrogen filling work in the film forming chamber can be omitted, and the film forming process can be performed continuously in a short time.

In one film formation chamber, only one layer of EL layers (including a hole transport layer, a hole injection layer, a light emitting layer, an electron transport layer, an electron injection layer, etc.) composed of a stack of different material layers is formed. Do the membrane. Each film formation chamber is provided with a vapor deposition source holder that can move in the film formation chamber. A plurality of vapor deposition source holders are prepared, and a plurality of containers (crucibles) filled with EL materials are appropriately provided, and are installed in the film forming chamber in this state. A film can be selectively formed by setting the substrate by a face-down method, aligning the position of a vapor deposition mask with a CCD or the like, and performing vapor deposition by a resistance heating method.

Installation chamber 52 is used to install a container (crucible) filled with EL material or to replace parts of a vapor deposition holder.
6p, 526q, 526r, 526s. Have the material manufacturer store the EL material in a container (typically a crucible) in advance. Note that the installation is preferably performed without exposure to the atmosphere. When the material is transported from the material manufacturer, the crucible is introduced into the installation chamber while being sealed in the second container. The installation chamber is evacuated, the crucible is taken out from the second container in the installation chamber, and the crucible is installed in the vapor deposition holder.
By doing so, the crucible and the EL material accommodated in the crucible can be prevented from being contaminated.

In the present invention, a white light emitting device having a three-layer structure including a layer containing an organic compound is realized. Therefore, a layer including an organic compound may be formed in at least three chambers. By using three chambers, the process time can be shortened, and the cost of the manufacturing apparatus can also be reduced. Moreover, the film thickness of each layer may be as thin as 20 to 40 nm, which is advantageous in terms of material cost.

For example, in the case of forming a white light emitting element, a hole transport layer (HTL) that also serves as a first light emitting layer is formed in the film formation chamber 506W1, and a second light emitting layer is formed in the film formation chamber 506W2. After the electron transport layer (ETL) is formed using 506W3, the cathode may be formed in the film formation chamber 510. As a light emitter in the first light emitting layer, a blue fluorescent material having hole transport properties such as TPD and α-NPD may be used. Further, as the light emitter in the second light emitting layer, an organometallic complex having platinum as a central metal is effective. Specifically, phosphorescence emission can be obtained by mixing a substance represented by the following structural formulas (1) to (4) into a host material at a high concentration (10 wt% to 40 wt%, preferably 12.5 wt to 20 wt%). Both excimer emissions can be derived. However, the present invention is not limited to these, and any phosphorescent material that simultaneously emits both phosphorescence and excimer emission may be used.

As an electron transport material that can be used for the electron transport layer (ETL), Tris (8
- quinolinolato) aluminum (abbreviation: Alq _3), tris (4-methyl-8-quinolinolato) aluminum (abbreviation: Almq _3), bis (10-hydroxybenzo [h] - quinolinato) beryllium (abbreviation: BeBq _2), bis (2-Methyl-8-quinolinolato)-(
4-hydroxy-biphenylyl) -aluminum (abbreviation: BAlq), bis [2- (2-
Hydroxyphenyl) -benzoxazolate] zinc (abbreviation: Zn (BOX) ₂ ), bis [
2- (2-hydroxyphenyl) -benzothiazolate] zinc (abbreviation: Zn (BTZ) ₂ )
And metal complexes such as In addition to metal complexes, 2- (4-biphenylyl)-
5- (4-tert-butylphenyl) -1,3,4-oxadiazole (abbreviation: PBD)
), Oxadiazole derivatives such as 1,3-bis [5- (p-tert-butylphenyl) -1,3,4-oxadiazol-2-yl] benzene (abbreviation: OXD-7), (
4-tert-butylphenyl) -4-phenyl-5- (4-biphenylyl) -1,2,
4-triazole (abbreviation: TAZ), 3- (4-tert-butylphenyl) -4- (4
-Ethylphenyl) -5- (4-biphenylyl) -1,2,4-triazole (abbreviation: p
Triazole derivatives such as -EtTAZ), imidazole derivatives such as 2,2 ', 2 "-(1,3,5-benzenetriyl) tris [1-phenyl-1H-benzimidazole] (abbreviation: TPBI), batho Phenanthroline derivatives such as phenanthroline (abbreviation: BPhen) and bathocuproin (abbreviation: BCP) can be used.

In particular, the second light-emitting layer has a high concentration (10 wt% to 40 wt%, preferably 1 by co-evaporation.
(2.5 wt to 20 wt%) can be mixed with one kind of metal complex, so that the concentration can be easily controlled and is suitable for mass production.

In addition, a vapor deposition mask is a part where the extraction electrode is exposed (a part where an FPC is attached later).
A simple mask for vapor deposition may be used in the region excluding.

In order to obtain a double-sided light emitting panel, the cathode is a laminate of a thin metal film and a transparent conductive film. The thin metal film (Ag or MgAg) may have a thickness of 1 nm to 10 nm by a resistance heating method.
Since the transparent conductive film is formed by sputtering, the cathode can be formed in a short time.

Here, an example in which a white light-emitting panel is manufactured is shown; however, a panel that emits monochromatic light (green, red, blue, or the like) can also be manufactured.

Hereinafter, a procedure for manufacturing a light emitting device by carrying a substrate provided with an anode (first electrode) and an insulator (partition wall) covering an end of the anode in advance into the manufacturing apparatus shown in FIG. 5 will be described.
Note that in the case of manufacturing an active matrix light-emitting device, a plurality of thin film transistors (current control TFTs) and other thin film transistors (such as switching TFTs) connected to an anode are provided in advance on a substrate, and are formed of thin film transistors. A drive circuit is also provided. In addition, when a simple matrix light-emitting device is manufactured, the manufacturing apparatus illustrated in FIG. 5 can be used.

First, the substrate (600 mm × 720 mm) is set in the substrate loading chamber 520. The substrate size is 320 mm × 400 mm, 370 mm × 470 mm, 550 mm × 650 mm,
600 mm x 720 mm, 680 mm x 880 mm, 1000 mm x 1200 mm, 11
A large-area substrate such as 00 mm × 1250 mm or even 1150 mm × 1300 mm can be handled.

A substrate (a substrate provided with an anode and an insulator covering the end of the anode) set in the substrate loading chamber 520 is transferred to a transfer chamber 518 in which atmospheric pressure is maintained. Note that the transfer chamber 518 is provided with a transfer mechanism (such as a transfer robot) for transferring or reversing the substrate.

The transfer chambers 508, 514, and 502 are provided with a transfer mechanism and a vacuum exhaust unit, respectively. The robot provided in the transfer chamber 518 can invert the front and back of the substrate, and can carry it over to the delivery chamber 505. The delivery chamber 505 is connected to an evacuation treatment chamber, and can be evacuated to a vacuum, or after evacuation, an inert gas can be introduced to an atmospheric pressure.

The vacuum evacuation chamber is provided with a magnetic levitation turbo molecular pump, a cryopump, or a dry pump. As a result, the ultimate vacuum of the transfer chamber connected to each chamber can be set to 10 ⁻⁵ to 10 ⁻⁶ Pa, and the back diffusion of impurities from the pump side and the exhaust system can be controlled. To prevent impurities from being introduced inside the device,
As the gas to be introduced, an inert gas such as nitrogen or a rare gas is used. These gases introduced into the apparatus are those purified by a gas purifier before being introduced into the apparatus.
Therefore, it is necessary to provide a gas purifier so that the gas is introduced into the vapor deposition apparatus after being highly purified. Thereby, oxygen, water, and other impurities contained in the gas can be removed in advance, so that these impurities can be prevented from being introduced into the apparatus.

In addition, before setting in the substrate loading chamber 520, a porous sponge (typically, a surfactant (weak alkali) is included in the surface of the first electrode (anode) in order to reduce point defects. It is preferable to remove dust on the surface by washing with PVA (polyvinyl alcohol), nylon or the like. As a cleaning mechanism, a cleaning device having a roll brush (manufactured by PVA) that rotates around an axis parallel to the surface of the substrate and contacts the surface of the substrate may be used, or may rotate around an axis perpendicular to the surface of the substrate. You may use the washing | cleaning apparatus which has a disk brush (product made from PVA) which contacts the surface of a board | substrate while moving.

Next, the substrate is transferred from the transfer chamber 518 to the delivery chamber 505, and further, the substrate is transferred from the transfer chamber 505 to the transfer chamber 502 without being exposed to the atmosphere.

In order to eliminate shrinkage, vacuum heating is preferably performed immediately before deposition of a film containing an organic compound. The substrate is transferred from the transfer chamber 502 to the multistage vacuum heating chamber 521, and moisture and other gases contained in the substrate are transferred. In order to thoroughly remove the gas, annealing for deaeration is performed in a vacuum (5 ×
10 ⁻³ Torr (0.665 Pa) or less, preferably 10 ⁻⁴ to 10 ⁻⁶ Pa). In the multistage vacuum heating chamber 521, a plurality of substrates are uniformly heated using a flat plate heater (typically a sheath heater). A plurality of the flat plate heaters are installed, and can be heated from both sides so that the substrate is sandwiched by the flat plate heaters. Of course, the flat plate heaters can also be heated from one side. In particular, when an organic resin film is used as a material for an interlayer insulating film or a partition, depending on the organic resin material, moisture may be easily adsorbed and degassing may occur. Therefore, before forming a layer containing an organic compound, 100 ° C-25
It is effective to perform vacuum heating to remove adsorbed moisture by performing natural cooling for 30 minutes after heating at 0 ° C., preferably 150 ° C. to 200 ° C., for example, 30 minutes or more.

In addition to the above vacuum heating, UV irradiation may be performed while heating at 200 to 250 ° C. in an inert gas atmosphere. Also, 200 to 250 in an inert gas atmosphere without vacuum heating.
You may just perform the process which irradiates UV, performing a heating at (degreeC).

If necessary, a hole injection layer made of a polymer material may be formed in the film formation chamber 512 by an ink jet method, a spin coating method, a spray method, or the like under atmospheric pressure or reduced pressure. Also,
After coating by the ink jet method, the film thickness may be uniformed by a spin coater. Similarly,
After coating by the spray method, the film thickness may be uniformed by a spin coater. Alternatively, the film may be formed by an inkjet method in a vacuum with the substrate placed vertically.

For example, a poly (ethylenedioxythiophene) / poly (styrenesulfonic acid) aqueous solution (PEDOT / PSS) acting as a hole injection layer (anode buffer layer) on the first electrode (anode) in the film formation chamber 512, Polyaniline / camphor sulfonic acid aqueous solution (PANI / CSA), P
TPDES, Et-PTPDK, PPBA, or the like may be applied and baked on the entire surface.
The firing is preferably performed in the multistage heating chambers 523a and 523b.

Hole injection layer (HIL) made of a polymer material by a spin coating method or other coating method
When the film is formed, the flatness is improved, and the coverage and film thickness uniformity of the film formed thereon can be improved. In particular, since the thickness of the light emitting layer becomes uniform, uniform light emission can be obtained. In this case, it is preferable to perform atmospheric pressure heating or vacuum heating (100 to 200 ° C.) immediately after forming the hole injection layer by a coating method and immediately before film formation by the vapor deposition method.

For example, after the surface of the first electrode (anode) is cleaned with a sponge, it is carried into the substrate loading chamber 520, conveyed to the film formation chamber 512a, and poly (ethylenedioxythiophene) /
After applying a poly (styrene sulfonic acid) aqueous solution (PEDOT / PSS) to the entire surface with a film thickness of 60 nm,
Transported to multi-stage heating chambers 523a and 523b, pre-baked at 80 ° C. for 10 minutes, main-fired at 200 ° C. for 1 hour, and further transported to multi-stage vacuum heating chamber 521 for vacuum heating (170 ° C., heating 30 immediately before vapor deposition) And 30 minutes), the EL layer may be formed by a vapor deposition method without being exposed to the atmosphere by being transported to the film formation chambers 506W1, 506W2, and 506W3. In particular, when an ITO film is used as an anode material and there are irregularities and fine particles on the surface, these effects can be reduced by setting the PEDOT / PSS film thickness to 30 nm or more. In order to improve the wettability of PEDOT / PSS, it is preferable to perform ultraviolet irradiation in the UV processing chamber 531.

In addition, when PEDOT / PSS is formed by spin coating, the film is formed over the entire surface, so that the end face, peripheral edge, terminal part, connection area between the cathode and lower wiring, etc. can be selectively removed. Preferably, it is preferable to remove selectively by O ₂ ashing or the like using a mask in the pretreatment chamber 503. The pretreatment chamber 503 has plasma generating means, and performs dry etching by exciting one or more kinds of gases selected from Ar, H, F, and O to generate plasma. By using the mask, only unnecessary portions can be selectively removed.

Note that the vapor deposition mask is stocked in the mask stock chambers 524a and 524b, and is appropriately transported to the film formation chamber when vapor deposition is performed. When a large substrate is used, the mask has a large area, so that a frame for fixing the mask becomes large and it is difficult to stock a large number of sheets. Therefore, two mask stock chambers 524a and 524b are prepared here. Mask stock room 524
The vapor deposition mask may be cleaned at a and 524b. In addition, since the mask stock chamber is vacant at the time of vapor deposition, it is possible to stock the substrate after film formation or processing.

Next, the substrate is transferred from the transfer chamber 502 to the delivery chamber 507, and further, the substrate is transferred from the transfer chamber 507 to the transfer chamber 508 without being exposed to the atmosphere.

Next, the substrate is appropriately transferred to the film formation chambers 506W1, 506W2, and 506W3 connected to the transfer chamber 508, and an organic compound layer made of low molecules to be a hole transport layer, a light-emitting layer, and an electron transport layer is appropriately formed. . By appropriately selecting an EL material, a light emitting element that emits light of a single color (specifically, white) can be formed as the entire light emitting element. The substrate is transferred between the transfer chambers via the delivery chambers 540, 541, and 511 without being exposed to the atmosphere.

Next, the substrate is transferred to the film formation chamber 510 by a transfer mechanism installed in the transfer chamber 514 to form a cathode. The cathode is preferably transparent or translucent, and is a metal film (MgAg, MgIn, CaF ₂ , LiF, CaN) formed by a vapor deposition method using resistance heating.
Alloy, etc., or a film formed by co-evaporation of an element belonging to Group 1 or 2 of the periodic table and aluminum, or a laminated film thereof)
It is preferable that the thin film (1 nm to 10 nm) or a laminate of the metal film (1 nm to 10 nm) and the transparent conductive film is used as the cathode. Further, after the substrate is transferred from the transfer chamber 508 to the transfer chamber 514 via the delivery chamber 511, the substrate is transferred to the deposition chamber 509, and a transparent conductive film is formed by a sputtering method.

  Through the above steps, a light-emitting element having a stacked structure including a layer containing an organic compound is formed.

Alternatively, the protective film may be formed by sealing a silicon nitride film or a silicon nitride oxide film by being transferred to the film formation chamber 513 connected to the transfer chamber 514. Here, a target made of silicon, a target made of silicon oxide, or a target made of silicon nitride is provided in the film formation chamber 513.

Alternatively, the protective film may be formed by moving a rod-shaped target with respect to the fixed substrate. Further, the protective film may be formed by moving the substrate with respect to the fixed rod-shaped target.

For example, a silicon nitride film can be formed over the cathode by using a disk-shaped target made of silicon and setting the film formation chamber atmosphere to a nitrogen atmosphere or an atmosphere containing nitrogen and argon. Further, a thin film containing carbon as a main component (DLC film, CN film, amorphous carbon film) may be formed as a protective film, or a film formation chamber using a CVD method may be provided separately. Diamond-like carbon film (also called DLC film)
Is a plasma CVD method (typically RF plasma CVD method, microwave CVD method, electron cyclotron resonance (ECR) CVD method, hot filament CVD method, etc.), combustion flame method, sputtering method, ion beam evaporation method, laser It can be formed by vapor deposition. Reaction gases used for film formation are hydrogen gas and hydrocarbon-based gas (for example, CH ₄ , C ₂ H ₂ , C ₆ H _6, etc.).
The film is ionized by glow discharge and accelerated colliding with a negative self-biased cathode to form a film. The CN film may be formed using C ₂ H ₄ gas and N ₂ gas as the reaction gas. Note that the DLC film and the CN film are insulating films that are transparent or translucent to visible light. Transparent to visible light means that the visible light transmittance is 80 to 100%, and translucent to visible light means that the visible light transmittance is 50 to 80%.

Further, instead of the protective layer, a protective layer made of a laminate of a first inorganic insulating film, a stress relaxation film, and a second inorganic insulating film may be formed on the cathode. For example, after forming the cathode, the film formation chamber 5
13 to form a first inorganic insulating film having a thickness of 5 to 50 nm, and the film formation chambers 506W1 and 506 are formed.
Stress relieving film (inorganic layer, which has hygroscopicity and transparency by vapor deposition and transported to W2 or 506W3
Or a layer containing an organic compound) is formed to a thickness of 10 nm to 100 nm, and again, the deposition chamber 5
13 to form a second inorganic insulating film having a thickness of 5 nm to 50 nm.

  Next, the substrate over which the light-emitting element is formed is transferred to the sealing chamber 519.

The sealing substrate is prepared by being set in the load chamber 517 from the outside. Load chamber 51 with sealing substrate
7 to the transfer chamber 527, and if necessary, a desiccant or an optical filter (color filter,
It is conveyed to an optical film attaching chamber 529 for attaching a polarizing film or the like. In addition, a sealing substrate on which an optical film (color filter, polarizing plate) is attached in advance may be set in the load chamber 517.

Note that it is preferable that annealing be performed in advance in the multistage heating chamber 516 in order to remove impurities such as moisture in the sealing substrate. Then, in the case of forming a sealing material to be bonded to a substrate provided with a light emitting element, a sealing material is formed in the dispensing chamber 515, and the sealing substrate on which the sealing material is formed is transferred to the delivery chamber 542. Then, it is transferred to the transfer chamber 514 and further transferred to the sealing substrate stock chamber 530. Note that here, an example in which the sealing material is formed over the sealing substrate is described; however, there is no particular limitation, and the sealing material may be formed over the substrate over which the light-emitting element is formed. Further, a vapor deposition mask used for vapor deposition may be stocked in the sealing substrate stock chamber 530.

In addition, since a present Example is a case where it is set as a double-sided emission structure, a sealing substrate is used for the optical film sticking chamber 5
The optical film may be attached to the inside of the sealing substrate. Alternatively, after the substrate provided with the light-emitting element and the sealing substrate are bonded together, the substrate is transported to the optical film pasting chamber 529, and an optical film (color filter or polarizing plate) is pasted outside the sealing substrate. .

Next, the sealing chamber 519 is bonded to the substrate and the sealing substrate, and the pair of bonded substrates is irradiated with UV light by an ultraviolet irradiation mechanism provided in the sealing chamber 519 to cure the sealing material.
It is preferable to irradiate UV light from the sealing substrate side where a TFT that shields light is not provided. In addition, although ultraviolet curable + thermosetting resin was used here as a sealing material, it will not specifically limit if it is an adhesive material, What is necessary is just to use curable resin etc. only with an ultraviolet-ray.

Further, instead of filling the sealed space with an inert gas, a resin may be filled. In the case of the bottom emission type, when the ultraviolet light is irradiated from the sealing substrate side, since the cathode does not pass the light, the resin material to be filled is not particularly limited, and an ultraviolet curable resin or an opaque resin may be used. In the case of the emission type, when ultraviolet light is irradiated from the sealing substrate side, it is preferable not to use an ultraviolet curable resin because the ultraviolet light passes through the cathode and damages the EL layer. Therefore, in the case of a dual emission type, it is preferable to use a transparent resin that is thermoset as the filling resin.

Next, the pair of bonded substrates is transferred from the sealing chamber 519 to the transfer chamber 514 and the delivery chamber 54.
2 is transferred from the transfer chamber 527 to the take-out chamber 525 and taken out.

Moreover, after taking out from the taking-out chamber 525, it heats and hardens a sealing material.
When a top emission type is used and a thermosetting resin is filled, it can be cured simultaneously with the heat treatment for curing the sealing material.

As described above, by using the manufacturing apparatus illustrated in FIG. 5, it is not necessary to expose the light-emitting element to the atmosphere until the light-emitting element is completely enclosed in the sealed space. Therefore, a highly reliable light-emitting device can be manufactured.

Although not shown here, there is provided a control device that realizes full automation by controlling a path for moving the substrate to each processing chamber.

  FIG. 6 shows an example of a top view of the vapor deposition apparatus.

In FIG. 6, a film forming chamber 101 includes a first vapor deposition source holder 104a and a second vapor deposition source holder 104b in which a substrate holding unit (not shown) and a vapor deposition shutter (not shown) are installed.
And means for moving these deposition source holders (not shown) and means for creating a reduced pressure atmosphere (
Vacuum evacuation means). The film forming chamber 101 is evacuated to a vacuum degree of 5 × 10 ⁻³ Torr (0.665 Pa) or less, preferably 10 ⁻⁴ to 10 ⁻⁶ Pa by means of a reduced pressure atmosphere.

In addition, a gas introduction system (not shown) for introducing a material gas into the film formation chamber by several sccm during vapor deposition.
And an inert gas (Ar, N _2, etc.) introduction system (not shown) for bringing the inside of the film formation chamber to a normal pressure is connected. Further, a cleaning gas (one or a plurality of gases selected from H ₂ , F ₂ , NF ₃ , or O ₂ ) introduction system may be provided. It is desirable to prevent the material gas from flowing to the gas outlet at the shortest distance from the gas inlet.

In addition, a material gas is intentionally introduced at the time of film formation, and a component of the material gas is included in the organic compound film to form a high-density film. Impurities such as oxygen and moisture that cause deterioration enter the film.
You may block spreading. Specifically, silane-based gas (
Monosilane, disilane, trisilane, etc.), SiF ₄ , GeH ₄ , GeF ₄ , SnH ₄ , or a hydrocarbon gas (CH ₄ , C ₂ H ₂ , C ₂ H ₄ , C ₆ H _6, etc.) Alternatively, a plurality of types may be used. Note that a mixed gas obtained by diluting these gases with hydrogen or argon is also included. These gases introduced into the apparatus are those purified by a gas purifier before being introduced into the apparatus. Therefore, it is necessary to provide a gas purifier so that the gas is introduced into the vapor deposition apparatus after being highly purified. Thereby, since residual gas (oxygen, moisture, other impurities, etc.) contained in the gas can be removed in advance, introduction of these impurities into the apparatus can be prevented.

For example, when a monosilane gas is introduced at the time of vapor deposition, Si is contained in the film, and after completing a light-emitting element, when there is a defective portion such as a pinhole or a short circuit, the defective portion generates heat, and thus Si is React to form an insulating insulator such as SiOx, SiCx,
Leakage at pinholes and shorts is reduced, and a self-healing effect is obtained in which point defects (such as dark spots) do not progress.

In addition, when introducing the said material gas, it is preferable to add a turbo-molecular pump and a dry pump in addition to a cryopump.

Further, in the film formation chamber 101, the evaporation source holder 104 can move a plurality of times along the movement path indicated by the chain line in FIG. The movement route shown in FIG. 6 is an example and is not particularly limited. In order to make the film thickness uniform, it is preferable to carry out vapor deposition by moving the vapor deposition source holder while shifting the movement path as shown in FIG. Further, the same movement route may be reciprocated. In addition, the moving speed of the vapor deposition holder may be changed as appropriate for each section of the moving path so that the film thickness can be made uniform and the time required for film formation can be shortened. For example, the deposition source holder is 3
What is necessary is just to move to an X direction or a Y direction at 0 cm / min-300 cm / min.

Moreover, when producing a white light emitting element, you may vapor-deposit locally as shown in FIG.
Vapor deposition is locally performed so that at least a region to be a display region is included in a region to be a panel. By locally performing vapor deposition, it is possible to prevent vapor deposition in an area where vapor deposition is unnecessary. For local vapor deposition, vapor deposition is performed without using a mask by appropriately opening and closing using a shutter (not shown). FIG. 9 shows an example of multi-chamfering, wherein 900 is a large substrate, 901 is a film formation chamber, 904 is a movable vapor deposition holder, and 906 is a crucible.

Further, the vapor deposition source holders 104a and 104b are containers (crucibles 106) in which a vapor deposition material is sealed.
) Is installed. Here, an example in which two crucibles are installed in one vapor deposition source holder 104a, 104b is shown. Further, the installation chamber 103 is provided with a film thickness meter (not shown). Here, the film thickness meter is not monitored while the vapor deposition source is moving, and the replacement frequency of the film thickness meter is reduced.

When there are a plurality of containers (a crucible for storing an organic compound, a vapor deposition boat) provided in one vapor deposition source holder, the vaporization direction (evaporation center) so that the organic compounds are mixed with each other
It is desirable to make the crucible mounting angle oblique so that the crossing points at the position of the deposition object.

Further, the vapor deposition source holder always stands by in the crucible installation chamber, and performs heating and heat insulation until the vapor deposition rate is stabilized. A film thickness monitor (not shown) is installed in the crucible installation room. When the deposition rate is stabilized, the substrate is transferred to the film formation chamber 102, aligned with a mask (not shown), and then the shutter is opened to move the deposition holder. Note that the alignment of the deposition mask and the substrate may be confirmed using a CCD camera (not shown). An alignment marker may be provided on each of the substrate and the vapor deposition mask, and position control may be performed. When deposition is completed, move the deposition holder to the crucible installation chamber and close the shutter. When the shutter is closed, the substrate is transferred to the transfer chamber 102.

Further, in FIG. 6, a plurality of vapor deposition holders 104a and 104b can stand by in the installation chamber 103. When the material of one vapor deposition holder runs out, the vapor deposition holder is replaced with another vapor deposition holder and sequentially moved. Film formation can be performed. Further, the EL material can be replenished to the vapor deposition holder that has become empty while one vapor deposition holder is moved in the film formation chamber. By using a plurality of vapor deposition holders 104, film formation can be performed efficiently.

Further, although only two crucibles can be set in the vapor deposition holders 104a and 104b, four crucibles can be set, and vapor deposition may be performed without setting only two or one crucible.

According to the present invention, the time required for film formation can be shortened. Conventionally, when EL material is replenished, it is necessary to open the film forming chamber to the atmosphere and replenish the crucible, and then evacuate, so the time required for replenishment becomes longer and causes a decrease in throughput. It was.

Further, if the deposition on the inner wall of the deposition chamber can be reduced, the frequency of maintenance such as cleaning of the inner wall of the deposition chamber can be reduced.

In addition, the crucible 106 is installed in the vapor deposition holders 104 a and 104 b in the installation chamber 103. FIGS. 7A and 7B show the state of conveyance. In addition, the same code | symbol is used for the part corresponding to FIG. The crucible 106 is carried from the door 112 of the installation chamber 103 in a state where the crucible 106 is hermetically sealed in a container composed of the upper part 721a and the lower part 721b. First, the loaded container is placed on the container installation turntable 109, and the fastener 702 is removed. (FIG. 7A) Since the inside is in a vacuum state, it cannot be removed even if the fastener 702 is removed under atmospheric pressure. Next, the interior of the installation chamber 103 is evacuated so that the container lid (upper part 721a) can be removed.

The form of the container to be conveyed will be specifically described with reference to FIG. The second container that is divided into an upper part (721a) and a lower part (721b) used for transportation includes a fixing means 706 for fixing the first container (crucible) provided on the upper part of the second container, and a fixing means. A spring 705 for pressurizing, a gas inlet 708 serving as a gas path for holding the second container provided under the second container under reduced pressure, and an O-ring for fixing the upper container 721a and the lower container 721b And a fastener 702. In the second container, a first container 106 in which a purified vapor deposition material is enclosed is installed. Note that the second container is preferably formed using a material containing stainless steel, and the first container 106 is preferably formed using a material containing titanium.

In the material manufacturer, the purified deposition material is sealed in the first container 106. And O
The second upper part 721a and the lower part 721b are combined via a ring, the upper container 721a and the lower container 721b are fixed by a fastener 702, and the first container 106 is sealed in the second container.
Thereafter, the inside of the second container is depressurized via the gas inlet 708, further replaced with a nitrogen atmosphere, the spring 705 is adjusted, and the first container 106 is fixed by the fixing means 706. In addition, you may install a desiccant in a 2nd container. When the inside of the second container is maintained in a vacuum, reduced pressure, or nitrogen atmosphere as described above, even slight oxygen or water adhering to the vapor deposition material can be prevented.

Next, the lid of the container is lifted by the lid transport robot 108 and moved to the lid installation base 107. In addition, the conveyance mechanism of the present invention is not limited to a configuration in which the first container 106 is pinched and conveyed from above the first container 106 as illustrated in FIG. 7B. Not
A configuration in which the side surface of the first container is sandwiched may be used.

Next, after rotating the container installation turntable 109, leaving the lower part of the container on the stand,
Only the crucible is lifted by the crucible transfer robot 110. (FIG. 7B) Finally, crucibles are set in the vapor deposition holders 104a and 104b waiting in the installation chamber 103.

The installation chamber 103 is provided with a cleaning gas (one or a plurality of gases selected from H ₂ , F ₂ , NF ₃ , or O ₂ ) introduction system, and components such as a vapor deposition holder and a shutter are installed using the cleaning gas. It may be cleaned. In addition, plasma generating means is provided in the installation room,
Alternatively, plasma may be generated, or a gas ionized by plasma may be introduced into the installation chamber to clean components such as the installation chamber wall, the vapor deposition holder, and the shutter, and may be exhausted by a vacuum exhaust unit. The plasma for cleaning is Ar, N ₂ , H ₂ , F ₂
One or a plurality of gases selected from NF ₃ , or O ₂ may be excited and generated.

Thus, the cleanliness of the film formation chamber can be maintained by moving the vapor deposition holders 104a and 104b to the installation chamber 103 and performing cleaning in the installation chamber.

Further, this embodiment can be freely combined with Embodiment 1. Deposition chamber 50 shown in FIG.
The vapor deposition apparatus illustrated in FIG. 6 may be disposed in any one of 6W1, 506W2, and 506W3, and the installation chambers illustrated in FIG. 7 may be disposed in the installation chambers 526a to 526n illustrated in FIG.

Here, an example of a film formation chamber in which the film formation chamber can be cleaned and the evaporation mask can be cleaned without opening to the atmosphere is shown. FIG. 8 is an example of a cross-sectional view of the film forming apparatus of this embodiment.

As shown in FIG. 8, an example in which plasma 1301 is generated between an evaporation mask 1302a and an electrode 1302b connected to a high-frequency power source 1300a via a capacitor 1300b is shown.

In FIG. 8, a vapor deposition mask 1302a fixed to the holder is provided in contact with a location where the substrate is provided (location shown by a dotted line in the drawing), and further below, heating is performed at different temperatures. A possible deposition source holder 1322 is also provided. Note that the evaporation source holder 1322 can be moved by the moving mechanism 1328 in the X direction, the Y direction, the Z direction, or the θ direction, which is the rotation direction.

When the internal organic compound is heated to the sublimation temperature by a heating means (typically a resistance heating method) provided in the vapor deposition holder, it is vaporized and vapor deposited on the surface of the substrate. Note that when vapor deposition is performed, the substrate shutter 1320 is moved to a position where vapor deposition is not hindered. The evaporation holder is also provided with a shutter 1321 that moves together, and is moved to a position that does not interfere with evaporation when it is desired to perform evaporation.

Further, during vapor deposition, a gas that makes it possible to include a material having a small atomic radius in the organic compound film by flowing a small amount of particles smaller than the particles of the organic compound material, that is, a gas composed of a material having a small atomic radius. An introduction system is provided. Specific examples of the material gas having a small atomic radius include silane gases (monosilane, disilane, trisilane, etc.), SiF ₄ , GeH ₄ , GeF.
₄ , SnH ₄ , or a hydrocarbon gas (CH ₄ , C ₂ H ₂ , C ₂ H ₄ , C ₆ H _6, etc.) may be used.
Note that a mixed gas obtained by diluting these gases with hydrogen or argon is also included. These gases introduced into the apparatus are those purified by a gas purifier before being introduced into the apparatus. Therefore, it is necessary to provide a gas purifier so that the gas is introduced into the vapor deposition apparatus after being highly purified. Thereby, since residual gas (oxygen, moisture, other impurities, etc.) contained in the gas can be removed in advance, introduction of these impurities into the apparatus can be prevented.

For example, when a monosilane gas is introduced at the time of vapor deposition, Si is contained in the film, and after completing a light-emitting element, when there is a defective portion such as a pinhole or a short circuit, the defective portion generates heat, and thus Si is React to form an insulating insulator such as SiOx, SiCx,
Leakage at pinholes and shorts is reduced, and a self-healing effect is obtained in which point defects (such as dark spots) do not progress.

Further, the component of the material gas introduced by heating the substrate by a heating means such as the substrate heating heater 1304 may be efficiently deposited on the substrate.

Further, it may be radicalized by plasma generating means. For example, in the case of monosilane,
The plasma generating means generates silicon oxide precursors such as SiHx, SiHxOy, and SiOy, and these are deposited on the substrate together with the organic compound material from the evaporation source. Monosilane easily reacts with oxygen and moisture, and can reduce the oxygen concentration and moisture content in the deposition chamber.

In addition, a magnetic levitation type turbo molecular pump 1326 and a cryopump 1327 are provided as the evacuation processing chamber so that various gases can be introduced. As a result, the ultimate vacuum in the film formation chamber can be set to 10 ⁻⁵ to 10 ⁻⁶ Pa. Note that after the vacuum pump 1327 is evacuated, the cryopump 1327 is stopped, and the turbo molecular pump 1326 is evacuated, and the deposition is performed while flowing a material gas at several sccm. Further, using an ion plating method, deposition may be performed while ionizing a material gas in a deposition chamber and attaching it to an evaporated organic material.

After the vapor deposition is completed, the substrate is taken out and cleaning is performed to remove the jig provided in the film formation apparatus and the vapor deposition material attached to the inner wall of the film formation apparatus without releasing to the atmosphere.

In cleaning, it is preferable to move the vapor deposition holder 1322 to an installation chamber (not shown here).

At the time of this cleaning, the wire electrode 130 is placed at a position facing the vapor deposition mask 1302a.
Move 2b. Further, a gas is introduced into the film formation chamber 1303. As a gas introduced into the deposition chamber 1303, one or a plurality of gases selected from Ar, H ₂ , F ₂ , NF ₃ , or O ₂ may be used. Next, a high frequency electric field is applied to the vapor deposition mask 1302a from the high frequency power source 1300a to excite a gas (Ar, H, F, NF ₃ , or O) to generate plasma 1301. In this manner, plasma 1301 is generated in the film formation chamber 1303, vaporized substances attached to the wall of the film formation chamber, the deposition shield 1305, or the vapor deposition mask 1302 a are vaporized and exhausted outside the film formation chamber. With the film forming apparatus shown in FIG. 4, the film forming chamber or the evaporation mask can be cleaned without being exposed to the air during maintenance.

Note that although an example in which the deposition mask 1302a is generated between the mask 1302b and the electrode 1302b disposed between the deposition source holder 1306 is shown here, the invention is not particularly limited and plasma generation means is provided. If you do. Further, a high frequency power source may be connected to the electrode 1302b, the wire electrode 1302b may be a plate-like or mesh-like electrode, or an electrode into which gas can be introduced like a shower head. As a plasma generation method, ECR, I
CP, helicon, magnetron, two frequencies, triode, LEP, or the like can be used as appropriate.

Further, the cleaning using the plasma may be performed every film formation process,
It is also possible to carry out after a plurality of film forming processes.

In addition, this embodiment can be freely combined with any one of Embodiment Modes 1 to 4, Embodiment 1, and Embodiment 2.

In this embodiment, an example of manufacturing a light-emitting device (double-sided emission structure) including a light-emitting element having an organic compound layer as a light-emitting layer over a substrate having an insulating surface is shown in FIG.

12A is a top view illustrating the light-emitting device, and FIG. 12B is a cross-sectional view taken along line AA ′ in FIG.
It is sectional drawing cut | disconnected by. Reference numeral 1101 indicated by a dotted line denotes a source signal line driver circuit, 1102 denotes a pixel portion, and 1103 denotes a gate signal line driver circuit. Reference numeral 1104 denotes a transparent sealing substrate, 1
Reference numeral 105 denotes a first sealing material, and the inner side surrounded by the first sealing material 1105 is a transparent second material.
The sealing material 1107 is filled. Note that the first sealing material 1105 contains a gap material for maintaining the distance between the substrates.

Reference numeral 1108 denotes a wiring for transmitting signals input to the source signal line driver circuit 1101 and the gate signal line driver circuit 1103. A video signal and a clock signal are received from an FPC (flexible printed circuit) 1109 serving as an external input terminal. receive. Although only the FPC is shown here, a printed wiring board (PWB) may be attached to the FPC.

Next, a cross-sectional structure will be described with reference to FIG. A driver circuit and a pixel portion are formed over a transparent substrate 1110. Here, a source signal line driver circuit 1101 and a pixel portion 1102 are shown as driver circuits.

Note that the source signal line driver circuit 1101 includes an n-channel TFT 1123 and a p-channel T
A CMOS circuit combined with FT1124 is formed. Also, T forming the drive circuit
The FT may be formed by a known CMOS circuit, PMOS circuit or NMOS circuit. Further, in this embodiment, a driver integrated type in which a drive circuit is formed on a substrate is shown, but this is not always necessary, and it can be formed outside the substrate. Further, the structure of a TFT having a polysilicon film or an amorphous silicon film as an active layer is not particularly limited, and may be a top gate type TFT or a bottom gate type TFT.

The pixel portion 1102 includes a switching TFT 1111 and a current control TFT 1112.
And a first electrode (anode) 1113 electrically connected to the drain thereof. The current control TFT 1112 may be an n-channel TFT or a p-channel TFT, but when connected to the anode, it is preferably a p-channel TFT. In addition, it is preferable to appropriately provide a storage capacitor (not shown). Note that here, only a cross-sectional structure of one pixel among the infinitely arranged pixels is shown, and an example in which two TFTs are used for the one pixel is shown. However, three or more TFTs are appropriately used. , May be used.

Here, since the first electrode 1113 is in direct contact with the drain of the TFT, the lower layer of the first electrode 1113 is a material layer that can be in ohmic contact with the drain made of silicon, and a layer containing an organic compound. It is desirable that the uppermost layer in contact is a material layer having a large work function. For example, a transparent conductive film (ITO (indium tin oxide alloy), indium oxide zinc oxide alloy (In ₂ O ₃ —ZnO), zinc oxide (ZnO), or the like) is used.

In addition, insulators (referred to as banks, partition walls, barriers, banks, or the like) 1114 are formed on both ends of the first electrode (anode) 1113. The insulator 1114 may be formed using an organic resin film or an insulating film containing silicon. Here, as the insulator 1114, a positive-type photosensitive acrylic resin film is used to form an insulator having a shape shown in FIG.

In order to improve the coverage, a curved surface having a curvature is formed at the upper end portion or the lower end portion of the insulator 1114. For example, when positive photosensitive acrylic is used as a material for the insulator 1114, it is preferable that only the upper end portion of the insulator 1114 have a curved surface with a curvature radius (0.2 μm to 3 μm). As the insulator 1114, either a negative type that becomes insoluble in an etchant by photosensitive light or a positive type that becomes soluble in an etchant by light can be used.

Alternatively, the insulator 1114 may be covered with a protective film formed of an aluminum nitride film, an aluminum nitride oxide film, a thin film containing carbon as its main component, or a silicon nitride film.

Further, a layer 111 containing an organic compound is formed over the first electrode (anode) 1113 by an evaporation method.
5 is formed selectively. In this example, the layer 1115 containing an organic compound is formed using the manufacturing apparatus described in Embodiment 2 to obtain a uniform film thickness. Further, a second electrode (cathode) 1116 is formed over the layer 1115 containing an organic compound. As the cathode, a material having a low work function (A
l, Ag, Li, Ca, or alloys thereof MgAg, MgIn, AlLi, CaF ₂ ,
Or CaN) may be used. Here, the second electrode (cathode) is used to transmit light.
1116, a thin metal film (MgAg: film thickness: 10 nm) and a film thickness of 110 n
A laminate of m transparent conductive films (ITO (indium tin oxide alloy), indium oxide zinc oxide alloy (In ₂ O ₃ —ZnO), zinc oxide (ZnO), etc.) is used. Thus, the first electrode (anode) 1113, the layer 1115 containing an organic compound, and the second electrode (cathode)
A light emitting element 1118 made of 1116 is formed. In this example, layer 1 containing an organic compound
115, CBP (film thickness 30 nm) including CuPc (film thickness 20 nm), α-NPD (film thickness 30 nm), organometallic complex (Pt (ppy) acac) having platinum as a central metal, BC
P (film thickness 20 nm), BCP: Li (film thickness 40 nm)
Are sequentially laminated to obtain white light emission. In this embodiment, since the light-emitting element 1118 emits white light, a color filter including a colored layer 1131 and a light-blocking layer (BM) 1132 (for the sake of simplicity, an overcoat layer is not shown here) is provided.

In such a double-sided light emitting display device, optical films 1140 and 1141 are provided for preventing the background from being seen through and preventing reflection of external light. Optical film 1140
, 1141 include a polarizing film (high transmission polarizing plate, thin polarizing plate, white polarizing plate, high performance dye polarizing plate, AR polarizing plate, etc.) and retardation film (broadband 1 / 4λ plate, temperature compensation type) A phase difference film, a twisted phase difference film, a wide viewing angle phase difference film, a biaxially oriented phase difference film, etc.) and a brightness enhancement film may be used in appropriate combination. For example, if a polarizing film is used as the optical films 1140 and 1141 and the light polarizing directions are orthogonal to each other, the effect of preventing the background from being seen through and the effect of preventing reflection can be obtained. In this case, the portion other than the portion that emits light and displays is black, and the background can be seen through no matter which side the display is viewed. Further, since light emitted from the light emitting panel passes through only one polarizing plate, it is displayed as it is.

Even if the two polarizing films are not orthogonal to each other, the same effect can be obtained as long as the directions of polarization of light are within ± 45 °, preferably within ± 20 °.

The optical films 1140 and 1141 can prevent the background from being seen through and seeing the display when it is viewed from one side.

Furthermore, another optical film may be added. For example, one polarizing film absorbs an S wave (or P wave), but a brightness increasing film that reflects and reproduces the S wave (or P wave) on the light emitting element side is provided between the polarizing plate and the light emitting panel. Also good. As a result, the P wave (or S wave) passing through the polarizing plate increases, and an increase in the integrated light quantity is obtained. In a double-sided light-emitting panel, the layer structure through which the light-emitting element passes differs, so the state of light emission (luminance, color degree, etc.) differs, and the optical film is useful for adjusting the light emission balance of both. . In the double-sided light-emitting panel, since the degree of reflection of external light is also different, it is preferable to provide a brightness enhancement film between the polarizing plate and the light-emitting panel on a more reflective surface.

In addition, a transparent protective laminate 1117 is formed to seal the light emitting element 1118. This transparent protective laminate 1117 is formed of a laminate of a first inorganic insulating film, a stress relaxation film, and a second inorganic insulating film. As the first inorganic insulating film and the second inorganic insulating film, sputtering or CV can be used.
Silicon nitride film, silicon oxide film, silicon oxynitride film (SiNO film (composition ratio N>) obtained by D method
O) or a SiON film (composition ratio N <O)), a thin film mainly containing carbon (for example, a DLC film,
CN film) can be used. These non-insulating films have a high blocking effect against moisture. However, as the film thickness increases, the film stress increases and peeling or film peeling tends to occur. However, by sandwiching the stress relaxation film between the first inorganic insulating film and the second inorganic insulating film, stress can be relaxed and moisture can be absorbed. Even if a minute hole (pinhole or the like) is formed in the first inorganic insulating film for some reason during film formation, it is filled with a stress relaxation film and a second inorganic insulating film is provided thereon. Therefore, it has a very high blocking effect against moisture and oxygen. Further, as the stress relaxation film, a material having a lower stress than the inorganic insulating film and having a hygroscopic property is preferable. In addition, it is desirable that the material has translucency. As a stress relaxation film, α-NPD (4,4′-bis- [N- (naphthyl) -N-phenyl) is used.
-Amino] biphenyl), BCP (vasocuproin), MTDATA (4,4 ', 4 "-tris (N
-3-methylphenyl-N-phenyl-amino) triphenylamine), Alq ₃ (Tris-8-
Material films containing an organic compound such as quinolinolato aluminum complex) may be used, and these material films are hygroscopic and are almost transparent if the film thickness is small. MgO, SrO ₂
, SrO has hygroscopicity and translucency, and a thin film can be obtained by a vapor deposition method, so that it can be used as a stress relaxation film. In this embodiment, a film formed in an atmosphere containing nitrogen and argon using a silicon target, that is, a silicon nitride film having a high blocking effect against impurities such as moisture and alkali metal is used as the first inorganic insulating film or the first film. 2 as an inorganic insulating film, and an Alq ₃ thin film is used as a stress relaxation film by vapor deposition. Moreover, in order to allow light emission to pass through the transparent protective laminate, it is preferable to make the total thickness of the transparent protective laminate as thin as possible.

Further, the first sealant 1105 is sealed in an inert gas atmosphere in order to seal the light emitting element 1118.
Then, the sealing substrate 1104 is bonded to the second sealing material 1107. First sealing material 1
As 105, an epoxy resin is preferably used. The second sealing material 1107 is not particularly limited as long as it is a light-transmitting material, and typically, an ultraviolet curable or thermosetting epoxy resin is preferably used. Here, the refractive index is 1.50, the viscosity is 500 cps,
Shore D hardness 90, Tensile strength 3000 psi, Tg point 150 ° C., Volume resistance 1 × 10 ¹⁵
A highly heat-resistant UV epoxy resin (Electrolite Co., Ltd .: 2500 Clear) having a resistance of Ω · cm and a withstand voltage of 450 V / mil is used. Further, by filling the second sealant 1107 between the pair of substrates, the entire transmittance can be improved as compared with a case where a space (inert gas) is provided between the pair of substrates. The first sealing material 1105 and the second sealing material 1107 are preferably materials that do not transmit moisture and oxygen as much as possible.

Further, in this embodiment, a plastic substrate made of FRP (Fiberglass-Reinforced Plastics), PVF (polyvinyl fluoride), Mylar, polyester, acrylic, or the like is used as a material constituting the sealing substrate 1104 in addition to a glass substrate or a quartz substrate. be able to.
Further, after the sealing substrate 1104 is bonded using the first sealing material 1105 and the second sealing material 1107, it is also possible to seal with a third sealing material so as to cover the side surface (exposed surface).

By enclosing the light emitting element in the first sealing material 1105 and the second sealing material 1107 as described above, the light emitting element can be completely blocked from the outside, and deterioration of the organic compound layer such as moisture and oxygen from the outside can be performed. Prevent encouraging substances from entering. Therefore, a highly reliable light-emitting device can be obtained.

In the case of manufacturing a top emission light emitting device, the anode is preferably a reflective metal film (such as chromium or titanium nitride). When a bottom emission type light emitting device is manufactured, the cathode is made of Al, Ag, Li, Ca, or alloys thereof MgAg, MgIn, Al
It is preferable to use a metal film made of Li (film thickness 50 nm to 200 nm).

This embodiment can be freely combined with any one of Embodiment Modes 1 to 4 and Embodiments 1 to 3.

In this embodiment, an example of an electronic device including two or more display devices will be described with reference to FIG. By implementing the present invention, an electronic device including an EL module can be completed. Electronic devices include video cameras, digital cameras, goggle-type displays (head-mounted displays), navigation systems, sound playback devices (car audio, audio components, etc.), notebook-type personal computers, game devices, and portable information terminals (mobile computers, A mobile phone, a portable game machine, an electronic book, or the like), an image playback device including a recording medium (specifically, a display capable of playing back a recording medium such as a digital versatile disc (DVD) and displaying the image) Apparatus).

FIG. 13A is a perspective view of a notebook personal computer, and FIG.
FIG. 3 is a perspective view showing a folded state. The notebook personal computer has a main body 220.
1, a housing 2202, display portions 2203 a and 2203 b, a keyboard 2204, an external connection port 2205, a pointing mouse 2206, and the like.

A laptop personal computer shown in FIGS. 13A and 13B includes a high-quality display portion 2203a that mainly displays an image in full color and a display portion 2203b that mainly displays characters and symbols in monochrome. I have.

FIG. 13C is a perspective view of the mobile computer, and FIG. 13D is a perspective view showing the back side. The mobile computer includes a main body 2301 and display units 2302a and 2302.
2b, switch 2303, operation key 2304, infrared port 2305, and the like. A high-quality display portion 2302a that mainly displays an image in full color and a display portion 2302b that mainly displays characters and symbols in monochrome are provided.

FIG. 13E illustrates a video camera, which includes a main body 2601, a display portion 2602, and a housing 260.
3, external connection port 2604, remote control receiver 2605, image receiver 2606, battery 2
607, a voice input unit 2608, operation keys 2609, and the like. A display portion 2602 is a double-sided light-emitting panel, and can display high-quality images that mainly display full-color images on one side, and can mainly display characters and symbols in monochrome on the other side. Note that the display portion 2602 can be rotated at the attachment portion. The present invention can be applied to the display portion 2602.

FIG. 13F is a perspective view of a mobile phone, and FIG. 13G is a perspective view showing a folded state. A cellular phone includes a main body 2701, a housing 2702, display portions 2703 a and 270.
3b, audio input unit 2704, audio output unit 2705, operation key 2706, external connection port 2
707, an antenna 2708, and the like.

The mobile phone shown in FIGS. 13F and 13G mainly includes a high-quality display portion 2703a that displays images in full color, and a display portion 2703b that mainly displays characters and symbols in area colors.
And. In this case, the display unit 2703a uses a color filter, and the display unit 27
For 03b, an optical film having an area color is used.

In addition, this embodiment can be freely combined with any one of Embodiment Modes 1 to 4 and Embodiments 1 to 4.

FIG. 16 shows a diagram when a mobile phone using the display device of the present invention is charged. In FIG. 16, both sides emit light while the mobile phone is open, but it may be closed. In general, in a display device using a light emitting element, the light emitting element deteriorates with time, and the luminance decreases. In particular, in the case of a display device in which a light emitting element is arranged for each pixel, since the lighting frequency of the pixel differs depending on the location, the degree of deterioration varies depending on the location. Therefore, the pixels with higher lighting frequency are more severely deteriorated, and the image quality is lowered as a burn-in phenomenon. Therefore, by performing a display such as during charging that is not in the normal use state, and by lighting pixels that are less frequently used,
It becomes possible to make burn-in less noticeable. Display contents during charging include full lighting, an image obtained by reversing the brightness of a standard image (such as a reception screen), and an image that is detected and displayed by pixels that are not used frequently.

FIG. 14 is a block diagram corresponding to FIG. 16, but when the CPU 2001 obtains a signal for detecting the state of charge from the charger 2017, the display controller 2004 is instructed to display the signal corresponding to the above. The light emitting display emits light.

FIG. 15 shows an example of means for creating an image in which the light and darkness of the standard signal is reversed.
The output of the video signal selection switch 2106 is input to the switch 2107, and the switch 2106
This signal can be selected as input to the display 2101 as it is or inverted. If light-dark reversal is required, it may be reversed before input. This selection is made by the display controller. In addition, when all lighting is performed, a fixed voltage may be input to the display 2101.
(Not shown)

In this way, it is possible to suppress deterioration in display image quality by performing light emission that reduces burn-in during charging.

In addition, this embodiment can be freely combined with any one of Embodiment Modes 1 to 4 and Embodiments 1 to 5.

Claims (4)

A mask,
A frame for fixing the mask;
Having an adhesive for bonding the mask and the frame;
The mask corresponds to any one of a region where a vapor deposition film for a red light emitting element is provided, a region where a vapor deposition film for a green light emitting element is provided, and a region where a vapor deposition film for a blue light emitting element is provided. Has a plurality of openings,
The plurality of openings have first to third openings,
In the row direction, the first opening is adjacent to the second opening;
In the column direction, the first opening is adjacent to the third opening,
The arrangement interval between the first opening and the second opening is longer than the arrangement interval between the first opening and the third opening.
The four corners of the frame have roundness toward the outside,
The adhesive may be a mini selectively positioned locations that match the line passing through the thermal expansion center of said frame,
The deposition mask according to claim 1, wherein the thermal expansion center is a portion that does not change when thermal expansion occurs such that the outer periphery and inner periphery of the frame change. A mask,
A frame for fixing the mask;
Having an adhesive for bonding the mask and the frame;
The mask corresponds to any one of a region where a vapor deposition film for a red light emitting element is provided, a region where a vapor deposition film for a green light emitting element is provided, and a region where a vapor deposition film for a blue light emitting element is provided. Has a plurality of openings,
The plurality of openings have first to third openings,
In the row direction, the first opening is adjacent to the second opening;
In the column direction, the first opening is adjacent to the third opening,
The arrangement interval between the first opening and the second opening is longer than the arrangement interval between the first opening and the third opening.
The four corners of the frame have a curvature whose center of curvature is within the frame;
The adhesive may be a mini selectively positioned locations that match the line passing through the thermal expansion center of said frame,
The deposition mask according to claim 1, wherein the thermal expansion center is a portion that does not change when thermal expansion occurs such that the outer periphery and inner periphery of the frame change. A mask,
A frame for fixing the mask;
Having an adhesive for bonding the mask and the frame;
The mask corresponds to any one of a region where a vapor deposition film for a red light emitting element is provided, a region where a vapor deposition film for a green light emitting element is provided, and a region where a vapor deposition film for a blue light emitting element is provided. Has a plurality of openings,
The plurality of openings have first to third openings,
In the row direction, a first non-opening is provided between the first opening and the second opening,
In the column direction, a second non-opening is provided between the first opening and the third opening,
The width of the first non-opening is wider than the width of the second non-opening,
The four corners of the frame have roundness toward the outside,
The adhesive may be a mini selectively positioned locations that match the line passing through the thermal expansion center of said frame,
The deposition mask according to claim 1, wherein the thermal expansion center is a portion that does not change when thermal expansion occurs such that the outer periphery and inner periphery of the frame change. A vapor deposition method using the vapor deposition mask according to any one of claims 1 to 3,
Preparing a plurality of the masks;
Corresponding to any one of the region where the vapor deposition film for the red light emitting element is provided, the region where the vapor deposition film for the green light emitting element is provided, and the region where the vapor deposition film for the blue light emitting element is provided, The vapor deposition method characterized by vapor-depositing the light emitting layer which the said light emitting element has.

Images