JP5503681B2 - 熱伝達アセンブリ及びリソグラフィ装置 - Google Patents
熱伝達アセンブリ及びリソグラフィ装置 Download PDFInfo
- Publication number
- JP5503681B2 JP5503681B2 JP2012059187A JP2012059187A JP5503681B2 JP 5503681 B2 JP5503681 B2 JP 5503681B2 JP 2012059187 A JP2012059187 A JP 2012059187A JP 2012059187 A JP2012059187 A JP 2012059187A JP 5503681 B2 JP5503681 B2 JP 5503681B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- circuit board
- printed circuit
- substrate
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
[0051] 図5は、流体閉じ込め構造体12、IHを有する局部液体供給システムを概略的に示す。流体閉じ込め構造体12は、投影システムPSの最終エレメントと基板テーブルWTまたは基板Wとの間の空間11の境界の少なくとも一部分に沿って延びる。(以下の文での基板Wの表面についての言及はまた、別に言明されない限り、基板テーブルWTの表面に加えて、またはそれに代えて言及することに留意されたい。)流体閉じ込め構造体12は、XY面では投影システムPSに対して実質的に静止しているが、Z方向(光軸の方向)にはいくらかの相対的移動がありうる。一実施形態では、シールが流体閉じ込め構造体12と基板Wの表面の間に形成され、このシールは、流体シール、望ましくはガスシールなどの非接触シールとすることができる。このようなシステムは、米国特許出願公開第2004−0207824号に開示されている。
Claims (14)
- リソグラフィ装置の少なくとも一部分を温度制御する熱伝達アセンブリであって、
前記リソグラフィ装置の前記一部分に取り付けられるプリント回路基板と、
前記リソグラフィ装置の前記一部分に取り付けられる複数の熱伝達エレメントとを備え、
前記複数の熱伝達エレメントが、前記プリント回路基板と別個であるが電気的には結合されており、
前記リソグラフィ装置の前記一部分が基板テーブルであり、
前記プリント回路基板が、前記基板テーブルの基板支持領域の向かい合う面に取り付けられる、熱伝達アセンブリ。 - 前記複数の熱伝達エレメント及び前記プリント回路基板がモジュール化されている、請求項1に記載の熱伝達アセンブリ。
- 前記複数の熱伝達エレメントが、ハンダ付け工程、積層化工程、溶接工程、導電接着工程、またはワイヤボンディング工程によって前記プリント回路基板に接続される、請求項1又は2に記載の熱伝達アセンブリ。
- 前記複数の熱伝達エレメントが、前記基板支持領域の縁部をほぼ取り囲んで延びるように配置される、請求項1から3のいずれかに記載の熱伝達アセンブリ。
- 前記複数の熱伝達エレメントのうちの少なくとも1つが、前記基板支持領域の前記縁部をほぼ取り囲んで延びる円弧形の構成を含むことができる、請求項4に記載の熱伝達アセンブリ。
- 前記複数の熱伝達エレメントのうちの少なくとも1つが、前記複数の熱伝達エレメントのうちの前記少なくとも1つを前記基板支持領域の前記縁部まわりに前記プリント回路基板と別個に並べるように、前記プリント回路基板と別個に移動可能である、請求項4または5に記載の熱伝達アセンブリ。
- リソグラフィ装置の少なくとも一部分を温度制御する熱伝達アセンブリであって、
前記リソグラフィ装置の前記一部分に取り付けられるプリント回路基板と、
前記リソグラフィ装置の前記一部分に取り付けられる複数の熱伝達エレメントとを備え、
前記複数の熱伝達エレメントが、前記プリント回路基板と別個であるが電気的には結合されており、
前記複数の熱伝達エレメントのうちの少なくとも1つが、外せるようにして前記プリント回路基板に接続される、熱伝達アセンブリ。 - 前記リソグラフィ装置の前記一部分が基板テーブルである、請求項7に記載の熱伝達アセンブリ。
- 前記複数の熱伝達エレメント及び前記プリント回路基板がモジュール化されている、請求項7又は8に記載の熱伝達アセンブリ。
- 前記プリント回路基板が、前記複数の熱伝達エレメントを前記プリント回路基板に接続するために、前記複数の熱伝達エレメントの第2の係合部材と係合する第1の係合部材を備える、請求項1から9のいずれかに記載の熱伝達アセンブリ。
- 前記熱伝達エレメントが、前記リソグラフィ装置の前記一部分を加熱する、請求項1から10のいずれかに記載の熱伝達アセンブリ。
- 1つまたは複数のセンサをさらに備える、請求項1から11のいずれかに記載の熱伝達アセンブリ。
- 前記センサが、前記プリント回路基板と一体化されている、または前記プリント回路基板に別個に取り付けられている、請求項12に記載の熱伝達アセンブリ。
- 請求項1から13のいずれかに記載の熱伝達アセンブリを備える、リソグラフィ装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22504809P | 2009-07-13 | 2009-07-13 | |
US61/225,048 | 2009-07-13 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010151529A Division JP4955801B2 (ja) | 2009-07-13 | 2010-07-02 | 熱伝達アセンブリ、リソグラフィ装置および製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012114472A JP2012114472A (ja) | 2012-06-14 |
JP5503681B2 true JP5503681B2 (ja) | 2014-05-28 |
Family
ID=43427214
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010151529A Active JP4955801B2 (ja) | 2009-07-13 | 2010-07-02 | 熱伝達アセンブリ、リソグラフィ装置および製造方法 |
JP2012059187A Active JP5503681B2 (ja) | 2009-07-13 | 2012-03-15 | 熱伝達アセンブリ及びリソグラフィ装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010151529A Active JP4955801B2 (ja) | 2009-07-13 | 2010-07-02 | 熱伝達アセンブリ、リソグラフィ装置および製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8502960B2 (ja) |
JP (2) | JP4955801B2 (ja) |
NL (1) | NL2004980A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2004980A (en) * | 2009-07-13 | 2011-01-17 | Asml Netherlands Bv | Heat transfers assembly, lithographic apparatus and manufacturing method. |
NL2008751A (en) * | 2011-06-06 | 2012-12-10 | Asml Netherlands Bv | Temperature sensing probe, burl plate, lithographic apparatus and method. |
NL2009189A (en) * | 2011-08-17 | 2013-02-19 | Asml Netherlands Bv | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
SG188036A1 (en) * | 2011-08-18 | 2013-03-28 | Asml Netherlands Bv | Lithographic apparatus, support table for a lithographic apparatus and device manufacturing method |
US9835957B2 (en) | 2013-09-27 | 2017-12-05 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
NL2017128A (en) * | 2015-07-16 | 2017-01-23 | Asml Netherlands Bv | A lithographic apparatus, a projection system, a last lens element, a liquid control member and a device manufacturing method |
DE102017200775A1 (de) * | 2017-01-19 | 2018-07-19 | Carl Zeiss Smt Gmbh | Bauelement für eine Projektionsbelichtungsanlage |
NL2020011A (en) * | 2017-01-26 | 2018-08-01 | Asml Netherlands Bv | A lithography apparatus and a method of manufacturing a device |
CN114354600B (zh) * | 2021-12-29 | 2022-09-16 | 常州中端电器有限公司 | 一种电子式仪表自动光学检测设备 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4509852A (en) | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
FR2631165B1 (fr) * | 1988-05-05 | 1992-02-21 | Moulene Daniel | Support conditionneur de temperature pour petits objets tels que des composants semi-conducteurs et procede de regulation thermique utilisant ce support |
JP2964192B2 (ja) * | 1992-02-05 | 1999-10-18 | 東京エレクトロン株式会社 | 半導体デバイス製造用加熱装置 |
US6328096B1 (en) * | 1997-12-31 | 2001-12-11 | Temptronic Corporation | Workpiece chuck |
AU2747999A (en) | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
US6583638B2 (en) * | 1999-01-26 | 2003-06-24 | Trio-Tech International | Temperature-controlled semiconductor wafer chuck system |
JP2003158051A (ja) * | 1999-06-09 | 2003-05-30 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
US6479979B1 (en) * | 1999-07-09 | 2002-11-12 | Srico, Inc. | Opto-electric device for measuring the root-mean-square value of an alternating current voltage |
US6780374B2 (en) * | 2000-12-08 | 2004-08-24 | Semitool, Inc. | Method and apparatus for processing a microelectronic workpiece at an elevated temperature |
JP2001274078A (ja) * | 2000-03-28 | 2001-10-05 | Canon Inc | 温調装置、デバイス製造装置およびデバイス製造方法 |
JP2002231421A (ja) * | 2000-04-07 | 2002-08-16 | Ibiden Co Ltd | セラミックヒータ |
WO2002054460A1 (fr) * | 2000-12-27 | 2002-07-11 | Nikon Corporation | Dispositif d'exposition |
CN100470367C (zh) | 2002-11-12 | 2009-03-18 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
SG121822A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
EP1420300B1 (en) | 2002-11-12 | 2015-07-29 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7394521B2 (en) | 2003-12-23 | 2008-07-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2005340719A (ja) * | 2004-05-31 | 2005-12-08 | Tokyo Seimitsu Co Ltd | ステージ機構 |
JP2006005135A (ja) * | 2004-06-17 | 2006-01-05 | Canon Inc | 温度調節装置およびデバイス製造装置 |
US7304715B2 (en) * | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7701550B2 (en) | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7397533B2 (en) | 2004-12-07 | 2008-07-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
SG124359A1 (en) | 2005-01-14 | 2006-08-30 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
JP2006261541A (ja) * | 2005-03-18 | 2006-09-28 | Tokyo Electron Ltd | 基板載置台、基板処理装置および基板処理方法 |
DE602005018553D1 (de) * | 2005-07-25 | 2010-02-04 | Fraunhofer Ges Forschung | Chip-halter für einen mikrofluid-chip |
JP2007123319A (ja) * | 2005-10-25 | 2007-05-17 | Nikon Corp | 露光装置及びデバイス製造方法 |
US7897110B2 (en) * | 2005-12-20 | 2011-03-01 | Asml Netherlands B.V. | System and method for detecting at least one contamination species in a lithographic apparatus |
JP4786499B2 (ja) * | 2006-10-26 | 2011-10-05 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び熱処理板の温度設定装置 |
US20080137055A1 (en) * | 2006-12-08 | 2008-06-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20080267257A1 (en) * | 2007-04-27 | 2008-10-30 | Sokudo Co., Ltd. | Method and System for Detecting Substrate Temperature in a Track Lithography Tool |
US7692766B2 (en) * | 2007-05-04 | 2010-04-06 | Asml Holding Nv | Lithographic apparatus |
US8514365B2 (en) | 2007-06-01 | 2013-08-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20080310113A1 (en) * | 2007-06-13 | 2008-12-18 | Asml Netherlands B.V. | Electronics rack and lithographic apparatus comprising such electronics rack |
US8064151B2 (en) * | 2007-08-14 | 2011-11-22 | Asml Netherlands B.V. | Lithographic apparatus and thermal optical manipulator control method |
JP2012516064A (ja) * | 2009-01-26 | 2012-07-12 | ナノインク インコーポレーティッド | 基板温度制御を含む大面積均質アレイの製作方法 |
NL2004980A (en) * | 2009-07-13 | 2011-01-17 | Asml Netherlands Bv | Heat transfers assembly, lithographic apparatus and manufacturing method. |
-
2010
- 2010-06-28 NL NL2004980A patent/NL2004980A/en not_active Application Discontinuation
- 2010-07-02 JP JP2010151529A patent/JP4955801B2/ja active Active
- 2010-07-12 US US12/834,768 patent/US8502960B2/en active Active
-
2012
- 2012-03-15 JP JP2012059187A patent/JP5503681B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012114472A (ja) | 2012-06-14 |
US8502960B2 (en) | 2013-08-06 |
JP4955801B2 (ja) | 2012-06-20 |
JP2011023716A (ja) | 2011-02-03 |
NL2004980A (en) | 2011-01-17 |
US20110007288A1 (en) | 2011-01-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5503681B2 (ja) | 熱伝達アセンブリ及びリソグラフィ装置 | |
US10591828B2 (en) | Lithographic apparatus and method | |
JP6556195B2 (ja) | リソグラフィ装置および方法 | |
JP4921516B2 (ja) | リソグラフィ装置及び方法 | |
KR101043358B1 (ko) | 기판 테이블, 리소그래피 장치 및 디바이스 제조 방법 | |
KR100737509B1 (ko) | 리소그래피 장치 및 디바이스 제조방법 | |
JP4514747B2 (ja) | リソグラフィ装置、デバイス製造方法および制御システム | |
US8274641B2 (en) | Substrate table, lithographic apparatus and device manufacturing method | |
JP2011192992A5 (ja) | ||
TWI421644B (zh) | 微影裝置及方法 | |
KR101442032B1 (ko) | 리소그래피 장치 및 액체의 거동을 제어하는 방법 | |
US20110069289A1 (en) | Lithographic apparatus, coverplate and device manufacturing method | |
US8553206B2 (en) | Lithographic apparatus, coverplate and device manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120315 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120315 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130301 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140121 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140131 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140218 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140314 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5503681 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |