JP5517354B2 - Heat treatment method for silicon wafer - Google Patents

Description

  The present invention relates to a method for heat-treating a silicon wafer to be used for manufacturing a semiconductor device on a silicon wafer obtained by slicing a silicon single crystal ingot manufactured by the Czochralski method or the like (hereinafter also simply referred to as a wafer). About.

In the manufacture of semiconductor devices, generally, a silicon wafer obtained by slicing a silicon single crystal ingot pulled up by the Czochralski method or the like is used.
In such a silicon wafer manufacturing process or a semiconductor device manufacturing process using the silicon wafer, for example, a vertical heat treatment apparatus using a vertical boat for the purpose of reducing defects on the surface layer of the wafer. And heat treatment using a rapid heating / cooling heat treatment (Rapid Thermal Process; hereinafter, also simply referred to as RTP) apparatus.

  When performing RTP as described above, for example, a ring-shaped support ring is used as a support jig in order to support a silicon wafer, and the material is silicon carbide or the like from the viewpoint of strength and contamination prevention. Silicon or the like is used (for example, Patent Document 1).

  However, when RTP is performed by supporting a wafer with a support ring as described in Patent Document 1, as shown in FIG. 5, during RTP, the wafer bends so that the central portion hangs down (in FIG. 5). Therefore, stress due to the weight of the wafer is concentrated at the contact point Wp between the wafer W and the support ring 31, and slip dislocation occurs in the wafer, or particles are generated due to contact friction between the wafer W and the support ring 31, This adhered to the wafer surface and caused a decrease in yield in device fabrication.

  In recent years, large-diameter wafers with a diameter of 300 mm or more have been manufactured, and as the diameter of such wafers has increased, the stress due to the weight of the wafer has also increased, and the above-described problems caused by the bending of the wafers. The tendency to produce is increasing.

  As a method for solving such a problem, for example, in Patent Document 2, in the RTA (Rapid Thermal Annealing) apparatus, the temperature of the contact portion between the wafer and its supporting jig is higher than the temperature at the center of the wafer. In addition, it has been proposed to perform the heat treatment in a state controlled to be 3 to 20 ° C. lower.

  Further, in Patent Document 3, in the RTP, the wafer outer surface is horizontally supported by a plurality of support pins so that the temperature of the wafer outer periphery is 1 to 6 ° C. higher than the temperature of the wafer center. It describes that heat treatment is performed while controlling the temperature distribution inside.

JP 2007-227461 A JP 2002-164300 A JP 2010-34288 A

  However, even in the heat treatment at a high temperature exceeding 1200 ° C. even by the temperature distribution control in the wafer surface as described in Patent Documents 2 and 3, the slip dislocation of the wafer generated from the contact portion with the support jig. It could not be said that the effect of suppressing was sufficient.

  Accordingly, there is a demand for a method capable of preventing the occurrence of slip dislocation by suppressing the bending of the wafer even when a high temperature heat treatment exceeding 1200 ° C. is performed.

  The present invention has been made to solve the above technical problem, and can suppress the deflection of the wafer during high-temperature heat treatment, and can prevent the occurrence of slip dislocation and the adhesion of particles to the wafer surface. It is an object of the present invention to provide a heat treatment method.

The silicon wafer heat treatment method according to the present invention is a method in which a silicon wafer obtained by slicing a silicon single crystal ingot is heat treated at a high temperature exceeding 1200 ° C., and the outer peripheral region of the back surface of the silicon wafer is supported by a support ring. The temperature of the outer peripheral portion at a position of 5 mm from the outer peripheral edge to the center of the silicon wafer is higher than the temperature of the central portion of the silicon wafer in a range of 4 ° C. or higher and 30 ° C. or lower, and The rapid heating / cooling heat treatment is performed while controlling the in-plane temperature of the silicon wafer so that the temperature of the outer peripheral edge is lower than the temperature of the outer peripheral portion in a range of 2 ° C. to 10 ° C. To do.
By controlling the temperature distribution in the wafer surface in this way, it is possible to suppress wafer deflection even during high-temperature heat treatment.

In the heat treatment method, it is preferable that the temperature of the outer peripheral edge of the silicon wafer be lower than the temperature of the outer peripheral portion in a range of 2 ° C. or higher and 7 ° C. or lower.
From the viewpoint of suppressing the bending of the wafer in the vicinity of the contact point with the support ring and suppressing the occurrence of slip dislocation due to thermal stress, the outer peripheral edge is preferably set to a temperature within the above range.

According to the silicon wafer heat treatment method of the present invention, the deflection of the wafer during high-temperature heat treatment can be suppressed, and the occurrence of slip dislocation and the adhesion of particles to the wafer surface can be prevented.
Therefore, the silicon wafer subjected to the heat treatment by the method according to the present invention contributes to the yield improvement in the semiconductor device manufacturing process.

It is sectional drawing which shows the outline | summary of the RTP apparatus used for the heat processing method of the silicon wafer which concerns on this invention. It is sectional drawing for demonstrating the aspect of the wafer holding part in a comparative example. It is sectional drawing for demonstrating the aspect of the wafer holding part in a comparative example. It is sectional drawing for demonstrating the aspect of the wafer holding part in an Example. It is sectional drawing which shows the aspect of the wafer holding part in the conventional RTP apparatus.

Hereinafter, the present invention will be described in more detail with reference to the drawings.
The heat treatment method for a silicon wafer according to the present invention relates to a heat treatment to be performed in order to use a silicon wafer obtained by slicing a silicon single crystal ingot for semiconductor device fabrication or the like. In the heat treatment according to the present invention, the outer peripheral region of the back surface of the silicon wafer is supported by a support ring.
In addition, the said support ring may be used normally, The shape and material will not be specifically limited if it can be used for the high temperature heat processing of a silicon wafer.

In the heat treatment, the temperature at the outer periphery of the wafer is higher in the range of 4 ° C. to 30 ° C. than the temperature at the center, and the temperature at the outer periphery of the wafer is lower than the temperature at the outer periphery. Thus, the wafer surface temperature is controlled.
Here, the wafer outer peripheral portion refers to a position of 5 mm from the outer peripheral edge of the wafer toward the center. Usually, the vicinity of this position is a place where the load of the wafer acts on the support ring.
By controlling the temperature distribution in the wafer surface in this way, the deflection of the wafer is suppressed even during high-temperature heat treatment, and the occurrence of slip dislocation from the contact point with the support ring, which is a wafer support jig, can be suppressed. . Moreover, generation | occurrence | production of the particle by the friction with the wafer and support ring in the said contact location can be suppressed, and adhesion to the wafer surface of this particle can be suppressed.

The temperature distribution in the wafer surface during the heat treatment is generally such that, at the contact point between the wafer and the support jig, the outer peripheral part of the wafer, which is the contact point, is centered by heat conduction from the wafer during heat treatment to the support jig. The temperature tends to be lower than that. In addition, since the weight of the wafer acts on the center which is the center of gravity of the wafer, the wafer is easily bent so that the center of the wafer hangs down (see FIG. 5). In the present invention, heat treatment is performed in a state where the temperature of the outer peripheral portion of the wafer is higher than the temperature of the central portion from the viewpoint of suppressing such deflection of the central portion of the wafer.
In addition, the vicinity of the contact portion between the wafer and the support ring is a portion where the load of the wafer is concentrated on the support jig. From the viewpoint of suppressing the bending of the wafer at this portion, the outer periphery of the wafer is outside. The temperature of the outer peripheral edge is lower than that of the outer peripheral portion.

As described above, the temperature of the wafer outer peripheral portion is set higher than the temperature of the wafer central portion. At this time, the temperature difference between the wafer outer peripheral portion and the central portion is in the range of 4 ° C. or higher and 30 ° C. or lower. To do.
When the temperature difference is less than 4 ° C., it is difficult to suppress the bending of the wafer center as described above. On the other hand, when the temperature difference exceeds 30 ° C., the temperature difference in the wafer surface is too large and slip dislocation due to thermal stress is likely to occur.

When only the in-plane temperature control between the outer peripheral portion and the central portion is performed, as shown in FIG. 2, the deflection of the central portion of the wafer (S2 in FIG. 2) is suppressed as compared with the case shown in FIG.
However, it cannot be said that this means (hereinafter referred to as means 1) alone is sufficient in suppressing the slip dislocation of the wafer (see the comparative example described later).

Further, when only the in-plane temperature control between the outer peripheral edge and the outer peripheral portion is performed, as shown in FIG. 3, the wafer bending near the support ring 31 is suppressed as compared with the case shown in FIG. The deflection of the central part of (S3 in FIG. 3) is hardly suppressed.
Therefore, it cannot be said that the effect of suppressing the slip dislocation of the wafer is sufficient only by this means (hereinafter referred to as means 2) (see the comparative example described later).

  On the other hand, by controlling the temperature of both the means 1 and the means 2, as shown in FIG. 4, the deflection of the center portion of the wafer is suppressed, and the deflection of the wafer near the support ring 31 is also suppressed. Therefore, it is possible to sufficiently prevent the occurrence of slip dislocation and the adhesion of particles to the wafer surface (see Examples described later).

Further, the temperature of the outer periphery of the wafer is set to be lower than the temperature of the outer peripheral portion of the wafer. At this time, the temperature difference between the outer peripheral edge of the wafer and the outer peripheral portion may be in the range of 2 ° C. or higher and 7 ° C. or lower. preferable.
By setting the temperature difference within the above range, adhesion of particles to the wafer surface can be further suppressed.

The heat treatment is preferably rapid heating / cooling heat treatment (RTP).
Since RTP normally performs heat treatment by rotating a wafer at a high speed, particles are more likely to be generated by contact friction between the wafer and the support ring than heat treatment using other vertical boats or the like.
In the present invention, even when the RTP performs the heat treatment by rotating the wafer at a high speed as described above, the deflection of the wafer can be reliably suppressed by controlling the temperature distribution in the wafer surface as described above.

  The wafer to be heat-treated in the present invention is a silicon wafer obtained by slicing a silicon single crystal ingot, and its production method is not particularly limited, but is used for semiconductor device production, for example, by Czochralski method. A silicon single crystal ingot that has been pulled up is sliced into a wafer shape with an inner peripheral blade or a wire saw, and then subjected to processing such as chamfering, lapping, etching, mirror polishing and the like on the outer periphery.

The heat treatment apparatus for carrying out the heat treatment method according to the present invention is not particularly limited as long as it can control the temperature in the wafer surface as described above. For example, a single wafer RTP apparatus is suitable. Used for.
FIG. 1 shows an outline of the RTP apparatus. The RTP apparatus 1 shown in FIG. 1 accommodates a wafer W and heat-treats it, a wafer support 30 provided in the reaction tube 20 for supporting the wafer W, and heating for heating the wafer W. Part 40.

  The reaction tube 20 is made of, for example, quartz and has a gas supply port 21 for supplying a first atmospheric gas F1 (solid arrow in the figure) to the first space 20a on the surface W1 side of the wafer W, and the first space 20a. From the gas discharge port 22 for discharging the gas from the gas, the gas supply port 23 for supplying the second atmosphere gas F2 (dotted arrow in the figure) to the second space 20b on the back surface W2 side of the wafer W, and the second space 20b. And a gas discharge port 24 for discharging gas.

  The wafer support portion 30 is made of, for example, silicon carbide, and supports the wafer W by placing an outer peripheral area (for example, an area of 2 mm or more and 5 mm or less from the outer peripheral edge toward the center) of the back surface W2 of the wafer W. A ring 31 and a rotating unit 32 that rotates the support ring 31 on which the wafer W is placed in the radial direction of the wafer W are provided.

  The heating unit 40 includes, for example, a plurality of halogen lamps 41 and is disposed outside the reaction tube 20 above the wafer support unit 30 and heats the wafer W from the surface W1 side. The halogen lamps 41 can be independently controlled for output, and the above-described control of the in-plane temperature distribution of the wafer W is performed by adjusting the output of each halogen lamp 41.

In the heat treatment using the RTP apparatus as described above, first, the wafer W is introduced into the reaction tube 20, and the outer peripheral region of the back surface W <b> 2 of the wafer W is placed on the support ring 31 of the wafer support 30. W is supported.
Then, while supplying the atmospheric gases F1 and F2 from the gas supply ports 21, 23, the wafer W is rotated by the rotating unit 32, and the wafer W is heat-treated by heating with the halogen lamp 41 of the heating unit 40. . At this time, the in-plane temperature distribution of the wafer W is controlled by measuring the temperature at each position of a predetermined distance in the radial direction from the center of the wafer W by a radiation thermometer (not shown) installed below the wafer support 30. This is done by adjusting the individual output of the halogen lamp 41.

EXAMPLES Hereinafter, although this invention is demonstrated further more concretely based on an Example, this invention is not restrict | limited by the following Example.
(Test 1)
A RTP apparatus as shown in FIG. 1 is used for a silicon wafer having a diameter of 300 mm and a thickness of 775 μm, which is obtained by slicing a silicon single crystal ingot manufactured by the Czochralski method, and having both surfaces mirror-polished. Went. The outer peripheral area of the back surface of the wafer (area from the outer peripheral edge to 2 mm toward the center) is held by a support ring, argon gas is supplied as the atmospheric gas, the in-plane temperature distribution is controlled, and the wafer is rotated at 500 rpm. Then, RTP for 15 seconds was performed to obtain an annealed wafer.

Each evaluation shown below was performed about the obtained annealed wafer.
About each wafer in RTP, the amount of bending of the wafer was measured with the surface shape measuring device.
Moreover, about each wafer after the said heat processing, LPD (Light Point Defect) of the wafer surface was measured using the wafer surface inspection apparatus (Surfscan-SP2 by KLA-Tecnor). The number of particles larger than 40 nm (> 40 nm) and larger than 120 nm (> 120 nm) adhered to the wafer surface was measured.
Furthermore, about each wafer after the said heat processing, the maximum slip length and the total slip length were measured using X-ray topography (XRT300 by Rigaku Corporation).
Table 1 summarizes the in-plane temperature distribution controlled in this test and the evaluation results at that time.

As can be seen from the evaluation results shown in Table 1, the temperature at the outer periphery of the wafer is higher in the range of 4 ° C. to 30 ° C. than the temperature at the center, and the temperature at the outer periphery of the wafer is the temperature at the outer periphery. When the heat treatment is performed by controlling the temperature distribution in the wafer surface so as to be lower (Examples 1 to 4), the amount of deflection of the wafer is suppressed, the number of particles adhering to the wafer surface is reduced, It was confirmed that the occurrence of slip dislocation was also suppressed.
It should be noted that the temperature at the outer peripheral part of the wafer is only set higher than the temperature at the central part in the range of 4 ° C. to 30 ° C. (Comparative Example 3), In the case (Comparative Example 2), the number of particles adhering to the wafer surface and the generation of slip dislocations were not sufficiently suppressed. Further, when the temperature at the outer peripheral portion of the wafer was made higher than the temperature at the central portion (Comparative Example 4), both the number of particles and the slip length tended to deteriorate greatly.

(Test 2)
About Example 3 and Example 4, RTP was performed by the method similar to the test 1 by changing the temperature difference of an outer peripheral part and an outer periphery, and the annealed wafer was obtained.
The obtained annealed wafer was evaluated in the same manner as in Test 1.
The in-plane temperature distribution controlled in this test and the evaluation results at that time are summarized in Table 2.

  As can be seen from the evaluation results shown in Table 2, the temperature of the outer peripheral edge of the silicon wafer adheres to the wafer surface by being lower than the temperature of the outer peripheral portion in a range of 2 ° C. or higher and 7 ° C. or lower. There was a tendency for the number of particles to further decrease.

DESCRIPTION OF SYMBOLS 1 RTP apparatus 20 Reaction tube 30 Wafer support part 31 Support ring 40 Heating part

Claims (2)

In a method of heat-treating a silicon wafer obtained by slicing a silicon single crystal ingot at a high temperature exceeding 1200 ° C. ,
Support the outer peripheral area of the back surface of the silicon wafer by a support ring,
The temperature of the outer peripheral portion at a position of 5 mm from the outer peripheral edge of the silicon wafer toward the center is higher than the temperature of the central portion of the silicon wafer in a range of 4 ° C. or higher and 30 ° C. or lower, and is outside the silicon wafer. The rapid heating / cooling heat treatment is performed while controlling the in-plane temperature of the silicon wafer so that the temperature of the peripheral edge is lower in the range of 2 ° C. or more and 10 ° C. or less than the temperature of the outer peripheral portion. Heat treatment method for silicon wafers.   2. The method for heat-treating a silicon wafer according to claim 1, wherein the temperature of the outer peripheral edge of the silicon wafer is lower than the temperature of the outer peripheral portion in a range of 2 ° C. or higher and 7 ° C. or lower.

Images