JP5567285B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more particularly, to a sheet peeling apparatus and a peeling method that can peel an adhesive sheet against an adherend to prevent the adherend from being lifted.

  A semiconductor wafer (hereinafter simply referred to as a “wafer”) may be integrated (mounted) on a ring frame via a mounting tape in consideration of handling properties when performing various processing, particularly dicing processing. Has been done. In addition, an adhesive sheet for protecting the circuit surface is attached to the wafer, and the adhesive sheet is peeled off from the wafer at a stage after predetermined processing of the wafer.

  Known sheet peeling apparatuses are disclosed in, for example, Patent Documents 1 and 2. The sheet peeling apparatus disclosed in Patent Document 1 includes a plate-like folding means capable of pressing an adhesive sheet folded during peeling to a semiconductor chip side as an adherend, and prevents the semiconductor chip from lifting up. Is configured to peel off.

  Patent Document 2 discloses a sheet peeling apparatus that peels an adhesive sheet via a peeling tape in a state where a wafer is mounted on a ring frame.

JP 2004-31535 A WO97 / 08745 Publication

  However, when the adhesive sheet is peeled off from the wafer integrated with the ring frame as disclosed in Patent Document 2 via the mounting tape with the peeling device as described in Patent Document 1, the folding means comes into contact with the ring frame. Therefore, there is a disadvantage that the folding means cannot be brought closer to the wafer side. For this reason, depending on the thickness of the ring frame or the adhesive sheet, the pressing force to the wafer side by the folding means is insufficient or no pressing force is applied, and the wafer is lifted and cracked together with the adhesive sheet without being peeled off. , Inconvenience.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of peeling an adhesive sheet while preventing an adherend such as a wafer from cracking. Is to provide.

In order to achieve the above object, the present invention provides a sheet peeling apparatus for peeling an adhesive sheet affixed to an adherend from the adherend via a peeling tape.
A supporting means for supporting the adherend, a feeding means for feeding out the peeling tape, a sticking means for sticking the peeling tape to the adhesive sheet, and an adhesive sheet by relatively moving the peeling tape and the adherend Moving means for peeling off, and folding means capable of maintaining the folded posture of the adhesive sheet folded during peeling,
The support means is provided on the outer side of the inner table for supporting the adherend, and on the outer side of the inner table. An adjustment means capable of adjusting the relative distance between the folding means supported by the table and the adherend ,
It said outer table, adopts a configuration in which the fold-back means Ru provided directly or indirectly can support the outside than the outer edge of the adherend.

In the present invention, the adherend is a semiconductor wafer in which the adhesive sheet is affixed on one surface and the other surface is integrated with a ring frame via a mounting tape,
The inner table is provided so as to be able to support a region corresponding to the semiconductor wafer from the mounting tape side, and the outer table is provided so as to be able to support a ring frame from the mounting tape side,
The outer table may be configured to be able to support the folding means via the ring frame.

  Furthermore, a configuration in which the folding means includes a shaft-like body and a plurality of interposing means rotatably provided on the shaft-like body is preferably employed.

Furthermore, the peeling method of the present invention is a sheet peeling method for peeling an adhesive sheet affixed to an adherend from the adherend via a peeling tape.
Supporting the adherend with an inner table;
An attaching step of attaching the peeling tape to an adhesive sheet;
Folding means that moves relative to the inner table and an outer table provided outside the inner table, and that can be directly or indirectly supported by the outer table outside the outer edge of the adherend. Adjusting the relative distance to the adherend;
A step of peeling the adhesive sheet from the adherend while maintaining the folded posture of the adhesive sheet folded by the folding means while relatively moving the peeling tape and the adherend. .

  According to the present invention, it is possible to adjust the relative distance between the adherend supported by the inner table and the folding means supported on the outer table by operating the adjusting means. Therefore, even if conditions such as the thickness of the ring frame and the adhesive sheet and the presence or absence of the ring frame on the outer table change, the pressing force to the adhesive sheet folded by the folding means can be maintained well. Thereby, it becomes possible to avoid that the adherend is lifted together with the adhesive sheet and the adherend is cracked or broken in the adhesive sheet when the adhesive sheet is peeled off. Such an effect can be advantageously obtained when the adherend is a very thin wafer and the wafer is integrated with the ring frame via a mounting tape.

  Moreover, when the folding | turning means is provided with the several interposition means which can rotate, it becomes possible to rotate separately according to the advancing direction of the target object which the said folding | turning means contacts.

1 is a schematic front view of a part of a sheet peeling apparatus according to an embodiment. The principal part schematic plan view of FIG. The principal part enlarged front view during adhesive sheet peeling. The schematic front view which shows the state which affixed the tape for peeling on the adhesive sheet. The top view similar to FIG. 2 of the sheet peeling apparatus which concerns on a modification. The principal part schematic front view which partially saw the sheet peeling apparatus which concerns on the said modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 4, the sheet peeling apparatus 10 peels the adhesive sheet S from the supporting means 11 that supports the wafer W as the adherend having the adhesive sheet S attached to one surface (upper surface in FIG. 1). The feeding means 12 for feeding out the strip-like peeling tape PT for cutting, the cutting means 13 for cutting the peeling tape PT every predetermined length, and the lead end side of the peeling tape PT projecting outward from the outer periphery of the adhesive sheet S In this state, the affixing means 14 for affixing the peeling tape PT to the adhesive sheet S, the holding means 15 for holding the lead end side of the peeling tape PT, and the moving means for moving the holding means 15 in the left-right direction in FIG. 1, a single-axis robot 16 constituting a moving means for moving the support means 11 in the left-right direction in FIG. 1, and a folding means 17 provided above the support means 11. It is configured. Here, in this embodiment, although not particularly limited, the wafer W is integrated with the ring frame RF via the mounting tape MT on the other surface (the lower surface in FIG. 1).

  The support means 11 relatively moves the inner table 18 formed in a substantially circular shape in plan view, the outer table 19 provided outside the inner table 18, and the inner table 18 and the outer table 19 in the vertical direction in FIG. And adjusting means 20 to be configured. The upper surfaces of the inner table 18 and the outer table 19 are suction surfaces. The inner table 18 is provided so as to be able to support an area corresponding to the wafer W from the lower side, and the outer table 19 can support the ring frame RF from the lower side. . The adjusting unit 20 includes a first linear motor 20A that moves the inner table 18 up and down and a second linear motor 20B that moves the outer table 19 up and down with respect to the base plate BP connected to the single-axis robot 16. Therefore, the relative height of each upper surface of the inner table 18 and the outer table 19 can be changed by operating the first and second linear motors 20A and 20B.

  The feeding means 12 is supported by the frame F and supports the peeling tape PT so that the peeling tape PT can be fed, a driving roller 22 that applies a feeding output to the peeling tape PT by driving the motor M, A pinch roller 23 sandwiching the peeling tape PT between the driving roller 22, a guide roller 24 positioned at the lower end of the frame F, a recess 27 A on the upper surface, and a shaft 26, a coil spring 28, and a bush 25. 1 and a tape guide plate 27 always biased to the left in FIG.

  The cutting means 13 includes a cutter blade 30, a cylinder 31 that moves the cutter blade 30 back and forth in the vertical direction, and a cylinder 32 that supports the cylinder 31 so as to be movable in the direction perpendicular to the paper surface in FIG.

  The affixing means 14 includes a heat block 35 and a cylinder 36 for moving the heat block 35 in the vertical direction, and adheres the peeling tape PT to the outer peripheral portion of the adhesive sheet S at the lower end of the heat block 35. It has become.

  The holding means 15 includes an upper chuck 38 and a lower chuck 39, and a chuck cylinder 40 that supports the chucks 38 and 39 so as to be separated from each other.

  The folding means 17 includes a shaft-like body 42 formed longer than the vertical width in FIG. 2 of the outer table 19, a bearing 43 as a plurality of interposing means provided on the outer peripheral side of the shaft-like body 42, and a shaft-like shape. A single-axis robot 46 having a slider 45 that supports the body 42 so as to be movable in the left-right direction in FIG. Each bearing 43 is provided so as to be relatively rotatable with respect to the shaft-like body 42, and the shaft-like body 42 is provided so as to be able to be kept out of contact with the outer table 19 and the ring frame RF. Thereby, each bearing 43 is provided in contact with the adhesive surface of the adhesive sheet S or the upper surface in FIG.

  Next, the sheet peeling method by the sheet peeling apparatus 10 in this embodiment is demonstrated.

  By the initial setting, as shown in FIG. 1, the lead end of the peeling tape PT is set so as to be positioned in the recess of the tape guide plate 27.

  When the wafer W integrated with the ring frame RF and attached with the adhesive sheet S is placed on the support means 11 by a transfer device (not shown), the chuck cylinder 40 moves to the right side in FIG. Is moved to the right side to sandwich the lead end side of the peeling tape PT between the upper chuck 38 and the lower chuck 39 and moved to the left side to pull out the peeling tape PT.

  Next, as indicated by a two-dot chain line in FIG. 4, the heat block 35 is lowered and the peeling tape PT is pressed against the outer peripheral portion of the adhesive sheet S and pasted. Thereafter, the cutter blade 30 is lowered through the cylinders 31 and 32 and moves in the direction perpendicular to the paper surface in FIG. 1, whereby the peeling tape PT is cut along the concave portion 27 </ b> A of the tape guide plate 27.

  As shown in FIG. 3, the height of the outer table 19 is adjusted by the second linear motor 20 </ b> B so that the lower end of the bearing 43 contacts the upper surface of the ring frame RF. Thus, the bearing 43 and the shaft-like body 42 are supported from below by the outer table 19 via the ring frame RF. The distance between the lower end of the bearing 43 and the upper surface of the wafer W is adjusted to a distance corresponding to twice the thickness of the adhesive sheet S by the first linear motor 20A. The movement amounts of the first and second linear motion motors 20A and 20B are stored in advance in a control means (not shown).

  Next, the single-axis robot 16 and the single-axis robot (not shown) that moves the holding means 15 are operated to move the peeling tape PT attached to the adhesive sheet S and the wafer W relative to each other in the left-right direction. The S is peeled off from the wafer W while being folded. At this time, as shown in FIG. 3, the single-axis robot 46 is operated so that the bearing 43 is positioned on the folding edge SE of the adhesive sheet S, and the folded posture of the adhesive sheet S is maintained. Then, the peeling tape PT and the wafer W are further moved relative to each other to completely peel the adhesive sheet S from the wafer W.

  Here, during the peeling of the adhesive sheet S, the bearings 43 in the range indicated by reference numeral H1 in FIG. 2, that is, the bearings 43 in contact with the adhesive sheet S rotate in the direction of the arrow R1 in FIG. On the other hand, each bearing 43 in the range indicated by reference numeral H2 in FIG. 2, that is, the bearing 43 in contact with the ring frame RF, rotates in the direction of arrow R2 in FIG. Thereby, each bearing 43 can be rotated individually according to the traveling direction of the object to be in contact, and even when the traveling direction of the adhesive sheet S and the traveling direction of the ring frame RF are opposite, it can be handled without difficulty.

  Therefore, according to such an embodiment, by moving the inner table 18 and the outer table 19 by the adjusting means 20, the relative heights of the upper surfaces thereof can be adjusted, and consequently contact the ring frame RF. The relative distance between the folding means 17 and the upper surface of the wafer W can be adjusted. Thereby, for example, even when the thickness of the adhesive sheet S that is folded back to be two sheets is smaller than the thickness of the ring frame RF, the folding means 17 is used when peeling the adhesive sheet S from the wafer W. The downward pressing force can be maintained moderately, and it is possible to avoid the wafer W from being lifted and cracked together with the adhesive sheet S.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, as long as the folding means 17 can maintain the folded posture of the adhesive sheet S, various design changes are possible, and the ring frame RF and the mounting tape MT may be omitted. Specifically, as shown in FIGS. 5 and 6, the folding means 17 may be constituted by a plate-like body 48 and a moving means (not shown) that moves the plate-like body 48 in the left-right direction in the figure. Good. In the configuration shown in the figure, the lower surface of the plate body 48 is supported on the upper surface of the outer table 19 by the second linear motion motor 20B, and the lower surface of the plate body 48 and the upper surface of the wafer W are supported by the first linear motion motor 20A. Is adjusted to a distance corresponding to about twice the thickness of the adhesive sheet S. Thereafter, the adhesive sheet S is moved so that the plate-like body 48 is positioned on the folded adhesive sheet S while the peeling of the adhesive sheet S proceeds, so that the folded posture of the adhesive sheet S is favorably maintained. The adhesive sheet S can be peeled off from the wafer W while preventing it from lifting.

  Furthermore, the single-axis robots 16 and 46, the cylinders 31, 32 and 36, and the direct acting motors 20A and 20B may be replaced with driving means such as other single-axis robots, direct acting motors, air cylinders and hydraulic cylinders.

  Further, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.

  Further, the relative movement between the peeling tape PT and the wafer W at the time of peeling the adhesive sheet S by the moving means may be performed by moving at least one of the supporting means 11 and the holding means 15. Further, the moving means may be operated so that the folding edge SE of the adhesive sheet S is positioned below the shaft-like body 42 and the bearing 43 without moving to the left and right in FIG.

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Support means 12 Feeding means 14 Sticking means 16 Single axis robot (moving means)
17 Folding means 18 Inner table 19 Outer table 20 Adjustment means 42 Shaft-shaped body 43 Bearing (interposition means)
MT Mounting tape PT Stripping tape RF Ring frame S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (4)

In the sheet peeling apparatus for peeling the adhesive sheet affixed to the adherend from the adherend via the peeling tape,
A supporting means for supporting the adherend, a feeding means for feeding out the peeling tape, a sticking means for sticking the peeling tape to the adhesive sheet, and an adhesive sheet by relatively moving the peeling tape and the adherend Moving means for peeling off, and folding means capable of maintaining the folded posture of the adhesive sheet folded during peeling,
The support means is provided on the outer side of the inner table for supporting the adherend, and on the outer side of the inner table. An adjustment means capable of adjusting the relative distance between the folding means supported by the table and the adherend ,
The sheet peeling apparatus according to claim 1, wherein the outer table is provided so as to be able to directly or indirectly support the folding means outside the outer edge of the adherend . The adherend is a semiconductor wafer in which the adhesive sheet is affixed on one surface and integrated with a ring frame via a mounting tape on the other surface,
The inner table is provided so as to be able to support a region corresponding to the semiconductor wafer from the mounting tape side, and the outer table is provided so as to be able to support a ring frame from the mounting tape side,
2. The sheet peeling apparatus according to claim 1, wherein the outer table is provided so as to be able to support the folding means via the ring frame.   3. The sheet peeling apparatus according to claim 1, wherein the folding means includes a shaft-like body and a plurality of interposing means provided rotatably on the shaft-like body. In the sheet peeling method for peeling the adhesive sheet affixed to the adherend from the adherend via the peeling tape,
Supporting the adherend with an inner table;
An attaching step of attaching the peeling tape to an adhesive sheet;
Folding means that moves relative to the inner table and an outer table provided outside the inner table, and that can be directly or indirectly supported by the outer table outside the outer edge of the adherend. Adjusting the relative distance to the adherend;
A step of peeling the adhesive sheet from the adherend while maintaining the folded posture of the adhesive sheet folded by the folding means while relatively moving the peeling tape and the adherend. Sheet peeling method.

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