JP5528193B2 - Component mounting apparatus and method for identifying cause of reduction in production throughput - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting a component such as a chip mounter on a substrate, and more particularly to a technique for specifying a decrease in production throughput.

  In a component mounting apparatus that mounts an electronic component on a circuit board, the component held by the feeder of the component supply apparatus is sucked by the suction nozzle of the mounting head, and is transported and mounted at a predetermined position on the circuit board. .

  In such a component mounting apparatus, it is important to maintain a high production throughput, which is the speed of producing a circuit board on which components are mounted. For this reason, when the production throughput decreases, it is necessary to identify the cause of the decrease and take countermeasures.

  As a factor of a decrease in production throughput, there is an abnormal operation of each part of the component mounting apparatus. For example, after the component mounting apparatus sucks the component with the suction nozzle, the suction nozzle that sucks the component is measured by a sensor to determine whether the posture of the component is abnormal. When there is an abnormality in the posture of the component, the component re-adsorption operation and the component disposal operation are performed. Therefore, the production throughput is reduced by the amount of the discarding and re-adsorption operations.

  As an operation abnormality that reduces the production throughput, there are cases where the component mounting apparatus executes an additional operation as in the above-described posture determination example, or the operation performed by the component mounting apparatus does not reach the assumed speed. It is done.

  Therefore, when the production throughput of the component mounting apparatus decreases, it is necessary to identify the cause of the abnormal operation that causes the decrease and take countermeasures.

  In such a component mounting apparatus, a method is known in which the speed of mounting a component on a circuit board is measured and the cause of a decrease in production throughput of the component mounting apparatus is identified from the speed [for example, Japanese Patent No. 3583121 Gazette (patent document 1)].

Japanese Patent No. 3583121

  However, the method described in Patent Document 1 cannot determine the continuity of a decrease in production throughput. Moreover, the necessity of countermeasures cannot be determined according to the certainty of the identified cause.

  Since it is necessary to stop the production of the component mounting equipment in order to cope with the reduction in the production throughput of the component mounting apparatus, if the decrease in the production throughput is temporary, the production throughput should be increased without taking countermeasures. Can keep.

  Also, if countermeasures are taken for the wrong cause, the production throughput cannot be increased even if the countermeasures are taken, and the production throughput is reduced by the amount that the component mounting equipment is stopped for countermeasures. If the probability of the cause is low, it is possible to keep the production throughput high without taking measures.

  Therefore, the object of the present invention is to determine the continuity of a decrease in production throughput, calculate the probability that indicates the cause of the decrease in production throughput and the probability of the cause, the decrease in production throughput continues, and the probability value is large It is another object of the present invention to provide a component mounting apparatus capable of presenting a cause and a countermeasure for a decrease in production throughput and a method for identifying the cause of the decrease in production throughput.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  That is, the outline of a typical one is whether or not an operation that reduces the production throughput has occurred in the operation of the component mounting apparatus based on the measurement result of the measuring apparatus that measures the state of the mounting apparatus that sucks and mounts the component on the board. And an operation device that stores the generation time in the storage unit when an operation that lowers the production throughput occurs, the calculation device generates the occurrence based on the information on the generation time stored in the storage unit. Calculate the interval, determine whether or not the decrease in production throughput continues based on the occurrence interval information, and reduce the production throughput to the operation of the component mounting apparatus when it is determined that the decrease in production throughput continues Outputs that an operation has occurred.

  The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

  In other words, the effect obtained by a typical one is not effective because the component mounting apparatus can take measures when the decrease in production throughput of the component mounting apparatus continues and the cause of the decrease in production throughput can be identified. The component mounting apparatus can be operated without reducing the production throughput of the component mounting apparatus due to necessary measures.

It is a lineblock diagram showing the whole component mounting device composition concerning one embodiment of the present invention. It is a top view which shows the structure of the feeder base of the component mounting apparatus which concerns on one embodiment of this invention, a head, and a beam. It is a bottom view which shows the structure of the head of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows an example of the image which the measuring device of the component mounting apparatus which concerns on one embodiment of this invention acquired. It is a figure which shows an example of the mounting information table of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows an example of the attitude | position determination information table of the component mounting apparatus which concerns on one embodiment of this invention. It is a block diagram which shows the structure of the arithmetic unit of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows an example of the factor information table of the arithmetic unit of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows an example of the measured value information table of the arithmetic unit of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows an example of the threshold value information table of the arithmetic unit of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows an example of the coefficient information table of the arithmetic unit of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows the probability information table of the arithmetic unit of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows an example of the determination area information table of the arithmetic unit of the component mounting apparatus which concerns on one embodiment of this invention. It is a flowchart which shows the process of the arithmetic unit of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows the relationship between the image and measurement value which the measuring device of the component mounting apparatus which concerns on one embodiment of this invention acquired. It is a figure which shows an example of the image which the measuring device acquired when there is abnormality in the component attitude | position of the component mounting apparatus which concerns on one embodiment of this invention. It is a flowchart which shows the process of the arithmetic unit 150 of the component mounting apparatus which concerns on one embodiment of this invention. It is explanatory drawing for demonstrating the factor generation | occurrence | production interval of the component mounting apparatus which concerns on one embodiment of this invention. It is a figure which shows an example of the image which the measuring device acquired when the measuring device of the component mounting apparatus which concerns on one embodiment of this invention has a damage | wound and dirt. It is a figure which shows an example of the image displayed on an output part, when it determines with the production throughput fall of the component mounting apparatus which concerns on one embodiment of this invention continuing. It is a figure which shows an example of the image displayed on an output part, when confirming whether the order of the components of the component mounting apparatus which concerns on one embodiment of this invention is orderable.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

  A configuration of a component mounting apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a configuration diagram showing an overall configuration of a component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is an upper surface showing configurations of a feeder base, a head, and a beam of the component mounting apparatus according to an embodiment of the present invention. 3 is a bottom view showing the configuration of the head of the component mounting apparatus according to the embodiment of the present invention. FIG. 4 is an example of an image acquired by the measuring apparatus of the component mounting apparatus according to the embodiment of the present invention. FIG. 5 is a diagram showing an example of a mounting information table of a component mounting apparatus according to an embodiment of the present invention, and FIG. 6 is an attitude determination information table of a component mounting apparatus according to an embodiment of the present invention. It is a figure which shows an example.

  In FIG. 1, the component mounting apparatus 100 includes a supply device 110, a mounting device 120, a measurement device 130, an overall control device 140, an arithmetic device 150, an input unit 170, an output unit 171, and an IF unit 172. These are connected to each other via a bus 173.

  The supply device 110 includes a feeder base 111 and an IF unit 112.

  As shown in FIG. 2, the feeder base 111 has a plurality of feeders 111a.

  In response to an instruction from the overall control device 140 to be described later, the feeder 111a removes the remaining components from the suction nozzle 123 when the components held by the feeder 111a are sucked by the suction nozzle 123 described later. Transport to a position where it can be sucked.

  The IF unit 112 is an interface for transmitting and receiving information via the bus 173.

  The mounting device 120 includes a head 121, a beam 122, a suction nozzle 123, a drive control unit 124, and an IF unit 125.

  As shown in FIG. 2, the head 121 can be moved along the beam 122 in one coordinate axis direction (X direction in FIG. 2).

  As shown in FIG. 2, the beam 122 can be moved along the guide 122a in another coordinate axis direction (Y direction in FIG. 2) intersecting with the coordinate axis direction in which the head 121 moves. .

  As shown in FIG. 3, a plurality of suction nozzles 123 are arranged in a circle on a head rotating portion 121a on the lower surface of the head 121. By rotating the head rotating portion 121a, the position of the suction nozzle 123 is changed. It can be changed.

  Further, the suction nozzle 123 can move up and down in a direction intersecting the X direction and the Y direction.

  Then, the head 121 and the beam 122 are moved in the X direction and the Y direction, the head rotating unit 121a is rotated, and the suction nozzle 123 is moved up and down in a direction crossing the X direction and the Y direction, thereby setting a predetermined suction nozzle. In 123, a component is sucked from the feeder 111a mounted on the feeder base 111 so that the component can be mounted at a predetermined position on the substrate 180.

  In response to an instruction from the overall control device 140, which will be described later, the drive control unit 124 mounts the head 121, the head rotating unit 121a, and the beam so that components are mounted in the mounting order and mounting position specified by the mounting information table 142a described later. 122 and the suction nozzle 123 are controlled.

  In addition, when the drive control unit 124 controls the suction nozzle 123 to suck a component, the drive control unit 124 performs processing to transmit suction information indicating that the component has been sucked to the overall control device 140 via the IF unit 125. .

  The IF unit 125 is an interface for transmitting and receiving information via the bus 173.

  The measurement device 130 includes a light source 131, a sensor 132, and an IF unit 133.

  The light source 131 irradiates the suction nozzle 123 with light in the direction of the sensor 132 (to be described later) after the suction nozzle 123 sucks the component. The light source 131 also rotates by the same angle as that of the suction nozzle 123 when the head rotating unit 121a rotates.

  Since the light source 131 itself rotates at the same angle as the suction nozzle 123, a specific part on the surface of the light source 131 always corresponds to the specific suction nozzle 123.

  The sensor 132 detects the light emitted from the light source 131 and acquires an image of the suction nozzle 123 that sucks the component as shown in FIG. The colored portion in FIG. 4 is a portion where the irradiated light is blocked by scratches or dirt on the suction nozzle 123, components, light source 131, or sensor 132.

  Since the light source 131 and the suction nozzle 123 are rotated by the same angle when the head rotating unit 121a is rotated, for example, when the surface of the light source 131 has scratches or dirt, the light source is viewed from the center of the head rotating unit 121a. Only when the angle 131 with the flaws and dirt and the suction nozzle 123 to be imaged are at the same angle, the dirt and flaws are imaged.

  Then, the sensor 132 outputs the acquired image to the arithmetic device 150.

  The IF unit 133 is an interface for transmitting and receiving information via the bus 173.

  The overall control device 140 includes a storage unit 141, an overall control unit 144, and an IF unit 145.

  The storage unit 141 includes a mounting information storage area 142 and a posture determination information storage area 143. The mounting information storage area 142 stores mounting information for specifying the mounting order and suction order of components, the position where the components are mounted on the board, and the supply position of the components. For example, in the present embodiment, a mounting information table 142a as shown in FIG. 5 is stored.

  As shown in FIG. 5, the mounting information table 142a has an order field 142b, a component mounting coordinate field 142c, and a feeder number field 142d.

  The order field 142b stores information for specifying the component mounting order and the component suction order. Here, in the present embodiment, the component mounting order and the suction order are made the same, but they may be in different orders.

  The component mounting coordinate field 142c stores information for specifying a position where a component to be sucked from the mounting position on the feeder base 111 of the feeder 111a specified by the feeder number field 142d is mounted on the substrate 180.

  The feeder number field 142d stores information for specifying the mounting position on the feeder base 111 of the feeder 111a that holds the component mounted at the coordinates specified by the component mounting coordinate field 142c in the order specified by the order field 142b. Is done.

  Here, in the present embodiment, a feeder number that is identification information for uniquely identifying the mounting position on the feeder base 111 is stored as information for specifying the mounting position on the feeder base 111.

  The posture determination information storage area 143 stores information for determining whether or not the posture of the component sucked by the suction nozzle 123 is good. For example, in the present embodiment, an attitude determination information table 143a as shown in FIG. 6 is stored.

  As shown in FIG. 6, the posture determination information table 143a has a posture determination field 143b.

  The posture determination field 143b stores information for determining whether the posture of the component sucked by the suction nozzle 123 is good or bad. When the distance from the upper surface of the image to the lower surface of the image of the suction nozzle 123 that picks up the component imaged by the sensor 132 is greater than the value stored in the posture determination field 143b, it is determined that the posture of the component is bad.

  The overall control unit 144 controls processing performed by the supply device 110, the mounting device 120, the measurement device 130, the arithmetic device 150, the input unit 170, the output unit 171 and the IF unit 172.

  For example, the overall control unit 144 outputs necessary instructions to the supply device 110 and the mounting device 120 so that components are mounted in the order and mounting coordinates specified in the mounting information table 142a.

  In addition, the overall control unit 144 outputs a necessary instruction to the measurement device 130 so as to measure an image of the suction nozzle 123 that sucks the component after the suction nozzle 123 sucks the component.

  The IF unit 145 is an interface for transmitting and receiving information via the bus 173.

  The input unit 170 is an input device for accepting input of information, and can be configured by, for example, a mouse or a keyboard.

  The output unit 171 is an output device that outputs information, and can be configured by, for example, a display.

  The IF unit 172 is an interface for transmitting and receiving information to and from other devices via a network.

  The bus 173 is a communication path that connects the supply device 110, the mounting device 120, the measurement device 130, the overall control device 140, the arithmetic device 150, the input unit 170, the output unit 171, and the IF unit 172.

  Next, the configuration of the arithmetic unit of the component mounting apparatus according to the embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a block diagram showing the configuration of the arithmetic unit of the component mounting apparatus according to the embodiment of the present invention, and FIGS. 8 to 13 show the tables of the arithmetic unit of the component mounting apparatus according to the embodiment of the present invention. FIG. 8 is an example of a factor information table, FIG. 9 is an example of a measurement value information table, FIG. 10 is an example of a threshold information table, FIG. 11 is an example of a coefficient information table, and FIG. 12 is a probability information table. FIG. 13 shows an example of the determination section information table.

  In FIG. 7, the arithmetic device 150 includes a storage unit 151, a control unit 160, an input unit 161, an output unit 162, and an IF unit 163.

  The storage unit 151 includes a factor information storage area 152, a measurement value information storage area 153, a threshold information storage area 154, a coefficient information storage area 155, a probability information storage area 156, and a determination section information storage area 157. ing.

  The factor information storage area 152 stores information for identifying the time of occurrence of the production throughput reduction factor that has occurred in the component mounting apparatus 100. For example, in the present embodiment, a factor information table 152a as shown in FIG. 8 is stored.

  As shown in FIG. 8, the factor information table 152a has a factor occurrence time field 152b.

  The factor occurrence time field 152b stores information for identifying the occurrence time of the production throughput reduction factor that has occurred in the component mounting apparatus 100.

  In the measurement value information storage area 153, information for specifying the measurement value of the measurement device 130 is stored. For example, in the present embodiment, a measurement value information table 153a as shown in FIG. 9 is stored.

  As shown in FIG. 9, the measurement value information table 153a has a measurement value field 153b. The measurement value field 153b stores information for specifying the measurement value of the measurement device 130.

  The threshold information storage area 154 stores information for specifying a value used for determination in the flowchart shown in FIG. For example, in the present embodiment, a threshold information table 154a as shown in FIG. 10 is stored.

  As shown in FIG. 10, the threshold information table 154a has a threshold frequency field 154b, a threshold average field 154c, a threshold probability field 154d, a threshold probability frequency field 154e, and a frequency 2 field 154f.

  The threshold number field 154b, the threshold average field 154c, the threshold probability field 154d, the threshold probability number field 154e, and the number two field 154f specify values determined by the designer or user of the component mounting apparatus 100. Each piece of information is stored. In the number-of-times 2 field 154f, for example, a value about twice the value of the threshold number-of-times field 154b is stored.

  The coefficient information storage area 155 stores information for specifying a value used for probability calculation in the flowchart shown in FIG. 17 described later. For example, in the present embodiment, a coefficient information table 155a as shown in FIG. 11 is stored.

  As shown in FIG. 11, the coefficient information table 155a has a coefficient a field 155b and a coefficient b field 155c.

  In the coefficient a field 155b and the coefficient b field 155c, information specifying values determined by the designer or user of the component mounting apparatus 100 is stored.

  The probability information storage area 156 stores information for specifying the probability value calculated in the flowchart shown in FIG. For example, in the present embodiment, a probability information table 156a as shown in FIG. 12 is stored.

  As shown in FIG. 12, the probability information table 156a has a light source field 156b, a suction nozzle field 156c, and a sensor field 156d.

  In the light source field 156b, the suction nozzle field 156c, and the sensor field 156d, the sensor 132 determines whether the cause of the decrease in production throughput, which is calculated in the flowchart shown in FIG. 17 described later, is the light source 131 or the suction nozzle 123. Probability information for specifying whether or not is stored.

  The determination section information storage area 157 stores information for specifying the time for calculating the average of the factor occurrence count and the factor occurrence interval in the flowchart shown in FIG. For example, in the present embodiment, a determination section information table 157a as shown in FIG. 13 is stored.

  As illustrated in FIG. 13, the determination section information table 157a includes a determination section field 157b.

  In the determination section field 157b, information for specifying a time that is targeted for the average of the number of occurrences of the factor and the average of the factor occurrence intervals in the flowchart shown in FIG. 17 to be described later is stored. For example, when information of 1 minute is stored, the average of the factor occurrence count and the factor occurrence interval is calculated for the factor information stored between the current time and the time one minute before.

The control unit 160 controls the entire processing in the arithmetic device 150 and performs the following processes.
When a factor that lowers the production throughput occurs in the component mounting apparatus 100, information is stored in the factor information table 152a and updated.
-Necessary information is acquired from the measurement device 130 and the posture determination information table 143a, the posture of the component sucked by the suction nozzle 123 is determined, and the information is stored in the measurement value information table 153a and updated. .
A process for determining whether or not a decrease in production throughput continues based on information stored in the factor information table 152a and information stored in the threshold information table 154a is performed.
Based on the information stored in the measurement value information table 153a and the information stored in the coefficient information table 155a, there is a probability that the production throughput decline is caused by the suction nozzle 123 and the cause of the production throughput decline is in the measurement device 130. The probability value is calculated, and the information is stored in the probability information table 156a and updated.
The information indicating the cause of the decrease in production throughput is output by the output unit 162 or the output by the information stored in the probability information table 156a, the information stored in the factor information table 152a, and the information stored in the threshold information table 154a. Processing to output to the unit 171 is performed.

  The input unit 161 accepts input of information, and the output unit 162 outputs information. The IF unit 163 is an interface for transmitting and receiving information via the bus 173.

  The arithmetic device 150 described above includes, for example, a CPU (Central Processing Unit), a storage medium such as a memory and an HDD (Hard Disk Drive), an input device such as a keyboard and a mouse, an output device such as a display, a bus, and the like. It can be realized by a general computer provided with an I / F (InterFace) for connecting to H.173.

  Next, processing of the arithmetic device 150 of the component mounting apparatus according to the embodiment of the present invention will be described with reference to FIGS. FIG. 14 is a flowchart showing the processing of the arithmetic device 150 of the component mounting apparatus according to the embodiment of the present invention, and shows processing for determining whether the posture of the component is good and updating the factor information and the measured value information. .

  FIG. 15 is a diagram illustrating a relationship between an image acquired by the measurement device of the component mounting apparatus according to the embodiment of the present invention and a measured value, and FIG. 16 illustrates a component posture of the component mounting apparatus according to the embodiment of the present invention. FIG. 17 is a flowchart illustrating an example of an image acquired by the measurement apparatus when there is an abnormality. FIG. 17 is a flowchart illustrating processing of the arithmetic unit of the component mounting apparatus according to the embodiment of the present invention. In this example, the continuity of the production throughput is determined, the probability of causing the production throughput reduction candidate is calculated, and a countermeasure instruction for the production throughput reduction is output.

  FIG. 18 is an explanatory diagram for explaining the factor generation interval of the component mounting apparatus according to the embodiment of the present invention. FIG. 19 is a scratch or a stain on the measuring apparatus of the component mounting apparatus according to the embodiment of the present invention. FIG. 20 is a diagram illustrating an example of an image acquired by the measurement device in a certain case, and FIG. 20 is an example of an image displayed on the output unit when it is determined that the production throughput of the component mounting device according to the embodiment of the present invention continues to decrease. FIG. 21 is a diagram showing an example of an image displayed on the output unit when confirming whether or not an order for parts of the component mounting apparatus according to the embodiment of the present invention is available.

  First, when the image of the suction nozzle 123 is transmitted from the measurement device 130 via the IF unit 163, the control unit 160 of the arithmetic device 150 executes the processing illustrated in the flowchart of FIG.

  In step S10, as shown in FIG. 15, the control unit 160 changes the coloring portion from the upper end portion of the suction nozzle 123 image to the coloring portion continuous from the upper end portion of the suction nozzle 123 image among the suction nozzle 123 images. A distance L01 to the lower end is calculated.

  In step S11, the control unit 160 compares the measured value L01 with information (referred to as a determination value L02) stored in the posture determination field 143b of the posture determination information table 143a.

  For example, as shown in FIG. 16, when the picked-up component has a poor posture and the measured value L01 is larger than the determination value L02, it means that the component is not picked up horizontally by the suction nozzle 123. In this case, since the mounting of the component to the board fails, it is necessary to discard the component and suck the component again so that the suction nozzle 123 sucks the component horizontally.

  Therefore, when the measurement value L01 is larger than the determination value L02 in step S11, the control unit 160 executes step S13 and step S14.

  When the measured value L01 is equal to the determination value L02 or the measured value L01 is smaller than the determination value L02, the control unit 160 instructs the overall control device 140 to continue the operation in step S12.

  In step S13, the control unit 160 adds a new line to the last line of the factor occurrence time field 152b of the factor information table 152a, and stores the current time there. This is because the component re-adsorption operation and the component disposal operation occur as will be described later due to the poor posture of the component, and the production throughput of the component mounting apparatus 100 decreases by the amount of the operation.

  In the present embodiment, the current time is stored in the factor occurrence time field 152b of the factor information table 152a based on the comparison result between the measurement value L01 and the determination value L02. Based on information other than L01, when the component mounting operation on the board is redone, the time when the mounting operation is redone may be stored.

  When an operation abnormality that causes a reduction in production throughput of the component mounting apparatus 100 occurs in this way, the control unit 160 stores the occurrence time of the operation abnormality in the factor occurrence time field 152b of the factor information table 152a.

  Here, the component re-suction operation is stored as an operation abnormality. However, when an operation abnormality that lowers the production throughput occurs (for example, the head moving speed decreases and falls below a predetermined threshold). The current time is stored in the factor occurrence time field 152b of the factor information table 152a.

  Further, the control unit 160 adds a new line to the last line of the measurement value field 153b of the measurement value information table 153a, and stores the value of the measurement value L01 therein.

  In step S <b> 14, the control unit 160 instructs the overall control device 140 to perform the component suction operation again with the suction nozzle 123 that has not picked up another component, and instructs to discard the component having a poor posture. .

  In step S10, when the sensor 132 or the light source 131 is scratched or dirty, the measured value L01 is larger than the determination value L02 even when the suction nozzle 123 sucks the component horizontally as shown in FIG. . As a result, in step S11, the component suction operation and the component disposal are performed again even if there is no problem in the component suction.

  Therefore, scratches and dirt on the sensor 132 or the light source 131 cause a decrease in production throughput.

  Therefore, the processing unit 150 determines the continuity of the production throughput reduction of the component mounting apparatus 100, calculates the cause probability for the cause of the production throughput reduction, and outputs a countermeasure instruction for the production throughput reduction. When the execution instruction for the production throughput decrease determination process is transmitted from the input unit 161 or the overall control device 140 via the IF unit 163, the arithmetic device 150 executes the process shown in the flowchart of FIG.

  In step S20, the controller 160 subtracts the value stored in the determination section field 157b of the determination section information table 157a from the current time among the values stored in the factor occurrence time field 152b of the factor information table 152a. The number of large ones is specified.

  For example, when the current time is “2009/1/22 1:33:00” and the value stored in the factor occurrence time field 152b of the factor information table 152a is “1 minute”, “2009/1/22 The number of data whose time is larger than “1:32:00” is specified. In the example shown in FIG. Here, the number of identified data is referred to as d01.

  In step S21, the control unit 160 sets the value stored in the determination section field 157b of the determination section information table 157a from the current time among the values stored in the factor occurrence time field 152b of the factor information table 152a to be larger than the time. As for the factor occurrence interval, time is calculated from one factor occurrence time to the next factor occurrence time, and the average of the factor occurrence intervals is calculated.

  For example, when the current time is “2009/1/22 1:33:00” and the value stored in the determination section field 157b of the determination section information table 157a is “1 minute”, “2009/1/22 Data with a time greater than “1:32:00” is targeted, and the difference between the targeted data is calculated.

  For example, the difference is calculated as shown in FIG. In FIG. 18, the value d02_i (i = 1, 2,... N) indicates the difference between the factor occurrence time and the next factor occurrence time, which is the factor occurrence interval. Then, the average (d02) of the factor occurrence intervals is calculated from d02_i using the following equation (1).

  Here, n represents the total number of data of d02_i.

  In step S22, the control unit 160 compares d01 with the value stored in the threshold number field 154b of the threshold information table 154a, and compares d02 with the value stored in the threshold average field 154c of the threshold information table 154a. If d01 is larger than the value stored in the threshold number field 154b of the threshold information table 154a and d02 is larger than the value stored in the threshold average field 154c of the threshold information table 154a, the production throughput decreases. It is determined that there is continuity.

  Here, the fact that d02 is larger than the value stored in the threshold average field 154c of the threshold information table 154a indicates that the production throughput reduction factor is generated at a certain interval or more. In a device that repeatedly operates in a specific pattern such as the head 121, the beam 122, the suction nozzle 123, and the measurement device 130, such as the component mounting apparatus 100, when there is a problem in a specific part, Every time, an abnormal operation that reduces the production throughput occurs.

  For example, when there is a problem with a specific suction nozzle 123 and the suction nozzle 123 inclines and sucks a component, the re-suction operation is performed every time the suction nozzle 123 is used. Therefore, an operation abnormality that reduces the production throughput occurs at a certain interval in accordance with the interval at which a specific part operates, and the occurrence interval of the production throughput reduction factor increases.

  Therefore, if the average of the occurrence intervals of the production throughput reduction factor is large, it is considered that the reduction factor is periodically generated because there is a problem in a specific part, and the production throughput reduction factor is determined every time that specific part is used. It occurs again, that is, it is determined that the decrease in production throughput continues.

  The reason why the factor occurrence count d01 is compared is to sufficiently increase the number of sample data for calculating d02 which is the average factor occurrence interval.

  As a result of the comparison in step S22, when it is determined that there is continuity in the production throughput reduction, the control unit 160 executes step S23.

  If it is not determined that there is continuity in production throughput reduction, in step S28, the control unit 160 compares d01 with the value stored in the number-of-times 2 field 154f of the threshold information table 154a. If the value is larger than the value of the number of times 2 field 154f of the threshold information table 154a, the control unit 160 executes step S23. If the value of d01 is not larger than the value of the number of times 2 field 154f of the threshold information table 154a, processing is performed. Exit.

  In step S23, the control unit 160 sets the value stored in the bottom row in the measurement value field 153b of the measurement value information table 153a (referred to as d03_1) and the second value from the bottom in the measurement value field 153b of the measurement value information table 153a. From the value stored in the second row (referred to as d03_2), the difference between the measured values (referred to as d03) is calculated by the following equation (2).

  In step S24, the control unit 160 calculates the probability of causing a decrease in production throughput for the abnormality of the measuring apparatus 130 that is a candidate for the cause of a decrease in production throughput, using the following equation (3).

  Here, d04 is a probability caused by the light source 131 or the sensor 132 of the measuring device 130, a is a value stored in the coefficient a field 155b of the coefficient information table 155a, and b is a coefficient b of the coefficient information table 155a. It represents the value stored in field 155c.

  The above equation (3) outputs a value closer to 1 as d03 is smaller than the value stored in the coefficient b field 155c. When the light source 131 or the sensor 132 has scratches or dirt, the scratches or dirt are imaged as shown in FIG. 19, and the distance from the upper surface of the image to the lower surface of the scratches or dirt is stored as L01.

  Since the position of the scratch or dirt in the light source 131 or the sensor 132 does not change, almost the same value is output as L01 until the scratch or dirt disappears. In this case, d03 is a value close to 0, and as a result, d04 is a value close to 1.

  On the other hand, if there is a problem with the suction nozzle 123, the suction of parts by the suction nozzle 123 varies, so that a different value is output as L01 each time, and the value of d03 increases, and as a result, the value of d04 The value becomes smaller.

  Then, the control unit 160 stores d04 in the light source field 156b or the sensor field 156d of the probability information table 156a.

  The storage of d04 is stored in the light source field 156b when there is a high possibility that the light source 131 has scratches or dirt in step S22 if it is determined that there is a continuation of the decrease in production throughput. In step S28, the value of d01 is stored. If the value is larger than the value in the number-of-times 2 field 154f of the threshold information table 154a, the number of occurrences of the factor is large, and the sensor 132 is likely to be scratched or dirty, and is stored in the sensor field 156d. If there is a scratch or a dirt on the part facing the suction nozzle 123 where the light source 131 is located, the part re-suction operation occurs only when the suction nozzle 123 is used. Therefore, when the light source 131 has scratches or dirt, the factor generation interval is larger than the use interval of the suction nozzle 123.

  Further, the value (1-d04) is stored in the suction nozzle field 156c.

  Therefore, when there is a problem with the suction nozzle 123, the value of d04 decreases and the value of (1-d04) increases, so that the suction nozzle 123 can be identified as the cause.

  In step S25, control unit 160 compares d04 with the value stored in threshold probability field 154d, compares the product of d01 and d04 with the value stored in threshold probability count field 154e, and executes step S26. Alternatively, the end of processing is selected.

  When d04 (or 1-d04) is larger than the value stored in the threshold probability field 154d and the product of d01 and d04 (or 1-d04) is larger than the value stored in the threshold probability number field 154e Since the cause can be specified with a high probability and the degree of reduction in production throughput is large, the control unit 160 requests a countermeasure instruction in step S26. If this condition is not met, the control unit 160 ends the process.

  In step S <b> 26, the control unit 160 informs the output unit 162, the output unit 171, or the overall control device 140 that the production throughput of the component mounting apparatus 100 is lowered and the production throughput decline, as shown in FIG. 20. The information indicating the cause of the error and the countermeasures are output.

  In step S27, the control unit 160 inquires of the output unit 162, the output unit 171 or the overall control device 140 as to whether or not an order can be placed for a part that causes a decrease in production throughput, as shown in FIG. Then, when part ordering is permitted, the control unit 160 requests a replacement part of a part that causes a reduction in production throughput from the material part or part purchaser manufacturer that purchases the part through the IF unit 172.

  As described above, in the present embodiment, when the decrease in the production throughput of the component mounting apparatus is not temporary, the decrease in the production throughput continues, and the cause of the decrease in the production throughput can be identified, the component mounting apparatus Since measures can be taken, the component mounting apparatus can be operated without reducing the production throughput of the component mounting apparatus due to unnecessary measures.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  The present invention relates to a component mounting apparatus that mounts a component such as a chip mounter on a substrate, and can be widely applied to devices and systems that need to suppress a decrease in production throughput.

  DESCRIPTION OF SYMBOLS 100 ... Component mounting apparatus, 110 ... Supply apparatus, 111 ... Feeder base, 112, 125, 133, 145, 163 ... IF part, 120 ... Mounting apparatus, 121 ... Head, 122 ... Beam, 123 ... Suction nozzle, 124 ... Drive Control unit, 130 ... measuring device, 131 ... light source, 132 ... sensor, 140 ... overall control device, 141 ... storage unit, 142 ... mounting information storage area, 143 ... posture determination information storage area, 144 ... overall control unit, 150 ... Arithmetic unit 151 ... storage unit 152 ... factor information storage area 153 ... measurement value information storage area 154 ... threshold information storage area 155 ... coefficient information storage area 156 ... probability information storage area 157 ... determination section information storage Area, 160 ... control unit, 161, 170 ... input unit, 162,171 ... output unit.

Claims (4)

A component mounting apparatus for mounting a component on a board,
A mounting device for sucking and mounting the component on the substrate;
A measuring device for measuring the shape of the suction nozzle of the mounting device a plurality of times ;
Based on the measurement result of the measuring device, it is determined whether or not an operation for reducing the production throughput has occurred in the operation of the component mounting device. An arithmetic device for storing in the storage unit,
The computing device calculates an occurrence interval based on the occurrence time information stored in the storage unit, and if the occurrence interval information is larger than a predetermined threshold, the production throughput is reduced. Decide to continue,
When it is determined that the decrease in the production throughput continues, the arithmetic device determines the probability that the measurement device is the cause of the decrease in the production throughput based on information on the difference between the measurement values of the shape of the suction nozzle. Component mounting, characterized in that, when the probability, or the product of the probability or the reduction amount of the production throughput, is greater than a predetermined threshold, the measure is output as a cause of the production throughput reduction. apparatus. The component mounting apparatus according to claim 1,
When the mounting operation of the component on the board is redone, the arithmetic device stores the time when the mounting operation is redone in the storage unit as the generation time. The component mounting apparatus according to claim 1 ,
The component mounting apparatus outputs an instruction for obtaining a part of the component mounting apparatus corresponding to a cause of a decrease in the production throughput or a countermeasure for the cause. A method for identifying the cause of a decrease in production throughput of a component mounting apparatus that mounts the component on a board using a mounting apparatus that sucks and mounts the part on the board,
The arithmetic unit of the component mounting apparatus determines whether or not an operation for reducing the production throughput has occurred in the operation of the component mounting apparatus, and stores an occurrence time when an operation for reducing the production throughput occurs. The generation interval is calculated based on the occurrence time information stored in the storage unit and stored in the storage unit. When the occurrence interval information is larger than a predetermined threshold, the production throughput is reduced. When it is determined to continue, and when it is determined that the decrease in the production throughput continues , based on the information of the difference between the measurement values of the suction nozzle shape, the probability that the measurement device is the cause of the decrease in the production throughput is calculated, When the probability, or the product of the probability and the amount of decrease in the production throughput, is greater than a predetermined threshold, the measuring device is reduced in production throughput. Production throughput decreases cause identification method of the component mounting apparatus and outputs the measures as the cause.

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