JP5543178B2 - 超音波診断装置用プローブ及びその製造方法 - Google Patents

超音波診断装置用プローブ及びその製造方法 Download PDF

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Publication number
JP5543178B2
JP5543178B2 JP2009262222A JP2009262222A JP5543178B2 JP 5543178 B2 JP5543178 B2 JP 5543178B2 JP 2009262222 A JP2009262222 A JP 2009262222A JP 2009262222 A JP2009262222 A JP 2009262222A JP 5543178 B2 JP5543178 B2 JP 5543178B2
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Japan
Prior art keywords
electrode
probe
ultrasonic diagnostic
sound absorbing
absorbing layer
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Expired - Fee Related
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JP2009262222A
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English (en)
Japanese (ja)
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JP2010124467A (ja
JP2010124467A5 (enExample
Inventor
ソン ジェ イ，
ジョン リム パク，
ジェ イク キム，
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Samsung Medison Co Ltd
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Samsung Medison Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/08—Clinical applications
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Public Health (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biophysics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Veterinary Medicine (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
JP2009262222A 2008-11-19 2009-11-17 超音波診断装置用プローブ及びその製造方法 Expired - Fee Related JP5543178B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080115409A KR101112658B1 (ko) 2008-11-19 2008-11-19 초음파 진단장치용 프로브 및 그 제조방법
KR10-2008-0115409 2008-11-19

Publications (3)

Publication Number Publication Date
JP2010124467A JP2010124467A (ja) 2010-06-03
JP2010124467A5 JP2010124467A5 (enExample) 2013-07-18
JP5543178B2 true JP5543178B2 (ja) 2014-07-09

Family

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Family Applications (1)

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JP2009262222A Expired - Fee Related JP5543178B2 (ja) 2008-11-19 2009-11-17 超音波診断装置用プローブ及びその製造方法

Country Status (4)

Country Link
US (1) US9616463B2 (enExample)
EP (1) EP2190009A1 (enExample)
JP (1) JP5543178B2 (enExample)
KR (1) KR101112658B1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101196214B1 (ko) 2010-09-06 2012-11-05 삼성메디슨 주식회사 초음파 진단장치용 프로브
KR102205505B1 (ko) * 2014-03-04 2021-01-20 삼성메디슨 주식회사 초음파 프로브의 제조 방법 및 그 초음파 프로브
JP5923539B2 (ja) * 2014-03-20 2016-05-24 富士フイルム株式会社 超音波探触子
KR102092589B1 (ko) * 2014-04-23 2020-03-24 삼성전자주식회사 초음파 프로브 및 그 제조방법
US10265729B2 (en) * 2015-02-06 2019-04-23 Olympus Scientific Solutions Americas Inc. Phased array ultrasonic transducers with solderless stack bonding assembly
US11090031B2 (en) * 2015-02-06 2021-08-17 Koninklijke Philips N.V. Systems, methods, and apparatuses for thermal management of ultrasound transducers
WO2017091632A1 (en) * 2015-11-25 2017-06-01 Fujifilm Sonosite, Inc. High frequency ultrasound transducer and method for manufacture
EP3383276A4 (en) * 2015-11-25 2019-07-24 Fujifilm Sonosite, Inc. MEDICAL INSTRUMENT COMPRISING A NETWORK OF HIGH FREQUENCY ULTRASONIC TRANSDUCERS
KR102374007B1 (ko) * 2017-09-15 2022-03-14 지멘스 메디컬 솔루션즈 유에스에이, 인크. 초음파 트랜스듀서 및 그 제조 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5295487A (en) 1992-02-12 1994-03-22 Kabushiki Kaisha Toshiba Ultrasonic probe
JPH05227594A (ja) * 1992-02-17 1993-09-03 Olympus Optical Co Ltd 超音波探触子
US5810009A (en) * 1994-09-27 1998-09-22 Kabushiki Kaisha Toshiba Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe
JP3526486B2 (ja) * 1995-04-28 2004-05-17 株式会社東芝 超音波探触子，この探触子を備えた超音波プローブ，およびこれらの製造方法
JPH10112899A (ja) * 1996-10-07 1998-04-28 Toshiba Iyou Syst Eng Kk 超音波探触子
US6043590A (en) * 1997-04-18 2000-03-28 Atl Ultrasound Composite transducer with connective backing block
JP4408974B2 (ja) * 1998-12-09 2010-02-03 株式会社東芝 超音波トランスジューサ及びその製造方法
US6552471B1 (en) * 1999-01-28 2003-04-22 Parallel Design, Inc. Multi-piezoelectric layer ultrasonic transducer for medical imaging
US6558323B2 (en) * 2000-11-29 2003-05-06 Olympus Optical Co., Ltd. Ultrasound transducer array
JP3940683B2 (ja) * 2003-02-24 2007-07-04 株式会社東芝 超音波探触子及びその製造方法
JP2004363746A (ja) * 2003-06-03 2004-12-24 Fuji Photo Film Co Ltd 超音波用探触子及びその製造方法
JP4256309B2 (ja) * 2003-09-29 2009-04-22 株式会社東芝 超音波プローブおよび超音波診断装置
KR100546411B1 (ko) * 2004-05-20 2006-01-26 삼성전자주식회사 플립 칩 패키지, 그 패키지를 포함하는 이미지 센서 모듈및 그 제조방법
JP2006179821A (ja) * 2004-12-24 2006-07-06 Toshiba Corp プリント回路基板
EP1854413B1 (en) * 2005-01-18 2010-12-08 Esaote S.p.A. An ultrasound probe, particularly for diagnostic imaging
US7791252B2 (en) * 2007-01-30 2010-09-07 General Electric Company Ultrasound probe assembly and method of fabrication

Also Published As

Publication number Publication date
JP2010124467A (ja) 2010-06-03
KR101112658B1 (ko) 2012-02-15
US20100125209A1 (en) 2010-05-20
US9616463B2 (en) 2017-04-11
KR20100056308A (ko) 2010-05-27
EP2190009A1 (en) 2010-05-26

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