JP5544617B2 - 合金皮膜の無電解めっき方法およびめっき液 - Google Patents
合金皮膜の無電解めっき方法およびめっき液 Download PDFInfo
- Publication number
- JP5544617B2 JP5544617B2 JP2009538238A JP2009538238A JP5544617B2 JP 5544617 B2 JP5544617 B2 JP 5544617B2 JP 2009538238 A JP2009538238 A JP 2009538238A JP 2009538238 A JP2009538238 A JP 2009538238A JP 5544617 B2 JP5544617 B2 JP 5544617B2
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- JP
- Japan
- Prior art keywords
- plating
- substrate
- solution
- metal
- metal compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 55
- 238000000034 method Methods 0.000 title claims description 30
- 229910045601 alloy Inorganic materials 0.000 title claims description 28
- 239000000956 alloy Substances 0.000 title claims description 28
- 238000007772 electroless plating Methods 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 150000002736 metal compounds Chemical class 0.000 claims description 19
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 18
- 150000003839 salts Chemical class 0.000 claims description 16
- 229910052741 iridium Inorganic materials 0.000 claims description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 229910052697 platinum Inorganic materials 0.000 claims description 11
- 239000002585 base Substances 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910001513 alkali metal bromide Inorganic materials 0.000 claims description 4
- 229910052936 alkali metal sulfate Inorganic materials 0.000 claims description 4
- 235000006408 oxalic acid Nutrition 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 30
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 23
- 239000010931 gold Substances 0.000 description 9
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 9
- 238000000576 coating method Methods 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 6
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 238000006467 substitution reaction Methods 0.000 description 5
- 229910001260 Pt alloy Inorganic materials 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- 229910000575 Ir alloy Inorganic materials 0.000 description 3
- 229910002835 Pt–Ir Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000601 superalloy Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 229910001325 element alloy Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
- 229910010277 boron hydride Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 150000002504 iridium compounds Chemical class 0.000 description 1
- HTFVQFACYFEXPR-UHFFFAOYSA-K iridium(3+);tribromide Chemical compound Br[Ir](Br)Br HTFVQFACYFEXPR-UHFFFAOYSA-K 0.000 description 1
- 150000002826 nitrites Chemical class 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- DANYXEHCMQHDNX-UHFFFAOYSA-K trichloroiridium Chemical compound Cl[Ir](Cl)Cl DANYXEHCMQHDNX-UHFFFAOYSA-K 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Description
1)メッキ液中に還元剤を加えて行う方法(還元剤として例えばボロンハイドライド、ヒドラジン、蟻酸または、金属としてはZn,Al、Feなどが有る)
2)自己分解型
3)置換型
本発明の無電解めっき方法は3)置換型であり、被めっき物としての基材をめっき液中に投入し、めっき液中でイオン化している金属を、基材の表面全部またはその一部に置換還元析出させる方法である。そして本発明は、多元素合金の皮膜を無電解めっきにより形成するためのめっき液に最も特徴を有している。
Claims (3)
- 金属化合物溶液を基材に接触させ、金属化合物を還元して、前記基材表面に金属を析出させる無電解めっき方法であって、前記金属化合物溶液として、PtとIr、もしくはさらにCo化合物を溶解した金属化合物溶液にアルカリ金属の臭化物もしくは硫酸塩の少なくとも一種を混入したpH0.4〜2.0の金属化合物溶液を用いると共に、前記基材としてNi系基材を用い、前記金属化合物溶液中に前記基材を浸漬して、前記各金属からなる合金皮膜を前記基材表面に形成することを特徴とする合金被膜の無電解めっき方法。
- 前記金属化合物溶液に、さらに、クエン酸またはその塩、シュウ酸またはその塩、酢酸またはその塩、マロン酸またはその塩のうちの1種又は2種以上を混入してあることを特徴とする請求項1に記載の合金皮膜の無電解めっき方法。
- 請求項1又は2に記載の無電解めっき方法に使用するめっき液であって、PtとIr、もしくはさらにCo化合物を溶解した金属化合物溶液にアルカリ金属の臭化物もしくは硫酸塩の少なくとも一種を混入したpH0.4〜2.0の金属化合物溶液であることを特徴とするめっき液。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009538238A JP5544617B2 (ja) | 2007-10-22 | 2008-10-22 | 合金皮膜の無電解めっき方法およびめっき液 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007273948 | 2007-10-22 | ||
JP2007273948 | 2007-10-22 | ||
PCT/JP2008/069161 WO2009054420A1 (ja) | 2007-10-22 | 2008-10-22 | 合金皮膜の無電解めっき方法およびめっき液 |
JP2009538238A JP5544617B2 (ja) | 2007-10-22 | 2008-10-22 | 合金皮膜の無電解めっき方法およびめっき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009054420A1 JPWO2009054420A1 (ja) | 2011-03-03 |
JP5544617B2 true JP5544617B2 (ja) | 2014-07-09 |
Family
ID=40579524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009538238A Expired - Fee Related JP5544617B2 (ja) | 2007-10-22 | 2008-10-22 | 合金皮膜の無電解めっき方法およびめっき液 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100291312A1 (ja) |
EP (1) | EP2213766A4 (ja) |
JP (1) | JP5544617B2 (ja) |
WO (1) | WO2009054420A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8317910B2 (en) * | 2010-03-22 | 2012-11-27 | Unity Semiconductor Corporation | Immersion platinum plating solution |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0347973A (ja) * | 1989-07-17 | 1991-02-28 | Nippon Kagaku Sangyo Kk | 亜鉛又は亜鉛合金の無電解ニッケルめっき方法 |
JPH0693459A (ja) * | 1991-10-18 | 1994-04-05 | Japan Energy Corp | 無電解錫−鉛合金めっき液 |
JP2000309876A (ja) * | 1999-04-23 | 2000-11-07 | Okuno Chem Ind Co Ltd | 置換型無電解錫−銀合金めっき液 |
JP2007123883A (ja) * | 2005-10-25 | 2007-05-17 | Samsung Electro Mech Co Ltd | プリント回路基板のメッキ層形成方法およびこれから製造されたプリント回路基板 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3917464A (en) * | 1973-07-20 | 1975-11-04 | Us Army | Electroless deposition of cobalt boron |
US4431685A (en) * | 1982-07-02 | 1984-02-14 | International Business Machines Corporation | Decreasing plated metal defects |
JPS5953667A (ja) * | 1982-09-20 | 1984-03-28 | Pentel Kk | 無電解めつき法 |
US4751110A (en) * | 1986-07-14 | 1988-06-14 | Shipley Company Inc. | Radiation attenuation shielding |
JP2972567B2 (ja) | 1996-03-21 | 1999-11-08 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 白金イリジウム合金めっき |
US6251249B1 (en) * | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
US6205657B1 (en) * | 1996-11-08 | 2001-03-27 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method for producing the same |
JP3117656B2 (ja) * | 1997-02-20 | 2000-12-18 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 白金イリジウム合金めっき |
US6162365A (en) * | 1998-03-04 | 2000-12-19 | International Business Machines Corporation | Pd etch mask for copper circuitization |
JP2000038681A (ja) * | 1998-07-21 | 2000-02-08 | Permelec Electrode Ltd | 置換めっき方法 |
US6521532B1 (en) * | 1999-07-22 | 2003-02-18 | James A. Cunningham | Method for making integrated circuit including interconnects with enhanced electromigration resistance |
US6361823B1 (en) * | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
US6506314B1 (en) * | 2000-07-27 | 2003-01-14 | Atotech Deutschland Gmbh | Adhesion of polymeric materials to metal surfaces |
AU2001278794A1 (en) * | 2000-08-21 | 2002-03-04 | Learonal Japan Inc. | Electroless displacement gold plating solution and additive for preparing said plating solution |
JP3855121B2 (ja) | 2001-09-28 | 2006-12-06 | 日立造船株式会社 | 固体高分子形水電解用電極接合体の作製方法 |
EP1245697A3 (de) * | 2002-07-17 | 2003-02-19 | ATOTECH Deutschland GmbH | Verfahren zum aussenstromlosen Abscheiden von Silber |
JP3837559B2 (ja) | 2003-09-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | アルミニウムが拡散浸透されたイリジウムと白金とからなる合金が被覆されたニッケル基超合金 |
JP4532385B2 (ja) | 2005-10-11 | 2010-08-25 | 田中貴金属工業株式会社 | 無電解めっき方法 |
-
2008
- 2008-10-22 US US12/734,293 patent/US20100291312A1/en not_active Abandoned
- 2008-10-22 JP JP2009538238A patent/JP5544617B2/ja not_active Expired - Fee Related
- 2008-10-22 EP EP08841306.7A patent/EP2213766A4/en not_active Withdrawn
- 2008-10-22 WO PCT/JP2008/069161 patent/WO2009054420A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0347973A (ja) * | 1989-07-17 | 1991-02-28 | Nippon Kagaku Sangyo Kk | 亜鉛又は亜鉛合金の無電解ニッケルめっき方法 |
JPH0693459A (ja) * | 1991-10-18 | 1994-04-05 | Japan Energy Corp | 無電解錫−鉛合金めっき液 |
JP2000309876A (ja) * | 1999-04-23 | 2000-11-07 | Okuno Chem Ind Co Ltd | 置換型無電解錫−銀合金めっき液 |
JP2007123883A (ja) * | 2005-10-25 | 2007-05-17 | Samsung Electro Mech Co Ltd | プリント回路基板のメッキ層形成方法およびこれから製造されたプリント回路基板 |
Also Published As
Publication number | Publication date |
---|---|
EP2213766A1 (en) | 2010-08-04 |
EP2213766A4 (en) | 2014-01-22 |
WO2009054420A1 (ja) | 2009-04-30 |
US20100291312A1 (en) | 2010-11-18 |
JPWO2009054420A1 (ja) | 2011-03-03 |
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