WO2009054420A1 - 合金皮膜の無電解めっき方法およびめっき液 - Google Patents

合金皮膜の無電解めっき方法およびめっき液 Download PDF

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Publication number
WO2009054420A1
WO2009054420A1 PCT/JP2008/069161 JP2008069161W WO2009054420A1 WO 2009054420 A1 WO2009054420 A1 WO 2009054420A1 JP 2008069161 W JP2008069161 W JP 2008069161W WO 2009054420 A1 WO2009054420 A1 WO 2009054420A1
Authority
WO
WIPO (PCT)
Prior art keywords
coating film
alloy coating
electroless plating
plating method
liquid
Prior art date
Application number
PCT/JP2008/069161
Other languages
English (en)
French (fr)
Inventor
Hideyuki Murakami
Yukio Matsubara
Syunsuke Moriizumi
Hiromichi Murakami
Mikiyo Yoshida
Original Assignee
National Institute For Materials Science
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute For Materials Science filed Critical National Institute For Materials Science
Priority to JP2009538238A priority Critical patent/JP5544617B2/ja
Priority to US12/734,293 priority patent/US20100291312A1/en
Priority to EP08841306.7A priority patent/EP2213766A4/en
Publication of WO2009054420A1 publication Critical patent/WO2009054420A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

　相互に異なる金属からなる複数の金属化合物を溶解した金属化合物溶中に前記基材を浸漬することにより、所望の合金組成をもった合金皮膜を前記基材表面に形成する。
PCT/JP2008/069161 2007-10-22 2008-10-22 合金皮膜の無電解めっき方法およびめっき液 WO2009054420A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009538238A JP5544617B2 (ja) 2007-10-22 2008-10-22 合金皮膜の無電解めっき方法およびめっき液
US12/734,293 US20100291312A1 (en) 2007-10-22 2008-10-22 Electroless plating method for alloy coating film and plating liquid
EP08841306.7A EP2213766A4 (en) 2007-10-22 2008-10-22 AUTOCATALYTIC DEPOSITION METHOD FOR ALLOY COATING FILM AND DEPOSITION FLUID

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-273948 2007-10-22
JP2007273948 2007-10-22

Publications (1)

Publication Number Publication Date
WO2009054420A1 true WO2009054420A1 (ja) 2009-04-30

Family

ID=40579524

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069161 WO2009054420A1 (ja) 2007-10-22 2008-10-22 合金皮膜の無電解めっき方法およびめっき液

Country Status (4)

Country Link
US (1) US20100291312A1 (ja)
EP (1) EP2213766A4 (ja)
JP (1) JP5544617B2 (ja)
WO (1) WO2009054420A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110229734A1 (en) * 2010-03-22 2011-09-22 Unity Semiconductor Corporation Immersion platinum plating solution

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347973A (ja) * 1989-07-17 1991-02-28 Nippon Kagaku Sangyo Kk 亜鉛又は亜鉛合金の無電解ニッケルめっき方法
JPH0693459A (ja) * 1991-10-18 1994-04-05 Japan Energy Corp 無電解錫−鉛合金めっき液
JPH09256189A (ja) 1996-03-21 1997-09-30 Electroplating Eng Of Japan Co 白金イリジウム合金めっき
JPH10237686A (ja) 1997-02-20 1998-09-08 Electroplating Eng Of Japan Co 白金イリジウム合金めっき
JP2000309876A (ja) * 1999-04-23 2000-11-07 Okuno Chem Ind Co Ltd 置換型無電解錫−銀合金めっき液
JP2003105579A (ja) 2001-09-28 2003-04-09 Hitachi Zosen Corp 固体高分子形水電解用電極接合体の作製方法
JP2005105299A (ja) 2003-09-26 2005-04-21 National Institute For Materials Science アルミニウムが拡散浸透されたイリジウムと白金とからなる合金が被覆されたニッケル基超合金
JP2007107021A (ja) 2005-10-11 2007-04-26 Tanaka Kikinzoku Kogyo Kk 無電解めっき方法及び白金めっき品並びに還元剤
JP2007123883A (ja) * 2005-10-25 2007-05-17 Samsung Electro Mech Co Ltd プリント回路基板のメッキ層形成方法およびこれから製造されたプリント回路基板

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US3917464A (en) * 1973-07-20 1975-11-04 Us Army Electroless deposition of cobalt boron
US4431685A (en) * 1982-07-02 1984-02-14 International Business Machines Corporation Decreasing plated metal defects
JPS5953667A (ja) * 1982-09-20 1984-03-28 Pentel Kk 無電解めつき法
US4751110A (en) * 1986-07-14 1988-06-14 Shipley Company Inc. Radiation attenuation shielding
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
US6205657B1 (en) * 1996-11-08 2001-03-27 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method for producing the same
US6162365A (en) * 1998-03-04 2000-12-19 International Business Machines Corporation Pd etch mask for copper circuitization
JP2000038681A (ja) * 1998-07-21 2000-02-08 Permelec Electrode Ltd 置換めっき方法
US6521532B1 (en) * 1999-07-22 2003-02-18 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance
US6361823B1 (en) * 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
US6506314B1 (en) * 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
AU2001278794A1 (en) * 2000-08-21 2002-03-04 Learonal Japan Inc. Electroless displacement gold plating solution and additive for preparing said plating solution
EP1245697A3 (de) * 2002-07-17 2003-02-19 ATOTECH Deutschland GmbH Verfahren zum aussenstromlosen Abscheiden von Silber

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347973A (ja) * 1989-07-17 1991-02-28 Nippon Kagaku Sangyo Kk 亜鉛又は亜鉛合金の無電解ニッケルめっき方法
JPH0693459A (ja) * 1991-10-18 1994-04-05 Japan Energy Corp 無電解錫−鉛合金めっき液
JPH09256189A (ja) 1996-03-21 1997-09-30 Electroplating Eng Of Japan Co 白金イリジウム合金めっき
JPH10237686A (ja) 1997-02-20 1998-09-08 Electroplating Eng Of Japan Co 白金イリジウム合金めっき
JP2000309876A (ja) * 1999-04-23 2000-11-07 Okuno Chem Ind Co Ltd 置換型無電解錫−銀合金めっき液
JP2003105579A (ja) 2001-09-28 2003-04-09 Hitachi Zosen Corp 固体高分子形水電解用電極接合体の作製方法
JP2005105299A (ja) 2003-09-26 2005-04-21 National Institute For Materials Science アルミニウムが拡散浸透されたイリジウムと白金とからなる合金が被覆されたニッケル基超合金
JP2007107021A (ja) 2005-10-11 2007-04-26 Tanaka Kikinzoku Kogyo Kk 無電解めっき方法及び白金めっき品並びに還元剤
JP2007123883A (ja) * 2005-10-25 2007-05-17 Samsung Electro Mech Co Ltd プリント回路基板のメッキ層形成方法およびこれから製造されたプリント回路基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110229734A1 (en) * 2010-03-22 2011-09-22 Unity Semiconductor Corporation Immersion platinum plating solution
US8317910B2 (en) * 2010-03-22 2012-11-27 Unity Semiconductor Corporation Immersion platinum plating solution
US8361560B2 (en) 2010-03-22 2013-01-29 Unity Semiconductor Corporation Immersion platinum plating solution

Also Published As

Publication number Publication date
EP2213766A4 (en) 2014-01-22
US20100291312A1 (en) 2010-11-18
JP5544617B2 (ja) 2014-07-09
JPWO2009054420A1 (ja) 2011-03-03
EP2213766A1 (en) 2010-08-04

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