JP5499622B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to a technical field of an electro-optical device such as a liquid crystal device and an electronic apparatus such as a liquid crystal projector including the electro-optical device.

  As this type of electro-optical device, for example, there is a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates. In the manufacturing process of such a liquid crystal device, a method in which a pair of substrates is bonded together with a sealing material containing an ultraviolet curable resin or the like may be used. In this case, in order to cure the sealing material, it is required to irradiate the sealing material with sufficient ultraviolet rays. For this reason, for example, Patent Document 1 proposes a technique in which a light shielding film is not provided on a portion of the substrate that overlaps with the sealing material.

Japanese Patent No. 2695548

  However, as described above, when the light shielding film is not provided on the portion overlapping the sealing material, the light irradiated during the operation of the apparatus passes through the portion overlapping the sealing material, which may adversely affect the display image. is there. In addition, since the layout of the light-shielding wiring in the portion overlapping with the sealing material is limited, the apparatus configuration may be complicated. As described above, the above-described technique has a technical problem that various inconveniences occur because the portion overlapping the sealing material cannot be shielded from light.

  The present invention has been made in view of, for example, the above-described problems, and it is an object to provide a high-quality electro-optical device and electronic apparatus with a simple configuration by making it possible to shield a portion overlapping a sealing material. To do.

In order to solve the above problem, an electro-optical device according to the present invention is an electro-optical device in which an electro-optical material is sandwiched between a first substrate and a second substrate, and the first substrate includes the first optical substrate. A data line driving circuit provided along a first side of one substrate, a scanning line driving circuit provided along a second side intersecting with the first side, and the scanning line driving circuit; A wiring extending along the second side between the second side and electrically connected to the scanning line driver circuit; and the first substrate and the second substrate. A sealant provided between the data line driving circuit, the scanning line driving circuit, and the wiring, at least partially overlapping each other, and bonding the first substrate and the second substrate to each other; on the second substrate, the data line driving circuit, the scanning line driving circuit, said arrangement And a said sealing member and a light shielding film provided so as to overlap at least partially, respectively.

  According to the electro-optical device of the present invention, for example, an electro-optical material such as liquid crystal is sandwiched between a first substrate that is a TFT array substrate and a second substrate that is a counter substrate. In the first substrate, peripheral circuits such as a scanning line driving circuit and a data line driving circuit are provided around a display portion for displaying an image. A wiring electrically connected to the peripheral circuit is provided outside the peripheral circuit when viewed from the display unit. The peripheral circuit and the wiring are typically configured to include a light-shielding metal or the like.

  The first substrate and the second substrate are bonded to each other with a sealing material. Here, in particular, the sealing material is bonded to the first substrate and the second substrate by surface active bonding. For this reason, the sealing material according to the present invention does not need to be cured by irradiation with light after the first substrate and the second substrate are bonded together, unlike the case where the sealing material is made of, for example, an ultraviolet curable resin.

  If the sealing material is made of an ultraviolet curable resin, it must be avoided that the sealing material has a portion where light cannot be sufficiently irradiated. For this reason, the member which has light-shielding property cannot be provided in the part which overlaps with a sealing material. Or the formation density of the member which has light-shielding property in the part which overlaps with a sealing material will be restrict | limited extremely.

  However, in the present invention, as described above, after the first substrate and the second substrate are bonded together, it is not necessary to irradiate the sealing material with light and cure it. Therefore, the sealing material and the light-shielding member can be provided so as to overlap each other. Thereby, the freedom degree of the layout of an apparatus structure is raised significantly.

  Specifically, the sealing material according to the present invention is provided so as to at least partially overlap the peripheral circuit and the wiring. In the second substrate, a light shielding film is provided so as to at least partially overlap the peripheral circuit and the sealing material. This light shielding film is, for example, a frame light shielding film provided along the boundary between the display portion and the peripheral portion, and is provided so as to cover the peripheral portion. Note that a plurality of peripheral circuits may be provided on the first substrate. In that case, the light-shielding film may be provided so as to overlap with at least one peripheral circuit.

  In the present invention, as described above, since the light shielding film can be provided so as to overlap the sealing material, the width of the light shielding film can be increased. Therefore, it is possible to reduce the influence of light from other than the display unit on the display image. That is, ambient light re-reflection can be prevented. In addition, since it is not necessary to consider the formation density of wiring or the like that must be arranged in a region overlapping with the sealing material, the arrangement space can be used efficiently.

  Furthermore, in the present invention, since it is not necessary to irradiate the sealing material with light such as ultraviolet rays, it is possible to prevent a decrease in reliability due to light being irradiated to a portion other than the sealing material at that time. . In addition, if the sealing material is made of an inorganic material or the like, it can be prevented that the uncured component of the seal adversely affects other members, thereby reducing the reliability.

  As described above, according to the electro-optical device of the present invention, it is possible to display a high-quality image and a highly reliable electro-optical device.

  In one aspect of the electro-optical device of the present invention, the light-shielding film is provided so as to at least partially overlap the wiring, and no other light-shielding layer that overlaps the wiring is provided on the first substrate. .

  According to this aspect, since the light shielding film is provided so as to at least partially overlap the wiring, even if there is no other light shielding layer overlapping the wiring, the portion overlapping the wiring can be shielded. That is, in the light shielding layer of this aspect, it is possible to shield even a portion that should be shielded by other light shielding layers.

  For example, if the light-shielding film and the wiring do not overlap each other, the light projected between the devices includes light that is transmitted between the wirings. Such light adversely affects the operation of the apparatus and the displayed image. Therefore, it is usually required to provide another light shielding layer in a portion overlapping with the wiring.

  However, in this embodiment, as described above, since the light shielding layer is provided so as to at least partially overlap the wiring, it is not necessary to provide another light shielding layer. Therefore, the apparatus configuration can be simplified.

  In another aspect of the electro-optical device according to the aspect of the invention, the first substrate and the second substrate are provided with alignment marks that serve as marks when bonded to each other. It is provided so as not to overlap the alignment mark.

  According to this aspect, each of the first substrate and the second substrate is provided with the alignment mark serving as a mark when the substrates are bonded to each other. The alignment mark is preferably provided at a position where the alignment mark can be visually observed (or can be confirmed using a dedicated device or the like).

  In this aspect, since the light shielding film is provided so as not to overlap the alignment mark, it can be prevented that the alignment mark cannot be confirmed by the light shielding film. Accordingly, the first substrate and the second substrate can be suitably bonded.

  In another aspect of the electro-optical device of the present invention, the electro-optical device includes a conduction portion that electrically conducts between the first substrate and the second substrate, and the light shielding film is provided so as not to overlap the conduction portion. Yes.

  According to this aspect, the conducting portions that electrically conduct the first substrate and the second substrate are provided at, for example, the four corners of the substrate. The conduction part is typically made of a material containing an ultraviolet curable resin or the like, and is cured after being provided so as to connect the first substrate and the second substrate to each other.

  In this aspect, since the light shielding film is provided so as not to overlap the conductive portion, it is possible to avoid the conductive portion from being shielded from light by the light shielding film. Therefore, it is possible to cure the conductive portion reliably and to electrically connect the first substrate and the second substrate.

  In another aspect of the electro-optical device of the invention, the electro-optical device includes a sealing material that seals an opening for injecting the electro-optical material, and the light-shielding film is provided so as not to overlap the sealing material. Yes.

  According to this aspect, at the time of manufacture, the sealing material is first provided so as to have the opening. Subsequently, after the first substrate and the second substrate are bonded to each other, an electro-optical material is injected from the opening in the sealing material. Thereby, the region surrounded by the sealing material is filled with the electro-optical material. The opening is sealed with a sealing material after the electro-optic material is injected. The encapsulant is typically attached manually.

  In this aspect, since the light shielding film is provided so as not to overlap the sealing material (in other words, not to overlap the opening), the portion where the sealing material is attached due to the light shielding film during manufacture Can be prevented from being confirmed. Therefore, the opening in the sealing material can be reliably sealed.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention (including various aspects thereof).

  According to the electronic apparatus of the present invention, the electro-optical device according to the present invention described above is included, so that a high-quality display can be performed and the projection display device, the television, and the mobile phone are highly reliable. Various electronic devices such as a telephone, an electronic notebook, a word processor, a viewfinder type or a monitor direct-view type video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized. In addition, as an electronic apparatus of the present invention, for example, an electrophoretic device such as electronic paper can be realized.

  The effect | action and other gain of this invention are clarified from the form for implementing invention demonstrated below.

1 is a plan view showing an overall configuration of an electro-optical device according to a first embodiment. It is the HH 'sectional view taken on the line of FIG. FIG. 3 is an equivalent circuit diagram of various elements, wirings, and the like that constitute an image display area of the electro-optical device according to the first embodiment. FIG. 3 is a plan view showing a simplified positional relationship between members constituting the electro-optical device according to the first embodiment. It is a schematic sectional drawing which shows the AA 'line cross section of FIG. 4 roughly. It is a side view which shows the manufacturing method of the electro-optical apparatus concerning a comparative example. It is a schematic sectional drawing which shows roughly the AA 'line cross section of the electro-optical apparatus which concerns on a comparative example. FIG. 6 is a schematic cross-sectional view (No. 1) schematically showing a cross section taken along line AA ′ of a modification of the electro-optical device according to the first embodiment. It is. FIG. 6 is a schematic cross-sectional view (part 2) schematically illustrating a cross-section taken along line AA ′ of a modification of the electro-optical device according to the first embodiment. FIG. 6 is a schematic cross-sectional view (No. 3) schematically showing a cross-section taken along line AA ′ of the modification of the electro-optical device according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a light shielding layer between wirings provided in an electro-optical device according to a comparative example. FIG. 3 is an enlarged plan view showing a partially enlarged view of the periphery of a vertical conduction part in the electro-optical device according to the first embodiment. FIG. 6 is a plan view showing a simplified positional relationship between members constituting an electro-optical device according to a second embodiment. FIG. 11 is a process plan view (part 1) illustrating the method of manufacturing the electro-optical device according to the second embodiment in order. FIG. 12 is a process plan view (part 2) illustrating the method of manufacturing the electro-optical device according to the second embodiment in order. It is a top view which shows the structure of the projector which is an example of the electronic device to which the electro-optical apparatus is applied.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Electro-optical device>
First, the electro-optical device according to the present embodiment will be described with reference to FIGS. In the following embodiments, a liquid crystal device of a TFT (Thin Film Transistor) active matrix driving system with a built-in driving circuit will be described as an example of the electro-optical device of the present invention.

<First Embodiment>
The overall configuration of the electro-optical device according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the overall configuration of the electro-optical device according to this embodiment, and FIG. 2 is a cross-sectional view taken along the line HH ′ of FIG.

  1 and 2, in the electro-optical device according to the present embodiment, a TFT array substrate 10 and a counter substrate 20 are disposed to face each other. The TFT array substrate 10 is an example of the “first substrate” in the present invention, and is, for example, a transparent substrate such as a quartz substrate or a glass substrate, a silicon substrate, or the like. The counter substrate 20 is an example of the “second substrate” in the present invention, and is a transparent substrate such as a quartz substrate or a glass substrate. Between the TFT array substrate 10 and the counter substrate 20, a liquid crystal layer 50, which is an example of the “electro-optical material” of the present invention, is sealed. The liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between a pair of alignment films.

  The TFT array substrate 10 and the counter substrate 20 are bonded to each other by a sealing material 52 provided in a sealing region located around the image display region 10a provided with a plurality of pixel electrodes.

  The sealing material 52 is a member for bonding the two substrates together, and is bonded to the TFT array substrate 10 and the counter substrate 20 by a surface active bonding technique. The surface active bonding technique is a technique for giving a bonding force to an activated surface by activating the surface of metal or the like by applying energy thereto. For activation, various methods such as irradiation with an atomic beam can be used.

  In the sealing material 52, a gap material such as glass fiber or glass beads for dispersing the distance between the TFT array substrate 10 and the counter substrate 20 (that is, the inter-substrate gap) to a predetermined value is dispersed. Note that the gap material may be arranged in the image display region 10a or a peripheral region located around the image display region 10a in addition to or instead of the material mixed in the seal material 52.

  In FIG. 2, a light-shielding frame light-shielding film 53 that defines the frame area of the image display region 10a is provided on the counter substrate 20 side in an area that overlaps the seal area where the seal material 52 is disposed. The specific positional relationship between the frame light shielding film 53 and the sealing material will be described in detail later. A part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  Returning to FIG. 1, the data line driving circuit 101 and the external circuit connection terminal 102 are provided along one side of the TFT array substrate 10 in a region located outside the sealing region where the sealing material 52 is disposed in the peripheral region. It has been. The scanning line driving circuit 104 is provided along two sides adjacent to the one side. Further, in order to connect the two scanning line driving circuits 104 provided on both sides of the image display area 10a in this way, a plurality of wirings 105 are provided along the remaining side of the TFT array substrate 10. The data line driving circuit 101 and the scanning line driving circuit 104 here are examples of the “peripheral circuit” in the present invention.

  In a region facing the four corners of the counter substrate 20 on the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with a vertical conduction material are arranged. Thereby, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20.

  In FIG. 2, on the TFT array substrate 10, a laminated structure in which pixel switching TFTs as drive elements, wiring lines such as scanning lines and data lines are formed is formed. Although the detailed configuration of this laminated structure is not shown in FIG. 2, pixel electrodes 9a made of a transparent material such as ITO (Indium Tin Oxide) are provided on the laminated structure with a predetermined pattern for each pixel. It is formed in an island shape.

  The pixel electrode 9 a is formed in the image display area 10 a on the TFT array substrate 10 so as to face the counter electrode 21. On the surface of the TFT array substrate 10 facing the liquid crystal layer 50, that is, on the pixel electrode 9a, an alignment film 16 is formed so as to cover the pixel electrode 9a.

  A light shielding film 23 is formed on the surface of the counter substrate 20 facing the TFT array substrate 10. For example, the light shielding film 23 is formed in a lattice shape when viewed in plan on the facing surface of the facing substrate 20. In the counter substrate 20, a non-opening area is defined by the light shielding film 23, and an area partitioned by the light shielding film 23 is an opening area through which light emitted from, for example, a projector lamp or a direct viewing backlight is transmitted. The light shielding film 23 may be formed in a stripe shape, and the non-opening region may be defined by the light shielding film 23 and various components such as data lines provided on the TFT array substrate 10 side.

  On the light shielding film 23, a counter electrode 21 made of a transparent material such as ITO is formed so as to face the plurality of pixel electrodes 9a. Further, in order to perform color display in the image display area 10a, a color filter (not shown in FIG. 2) may be formed on the light shielding film 23 in an area including a part of the opening area and the non-opening area. Good. An alignment film 22 is formed on the counter electrode 21 on the counter surface of the counter substrate 20.

  In addition to the above-described drive circuits such as the data line drive circuit 101 and the scanning line drive circuit 104, the image signal on the image signal line is sampled on the TFT array substrate 10 shown in FIGS. Sampling circuit that supplies lines, precharge circuit that supplies pre-charge signals of a predetermined voltage level to multiple data lines in advance of image signals, inspection of quality, defects, etc. of the electro-optical device during production or shipment An inspection circuit or the like may be formed.

  Next, an electrical configuration of the pixel portion of the electro-optical device according to the present embodiment will be described with reference to FIG. FIG. 3 is an equivalent circuit diagram of various elements, wirings, and the like in a plurality of pixels formed in a matrix forming the image display area of the electro-optical device according to this embodiment.

  In FIG. 3, a pixel electrode 9a and a TFT 30 are formed in each of a plurality of pixels formed in a matrix that forms the image display region 10a. The TFT 30 is electrically connected to the pixel electrode 9a, and performs switching control of the pixel electrode 9a during the operation of the electro-optical device according to the present embodiment. The data line 6a to which the image signal is supplied is electrically connected to the source of the TFT 30. The image signals S1, S2,..., Sn to be written to the data lines 6a may be supplied line-sequentially in this order, or may be supplied for each group to a plurality of adjacent data lines 6a. May be.

  The scanning line 3a is electrically connected to the gate of the TFT 30, and the electro-optical device according to the present embodiment pulse-scans the scanning signals G1, G2,. Gm is applied in this order in a line sequential manner. The pixel electrode 9a is electrically connected to the drain of the TFT 30, and the image signal S1, S2,... Supplied from the data line 6a is closed by closing the switch of the TFT 30 serving as a switching element for a certain period. Sn is written at a predetermined timing. A predetermined level of image signals S1, S2,..., Sn written in the liquid crystal as an example of the electro-optical material via the pixel electrode 9a is held for a certain period with the counter electrode formed on the counter substrate. The

  The liquid crystal constituting the liquid crystal layer 50 (see FIG. 2) modulates light and enables gradation display by changing the orientation and order of the molecular assembly depending on the applied voltage level. For example, in the normally white mode, the transmittance for incident light is reduced according to the voltage applied in units of each pixel. In the normally black mode, the transmittance is applied in units of each pixel. As a result, the transmittance for incident light is increased, and light having a contrast corresponding to an image signal is emitted from the electro-optical device as a whole.

  In order to prevent the image signal held here from leaking, a storage capacitor 70 is added in parallel with the liquid crystal capacitor formed between the pixel electrode 9a and the counter electrode 21 (see FIG. 2). The storage capacitor 70 is a capacitive element that functions as a storage capacitor that temporarily holds the potential of each pixel electrode 9a in response to supply of an image signal. One electrode of the storage capacitor 70 is electrically connected to the drain of the TFT 30 in parallel with the pixel electrode 9a, and the other electrode is electrically connected to the capacitor line 300 having a fixed potential so as to have a constant potential. ing. According to the storage capacitor 70, the potential holding characteristic of the pixel electrode 9a is improved, and the display characteristics such as improvement of contrast and reduction of flicker can be improved.

  Next, a more specific configuration of the electro-optical device according to the present embodiment will be described with reference to FIGS. 4 and 5. FIG. 4 is a plan view schematically showing the positional relationship of each member constituting the electro-optical device according to this embodiment, and FIG. 5 schematically shows a cross section taken along the line AA ′ of FIG. It is a schematic sectional drawing. In FIG. 4, for convenience of explanation, detailed members constituting the electro-optical device shown in FIGS. 1 and 2 are omitted as appropriate. In FIG. 5 as well, members not closely related to the present embodiment are omitted as appropriate.

  4, in the electro-optical device according to this embodiment, a sealing material 52 is bonded to the TFT array substrate 10 and the counter substrate 20 by a surface active bonding technique. For this reason, as shown in the drawing, the sealing material 52 and the frame light shielding film 53 can be arranged so as to overlap each other. Further, the seal material 52, the data line driving circuit 101, and the scanning line driving circuit 104 can be arranged so as to overlap each other.

  In FIG. 5, the sealing material 52, the frame light shielding film 53, and the scanning line driving circuit 104 are configured to overlap each other in the cross section taken along the line AA ′. The wiring 150 indicates a wiring group such as a common wiring arranged outside the scanning line driving circuit 104, and is an example of the “wiring” in the present invention. The wiring 150 electrically connects the external circuit connection terminal 102 and the scanning line driving circuit 104 to each other. For example, the wiring 150 supplies a signal such as a clock signal or a start pulse to the scanning line driver circuit.

  Here, effects obtained by the electro-optical device according to the present embodiment will be described with reference to FIGS. 6 and 7 in addition to FIGS. 4 and 5. FIG. 6 is a side view showing a method for manufacturing the electro-optical device according to the comparative example, and FIG. 7 is a schematic cross-sectional view schematically showing a cross section taken along line AA ′ of the electro-optical device according to the comparative example. is there.

  In FIG. 6, for example, consider a case where the sealing material is made of an ultraviolet curable resin. In this case, when the device is manufactured, after the TFT array substrate 10 and the counter substrate 20 are bonded to each other, UV light irradiation using a UV (Ultra Violet) light mask 200 is performed. That is, UV light is irradiated to cure the sealing material 52.

  In FIG. 7, in order to irradiate the sealing material 52 with UV light, a configuration is required in which the sealing material 52 and the frame light shielding film 53 do not overlap each other. However, in such a configuration, there is a possibility that light transmitted through a portion overlapping with the sealing material 52 may affect the display image during operation of the apparatus. That is, there is a possibility that the image quality is deteriorated due to re-reflection of ambient light. In addition, the light transmitted through the portion overlapping the sealing material 52 is irradiated to the portion other than the sealing material 52, and thus the reliability of the apparatus may be lowered.

  On the other hand, in the electro-optical device according to the present embodiment, as illustrated in FIGS. 4 and 5, the seal material 52, the frame light shielding film 53, the data line driving circuit 101, and the scanning line driving circuit 104 overlap each other. Can be arranged as follows. For this reason, it is possible to reliably prevent ambient light re-reflection. Therefore, a high quality image can be displayed. In addition, since the region where the frame light shielding film 53 is provided is not limited by the sealing material 52, each part of the apparatus can be effectively shielded from light. Therefore, it is possible to prevent a decrease in reliability due to light.

  Moreover, since the sealing material 52 according to the present embodiment is bonded using a surface active bonding technique, it is also possible to use an inorganic material. In this case, it is possible to prevent the uncured component from adversely affecting other members, thereby reducing the reliability.

  Subsequently, modified examples of the electro-optical device according to the present embodiment will be described with reference to FIGS. 8 to 10 are schematic cross-sectional views schematically showing a cross section taken along line AA ′ of the modified example of the electro-optical device according to the present embodiment. FIG. 11 is a cross-sectional view illustrating an inter-wiring light shielding layer provided in the electro-optical device according to the comparative example.

  As shown in FIG. 8, the sealing material 52 and the frame light shielding film 53 may be provided so as to partially overlap. Even in such a case, the effect of being able to arrange the sealing material 52 and the frame light shielding film 53 so as to overlap each other can be obtained accordingly.

  As shown in FIG. 9, the sealing material 52 may be provided so as to extend to a position overlapping the wiring 150. Even in such a case, since the sealing material 52 does not have to be irradiated with UV light, the arrangement layout of the wiring 150 is not limited.

  As shown in FIG. 10, when the sealing material 52 is provided so as to overlap the wiring 150, the frame light shielding film 53 may be provided so as to overlap the wiring 150 as well. In this case, the frame light-shielding film 53 can more effectively shield each member of the apparatus.

  In FIG. 11, for example, when the sealing material 52 containing the ultraviolet curable resin shown in FIGS. 6 and 7 is used, there is a certain distance between the wirings 150 so as not to block the irradiation of the UV light to the sealing material 52. Provided. That is, the formation density of the wiring 150 is limited.

  However, the gap between the wirings as described above transmits the projection light (that is, the light for displaying an image) during the operation of the apparatus in addition to the UV light when the sealing material 52 is cured. For this reason, it has been required to enhance the light shielding function by providing an inter-wiring light-shielding film 400 so that the projection light does not pass through the gaps between the wirings 150.

  In contrast, in the electro-optical device according to the present embodiment as illustrated in FIG. 10, the frame light-shielding film 53 can also shield the portion overlapping the wiring 150. Therefore, it is not necessary to provide a light shielding film such as the inter-wire light shielding film 400 shown in FIG. Therefore, the apparatus configuration can be simplified.

  Next, a more detailed configuration of the frame light shielding film according to the present embodiment will be described with reference to FIG. FIG. 12 is an enlarged plan view partially showing the periphery of the vertical conduction portion in the electro-optical device according to this embodiment.

  In FIG. 12, the frame light shielding film 53 is provided so as to have a notch in the vicinity of the vertical conduction portion 106 of the electro-optical device according to the present embodiment. Thereby, the frame light shielding film 53 is provided so as not to overlap the vertical conduction part 106 and the alignment mark 500. The vertical conduction portion 106 here is an example of the “conduction portion” in the present invention.

  The vertical conduction part 106 is typically made of a material containing an ultraviolet curable resin or the like, and is provided so as to connect the TFT array substrate 10 and the counter substrate 20 to each other, and then cured by irradiating UV light. Be made. Here, the frame light-shielding film 53 is provided so as not to overlap the vertical conduction part 106, thereby preventing the vertical conduction part 106 from being shielded by the frame light-shielding film 53. Therefore, the curing process of the vertical conduction part 106 can be reliably performed.

  On the other hand, the alignment mark 500 is provided on each of the TFT array substrate 10 and the counter substrate 20 as a mark when the TFT array substrate 10 and the counter substrate 20 are bonded to each other. The alignment mark 500 is preferably provided at a position where the alignment mark 500 can be visually observed. Here, since the frame light-shielding film 53 is provided so as not to overlap the alignment mark 500, it is prevented that the alignment light cannot be confirmed due to the frame light-shielding film 53 being obstructed. Therefore, the TFT array substrate 10 and the counter substrate 20 can be suitably bonded.

  As described above, according to the electro-optical device according to the present embodiment, a high-quality device can be realized with a simple configuration by making it possible to shield the portion overlapping the sealing material 52.

Second Embodiment
Next, an electro-optical device according to a second embodiment will be described with reference to FIGS. Note that the second embodiment differs from the first embodiment described above in terms of the positional relationship between the sealing material, the frame light shielding film, and the like, and the other configurations are generally the same. Therefore, in the second embodiment, portions different from the first embodiment will be described in detail, and descriptions of other overlapping portions will be omitted as appropriate.

  First, the configuration of the electro-optical device according to the second embodiment will be described with reference to FIG. FIG. 13 is a plan view schematically showing the positional relationship between the members constituting the electro-optical device according to the second embodiment.

  In FIG. 13, the electro-optical device according to the second embodiment is different from the electro-optical device according to the first embodiment shown in FIG. 4 in that the counter substrate 20 does not cover the data line driving circuit 101. As a result, the data line driving circuit 101 is arranged so as not to be covered by the frame light shielding film 53.

  Further, the sealing material 52 is provided with an opening used when liquid crystal is injected, and the opening is provided with a sealing material 600 that prevents the liquid crystal from leaking outside. The sealing material 600 is provided as a part of the side along the data line driving circuit 101 and is provided so as not to completely overlap the frame light shielding film 53.

  Here, effects obtained by the electro-optical device according to the second embodiment will be described with reference to FIGS. 14 and 15. FIGS. 14 and 15 are process plan views sequentially showing the method of manufacturing the electro-optical device according to the second embodiment.

  In FIG. 14, when the electro-optical device according to the second embodiment is manufactured, first, the sealing material 52 is drawn so as to have the opening 52a. Subsequently, after the TFT array substrate 10 and the counter substrate 20 are bonded to each other, liquid crystal is injected from the opening 52 a in the seal material 52. As a result, the region surrounded by the sealing material 52 is filled with liquid crystal.

  In FIG. 15, the opening 52a of the sealing material is sealed with the sealing material 600 after the liquid crystal is injected. Sealant 600 is typically attached by hand.

  Here, in particular, in the electro-optical device according to the second embodiment, as shown in FIG. 13, the frame light-shielding film 53 is provided so as not to completely overlap the sealing material 600. For this reason, at the time of manufacture, it can prevent that the frame light-shielding film 53 becomes a hindrance and the part which attaches the sealing material 600 cannot be confirmed. Therefore, the opening 52a in the sealing material 52 can be reliably sealed.

  As described above, according to the electro-optical device according to the second embodiment, the sealing work is favorably performed even when the opening 52a is provided on the data line driving circuit 101 side in the sealing material 52. It is possible.

<Electronic equipment>
Next, the case where the liquid crystal device which is the above-described electro-optical device is applied to various electronic devices will be described. FIG. 16 is a plan view showing a configuration example of the projector. Hereinafter, a projector using the liquid crystal device as a light valve will be described.

  As shown in FIG. 16, a lamp unit 1102 including a white light source such as a halogen lamp is provided inside the projector 1100. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal panels 1110R, 1110B, and 1110G.

  The configurations of the liquid crystal panels 1110R, 1110B, and 1110G are the same as those of the liquid crystal device described above, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit. The light modulated by these liquid crystal panels enters the dichroic prism 1112 from three directions. In the dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Therefore, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, paying attention to the display images by the liquid crystal panels 1110R, 1110B, and 1110G, the display image by the liquid crystal panel 1110G needs to be horizontally reversed with respect to the display images by the liquid crystal panels 1110R and 1110B.

  Since light corresponding to the primary colors R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108, it is not necessary to provide a color filter.

  In addition to the electronic device described with reference to FIG. 16, a mobile personal computer, a mobile phone, an LCD TV, a viewfinder type, a monitor direct view type video tape recorder, a car navigation device, a pager, an electronic device Examples include notebooks, calculators, word processors, workstations, videophones, POS terminals, and devices with touch panels. Needless to say, the present invention can be applied to these various electronic devices.

  In addition to the liquid crystal devices described in the above embodiments, the present invention includes a reflective liquid crystal device (LCOS), a plasma display (PDP), a field emission display (FED, SED), an organic EL display, and a digital micromirror device. (DMD), electrophoresis apparatus and the like are also applicable.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and an electro-optical device with such a change. In addition, an electronic apparatus including the electro-optical device is also included in the technical scope of the present invention.

  3a ... scanning line, 6a ... data line, 9a ... pixel electrode, 10 ... TFT array substrate, 10a ... image display area, 20 ... counter substrate, 30 ... TFT, 50 ... liquid crystal layer, 52 ... sealing material, 52a ... opening 53 ... Frame light shielding film, 101 ... Data line driving circuit, 102 ... External circuit connection terminal, 104 ... Scanning line driving circuit, 106 ... Vertical conduction part, 150 ... Wiring, 200 ... UV light shielding mask, 400 ... Light shielding between wirings Membrane 500 ... Alignment mark 600 ... Sealing material

Claims (5)

An electro-optical device comprising an electro-optical material sandwiched between a first substrate and a second substrate,
A data line driving circuit provided on the first substrate along the first side of the first substrate, and a scanning line driving provided on the second side that intersects the first side. A wiring extending between the circuit and the scanning line driving circuit and the second side along the second side and electrically connected to the scanning line driving circuit;
Between the first substrate and the second substrate, the data line driving circuit, the scanning line driving circuit, and the wiring are provided so as to at least partially overlap, respectively, A sealing material for bonding the second substrates together;
An electro-optical device comprising: a light-shielding film provided on the second substrate so as to at least partially overlap the data line driving circuit, the scanning line driving circuit , the wiring, and the sealing material, respectively. . The electro-optical device according to claim 1, wherein the other shielding layer overlapping with the wiring on the first substrate is not provided. Each of the first substrate and the second substrate is provided with an alignment mark serving as a mark when bonded to each other.
The electro-optical device according to claim 1, wherein the light shielding film is provided so as not to overlap the alignment mark. A conduction portion that electrically conducts between the first substrate and the second substrate;
The electro-optical device according to any one of claims 1 to 3, wherein the light shielding film is provided so as not to overlap the conductive portion. An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 4.

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