JP5541968B2 - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
- Publication number
- JP5541968B2 JP5541968B2 JP2010117637A JP2010117637A JP5541968B2 JP 5541968 B2 JP5541968 B2 JP 5541968B2 JP 2010117637 A JP2010117637 A JP 2010117637A JP 2010117637 A JP2010117637 A JP 2010117637A JP 5541968 B2 JP5541968 B2 JP 5541968B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- terminal connection
- terminals
- image sensor
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003384 imaging method Methods 0.000 title claims description 65
- 239000000758 substrate Substances 0.000 claims description 14
- 230000003287 optical effect Effects 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 description 24
- 238000005452 bending Methods 0.000 description 18
- 239000011521 glass Substances 0.000 description 10
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
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- 238000005286 illumination Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
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- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Camera Bodies And Camera Details Or Accessories (AREA)
- Endoscopes (AREA)
- Studio Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010117637A JP5541968B2 (ja) | 2010-05-21 | 2010-05-21 | 撮像装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010117637A JP5541968B2 (ja) | 2010-05-21 | 2010-05-21 | 撮像装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011249870A JP2011249870A (ja) | 2011-12-08 |
| JP2011249870A5 JP2011249870A5 (https=) | 2013-07-04 |
| JP5541968B2 true JP5541968B2 (ja) | 2014-07-09 |
Family
ID=45414643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010117637A Expired - Fee Related JP5541968B2 (ja) | 2010-05-21 | 2010-05-21 | 撮像装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5541968B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6124505B2 (ja) * | 2012-04-05 | 2017-05-10 | オリンパス株式会社 | 撮像モジュール |
| JP5711178B2 (ja) * | 2012-04-06 | 2015-04-30 | オリンパスメディカルシステムズ株式会社 | 撮像装置及びこの撮像装置を用いた内視鏡 |
| WO2014010283A1 (ja) * | 2012-07-10 | 2014-01-16 | オリンパスメディカルシステムズ株式会社 | 超音波内視鏡 |
| EP3827728B1 (en) * | 2013-07-01 | 2023-06-07 | EndoChoice, Inc. | Circuit board assembly of a multiple viewing elements endoscope |
| DE112016006595T5 (de) * | 2016-03-15 | 2018-12-13 | Olympus Corporation | Bildaufnahmevorrichtung, Endoskop und Verfahren zum Herstellen der Bildaufnahmevorrichtung |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08264705A (ja) * | 1995-03-28 | 1996-10-11 | Seiko Epson Corp | 半導体装置及びそれを用いた実装構造及び実装方法 |
| JP2000210252A (ja) * | 1999-01-25 | 2000-08-02 | Sony Corp | 固体撮像装置 |
-
2010
- 2010-05-21 JP JP2010117637A patent/JP5541968B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011249870A (ja) | 2011-12-08 |
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